KR20150146179A - Manufacturing method of touch panel sensor - Google Patents

Abstract

A manufacturing method of a touch panel sensor, which is arranged in an upper part of a display and detects a contact position of an object, comprises the following steps: forming a transparent conductive layer on an insulating substrate using a conductive fiber solution; forming a transparent insulating pattern corresponding to a transparent conductive pattern formed from the transparent conductive layer on the transparent conductive layer; and ionizing a conductive fiber of an area excluding a part protected by the transparent insulating pattern to electrically separate from each other by using the transparent insulating pattern as a mask, and forming the transparent conductive pattern from the transparent conductive layer of the part protected by the transparent insulating pattern.

Description

Technical Field [0001] The present invention relates to a manufacturing method of a touch panel sensor,

The present invention relates to a method of manufacturing a touch panel sensor capable of sensing a contact position of an object approaching a display.

1 is a perspective view illustrating a conventional capacitive touch panel sensor.

Referring to FIG. 1, a conventional touch panel sensor has a lower insulating sheet 10 and an upper insulating sheet 20 bonded to each other. The lower ITO electrode 30 and the upper ITO electrode 40 are vertically arranged on the upper surface of the lower insulating sheet 10 and the lower surface of the upper insulating sheet 20, respectively.

In the above-described touch panel sensor, there is a capacitance value corresponding to the area of each intersection point at each intersection of the lower ITO electrode 30 and the upper ITO electrode 40. When a part of the body is close to the intersection, The area of the body part is added to the area of the body 40, and the capacitance value can be changed.

A connection line 48 made of a metal material for electrically connecting the upper ITO electrode 40 and the electrode 52 of the external circuit board 50 extends from the end of the upper ITO electrode 40 to the upper surface of the upper insulating sheet 20 And the lower ITO electrode 30 is connected to the circuit board 50 by a separate connection line.

In general, the connecting line 48 provided with a metal can be visually recognized from the top of the transparent upper insulating sheet 20 because no light passes through the connecting line 48 and the circuit board 50 can be visually confirmed A separate reinforcing substrate 60 having a window decoration 65 in the form of a frame is disposed on the upper insulating sheet 20.

According to the conventional method, the ITO electrode 40 is formed by forming an ITO thin film on the insulating sheet 20, forming a mask for the pattern on the ITO thin film by a method such as photoresist, And the ITO electrode 40 is formed by removing the mask. In this process, it is troublesome to carry out processes such as film-forming, etching, and cleaning several times.

After this, the cumbersome process can continue. A process of forming the metal connecting line 48 again after forming the ITO electrode 40 is necessary. For this, a metal thin film is formed on the insulating substrate 20 on which the ITO electrode 40 is formed by a method such as sputtering or vapor deposition, and a mask for patterning is formed by photoresist or the like to pattern the connecting line 48 The metal thin film is patterned by using the mask, and the mask is removed to form the connecting line 48. In this case,

If the mask formation, patterning, etching, cleaning, and mask removal are performed a number of times each time, the overall manufacturing process is extended, and the probability of failure is increased because the process is performed in a lot of steps.

The present invention provides a method of manufacturing a touch panel sensor capable of simplifying a process of forming a conductive pattern and a wire pattern.

The present invention provides a method of manufacturing a touch panel sensor capable of forming a conductive pattern with a thin and uniform thickness.

According to an exemplary embodiment of the present invention, there is provided a method of manufacturing a touch panel sensor disposed on a display and sensing a contact position of a target object, the method comprising: forming a transparent conductive film on an insulating substrate using a conductive fiber solution; A step of forming a transparent insulating pattern corresponding to a transparent conductive pattern formed from a transparent conductive film on the film, and a step of forming a transparent insulating pattern corresponding to the transparent conductive pattern, And forming a transparent conductive pattern from the transparent conductive film of the portion protected by the transparent insulating pattern.

Further, the transparent insulation pattern can be formed before the wire pattern, and the wire pattern can be formed before the transparent insulation pattern. Specifically, after forming the transparent insulating pattern, it is possible to provide a wire pattern for electrically connecting the transparent conductive pattern to the outside on the transparent conductive film while maintaining the transparent conductive film as it is, It is also possible to form a transparent insulating pattern after providing a transparent conductive pattern and a wire pattern for electrical connection with the outside. In either case, a transparent conductive pattern can be formed from the transparent conductive film by forming a transparent insulating pattern and a wire pattern, followed by etching or dissociation.

The wire pattern can be provided through a printing method using a silver paste, but a wire pattern can be provided through etching even in a situation where a transparent insulation pattern is already formed. Specifically, a wire layer may be formed so as to cover the transparent conductive film and the transparent insulating pattern formed thereon, and then the wire pattern may be completed through an etching process for the designed wire pattern. The transparent conductive film under the transparent insulating pattern in the etching process can be protected as it is. In addition, the wire layer can be applied by a method such as coating or printing, or a method using sputtering.

Particularly, in the present invention, since a transparent conductive film is entirely formed on an insulating substrate for a transparent conductive pattern, a transparent conductive pattern having a uniform thickness can be formed regardless of the material used. Korean Patent No. 10-1192645 discloses the formation of a transparent electrode using silver nano wire. However, in the process of forming a transparent conductive pattern having a thickness of about 0.1 to 0.5 탆 using silver nano fibers, It is difficult to form a transparent conductive pattern having a uniform thickness due to the surface tension of the metal fiber solution.

In addition, although etching can be performed to form a transparent conductive pattern, a chemical dissociation method can be used in the present invention. For example, when the transparent conductive film is provided by using the conductive fiber solution, the conductive fibers in the region except for the portion protected by the transparent insulating pattern are mutually dissociated to form a portion protected by the transparent insulating pattern as the transparent conductive pattern Can be formed. For example, the transparent conductive film partially protected by the transparent insulating pattern can be deposited in the high-concentration resin solution, and the metal fiber at the exposed portion of the high-concentration resin solution can be dissociated. In this process, the transparent conductive film under the transparent insulating pattern can be protected, and the transparent insulating pattern can be used as a mask.

When a transparent conductive pattern is formed through dissociation after forming a wire pattern while maintaining the transparent conductive film intact, a transparent conductive film under the wire pattern is also formed. Can be protected.

When a wire pattern and a transparent insulating pattern are formed on a transparent conductive film to function as a mask, a part of the transparent conductive film may remain in a pattern shape in a lower part of the wire pattern as well as in the transparent insulating pattern, A part of the transparent conductive film having the shape of the electrode can be defined as an electrode pattern. The transparent conductive pattern may be provided in various shapes such as a linear shape, a diamond shape, a square shape, a triangle shape, a net shape, and the like, depending on the desired pattern pattern.

On the other hand, the transparent conductive film may be formed of at least one selected from the group consisting of carbon fiber, carbon powder, powder using metal, conductive ink, conductive organic material, PEDOT (polyethylene dioxythiophene), ITO, IZO, Al-doped zinc oxide, Nanotube), graphene, and carbon powder, or a conductive fiber solution may be used. The conductive fiber solution may be provided in a metal nano wire such as a silver nanowire including a synthetic resin and a volatile solvent (or water).

For reference, the conductive fiber in the present invention may include metal fibers including other metals (Al, Ag, Au, Cu, W) on the fibers other than the above-mentioned silver (Ag) And may include a fibrous non-metal fiber-like material having electrical conductivity, such as carbon fiber, although it is not made of metal.

The dissociation used in the present specification may mean simply dissolving or dissolving. However, more specifically, dissociation is terminated when the conductive fibers contained in the transparent conductive film are clumped to each other, So that they remain sufficiently separated from each other can be referred to as Harry.

The conductive fiber solution includes a conductive fiber, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder. The water-soluble solvent is volatilized, and the conductive fiber is fixed on the insulating substrate by the water-soluble binder to form a transparent conductive film. The insulating pattern is formed by using a liquid oil-based resin alone or by mixing an oil-based solvent for dissolving the oil-based resin with an oil-based resin and curing the oil-based resin on the transparent conductive film. In the step of forming the transparent conductive pattern, The dissolving resin solution for dissolution can be used to dissociate the conductive fibers.

The oil-insulating resin of the transparent insulation pattern may include at least one of urethane, epoxy acrylate and polyester acrylate. The oil-based solvent of the transparent insulation pattern may be acetone, Methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, ethyl acetate, ethyl acetate, butyl acetate butyl acetate).

Further, the water soluble binder of the conductive fiber solution includes ethyl cellulose, and the water soluble solvent of the conductive fiber solution may include water or an alcohol meter.

On the other hand, although specific materials of the water-soluble binder of the conductive fiber solution, the oil-based resin of the transparent insulation pattern and the oil-based solvent are listed above, the water-soluble binder of the conductive fiber solution contains synthetic resin having other water- And the oil-based resin and the oil-based solvent of the transparent insulation pattern may also include other oil-based (or oil-soluble) synthetic resin which is not dissolved by the dissolving resin solution.

The conductive resin in the region excluding the portion protected by the transparent conductive pattern is hardly evenly distributed in the resin solution for dissolution so that the dissolution resin solution is cured as it is, The conductive film may lose electrical conductivity.

Particularly, in the case where the metal fiber is uniformly distributed in the resin solution for dissolution which is disposed above the region except for the above-mentioned region, and the dissolution resin solution is cured as it is in the dissociated state, the region excluding the portion protected by the transparent conductive pattern, The lowering of the light transmittance by the metal fiber in the portion protected by the pattern may be the same.

The dissolving resin solution may contain a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin, and the water-soluble resin may include at least one of a water-soluble photocurable resin, a water-soluble natural dry resin, and a water-soluble thermosetting resin. The water-soluble solvent can be used alone or in combination with water or an alcohol meter.

Although only one touch panel sensor may be formed on an insulating substrate, it is also possible to define a touch panel sensor as one cell and simultaneously form a plurality of cell touch panel sensors on one insulating substrate. After forming the touch panel sensors of a plurality of cells at the same time, each cell can be cut and used as a conductive pattern film of a touch panel sensor.

Further, after forming the transparent conductive pattern, a protective coating layer can be formed.

A method of manufacturing a touch panel sensor of the present invention includes forming a transparent conductive pattern, forming a mask pattern many times as in the conventional method, forming a transparent conductive pattern by etching, removing the mask pattern before forming the wire pattern, The process of forming the wire pattern can be simplified, and the number of processes can be reduced, thereby reducing defects occurring in the process.

The method of manufacturing a touch panel sensor of the present invention forms a thin transparent conductive film on the entire surface, and forms a transparent conductive pattern using the transparent conductive film. Therefore, the transparent conductive pattern itself can be formed with a uniform thickness.

Since the method of manufacturing the touch panel sensor of the present invention can form a transparent conductive pattern and can be mass-produced through an automated process using a roll film, the production speed, accuracy, and yield .

1 is a perspective view illustrating a conventional touch panel sensor.
2 is an exploded perspective view of a touch panel sensor according to an embodiment of the present invention.
3 to 6 are a plan view and a sectional view for explaining the process of manufacturing the top sheet shown in Fig.
7 and 8 are a plan view and a cross-sectional view for explaining a process of manufacturing an upper sheet of a touch panel sensor according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. For reference, the same numbers in this description refer to substantially the same elements and can be described with reference to the contents described in the other drawings under these rules, and the contents which are judged to be obvious to the person skilled in the art or repeated can be omitted.

FIG. 2 is an exploded perspective view of a touch panel sensor according to an embodiment of the present invention, and FIGS. 3 to 6 are a plan view and a sectional view for explaining a process of manufacturing the upper sheet shown in FIG.

Referring to FIG. 2, the touch panel sensor 100 includes an upper cover substrate 110, an upper sheet 120, a lower sheet 130, and a flexible circuit board 140.

The top sheet 120 includes an upper insulating substrate 122, an upper conductive pattern 126, an upper wire pattern 128, and an upper conductive terminal 129. The lower sheet 130 also includes a lower insulating substrate 132, a lower conductive pattern 136, a lower wire pattern 138, and a lower conductive terminal 139. For reference, the conductive patterns are for a capacitive touch panel sensor. The lower conductive pattern 136 may operate as a transmitter, and the upper conductive pattern 126 may operate as a receiver.

The upper conductive pattern 126 and the upper wire pattern 128 may be disposed on the upper insulating substrate 122 and the lower conductive pattern 136 and the lower wire pattern 138 may be disposed on the lower insulating substrate 132. The upper conductive pattern 126 is disposed on the upper insulating substrate 122 in the longitudinal direction and the lower conductive pattern 136 is disposed on the lower insulating substrate 132 in the transverse direction, 126 may be formed.

Since the upper cover substrate 110 is directly touched by a part of the body, a rigid glass substrate which is excellent in strength and can not be easily refracted can be used, or a translucent reinforced plastic such as polycarbonate which is not easily refracted due to its strength can be used .

The bottom cover of the upper cover substrate 110 is also provided with a frame-shaped window decoration 112 which is made of a transparent material, such as an upper insulating substrate 122, And the upper and lower wire patterns 128 and 138 and the flexible circuit board 140 disposed at the edges of the lower insulating substrate 132. [ In some cases, the upper cover substrate functions as an insulating substrate, the upper conductive pattern may be formed directly on the bottom surface of the upper cover substrate, or the lower conductive pattern may be formed on the upper cover substrate according to the structure of the touch panel sensor . That is, in addition to being provided as a structure of a glass substrate-an upper film-a lower film as shown in the drawing, a conductive pattern may be formed on the bottom surface of the glass substrate and the upper surface of the film, A conductive pattern may be formed on both the upper surface and the lower surface. For this, a conventional laminated structure can be referred to, and the laminated structure of a substrate, a film or the like excluding the relation between the conductive pattern, the wire pattern and the insulating pattern does not limit the present invention.

For reference, the upper and lower insulating substrates 122 and 132 may include materials such as polyethylene, polypropylene, acryloyl, polyethylene terephthalate (PET), and plastic and glass.

On the other hand, an optical adhesive layer may be interposed between the upper cover substrate 110, the upper sheet 120, and the lower sheet 130, and the optical adhesive layer may be bonded to the upper sheet substrate 110, Or an OCA (Optically Clear Adhesive) film, a UV curing agent, or the like.

The flexible circuit board 140 may be provided with a terminal electrically connected to the upper and lower wire patterns 128 and 138 formed on the upper insulating substrate 122 and the lower insulating substrate 132. Therefore, when the object approaches the surface of the upper cover substrate 110, a change in capacitance value caused by mutual action of the upper conductive pattern 126 and the lower conductive pattern 136 is generated along the upper and lower wire patterns 128 and 138 And the control unit corresponding to the external device can calculate the touch position using the change of the value.

Hereinafter, a schematic configuration and components of the touch panel sensor according to the present invention will be described. In particular, the manufacturing process of the upper and lower sheets for generating the electric signal by the approach of the touch panel sensor, , The description of the lower sheet can be replaced with the description of the upper sheet.

Hereinafter, the manufacturing process of the upper sheet 120 will be described with reference to FIGS. As will be described later, the following process may be applied to the manufacturing process of the lower sheet 130 by different patterns, and may be applied to forming the upper conductive pattern and the lower conductive pattern on one insulating substrate.

In addition, the upper sheet 120 may be formed in a plurality of cells at the same time on one original insulating substrate, and the process may be performed as follows. In addition, this process can easily be changed in favor of mass production through the process of passing the rollers.

Referring to FIG. 3, a roll-shaped insulating plate 121 for a touch panel sensor of a plurality of cells is provided. A transparent conductive film 124 is applied over the entire surface of the insulating base plate 121.

The transparent conductive film 124 may be provided as a conductive film using a conductive fiber solution, which may be formed on site in accordance with a conventional method or may be provided from an external company in a state where the conductive film is already formed.

Referring to FIG. 4, a wire pattern 128 is provided thereon while the transparent conductive film 124 remains. The wire pattern 128 is electrically connected to the terminal of the flexible circuit board 140 to electrically connect the transparent conductive pattern 126 to the outside. In this embodiment, the wire pattern 128 is a transparent insulation pattern 156, but in another embodiment of the present invention the wire pattern is formed later than the transparent insulation pattern.

The wire pattern 128 can be formed by various methods such as silver paste silk printing, printing methods such as gravure printing of conductive ink including silver ink, flexo printing, metal thin film formation and etching. Since the transparent conductive pattern 126 is not formed when the wire pattern 128 is formed, the wire pattern 128 can be formed in advance corresponding to the position where the transparent conductive pattern 126 is formed.

Referring to FIG. 5, a transparent insulating pattern 156 is formed on the transparent conductive film 124 corresponding to the shape of the transparent conductive pattern 126. The transparent insulation pattern 156 has a rectangular outer shape extending upward and downward, and includes a square hole formed at uniform intervals inside. Thus, the transparent insulation pattern 156 is provided with three linear patterns connected at the top and bottom and formed at uniform widths and intervals. Three linear patterns form one group, and six transparent insulating patterns 156 are arranged in parallel at uniform intervals. For reference, the above structure is an example of a transparent conductive pattern, and may be formed in various structures such as a diamond structure depending on the type of the touch sensor.

5A, transparent insulating patterns 156 are formed at uniform intervals on the transparent conductive film 124. In FIG. 5B, a transparent conductive film 124 is formed on the transparent conductive film 124, And a transparent insulating pattern 156 is formed thereon.

Hereinafter, the process of forming the transparent conductive pattern 126 from the transparent conductive film 124 through dissociation will be described in detail with reference to FIG.

6, the transparent conductive film 124 is formed on the insulating base plate 121. The transparent conductive film 124 of the present embodiment is a water-soluble binder for dissolving the conductive fibers, the water-soluble binder, Is formed using a conductive fiber solution mixed with a solvent. The water-soluble solvent is volatilized and disappears using water or an alcohol system, and substantially the conductive fibers are stably attached on the insulating plate 121 through the water-soluble binder. In this state, since the conductive fibers are entangled with each other, the transparent conductive film 124 has conductivity even if the water-soluble binder is interposed in the middle. In this embodiment, ethyl cellulose may be used as a water-soluble binder of the conductive fiber solution, and water or an alcohol-based material may be used as a water-soluble solvent. In the present embodiment, the conductive fiber may include metal fibers including other metals (Al, Ag, Au, Cu, W) on the fibers other than the above-mentioned silver (Ag) A non-metallic fiber-like material having electrical conductivity such as carbon fiber may be included.

A wire pattern 128 and a transparent insulating pattern 156 corresponding to a desired shape of the transparent conductive pattern 126 are sequentially stacked on the transparent conductive film 124 described above.

The transparent insulating pattern 156 may be formed by using a liquid oily resin alone or by mixing an oily solvent for dissolving the oily resin with the oily resin and curing the oily resin on the transparent conductive film 124. [

The oil-insulating resin of the transparent insulation pattern may include at least one of urethane, epoxy acrylate and polyester acrylate. The oil-based solvent of the transparent insulation pattern may be acetone, Methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, ethyl acetate, ethyl acetate, butyl acetate butyl acetate).

5A, transparent insulating patterns 156 are formed at uniform intervals on the transparent conductive film 124, and FIG. 5B is a cross-sectional view of the transparent conductive film 124, And a transparent insulating pattern 156 is formed thereon.

The conductive fiber 124 in the portion not protected by the transparent insulating pattern 156 is removed from the transparent conductive film 124 provided as shown in Fig. It can be dissociated to lose conductivity. This process can be referred to FIG. Here, the dissociation may have a merely dissolving effect, but more specifically, the conductive fibers contained in the transparent conductive film 324 are separated from each other to be loosened, It may have the meaning of changing the state to a sufficiently far apart state.

Referring to FIG. 6, a dissolving resin solution 160 is applied so that the transparent insulation pattern 156 is sufficiently covered on the insulation plate 121.

Here, the height of the dissolving resin solution 160 is adjustable within a range that allows the conductive fibers contained in the transparent conductive film 124 to be spaced sufficiently apart to lose electrical conductivity.

In addition, the dissolving resin solution 160 includes a water-soluble solvent for dissolving the water-soluble resin and the water-soluble resin. In the course of curing the dissolving resin solution 160, the water-soluble solvent may volatilize, The height of the dissolving resin solution 160 may be somewhat reduced after the curing of the solution 160 (substantially curing the water-soluble resin). However, as mentioned above, the height of the dissolving resin solution 160, The conductive fibers contained in the film 124 should be adjusted to such a degree that they can be sufficiently separated to lose electrical conductivity.

If the water-soluble resin remaining after volatilization of the water-soluble solvent in the dissolving resin solution 160 solidifies as it is, the conductive fibers, which have dissociated in the water-soluble resin and remain in a loosened state, can not naturally conduct electricity any more And the transparent conductive film 124 of the portion 127 exposed by the dissolving resin solution 160, that is, the portion 127 not protected by the transparent insulating pattern 156, may lose electrical conductivity.

Particularly, in the case where the metal fiber is uniformly distributed in the resin solution for dissolution which is disposed above the region except for the above-mentioned region, and the dissolution resin solution is cured as it is in the dissociated state, the region excluding the portion protected by the transparent conductive pattern, The lowering of the light transmittance by the metal fiber in the portion protected by the pattern may be the same. Therefore, when the touch panel sensor manufactured by the present manufacturing method is viewed from above, the boundary portion of the transparent conductive pattern is virtually blurred and can be visually confirmed.

The water-soluble resin of the dissolution resin solution 160 may be used by dissolving at least one of water-soluble photo-curable resin, water-soluble natural dry resin, and water-soluble thermosetting resin in a water-soluble solvent, Depending on the nature of the water-soluble resin used, the curing process can be changed. For example, Alberdingk Boley's LUX family of products is a representative water-soluble, water-soluble photocurable resin, and products such as LUX 220, 250, and 255 are cured by ultraviolet light.

Therefore, when the LUX series product of Alberdingk Boley is used as a water-soluble resin, only general water can be used as a water-soluble solvent, and if a water-soluble resin soluble in alcohol is selected in some cases, an alcohol-based material can be used as a water-soluble solvent. For reference, the water-soluble resin may be provided in the same material as the water-soluble binder of the conductive fiber solution.

In summary, the unprotected portion of the transparent insulating pattern 156 is dissociated and is not substantially removed, but it is possible to realize the same effect of losing electrical conductivity as if it is physically removed, ) Is defined as a transparent conductive pattern 126. The transparent conductive pattern 126 is a transparent conductive pattern.

In this embodiment, after the transparent conductive pattern 126 is formed, a protective coating layer may be further formed thereon, but the hardened dissolving resin solution 160 may substantially serve as a protective coating layer.

Particularly, in this embodiment, the dissolving resin solution 160 is hardened and its surface is smoothly provided, so that the defect rate in which air bubbles are generated between the optical adhesive layer and the sheet, which are used in joining between the upper and lower sheets, can be greatly reduced.

7 and 8 are a plan view and a cross-sectional view for explaining a process of manufacturing an upper sheet of a touch panel sensor according to another embodiment of the present invention. For reference, the explanation of the insulating disc, the transparent insulating pattern, and the transparent conductive film and the process of forming the transparent insulating film can be referred to the above description.

Referring to FIG. 7, a transparent insulating pattern 256 corresponding to the shape of the transparent conductive pattern 226 designed on the transparent conductive film 224 is formed.

Thereafter, the transparent conductive film 224 is left as it is, and a wire pattern 228 is formed thereon.

The wire pattern may be provided through etching from a wire layer overlying the transparent conductive film. The wire layer can be applied from a method such as coating or printing to a method using sputtering. In this case, the transparent conductive film 224 under the wire pattern 228 formed as designed can be protected as it is. In this embodiment, since the transparent insulating pattern 256 is formed first and the wire pattern 228 is formed, the wire pattern 228 can be formed through the etching process of the wire layer 227. [

However, in this embodiment, the wire pattern 228 can be provided through a printing method using a printing method such as silver paste silk printing, gravure printing of conductive ink including silver ink, and flexo printing. The wire pattern 228 thus formed can be provided in a shape as originally designed without any separate etching, and can be electrically connected to the terminal of the flexible circuit board at a later time.

7, a transparent conductive film 224, a transparent insulating pattern 256, and a wire pattern 228 are sequentially formed, and then a transparent conductive film 224 is formed through dissociation of the transparent conductive film 224, 226).

The dissociation process of the transparent conductive film 224 has been described in the previous embodiment, but will be described again with reference to FIG.

8, a transparent conductive film 224, a transparent insulating pattern 256, and a wire pattern 228 are sequentially formed on the insulating base plate 221, as described above.

The transparent conductive film 224 is formed using a conductive fiber solution in which conductive fibers, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder are mixed. Since the transparent conductive film 224 is entangled with the conductive fibers before dissociation, the transparent conductive film 124 has conductivity even though the water-soluble binder is interposed in the middle.

The transparent conductive film 224 of the portion 227 not protected by the transparent insulating pattern 256 is removed from the transparent conductive film 224 provided as shown in Fig. The conductive fibers can be dissociated to lose conductivity.

Referring to FIG. 8, a dissolving resin solution 260 is applied so that the transparent insulation pattern 256 is sufficiently covered on the insulation plate 221.

Here, the height of the dissolving resin solution 260 is adjustable within a range that allows the conductive fibers contained in the transparent conductive film 224 to be spaced sufficiently apart to lose electrical conductivity.

The dissolving resin solution 260 includes a water-soluble solvent and a water-soluble solvent for dissolving the water-soluble resin. In the course of curing the dissolving resin solution 260, the water-soluble solvent can be volatilized, After the curing of the solution 260, the height of the dissolving resin solution 260 may be somewhat reduced. However, as described above, the height of the dissolving resin solution 260, which has been reduced and changed, It should be controlled within a range that can be sufficiently separated to lose conductivity.

In any case, if the water-soluble resin remaining after volatilization of the water-soluble solvent in the dissolving resin solution 260 solidifies as it is, the conductive fibers, which are dissociated in the water-soluble resin and kept in a loosened state, can not naturally conduct electricity any more And the transparent conductive film 224 of the portion 227 exposed to the dissolving resin solution 260, that is, the portion not covered by the transparent insulating pattern 256, may lose electrical conductivity.

In summary, the unprotected portion of the transparent insulating pattern 256 is dissociated and is not substantially removed, but it is possible to realize the same effect of losing electrical conductivity as if it is physically removed, Is defined as a transparent conductive pattern 226. The transparent conductive pattern 226 is a transparent conductive pattern.

After forming the transparent conductive pattern 226, a protective coating layer may be further formed thereon, but the cured dissolving resin solution 260 may substantially act as a protective coating layer and may be omitted.

In particular, the dissolving resin solution 260 is cured to smoothly provide the surface thereof, so that the defective rate at which air bubbles are generated between the optical adhesive layer and the sheet to be used in joining the upper and lower sheets later can be greatly reduced.

Although the present invention has been described with reference to the preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the following claims. It can be understood that

100: touch panel sensor 110: upper cover substrate
112: window decoration 120: top sheet
121: upper insulating plate 122: upper insulating substrate
126: upper conductive pattern 128: upper wire pattern
125: upper protective coating layer 129: upper conductive terminal
130: Lower sheet

Claims (14)

1. A method of manufacturing a touch panel sensor disposed on an upper surface of a display,
Forming a transparent conductive film on an insulating substrate using a conductive fiber solution;
Forming a transparent insulating pattern corresponding to a transparent conductive pattern formed from the transparent conductive film on the transparent conductive film; And
Wherein the transparent conductive pattern of the portion protected by the transparent insulating pattern is electrically connected to the transparent conductive pattern by using the transparent insulating pattern as a mask to dissociate the conductive fibers of the region excluding the portion protected by the transparent insulating pattern, Forming a conductive pattern;
The method of claim 1, The method according to claim 1,
After forming the transparent insulation pattern,
Wherein a wire pattern for electrically connecting the transparent conductive pattern to the outside is provided on the transparent conductive film while maintaining the transparent conductive film as it is. The method according to claim 1,
After providing the wire pattern for electrical connection between the transparent conductive pattern and the outside on the transparent conductive film while keeping the transparent conductive film intact,
And forming the transparent insulating pattern. The method according to claim 1,
Wherein the conductive fiber solution comprises a conductive solvent, a water-soluble binder, and a water-soluble solvent for dissolving the water-soluble binder, wherein the water-soluble solvent is volatilized and the conductive fiber is fixed on the insulating substrate by the water- Forming a conductive film,
Wherein the transparent insulating pattern is formed by using a liquid oily resin alone or by mixing an oily solvent for dissolving the oily resin with the oily resin and curing the oily resin on the transparent conductive film,
Wherein the conductive fiber is dissociated using a dissolution resin solution for dissolving the water-soluble binder in the step of forming the transparent conductive pattern. 5. The method of claim 4,
Wherein the oil-based resin of the transparent insulation pattern comprises at least one of urethane, epoxy acrylate, and polyester acrylate,
The oily solvent of the transparent insulating pattern may be at least one selected from the group consisting of acetone, methyl isobutyl ketone (MIBK), methyl ethyl ketone (MEK), cyclohexane, toluene, wherein the adhesive layer comprises at least one of ethyl acetate, ethyl acetate, and butyl acetate. 5. The method of claim 4,
Wherein the water soluble binder of the conductive fiber solution comprises ethyl cellulose,
Wherein the water soluble solvent of the conductive fiber solution comprises water or an alcohol meter. 5. The method of claim 4,
The conductive resin in the region excluding the portion protected by the transparent conductive pattern is hardly evenly distributed in the dissolution resin solution and hardened,
Wherein the transparent conductive film loses electrical conductivity in a region excluding the portion protected by the transparent conductive pattern. 5. The method of claim 4,
Wherein the dissolving resin solution comprises a water-soluble resin and a water-soluble solvent for dissolving the water-soluble resin. 9. The method of claim 8,
Wherein the water-soluble resin comprises at least one of a water-soluble photo-curable resin, a water-soluble naturally-drying resin, and a water-soluble thermosetting resin. 9. The method of claim 8,
Wherein the water-soluble solvent is water or alcohol meter alone or in combination. The method according to claim 1,
Wherein the wire pattern is provided by etching a wire layer provided so as to cover the entire transparent conductive film, and the transparent conductive film under the transparent insulating pattern is protected in an etching process. 12. The method of claim 11,
Wherein the wire layer is provided by sputtering. The method according to claim 1,
Wherein the protective coating layer is formed after forming the transparent conductive pattern. The method according to claim 1,
Wherein a cell for one or a plurality of touch panel sensors is simultaneously formed on the insulating substrate, and the insulating substrate is provided in the form of a flat film or a roll film.

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