KR100912181B1 - Partial plating method for preventing lead-rising phenomena by using laser beam - Google Patents

Abstract

The present invention includes a nickel plating step of plating nickel (Ni) on a base metal, a gold plating step by an electroplating device after nickel plating, a laser surface treatment step for preventing lead rise, and an inspection step using a vision system. The present invention relates to a method of preventing partial lead rise and partial plating of parts requiring partial lead rise.

The surface treatment method of such a configuration was used a laser, which is a method of removing the gold of the gold plated portion and the nickel layer is exposed to allow partial soldering to prevent soldering to a specific part.

Partial lead rise, lead rise prevention, nickel plating, gold plating, laser surface treatment, soldering

Description

Partial plating method for preventing lead rise using laser surface treatment step {Partial plating method for preventing lead-rising phenomena by using laser beam}

The present invention relates to a method of surface treatment using a laser to the gold-plated portion in order to prevent the overall lead rise of the parts such as connector terminals or lead frames and to partially plate only a specific portion.

Specifically, the present invention relates to a laser surface treatment method that prevents soldering to a specific part when soldering the above components, and the like. Soldering or Pb free soldering in reflow by laser surface treatment ) Will not be soldered to a specific part, including the bend.

In general, the plating is electroplating, chemical plating, hot-dip plating, etc., wherein the electroplating is to attach the plated metal to the surface by energizing the object as a cathode in the electrolytic solution, it is performed for various purposes, such as decorative or anti-rust function, relatively In addition to being inexpensive and providing an appropriate metal coating, it can be applied to many fields such as automobiles, acoustic devices, aircraft, telecommunications, computer parts, jewelry, and building materials. In addition, the electroplating can be processed up to a small amount of a variety of products, it can give a texture of a variety of metal, there is an advantage that can obtain a film having excellent properties and good adhesion to expensive metal.

As a method for preventing the entire lead rise and partial plating, the masking tape was manually adhered to a place where plating is not required on a conventional gold plating site, and plating was performed. Since there is a problem that needs to be cut to fit the shape, a lot of time and manpower is required according to the manual work, and there is a problem that the defect rate is high.

As a method for solving the above problems, there is a partial plating method using ink masking (Domestic Patent No. 621,189), but it is difficult to penetrate masking ink into fine parts and pretreatment methods having low precision, and gold plating during post-treatment. It is difficult to remove the masked ink or remove the masked ink.

Japanese Laid-Open Patent Publication JP 59-170295 A relates to a method for forming a plurality of colors by complex plating of different dissimilar metals, and after forming a nickel plated layer on a molded substrate made of a metal material such as iron or copper alloy, After the plating process, the parts to be displayed on the metal plating layer should be printed with a special ink, and then subjected to a predetermined process, and then the masking is peeled off to remove the necessary characters on the substrate in a plurality of colors. Techniques for forming are known, but this also likewise occurs.

Therefore, there is a need for a new surface treatment method that can solve the above problems.

The present invention has been made in view of the above necessity, without having to manufacture a separate mold for masking each plated object such as a lead frame or a connector, or use a method of masking using an ink jet and plating. In order to provide a surface treatment method that can lead partly by removing gold freely on a part which is not to be plated and having nickel appear on the surface.

In the electronic and electronic parts as described above, in order to remove the gold of the gold-plated portion to come out of the nickel (Ni) portion that is not soldered, and to prevent the soldering on the entire gold-plated portion during soldering (Soldering), A method of surface treatment using a laser beam has been proposed.

Therefore, the present invention for achieving the above object is a nickel plating step (A1) of electroplating nickel (Ni) on the base metal (Base metal); Gold plating step (A2) by the electroplating device after nickel plating; Laser surface treatment step (A3) to remove the gold to prevent lead rise and expose the nickel surface; And a step (A4) of inspecting the removal of the gold and the exposed nickel surface by using a vision system.

In this case, the nickel plating step (A1) is preferably by the electro-nickel plating method, in the gold plating step (A2) instead of gold (Au), silver (Ag), tin (Sn), tin copper alloy (Sn + Cu) And tin lead alloy (Sn + Pb) can be selected as the plating material. The laser surface treatment step (A3) in the removal of gold of the gold-plated portion on the nickel base plated layer with a laser, the movement speed of the gold-plated portion is preferably made by adjusting the speed according to the gold plating thickness, bonding strength and laser power. Do. Gold plating removal width to prevent lead rise is adjustable from 0.05mm to 0.7mm minimum.

In addition, in the laser surface treatment step A3, the laser beam generator 30 may use a Yb-doped optical fiber laser or select a Nd: YAG (Neodymium-doped yttrium aluminum garnet) laser. . And the laser generated at this time is transmitted to the portion to remove the gold by the transmission device 32 using a multi-joint (prism, mirror, etc.) or optical fiber cable. In addition, the inspection step (A4) using the vision system 40 is characterized in that the gold plating is present on the nickel plating, using the roughness difference between gold and nickel or by using a color difference.

A nickel plating step (A1) of electroplating nickel (Ni) on the base metal as described above; Gold plating step (A2) by the electroplating device after nickel plating; Laser surface treatment step (A3) to remove the gold to prevent lead rise and expose the nickel surface; And a step (A4) of inspecting, using a vision system, that the gold removal and the nickel surface are exposed provide the following effects.

First, the partial plating method according to the present invention can remove the gold to the minimum 0.05mm width and leave the nickel portion, thus suppressing the overall lead rise phenomenon on the gold plated part during soldering of components such as a micro lead frame or connector. Only certain parts may lead to lead rise.

Secondly, the partial plating method according to the present invention does not need to manufacture a separate mold for masking each plated object such as a lead frame or a connector, or masking using inkjet, and does not plate various shapes. By using laser to remove gold freely and expose nickel on the surface, there is an advantage that can only partially control the lead rise.

It is to be understood that the invention is not limited to that described above and illustrated in the drawings, and that more modifications and variations are possible within the scope of the following claims.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic process diagram of a partial plating method according to the present invention.

FIG. 2 is a detailed configuration diagram of the partial plating apparatus according to the process illustrated in FIG. 1.

Referring to the drawings, a nickel plating step (A1) of nickel plating the base metal, a gold plating step (A2) by the electroplating apparatus after the nickel plating, a laser surface treatment step (A3) to prevent lead rise, After the laser surface treatment, the inspection step A4 using a vision system is performed in sequence.

At this time, the nickel plating step (A1) and gold plating step (A2) is by the electroplating method, the laser surface treatment step (A3) is the gold of the gold-plated portion on the nickel base plated layer with a laser and the laser used at this time Yb-doped fiber lasers or Nd: YAG lasers can be selected and used, and the generated laser beams are used to remove gold through multi-joint prism or mirrors or through fiber optic cables. Delivered. At this time, in the inspection of the gold removed portion using the vision system 40, the inspection camera and the illumination by using the roughness difference or color difference of gold and nickel, by checking the surface pattern of the removed gold If it does not match the designed part, the control system signals a warning light so that it can be notified outside.

Meanwhile, in the gold plating step (A2), one of silver (Ag), tin (Sn), tin copper alloy (Sn + Cu), and tin lead alloy (Sn + Pb) is used as a plating material instead of gold (Au). Base metals include brass, bronze, and phosphor bronze (Phosphor Bronze).

Hereinafter, a comparison will be made between the connector terminals before and after the laser surface treatment.

FIG. 3 shows a board to board (BTB) connector before the laser surface treatment step shown in FIG.

Figure 4 shows a board to board (BTB) connector after the laser surface treatment step shown in FIG. Black areas indicate laser surface treatment. This black band is used to prevent lead rise. In this way, the exposed nickel plated layer (see FIG. 8) improves the corrosion resistance of the connector terminal, improves hardness, and improves durability, thereby making it possible to manufacture longer connector terminals.

As another example, FIG. 5 shows a board to wire (BTW) connector before the laser surface treatment step shown in FIG.

FIG. 6 illustrates a board to wire (BTW) connector after the laser surface treatment step shown in FIG. 1. The black part has a laser surface treatment, and this part has been removed from the gold-plated part. Referring to FIG. 2, the Nd: YAG (yttrium-aluminum-garnet) -based laser generated by the laser beam generator 30 uses a multi-joint (prism or mirror type) or a transmission device 32 through an optical fiber cable. In order to prevent lead rise, the gold of the gold plated portion is removed by the laser surface treatment apparatus 34. In addition, by using the laser surface treatment apparatus 34, only portions that will not lead on the gold plated layer may be specified, thereby forming patterns of various shapes. Here, the moving speed of the gold-plated part is made by adjusting the speed according to the gold plating thickness, the bonding strength and the laser power, and the gold plating removal width for preventing lead rise is adjustable from 0.05mm to 0.7mm at least.

As a result, the gold of the gold-plated portion is removed to expose the nickel plating layer 200 (see FIG. 8), and the partial lead rises according to the pattern of the desired pattern.

FIG. 7 is an enlarged schematic view of the connector of FIG. 5 and shows a nickel plated layer and a gold plated layer formed on a base metal.

FIG. 8 is an enlarged view of the connector of the connector shown in FIG. 6, in which a nickel plated layer and a gold plated layer are formed on a base metal. At this time, it can be seen that after the laser surface treatment, a part of the gold plating is removed and the nickel layer is exposed.

1 is a schematic process diagram of a partial plating method according to the present invention.

FIG. 2 is a detailed configuration diagram of the partial plating apparatus according to the process illustrated in FIG. 1.

3 is a three-dimensional view of a board to board (BTB) connector before the laser surface treatment step shown in FIG.

FIG. 4 is a three-dimensional view of the board to board (BTB) connector after the laser surface treatment step shown in FIG. 1 (the black portion is in a laser surface treatment state).

FIG. 5 illustrates a board to wire (BTW) connector before the laser surface treatment step shown in FIG. 1.

FIG. 6 shows a board to wire (BTW) connector after the laser surface treatment step shown in FIG. 1 (the black part is in a laser surface treated state).

FIG. 7 is an enlarged schematic view of the connector of FIG. 5 and shows a nickel plated layer and a gold plated layer formed on a base metal.

FIG. 8 is an enlarged view of the connecting part of the connector shown in FIG. 6, in which a nickel plated layer and a gold plated layer are formed on a base metal (a portion of the gold plated after the laser surface treatment is removed and the nickel layer is Can be seen).

<Description of Symbols for Main Parts of Drawings>

A1: nickel plating step A2: gold plating step

A3: laser surface treatment step A4: inspection step

10: nickel electroplating apparatus 20: gold electroplating apparatus

30: laser beam generator 32: multi-joint or optical fiber cable transmission device

34: laser surface treatment device 36: control panel

40: Vision system

100: base metal

200: nickel plated layer

300: gold plating layer

Claims (6)

A nickel plating step (A1) of electroplating nickel (Ni) on a base metal; Gold plating step (A2) by the electroplating device after nickel plating; Laser surface treatment step (A3) to remove the gold to prevent lead rise and expose the nickel surface; And removing the gold and exposing the nickel surface by using a vision system (A4), wherein the laser surface treatment step (A3) comprises Yb-doped optical fiber. ) Laser or Nd: YAG (Neodymium-doped yttrium aluminum garnet) laser passes through the selected laser beam generator 30, and the generated laser beam is transmitted using the transfer device 32 through the articulated or optical fiber cable. In the inspection step A4 using the vision system 40, gold plating is present on the nickel plating, and the inspection is performed by using a color difference or a color difference between gold and nickel. Plating method. delete The method of claim 1, wherein the gold plating step A2 selects any one of silver (Ag), tin (Sn), tin copper alloy (Sn + Cu), and tin lead alloy (Sn + Pb) instead of gold (Au). Partial plating method characterized in that the plating material. delete delete delete

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