KR20090021094A - Vapor deposition mask and manufacturing method of vapor deposition mask - Google Patents

Abstract

A deposition mask and a manufacturing method of deposition mask are provided to deposit the depositing materials with the high efficiency by forming a penetration hole consisting of a groove and a hole in a metal sheet. A deposition mask(20) comprises a metal sheet(34). The metal sheet has a first side and the second side which is opposite to the first side. A penetration hole(25) extending the interval between the first side and the second side is formed in the metal sheet. The groove(26) having the shape of standing the first side of the metal sheet is built up. A hole(27) is formed in the second side of the metal sheet. The groove and the hole are put through. The penetration hole passing through the metal sheet is formed owing to the groove and the hole.

Description

Deposition mask and manufacturing method of deposition mask {VAPOR DEPOSITION MASK AND MANUFACTURING METHOD OF VAPOR DEPOSITION MASK}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a deposition mask used to perform deposition in a desired pattern, and more particularly to a deposition mask capable of forming a deposition material with high utilization efficiency.

The present invention also relates to a method of manufacturing a deposition mask used for performing deposition in a desired pattern, and more particularly, to a method of manufacturing a deposition mask capable of forming a deposition material with high utilization efficiency.

Background Art Conventionally, a method of forming a thin film in a desired pattern using a deposition mask including a through hole arranged in a desired pattern is known. In recent years, vapor deposition may be used to form a very expensive material, for example, in the case of depositing an organic material on a substrate during the manufacture of an organic EL display device. In addition, a deposition mask can generally be manufactured by forming through holes in a metal plate by etching using a photolithography technique (for example, JP2004-39319A).

However, when the deposition material is deposited on the substrate using the deposition mask, the deposition material is also attached to the deposition mask. That is, not all of the deposition materials used are attached to the substrate. In addition, when the porosity of the deposition mask decreases, the utilization efficiency of the deposition material also decreases. For example, when an organic light emitting material is deposited on a substrate to manufacture a color display device, the porosity of the deposition mask for depositing an organic light emitting material capable of emitting a single color is usually less than 34%, so that the deposition is performed. The utilization efficiency of the material is very low. When using expensive evaporation materials, low use efficiency becomes a big problem. In addition, the utilization efficiency referred to here refers to the ratio which adhered to the board | substrate among the used vapor deposition materials.

In addition, some vapor deposition materials may move at an angle with respect to the sheet surface of the metal sheet constituting the vapor deposition mask and face the substrate. In order to increase the utilization efficiency of the vapor deposition material by effectively using the vapor deposition material moving at an angle, it is preferable to form through holes in which the wall surface is greatly inclined and the ends are thinned. However, in order to form a through hole in a metal sheet by etching, it may be difficult to incline the wall surface of a through hole largely. Specifically, when the spacing interval of adjacent holes is short, there exists a tendency for the wall surface of the side which faces an adjacent hole to rise. In addition, when a through hole having a rectangular shape in plan view is produced by etching, the wall surface on the long side of the through hole can be greatly inclined, while the wall surface on the short side of the through hole tends to rise.

This invention is made | formed in view of this point, Comprising: It aims at providing the vapor deposition mask which can form a vapor deposition material into a high utilization efficiency. Moreover, an object of this invention is to provide the manufacturing method of a vapor deposition mask which can form a vapor deposition material into a high utilization efficiency.

By the way, when the wall surface of the through-hole rises, not only the utilization efficiency of vapor deposition material deteriorates but it also raises another problem. The metal sheet constituting the deposition mask has a certain thickness due to manufacturing restrictions or restrictions on use. Therefore, when the wall surface of the through hole is raised, part of the deposition material moves at an angle as described above, so that it is difficult to stably form a film with a predetermined thickness in the edge region of the deposition area (region to be deposited). . In order to avoid this problem, it is considered effective to make the through hole larger than the desired pattern. However, when this method is adopted, the through-holes of the deposition masks are connected when adjacent deposition areas are adjacent. Therefore, in the case of forming an organic light emitting material as each pixel of the display device, for example, this method cannot be employed, and adjacent film formation regions (pixels) must be deposited by a separate deposition process. That is, it is necessary to deposit the same material in two portions by depositing about half of the film formation region at one interval in one deposition process and depositing the remaining film formation region in the second deposition process. For this reason, when three types of organic light emitting materials are deposited in order to fabricate a color display device, it is necessary to provide a deposition process twice in total, six times per one type of organic light emitting material. It is more preferable if the present invention can solve such a problem and reduce the number of deposition steps.

The deposition mask according to the present invention includes a metal sheet having a first surface and a second surface opposite to the first surface, the metal sheet having a through hole extending between the first surface and the second surface, A groove extending in a linear shape is formed on the first surface side of the sheet, and a hole is formed on the second surface side of the metal sheet so that the groove and the hole are through, and the metal sheet is formed by the groove and the hole. It is characterized in that a through hole penetrating the through.

In the deposition mask according to the present invention, the groove may be formed by etching the metal sheet from the side of the first surface.

In the vapor deposition mask according to the present invention, the cross-sectional area of the groove in the cross section along the sheet surface of the metal sheet may be gradually reduced from the first surface side to the second surface side.

In the vapor deposition mask according to the present invention, the hole may be formed by etching the metal sheet from the side of the second surface.

Moreover, in the vapor deposition mask which concerns on this invention, the cross-sectional area of the said hole in the cross section along the sheet surface of the said metal sheet may become small gradually from the said 2nd surface side toward the said 1st surface side.

Moreover, in the vapor deposition mask which concerns on this invention, the area | region enclosed by the connection part of the wall surface of the said groove | channel and the wall surface of the said hole has a rectangular shape when it observes from the normal direction of the sheet surface of the said metal sheet, The longitudinal direction of the area enclosed by the connecting portion may extend along the longitudinal direction of the linear groove.

In the vapor deposition mask according to the present invention, a plurality of the grooves extending in a linear shape may be formed in parallel with each other.

In the vapor deposition mask according to the present invention, a plurality of the holes may be formed at intervals along the longitudinal direction of the grooves.

Further, in the deposition mask according to the present invention, a plurality of grooves extending in parallel to each other are formed at equal intervals, and a plurality of holes are formed at equal intervals along the longitudinal direction of each groove, and the sheet of the metal sheet In the case of observing from the normal direction of the surface, the length between two adjacent through holes in the longitudinal direction of each groove may be shorter than the length between two through holes respectively formed in the adjacent grooves.

Further, in the deposition mask according to the present invention, when a plurality of the holes are formed at intervals along the longitudinal direction of the groove, on the first surface of the groove along a direction orthogonal to the longitudinal direction of the groove. The width in may be narrower in the portion between two adjacent holes in the longitudinal direction than in the portion in which the hole in the longitudinal direction is formed.

In the vapor deposition mask according to the present invention, the groove is formed by a plurality of holes formed on the first surface side, and two holes adjacent to each other along the longitudinal direction of the groove are among the plurality of holes. You may make it connected in a 1st surface.

In the vapor deposition mask according to the present invention, when the plurality of holes are formed at intervals along the longitudinal direction of the grooves, the grooves are formed by a plurality of holes formed on the first surface side. Two holes which are adjacent in the said longitudinal direction of the said groove among the some hole are connected in the said 1st surface, and the hole formed in the said 2nd surface side is formed in the hole which is formed in the said 1st surface side, and comprises the said groove | channel You may be arrange | positioned at the position facing.

In the method of manufacturing a deposition mask according to the present invention, a metal sheet having a first surface and a second surface opposite to the first surface is etched to form grooves extending linearly on the first surface side of the metal sheet. And forming a hole in the second surface side of the metal sheet by etching the metal sheet, wherein the through hole penetrates the metal sheet by the groove and the hole through the groove and the hole. The groove and the hole are formed to be formed.

In the method for manufacturing a deposition mask according to the present invention, a plurality of grooves extending in parallel to each other are formed at equal intervals, and a plurality of holes are formed at equal intervals along the longitudinal direction of each groove, and the metal In the case of observing from the normal direction of the sheet surface of the sheet, the length between two adjacent through holes along the longitudinal direction of each groove may be shorter than the length between two through holes respectively formed in the adjacent grooves.

Moreover, in the manufacturing method of the vapor deposition mask which concerns on this invention, when the area | region enclosed by the connection part of the wall surface of the said groove | channel and the wall surface of the said hole is observed from the normal direction of the sheet surface of the said metal sheet, a rectangular shape is formed. The groove and the hole are formed so as to have, and the longitudinal direction of the region enclosed by the connecting portion may extend along the longitudinal direction of the linear groove.

Moreover, the manufacturing method of the vapor deposition mask which concerns on this invention may further include the process of supplying the said metal sheet, In the process of forming the said groove | channel, you may make it the groove which extends along the supply direction of the said metal sheet.

In the method for manufacturing a deposition mask according to the present invention, the groove may be formed by etching the metal sheet, and the hole may be formed by etching the metal sheet.

In the manufacturing method of such a vapor deposition mask, the said 1st surface and the said 2nd surface of the said metal sheet may be etched simultaneously, and the process of forming the said hole and the process of forming the said groove may be performed in parallel.

Or in the manufacturing method of such a vapor deposition mask, the said 1st surface and the said 2nd surface of the said metal sheet are etched simultaneously, and the process of forming the said hole and the process of forming the said groove are performed in parallel, and the said hole after that Only one of the steps of forming the step and the step of forming the grooves may be performed continuously.

Or the manufacturing method of such a deposition mask is a process performed after the said hole is formed by etching the said metal sheet, The process further includes the process of sealing the formed said hole with resin, and after sealing the said hole, the said metal sheet is etched. As a result, the grooves extending from the first surface side to the holes may be formed. In the step of forming the hole in the method for manufacturing the deposition mask, the first surface and the second surface of the metal sheet may be etched simultaneously to partially form the groove.

Moreover, in the manufacturing method of the vapor deposition mask by this invention, the process of forming the said hole may be performed before the process of forming the said groove | channel.

Moreover, in the manufacturing method of the vapor deposition mask by this invention, the process of forming the said groove may be performed before the process of forming the said hole.

In the step of forming the groove in the method for manufacturing a deposition mask according to the present invention, the two adjacent holes are connected on the first surface, and the plurality of holes are arranged in a linear shape so as to form the first surface side. The groove may be formed by forming from the above. In the manufacturing method of such a deposition mask, the hole formed in the said 2nd surface side may be formed in the position which is formed in the said 1st surface side and faces the hole which comprises the said groove | channel. Further, in the step of forming the groove of the method of manufacturing the deposition mask, the plurality of holes constituting the grooves are arranged in a state in which a plurality of through holes are arranged at intervals to form a resist formed on the first surface. By etching the first surface of the metal sheet, an etching is formed on the first surface side of the metal sheet at a position corresponding to the through hole of the resist, and the etching for forming a groove made of the plurality of holes is performed by the groove. Two holes adjacent to each other along the longitudinal direction of may be connected under the bridge portion of the resist located between the two through holes of the resist corresponding to the two holes, respectively.

According to the present invention, through holes are formed in the metal sheet by linear grooves and holes. Therefore, the vapor deposition material which advances at an angle with respect to the sheet surface of a metal sheet, and which advances so that it may generally follow the longitudinal direction of a groove | channel can be used for vapor deposition with high efficiency. Thereby, the utilization efficiency of vapor deposition material can be improved.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of the vapor deposition mask and the manufacturing method of a vapor deposition mask by this invention are demonstrated with reference to FIGS. 1 to 18 are views for explaining an embodiment of the present invention. In the following embodiments, the deposition mask (metal mask for deposition) used to pattern the organic light emitting material on the glass substrate in a desired pattern when manufacturing the organic EL display device will be described as an example. do. However, the present invention is not limited to such an application, but the present invention can be applied to a deposition mask (metal mask for deposition) and a method of manufacturing the deposition mask used for various applications.

First, an example of the deposition mask which can be manufactured by the manufacturing method of the deposition mask by this invention is demonstrated mainly with reference to FIGS. 1 is a perspective view showing an example of a deposition mask and a deposition mask apparatus, FIG. 2 is a partial plan view of the deposition mask, FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2, and FIG. A cross section taken along the line IV-IV.

As shown in Figs. 1 to 4, the deposition mask 20 is composed of a metal sheet 34 having opposing first and second surfaces 34a and 34b. The metal sheet 34 is formed with a plurality of through holes 25 extending between the first surface 34a and the second surface 34b. The vapor deposition mask apparatus 10 has a vapor deposition mask 20 and the frame 15 fixed to this vapor deposition mask 20, as shown in FIG. In the example shown in Fig. 1, the frame 15 is provided at the edge of the deposition mask 20 (metal sheet 34).

The deposition mask apparatus 10 shown in FIG. 1 is supported in the deposition apparatus 40 with the deposition mask 20 facing the glass substrate 42 as shown in FIG. 5 is a diagram for explaining a method of using the deposition mask apparatus 10. As shown in FIG. In the vapor deposition apparatus 40, the crucible 44 which accommodates vapor deposition material (for example, organic light emitting material) 48 under the glass substrate 42 which inserted this vapor deposition mask apparatus 10, and the crucible 44 The heater 46 which heats the heat is arrange | positioned. The deposition material 48 in the crucible 44 is vaporized or sublimed by heating from the heater 46 to adhere to the surface of the glass substrate 42. As described above, a plurality of through holes 25 are formed in the deposition mask 20, and the deposition material 48 is attached to the glass substrate 42 through the through holes 25. As a result, the deposition material 48 is deposited on the surface of the glass substrate 42 in a desired pattern corresponding to the position of the through hole 25 of the deposition mask 20.

As shown in Figs. 1 and 2, in the present embodiment, the metal sheet 34 constituting the deposition mask 20 has a substantially rectangular shape in plan view, more precisely, a substantially rectangular shape in plan view. have. 3 and 4, the grooves 26 extending in a linear shape are formed on the side of the first surface 34a of the metal sheet 34, and the second surface 34b of the metal sheet 34 is formed. Holes 27 are formed on the sides of the recesses. The hole 27 and the groove 26 pass through, and as a result, the through hole 25 penetrating the metal sheet 34 is formed by the hole 27 and the groove 26.

In the example shown in Fig. 3, the cross-sectional area of the grooves 26 in the cross section along the sheet surface of the metal sheet 34 gradually decreases from the first surface 34a side to the second surface 34b side. Goes. Such grooves 26 can be formed by etching the metal sheet 34 from the side of the first surface 34a, for example, as described later. Similarly, in the example shown in FIGS. 3 and 4, the cross-sectional area of the hole 27 in the cross section along the sheet surface of the metal sheet 34 from the second surface 34b side to the first surface 34a side. Gradually decreases. Such a hole 27 can be formed by etching the metal sheet 34 from the side of the second surface 34b, for example, as described later.

As shown in Figs. 1 and 2, the groove 26 extends linearly along the sheet surface of the metal sheet 34. As shown in Figs. A plurality of grooves 26 extending in parallel with each other are formed in the first surface 34a of the metal sheet 34. A plurality of holes 27 passing through the grooves 26 are formed in each groove 26. A plurality of holes 27 facing each groove 26 are arranged on a straight line at regular intervals along the longitudinal direction of the groove 26.

In the case of observing from the direction (thickness direction, normal direction) orthogonal to the sheet surface of the metal sheet 34, in other words, in the plane of the metal sheet 34, the hole 27 is a rectangular shape, More specifically, rectangular shape. It is formed in a shape. The longitudinal direction of the hole 27, that is, the direction along the long side of the rectangular contour with the hole 27, is along the longitudinal direction of the groove 26 (the direction in which the groove 26 extends (extension direction)). . As shown in FIG. 2, the hole 27 is formed in the position which faces the groove | channel 26. As shown in FIG. More specifically, the hole 27 is arrange | positioned so that the center may be located in the plane of the hole 27 at the center of the width direction orthogonal to the longitudinal direction of the groove 26. The width of the hole 27 is narrower than the width of the groove 26. In addition, a rectangular shape or a rectangular shape here does not refer only to an exact rectangular shape or an exact rectangle, but is a concept which includes the substantially rectangular shape and the substantially rectangular shape which can be produced when manufacturing a rectangular shape or a rectangle by etching.

The hole 27 extends from the second surface 34b of the metal sheet 34 to the bottom of the groove 26. The wall surface 26a of the groove 26 and the wall surface 27a of the hole 27 are connected by a circumferential connecting portion 28. As shown in Figs. 3 and 4, the connecting portion 28 is formed by the ridge line of the protruding portion 28a in which the opening area (the area of the through hole 25 in plan view) is minimized. Since the planar view of the hole 27 is a rectangular shape, the area enclosed by the circumferential connecting portion 28 is also observed from the direction orthogonal to the sheet surface of the metal sheet 34 (viewed from the plane). It has a rectangular shape. 2, the longitudinal direction of the area | region enclosed by the connection part 28 extends along the longitudinal direction of the linear groove 26. As shown in FIG. In addition, in this embodiment, as shown in FIG. 2, when it observes from the direction orthogonal to the sheet surface of the metal sheet 34 (as viewed from a plane), 2 adjoins along the longitudinal direction of each groove | channel 26. The length La between the two through holes 25 (areas enclosed by the connecting portions 28) is respectively enclosed by two through holes 25 (areas enclosed by the connecting portions 28) formed in the adjacent grooves 26. It is shorter than the length Lb between].

6 and 7, when the deposition mask apparatus 10 is accommodated in the deposition apparatus 40, a second portion of the deposition mask 20 corresponding to the second surface 34b of the metal sheet 34 is formed. The surface 20b faces the glass substrate 42, and the first surface 20a of the deposition mask 20 corresponding to the first surface 34a of the metal sheet 34 holds the deposition material 48. Facing the crucible 44. That is, as shown in Figs. 6 and 7, the vapor deposition material 48 enters the through hole 25 from the side of the groove 26 gradually tapering off, and then passes through the hole 27 through the through hole 25. From)

As described above, the hole 27 is tapered from the second surface 34b side toward the first surface 34a side, so that the protrusion 28a having the smallest opening area in the through hole 25 is formed. Formed. And when vapor deposition is performed using such a vapor deposition mask 20, the film thickness of the vapor deposition film 49 formed into the area | region corresponding to the back side of the protrusion part 28a in the glass substrate 42 is not stable. As confirmed by the inventor, in the deposition mask 20 used for depositing an organic light emitting material when fabricating an organic EL display, the connection portion between the wall surface 26a of the groove 26 and the wall surface 27a of the hole 27 is used. If the length Lc along the direction orthogonal to the sheet surface of the metal sheet 34 from (28) to 2nd surface 34b (20b) is 10 micrometers or less (more preferably 5 micrometers or less), or a groove | channel Length along the direction orthogonal to the sheet surface of the metal sheet 34 from the connection part 28 of the wall surface 26a of 26 and the wall surface 27a of the hole 27 to the 1st surface 34a (20a). If it was less than one third of Ld, the vapor deposition film 49 could be formed in the to-be-filmed area | region (region to be formed into a film) with stable film thickness.

6 and 7 do not move linearly from the crucible 44 toward the glass substrate 42, but move diagonally with respect to the plate surface of the glass substrate 42. As shown in FIG. There is also. As above-mentioned, when the cross-sectional shape of the through-hole 25 rises in the direction orthogonal to the sheet surface of the metal sheet 34, the vapor deposition material 48 which moves obliquely cannot be used effectively.

And generally, when the space | interval spacing of the adjacent through-holes 25 is short, there exists a tendency for the wall surface on the side of the adjacent through-hole to rise up. In the present embodiment, the through-holes 25 are arranged at regular intervals La along the one direction in a plan view, and are longer than the intervals La b along the other direction different from the one direction Lb. ) Are arranged. However, according to the present embodiment, since the grooves 26 extend in one direction in which the spacing interval La becomes shorter, in the cross section transverse to the longitudinal direction of the through hole 25, the adjacent one in one direction Rather than the wall surface on the side of the through-hole, the wall surface constituting the through-hole 25 exists only in the portion of the hole 27 whose thickness Lc is adjusted as shown in FIG.

Moreover, in general, in the cross section (the cross section crossing the short side of the rectangular shape) of the through hole 25 which has a rectangular shape in plan view, the wall surface of the through hole 25 tends to rise. have. That is, the wall surface of the short side of the through-hole 25 which has a rectangular shape in planar view tends to rise. However, according to the present embodiment, since the longitudinal direction of the through hole 25 coincides with the longitudinal direction of the groove 26, the through hole 25 is formed in the cross section crossing the longitudinal direction of the through hole 25. Rather than the wall surface which forms, the wall surface which comprises the through hole 25 itself exists only the part of the hole 27 which adjusted thickness Lc as shown in FIG.

In view of the above, in the cross section transverse to the longitudinal direction of the through hole 25 shown in Fig. 7, the vapor deposition material 48 effectively moves obliquely and faces the glass substrate 42. Film-forming efficiency) can be significantly improved. In addition, as shown in Fig. 7, almost no wall surface constituting the through hole 25 exists, so that the film is stably formed with a sufficient film thickness even in a region corresponding to the edge region of the through hole 25 in the glass substrate 42. can do. Therefore, it is not necessary to make the opening area of the through hole 25 larger than the film forming area (area to be formed) as in the prior art. For this reason, the through-hole 25 is formed in a short space | interval, and patterning to a fine pitch can be performed once with high precision.

On the other hand, as shown in Fig. 6, in the cross section (cross section crossing the long side of the rectangular shape) across the width direction of the through hole 25 having a rectangular shape in plan view, the wall surface of the through hole 25 is It is also present in the groove 26. In the cross section of the through hole 25 in the width direction, assuming that the wall surface 26a of the groove 26 has the outline shown by the dotted line in Fig. 6, the vapor deposition material 48 moving at an angle is formed by the deposition mask ( It is attached to 20 and does not reach the glass substrate 42. That is, in order to save the expensive deposition material by increasing the utilization efficiency (ratio of adhesion to the glass substrate 42) of the deposition material, it is orthogonal to the longitudinal direction of the groove 26 and perpendicular to the sheet surface of the metal sheet 34. In the cross section (cross section shown in Fig. 6), the connection surface 28 of the wall surface 26a of the groove 26 and the wall surface 27a of the hole 27 and the first surface 34a (20a) of the groove 26 are shown. It is preferable that the angle θ formed by the straight line L connecting the ends on the] side with the second surface 34b (20b) is smaller, and the angle θ is preferably 45 ° or less.

Further, when the angle θ is made smaller, the wall surfaces 26a of the adjacent grooves 26 are connected to each other as shown by the dashed-dotted line in FIG. 6. However, in consideration of the strength of the deposition mask 20, it is preferable that the wall surfaces 26a of the adjacent grooves 26 are not connected to each other, and the grooves 26 adjacent to each other on the flat first surface 34a (20a) are not connected. It is more preferable that the flat surface of 5 micrometers or more is formed between).

That is, the angle θ formed by the straight line L with respect to the second surface 34b (20b) is such that a flat surface of 5 µm or more is formed between the grooves 26 on the first surface 34a (20a). It is more than an angle, and it is preferable that it is 45 degrees or less.

As described above, in the present embodiment, the plurality of through holes 25 are arranged along the grooves 26 extending in a linear shape with a constant separation distance La. In addition, a plurality of grooves 26 are formed at predetermined intervals. As a result, as shown in FIG. 2, the through-hole 25 is disposed not only in the longitudinal direction of the groove 26, but also at a constant separation distance Lb along the direction orthogonal to the longitudinal direction of the groove 26. have. As an example, when the deposition mask 20 (deposition mask device 10) is used to produce a medium-sized display (for example, a 20-inch type display), the above-mentioned separation distance La is 20 µm or more and 50 The separation distance Lb may be about 84 µm or more and about 254 µm or less. In addition, the length of one side (long side or short side when the through-hole 25 has a rectangular shape) of the through-hole 25 which has a rectangular shape can be about 8 micrometers or more and 64 micrometers or less.

Then, the deposition mask 20 (the deposition mask apparatus 10) and the glass substrate 42 are relatively moved relative to each other in the direction orthogonal to the longitudinal direction of the groove 26, and the organic light emitting material for red and green for As the organic light emitting material and the organic light emitting material for blue are deposited in order, a display for color display can be produced. In particular, according to the present embodiment, since the opening area of the through hole 25 does not need to be set large compared to the area to be deposited, pixels spaced apart by a small distance La can be formed by one deposition process. have. Therefore, in the case of depositing the organic light emitting material of three colors, the three steps can be omitted as compared with the conventional method in which the film formation of each color is performed twice.

Moreover, the frame 15 provided in the periphery of the vapor deposition mask 20 is for maintaining the vapor deposition mask 20 in the pulled state so that the vapor deposition mask 20 may not bend. The deposition mask 20 and the frame 15 are fixed to each other by, for example, spot welding. As described above, the deposition mask apparatus 10 is held inside the deposition apparatus 40 which becomes a high temperature atmosphere. Therefore, the deposition mask 20 and the frame 15 are preferably made of the same material having a low coefficient of thermal expansion in order to prevent bending of the deposition frame and generation of thermal stress. As such a material, 36% Ni inver material can be used, for example.

Next, the manufacturing method of such a deposition mask 20 and the deposition mask apparatus 10 is demonstrated mainly using FIGS. 8-10. FIG. 8 is a view for explaining a method of manufacturing a deposition mask as a whole, FIG. 9 is a view for explaining a method for forming a resist pattern on a metal sheet, and FIG. 10 is for explaining a method for etching a metal sheet. Drawing.

As shown in FIG. 8, the manufacturing method of the vapor deposition mask in this embodiment provides the process of supplying the metal sheet 34 extended to strip shape, and the metal sheet 34 is etched using photolithography technique. To form the grooves 26 extending in a linear shape on the first surface 34a side of the metal sheet 34 and etching using the port lithography technique to the metal sheet 34 to form the metal sheet 34. The process of forming the hole 27 in the 2nd surface 34b side of the process is included. Each process is explained in more detail below. In addition, in this embodiment, the process and the hole 27 which form the groove | channel 26 by the 1st surface 34a and the 2nd surface 34b of the metal sheet 34 simultaneously etched as mentioned below are described. The forming process is performed in parallel.

As shown in FIG. 8, in this embodiment, the winding body 29 which wound the metal sheet 34 to the supply core 31 is prepared. Then, as the supply core 31 rotates to rewind the winding body 29, a metal sheet 34 extending in a band shape is supplied as shown in FIG. In addition, the metal sheet 34 forms a through hole 25 to form the deposition mask 20. Therefore, as mentioned above, the metal sheet 34 consists of 36% Ni inver material, for example. However, not only this but the sheet | seat which consists of stainless steel, copper, iron, and aluminum can also be used as the sheet | seat 34 made of metal.

The supplied metal sheet 34 is etched by an etching apparatus (etching means) 50. Specifically, first, a photosensitive resist material is applied onto the first surface 34a (on the lower surface in the sheet of Fig. 9) and the second surface 34b of the metal sheet 34, and the metal sheet ( 34), resist films 36a and 36b are formed. Next, glass dry plates 37a and 37b are prepared so as not to transmit light to the regions to be removed in the resist films 36a and 36b, and the glass dry plates 37a and 37b are disposed on the resist films 36a and 36b. .

Thereafter, as shown in FIG. 9, the resist film 36 is exposed beyond the glass dry plate 37, and the resist film 36 is further developed. As described above, a resist pattern (simply referred to as a resist) 35a is formed on the first surface 34a of the metal sheet 34, and a resist is formed on the second surface 34b of the metal sheet 34. A pattern (simply referred to as a resist) 35b is formed.

In addition, the area | region which faces the resist film 36a, 36b which should be removed among the glass dry plates 37a, 37b may be made black, and visible light may be used as exposure light. In this case, since the visible light is absorbed in the black portion, no light is incident on the region to be removed of the resist films 36a and 36b, and the resist films 36a and 36b are not fixed on the metal sheet 34. On the other hand, light is incident on the region to be removed of the resist films 36a and 36b, and the resist films 36a and 36b in the region are fixed on the metal sheet 34. As shown in FIG. The resist films 36a and 36b that are not fixed are removed by, for example, hot water washing.

Next, as shown in FIG. 10, the metal sheet 34 is formed by the etching solution (for example, ferric chloride solution) 38 using the resist patterns 35a and 35b formed on the metal sheet 34 as masks. Is etched from the first surface 34a side and the second surface 34b side. In the present embodiment, the first surface of the metal sheet 34 beyond the resist pattern 35a from the lower nozzle 51a of the etching apparatus 50 disposed below the metal sheet 34 to which the etching liquid 38 is conveyed. Sprayed toward 34a). At the same time, the second surface 34b of the metal sheet 34 over the resist pattern 35b is removed from the upper nozzle 51b of the etching apparatus 50 disposed above the metal sheet 34 to which the etching liquid 38 is conveyed. Sprayed towards. At this time, as shown by the dotted line in FIG. 10, erosion by the etching solution starts in a region not covered by the resist patterns 35a and 35b in the metal sheet 34. Thereafter, erosion proceeds not only in the thickness direction of the metal sheet 34 but also in the direction along the sheet surface of the metal sheet 34. As described above, the erosion by the etching solution proceeds from the first surface 34a of the metal sheet 34 toward the second surface 34b side to form the groove 26, and similarly, the erosion by the etching solution is performed by the metal sheet. The hole 27 is formed by advancing toward the first surface 34a side from the second surface 34b of 34. Finally, the through hole 25 through which the groove 26 and the hole 27 penetrate the metal sheet 34 by the groove 26 and the hole 27 is formed.

Thereafter, the resist patterns 35a and 35b on the metal sheet 34 are removed, and the metal sheet 34 is washed with water. In this way, the sheet-shaped member 18 for deposition masks which consists of the metal sheet 34 in which the many through-holes 25 were formed can be obtained.

The sheet-shaped member 18 for deposition masks obtained in this way is cut | disconnected by the pair of conveyance rollers 52 and 52 which were rotated in the state which clamped the said deposition mask sheet-shaped member 18 (cutting means). Returned to 53. In addition, by the rotation of the conveying rollers 52 and 52, the above-described supply core 31 is rotated through the tension (tension force) acting on the sheet-shaped member 18 for deposition mask and the metal sheet 34, thereby winding the winding body ( The metal sheet 34 is supplied from 29.

The sheet-like vapor deposition mask 20 is obtained by cutting the metal sheet 34 in which the many through-holes 25 were formed to predetermined length by the cutting device (cutting means) 53. As shown in FIG. And the vapor deposition mask apparatus 10 is obtained by providing the frame 15 with respect to each vapor deposition mask 20. The frame 15 may be provided on one surface 20a of the deposition mask 20 or may be provided on the other surface 20b of the deposition mask 20.

In addition, when forming the groove | channel 26 which extends thinly and elongate in linear form as mentioned above, the direction in which the groove | channel 26 is extended and the direction in which the metal sheet 34 is supplied (the metal sheet 34 is conveyed) Direction] is preferably substantially parallel. In this case, it is possible to prevent the metal sheet 34 from extending or cutting in the portion of the groove 26 having a thin thickness during the manufacture of the deposition mask 20.

As described above, according to the present embodiment, the through hole 25 is formed in the metal sheet 34 by the linear grooves 26 and the holes 27. Therefore, the vapor deposition material 48 which advances generally along the longitudinal direction of the groove | channel 26 as the vapor deposition material 48 which advances obliquely with respect to the sheet surface of the metal sheet 34 can be used for vapor deposition with high efficiency. . Thereby, the utilization efficiency of the vapor deposition material 48 can be improved significantly. And the deposition mask 20 which concerns on this embodiment is a deposition mask used for patterning an expensive organic light emitting material on a board | substrate 42 in a desired pattern, for example when manufacturing an organic electroluminescent display apparatus (for deposition) Is very suitable for metal masks).

In addition, according to the present embodiment, the use efficiency of the vapor deposition material 48 is greatly increased while securing the thickness of the metal sheet 34 to a certain degree or more. That is, the thickness of the metal sheet 34 is locally cut, without reducing the thickness of the metal sheet 34 as a whole, and the utilization efficiency of the vapor deposition material 48 is greatly improved. Therefore, the rigidity of the metal sheet 34 and the deposition mask 20 can be ensured, so that the deposition mask 20 (metal sheet 34) during the production or handling of the deposition mask 20 (such as conveyance or use). Can be effectively prevented from being deformed. As a result, when the obtained vapor deposition mask 20 is used, vapor deposition by a very high precision pattern can be performed with high precision.

Moreover, according to this embodiment, in the process of supplying the metal sheet 34, the metal sheet 34 which rewinds the winding body 29 which wound the metal sheet 34, and extends in strip shape is supplied. Such a winding body 29 is available at low cost, and is also very preferable in terms of handling.

Moreover, it is related with embodiment mentioned above, and various changes are possible within the scope of the summary of this invention. Hereinafter, an example of a modification is demonstrated, referring drawings suitably. In addition, in FIGS. 13-18 mentioned below, the same code | symbol is attached | subjected to the same part as the above-mentioned embodiment, and the modified example demonstrated below, and the overlapping detailed description is abbreviate | omitted.

(Modification 1)

In the above-mentioned embodiment, although the 1st surface 34a and the 2nd surface 34b of the metal sheet 34 were etched simultaneously, the example in which the groove | channel 26 and the hole 27 were formed in parallel was demonstrated, It is not limited to this. For example, as shown in FIG. 11, the process of forming the hole 27 may be performed before the process of forming the groove 26, and as shown in FIG. 12, the process of forming the groove 26 It may be performed before the step of forming the hole 27. If the step of forming the hole 27 is performed before the step of forming the groove 26, the hole 27 is formed after etching from the second surface 34b side of the metal sheet 34 to form the hole 27. A step of filling with resin or a step of filling the hole 27 with resin and covering the second surface 34b of the metal sheet 34 with a resin film may be further provided. In this case, the groove 26 can be formed with high precision by etching. In addition, the resin film on the hole 27 and the second surface 34b is removed after the grooves 26 are formed. Similarly, when the process of forming the grooves 26 is performed before the process of forming the holes 27, the grooves 26 are formed by etching from the first surface 34a side of the metal sheet 34 to form the grooves 26. ) May be further filled with a resin, or the groove 26 may be filled with a resin and the first surface 34a of the metal sheet 34 may be covered with a resin film. In this case, the hole 27 can be formed precisely by etching. In addition, the resin film on the grooves 26 and the first surface 34a is removed after the hole 27 is formed.

Alternatively, as shown in FIG. 13, the first surface 34a and the second surface 34b of the metal sheet 34 are simultaneously etched to form the holes 27 and the process of forming the grooves 26. It may be performed in parallel, and after that, only one of the steps of forming the hole 27 and the step of forming the groove 26 may be continued. That is, in this method, etching is performed in two stages, and the process of forming the hole 27 and the process of forming the groove 26 are performed in parallel in the first etching. Then either one of the steps of forming the holes 27 and the step of forming the grooves 26 in the first etching is completed, and the steps of forming the holes 27 in the second etching. And only the other one of the steps of forming the grooves 26 is continued. When applying to manufacture of the vapor deposition mask 20 of above-mentioned embodiment, it is preferable that formation of the hole 27 which becomes the minimum amount of cutting by an etching is completed by the 1st etching. According to this method, it becomes possible to efficiently manufacture the grooves 26 and the holes 27 having different cutting amounts by etching.

Here, the modification of the manufacturing method shown in FIG. 14 is demonstrated in detail. 14A to 14E are views for explaining one modification of the method of manufacturing the deposition mask, all of which are made of metal sheet 34 in a cross section along the width direction of the groove 26. )

As shown in Fig. 14A, a resist (resist pattern) 35a is formed on the first surface 34a of the metal sheet 34 in the same manner as described above, and the metal sheet 34 is formed. A resist (resist pattern) 35b is formed on the second surface 34b of the substrate. Next, the first etching is performed on the metal sheet 34 over the resists 35a and 35b. In the first etching, the first surface 34a and the second surface 34b of the metal sheet 34 are simultaneously etched, and the grooves 26 and the second surface 34b on the first surface 34a side are etched at the same time. The hole 27 at the side is formed in parallel. However, the cutting amount by etching for forming the hole 27 is much smaller than the cutting amount by etching for forming the grooves 26. Therefore, as shown in Fig. 14B, the groove 26 is still in the formation stage at the time when the hole 27 having the desired shape is formed on the second surface 34b side of the metal sheet 34. have. In the state shown in FIG. 14B, the first etching of the metal sheet 34 is completed.

Next, as shown in Fig. 14C, the hole 27 formed by the resin 39 having resistance to the etching liquid 38 is covered. That is, the hole 27 is sealed by the resin 39 having resistance to the etching liquid 38. In the example shown in FIG. 14C, not only the hole 27 in which the film of the resin 39 is formed, but also the second surface 34b (resist 35b) is formed.

After that, the second etching is performed on the metal sheet 34. In the second etching, the grooves 26 are formed from the side of the first surface 34a where the metal sheet 34 is etched only from the side of the first surface 34a. This is because the metal sheet 34 is coated with a resin 39 having resistance to the etching solution 38 on the side of the second surface 34b. Therefore, the shape of the hole 27 formed in the desired shape by the first etching is not damaged. Then, as shown in Fig. 14D, the second time with respect to the metal sheet 34 at the time when the groove 26 of the desired shape is formed on the first surface 34a side of the metal sheet 34 is shown. Etching ends. At this time, as shown in Fig. 14 (d), the groove 26 extends to the position reaching the hole 27 along the thickness direction of the metal sheet 34, whereby the grooves 26 pass through each other. The through hole 25 is formed in the metal sheet 34 by the hole 27.

Next, the resists 35a and 35b and the resin film 39 are removed from the metal sheet 34. In addition, the resin film 39 can be removed by burning, for example. Thus, as shown in Fig. 14E, the deposition mask 20 (the sheet-like member 18 for the deposition mask) is obtained.

In the above manufacturing method, when the 2nd etching is complete | finished and the hole 27 and the groove 26 are communicated and the through-hole 25 was produced, the hole 27 is sealed by the resin 39. As shown in FIG. And according to this manufacturing method, the groove 26 and the hole 27 (namely, the through hole 25) can be formed stably with high precision.

For example, if the hole 27 is not sealed with resin, the first surface 34a and the second surface 34b of the metal sheet 34 communicate with each other through the through hole 25. In this case, the fresh etching liquid 38 (refer FIG. 10) with high erosion ability flows in from the groove 26 toward the hole 27 side. At this time, in the hole 27 where the cross-sectional area (opening area) becomes small or the vicinity of the protruding portion 28a, the hydraulic pressure is increased, and these regions are locally violently eroded by the fresh etching solution. Moreover, the etching liquid which flowed in from the 1st surface 34a side to the 2nd surface 34b side may remain around the hole 27 on the 2nd surface 34b. For that reason, it becomes difficult to stabilize the shape of the connection part 28 which defines the outline of the through hole 25, and to make the outline of all the through holes 25 uniform. In addition, if the hole 27 was not originally sealed with the resin 39, the through hole may be formed by the pressure generated when the groove 26 begins to flow into the second surface 34b through the hole 27. The cross-sectional shape (particularly, the shape of the protruding portion 28a) of 25 may be crushed.

On the other hand, according to this modification in which the hole 27 is sealed by the resin 39 when the hole 27 and the groove 26 communicate with each other and the through hole 25 is produced, all of the above problems can be avoided. Therefore, the through-hole 25 of a desired shape can be formed accurately and stably. In addition, according to this method, since the hole 27 and the groove 26 can be formed in a desired shape with high accuracy, the metal sheet 34 from the above-mentioned connection part 28 to the 2nd surface 34b (20b) mentioned above. Length Lc (refer FIG. 6) along the direction orthogonal to the sheet surface of () can be made into 5 micrometers or less (more specifically, 2-4 micrometers) stably. As a result, when the obtained vapor deposition mask 20 is used, vapor deposition by a very high precision pattern can be performed with high precision. In particular, the film thickness of the deposited film at the edge portion in the film formation region (region to be formed) can also be stabilized.

(Modification 2)

Moreover, in embodiment mentioned above, the groove 26 is formed by etching the metal sheet 34 from the side of the 1st surface 34a, and the metal sheet 34 is etched from the side of the 2nd surface 34b. Although the example in which the hole 27 is formed by this was demonstrated, it is not limited to this. For example, after the metal sheet 34 is etched from the side of the first surface 34a to form the grooves 26, a resist pattern (resist is formed on the side of the first surface 34a of the metal sheet 34. ), And the hole 27 may be formed by etching the metal sheet 34 from the side of the first surface 34a. In this case, the hole 27 extending from the bottom of the groove 26 to the second surface 34b of the metal sheet 34 can be formed, and the formed hole 27 is formed of the metal sheet ( The cross-sectional area becomes smaller toward the second surface 34b side from the first surface 34a side of 34. That is, according to this method, the cross-sectional area (opening area) of the through hole 25 in the cross section along the sheet surface of the metal sheet 34 toward the second surface 34b side from the first surface 34a side gradually increases. It is getting smaller. Therefore, according to the vapor deposition mask 20 which consists of the metal sheet 34 manufactured in this way, vapor deposition by a high precision pattern can be performed with very high precision.

(Modification 3)

In addition, the structure of the groove | channel 26 formed in the 1st surface 34a side of the metal sheet 34 in above-mentioned embodiment is only an example. For example, in the above-mentioned embodiment, although the groove 26 demonstrated the example which has a substantially uniform width and a substantially uniform depth along the longitudinal direction, it cannot limit to this. As an example, as shown in FIG. 15, the width on the first surface 34a of the groove 26 along the direction orthogonal to the longitudinal direction of the groove 26 (that is, the width direction of the groove) is not constant. You may not. In the vapor deposition mask 20 shown in FIG. 15, the width Wa of the part in which the hole 27 is formed in the longitudinal direction of the groove 26 has two adjacent widthwise grooves in the longitudinal direction of the groove 26. It is thicker than the width Wb of the portion between the holes 27.

The groove 26 is formed of a plurality of holes (groove holes) 30 arranged along the longitudinal direction of the groove 26 and formed on the first surface 34a side. Two holes 27 adjacent to each other along the longitudinal direction of the grooves 26 of the plurality of holes 30 constituting the grooves 26 are connected at the first surface 34a. In other words, the two holes 27 are formed to be partially polymerized on the first surface 34a. That is, on the first surface 34a, the outer contours of the two holes 27 are connected. 15 and 16, the hole 27 formed on the side of the second surface 34b faces the hole 30 formed on the side of the first surface 34a to form the groove 26. As shown in Figs. It is located at the position. In particular, in the present embodiment, as can be understood from Figs. 15 and 16, the center position C27 along the longitudinal direction of the groove 26 of the hole 27 formed on the second surface 34b side is the first position. The center position C30 along the longitudinal direction of the groove 26 of the groove configuration hole 30 formed on the surface 34a side coincides with the longitudinal direction of the groove 26. In addition, in this embodiment, as can be understood from FIG. 15, the center position along the width direction of the groove | channel 26 of the hole 27 formed in the 2nd surface 34b side was formed in the 1st surface 34a side. The center position along the width direction of the groove 26 of the groove configuration hole 30 coincides with the width direction of the groove 26. 16, the cross section along the longitudinal direction of this groove 26 is shown.

As shown in Fig. 16, the groove 26 extends in a linear shape, but the depth of the groove 26 is not constant. The depth Da of the portion where the hole 27 is formed in the longitudinal direction of the groove 26 is greater than the depth Db of the portion between two adjacent holes 27 in the longitudinal direction of the groove 26. It is deep.

In addition, about the other structure of the deposition mask 20 shown in FIG. 15 and FIG. 16, it can be set as the structure similar to the deposition mask demonstrated in embodiment mentioned above. For example, the cross-sectional shape along the width direction of the groove 26 can be the same as the cross-sectional shape of the groove (see Fig. 3) in the above-described deposition mask.

According to this vapor deposition sheet 20, the effect similar to the vapor deposition sheet in embodiment mentioned above can be expected. For example, since the through hole 25 is formed in the metal sheet 34 by the linear groove 26 and the hole 27, the vapor deposition material which advances at an angle with respect to the sheet surface of the metal sheet 34. It is 48 (see Fig. 5), and the deposition material 48 which proceeds to substantially follow the longitudinal direction of the groove 26 can be used for deposition with high efficiency. Thereby, the utilization efficiency of the vapor deposition material 48 can be improved significantly. In particular, according to the present modification, it is possible to ensure the rigidity of the metal sheet 34 and the deposition mask 20 than the deposition mask in the above-described embodiment. For this reason, it can prevent more effectively that the vapor deposition mask 20 (metal sheet 34) deform | transforms at the time of manufacture of a vapor deposition mask 20, or handling (for conveyance, use, etc.). As a result, when the vapor deposition mask 20 obtained is used, vapor deposition by a very high precision pattern can be performed more accurately.

Here, an example of the manufacturing method of the vapor deposition sheet shown in FIG. 15 and FIG. 16 is demonstrated with reference to FIG. 17 and FIG. Further, the deposition sheet 20 shown in Figs. 15 and 16 can be produced by any one of the above-described manufacturing methods shown in Figs. 8, 11, 12 and 13. As an example, the manufacturing method described below is the same method as the manufacturing method described with reference to FIGS. 13 and 14. 17A to 17E are views for explaining a method for manufacturing a deposition mask, and all of them show the metal sheet 34 in the cross section along the longitudinal direction of the groove. 18 shows the outer contour of the grooves 26 and through-holes 25 in which an example of a resist (resist pattern) 35a that can be disposed on the first surface 34a of the metal sheet 34 is to be formed. It is a top view showing together.

First, as shown in Fig. 17A, a resist (resist pattern) 35a is formed on the first surface 34a of the metal sheet 34, and the second surface 34b of the metal sheet 34 is formed. ), A resist (resist pattern) 35b is formed. In this example, as shown in Fig. 18, the resist 35a formed on the first surface 34a of the metal sheet 34 forms a groove 26 on the first surface 34a. Through holes 35a1 are formed at positions where holes 30 to be formed are to be formed, respectively. As shown in FIG. 18, the some through hole 35a1 is arrange | positioned at intervals along the longitudinal direction (up-down direction in the paper surface of FIG. 18) of the groove | channel 26 to be formed. Therefore, the resist 35a has the bridge part 35a2 located between two adjacent through-holes 35a1 along the longitudinal direction of the groove 26 to be formed.

Next, the first etching is performed on the metal sheet 34 over the resists 35a and 35b. In the first etching, the holes 30 in which the first surface 34a and the second surface 34b of the metal sheet 34 are simultaneously etched to form the grooves 26 on the first surface 34a side. ) And the hole 27 on the side of the second surface 34b are formed in parallel. That is, in the plurality of holes 30 constituting the groove 26, the plurality of through holes 35a1 are arranged in a line shape at intervals so that the resist 35a formed on the first surface 34a is disposed. By etching the first surface 34a of the metal sheet 34, the metal sheet 34 is formed on the first surface 34a side of the metal sheet 34 at a position corresponding to the through hole 35a1 of the resist 35a. As shown in Fig. 17B, a hole 27 having a desired shape is formed on the second surface 34b side of the metal sheet 34, and the hole 30 constituting the groove 26 is formed. In the state which is not formed completely, the 1st etching with respect to the metal sheet 34 is complete | finished. Next, as shown in Fig. 17C, the hole 27 and the second surface 34b (resist 35b) in which the resin film 39 made of a resin having resistance to the etching liquid 38 are formed. It is formed to cover. That is, the hole 27 is sealed by the resin 39 having resistance to the etching liquid 38.

After that, the second etching is performed on the metal sheet 34. In the 2nd etching, formation of the hole 30 which comprises the groove | channel 26 which comprises the metal sheet 34 from the 1st surface 34a side only from the side of the 1st surface 34a advances. At this time, since the hole 27 is sealed with a resin 39 having resistance to the etching liquid 38, the shape of the hole 27 formed by the first etching is not damaged. Then, as shown in Fig. 17D, the second etching of the metal sheet 34 is performed at the time when the hole 30 having the desired shape is formed on the first surface 34a side of the metal sheet 34. This ends.

As described above, the erosion of the metal sheet 34 by etching proceeds not only in the thickness direction of the metal sheet 34 but also in the direction along the sheet surface of the metal sheet 34. As shown in Fig. 17D, the hole 30 formed in the first surface 34a is subjected to the two-step etching process up to the hole 27 formed in the second surface 34b side. And a direction along the sheet surface of the metal sheet 34 so as to extend in the thickness direction of the 34 and to be connected at the first surface 34a and the adjacent hole 30 along the longitudinal direction of the groove 26 to be formed. Also extends. In the second etching, all two holes 30 adjacent to each other along the longitudinal direction of the grooves 26 of the plurality of holes 30 correspond to the two holes 30. It continues until it connects below the bridge part 35a2 of the resist 35a located between the two through-holes 35a1. That is, after completion of the second etching, a gap is formed between the bridge portion 35a2 of the resist 35a and the metal sheet 34. In this way, the two adjacent holes 30 are finally connected on the first surface 34a by two-step etching, and the plurality of holes (groove holes) 30 are arranged in a linear shape. And the groove 26 is finally formed from the plurality of holes 30. In addition, it may be in the 1st etching process that the two holes 30 adjoining along the longitudinal direction of the groove 26 start to superpose | polymerize on the 1st surface 34a, and the 2nd etching process You may be heavy.

Thereafter, the resists 35a and 35b and the resin film 39 are removed from the metal sheet 34, and as shown in Fig. 17E, the deposition mask 20 (the sheet-shaped member 18 for the deposition mask). ] Is obtained.

According to the above manufacturing method, the same operation and effect as the manufacturing method described with reference to FIGS. 13 and 14 can be expected. For example, according to the above manufacturing method, the through-hole 25 of a desired shape can be formed stably with high precision. Moreover, according to the above manufacturing method, length Lc (refer FIG. 6) along the direction orthogonal to the sheet surface of the metal sheet 34 from the connection part 28 mentioned above to the 2nd surface 34b (20b) is mentioned. It can be set to 5 micrometers or less (more specifically, 2-4 micrometers) stably. As a result, when the obtained vapor deposition mask 20 is used, vapor deposition by a very high precision pattern can be performed with high precision. In particular, the film thickness of the deposited film at the edge portion in the film formation region (region to be formed) can also be stabilized.

In addition, the resist 35a formed on the first surface 34a of the metal sheet 34 has a bridge portion 35a2 between the through holes 35a1. Accordingly, the resist 35a has high rigidity and adhesiveness to the metal sheet 34 as compared with the case where the long elongated through holes extending in a line shape corresponding to the grooves 26 to be formed are arranged side by side. This is improved. That is, the resist 35a is effectively prevented from being deformed on the first surface 34a of the metal sheet 34 or the peeling of the resist 35a from the first surface 34a of the metal sheet 34 during etching. can do. Thereby, the through hole 25 of a desired shape can be formed more accurately and more stably.

(Modification 4)

In addition, the structure of the hole 27 formed in the 1st surface 34a side of the metal sheet 34 in above-mentioned embodiment is only an example. For example, although the hole 27 showed the rectangular shape in planar view in the above-mentioned embodiment, it is not limited to this, For example, you may have various shapes, such as square.

(Modification 5)

In addition, although the example which supplied the metal sheet 34 extended in strip shape was shown in embodiment mentioned above, it is not limited to this. The sheet metal sheet 34 may be supplied, and the metal sheet 34 may be etched to form the deposition mask 20.

(Modification 6)

In addition, although the example which provided the frame 15 with respect to the deposition mask 20 cut | disconnected to predetermined length was shown in embodiment mentioned above, it is not limited to this. For example, the frame 15 is provided with respect to the sheet-shaped member 18 for vapor deposition masks before cutting, and the sheet-shaped member 18 for vapor deposition masks to which the frame 15 was fixed is cut | disconnected to predetermined length after that, You may go.

(Modification 7)

In addition, although some modifications to the above-described embodiment have been described above, it is naturally possible to apply a combination of a plurality of modifications as appropriate.

1 is a perspective view showing one embodiment of a deposition mask according to the present invention;

FIG. 2 is a partial plan view showing the deposition mask shown in FIG. 1; FIG.

Fig. 3 is a cross sectional view taken along the line III-III of Fig. 2;

4 is a cross-sectional view taken along a line IV-IV of FIG. 3;

5 is a view for explaining a method of using a deposition mask.

FIG. 6 is a view for explaining the operation of the deposition mask in the section corresponding to FIG. 3; FIG.

FIG. 7 is a view for explaining the operation of the deposition mask in the section corresponding to FIG. 4; FIG.

8 is a view for explaining an embodiment of a method for manufacturing a deposition mask according to the present invention.

9 is a view for explaining a method of forming a resist pattern on a metal sheet.

10 is a diagram for explaining a method of etching a metal sheet.

FIG. 11 is a view corresponding to FIG. 8 for explaining one modification of the method of manufacturing a deposition mask. FIG.

FIG. 12 is a view corresponding to FIG. 8 for explaining another modification of the method of manufacturing the deposition mask. FIG.

FIG. 13 is a view corresponding to FIG. 8 and for explaining another modification of the method of manufacturing the deposition mask. FIG.

14 (a) to 14 (e) are views for explaining the manufacturing method shown in FIG. 13, all showing a metal sheet in a cross section along the width direction of the grooves to be formed.

FIG. 15 is a view corresponding to FIG. 2, showing a partial plan view of one modification of the deposition mask; FIG.

FIG. 16 is a cross-sectional view taken along the line XVI-XVI in FIG. 15; FIG.

17A to 17E are diagrams for explaining an example of the manufacturing method of the deposition mask shown in FIG. 15, and show a metal sheet in a cross section along the longitudinal direction of the grooves to be formed. Drawing.

FIG. 18 is a partial plan view showing an example of a resist that can be used in the manufacturing method shown in FIG. 17; FIG.

<Explanation of symbols for the main parts of the drawings>

10: Deposition mask device

15: Frame

20: Deposition mask

25: Through hole

34: Metal sheet

40: Deposition device

Claims (24)

And a metal sheet having a first surface and a second surface opposite to the first surface, the metal sheet having a through hole extending between the first surface and the second surface, A groove extending in a linear shape is formed on the first surface side of the metal sheet, The hole is formed in the said 2nd surface side of the said metal sheet, And said groove and said hole are formed therethrough, and said through hole and said hole are formed through holes penetrating said metal sheet. The deposition mask according to claim 1, wherein the cross-sectional area of the groove in the cross section along the sheet surface of the metal sheet is gradually decreased from the first surface side to the second surface side. The deposition mask according to claim 1, wherein the cross-sectional area of the hole in the cross section along the sheet surface of the metal sheet is gradually decreased from the second surface side to the first surface side. The area enclosed by the connection portion between the wall surface of the groove and the wall surface of the hole has a rectangular shape when observed from the normal direction of the sheet surface of the metal sheet. The longitudinal direction of the area | region enclosed by the said connection part extends along the longitudinal direction of the said linear groove. The deposition mask according to claim 1, wherein a plurality of grooves extending in a straight line are formed in parallel to each other. The deposition mask according to claim 1, wherein a plurality of said holes are formed at intervals along the longitudinal direction of said groove. According to claim 1, A plurality of grooves extending in parallel to each other are formed at equal intervals, A plurality of holes are formed at equal intervals along the longitudinal direction of each groove, In the case of observing from the normal direction of the sheet surface of the metal sheet, the length between two adjacent through holes along the longitudinal direction of the groove is shorter than the length between two through holes respectively formed in the adjacent grooves. Deposition mask. The width | variety on the said 1st surface of the said groove | channel along the direction orthogonal to the said longitudinal direction of the said groove | channel is rather than the part in which the said hole in the said longitudinal direction is formed. It is narrowed in the part between two adjacent holes in the said longitudinal direction, The vapor deposition mask characterized by the above-mentioned. The said groove is formed by the some hole formed in the said 1st surface side, The two holes of Claim 1, 6, or 7 which adjoin along the said longitudinal direction of the said groove among the said some holes. Is connected in the said 1st surface, The vapor deposition mask characterized by the above-mentioned. The said groove is formed by the some hole formed in the said 1st surface side, The two holes which adjoin along the said longitudinal direction of the said groove among the said some holes are the said 1st. I am connected in a plane, The hole formed in the said 2nd surface side is arrange | positioned in the position which is formed in the said 1st surface side and faces the hole which comprises the said groove | channel, The vapor deposition mask characterized by the above-mentioned. Etching a metal sheet having a first surface and a second surface opposite to the first surface to form a groove extending linearly on the first surface side of the metal sheet; Etching the metal sheet to form a hole in the second surface side of the metal sheet; And the grooves and the holes are formed such that the grooves and the holes penetrate the metal sheet by the grooves and the holes. The method of claim 11, wherein a plurality of grooves extending in parallel to each other are formed at equal intervals, A plurality of holes are formed at equal intervals along the longitudinal direction of each groove, In the case of observing from the normal direction of the sheet surface of the metal sheet, the length between two through holes adjacent along the longitudinal direction of the groove is shorter than the length between two through holes respectively formed in the adjacent grooves. The manufacturing method of the vapor deposition mask which exists. 12. The groove and the hole according to claim 11, wherein the area surrounded by the connecting portion between the wall surface of the groove and the wall surface of the hole is viewed from the normal direction of the sheet surface of the metal sheet. Formed, The longitudinal direction of the area | region enclosed by the said connection part is extended along the longitudinal direction of the said linear groove, The manufacturing method of the vapor deposition mask characterized by the above-mentioned. The method of claim 11, further comprising the step of supplying the metal sheet, In the step of forming the groove, a groove extending in the supply direction of the metal sheet is formed, characterized in that the manufacturing method of the deposition mask. The groove according to claim 11, wherein the groove is formed by etching the metal sheet, The hole is formed by etching the metal sheet, wherein the deposition mask is produced. The method of claim 15, wherein the first surface and the second surface of the metal sheet are simultaneously etched, and the step of forming the hole and the step of forming the groove are performed in parallel. Way. The process according to claim 15, wherein the first surface and the second surface of the metal sheet are simultaneously etched to form the holes and the grooves are formed in parallel. Only one of the steps of forming the groove is continuously performed. The process of Claim 15 which is a process performed after the said hole is formed by etching the said metal sheet, Furthermore, the process of sealing the formed said hole with resin is further provided, And after the sealing of the hole, the groove passing through the first surface side to the hole is formed by etching the metal sheet. 19. The method of claim 18, wherein in the step of forming the hole, the first surface and the second surface of the metal sheet are simultaneously etched and the formation of the grooves is partially performed. Way. The method of manufacturing a deposition mask according to claim 11, wherein the step of forming the hole is performed before the step of forming the groove. The method of manufacturing a deposition mask according to claim 11, wherein the step of forming the groove is performed before the step of forming the hole. The groove is formed in the step of forming the groove, wherein the two adjacent holes are connected on the first surface, and the plurality of holes are arranged in a linear shape to form the groove from the first surface side. Method for producing a deposition mask, characterized in that to form a. 23. The method of manufacturing a deposition mask according to claim 22, wherein the hole formed on the second surface side is formed at a position formed on the first surface side to face the hole constituting the groove. The process of claim 22, wherein in the step of forming the groove, The plurality of holes constituting the groove may be formed by etching the first surface of the metal sheet in a state in which a plurality of through holes are arranged at intervals and disposed on the first surface. Is formed on the first surface side of the metal sheet at a position corresponding to In the etching for forming the grooves formed of the plurality of holes, two holes adjacent to each other along the longitudinal direction of the grooves are placed between two through holes of the resist respectively corresponding to the two holes. A method of manufacturing a deposition mask, which is performed so as to be connected below the negative side.

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