KR20120049826A - Position alignment device, position alignment method, and computer readable recording medium having position alignment program recorded thereon - Google Patents

Abstract

PURPOSE: A position aligning device, a position aligning method, and a computer readable recording medium having position aligning program are provided to control an increase of a testing time by reducing a searching time for a position alignment of a testing object even though images photographed is out of a testing area. CONSTITUTION: A position aligning device comprises a photographing unit, a memory unit, a searching unit(24), a calculation unit(25), and a control unit. The memory unit comprises a high-resolution recipe image photographed by the photographing unit and a view field area of the high-resolution recipe image and memorizes a low-resolution recipe image photographed by the photographing unit. The searching unit searches a position of a testing image for testing photographed by the photographing unit and the low-resolution recipe image at a same diameter with the high-resolution recipe image. When a measurement section is out of the view field area of the testing image based on a result of the searching, the calculation unit calculates position information including a position of measurement section and the testing image. The control unit moves the photographing unit so that the measurement section can be in the view field area of the testing image and the photographing unit photographs the testing image.

Description

POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, AND COMPUTER READABLE RECORDING MEDIUM HAVING POSITION ALIGNMENT PROGRAM RECORDED THEREON}

The present invention relates to a position alignment device, a position alignment method, and a position alignment program used for an inspection apparatus for inspecting a glass substrate, a semiconductor substrate, a printed board, or the like, for example, for a flat panel display.

Conventionally, flat panels such as liquid crystal displays (LCDs), plasma display panels (PDPs), organic electroluminescent (EL) displays, and surface-conduction electro-emitter displays (SEDs) are used. Display) In the manufacture of various substrates such as a substrate, a semiconductor wafer, and a printed circuit board, in order to improve the yield, defects such as short-circuits, poor connection, and disconnection or pattern defects are present after each patterning process. Is checked. The board | substrate test | inspection apparatus is what is called a board | substrate test | inspection apparatus of the transmissive illumination type which image-captures the board | substrate of an inspection object and performs board | substrate inspection, illuminating a board | substrate from below the floating plate in which a board | substrate is mounted. Moreover, depending on the board | substrate of a test | inspection, the fall-light illumination type board | substrate inspection apparatus which illuminates from the imaging element side which picks up a board | substrate is also used.

By the way, in the board | substrate inspection apparatus which performs a process of inspection, a measurement, etc. with respect to the board | substrate which has a wide inspection object surface, such as a glass substrate, when it inspects the specific position of an inspection object surface, it is registered based on the coordinate registered in the recipe. The pattern matching of the target pattern of the inspection target board | substrate was performed with reference to a template, and position alignment was performed. However, the coordinates of the target pattern registered in the recipe and the coordinates of the actual target pattern on the stage do not necessarily coincide. In some cases, the image pickup unit or the substrate is moved to repeat the pattern matching a plurality of times. I had to search.

Therefore, the first template acquired at high magnification and the second template for pattern matching with the reduced image including the wide area including the search target image are set in advance, and the target pattern is not obtained by pattern matching in the first template. In this case, a position alignment method of performing pattern matching using a second template is disclosed (see Patent Document 1, for example).

[Patent Document 1] Japanese Patent No. 3246616

However, in the position alignment method disclosed in Patent Document 1, when the captured image is out of the inspection area, it is necessary to perform pattern matching again after switching the optical system to a low magnification at the captured position to acquire a wide range of low magnification images. As a result, the inspection time was increased. In addition, the movement of the imaging unit or the substrate plural times also caused an increase in the inspection time.

This invention is made | formed in view of the above, Even if the image of the test | inspection object imaged out of the test | inspection area | region is located, the position alignment which can shorten the search time which takes the position alignment of a test subject, and can suppress the increase of test time. An object of the present invention is to provide a computer-readable recording medium having recorded thereon an apparatus, a positioning method and a positioning program.

MEANS TO SOLVE THE PROBLEM In order to solve the problem mentioned above and to achieve the objective, the position alignment apparatus which concerns on this invention is a position alignment apparatus which performs the position alignment of the board | substrate for inspection measurement, The imaging part which picks up the image of the said board | substrate, and the said inspection A measurement location for performing measurement is set, and includes a high magnification recipe image picked up by the imaging unit and a viewing area of the high magnification recipe image, and has a wider viewing area than the high magnification recipe image, and is picked up by the imaging unit. A retrieval unit for storing the stored low magnification recipe image and a position in the low magnification recipe image of the inspection image for the inspection measurement picked up by the imaging unit at a magnification equivalent to the high magnification recipe image stored in the storage unit; And, as a result of the search by the searching unit, the measurement dog from the field of view area of the inspection image. If is out of the range, the measurement location is calculated into the field of view of the inspection image based on the calculation unit for calculating the position information including the inspection image and the position of the measurement location, and the position information calculated by the calculation unit. And a control unit for imaging the inspection image after moving the imaging unit.

In order to solve the above-mentioned problems and to achieve the object, the position alignment method according to the present invention includes an image capturing unit for capturing a substrate image for inspection measurement, a high magnification recipe image in which a measurement point for performing the inspection measurement is set, and the A position alignment method performed by a position aligning device including a field of view of a high magnification recipe image and having a storage unit for storing a low magnification recipe image having a wider field of view as compared to the high magnification recipe image, and for aligning positions of the substrate images. An image of a substrate to be measured, which is picked up at the same magnification as that of the high magnification recipe image, an inspection image imaging step of capturing an inspection image to perform inspection measurement, and a search step of searching for a position within the low magnification recipe image of the inspection image; The visual field of the inspection image as a result of the search in the search step When the measurement point is out of the station, a calculation step of calculating the position information including the inspection image and the position of the measurement point, and the visual field of the inspection image based on the position information calculated in the calculation step. After moving the said imaging part so that the said measurement location may enter in an area | region, it is characterized by including the moving imaging step which picks up a test image.

In order to solve the above-mentioned problems and achieve the object, a computer-readable recording medium which records a position alignment program according to the present invention includes an image capturing unit for photographing a substrate image for inspection measurement, and a measurement point for performing the inspection measurement. And a storage unit for storing a high magnification recipe image, and a low magnification recipe image having a wider viewing area than that of the high magnification recipe image, and storing a position of the substrate image. An image of a substrate to be inspected by the apparatus is imaged at the same magnification as that of the high magnification recipe image, and the inspection image imaging procedure of capturing an inspection image to perform inspection measurement and a position in the low magnification recipe image of the inspection image are searched. The search as a result of the search in the search procedure and the search procedure When the measurement location is out of the visual field area of the dead image, the calculation procedure for calculating the position information including the inspection image and the position of the measurement location, and the position information calculated in the calculation procedure, After the imaging unit is moved so that the measurement point enters the visual field of the inspection image, a moving imaging procedure for imaging the inspection image is executed.

The computer-readable recording medium which records the position alignment device, the position alignment method, and the position alignment program according to the present invention includes a high magnification recipe image including a measurement point, a high magnification recipe image, and has a wider field of view than a high magnification recipe image. When a low magnification recipe image to be registered is registered in advance, and an inspection image acquired at a high magnification is out of the inspection area, the inspection image is set to have a pixel resolution equivalent to the magnification of the low magnification recipe image to search for a position in the low magnification recipe image of the inspection image. Even when the image of the inspection subject captured is out of the inspection region, the search time required for the alignment of the inspection subject can be shortened and the increase in inspection time can be suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic diagram which shows typically the structure of the flat panel display (FPD) test | inspection apparatus which concerns on embodiment of this invention.
2 is a flowchart for explaining a recipe image registration process according to the embodiment of the present invention.
3 is a schematic diagram showing a recipe image of the FPD inspection apparatus according to the embodiment of the present invention.
4 is a schematic diagram showing a recipe image of the FPD inspection apparatus according to the embodiment of the present invention.
5 is a flowchart for explaining line width measurement processing according to the embodiment of the present invention.
6 is a schematic diagram showing an inspection image of the FPD inspection apparatus according to the embodiment of the present invention.
7 is a schematic diagram showing a recipe image and an inspection image of the FPD inspection apparatus according to the embodiment of the present invention.
8 is a schematic diagram showing a recipe image and an inspection image of the FPD inspection apparatus according to the embodiment of the present invention.

EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated in detail with drawing. In addition, this invention is not limited by the following embodiment. In addition, each drawing referred to in the following description is only the outline of shape, size, and a positional relationship so that the content of this invention can be understood. That is, the present invention is not limited only to the shape, size, and positional relationship illustrated in each drawing.

First, the inspection apparatus which concerns on embodiment of this invention is demonstrated in detail with reference to drawings. In addition, the following description demonstrates the board | substrate inspection apparatus of the type which moves an optical system unit with respect to the board | substrate of a test | inspection as an example of a position alignment apparatus. However, this embodiment is not limited to this, It is also possible to apply to the board | substrate inspection apparatus of the type which moves a board | substrate with respect to an optical unit. In addition, although the board | substrate test | inspection apparatus is demonstrated as an offline type, it may be an inline type.

FIG. 1: is a schematic diagram which shows schematic structure of the flat panel display (FPD) test | inspection apparatus which concerns on this embodiment. As shown in FIG. 1, the FPD inspection apparatus 1 includes a substrate processing unit 1a for placing and inspecting a substrate W that performs a conveyed quadrangle, and a control mechanism 1b for controlling the entire FPD inspection apparatus 1. ).

In addition, the substrate processing unit 1a is fixed on the stage 12 and the stage 12 that forms a substantially rectangular shape that is a base frame 11 as a mount, an upper plate of the base frame 11, and holds the substrate W. The substrate holder 13 to be made, the door frame 14 which hangs the stage 12 along one side, the optical unit 16 hold | maintained by the door frame 14, and the optical unit 16 are door frame The moving mechanism 18 which moves every 14 is provided.

In addition, the moving mechanism 18 provided in the door frame 14 is installed below the stage 12, for example. Below the stage 12, the X-axis member 19 extended along the direction (X direction) orthogonal to the longitudinal direction of the door frame 14 is also provided. The moving mechanism 18 moves the optical unit 16 along the X direction for every door frame 14 by moving along the X-axis member 19 under the control of the control part 20. The sentence frame 14 is called what is called a gantry stage, and is equipped with the Y-axis member 15 provided in the direction (Y direction) orthogonal to the moving direction (X direction) of the moving mechanism 18. As shown in FIG. The optical unit 16 is hold | maintained in the sentence frame 14 by the moving mechanism 17 which can move the sentence frame 14 along the Y-axis member 15. As shown in FIG. The moving mechanism 17 moves the sentence frame 14 along the Y-axis member 15 under the control of the control part 20.

The base frame 11 is comprised by the member with high earthquake resistance, for example, the frame which combined block-shaped marble and steel materials. In addition, between the base frame 11 and the installation surface (for example, the floor), a vibration absorbing mechanism composed of, for example, a spring, a hydraulic damper, or the like is provided. Thereby, vibration of the stage 12 and the optical unit 16 is further prevented.

The stage 12 includes a plurality of floating plates extending in the Y direction and forming a substantially plate shape in which the substrate W is lifted and placed on the transport surface. By arranging the floating plate along the X direction, the conveyance path of the substrate W is formed. In this way, the stage 12 has a structure in which each floating plate is arranged in the shape of a footboard which is woven like a foot along the X direction. Each floating plate is provided with a plurality of blowing holes for ejecting air vertically upward by supply of air from an air supply unit (not shown). Moreover, it is preferable that a jet hole is arrange | positioned at the space | interval so that the bending vibration of the board | substrate W may not generate | occur | produce like the space | interval of a lagrange point. Moreover, as a positioning method of the board | substrate W, the lift pin which supports the board | substrate W carried on the stage 12, and arrange | positions on the stage 12, the alignment mechanism etc. which align the board | substrate W mounted on the stage 12, etc. The method of using is mentioned.

The optical unit 16 has the microscope 161 which adjusts a viewing area, and the imaging part 162 which picks up the board | substrate W with which the viewing area or focal position was adjusted with the microscope 161. As shown in FIG. By analyzing the image acquired by this optical unit 16, whether the defect exists in the board | substrate W can be detected. In addition, the optical unit 16 is, for example, a repair unit for performing laser irradiation repair or coating correction on a defective portion of the substrate W, a measurement unit for measuring dimensions such as wiring, film thickness measurement, color measurement, and the like. It is possible to apply a processing unit that performs the processing at a predetermined position. In addition, the optical unit 16 may be an imaging form without the microscope 161.

The microscope 161 is a magnification optical system for reducing the imaging field of view of the image capturing unit 162 and realizing image acquisition at a desired magnification. In addition, the imaging unit 162 includes an illumination unit such as an LED, an optical system such as a condenser lens, and an imaging element such as a CMOS image sensor or a CCD. The illumination unit emits illumination light such as white light in the imaging visual field of the imaging device, and illuminates a subject in the imaging visual field. This optical system collects the reflected light from this imaging visual field on the imaging surface of an imaging element, and forms the subject image (substrate W image) of an imaging visual field on the imaging surface of an imaging element. The imaging element receives the reflected light from this imaging visual field through an imaging surface, performs a photoelectric conversion process on the received optical signal, and image | photographs the subject image of this imaging visual field. Under the control of the control unit 20, the microscope 161 automatically moves the lens system included in the microscope 161 itself or the microscope 161 in a direction perpendicular to the imaging surface of the substrate W (Z direction). Has the auto focus function. The autofocus may be to detect and focus a position where the contrast is maximized, or may be focused using a laser.

In addition, the FPD inspection apparatus 1 includes an exterior having an FFU that surrounds at least the substrate processing unit 1a and delivers clean air (hereinafter referred to as clean air) provided above the optical unit 16. If it exists, since a clean room can be formed, it is preferable. This clean room is an enclosed interior space other than the inlet and outlet of the board | substrate, and the lower duct.

FFU sends clean air from which dust, such as a particle, was removed, for example. As a result, the moving area of the optical unit 16 is made into the clean state with less dust especially. Moreover, the clean air sent out concentrated in the vicinity of the optical unit 16 forms exhaust in a clean room, and is exhausted from the exhaust port.

The control mechanism 1b includes a control unit 20, a transmission / reception unit 21, an input unit 22, an output unit 23, a search unit 24, a calculation unit 25, and a storage unit 26. The control mechanism 1b is realized by a computer provided with a ROM, a RAM, and the like.

The control unit 20 controls the entire FPD inspection apparatus 1. The transceiver 21 has a function as an interface for transmitting and receiving information according to a predetermined format, and is connected to, for example, the imaging unit 161 of the optical unit 16. Also, it may be through a communication network (not shown).

The input unit 22 is configured by using a keyboard, a mouse, a microphone, or the like, and acquires various information necessary for analyzing a specimen, instruction information of an analysis operation, and the like from the outside. The output part 23 is comprised using a display, a printer, a speaker, etc.

The search unit 24 searches for a position in the low magnification recipe image D2 to be described later where the high magnification image of the substrate W captured by the imaging unit 161 of the optical unit 16 is described later. In addition, the searching unit 24 determines whether or not the inspection target pattern is included in the high magnification image based on the search result.

The calculation unit 25 calculates the distance between the high magnification image and the high magnification recipe image D1 from the position of the high magnification image searched by the search unit 24 with respect to the low magnification recipe image D2. In addition, the high magnification recipe image D1 is an image which enlarged a part of the low magnification recipe image, and is an image containing the pattern of a test target, as mentioned later.

The storage unit 26 includes a hard disk for storing information magnetically and various programs including a position alignment program according to the present embodiment, which is related to the processing when the substrate processing unit 1a executes the processing. It is constructed using a memory that is loaded from and electrically stored. In addition, the storage unit 26 stores the high magnification recipe image D1 and the low magnification recipe image D2 used in the line width measurement process described later.

Next, the recipe image used for pattern matching is demonstrated. 2 is a flowchart for explaining a recipe image registration process performed by the FPD inspection apparatus 1. 3 and 4 are schematic diagrams showing a recipe image. First, the control unit 20 performs a high magnification (a magnification S1) on the image including the pattern of the measurement target in the measurement coordinates registered in the recipe picked up by the imaging unit 161 through the transmission / reception unit 21. (Step S102). The acquired image is, for example, a high magnification recipe image D1 including at least the pattern R1 of the measurement target, as shown in FIG. 3. In addition, in the high magnification recipe image D1, a part of the pattern R2 is imaged so as to fit into the frame, in addition to the pattern R1 to be measured, but the image may not be included in the frame.

After acquiring the high magnification recipe image D1, a measurement location is set on the high magnification recipe image D1 (step S104). As shown in FIG. 3, the measuring points P1 and P2 which are measuring points which measure the line width in the pattern R1 are set. By setting the measurement points P1 and P2, when the pattern R1 exists in the picked-up image, the distance between the measurement points P1 and P2 is set. The measurement points P1 and P2 are set, for example, at the boundary part where the shade between the pattern R1 and the substrate surface changes.

When setting of the measurement location in high magnification recipe image D1 is complete | finished, the control part 20 makes the memory part 26 store this high magnification recipe image D1 (step S106).

Next, the image in this measurement coordinate is acquired by low magnification (magnification S2 (<S1)) (step S108). As shown in FIG. 4, the acquired image is a low magnification recipe image D2 including at least a high magnification recipe image D1. At this time, the area of the viewing area of the low magnification recipe image D2 is two times or more of the area of the viewing area of the high magnification recipe image D1. 3 and 4, it is preferable that the viewing center C1 of the high magnification recipe image D1 and the viewing center C2 of the low magnification recipe image D2 coincide with each other.

When the low magnification recipe image D2 is acquired, the control unit 20 causes the storage unit 26 to store the low magnification recipe image D2 (step S110). The above-described recipe image registration processing is performed with respect to the measurement coordinates registered in the recipe. When there are a plurality of measurement coordinates, the high magnification recipe image D1 and the low magnification recipe image D2 of the measurement coordinates are acquired and stored. In addition, when the same pattern is formed in the board | substrate W, you may register a high magnification recipe image and a low magnification recipe image one image each in common to each measurement coordinate.

5 is a flowchart for explaining a line width measurement process performed by the FPD inspection apparatus 1. 6 to 8 are schematic diagrams showing inspection images and recipe images. First, the control unit 20 moves the optical unit 16 to the measurement coordinates (step S202). And the control part 20 image | photographs the image of the board | substrate W in a measurement coordinate with high magnification (magnification S1), and acquires an image as the inspection image 30 shown in FIG. 6 (step S204).

After acquiring the inspection image 30, the control unit 20 reduces the inspection image 30 acquired in step S204 by (S2 / S1) times (step S206). By this reduction processing, the inspection image 30 and the low magnification recipe image D2 become equal pixel resolution.

The control unit 20 causes the search unit 24 to search where the reduced image 40 in which the inspection image 30 is reduced is located on the low magnification recipe image D2 (step S208). As shown in FIG. 7, the search unit 24 searches a position in the low magnification recipe image D2 of the reduced image 40 to determine a location where the inspection image 30 is located on the low magnification recipe image D2.

When search of the position in the low magnification recipe image D2 of the reduced image 40 is complete | finished, the control part 20 calculates the position of the measurement location in the test | inspection image 30 (step S210). At this time, the control part 20 calculates the coordinate of the visual field center C3 of the test | inspection image 30, for example.

When the coordinates of the visual field center C3 of the inspection image 30 are calculated, the control unit 20 determines whether or not there are measurement points in the inspection image 30 based on the calculated coordinates (step S212). Here, in the case where it is determined that there are measurement points in the inspection image 30 (step S212: YES), the control unit 20 proceeds to step S218 and performs the line width measurement processing of the measurement points. The control unit 20 measures the distance between the measuring points P1 and P2 shown in FIG. 3, for example. After the line width measurement is finished, the control unit 20 proceeds to step S202 when there is the next measurement coordinate (step S220: YES), and performs the line width measurement process at the next measurement coordinate. In addition, when there is no next measurement coordinate (step S220: no), the control part 20 complete | finishes a process.

On the other hand, when the control unit 20 determines that there is no measurement point in the inspection image 30 (deviates from the inspection area) (step S212: NO), the control unit 20 calculates a deviation amount from the measurement position of the inspection image 30. (Step S214). Specifically, as shown in FIG. 8, the control unit 20 calculates the distance and direction between the viewing center C3 of the reduced image 40 (the inspection image 30) and the viewing center C2 of the low magnification recipe image D2. It calculates to (25). The control unit 20 moves the optical unit 16 so that the field of view at the high magnification (magnification S1) becomes the region 50 based on the distance and the direction of the shift amount calculated by the calculating unit 25.

After moving the optical unit 16, the control unit 20 acquires an image at a high magnification (magnification S1) (step S216). After acquiring the image, the control unit 20 proceeds to step S218 and performs a line width measurement process.

According to this embodiment mentioned above, the inspection image acquired by the high magnification recipe image containing a measurement location, and the low magnification recipe image containing a high magnification recipe image, and having a wider field of view than a high magnification recipe image in advance, and acquired by high magnification is an inspection area. Since the inspection image is set to have a pixel resolution equal to the magnification of the low magnification recipe image and the position in the low magnification recipe image of the inspection image is detected, the magnification of the optical system is not switched even when the inspection image is out of the inspection area. Instead, an inspection image including a measurement point can be obtained. In addition, the optical unit can be moved to the inspection area including the measurement point in one movement operation without performing a plurality of corrections and pattern matching. As a result, the search time required for the alignment of the inspection object can be shortened, and the increase in the inspection time can be suppressed.

In addition, by setting the viewing area of the low magnification recipe image to twice or more the viewing area of the high magnification recipe image, even if the inspection image is largely out of the measurement point, the inspection image exists in the low magnification recipe image, The inspection of the inspection image can be assured.

Although the calculation unit 25 has been described as calculating the amount of deviation based on the coordinate of the center of view of the image, the reference point (coordinate) for calculating may be any place within the frame of the image. For example, the angle of the frame may be used as a reference point, or may be a reference point corresponding to the measurement point in the high magnification recipe image D1.

As described above, the computer-readable recording medium which records the position alignment device, the position alignment method and the position alignment program according to the present invention is useful for shortening the inspection time by performing efficient pattern matching.

1: FPD inspection device
1a: substrate processing unit
1b: control mechanism
11: base frame
12: stage
13: substrate holder
14: door frame
15: Y axis member
16: optical unit
17, 18: moving mechanism
19: X axis member
20:
21: transceiver
22: input unit
23: output unit
24: search unit
25: calculation unit
26: memory
30: inspection image
40: reduced image
161: microscope
162: imaging unit
C1? C3: Center of View
D1: high magnification recipe image
D2: low magnification recipe image
R1, R2: Pattern
W: substrate

Claims (6)

A position alignment device for performing position alignment of a substrate for inspection measurement,
An imaging unit which picks up an image of the substrate;
A measurement location for performing the inspection measurement is set, and includes a high magnification recipe image picked up by the imaging unit, and a viewing area of the high magnification recipe image, and has a wider viewing area than the high magnification recipe image, and the imaging unit A storage unit for storing the low magnification recipe image picked up by
A retrieval unit for retrieving a position in the low magnification recipe image of the inspection image for the inspection measurement picked up by the imaging unit at a magnification equivalent to the high magnification recipe image stored by the storage unit;
A calculation unit for calculating position information including the inspection image and the position of the measurement location when the measurement location is out of the visual field of the inspection image as a result of the search by the search unit;
A control unit configured to image the inspection image after moving the imaging unit such that the measurement point enters the viewing area of the inspection image based on the positional information calculated by the calculation unit;
Positioning device characterized in that it comprises a. The method of claim 1,
And the retrieval unit performs retrieval by reducing the inspection image to a pixel resolution equivalent to that of the low magnification recipe image. The method of claim 1,
An area of the viewing area of the low magnification recipe image is twice or more of the area of the viewing area of the high magnification recipe image. The method of claim 1,
The high magnification recipe image and the low magnification recipe image, the position of the center of view coincides with the position alignment device. A low magnification including an image capturing unit for photographing a substrate image for inspection measurement, a high magnification recipe image in which a measurement point for performing the inspection measurement is set, and a viewing area of the high magnification recipe image, and having a wider viewing area than the high magnification recipe image A position alignment method comprising a storage unit for storing a recipe image and performed by a position alignment device for aligning positions of the substrate image,
An image of a substrate to be measured, which is picked up at the same magnification as that of the high magnification recipe image, an inspection image imaging step of picking up an inspection image to perform inspection measurement;
A search step of searching for a position in the low magnification recipe image of the inspection image;
A calculation step of calculating position information including the inspection image and the position of the measurement location when the measurement location is out of the viewing area of the inspection image as a result of the search in the search step;
On the basis of the positional information calculated in the calculation step, the moving imaging step of moving the imaging unit so that the measurement location is in the viewing area of the inspection image, and then imaging the inspection image.
Position alignment method comprising a. A low magnification including an image capturing unit for photographing a substrate image for inspection measurement, a high magnification recipe image in which a measurement point for performing the inspection measurement is set, and a viewing area of the high magnification recipe image, and having a wider viewing area than the high magnification recipe image In the position alignment device which has a storage part which memorizes a recipe image, and arranges the position of the said board | substrate image,
As an image of the board | substrate which inspects, the inspection image imaging procedure which image | photographs with the magnification equivalent to the said high magnification recipe image, and image | photographs the inspection image which performs inspection measurement,
A search procedure for searching for a position in the low magnification recipe image of the inspection image;
A calculation procedure for calculating position information including the inspection image and the position of the measurement location when the measurement location is out of the visual field of the inspection image as a result of the search in the search procedure;
On the basis of the positional information calculated in the calculation procedure, the moving imaging procedure for imaging the inspection image after moving the image capturing unit so that the measurement point enters the viewing area of the inspection image.
A computer-readable recording medium having recorded thereon a positioning program.

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