KR20120022189A - Lighting apparatus using led - Google Patents

Lighting apparatus using led Download PDF

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Publication number
KR20120022189A
KR20120022189A KR1020100085463A KR20100085463A KR20120022189A KR 20120022189 A KR20120022189 A KR 20120022189A KR 1020100085463 A KR1020100085463 A KR 1020100085463A KR 20100085463 A KR20100085463 A KR 20100085463A KR 20120022189 A KR20120022189 A KR 20120022189A
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KR
South Korea
Prior art keywords
heat dissipation
light emitting
emitting device
device package
power box
Prior art date
Application number
KR1020100085463A
Other languages
Korean (ko)
Inventor
김용태
Original Assignee
(주)엔엠엘이디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)엔엠엘이디 filed Critical (주)엔엠엘이디
Priority to KR1020100085463A priority Critical patent/KR20120022189A/en
Publication of KR20120022189A publication Critical patent/KR20120022189A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/008Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being outside the housing of the lighting device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PURPOSE: An LED lighting device is provided to improve heat radiation performance by including a heat radiation unit with a plurality of heat radiation fins on the outer side of a cylinder. CONSTITUTION: A heat radiation unit(110) has a plurality of heat radiation fins radially formed on the outer side of a cylinder. A light emitting package is combined with the lower side of the heat radiation unit and has a plurality of LED chips. A reflector has a downwardly opened reflection surface and an insertion hole in the center thereof. A power box(140) is combined with the upper side of the heat radiation unit and forms a receiving space. A power module is received in the receiving space of the power box and drives a light emitting device package. A support cap is combined with the upper side of the power box and includes a fixed support unit on the upper side thereof.

Description

LED lighting device {Lighting apparatus using LED}

The present invention relates to an LED lighting apparatus, and more particularly, to a high brightness LED lighting apparatus suitable for solving a heat dissipation problem and suitable for factories or workshops with high heights.

In general, a lighting device includes a light source for generating light and illuminates a dark area by illuminating a predetermined range with light generated from the light source. An example of the lighting device is a work lighting device installed on a ceiling or a wall at a factory or a workshop.

Incidentally, incandescent lamps, fluorescent lamps, and three-wavelengths are generally used as light sources of the lighting device, but they have disadvantages such as high power consumption and short lifespan. In order to remedy this drawback, recently, a technology that uses a liquid light-emitting diode (LED), which consumes relatively little power and has a long life, is drawing attention.

In addition, in most factories and workshops, lighting devices are installed at high heights, and incandescent lamps, fluorescent lamps, and three-wavelength light sources are relatively low in brightness, so when installed at high heights, the work space on the floor needs lighting. Lighting is not efficient.

In addition, in factories and workshops, there are cases where lighting needs to focus on a narrow area. In general, factories and workshops have high heights, which is difficult to meet when using conventional lighting devices. In addition, heat dissipation is a problem due to heat generated due to high luminance despite low heat generation characteristics.

Therefore, the problem to be solved by the present invention is to provide a high brightness LED lighting device that can be used in high places such as factories or workshops.

In addition, the present invention relates to an LED lighting device having excellent heat dissipation performance and relatively simple structure in order to solve the heat problem according to high brightness.

LED lighting device according to embodiments of the present invention to achieve the above object includes a heat dissipation unit, a single light emitting device package, a reflector, a power box, a power module and a support cap. The heat dissipation unit has a plurality of heat dissipation fins radially formed on a cylinder and an outer circumferential surface of the cylinder, and four heat dissipation fins disposed perpendicular to each other among the heat dissipation fins have a thickness greater than that of the other heat dissipation fins. The light emitting device package is coupled to the lower portion of the heat dissipation unit and has a plurality of LED chips for high brightness light emission. The reflector is coupled to the lower portion of the heat dissipation portion, forms a reflective surface opened in the lower direction, and the insertion hole in which the light emitting device package is inserted is formed in the center. The power box is coupled to an upper portion of the heat dissipation unit, and a pair of box-shaped frames having the same shape are opposed to each other to form an accommodation space. The power module is accommodated in an accommodating space of the power box and provided to drive the light emitting device package. The support cap is coupled to the upper portion of the power box, and has a circular configuration having a fixed support on the upper surface.

According to the embodiments of the present invention, the heat dissipation portion has a length proportional to the amount of heat generated by the light emitting device package.

According to embodiments of the present invention, the LED lighting device is coupled to the lower portion of the heat dissipation portion to form a spherical inner space and cover the light emitting device package, the transparent to induce the diffusion of light generated in the light emitting device package It may further include a protective lens of the material.

According to embodiments of the present invention, each of the pair of frames constituting the power box forms an inner space opened in one direction and has a cylindrical protrusion of a predetermined height on the opposite surface, the cylindrical protrusion is the heat dissipation portion and Guide the coupling of the support cap.

According to embodiments of the present invention, the support cap may be coupled to the power box by a fixing clip provided in the power box.

The LED lighting apparatus according to the embodiments of the present invention configured as described above uses an LED having low power consumption and low heat generation as a light source, and by using a light emitting device package in which a plurality of LED chips are packaged as a light source to realize high brightness, High brightness lighting is possible.

In addition, it solves the heat problem generated when lighting through the heat radiating portion having a plurality of heat dissipation fins on the outer peripheral surface, it is possible to solve the heat problem by configuring the length of the heat radiating part in accordance with the amount of heat generated.

In addition, since the structure is simple and easy to manufacture, the manufacturing cost can be reduced.

In addition, it is excellent in high brightness and straightness, suitable for use as a lighting device in a factory or workshop with high height, and in some cases it is easy to manufacture to intensively illuminate a relatively narrow range.

1 is an exploded perspective view of an LED lighting apparatus according to an embodiment of the present invention.
2 is a side view of the LED lighting apparatus according to an embodiment of the present invention.
3 is a view showing a coupling state of the heat dissipation unit and the light emitting device package shown in FIG.
4 is a cross-sectional view illustrating a coupling state of the heat dissipation unit and the light emitting device package illustrated in FIG. 1.
5A and 5B are exemplary views in which the length of the heat dissipation part is configured differently according to the amount of heat generated.

Hereinafter, an LED lighting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the invention, and are actually shown in a smaller scale than the actual dimensions in order to explain the schematic configuration. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is an exploded perspective view of an LED lighting apparatus according to an embodiment of the present invention, Figure 2 is a side view of the LED lighting apparatus according to an embodiment of the present invention, Figure 3 is a heat dissipation unit and a light emitting device shown in FIG. 4 is a cross-sectional view illustrating a coupling state of a heat dissipation unit and a light emitting device package illustrated in FIG. 1.

1 to 4, the LED lighting device 100 according to an embodiment of the present invention includes a heat dissipation unit 110 for dissipating heat, a light emitting device package 120 for generating light, and concentration of generated light. In addition, a reflector 130 for diffusion, a power box 140 coupled to an upper portion of the heat dissipation unit 110, a power module 150 disposed inside the power box 140 and driving the light emitting device package 120. ) And a support cap 160 for fixing the lighting device 100 to a ceiling or the like.

The LED lighting device 100 may be mainly used for lighting of a work space in a place where the height is high, for example, a factory or a workshop. However, the use of the LED lighting device 100 is not limited to a place where the height is high, and may be preferably used in various places where high brightness illumination is required.

The heat dissipation unit 110 serves to dissipate generated heat. For example, the heat dissipation unit 110 may include a cylinder 111 in the center and a plurality of heat dissipation fins 112 radially formed on the outer circumferential surface of the cylinder 111. Here, each of the heat radiation fins 112 may have a plate shape extending in the longitudinal direction of the cylinder. In addition, the four heat dissipation fins 112 disposed perpendicular to each other among the heat dissipation fins 112 have a thickness greater than that of the other heat dissipation fins 112. That is, the heat dissipation fins 112 positioned at 12, 3, 6 and 9 o'clock directions have a thickness thicker than the heat dissipation fins 112 positioned at the remaining directions. Four heat radiation fins 112 having a relatively thick thickness is a configuration for coupling the heat radiation portion 110 and the remaining members. Specifically, screw holes are provided at upper and lower ends of the four heat dissipation fins 112, and the power box 140, the light emitting device package 120, and the reflector 130 are coupled through the screw holes. . In addition, except for four heat radiation fins 112 having a thick thickness, the remaining heat radiation fins 112 have an extension in the circumferential direction at the radial end. The area where the heat dissipation fins 112 are in contact with the air layer through the expansion part can be widened, thereby increasing heat dissipation efficiency.

In the above description, the heat dissipation unit 110 has been described as consisting of heat dissipation fins 112 formed radially on the center of the cylinder 111 and the outer circumferential surface of the cylinder 111, but the configuration of the heat dissipation unit 110 is It is not limited. For example, the heat dissipation unit 110 may include an inner cylinder and an outer cylinder, and may have a configuration including inner heat dissipation fins connecting the inner cylinder and the outer cylinder and outer heat dissipation fins formed on the outer circumferential surface of the outer cylinder.

The light emitting device package 120 generates light substantially. The light emitting device package 120 is coupled to the lower portion of the heat dissipation unit 110. The light emitting device package 120 may be formed of one package having a plurality of LED chips in order to generate high luminance light. The light emitting device package 120 may have various shapes, but as an example, the light emitting device package 120 may include a frame member 121 forming an accommodation space opened in one direction, and the frame member 121. A plurality of LED chips 122 disposed in the storage space and electrically connected to a circuit pattern not shown through wire bonding, and filled in the storage space of the frame member 121 in which the LED chips 122 are disposed, the LED chips ( And a fluorescent agent 123 for applying 122. In another embodiment, the light emitting device package 120 may be formed of a plurality of packages in order to illuminate light having a very high brightness.

Meanwhile, a transparent protective lens 126 may be provided to protect the light emitting device package 120 or to induce diffusion of generated light.

The protective lens 126 forms a spherical inner space and is coupled to the lower portion of the heat dissipation unit 110 to cover the light emitting device package 120. The protective lens 126 may be made of a transparent transparent resin or a glass material. At this time, since the heat dissipation unit 110 may be deformed to the protective lens 126 due to high temperature, it is not preferable to directly couple the protective lens 126 to the heat dissipation unit 110. Therefore, a lens guide 127 having a heat insulating effect may be provided between the heat dissipation unit 110 and the protective lens 126. The lens guide 127 may have a ring-shaped plate (for example, a washer shape) and is preferably made of a material having heat resistance. The protective lens 126 does not have a lens function, and may have only a simple protection (cover) function of the light emitting device package 120 as a projection that transmits light.

The reflector 130 is coupled to the lower portion of the heat dissipation unit 110. The reflector 130 has a reflecting surface opened in the downward direction and has an insertion hole 131 into which the light emitting device package 120 is inserted. That is, the inner diameter of the insertion hole 131 of the reflector 130 should be at least larger than the outer diameters of the light emitting device package 120 and the protective lens 126. Fixing of the reflector 130 may be made by screws fastened to four heat radiation fins 112 having a thick thickness. The reflector 130 has a reflecting function and is preferably made of steel or stainless steel so as to withstand heat.

The power box 140 and the power module 150 are provided for the light emitting operation of the light emitting device package 120.

The power box 140 is coupled to the upper portion of the heat dissipation unit 110, the power module 150 is accommodated therein. In the present embodiment, the power box 140 has a structure in which a pair of box-shaped frames 141 having the same shape are opposed to each other to form an accommodation space. Specifically, each of the pair of frames 141 has a rectangular shape forming an inner space opened in one direction, and has a cylindrical protrusion 142 protruding at a predetermined height on the opposite side of the opening direction. The power box 140 has a structure in which a pair of frames 141 are joined to abut an opening to form a single storage space. In addition, since it is formed of a pair of frames 141 having the same shape, it is easy to manufacture because the same product may be produced through one production system in the manufacturing process. As a result, productivity is improved. The protrusion 142 formed on the opposite surface of the frame 141 serves as a guide for coupling with other members. Specifically, the heat dissipation unit 110 is inserted into the protrusion 142 on the frame 141 located on the lower side, and the protrusion 142 on the frame 141 located on the upper side of the support cap 160. Guide the join.

Coupling between the power box 140 and the heat dissipation unit 110 may be made through screws fastened to four heat dissipation fins 112 having a thick thickness.

In addition, although not shown in detail, the power module 150 is disposed inside the power box 140, and the power module 150 may generate heat during operation. Therefore, the power box 140 may have a plurality of heat dissipation fins on the upper and lower surfaces, respectively, to dissipate heat.

The power module 150 is accommodated in the power box 140. The power module (! 50) is preferably fixed through a screw or the like in the power box 140. The power module 150 receives main power from the outside, and converts the provided main power into a driving power suitable for driving the light emitting device package 120 and then provides the power supply to the light emitting device package 120. do. To this end, although not shown, the power module 150 may be wired to the light emitting device package 120, and the wire may be connected to the light emitting device package 110 through the heat dissipation unit 110. In addition, the power module 150 receives main power from the outside through a wire connected through the power box 140.

The support cap 160 is coupled to the upper portion of the power box 140, and serves as a support for installing the LED lighting device 100 on the ceiling. To this end, the support cap 160 has a fixed support 161 on the upper surface. Fixing support 161 may have a variety of shapes, for example may have a hook shape to be installed through a wire or the like. Alternatively, the fixing support 161 may be variously changed, and the present embodiment is not limited by the structure of the fixing support 161.

For example, the support cap 160 may be coupled to the upper portion of the power box 140 through the fixing clip 143. That is, the support cap 160 has a circular cap shape and is configured to surround the protrusion 142 formed on the upper surface of the power box 140. At this time, both sides of the support cap 160 may be provided with a hook hook 162, the power box 140 may be provided with a fixing clip 143 that can be fastened to the hook hook 162. The fixing clip 143 is a method of fixing the locking ring by rotating in the downward direction in the state over the locking hook 162.

5A and 5B are exemplary views in which the length of the heat dissipation part is configured differently according to the amount of heat generated.

5A and 5B, in the present embodiment, the heat dissipation unit 110 has a length proportional to the amount of heat generated. The LED lighting device 100 can prevent unnecessary size expansion of the heat dissipating unit 110 by configuring a heat dissipating unit 110 of a corresponding length according to the amount of heat generated. In other words, when the amount of heat generated is relatively short, the length of the heat dissipating unit 110 is relatively short. When the amount of heat is generated, the length of the heat dissipating unit 110 is relatively long.

For example, when the heat generation amount is small, as shown in FIG. 5A, the short heat radiation unit 110 is used, thereby reducing the overall size of the device while ensuring a sufficient heat dissipation effect relative to the heat generation amount. As a result, the material can be saved, and further, the manufacturing cost can be reduced. On the contrary, when the amount of heat generated is large, as shown in FIG. 5B, the heat radiating unit 110 having a relatively long length is used, so as to ensure a heat dissipation capability corresponding to a high amount of heat generated.

As described above, the LED lighting apparatus 110 of the present invention obtains the increase or decrease of the heat dissipation ability through the heat dissipation unit 110 having different lengths so as to cope with the heat amount increased or decreased according to the luminance. Therefore, various high brightness and corresponding heat dissipation problems can be solved only by replacing the heat dissipation unit 110 without replacing the LED lighting apparatus 110 as a whole.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

According to the embodiments of the present invention as described above, by using the LED as a light source, and using a light emitting device package formed of a plurality of LED chips as a light source for realizing high brightness, high brightness illumination is possible.

In addition, the heat dissipation problem generated during illumination is solved through the heat dissipation part having a plurality of heat dissipation fins on the outer circumferential surface of the cylinder, and furthermore, the heat dissipation part can be effectively solved by configuring the length of the heat dissipation part differently according to the heat generation amount.

In addition, since the structure is simple and easy to manufacture, the manufacturing cost can be reduced. Its high brightness and straightness make it suitable for use as a lighting device in factories or workshops with high heights, and in some cases it is easy to manufacture to focus on a relatively narrow range.

Therefore, it can be easily used where high brightness is required without a heat generation problem, and can be preferably used for high brightness lighting in an environment of high height such as a factory or a workshop.

100: LED lighting device 110: heat dissipation unit
111: cylinder 112: heat dissipation fin
120: light emitting device package 121: frame member
122: LED chip 123: fluorescent agent
126: protective lens 127: lens guide
130: reflector 131: insertion hole
140: power box 141: frame
142: projection 143: fixing clip
150: power supply module 160: support cap
161: fixed support 162: hook hook

Claims (5)

A heat dissipation unit having a plurality of heat dissipation fins radially formed on a cylinder and an outer circumferential surface of the cylinder, wherein four heat dissipation fins disposed perpendicular to each other among the heat dissipation fins have a thickness greater than that of the other heat dissipation fins;
A single light emitting device package coupled to a lower portion of the heat dissipation unit and having a plurality of LED chips for high luminance light emission;
A reflector coupled to a lower portion of the heat dissipation unit, forming a reflecting surface opened in a lower direction, and having an insertion hole into which a foot and a device package is inserted in a central portion thereof;
A power box coupled to an upper portion of the heat dissipation unit and having a pair of box-shaped frames having the same shape facing each other to form an accommodation space;
A power module accommodated in an accommodation space of the power box and driving the light emitting device package; And
LED lighting device coupled to the top of the power box, including a circular support cap having a fixed support on the top surface.
The LED lighting apparatus of claim 1, wherein the heat dissipation unit has a length proportional to the amount of heat generated by the light emitting device package. The light emitting device of claim 1, further comprising a protective lens made of a transparent material coupled to a lower portion of the heat dissipation unit to form a spherical inner space and cover the light emitting device package, and to induce diffusion of light generated from the light emitting device package. LED lighting device, characterized in that. The method of claim 1, wherein each of the pair of frames constituting the power box forms an inner space opened in one direction and has a cylindrical protrusion of a predetermined height on the opposite side, the cylindrical protrusion is the heat dissipation portion or the support cap LED lighting device, characterized in that for guiding the combination. The LED lighting apparatus according to claim 1, wherein the power box has fixing clips for coupling and fixing the support caps to both sides thereof.
KR1020100085463A 2010-09-01 2010-09-01 Lighting apparatus using led KR20120022189A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103887252A (en) * 2012-12-24 2014-06-25 郑荣裕 Efficient heat-conductive heat dissipater
CN104100868A (en) * 2014-07-23 2014-10-15 深圳市超频三科技有限公司 LED lamp
KR20200106597A (en) * 2019-03-05 2020-09-15 주식회사 카타콤 Light apparatus having sterilization function for cattle shed
KR102588547B1 (en) * 2022-12-13 2023-10-11 박해영 Lighting apparatus for fish farming facility

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103887252A (en) * 2012-12-24 2014-06-25 郑荣裕 Efficient heat-conductive heat dissipater
CN104100868A (en) * 2014-07-23 2014-10-15 深圳市超频三科技有限公司 LED lamp
KR20200106597A (en) * 2019-03-05 2020-09-15 주식회사 카타콤 Light apparatus having sterilization function for cattle shed
KR102588547B1 (en) * 2022-12-13 2023-10-11 박해영 Lighting apparatus for fish farming facility

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