KR20160046061A - Transparent touch panel film for forming fine wire pattern, manufacturing method thereof, and touch panel including the same - Google Patents

Abstract

The present invention relates to a transparent touch panel film, a manufacturing method thereof, and a touch panel using the same. The transparent touch panel film comprises: a substrate; a transparent conductive layer placed on at least one surface of the substrate; a Cu-Zn-Al (CZA) layer made of three components, alloy of 0.1 to 10 weight percent zinc (Zn), 0.1 to 10 weight percent aluminum (Al) and copper (Cu) accounting for a remaining proportion; and a darkened layer arranged to touch the CZA layer. The purpose of the present invention is to make the transparent touch panel film capable of forming fine electrodes.

Description

Technical Field [0001] The present invention relates to a transparent touch panel film capable of forming fine signal lines, a manufacturing method thereof, and a touch panel including the touch panel,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a transparent touch panel film, and more particularly, to a transparent touch panel film capable of forming a fine signal line, a method of manufacturing the same, and a touch panel including the transparent touch panel film.

The smartphone uses a capacitive touch panel, and the capacitive touchscreen has an advantage in that it has excellent durability as compared with the conventional touch panel type resistive touch screen. The electrostatic capacity type is a method of detecting the touch position in the electrode area of the touch panel based on the static electricity generated in the human body when a person touches the touch panel by using the static electricity in the body.

Briefly, a transparent conductive layer made of a metal conductive material such as indium tin compound (ITO) is deposited on a substrate made of glass, polymer, or silicon to form a transparent electrode (electric circuit) When the user touches the surface of the touch panel, the amount of current flowing through the transparent electrode changes due to the static electricity of the person, and the operation is performed by recognizing the amount of the changed electric current.

The conventional capacitance type touch panel is divided into a display area and a bezel area which is a rim. In the display region, a capacitive electrode pattern made of a transparent conductive layer is formed. In the bezel region, a signal line is formed for signal transmission between the capacitive electrode pattern and the control chip.

In recent years, as the demand for enlargement of the display area in mobile devices has increased, it has been desired to reduce the bezel area as much as possible. As a result, the line width of the signal wiring is gradually decreasing. However, in the conductive layer applied to the conventional signal wiring, a plurality of pinholes are formed, and as the wiring is miniaturized, disconnection may occur.

In the case where Al-AlN, Al-CrN, Cu-CrN, Cu-CuN, Ag-CrN, Ag-AlN or Ag-CuN which is a metal thin film having high electrical conductivity is used as the electrode of the touch screen panel, There is a problem of visibility due to high reflectivity even in the line width pattern.

In addition, there is also a problem that the manufacturing cost is increased due to the complexity of the expensive metal target process and the manufacturing process. Accordingly, development of a conductive material that can be applied to a touch screen panel which is different from a touch screen panel using a transparent conductive thin film layer based on the existing ITO, and has improved hiding properties of metal fine pattern electrodes and reflection and diffraction characteristics against external light It is urgent.

Korean Patent Publication No. 10-2013-0068502

The present invention is to provide a transparent touch panel film capable of thinning a transparent touch panel film by making it thinner and capable of fine wiring formation, a method of manufacturing the same, and a touch panel using the same.

(Zn), 0.1 to 10.0% by weight of aluminum (Al) and 0.1 to 10.0% by weight of aluminum (Al), and the balance (Cu-Zn-Al) layer which is a three-component alloy composed of copper (Cu) and a blackening layer provided in contact with the CZA layer.

Also, the blackening layer may provide a transparent touch panel film, which is one of a CZAO (Cu-Zn-Al-O) layer, a CZAN (Cu-Zn-Al-N) layer and a composite layer thereof.

The CZAO (Cu-Zn-Al-O) layer is a three-component alloy consisting of 0.1 to 10.0 wt% of zinc, 0.1 to 10.0 wt% of aluminum, Cu-Zn-Al) and oxygen (O ₂ ).

In addition, the content of oxygen (O ₂ ) in the CZAO (Cu-Zn-Al-O) layer may be 1 to 10% by weight based on the total weight of the CZAO layer.

Also, the CZAN (Cu-Zn-Al-N) layer is a three-component alloy consisting of 0.1 to 10.0 wt% of zinc, 0.1 to 10.0 wt% of aluminum, Cu-Zn-Al) and nitrogen (N ₂ ).

In addition, the content of nitrogen (N ₂ ) in the CZAN (Cu-Zn-Al-N) layer may be 1 to 10% by weight based on the total weight of the CZAN layer.

In addition, the CZA layer may have a thickness of 50 to 500 nm.

In addition, a transparent touch panel film in which the blackening layer and the CZA layer have a width of 10 mu m or less, a thickness of 500 nm or less, and a pitch of 600 mu m or less and the pattern is a mesh pattern can be provided.

The transparent touch panel further includes an optical layer provided between the transparent conductive layer and the substrate to make the difference between the reflectance of the transparent conductive layer and the reflectivity of the removed region patterned by the transparent conductive layer be 10% A film can be provided.

Further, the optical layer may have a thickness of 1 to 5 占 퐉.

According to an aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: providing a transparent conductive layer on at least one surface of a substrate; providing 0.1 to 10.0 wt% zinc (Zn) (Cu-Zn-Al) layer, which is a three-component alloy composed of copper (Cu), and a blackening layer provided in contact with the CZA layer .

The blackening layer may be a CZAO (Cu-Zn-Al-O) layer, a CZAN (Cu-Zn-Al-N) layer or a composite layer thereof.

The CZAO (Cu-Zn-Al-O) layer is a three-component alloy consisting of 0.1 to 10.0 wt% of zinc, 0.1 to 10.0 wt% of aluminum, Cu-Zn-Al) and oxygen (O ₂ ).

Also, the content of oxygen (O ₂ ) in the CZAO (Cu-Zn-Al-O) layer may be 1 to 10 wt% based on the total weight of the CZAO layer.

Also, the CZAN (Cu-Zn-Al-N) layer is a three-component alloy consisting of 0.1 to 10.0 wt% of zinc, 0.1 to 10.0 wt% of aluminum, Cu-Zn-Al) and nitrogen (N ₂ ) can be provided.

In addition, the content of nitrogen (N ₂ ) in the CZAN (Cu-Zn-Al-N) layer may be 1 to 10 wt% based on the total weight of the CZAN layer.

The thickness of the CZA layer may be 50 to 500 nm.

The step of providing an optical layer on the substrate so that the reflectance of the transparent conductive layer and the reflectance of the removed region after patterning the transparent conductive layer is 10% or less on the substrate before the transparent conductive layer is formed The present invention provides a method for manufacturing a transparent touch panel film.

Further, it is possible to provide a method for manufacturing a transparent touch panel film wherein the line width of the blackening layer and the CZA layer is 10 mu m or less, the thickness is 500 nm or less, the pitch is 600 mu m or less, and the pattern is a mesh pattern.

The step of providing the transparent conductive layer may include a step of providing an amorphous transparent conductive layer and heat-treating the amorphous transparent conductive layer at a temperature of 120 to 170 ° C for 30 to 120 minutes to convert it to a crystalline transparent conductive layer The transparent touch panel can be manufactured by a method comprising the steps of:

According to an aspect of the present invention, there is provided a capacitive touch panel including a transparent touch panel film according to one aspect of the present invention.

1 is a cross-sectional view of a transparent touch panel film according to an embodiment of the present invention.
FIG. 2 is a perspective view of a wiring layer and a transparent conductive layer patterned to assemble a transparent touch panel film with a touch panel. FIG.
FIG. 3 illustrates a patterned gravitational offset patterning according to an embodiment of the present invention.
4 is a cross-sectional view of a transparent touch panel film according to another embodiment of the present invention.
5 is a cross-sectional view of a transparent touch panel film according to another embodiment of the present invention after patterning a wiring layer and a transparent conductive layer before the touch panel is assembled into a touch panel.
6 is a flowchart illustrating steps of a method for manufacturing a transparent touch panel film according to an embodiment of the present invention.
FIG. 7 is a flowchart showing the difference in the process of the bezel when using the CZA layer according to the present invention.
8 is a flowchart showing the difference in the process when the CZA layer is used in the process of forming the touch panel portion.
9 is a flow chart showing the difference in the process when the CZA layer is used in the process of forming the metal mesh.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided to fully convey the spirit of the present invention to a person having ordinary skill in the art to which the present invention belongs. The present invention is not limited to the embodiments shown herein but may be embodied in other forms. For the sake of clarity, the drawings are not drawn to scale, and the size of the elements may be slightly exaggerated to facilitate understanding.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view of a transparent touch panel film according to an embodiment of the present invention, and FIG. 2 is a perspective view after patterning a wiring layer and a transparent conductive layer 200 to assemble a transparent touch panel film with a touch panel. Referring to FIGS. 1 and 2, a transparent touch film according to an embodiment of the present invention may include a substrate 100, a transparent conductive layer 200, and a wiring layer. The wiring layer may be the same as the CZA layer 300 to be described later.

The wiring layer should have a high corrosion resistance, an excellent selectivity, and a low resistance. Thus, even when formed into a line and space, signal transmission is excellent, etching uniformity can be obtained, pinholes are not generated It can be provided with a material which may not cause disconnection even if it is patterned with a fine line width.

In addition, a pressure sensitive adhesive layer has to be provided between the substrate 100, the transparent conductive layer 200, and the wiring layer in order to create an adhesive force between these layers. However, the addition of such a layer may increase the complexity of the process, . However, according to the wiring layer according to an embodiment of the present invention, since the wiring layer itself can have an adhesive force, a separate adhesive layer can be omitted.

One embodiment of the present invention is a light emitting device comprising a substrate 100, a transparent conductive layer 200 provided on at least one surface of the substrate 100, and a transparent conductive layer 200 provided on the transparent conductive layer 200, (Cu-Zn-Al) layer 300, which is a three-component system alloy composed of aluminum (Al) in an amount of 0.1 to 10.0% by weight and the balance of copper (Cu) .

The substrate 100 may be made of a thermoplastic plastic film that is transparent, flexible, heat resistant to a high temperature process for forming a conductive film by sputtering or vacuum deposition on the top surface. Although there is no particular limitation on the type of the substrate 100, the substrate 100 may be formed of a resin such as a polyester resin, an acetate resin, a polyether sulfone resin, a polycarbonate resin, a polyamide resin, a polyimide resin, a polyolefin resin, ) One or more plastic films selected from the group consisting of an acrylic resin, a polyvinyl chloride resin, a polyvinylidene chloride resin, a polystyrene resin, a polyvinyl alcohol resin, a polyarylate resin and a polyphenylene sulfide resin .

The substrate 100 may be made of glass. As the glass material, ordinary glass can be used as long as it has a hardness of at least a certain degree, but any one or more of glass selected from the group of high hardness glass including high hardness film glass, sapphire glass and gorilla glass may be used.

In addition, the thickness of the CZA layer 300 is in the range of 50 to 500 nm, which can exhibit excellent touch panel applicability while maintaining mechanical strength. 2 illustrates that the transparent conductive layer 200 and the wiring layer are provided on one surface of the substrate 100, but the transparent conductive layer 200 and the wiring layer may be provided on both surfaces of the substrate 100, respectively.

Referring to FIG. 2, the wiring layer is patterned in a bezel region other than the display region, so that the wiring pattern 310 can be formed. The wiring pattern 310 may be provided for signal transmission between the transparent conductive layer pattern 210, which is a capacitive electrode pattern formed in the display area, and a control chip (not shown).

The thickness of the blackened layer and the CZA layer to be oxidized are 10 mu m or less, the thickness is 500 nm or less, and the pitch is 600 mu m or less, and the pattern may be a mesh pattern. The width, thickness and shape of the pitch of each layer can be determined by the patterning method, which can be patterned by the method of gravure offset. Referring to FIG. 3, a patterning method using a gravure offset is shown. Through this method, the pattern of each layer can be finely and accurately patterned.

The transparent conductive layer 200 may be transparent if it is a conductive material. There is no particular limitation on the kind of the metal element. However, there is no particular limitation on the kind of the metal element. However, the metal element is not limited to indium, tin, zinc, gallium, antimony, titanium, silicon, Metal oxides of any one or more metals selected from the group consisting of Mg, Al, Au, Ag, Cu, Pd and W, have. The thickness of the transparent conductive layer 200 may be 100 to 500 Å. When the thickness is 100 angstroms or more, it can be formed as a continuous thin film of good conductivity. On the other hand, when the thickness is 500 ANGSTROM or less, the transparency of the touch panel can be maintained in a desired range.

Further, CZA (Cu (Cu)), which is a three-component alloy which is provided on one surface of the transparent conductive layer 200 and is composed of 0.1 to 10.0% by weight of aluminum (Al), 0.1 to 10.0% by weight of titanium -Al-Ti) layer. At this time, the total of the contents of aluminum (Al) and titanium (Ti) may be 20 wt% or less, and if it exceeds 20 wt%, the function and adhesion of the wiring layer may be deteriorated. In addition, when the total amount of aluminum (Al) and titanium (Ti) is 15 wt% or less, the corrosion resistance can be improved. This is a value considering the economical efficiency of the wiring layer and the reliability as wiring.

When wiring is formed by CZA, pinhole of small size can be generated compared with the existing material. Even if pinholes are rarely generated, there is no fear of disconnection even if the wiring layer has a size of 5 탆 or less and is patterned with signal wiring. Further, the wiring layer can form a uniform wiring layer in a short period of time through roll-to-roll sputtering.

Since the wiring layer is formed of CZA which is a low resistance material, it can be formed into a single layer having a thickness of 50 to 500 nm or less. The thickness of the wiring layer should be 50 nm or more to obtain the desired signal resistance, and the thickness of the wiring layer to be 500 nm or less. Since the thickness of the wiring layer can be formed thinner than that of the conventional Mo / Al / Mo case of 30/300/30 nm, it is advantageous to make the touch panel thinner and can be formed into a single layer, so that the wiring manufacturing process can be simplified.

FIG. 4 is a cross-sectional view of a transparent touch panel film according to another embodiment of the present invention. FIG. 5 is a cross-sectional view of a transparent touch panel film according to another embodiment of the present invention, Sectional view after patterning. Referring to FIG. 4, a transparent touch panel film according to an exemplary embodiment of the present invention is provided between a transparent conductive layer 200 and a substrate 100 so that the reflectivity of the transparent conductive layer 200 and the reflectivity of the transparent conductive layer 200 And an optical layer (400) for allowing the difference in reflectance of the removed region to be 10% or less.

5, the optical layer 400 is formed by patterning the transparent conductive layer 200, and then the difference between the reflectance R 1 of the transparent conductive layer 200 and the reflectance R 2 of the region exposed by the transparent conductive pattern The optical properties can be controlled to be 10% or less. The difference in reflectance is less than 10% by the optical layer 400, so that deterioration in display quality in which the transparent conductive pattern is observed with the naked eye can be prevented in the touch panel including the transparent touch film according to one embodiment of the present invention .

The reflectance difference may be adjusted by an index matching technique. In the index matching, an additional layer such as an oxide layer is provided under the metal conductive layer film in order to remove the visibility showing the difference between the metal portion and the non-metal portion while patterning the metal electrode to adjust the refractive index, Is minimized. These techniques can make you feel no difference in your eyes.

In addition, the optical layer 400 may be provided with a thickness suitable for reducing the difference in reflectance to 10% or less. Accordingly, the thickness of the optical layer 400 may be set to 1 to 5 占 퐉. It may be provided by a roll-to-roll PECVD or sol-gel method or the like in order to provide the thickness of the optical layer 400.

6 is a flowchart illustrating steps of a method for manufacturing a transparent touch panel film according to an embodiment of the present invention. Referring to FIG. 6, a transparent touch panel film according to an exemplary embodiment of the present invention includes a transparent conductive layer 200 on at least one surface of a substrate 100, (Cu-Zn-Al) layer which is a ternary alloy composed of 0.1 to 10.0% by weight of zinc (Zn), 0.1 to 10.0% by weight of aluminum (Al) and the balance of copper (Cu) .

The substrate 100 may be a transparent, flexible plastic film having a thickness of 2 to 200 탆. In this case, the surface of the substrate 100 may be washed or surface-treated to provide a highly reliable product. The surface cleaning treatment can be carried out by various methods such as solution cleaning and ultrasonic cleaning. Further, a surface treatment for improving the adhesion of the optical layer 400, which may be provided on the substrate 100, may be further performed.

The transparent conductive layer 200 may be any conductive material having transparency as described above. There is no particular limitation on the kind of the metal element. However, there is no particular limitation on the kind of the metal element. However, the metal element is not limited to indium, tin, zinc, gallium, antimony, titanium, silicon, Metal oxides of any one or more metals selected from the group consisting of Mg, Al, Au, Ag, Cu, Pd and W, have. The thickness of the transparent conductive layer 200 may be 100 to 500 Å. When the thickness is 100 angstroms or more, it can be formed as a continuous thin film of good conductivity. On the other hand, when the thickness is 500 ANGSTROM or less, the transparency of the touch panel can be maintained in a desired range.

Further, CZA (Cu (Cu)), which is a three-component alloy which is provided on one surface of the transparent conductive layer 200 and is composed of 0.1 to 10.0% by weight of zinc (Zn), 0.1 to 10.0% -Al-Ti < / RTI > layer). At this time, the total of the contents of zinc (Zn) and aluminum (Al) may be 20 wt% or less, and if it exceeds 20 wt%, the function and adhesive force as a wiring layer may be deteriorated. Also, if the total amount of zinc (Zn) and aluminum (Al) is 15 wt% or less, the corrosion resistance can be improved. This is a value considering the economical efficiency of the wiring layer and the reliability as wiring.

As described above, the CZA layer 300 can generate pinholes of a smaller size than the existing material. Even if pinholes are rarely generated, there is no fear of disconnection even if the wiring layer has a size of 5 탆 or less and is patterned with signal wiring. Further, the wiring layer can form a uniform wiring layer in a short period of time through roll-to-roll sputtering.

The thickness of the CZA layer 300 is thinner than that of other conductive layers, as shown in Table 1 below. As a result, the weight of the product can be reduced.

division Example Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 ingredient Cu-Zn (0.5 wt%) - Al (2.5 wt%) Mo / Ag / Mo
Triple membrane Mo / Al / Mo
Triple membrane NiCr / Cu / NiCr
Triple membrane NiCuTi / Cu / NiCuTi
Triple membrane thickness CZA
160 nm Mo / Ag / Mo
30/120 / 30nm Mo / Al / Mo
30/300 / 30nm NiCr / Cu / NiCr
30/240 / 30nm NiCuTi / Cu / NiCuTi
30/240 / 30nm

In addition, the CZA layer 300 according to an exemplary embodiment of the present invention may have both conductivity and adhesion, so that the step of providing an additional adhesive layer may be omitted. Experimental results on the conductivity and adhesion according to the composition ratios of the CZA layer 300 are shown in Table 2 below.

Composition ratio R Adhesion C Z A 90 One 9 36.9 100/100 3 7 29.9 100/100 8 2 21.1 100/100 9 One 18.9 51/100 95 4 One 0.22 68/100 3 2 0.21 100/100 2 3 0.28 100/100 One 4 0.43 100/100

When the CZA layer 300 according to the present invention is used, the process may be simplified in the process of the bezel portion, and the difference of the process is shown in FIG. Referring to FIG. 7, it can be seen that the step of sputtering other materials for imparting adhesive strength can be omitted.

8 and 9 show that the CZA layer 300 can also simplify the process in the process of forming the touch panel portion and the metal mesh, and simplify the process compared to the conventional process. .

In addition, the optical layer 400 may be formed to have a thickness suitable for making the difference in reflectance 10% or less. The thickness of the optical layer 400 may be set to 1 to 5 占 퐉, which may be suitable for controlling the difference in reflectance to 10% or less. The optical layer 400 may be formed by a roll-to-roll PECVD method, a sol-gel method, or the like.

The step of providing the transparent conductive layer 200 may include providing the amorphous transparent conductive layer 200 and thermally treating the amorphous transparent conductive layer 200 at 120 to 170 ° C for 30 to 120 minutes to form a crystalline transparent conductive layer 200, Layer 200 as shown in FIG. In this step, the amorphous transparent conductive layer 200 is thermally treated to convert the amorphous transparent conductive layer 200 into a crystalline transparent conductive layer 200 to complete the formation of the transparent conductive layer 200. The heat treatment may be performed at 120 to 170 ° C For 30 to 120 minutes. The sheet resistance (Ω / square) of the transparent conductive layer 200 can be lowered and stabilized by converting the amorphous transparent conductive layer 200 into the crystalline transparent conductive layer 200.

In addition, one aspect of the present invention can be used in addition to the blackening layer oxidizing the CZA layer. The pattern of the electrode is often made of metal , and the metal material is highly glossy, so that the external light may be reflected from the outside and the contrast ratio may be lowered. The surface of the conductive pattern can be darkened to suppress it. By doing so, the reflectance can be reduced.

In the blackening method for darkening the surface, a BM coating method in which carbon or black dye is added to the conductive paste may be used, or may be treated by a reactive sputtering method. According to the reactive sputtering method, the blackening layer can be formed and oxidation of the thin film can be prevented. By forming the blackening layer, it is possible to lower the reflectance of the hardened layer to improve the visibility and at the same time to prevent the natural oxidation, thereby minimizing the increase of sheet resistance due to oxidation.

Further, the blackening layer may be provided in contact with the CZA layer. When the blackening layer is provided on the CZA layer, oxidation of the CZA layer can be prevented and the reflectance can be controlled. If the blackening layer is provided under the CZA layer, the reflectance can be controlled .

Table 3 below is a table showing reflectance and resistance values according to nitrogen (N ₂ ) content.

Ar (sccm) N ₂ (sccm) Reflectance (%) R (Ω / □) 400 5 4.9 0.24 400 7 4.1 0.29 400 10 3.5 0.35 400 15 2.6 0.49 400 20 1.51 0.53 400 25 1.52 0.70 400 30 1.51 0.87

Table 4 below is a table showing reflectance and resistance values according to oxygen (O ₂ ) content.

Ar (sccm) O ₂ (sccm) Reflectance (%) R (Ω / □) 400 5 5.3 0.24 400 7 4.5 0.30 400 10 3.6 0.37 400 15 2.8 0.49 400 20 1.76 0.55 400 25 1.75 0.71 400 30 1.76 0.98

100: substrate 200: transparent conductive layer
210: transparent conductive layer pattern 300: CZA layer
310: wiring pattern 400: optical layer

Claims (21)

Board;
A transparent conductive layer provided on at least one side of the substrate;
(Cu-Zn-Al), which is a ternary alloy composed of 0.1 to 10.0 wt% of zinc (Zn), 0.1 to 10.0 wt% of aluminum (Al) and the balance of copper (Cu) layer; And
And a blackening layer provided in contact with the CZA layer. The method according to claim 1,
Wherein the blackening layer is any one of a CZAO (Cu-Zn-Al-O) layer, a CZAN (Cu-Zn-Al-N) layer and a composite layer thereof. 3. The method of claim 2,
The CZAO (Cu-Zn-Al-O) layer is a three-component alloy consisting of 0.1 to 10.0 wt% of zinc, 0.1 to 10.0 wt% of aluminum and the balance of copper, Zn-Al) and oxygen (O ₂ ). 3. The method of claim 2,
Wherein a content of oxygen (O ₂ ) in the CZAO (Cu-Zn-Al-O) layer is 1 to 10 wt% based on the total weight of the CZAO layer. 3. The method of claim 2,
The CZAN (Cu-Zn-Al-N) layer is a three-component alloy consisting of 0.1 to 10.0 wt% of zinc, 0.1 to 10.0 wt% of aluminum and the balance copper, Zn-Al) and nitrogen (N ₂ ). 3. The method of claim 2,
Wherein a content of nitrogen (N ₂ ) in the CZAN (Cu-Zn-Al-N) layer is 1 to 10 wt% based on the total weight of the CZAN layer. The method according to claim 1,
Wherein the thickness of the CZA layer is 50 to 500 nm. The method according to claim 1,
Wherein the blackening layer and the CZA layer have a width of 10 mu m or less, a thickness of 500 nm or less, and a pitch of 600 mu m or less, and the pattern is formed by a mesh pattern. The method according to claim 1,
Further comprising an optical layer provided between the transparent conductive layer and the substrate so that a difference between a reflectance of the transparent conductive layer and a reflectance of a region where the transparent conductive layer is patterned is 10% or less. 10. The method of claim 9,
Wherein the optical layer has a thickness of 1 to 5 占 퐉. Providing a transparent conductive layer on at least one side of the substrate;
(Cu-Zn-Al), which is a ternary alloy composed of 0.1 to 10.0 wt% of zinc (Zn), 0.1 to 10.0 wt% of aluminum (Al) and the balance of copper (Cu) Providing a layer; And
And a blackening layer provided in contact with the CZA layer. 12. The method of claim 11,
Wherein the blackening layer is one of a CZAO (Cu-Zn-Al-O) layer, a CZAN (Cu-Zn-Al-N) layer and a composite layer thereof. 13. The method of claim 12,
The CZAO (Cu-Zn-Al-O) layer is a three-component alloy consisting of 0.1 to 10.0 wt% of zinc, 0.1 to 10.0 wt% of aluminum and the balance of copper, Zn-Al) and oxygen (O ₂ ). 13. The method of claim 12,
Wherein the content of oxygen (O ₂ ) in the CZAO (Cu-Zn-Al-O) layer is 1 to 10 wt% based on the total weight of the CZAO layer. 13. The method of claim 12,
The CZAN (Cu-Zn-Al-N) layer is a three-component alloy consisting of 0.1 to 10.0 wt% of zinc, 0.1 to 10.0 wt% of aluminum and the balance copper, Zn-Al) and nitrogen (N ₂ ). 13. The method of claim 12,
Wherein the content of nitrogen (N ₂ ) in the CZAN (Cu-Zn-Al-N) layer is 1 to 10 wt% based on the total weight of the CZAN layer. 12. The method of claim 11,
Wherein the thickness of the CZA layer is 50 to 500 nm. 12. The method of claim 11,
The method further includes the step of providing an optical layer on the substrate so that the reflectance of the transparent conductive layer and the reflectivity of the removed region after patterning the transparent conductive layer are 10% or less on the substrate before the transparent conductive layer is provided Method of manufacturing a transparent touch panel film. 12. The method of claim 11,
Wherein the blackening layer and the CZA layer have a line width of 10 mu m or less, a thickness of 500 nm or less, and a pitch of 600 mu m or less, and the pattern is a mesh pattern. 12. The method of claim 11,
The step of providing the transparent conductive layer may include:
An amorphous transparent conductive layer is provided,
Treating the amorphous transparent conductive layer at 120 to 170 ° C for 30 to 120 minutes to convert the amorphous transparent conductive layer to a crystalline transparent conductive layer. A capacitive touch panel comprising a transparent touch panel film according to any one of claims 1 to 10.

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