KR100539974B1 - LC Module - Google Patents

LC Module Download PDF

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Publication number
KR100539974B1
KR100539974B1 KR1019980027232A KR19980027232A KR100539974B1 KR 100539974 B1 KR100539974 B1 KR 100539974B1 KR 1019980027232 A KR1019980027232 A KR 1019980027232A KR 19980027232 A KR19980027232 A KR 19980027232A KR 100539974 B1 KR100539974 B1 KR 100539974B1
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South Korea
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printed circuit
circuit pattern
mold frame
lcd panel
circuit board
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KR1019980027232A
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Korean (ko)
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KR20000007749A (en
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권선영
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삼성전자주식회사
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Publication of KR20000007749A publication Critical patent/KR20000007749A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)

Abstract

TFT-LCD 패널, 도광판, 확산 시트류 등을 고정 지지하는 몰드 프레임의 외측 밑면에 인쇄회로기판 역할을 하는 인쇄회로 패턴을 형성하고 회로를 구성하는 다양한 소자를 표면실장방식으로 인쇄회로 패턴에 실장한 후 구동드라이브 IC가 실장된 테이프 케리어 패키지에 의하여 TFT-LCD 패널의 단자와 인쇄회로 패턴의 단자를 연결하여 인쇄회로기판의 두께 만큼 두께를 감소시킨 LCD 모듈이 개시되고 있다.A printed circuit pattern serving as a printed circuit board is formed on the outer bottom surface of a mold frame for holding and supporting a TFT-LCD panel, a light guide plate, a diffusion sheet, and the like, and various elements constituting the circuit are mounted on the printed circuit pattern using a surface mount method. Then, an LCD module is disclosed in which a thickness of a printed circuit board is reduced by connecting a terminal of a TFT-LCD panel and a terminal of a printed circuit pattern by a tape carrier package having a drive driver IC mounted thereon.

본 발명에 의하면, 백라이트 어셈블리의 몰드프레임에 인쇄회로기판의 역할을 하는 인쇄회로 패턴과 지정된 전기 소자들을 사진-식각, 증착의 방법으로 형성하고, 인쇄회로 패턴에 테이프 케리어 패키지의 출력 배선들을 전기적으로 연결시켜 인쇄회로기판만큼의 두께를 감소시켜 LCD 모듈의 전체 크기를 감소시키는 효과가 있다.According to the present invention, a printed circuit pattern serving as a printed circuit board and designated electrical elements are formed by a photo-etching and deposition method in a mold frame of a backlight assembly, and the output wirings of the tape carrier package are electrically connected to the printed circuit pattern. By reducing the thickness of the printed circuit board by connecting it has the effect of reducing the overall size of the LCD module.

Description

엘씨디 모듈LCD Module

본 발명은 LCD 모듈에 관한 것으로, 더욱 상세하게는 TFT-LCD 패널, 도광판, 확산 시트류 등을 고정 지지하는 몰드 프레임의 외측 밑면에 인쇄회로기판 역할을 하는 인쇄회로 패턴을 형성하고 회로를 구성하는 다양한 소자를 표면실장방식으로 인쇄회로 패턴에 실장한 후 구동드라이브 IC가 실장된 테이프 케리어 패키지에 의하여 TFT-LCD 패널의 단자와 인쇄회로 패턴의 단자를 연결하여 인쇄회로기판의 두께 만큼 두께를 감소시킨 LCD 모듈에 관한 것이다.The present invention relates to an LCD module, and more particularly to forming a printed circuit pattern serving as a printed circuit board on the outer bottom surface of a mold frame for holding and supporting a TFT-LCD panel, a light guide plate, a diffusion sheet, etc. After mounting various elements on the printed circuit pattern by surface mount method, the thickness of the printed circuit board is reduced by the thickness of the printed circuit board by connecting the terminal of the TFT-LCD panel and the terminal of the printed circuit pattern by the tape carrier package in which the drive drive IC is mounted. It relates to an LCD module.

최근, 경량화, 박형화, 소형화등의 장점을 가지고 있어 CRT(cathode ray tube)의 대체품으로 사용되고 있는 LCD 모듈은 액정의 전기광학적 성질을 이용하여 정보를 표시하는 표시장치이다. Recently, the LCD module, which is used as a substitute for a cathode ray tube (CRT) because of its advantages such as light weight, thinness, and miniaturization, is a display device that displays information using the electro-optical properties of liquid crystals.

투과형 LCD 모듈은 도 1에 도시된 바와 같이 크게 정보를 표시하는 LCD 패널(10)과, 인쇄회로기판(60)과, LCD 패널(10)과 인쇄회로기판(60)을 테이프 케리어 패키지(TCP;40)에 의하여 전기적으로 연결시켜 LCD 패널(10)을 구동시키는 구동드라이브 IC(45)와, LCD 패널(10)에 빛을 전달하는 백라이트 어셈블리(70) 및 이와 같은 구성 요소가 수납되는 몰드프레임(80)으로 구성된다.As shown in FIG. 1, the transmissive LCD module includes a LCD panel 10, a printed circuit board 60, a printed circuit board 60, an LCD panel 10, and a printed circuit board 60. A drive drive IC 45 electrically connected by 40 to drive the LCD panel 10, a backlight assembly 70 transmitting light to the LCD panel 10, and a mold frame in which such components are housed. 80).

그러나, 종래 LCD 모듈은 인쇄회로기판이 몰드프레임의 외부 밑면에 위치되기 때문에 LCD 모듈 전체의 두께가 두꺼워지는 문제점이 있다.However, the conventional LCD module has a problem that the entire thickness of the LCD module is thick because the printed circuit board is located on the outer bottom of the mold frame.

따라서, 본 발명은 이와 같은 종래 문제점을 감안한 것으로써 본 발명의 목적은 몰드프레임에 인쇄회로 패턴과 전기 소자들을 표면실장방식으로 형성한 후 TFT-LCD 패널의 단자와 인쇄회로 기판을 구동드라이브 IC가 실장된 테이프 케리어 패키지에 의하여 연결시킴으로써 LCD 모듈의 두께를 감소시킴에 있다.Accordingly, the present invention has been made in view of such a conventional problem, and an object of the present invention is to form a printed circuit pattern and electric elements in a surface mount method in a mold frame, and then drive a terminal IC and a printed circuit board of a TFT-LCD panel. It is to reduce the thickness of the LCD module by connecting by the mounting tape carrier package.

본 발명의 상기 목적을 달성하기 위한 LCD 모듈은, LCD 패널과, 램프 어셈블리, 도광판, 및 상기 램프 어셈블리와 도광판을 수납하는 몰드 프레임을 포함하는 백라이트 어셈블리와, 상기 LCD 패널을 구동하는 구동회로와, 상기 LCD 패널과 상기 구동회로를 전기적으로 연결하는 테이프 케리어 패키지를 포함하며, 상기 구동회로는 표면실장방식에 의해 상기 몰드 프레임에 일체로 형성되는 것을 특징으로 한다.An LCD module for achieving the above object of the present invention, the LCD panel, a backlight assembly including a lamp assembly, a light guide plate, and a mold frame for receiving the lamp assembly and the light guide plate, a drive circuit for driving the LCD panel; And a tape carrier package electrically connecting the LCD panel and the driving circuit, wherein the driving circuit is integrally formed on the mold frame by a surface mount method.

바람직하게는, 상기 구동회로는, 상기 몰드 프레임의 외부 밑면에 형성된다.Preferably, the driving circuit is formed on the outer bottom surface of the mold frame.

보다 바람직하게는, 상기 구동회로는, 상기 몰드 프레임의 외부 표면에 소정의 인쇄회로 패턴을 형성하고, 상기 인쇄회로 패턴에 소정의 전기 소자를 표면실장 방식에 의해 실장한다.More preferably, the driving circuit forms a predetermined printed circuit pattern on the outer surface of the mold frame, and mounts a predetermined electric element on the printed circuit pattern by a surface mount method.

이하, 본 발명 LCD 모듈의 구성을 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, the configuration of the LCD module of the present invention will be described with reference to the accompanying drawings.

첨부된 도 2에 도시된 바와 같이 크게 정보를 표시하는 LCD 패널(10)과, LCD패널(10)과 후술될 백라이트 어셈블리(70)의 몰드프레임(72)에 일체로 형성된 인쇄회로 패턴(74)을 전기적으로 연결하여 LCD 패널(10)을 구동시키는 구동드라이브 IC(45)와, LCD 패널(10)에 빛을 전달하는 백라이트 어셈블리(70)로 구성된다. 구동드라이브 IC의 실장방식은 씨오지(COG; Chip On glass)와 탭(TAB; Tape Automated Bonding)방식으로 구분된다. COG 실장 방식은 LCD 패널에 반도체 칩 패키지 형태의 구동드라이브 IC를 직접 실장하는 기술로, LCD 패널과 구동드라이브 IC 및 인쇄회로 패턴을 상호 연결하는데 시간이 많이 소요되어 LCD 모듈의 조립성이 저하되는 단점이 있다.As shown in FIG. 2, a printed circuit pattern 74 integrally formed on the LCD panel 10 displaying large information and the mold frame 72 of the LCD panel 10 and the backlight assembly 70 to be described later. And a drive drive IC 45 to electrically drive the LCD panel 10 and a backlight assembly 70 to transmit light to the LCD panel 10. The driving method of IC is divided into COG (Chip On Glass) and TAB (Tape Automated Bonding). The COG mounting method is a technology that directly mounts a drive driver IC in the form of a semiconductor chip package on the LCD panel. It takes a long time to interconnect the LCD panel with the drive driver IC and the printed circuit pattern. There is this.

탭 실장방식에 따르면 TCP(40)의 출력배선들은 LCD 패널(10)의 게이트 영역과 소스영역에 형성된 입력패드(12)들과 전기적으로 연결되고, TCP(40)의 입력배선들은 몰드 프레임(72)에 일체로 형성된 인쇄회로 패턴(74)의 출력패드들(76)과 접속된다.According to the tap mounting method, the output wires of the TCP 40 are electrically connected to the input pads 12 formed in the gate area and the source area of the LCD panel 10, and the input wires of the TCP 40 are molded in the mold frame 72. ) Are connected to the output pads 76 of the printed circuit pattern 74 integrally formed with each other.

한편, 백라이트 어셈블리(70)는 램프 어셈블리(73), 도광판(75)과, 시트류(77)와, 램프 어셈블리(73)와 도광판(75) 및 시트류(77)를 수납하는 몰드프레임(72)으로 구성된다. 여기서, 도광판(75)은 하부면이 소정 기울기로 기울어진 웨지(wedge) 형상이고, 도광판(75)의 두께가 얇은 쪽과 대응되는 몰드프레임(72)의 하부면에는 구동드라이브 IC(45)를 수납하기 위한 수납부(78)가 형성된다.Meanwhile, the backlight assembly 70 may include a lamp frame 73, a light guide plate 75, sheets 77, a mold frame 72 that receives the lamp assembly 73, the light guide plate 75, and sheets 77. It is composed of Here, the light guide plate 75 has a wedge shape in which the bottom surface thereof is inclined at a predetermined inclination, and the driving drive IC 45 is provided on the bottom surface of the mold frame 72 corresponding to the thinner side of the light guide plate 75. An accommodating portion 78 for accommodating is formed.

한편, 몰드프레임(72)의 외부 표면에는 사진-식각, 적층등의 방법에 의하여 소정 인쇄회로 패턴(74)이 형성되고 인쇄회로 패턴(74)에는 지정된 전기 소자들이 표면실장 방식에 의하여 실장된다. On the other hand, a predetermined printed circuit pattern 74 is formed on the outer surface of the mold frame 72 by photo-etching, lamination, etc., and the specified electrical elements are mounted on the printed circuit pattern 74 by a surface mounting method.

이와 같은 몰드프레임(72)의 외부 표면에 형성된 인쇄회로 패턴(74)의 입출력 패턴(미도시)에는 이방성 도전 필름이 어탯치되고 이방성 도전 필름에는 테이프 케리어 패키지의 입출력 패턴들이 얼라인먼트된 상태에서 어탯치되어 LCD 모듈(10)의 두께는 종래 인쇄회로기판의 두께만큼 감소된다.The anisotropic conductive film is attached to an input / output pattern (not shown) of the printed circuit pattern 74 formed on the outer surface of the mold frame 72, and the anisotropic conductive film is attached to the input / output patterns of the tape carrier package. Thus, the thickness of the LCD module 10 is reduced by the thickness of the conventional printed circuit board.

이상에서 설명한 바와 같이 백라이트 어셈블리의 몰드프레임에 인쇄회로기판의 역할을 하는 인쇄회로 패턴과 지정된 전기 소자들을 사진-식각, 증착의 방법으로 형성하고, 인쇄회로 패턴에 테이프 케리어 패키지의 출력 배선들을 전기적으로 연결시켜 인쇄회로기판만큼의 두께를 감소시켜 LCD 모듈의 전체 크기를 감소시키는 효과가 있다.As described above, the printed circuit pattern serving as the printed circuit board and the designated electric elements are formed by the photo-etching and deposition method in the mold frame of the backlight assembly, and the output wirings of the tape carrier package are electrically connected to the printed circuit pattern. By reducing the thickness of the printed circuit board by connecting it has the effect of reducing the overall size of the LCD module.

도 1은 종래 LCD 모듈을 도시한 단면도.1 is a cross-sectional view showing a conventional LCD module.

도 2는 본 발명에 의한 LCD 모듈을 도시한 단면도.2 is a cross-sectional view showing an LCD module according to the present invention.

Claims (3)

LCD 패널;LCD panel; 램프 어셈블리, 도광판, 및 상기 램프 어셈블리와 도광판을 수납하는 몰드 프레임을 포함하는 백라이트 어셈블리;A backlight assembly comprising a lamp assembly, a light guide plate, and a mold frame accommodating the lamp assembly and the light guide plate; 상기 LCD 패널을 구동하는 구동회로; 및A driving circuit for driving the LCD panel; And 상기 LCD 패널과 상기 구동회로를 전기적으로 연결하는 테이프 케리어 패키지를 포함하며,A tape carrier package electrically connecting the LCD panel and the driving circuit; 상기 구동회로는 표면실장방식에 의해 상기 몰드 프레임에 일체로 형성되는 것을 특징으로 하는 LCD 모듈. And the driving circuit is integrally formed on the mold frame by a surface mount method. 제 1 항에 있어서,The method of claim 1, 상기 구동회로는, 상기 몰드 프레임의 외부 밑면에 형성되는 것을 특징으로 하는 LCD 모듈.The driving circuit is an LCD module, characterized in that formed on the outer bottom surface of the mold frame. 제 2 항에 있어서,The method of claim 2, 상기 구동회로는, 상기 몰드 프레임의 외부 표면에 소정의 인쇄회로 패턴을 형성하고, 상기 인쇄회로 패턴에 소정의 전기 소자를 표면실장방식에 의해 실장한 것을 특징으로 하는 LCD 모듈.And the driving circuit forms a predetermined printed circuit pattern on an outer surface of the mold frame, and mounts a predetermined electric element on the printed circuit pattern by a surface mounting method.
KR1019980027232A 1998-07-07 1998-07-07 LC Module KR100539974B1 (en)

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KR100860240B1 (en) * 2001-11-13 2008-09-25 삼성전자주식회사 Liquid crystal display device having a light refraction portion
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Citations (4)

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JPH04359227A (en) * 1991-06-05 1992-12-11 Toshiba Corp Display module device
KR960001852A (en) * 1994-06-07 1996-01-26 카나이 쯔또무 LCD Display
KR970048709A (en) * 1995-12-05 1997-07-29 김광호 Tape Carrier Package with Bypass Capacitor and Liquid Crystal Display Using Same
KR19990075031A (en) * 1998-03-17 1999-10-05 윤종용 Electromagnetic shielding device of liquid crystal display

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04359227A (en) * 1991-06-05 1992-12-11 Toshiba Corp Display module device
KR960001852A (en) * 1994-06-07 1996-01-26 카나이 쯔또무 LCD Display
KR970048709A (en) * 1995-12-05 1997-07-29 김광호 Tape Carrier Package with Bypass Capacitor and Liquid Crystal Display Using Same
KR19990075031A (en) * 1998-03-17 1999-10-05 윤종용 Electromagnetic shielding device of liquid crystal display

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