KR101856182B1 - Electrical contact unit and Probe assembly for electrical inspecting a device having the same - Google Patents

Abstract

The electrical contact structure and the electrical inspection probe assembly including the electrical contact structure include a wiring pattern extending toward the front end of the base block and a first protection film formed on the wiring pattern facing the electrode pad of the inspection object to protect the wiring pattern A contact pattern disposed on one side of the wiring pattern so as to be in electrical contact with the electrode pad of the object to be inspected and a contact pattern disposed between the wiring pattern and the contact pattern to electrically connect the wiring pattern and the contact pattern, And a via pattern formed in the via hole passing through the first protective film.

Description

Technical Field [0001] The present invention relates to an electrical contact structure and a probe assembly for inspecting the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical contact structure and an electrical inspection probe assembly including the electrical contact structure. More particularly, the present invention relates to an electrical contact structure for electrically contacting an electrode pad of an object to be inspected when performing an electrical reliability test on the object such as a flat panel display And an electrical inspection probe assembly including the electrical contact structure.

Examples of the flat panel display device as the object to be inspected include a liquid crystal display panel, a plasma display panel, and an organic light emitting diode display panel. In the case of the above-mentioned flat panel display panel, an electrode pad for applying an electrical signal to the edge portion is provided.

In the inspection of the electrical reliability of the flat panel display device mentioned above, it is necessary to provide a base block, a printed circuit board (PCB) disposed on the lower surface of the base block, and a microcontroller electrically connected to the printed circuit board, A probe, and a probe. In recent years, a probe assembly having a contact pattern instead of a micro-tip has been developed to correspond to an electrode pad of a flat panel display panel having a fine pitch. That is, a contact pattern of a film structure made of a flexible printed circuit board (FPCB) is used instead of a micro-tip so as to be in electrical contact with an electrode pad of a flat panel display panel. The probe assembly includes a base block, a contact pattern of a flexible printed circuit board disposed at a front end of a lower surface of the base block, a wiring of a printed circuit board connected to the contact pattern while being disposed at a rear end of a lower surface of the base block do.

However, in the case of the probe assembly having the flexible printed circuit board of the contact pattern and the printed circuit board of the wiring, since there is a connection portion between the contact pattern and the wiring, generation of electrical noise, short- miss align, and so on. In addition, in the case of a printed circuit board, it is not easy to fabricate a flexible printed circuit board having a film structure, and it is disadvantageous in that it is expensive.

Further, in the electrical inspection of a flat panel display device such as a recent organic light emitting diode display panel having at least two different electrode pads which are different from each other in a row or a column, electrical contact with the electrode pads must be repeated according to each row or column Therefore, the inspection time tends to be somewhat long, and as a result, it may act as a cause of deteriorating the productivity.

An object of the present invention is to provide an electrical contact structure in which a contact pattern and a wiring pattern are provided in a single film structure, and an electric inspection probe assembly including the same.

According to an aspect of the present invention, there is provided an electrical contact structure including a wiring pattern extending toward an electrode pad of an object to be inspected, a wiring pattern facing the electrode pad of the object to protect the wiring pattern, A contact pattern disposed at a lower portion of one side of the wiring pattern so as to be in electrical contact with the electrode pad of the object to be inspected, and a second contact layer formed on the contact pattern so as to electrically connect the wiring pattern and the contact pattern. And a via pattern formed in the via hole passing through the first protective film between the wiring pattern and the contact pattern.

In the electrical contact structure according to an embodiment of the present invention, the contact pattern and the via pattern may be formed to have an integral structure.

In the electrical contact structure according to an embodiment of the present invention, the contact pattern may have a structure such that the contact pattern tapers toward an end contacting with the electrode pad.

In the electrical contact structure according to an embodiment of the present invention, the protective film may further include a second protective film formed on a wiring pattern opposite to the electrode pad of the test object to protect the wiring pattern.

In the electrical contact structure according to an embodiment of the present invention, when the contact pattern is electrically contacted with the electrode pad, the contact pattern may be pressed toward the electrode pad, And a pressing pattern between the first protective film and the second protective film.

According to an aspect of the present invention, there is provided a probe assembly for an electric inspection, comprising: a base block having a front end facing a direction in which an electrode pad formed on an object to be inspected for electrical inspection is located; And a first protective film formed on the wiring pattern facing the electrode pad of the test object so as to protect the wiring pattern; And a contact pattern formed in a via hole penetrating the first protective film between the wiring pattern and the contact pattern to electrically connect the wiring pattern and the contact pattern And an electrical contact having a via pattern.

In the probe assembly for electrical inspection according to an embodiment of the present invention, the via pattern extends through the first protective film, a wiring pattern formed on the first protective film, and a contact pattern formed under the first protective film May be formed in the via hole.

In the probe assembly for electrical inspection according to an embodiment of the present invention, the contact pattern and the via pattern may be formed to have an integral structure.

In the probe assembly for an electric test according to an embodiment of the present invention, the contact pattern may have a structure such that the contact pattern tapers toward an end contacting with the electrode pad.

In the probe assembly for electrical inspection according to an embodiment of the present invention, the protective film may include a coating film of an insulating material.

The protective film may further include a second protective film formed on the wiring pattern facing the lower surface of the base block so as to protect the wiring pattern, in the probe assembly for electrical inspection according to an embodiment of the present invention .

In the probe assembly for electrical inspection according to an embodiment of the present invention, the second protective film is formed under a portion that is in contact with the wiring pattern and a portion that is in contact with the wiring pattern, And a portion that is in contact with the wiring pattern may be formed of a coating film made of polyimide, polyester, or a mixture thereof, and a portion extending only to the portion where the contact pattern is formed Or a coating film of an insulating material.

In the probe assembly for electrical inspection according to an embodiment of the present invention, the protective film may be fixedly mounted on a lower surface of the base block using a bonding material made of an insulating material.

In the probe assembly for electrical inspection according to an embodiment of the present invention, when the contact pattern is electrically contacted to the electrode pad, And a pressing pattern may be further provided between the first protective film and the second protective film of the protective film.

In the probe assembly for electrical inspection according to an embodiment of the present invention, the pressing pattern may be made of the same material and structure as the contact pattern.

In the probe assembly for an electric test according to an embodiment of the present invention, when the object to be inspected includes at least two electrode pads located in different rows or columns, the contact pattern is electrically contacted to the electrode pads at the same time Possibly in at least two rows or columns.

In the probe assembly for electrical inspection according to an embodiment of the present invention, the wiring pattern may extend only to a portion not protruding from the front end of the base block.

In the probe assembly for electrical inspection according to an embodiment of the present invention, when the contact pattern is pressed by the electrical contact with the electrode pad, the contact pattern may be formed to absorb the impact applied to the contact pattern. And a shock absorbing portion formed to be in contact with a lower surface of the front end of the base block on the opposite side of the base block.

In the probe assembly for electrical inspection according to an embodiment of the present invention, the shock absorber may be made of a rubber material.

As described above, according to an embodiment of the present invention, the contact pattern and the wiring pattern are provided in a single film structure. That is, a contact pattern in electrical contact with an object to be inspected, and a contact pattern and an electrically extended rod in the wiring pattern are provided in a single film structure.

As described above, in the case of the electrical contact structure and the probe assembly for electrical inspection including the contact structure, the contact line and the wiring pattern are formed in a single film structure, so that the connection portion between the contact pattern and the wiring pattern can be omitted, A short circuit, a misalignment at a connection portion, and the like can be prevented in advance.

In addition, since only the flexible printed circuit board, which is a single film structure, can be applied to the contact pattern and the wiring pattern alone, the cost of the electrical contact structure and the electric inspection probe assembly including the same can be improved .

In addition, since the probe assembly for electrical inspection including the electrical contact according to the embodiment of the present invention can arrange the contact pattern in at least two rows or columns, at least two different electrode pads Such as an organic light emitting diode (OLED) display panel or the like.

Therefore, it is possible to perform one electrical test on the electrode pads located in at least two rows or columns, so that the time required for the electrical test can be sufficiently shortened, and as a result, the productivity can be improved. In addition, since the electrical contact with the electrode pad is based on at least two rows or columns, it is possible to reduce the number of times of electrical contact with the electrode pad, It can be expected that the reliability is improved.

The electrical contact structure according to an embodiment of the present invention and the electrical inspection probe assembly including the contact structure may be in contact with not only the protective film but also the via pattern, And the like.

FIG. 1 is a schematic view showing a probe assembly for electrical inspection according to an embodiment of the present invention.
2 is an enlarged view of a portion A in Fig.
Figure 3 is a schematic view showing the electrical contact of Figure 1;
Figs. 4 and 5 are schematic views showing other examples of the electrical contact of Fig.
Fig. 6 is a schematic view for explaining the structure of the electrical contact of Fig. 1. Fig.
Fig. 7 is a view showing the arrangement of the electrode pads of the test object shown in Fig. 1;

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail with reference to the accompanying drawings, which show an embodiment of the invention. However, the present invention is not limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to cross-sectional illustrations that are schematic illustrations of an ideal embodiment of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, the embodiments of the present invention are not to be construed as being limited to the specific shapes of the regions described as illustrations, but to include deviations in shapes, the regions described in the Figures being entirely schematic and their shapes It is not intended to describe the exact shape of the area nor is it intended to limit the scope of the invention.

Example

FIG. 1 is a schematic diagram showing a probe assembly for an electric inspection according to an embodiment of the present invention, FIG. 2 is an enlarged view of part A of FIG. 1, and FIG. 3 is a schematic view showing an electrical contact of FIG. FIG.

1 to 3, the electric inspection probe assembly 100 is used to electrically contact the electrode pads 21 of the inspection object 200 to check the electrical reliability of the inspection object 200. FIG. Examples of the object 200 to be inspected include a flat panel display panel such as an organic light emitting diode display panel, a liquid crystal display panel, and a plasma display panel. In particular, in the case of a flat panel display device such as an organic light emitting diode display panel, a plurality of electrode pads 21 are arranged at regular intervals. The plurality of electrode pads 21 mentioned above are provided so as to be arranged in different rows or columns.

The probe assembly 100 for electrical inspection according to the present invention includes a base block 11 and an electrical contact 13 which is an electrical contact structure of the present invention. In particular, the electrical contact portion 13, which is an electrical contact structure, includes a wiring pattern 35, a protective film, a contact pattern 37, a via pattern 39, and the like. The electrical contact portion 13 may further include a pressing pattern 17 and the electrical inspection probe assembly 100 may further include an impact absorbing portion 15 or the like.

In addition, as will be described later, the protective film includes the first protective film 33 and the second protective film 31. If necessary, the first protective film 33 alone may be provided. That is, the protective film may include the first protective film 33 alone or may include the first protective film 33 and the second protective film 31 together.

Specifically, the base block 11 described above is for supporting and fixing the electrical contact portion 13, and includes a front end portion facing the direction in which the electrode pad 21 formed on the test object 200 for electrical inspection is located ) 11a.

The electrical contact 13 has a protective film. The protective film has a first protective film (33) and a second protective film (31).

First, the second protective film 31 is disposed on the lower surface of the base block 11. The first protective film 33 is disposed on the opposite side of the second protective film 31. That is, the first protective film 33 is disposed on the opposite side of the second protective film 31 to the electrode pad 21 of the test object 200. Here, each of the second protective film 31 and the first protective film 33 formed as a protective film is formed of a coating film of an insulating material. In particular, the coating film of the insulating material mentioned above is not limited to the kind of material when sufficient flexibility is ensured along with insulation. And the second protective film 31 has a single film structure, whereas the first protective film 33 may have a multilayer film structure. The first protective film 33 is formed under the portion of the electrical contact portion 13 to be in contact with the wiring pattern 35 and the portion to be in contact with the wiring pattern 35, As shown in FIG. That is, the first protective film 33 is formed on the coating film 33b formed on the portion of the electrical contact portion 13 that is in contact with the wiring pattern 35 and the coating film 33b formed on the portion extending only to the portion where the contact pattern 37 is formed. (33a). Here, in the case of the coating film 33b formed on the portion facing the lower surface of the base block 11, a polyimide, a polyimide, a polyimide, and a polyimide are provided so as to more stably protect the wiring pattern 35, And a coating film 33b made of polyester or a mixture thereof. It is understood that the coating film 33b made of the above-mentioned polyester or a mixture thereof also has flexibility as well as insulation. In the case of the coating film 33a formed on the portion of the test object 200 facing the electrode pad 21, that is, the portion extending only to the portion where the contact pattern 37 is formed, And it is not limited to the kind of material when flexibility is secured sufficiently.

As described above, in the case of the electrical contact portion 13, it can be seen that the protective film composed of the second protective film 31 and the first protective film 33 has a flexible film structure because it is made of a material having flexibility as well as insulation . Accordingly, the electrical contact portion 13 may have the same structure as a flexible printed circuit board (FPCB). That is, since the protective film made of a material having flexibility as well as insulation and the wiring patterns 35 and the like of the electrical contact portion 13 to be described later are made of a flexible metal, the electrical contact portion 13 is made of the same flexible film as the flexible printed circuit board As shown in FIG.

Therefore, the probe assembly 100 for electric inspection of the present invention can have the electric contact portion 13 having the same flexible film structure as the flexible printed circuit board alone.

In the case of the above-mentioned protective film, the first protective film 33 and the second protective film 31 are provided together. However, only the first protective film 33 can be provided. That is, only the wiring patterns 35 facing the electrode pads 21 of the test object 200 are formed in the protective film so as to protect the wiring patterns 35 facing the electrode pads 21 of the test object 200, (33). In other words, in the case of the electrical contact portion 13 of the present invention and the electric test probe assembly 100 including the same, the second protective film 31 may be omitted and the first protective film 33 alone may be provided. In the case of the wiring pattern 35 facing the lower surface of the base block 11, it can be protected by the lower surface of the base block 11 without being exposed when attached to the lower surface of the base block 11 to be.

As described above, in the electrical contact portion 13 of the present invention and the electric test probe assembly 100 including the electric contact portion 13, only the first protective film 33 is provided as a protective film, or only the first protective film 33 and the The provision of the second protection film 31 prevents the wiring pattern 35 from being exposed to the outside and prevents particles such as dust from being attracted to the wiring pattern 35 due to static electricity or the like.

The wiring pattern 35 is interposed between the second protective film 31 and the first protective film 33. That is, the wiring pattern 35 is formed on the second protective film (second protective film) so that the second protective film 31, the wiring pattern 35, and the first protective film 33 are sequentially stacked down from the lower surface of the base block 11 31) and the first protective film (33). Here, the wiring pattern 35 has a structure extending toward the front end portion 11a of the base block 11. The rear end of the wiring pattern 35 has a structure to be connected to an external device such as a tester or the like which provides an external electrical signal when performing electrical inspection.

The contact pattern 37 is disposed below the wiring pattern 35 extending toward the front end 11a of the base block 11 so as to be in electrical contact with the electrode pad 21 of the test object 200 do. That is, the contact pattern 37 is disposed below the end portion of the wiring pattern 35 extending toward the front end portion 11a of the base block 11, Can be arranged perpendicular to each other. Thus, the electrical inspection of the test object 200 is performed with an electrical signal that is connected between the contact pattern 37 and the wiring pattern 35. That is to say, by checking an electrical signal passing between the contact pattern 37 and the wiring pattern 35 by electrically contacting the contact pattern 37 with the electrode pad 21 of the test object 200, An electrical inspection is carried out. Therefore, the contact pattern 37 and the wiring pattern 35 should be electrically connected to each other.

Accordingly, in the present invention, the via pattern 39 is formed to electrically connect the contact pattern 37 and the wiring pattern 35. Therefore, the via pattern 39 is formed in the via hole passing through the contact pattern 37, the first protective film 33, and the wiring pattern 35. In other words, the contact pattern 37 is formed in the via hole passing through the first protective film 33 and the wiring pattern 35 formed at the upper portion from the central portion of the contact pattern 37. At this time, it is appropriate that the via hole in which the via pattern 37 is formed has a structure in which the surface of the second protective film 31 is mainly exposed. The via pattern 39 of the present invention has a structure in which the conductive material is sufficiently filled in the via hole passing through the contact pattern 37, the first protective film 33, and the wiring pattern 35 successively The contact pattern 37 and the wiring pattern 35 are electrically connected to each other. In addition, the via pattern 39 can more stably fix the contact pattern 37 as well as the electrical connection between the contact pattern 37 and the wiring pattern 35. That is, when the contact pattern 37 and the wiring pattern 35 are directly connected to each other, the contact between the contact pattern 37 and the wiring pattern 35 is simple, 35 are weak and the connecting portion itself is exposed to the external environment so that the connection portion between the contact pattern 37 and the wiring pattern 35 becomes weaker by the continuous electrical inspection . In other words, when the contact pattern 37 is directly connected to the wiring pattern 35, the strength at the connection portion is weak and the connection portion is directly affected by the external environment. As described above, in the present invention, the via pattern 39 is formed in the via hole passing through the contact pattern 37, the first protective film 33, and the wiring pattern 35 to form the contact pattern 37 and the wiring pattern 35 The contact pattern 37 is formed so as to surround the via pattern 39 and the portion where the contact pattern 37 and the wiring pattern 35 are connected is minimally exposed to the external environment, Therefore, the contact pattern 37 and the wiring pattern 35 can be more stably fixed. That is, in the present invention, since the wiring pattern 35 and the via pattern 39 are not exposed to the external environment at all, but only the contact pattern 37 is exposed to the external environment, the contact pattern 37 and the wiring pattern 35, It is possible to more stably fix the space between them. In particular, since the contact pattern 37 is formed in a structure surrounding the via pattern 39, it is possible to secure the strength according to the contact more excellent than the connection by simple surface contact. As described above, the via pattern 39 can more securely fix the contact pattern 37 and the wiring pattern 35.

The contact pattern 37 is formed in a single film structure so that exposure of a portion where the contact pattern 37 and the wiring pattern 35 are directly connected can be omitted, A short circuit, and a misalignment at a connection portion, which are caused by exposure of a connection portion between the wiring pattern 35 and the wiring pattern 35, can be prevented in advance.

In addition, since the contact pattern 37 can be fixed using the via pattern 39, the size of the contact pattern 37 can be appropriately adjusted when the size of the via pattern 39 is appropriately adjusted.

Therefore, the probe assembly 100 for electrical inspection according to the present invention has an advantage that the operator can appropriately adjust the size of the contact pattern 37, that is, the cross-sectional area of the contact pattern 37. Accordingly, by appropriately adjusting the cross-sectional area of the contact pattern 37, it is possible to secure a wide gap between the neighboring contact patterns 37, and there is an advantage that interference between each other can be reduced.

The formation of the protective film composed of the first protective film 33 and the second protective film 31 as well as the electrical contact portion 13 composed of the wiring pattern 35, the contact pattern 37 and the via pattern 39, Forming, patterning, and the like, so that a detailed description thereof will be omitted, since those skilled in the art can easily understand it.

As mentioned above, the electric inspection probe assembly 100 of the present invention includes the base portion 11 and the electric contact portion 13 having the same flexible film structure as that of the flexible printed circuit board. Although not shown, the electrical contact portion 13 is fixedly disposed on the lower surface of the base block 11 using a bonding material made of an insulating material. In other words, the second protective film 31 of the electrical contact portion 13 is fixedly disposed on the lower surface of the base block 11 by using a bonding material made of an insulating material, 13 are fixedly arranged. Examples of the bonding material include double-sided tape and the like. As described above, when the second protective film 31 is omitted, the wiring pattern 35 may be directly fixed on the lower surface of the base block 11. [

Therefore, the probe assembly 100 for electric inspection of the present invention can have the electric contact portion 13 having the same flexible film structure as the flexible printed circuit board alone. In particular, since the via pattern 39 is used, not only the contact pattern 37 and the wiring pattern 35 are electrically connected but also the contact pattern 37 can be more stably fixed, It is possible to provide the electric contact portion 13 of the first embodiment only. In addition, since the electrical contact portion 13 having the same flexible film structure as that of the flexible printed circuit board is provided alone, the structure of the lower surface of the base block 11 can be independent of the structure. This is because the structure of the lower surface of the base block 11 utilizes the characteristics of the flexible film structure of the electrical contact portion 13 even if the structure has a lot of bending.

Figs. 4 and 5 are schematic views showing other examples of the electrical contact of Fig.

1 to 3, except for the structure of the via pattern 39 in FIG. 4, the via pattern 39 in FIG. 5, and the contact pattern 37, Therefore, the same reference numerals are used, and a detailed description thereof will be omitted.

Referring to FIG. 4, the via pattern 39 is formed in a via hole passing through the first protective film 33 between the wiring pattern 35 and the contact pattern 37, as in FIGS. 4, the via pattern 39 is formed in the via hole passing through the first protective film 33 between the wiring pattern 35 and the contact pattern 37 to form the wiring pattern 35, And the contact pattern 37 are electrically connected to each other.

4, when the via pattern 39 is formed in the via hole passing through the first protective film 33 between the wiring pattern 35 and the contact pattern 37, the via pattern 39 and the contact pattern 37 37 can be integrally formed. That is, a conductive material is sufficiently filled in the via hole, a conductive material is deposited on the first protective film 33, and a conductive material sufficiently filled in the via hole is etched by a photolithography process to form a via pattern 39 The via pattern 39 and the contact pattern 37 can be integrally formed by forming the contact pattern 37 with the conductive material deposited on the first protective film 33. [ In the case of the electrical contact 13 having the via pattern 39 of Fig. 4, the pressing pattern 17 may be further provided.

Referring to FIG. 5, the contact pattern 37 is structured such that the contact pattern 37 becomes tapered toward the end where the electrode pad 21 of the object 200 contacts the electrode pad 21, unlike the case of FIGS. 1 to 3 and 4. That is, the electrical contact 13 in Fig. 5 has the contact pattern 37 having a tip-shaped pyramid structure.

When the contact pattern 37 is formed to have a tip-shaped pyramid structure, easier scrubbing with the electrode pad 21 becomes possible. As a result, more stable contact between the contact pattern 37 and the electrode pad 21 The transmission of the electrical signal can be accomplished.

In addition, in the case of the contact pattern 37 having a structure that becomes tapered toward the end as shown in Fig. 5, its application to both the electrical contact 13 in Figs. 1 to 3 and the electrical contact 13 in Fig. It is possible. In the case of the electrical contact portion 13 having the contact pattern 37 of Fig. 5, the pressing pattern 17 may be further provided.

4 and 5, the electrical contact portion 31 having the second protective film 31 is described. However, as mentioned in the case of the electropia 13 in FIGS. 4 and 5, (31) may be omitted and only the first protective film (33) may be provided alone.

Fig. 6 is a schematic view for explaining the structure of the electrical contact of Fig. 1. Fig.

Referring to FIG. 6, the contact patterns 37 in the present invention may be arranged in at least two rows or columns. That is, the wiring patterns 35 are arranged so that one group extends close to the front end portion 11a of the base block 11 with respect to the front end portion 11a of the base block 11, The contact patterns 37 may be arranged in at least two rows or columns by being arranged to be slightly spaced from the front end portion 11a of the base block 11, As described above, when the wiring patterns 35 are divided into an appropriate group, the contact patterns 37 can be arranged in n rows (n is a natural number of 2 or more) or rows.

In this way, the contact patterns 37 are arranged in at least two rows or columns because the subject 100 is provided with at least two electrode pads 21 located in different rows or columns. In particular, in the case of a flat panel display device such as a recent organic light emitting diode display panel or the like, at least two electrode pads 21 are provided in different rows or columns.

Fig. 7 is a view showing the arrangement of the electrode pads of the test object shown in Fig. 1;

Referring to Fig. 7, there is shown a test object 200 having at least two electrode pads 21 located in different rows or columns. Here, the case where the electrode pad 21 of the object 200 mentioned above has four rows has been described, but the present invention is not limited thereto. As described above, in the present invention, even when the test object 200 has at least two electrode pads 21 located in different rows or columns by arranging the contact patterns 37 so as to have at least two rows or columns, Can cope.

The electrode pad 21a of the first row, the electrode pad 21b of the second row, the electrode pad 21c of the third row and the electrode pad 21d of the fourth column, as shown in FIG. 7, When the electrical contact portion 13 having the contact pattern 37 arranged in two rows is used in the case of having four rows as shown in FIG. 4A, the electrode pad 21 of the test subject 200 is electrically The electrical inspection of the electrode pads 21 of the test object 200 can be performed even if the electrical contact portions 13 having the contact patterns 37 arranged in four rows are used . This makes it easier to perform the electrical inspection more easily when the arrangement and the number of the contact patterns 37 of the electrical contact portion 13 are appropriately adjusted according to the structure of the row or column in which the electrode pads 21 of the test object 200 are disposed Will be possible.

Therefore, when the electrical inspection probe assembly 100 having the electrical contact 13 having the contact pattern 37 described above is used for electrical inspection, the process time can be shortened to twice or more as compared with the conventional one. Further, when the electric inspection probe assembly 100 of the present invention having the electrical contact 13 mentioned above is used for electrical inspection, since the electrical contact with the electrode pad 21 is performed on at least two rows or columns By reducing the number of times of electrical contact with the electrode pad 21, confirmation for misalignment can be reduced as much.

As described above, the probe assembly 100 for electrical inspection of the present invention is configured such that when the test object 200 is provided with at least two electrode pads 21 located in different rows or columns, the contact pattern 37 of the electrical contact portion 13 Can be easily disposed in at least two rows or columns so as to be electrically in contact with the electrode pads 21 at the same time.

Referring again to FIGS. 1 to 3, the wiring pattern 35 extends only to a portion not protruding from the front end portion 11a of the base block 11. That is, the electrical contact portion 13 is provided so as not to protrude from the front end portion 11a of the base block 11. If the electrical contact portion 13 is provided so as to protrude from the front end portion 11a of the base block 11 as in the conventional case, the portion protruded when the electrical test probe assembly 100 is handled interferes with the outside, I do not. Thus, in the present invention, the electrical contact portion 13 is provided so as not to protrude from the front end portion 11a of the base block 11. Here, the electrical contact portion 13 can be provided so as not to protrude from the front end portion 11a of the base block 11 because the contact pattern 37 can be connected and fixed using the via pattern 39, In particular, an electrical contact 13 having a single flexible film structure. The wiring pattern 35 of the electrical contact portion 13 is extended only to the portion not protruding from the front end portion 11a of the base block 11 so that the electrical inspection probe assembly 100 can be handled It is possible to secure easiness, and as a result, more stable electrical inspection is possible.

The above-mentioned pressing pattern 17 is provided between the second protective film 31 and the first protective film 33 in the upper part where the contact pattern 37 is disposed. The pressing pattern 17 can more easily push the contact pattern 37 toward the electrode pad when the contact pattern 37 is in electrical contact with the electrode pad 21. [ That is, when the contact pattern 37 comes into contact with the electrode pad 21, the contact pattern 37 is pressed more easily by the pressing pattern 17 formed on the opposite side to sufficiently press the contact pattern 37, Contact between the contact pattern 37 and the electrode pad 21 can be made more stable. Here, the pressed pattern 17 is not limited to the material and the structure, but may be made of the same material and structure as the contact pattern 37. In this way, the pressed pattern 17 is formed of the same material and structure as the contact pattern 37 so that the pressed pattern 17 is formed on the upper second protective film 31 and the first protective film The contact pattern 37 and the wiring pattern 35 can be electrically connected to each other only when the pattern 17 is formed of the same material as the contact pattern 37. [ It is because. Since the contact pattern 37 is formed so as to surround the via pattern 39 in the case of the pressed pattern 17 as well, when the contact pattern 37 is in electrical contact with the electrode pad 21, (37) can be pressed more easily. That is, when the contact pattern 37 is in electrical contact with the electrode pad 21 as described above by forming the pressed pattern 17 and the contact pattern 37 into a structure having the same structure of the upper and lower portions, The contact pattern 37 can be more easily pressed toward the second electrode 21.

The shock absorbing portion 15 is formed to be in contact with the lower surface of the front end portion 11a of the base block 11 on the opposite side where the contact pattern 37 is disposed. The impact absorbing portion 15 can absorb an impact applied to the contact pattern 37 when the contact pattern 37 is pressed by the contact pattern 37 being in electrical contact with the electrode pad 21. [ As described above, by absorbing the impact applied to the contact pattern 37 when the contact pattern 37 is pressed by electrically contacting the electrode pad 21 with the shock absorbing portion 15, More stable scrubbing between the electrode pads 21 can be achieved. Here, since the impact absorbing part 15 is required to absorb the impact, it can be made of a rubber material with elastic force.

The probe assembly 100 described above has the shock absorbing portion 15 in addition to the pressing pattern 17 so that the contact pattern 37 and the electrode pad 21, Can be achieved.

As mentioned above, the probe assembly for electrical inspection of the present invention can have the same electrical contact of the same flexible film structure as the flexible printed circuit board alone. That is, the probe assembly for electric inspection of the present invention is relatively inexpensive as compared with the printed circuit board, and can have the electric contact portion of the flexible film structure alone.

Therefore, the price competitiveness of the probe assembly for electrical inspection and the productivity of the product can be expected to be improved. Thus, it can be confirmed that the probe assembly for electrical inspection of the present invention has higher quality competitiveness when applied to the semiconductor industry, the flat panel display device industry, and the like.

In addition, the probe assembly for electrical inspection of the present invention can omit a portion where a contact pattern and a wiring pattern are directly connected, thereby preventing a problem caused by a direct connection between a contact pattern and a wiring pattern, The reliability can be expected to be improved. As a result, higher inspection data can be secured when applied to the semiconductor industry, the flat panel display device industry, and the like.

In addition, since the probe assembly for electrical inspection of the present invention can arrange the contact patterns in at least two rows or columns, it is possible to provide a probe card for a current organic light emitting diode display panel having at least two electrode pads, And the like. As a result, the productivity of the semiconductor industry, the flat panel display device industry, and the like can be expected to be improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

11: base block 11a: front end portion
13: electrical contact 15: shock absorber
17: pressing pattern 21: electrode pad
31, 33: protective film 35: wiring pattern
37: contact pattern 39: via pattern
100: probe assembly 200: subject

Claims (19)

A wiring pattern extending toward the electrode pad of the object to be inspected;
A protective film formed on the wiring pattern facing the electrode pad of the object to protect the wiring pattern;
A contact pattern disposed on one side of the wiring pattern so as to be in electrical contact with the electrode pad of the object to be inspected; And
And a via pattern formed in a via hole passing through the first protective film between the wiring pattern and the contact pattern so as to electrically connect the wiring pattern and the contact pattern,
Wherein the protective film further comprises a second protective film formed on a wiring pattern opposite to the electrode pad of the inspection object so as to protect the wiring pattern,
Further comprising a pressing pattern between the wiring pattern at the upper portion where the contact pattern is disposed and the second protective film so that the contact pattern is pressed toward the electrode pad when the contact pattern is in electrical contact with the electrode pad Electrical contact structure. The electrical contact structure according to claim 1, wherein the contact pattern and the via pattern are formed to have an integral structure. The electrical contact structure according to claim 1, wherein the contact pattern has a structure that becomes tapered toward the end contacting with the electrode pad. delete delete A base block having a front end portion facing a direction in which an electrode pad formed on an object to be inspected for electrical inspection is located; And
A protective film having a wiring pattern extending toward a front end of the base block and a first protective film formed on a wiring pattern facing the electrode pad of the test object so as to protect the wiring pattern; A via pattern formed in a via hole penetrating the first protective film between the wiring pattern and the contact pattern so as to electrically connect the wiring pattern and the contact pattern, Comprising an electrical contact having a pattern
The protective film further includes a second protective film formed on the wiring pattern facing the lower surface of the base block to protect the wiring pattern,
And a pressing pattern is further provided between the first protective film and the second protective film of the upper protective film on which the contact pattern is disposed such that the contact pattern is pressed toward the electrode pad when the contact pattern is in electrical contact with the electrode pad Wherein said probe assembly comprises: 7. The electronic device according to claim 6, wherein the via pattern is formed in a via hole penetrating the first protective film and extending to a wiring pattern formed on the first protective film and a contact pattern formed under the first protective film. Probe assembly for inspection. 7. The electrical inspection probe assembly according to claim 6, wherein the contact pattern and the via pattern are formed to have an integral structure. 7. The electrical inspection probe assembly according to claim 6, wherein the contact pattern has a structure such that the contact pattern tapers toward the end of contact with the electrode pad. The electrical inspection probe assembly of claim 6, wherein the protective film comprises a coating film of an insulating material. delete 7. The semiconductor device according to claim 6, wherein the second protective film is formed of a multilayer film having a portion that is in contact with the wiring pattern and a portion that is formed below a portion that is in contact with the wiring pattern and extends only to a portion where the contact pattern is formed, Characterized in that the portion to be in contact with the wiring pattern is made of a coating film made of polyimide, polyester or a mixture thereof, and a portion extending only to the portion where the contact pattern is formed is provided as a coating film of an insulating material Probe assembly. The electrical inspection probe of claim 6, wherein the protective film is fixed to a lower surface of the base block using a bonding material made of an insulating material. delete 7. The electrical inspection probe assembly as claimed in claim 6, wherein the pressing pattern has the same material and structure as the contact pattern. The touch panel of claim 6, wherein when the object to be inspected is provided with at least two electrode pads located in different rows or columns, the contact pattern is arranged in at least two rows or columns so as to be in electrical contact with the electrode pads at the same time A probe assembly for electrical inspection. 7. The electrical inspection probe according to claim 6, wherein the wiring pattern extends only to a portion not protruding from the front end of the base block. The method as claimed in claim 6, further comprising the steps of: forming a lower portion of the front end of the base block on the opposite side where the contact pattern is disposed so as to absorb an impact applied to the contact pattern when the contact pattern is pressed by the contact pattern being in electrical contact with the electrode pad; And an impact absorbing portion formed to be in contact with the surface of the probe. 19. The electrical inspection probe assembly according to claim 18, wherein the shock absorber is made of a rubber material.

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