JPWO2014171028A1 - Light resistance improver - Google Patents

Abstract

Provided is an additive capable of improving or improving the light resistance of a non-fluorinated thermoplastic resin (for example, super engineering plastic such as aromatic polyamide, liquid crystal polyester, and aromatic polyether ketone resin). This additive is composed of a fluorine-containing resin. Such a fluorine-containing resin may be, for example, a fluorine-containing resin having tetrafluoroethylene as a polymerization component, and in particular, a tetrafluoroethylene copolymer (for example, a copolymer of tetrafluoroethylene and other fluorinated olefins). Or a copolymer of tetrafluoroethylene and fluorinated vinyl ether, or a copolymer of tetrafluoroethylene, other fluorinated olefin and fluorinated vinyl ether).

Description

  The present invention provides an additive (or a light resistance (or light stability) of a non-fluorinated thermoplastic resin (for example, super engineering plastic such as aromatic polyamide, liquid crystal polyester, aromatic polyether ketone resin, etc.) that can be improved or improved (or Modifier).

  Super engineer plastics such as aromatic polyamides, liquid crystal polyesters, and aromatic polyetherketone resins (polyaryletherketone resins) are known as very excellent thermoplastic resins in terms of heat resistance and mechanical strength. There may be poor light resistance. For example, in an environment in which light acts, deterioration in various resin characteristics (for example, deterioration of mechanical characteristics, discoloration, etc.) is often observed.

  As a method for improving such light resistance, the addition of general-purpose stabilizers (light stabilizers, antioxidants, etc.) has been studied, but the melting point and molding temperature (molding temperature) of super engineering plastics are Since it is very high, such a general-purpose stabilizer may be thermally decomposed during the molding process, and a sufficient light resistance improvement effect may not be obtained. Moreover, not only mere thermal decomposition, but also a decomposed product of the stabilizer may cause the resin to thicken, resulting in a decrease in thermal stability.

  JP-A-2006-274073 (Patent Document 1) contains (A) 70 to 99% by mass of a polyaryl ketone resin and (B) 30 to 1% by mass of a fluororesin, and is dispersed in the resin composition. (B) The resin composition whose average particle diameter of a fluororesin is 0.1-30 micrometers is disclosed. And in this document, it is described that such a resin composition gives a resin molded article excellent in slidability, solvent resistance and heat resistance.

  In addition, WO2012 / 005133 (Patent Document 2) includes an aromatic polyetherketone resin and a fluororesin for the purpose of improving slidability and impact resistance, and the fluororesins are tetrafluoroethylene and perfluoroethylene. Copolymer with an aromatic unsaturated compound, the mass ratio of the aromatic polyetherketone resin to the fluororesin is 95: 5 to 50:50, and the fluororesin is particulate in the aromatic polyetherketone resin. Dispersed, a resin composition having an average dispersed particle size of fluororesin of 3 μm or less is disclosed.

JP 2006-274073 A (claim, paragraph [0005]) WO2012 / 005133 (Claims, Examples)

  Accordingly, an object of the present invention is to provide an additive capable of improving or improving the light resistance (or light resistance stability) of a non-fluorinated thermoplastic resin (particularly, super engineering plastic).

  Another object of the present invention is to provide an additive capable of maintaining the light resistance improving function even through a melt mixing process at a high temperature.

  A technique for dispersing a fluororesin in an aromatic polyetherketone resin as in the above-mentioned patent document is known, but it has been aimed at improving slidability. In addition, paragraph [0049] of Patent Document 2 has a description that it is excellent in weather resistance, but only describes general characteristics as a fluororesin, and a concept in which weather resistance and light resistance are different. It is.

  Under these circumstances, the present inventors have conducted intensive studies to achieve the above-mentioned problems, and as a result, the fluorine-containing resin is surprisingly light resistant to non-fluorinated thermoplastic resins (for example, super engineering plastics). In particular, in the form of a resin composition added to a non-fluorinated thermoplastic resin, even if it undergoes a melt mixing process at a high temperature, it does not impair the thermal stability, etc. The present invention was completed.

  That is, the light resistance improver (light resistance improver, light resistance imparting agent, light resistance stabilizer) of the present invention is for improving (or improving) the light resistance (or light resistance stability) of the non-fluorinated thermoplastic resin. It is an additive and is composed of a fluorine-containing resin.

  The fluorine-containing resin may be a fluorine-containing resin containing tetrafluoroethylene as a polymerization component. The fluorine-containing resin may be a thermoplastic fluororesin (or a heat-meltable fluororesin). The fluorine-containing resin may typically be a tetrafluoroethylene copolymer, in particular, a copolymer of tetrafluoroethylene and other fluorinated olefins (for example, tetrafluoroethylene and other perfluoroolefins). A copolymer of tetrafluoroethylene and fluorinated vinyl ether (for example, a copolymer of tetrafluoroethylene and perfluoro (alkyl vinyl ether)), and tetrafluoroethylene and other fluorinated olefins. It may be at least one selected from a copolymer with a fluorinated vinyl ether (for example, a copolymer of tetrafluoroethylene, another perfluoroolefin, and perfluoro (alkyl vinyl ether)).

  The non-fluorinated thermoplastic resin may be a super engineering plastic (for example, a super engineering plastic having a glass transition temperature of 100 ° C. or higher), and is particularly selected from aromatic polyamide, liquid crystal polyester, and aromatic polyether ketone resin. Alternatively, it may be at least one [for example, aromatic polyetherketone resin (for example, polyetheretherketone)].

  The present invention also includes a resin composition composed of a non-fluorinated thermoplastic resin and the light resistance improver (fluorine-containing resin). Moreover, the molded object formed with such a resin composition is also contained in this invention.

  Furthermore, in the present invention, the light resistance improver (fluorine-containing resin) is added (or mixed) to the non-fluorinated thermoplastic resin to improve the light resistance (or light resistance stability) of the non-fluorinated thermoplastic resin. A method of (or improvement) is also included.

  According to the additive of the present invention, the light resistance of the non-fluorinated thermoplastic resin can be improved or improved. Moreover, even if such an additive undergoes a melt-mixing process at a high temperature, it does not cause decomposition or thickening associated therewith, so that the light resistance can be improved or improved. Therefore, in particular, the additive of the present invention is a super engineering such as a non-fluorine thermoplastic resin that requires molding or processing at a high temperature, for example, an aromatic polyamide, a liquid crystal polyester, an aromatic polyether ketone resin, etc. It can be suitably applied to plastics.

  In addition, since the additive of the present invention is resinous, it can suppress the deterioration of the resin characteristics of the non-fluorinated thermoplastic resin. Depending on the resin characteristics, the excellent characteristics derived from the fluorine-containing resin can be obtained. It can also be applied to a plastic resin. In addition, bleeding and the like can be suppressed at a high level. Therefore, the additive of the present invention is very useful and practical.

  The additive (light resistance improver, light resistance improver, light resistance imparting agent) of the present invention is an additive for improving or improving the light resistance of a non-fluorinated thermoplastic resin, and is composed of a fluorine-containing resin. ing.

[Fluorine-containing resin]
The fluorine-containing resin (fluorine resin) is not particularly limited as long as it is a fluorine-containing resin (or fluorine-substituted resin), and examples thereof include a resin (polymer) having a fluorine-containing monomer as a polymerization component.

  Specific examples of the resin having a fluorine-containing monomer as a polymerization component (fluorine-containing resin) include a fluorine-containing monomer alone or a copolymer, a copolymer of a fluorine-containing monomer and a copolymerizable monomer, and the like.

Examples of fluorine-containing monomers include fluorinated olefins [or fluorine-containing olefins or fluorine-substituted olefins such as fluorinated chain olefins such as vinyl fluoride, vinylidene fluoride, tetrafluoroethylene, chlorotrifluoroethylene, and hexafluoropropylene. (E.g., fluorinated _C2-6 olefins, preferably fluorinated _C2-4 olefins, more preferably perfluoro _C2-4 olefins)], fluorinated vinyl ethers [or fluorine-containing vinyl ethers or fluorine-substituted vinyl ethers, for example, Fluorinated alkyl vinyl ethers such as perfluoro (methyl vinyl ether), perfluoro (ethyl vinyl ether), perfluoro (propyl vinyl ether) (eg fluorinated C _1-6 alkyl vinyl ether, preferred Or fluorinated C _1-4 alkyl vinyl ether, more preferably perfluoro C _1-4 alkyl vinyl ether)], fluorinated allyl ether [or fluorine-containing allyl ether or fluorine-substituted allyl ether such as perfluoro (alkyl allyl ether). Fluorinated alkyl allyl ethers such as fluorinated C _1-6 alkyl allyl ether, preferably fluorinated C _1-4 alkyl allyl ether, more preferably perfluoro C _1-4 alkyl allyl ether], fluorine And containing dioxole monomers [for example, 2,2-bis (trifluoromethyl) -4,5-difluoro-1,3-dioxole, etc.] and the like.

  The fluorine-containing monomers may be used alone or in combination of two or more.

Among these fluorine-containing monomers, perfluoromonomer, for example, perfluoroolefin (for example, perfluoro C _2-4 olefin such as tetrafluoroethylene, hexafluoropropylene), perfluorovinyl ether [for example, perfluoro (propyl vinyl) Perfluoro (C _1-6 alkyl vinyl ether) and the like].

  Therefore, the fluorine-containing monomer may be composed of a perfluoromonomer. In such a case, the ratio of the perfluoromonomer to the whole fluorine-containing monomer can be selected from the range of 10% by weight or more (for example, 20% by weight or more), for example, 30% by weight or more (for example, 40% by weight or more), Preferably, it may be 50% by weight or more (eg, 60% by weight or more), more preferably 70% by weight or more (eg, 75% by weight or more), particularly 80% by weight or more (eg, 90% by weight or more).

The copolymerizable monomer (other copolymerizable monomer, copolymerizable monomer not containing fluorine) is not particularly limited as long as it can be copolymerized. For example, olefins [for example, chain olefins such as ethylene and propylene, etc. (For example, C _2-6 olefin, preferably C _2-4 olefin)], halogenated olefins other than fluorine (for example, chloride or bromide C _2-4 olefins such as vinyl chloride and vinyl bromide), and the like. . The copolymerizable monomers may be used alone or in combination of two or more.

  In the copolymer of the fluorine-containing monomer and the copolymerizable monomer, the proportion of the copolymerizable monomer is, for example, 30 parts by weight or less (for example, 0.01 to 30% by weight) with respect to 100 parts by weight of the fluorine-containing monomer. Part), preferably 20 parts by weight or less (for example, 0.03 to 15 parts by weight), more preferably 10 parts by weight or less (for example, 0.05 to 5 parts by weight).

Typical fluorine-containing resins include polyfluorinated olefins (eg, polytetrafluoroethylene), fluorinated olefin copolymers {eg, fluorinated olefin copolymers [eg, tetrafluoroethylene and hexafluoropropylene Copolymers of tetrafluoroethylene and other fluorinated olefins (particularly, perfluoroolefins, preferably perfluoro C _3-4 olefins), copolymers of fluorinated olefins and fluorinated vinyl ethers, etc. [For example, tetrafluoroethylene and fluorinated vinyl ether such as a copolymer of tetrafluoroethylene and perfluoro (propyl vinyl ether) (particularly perfluoro (alkyl vinyl ether), preferably perfluoro (C _1-6 alkyl vinyl ether)) Copolymer with Tetrafluoroethylene and other fluorinated olefins such as copolymers of tetrafluoroethylene, hexafluoropropylene and perfluoro (propyl vinyl ether) (in particular, perfluoroolefins, preferably perfluoro C _3-4 olefins) and fluoride Vinyl ether (particularly a copolymer with perfluoro (alkyl vinyl ether), preferably perfluoro (C _1-6 alkyl vinyl ether)), etc.].

Among these, fluorine-containing resins containing tetrafluoroethylene as a polymerization component, for example, polytetrafluoroethylene, tetrafluoroethylene and other fluorinated olefins (particularly perfluoroolefin, preferably perfluoroC _3-4 olefin) Copolymer of tetrafluoroethylene and fluorinated vinyl ether (especially perfluoro (alkyl vinyl ether), preferably perfluoro (C _1-6 alkyl vinyl ether)), tetrafluoroethylene and other fluorinated olefins Copolymer of (especially perfluoroolefin, preferably perfluoro C _3-4 olefin) and fluorinated vinyl ether (particularly perfluoro (alkyl vinyl ether), preferably perfluoro (C _1-6 alkyl vinyl ether)) Is preferred.

  Preferred fluorine-containing resins also include thermoplastic fluorine-containing resins (or heat-meltable fluorine resins). Such thermoplastic fluororesin does not contain polytetrafluoroethylene. The thermoplastic fluorine-containing resin is easily dispersed (finely dispersed) in a non-fluorinated thermoplastic resin with a relatively small particle size, or the light resistance improving function is efficiently imparted to the non-fluorinated thermoplastic resin (or Expression).

  From such a viewpoint, particularly preferred fluorine-containing resins include tetrafluoroethylene copolymers such as copolymers of tetrafluoroethylene and other fluorinated olefins, copolymers of tetrafluoroethylene and fluorinated vinyl ethers. And copolymers of tetrafluoroethylene, other fluorinated olefins, and fluorinated vinyl ethers.

  In the tetrafluoroethylene copolymer, the proportion of tetrafluoroethylene is 30% by weight or more (for example, the total amount of tetrafluoroethylene copolymer (or the total amount of tetrafluoroethylene and non-tetrafluoroethylene monomer) (for example, 40 to 99.9% by weight), for example, 50% by weight or more (for example 55 to 99.5% by weight), preferably 60% by weight or more (for example 65 to 99% by weight), more preferably May be 70% by weight or more (for example, 75 to 98% by weight), particularly 80% by weight or more (for example, 85 to 95% by weight).

  The fluorine-containing resin may be a resin that has been surface-treated (for example, plasma treatment, fluorine gas treatment, ammonia treatment, etc.).

  When the fluorine-containing resin has a melting point, the melting point is not particularly limited, but is, for example, about 400 ° C. or less (for example, 200 to 380 ° C.), preferably about 230 to 350 ° C. (for example, 250 to 300 ° C.) Also good. Further, the fluorine-containing resin may be a resin that melts at the melting temperature of the non-fluorinated thermoplastic resin described later.

[Light resistance improver and resin composition]
The light resistance improver (fluorine-containing resin) of the present invention can be used as an additive for improving or improving the light resistance of a non-fluorinated thermoplastic resin.

  Non-fluorinated thermoplastic resins (sometimes referred to as fluorine-free thermoplastic resins, simply thermoplastic resins, resins, etc.) are not particularly fluorine-containing resins (resins that do not belong to the category of fluorine-containing resins). Without limitation, for example, non-fluorine-based halogen-containing resins (for example, chlorine-containing resins such as polyvinyl chloride and polyvinylidene polyene), styrene-based resins (for example, styrene copolymers such as polystyrene and AS resin), acrylic resins (For example, polymethyl methacrylate), olefin resin [for example, chain olefin resin (polyethylene, polypropylene, polymethylpentene, etc.), cyclic olefin resin (so-called COP, COC, etc.)], polyacetal resin, polycarbonate resin (for example, , Aromatic polycarbonate, etc.), polyester Resin [eg, aliphatic polyester resin (eg, polylactic acid), aromatic polyester resin (eg, polyarylate, liquid crystal polyester)], polyamide resin [eg, aliphatic polyamide (eg, polyamide 6, polyamide 66, polyamide 610, polyamide) 11, polyamide 12 etc.), aromatic polyamide etc.], polyphenylene ether resin (polyphenylene ether, modified polyphenylene ether etc.), polyether ketone resin (polyaryl ether ketone resin or aromatic polyether ketone resin etc.), polysulfone resin (polysulfone etc.) , Polyethersulfone, etc.), polyimide resin (polyimide, polyamideimide, polyetherimide, etc.), polyphenylene sulfide resin (polyphenylene sulfide, etc.), polyketo (Such as polyketone sulfide) sulfide resin, polybenzimidazole resin (polybenzimidazole, etc.) and the like.

  The thermoplastic resin may be a crystalline resin or an amorphous resin.

  The thermoplastic resins may be used alone or in combination of two or more.

  Among these thermoplastic resins, resins classified as engineering plastics (particularly super engineering plastics), such as polyarylate (PAR), liquid crystal polyester (or liquid crystal polymer, LCP), aromatic polyamide [for example, semi-aromatic polyamide (Polyamide etc. using aromatic dicarboxylic acid component or aromatic diamine component as polymerization component), wholly aromatic polyamide etc.], aromatic polyether ketone resin, polysulfone (PSU), polyether sulfone (PES), polyimide (PI) , Polyamideimide (PAI), polyetherimide (PEI), polyphenylene sulfide (PPS), polyketone sulfide, polybenzimidazole (PBI) and the like.

  Among these, in the present invention, aromatic polyamide, liquid crystal polyester, and aromatic polyetherketone resin are preferable, and aromatic polyetherketone resin can be preferably used from the viewpoint of dispersibility of fluorine-containing resin. Hereinafter, the aromatic polyamide, the liquid crystal polyester, and the aromatic polyether ketone resin will be described in detail.

(Aromatic polyamide)
Examples of the aromatic polyamide include polyamides in which at least one component (for example, dicarboxylic acid component) is an aromatic component among a diamine component and a dicarboxylic acid component which are polymerization components. Such an aromatic polyamide may be a wholly aromatic polyamide [for example, a polyamide having an aromatic diamine component (such as a component described below) and an aromatic dicarboxylic acid component (such as a component described below) as a polymerization component] Semi-aromatic polyamides [for example, one of the diamine component and dicarboxylic acid component (for example, an aromatic dicarboxylic acid component) a polyamide containing an aromatic component] may be used, and a semi-aromatic polyamide is particularly suitable. May be used.

Examples of the diamine component constituting the aromatic polyamide include an aliphatic diamine component [alkane diamine (for example, ethylene diamine, propylene diamine, butylene diamine, hexamethylene diamine, methyl pentane diamine, 2-methyl propane diamine, 3-methyl propane diamine). , Octamethylene diamine, nonamethylene diamine, decane diamine, C _2-14 alkane diamine such as dodecane diamine, etc.)], alicyclic diamine components [for example, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, 1 , _{2-diamino-C 5-8} cycloalkane such as diaminocyclohexane; 1,3-di (aminomethyl) cyclohexane, 1,4-di (aminomethyl) cyclohexane, 1,2-di (aminomethyl) Shikurohe Di include San (amino _{C 1-4 alkyl) C 5-8} cycloalkane; 4,4'-diamino-di-cyclohexylene methane, 4,4'-diamino-3,3'-dimethyl-cyclohexylene methane, 4, Di (amino C _5-8 cycloalkyl) C _1-4 alkanes such as 4′-diaminodicyclohexylenepropane; isophoronediamine, etc.], aromatic diamine components [eg, benzenediamine (eg, p-phenylenediamine, etc.), Naphthalenediamine (for example, 1,5-diaminonaphthalene, etc.), diaminobiphenyl (for example, 4,4′-diaminobiphenyl), di (aminoalkyl) arene (for example, di (aminoC _1-4 alkyl) such as xylylenediamine ) Benzene etc.] The diamine component may be used alone or in combination of two or more. It may be.

Examples of the dicarboxylic acid component constituting the aromatic polyamide include aliphatic dicarboxylic acid components (for example, succinic acid, propanenic acid, butanenic acid, pentatanic acid, adipic acid, heptanenic acid, octatannic acid, nonannic acid, decannic acid, dodecanniic acid, Acid, C _2-20 alkanedicarboxylic acid such as undecanoic acid), alicyclic dicarboxylic acid (for example, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, hexahydrophthalic anhydride Acid, 3-methyl-hexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, 3-methylhexahydrophthalic acid, C- _5-10 cycloalkanedicarboxylic acid such as 4-methylhexahydrophthalic acid), aromatic Dicarboxylic acid components (eg phthalic acid, Refutaru acid, isophthalic acid, C _6-10 array Nji carboxylic acids such as naphthalene dicarboxylic acid) and the like. These dicarboxylic acid components may be used alone or in combination of two or more.

  Typical semi-aromatic polyamides include dicarboxylic acid components including an aromatic dicarboxylic acid component (particularly, an aromatic dicarboxylic acid component including at least a terephthalic acid component) and a diamine component [an aliphatic diamine component (for example, hexamethylenediamine). And diamine components containing at least a non-aromatic diamine component such as nonamethylene diamine] and the like, and polyamides such as polyphthalamide (PPA).

  In such a semi-aromatic polyamide, the aromatic dicarboxylic acid component and / or the diamine component may be used alone or in combination of two or more. For example, the aromatic dicarboxylic acid component may be a combination of a terephthalic acid component and another aromatic dicarboxylic acid component (such as an isophthalic acid component). Further, an aromatic dicarboxylic acid component and a non-aromatic dicarboxylic acid component (for example, an aliphatic dicarboxylic acid component such as adipic acid) may be combined. Furthermore, when combining an aromatic dicarboxylic acid component and a non-aromatic dicarboxylic acid component, the ratio of the aromatic dicarboxylic acid component to the entire dicarboxylic acid component is, for example, 30 mol% or more (for example, 35 to 99 mol%), preferably May be 40 mol% or more (for example, 45 to 97 mol%), more preferably 50 mol% or more (for example, 60 to 95 mol%).

(Liquid crystal polyester)
The liquid crystal polyester (liquid crystal polymer) may be a wholly aromatic liquid crystal polymer or a semi-aromatic liquid crystal polymer, and particularly preferably a wholly aromatic liquid crystal polymer.

  Further, the liquid crystal polyester only needs to have at least a liquid crystal polyester unit, and a liquid crystal polyester (for example, liquid crystal polyester ether, liquid crystal polyester) having other units (or bonds such as an ether unit, an amide unit, and a carbonate unit). Amide, liquid crystal polyester carbonate, etc.).

  As a polymerization component (polycondensation component, monomer) constituting the liquid crystal polyester, for example, an aromatic hydroxycarboxylic acid component [for example, hydroxybenzoic acid (p-hydroxybenzoic acid, m-hydroxybenzoic acid, o-hydroxybenzoic acid) , Hydroxyarene carboxylic acids such as hydroxy naphthoic acid (eg 6-hydroxy-2-naphthoic acid, 5-hydroxy-2-naphthoic acid), hydroxyphenyl benzoic acid (eg 4′-hydroxyphenyl-4-benzoic acid, 3′-hydroxyphenyl-4-benzoic acid)], aromatic dicarboxylic acid components [eg, benzenediol (eg, terephthalic acid, isophthalic acid, etc.), naphthalene dicarboxylic acid (eg, 2,6-naphthalenedicarboxylic acid, 1 , 4-naphthalenedicarboxylic acid, etc.), dicarbo Cibiphenyl (for example, 4,4′-dicarboxyphenyl, etc.), diphenyl ether dicarboxylic acid (for example, diphenyl ether-4,4′-dicarboxylic acid, etc.), etc., aromatic diol component [for example, benzene diol (for example, hydroquinone, etc.) ), Dihydroxynaphthalene (such as 2,6-dihydroxynaphthalene), dihydroxybiphenyl (such as 4,4′-hydroxybiphenyl), dihydroxydiphenyl ether (such as 4,4′-dihydroxydiphenyl ether), etc.], aromatic hydroxy Amine components [e.g., aminophenol (e.g., p-aminophenol, etc.), aminonaphthol (e.g., 4-amino-1-naphthol, etc.), aminohydroxybiphenyl (e.g., 4-amino-4 ' Hydroxybiphenyl etc.)], aromatic diamine components [eg benzenediamine (eg p-phenylenediamine etc.), naphthalenediamine (eg 1,5-diaminonaphthalene etc.), diaminobiphenyl (eg 4,4′- Diaminobiphenyl), etc.], aromatic aminocarboxylic acid components [eg, aminobenzoic acid (eg, p-aminobenzoic acid, etc.), aminonaphthoic acid (eg, 6-aminonaphthoic acid, etc.), etc.] Bifunctional aromatic component).

  The aromatic component may have a substituent (for example, an alkyl group, an alkoxy group, a halogen atom, etc.). In addition, aromatic components include reactive derivatives [eg, compounds in which a hydroxyl group is substituted with an acyloxy group, carboxyl groups in an ester group (eg, alkylcarbonyl group, aryloxycarbonyl group, etc.) or acid halide groups (eg, chloro And a compound substituted with an acylamino group).

  These aromatic components may be used alone or in combination of two or more.

In addition, the polymerization component usually only needs to contain at least these aromatic components, and non-aromatic components {for example, aliphatic diol components (for example, C _2-10 such as ethylene glycol and 1,4-butanediol). Alkanediol), polyester components [eg, polyester components containing an aliphatic skeleton such as polyalkylene arylates (eg, poly C _2-4 alkylene C _6-10 arylates such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate), A trifunctional or higher functional component [for example, an aromatic hydroxydicarboxylic acid component (for example, hydroxyisophthalic acid, hydroxynaphthalenedicarboxylic acid, etc.), etc.] may be included. These components may be used alone or in combination of two or more.

  Specific examples of the liquid crystal polyester include (i) an aromatic hydroxycarboxylic acid component (for example, hydroxybenzoic acid component), an aromatic dicarboxylic acid component (for example, benzenedicarboxylic acid component, naphthalenedicarboxylic acid, etc.), An aromatic diol component (eg, dihydroxybiphenyl), a polycondensate with at least one component selected from aromatic hydroxyamines and aromatic diamines, (ii) two or more aromatic hydroxycarboxylic acid components [eg, A polycondensation product of a hydroxybenzoic acid component and another aromatic hydroxycarboxylic acid component (for example, a hydroxynaphthoic acid component), (iii) an aromatic hydroxycarboxylic acid component (for example, a hydroxybenzoic acid component), and an aromatic Dicarboxylic acid components (eg benzene dicarboxylic acid components, A motor such as a dicarboxylic acid) include liquid crystal polyester and the polyester component (e.g., a polyalkylene arylate etc.) and at least polymerization component an aromatic hydroxycarboxylic acid component such as polycondensates of.

  The liquid crystal polyester may usually be a liquid crystal polyester having at least a hydroxybenzoic acid component as a polymerization component, and in particular, a liquid crystal polyester having a hydroxybenzoic acid component and another polymerization component as a polymerization component. In the liquid crystal polyester containing such other polymerization component as a polymerization component, the ratio of the hydroxybenzoic acid component (such as 4-hydroxybenzoic acid component) to the entire polymerization component is, for example, 10 to 95 mol%, preferably 20 to 90%. It may be about mol%, more preferably about 30 to 80 mol%.

(Aromatic polyether ketone resin)
Aromatic polyetherketone resins (polyaryletherketone resins) usually contain a repeating unit composed of an arylene group, an ether group [—O—], and a carbonyl group [—C (═O) —]. There are many cases. Although it does not restrict | limit especially as such resin, For example, the repeating unit represented by either of following formula (a1)-(a5) may be included.
[—Ar—O—Ar—C (═O) —] (a1)
[—Ar—O—Ar—C (═O) —Ar—C (═O) —] (a2)
[—Ar—O—Ar—O—Ar—C (═O) —] (a3)
[—Ar—O—Ar—C (═O) —Ar—O—Ar—C (═O) —Ar—C (═O) —] (a4)
[—Ar—O—Ar—O—Ar—C (═O) —Ar—C (═O) —] (a5)
(In the formula, Ar represents a divalent aromatic hydrocarbon ring group which may have a substituent)
Examples of the divalent aromatic hydrocarbon ring group represented by Ar include a C _6-10 arylene group such as a phenylene group (such as o-, m- or p-phenylene group) and a naphthylene group, a biphenylene group (2 , 2'-biphenylene group, 3,3'-biphenylene, 4,4'-biphenylene group) bicycloalkyl _{C 6-10} arylene group such as, o-, terpolymers _{C 6,} such as m- or p- terphenylene Examples thereof include a _-10 arylene group. These aromatic hydrocarbon ring groups are substituted with, for example, a halogen atom, an alkyl group (a linear or branched C _1-4 alkyl group such as a methyl group), a haloalkyl group, a hydroxyl group, an alkoxy group ( A linear or branched C _1-4 alkoxy group such as a methoxy group), a mercapto group, an alkylthio group, a carboxyl group, a sulfo group, an amino group, an N-substituted amino group, a cyano group, etc. Good. In the repeating units (a1) to (a5), the types of Ar may be the same as or different from each other.

  Preferred Ar is a phenylene group (for example, p-phenylene group) or a biphenylene group (for example, 4,4'-biphenylene group).

  Examples of the resin having a repeating unit (a1) include polyether ketone (for example, “PEEK-HT” manufactured by Victrex). Examples of the resin having the repeating unit (a2) include polyether ketone ketone (for example, “PEKK” manufactured by Arkema + Oxford Performance Material). As the resin having the repeating unit (a3), polyether ether ketone (for example, “VICTREX PEEK” manufactured by Victrex, “Vestakeep (registered trademark)” manufactured by Evonik, “Vestakeep-J” manufactured by Daicel-Evonik, Solvay Advanced Examples include "Ketaspire (registered trademark)" manufactured by Polymers, and polyether-diphenyl-ether-phenyl-ketone-phenyl (for example, "Kadel (registered trademark)" manufactured by Solvay Advanced Polymers). Examples of the resin having the repeating unit (a4) include polyether ketone ether ketone ketone (for example, “VICTREX ST” manufactured by Victrex). Examples of the resin having the repeating unit (a5) include polyether ether ketone ketone.

  In the repeating unit composed of an arylene group, an ether group and a carbonyl group, the ratio of the ether segment (E) to the ketone segment (K) is, for example, the former / the latter (E / K) = 0.5 / 1 2/1, preferably about 1/1 to 2/1. The ether segment imparts flexibility to the molecular chain, and the ketone segment imparts rigidity to the molecular chain, so the more the ether segment, the faster the crystallization rate and the higher the crystallinity that can ultimately be reached. As the number of segments increases, the glass transition temperature and melting point tend to increase.

  Among aromatic polyetherketone resins, aromatic polyetherketone resins having any one of the repeating units (a1) to (a3), particularly the balance between the glass transition temperature and the high melting point, and the high crystallization rate. From the viewpoint of superiority, an aromatic polyetherketone resin (for example, polyetheretherketone) having a repeating unit (a3) is preferable.

  As the aromatic polyether ketone resin, commercially available products as described above may be used, and a conventional method (for example, a method of condensing an aromatic diol component and an aromatic dihalide component, an aromatic monohalide monool, or the like). You may utilize what was synthesize | combined by the method using nucleophilic substitution reactions, such as the method of carrying out the self-condensation of a component.

  Examples of the aromatic diol component include dihydroxybenzene (such as hydroquinone) and dihydroxybenzophenone (such as 4,4'-dihydroxybenzophenone). Examples of the aromatic dihalide component include dihalobenzophenone (such as 4,4'-difluorobenzophenone and 4,4'-dichlorobenzophenone). Examples of the aromatic monohalide monool component include halo-hydroxybenzophenone (such as 4-fluoro-4'-hydroxybenzophenone).

  The condensation reaction may be performed in the presence of a base and / or a solvent. Examples of the base include alkali metal salts such as alkali metal carbonates such as (anhydrous) potassium carbonate. Examples of the solvent include high boiling point solvents such as diphenyl sulfone and sulfolane. The reaction temperature may be, for example, about 150 to 400 ° C, preferably about 200 to 350 ° C.

  The reaction product can be separated and purified by conventional separation means such as filtration, concentration, crystallization, chromatography and the like. The reaction product may be washed and dried as necessary. Examples of the cleaning solvent include water, alcohols (such as methanol and ethanol), ketones (such as acetone), and mixed solvents thereof. Further, the solid reaction product may be pulverized or classified to adjust the particle size.

  The terminal group (such as a halogen atom) of the reaction product may be modified with, for example, an alkali sulfonate group (such as a lithium sulfonate group, a sodium sulfonate group, or a potassium sulfonate group) from the viewpoint of adjusting the crystallization temperature. .

  The number average molecular weight of the thermoplastic resin is not particularly limited. For example, in gel permeation chromatography (GPC), it is 5,000 or more (for example, 5,000 to 1,000,000), preferably 8 in terms of polystyrene. 5,000 or more (for example, 10,000 to 500,000), more preferably 15,000 or more (for example, 20,000 to 100,000).

  The glass transition temperature (Tg) and melting point of the thermoplastic resin are not particularly limited and can be appropriately selected according to the type of the resin. For example, when the thermoplastic resin is a highly heat-resistant resin such as engineering plastic (particularly super engineering plastic), the glass transition temperature is 60 ° C. or higher (for example, 65 to 250 ° C.), preferably 70 ° C. or higher ( For example, 85-230 degreeC), More preferably, 80 degreeC or more (for example, 85-200 degreeC) may be sufficient, and 100 degreeC or more may be sufficient especially. In particular, the glass transition temperature (Tg) of the aromatic polyetherketone resin may be, for example, 100 ° C. or higher, preferably 120 to 200 ° C., more preferably about 140 to 180 ° C.

  In addition, when the thermoplastic resin is a highly heat-resistant resin (crystalline resin) such as engineering plastic (particularly super engineering plastic), the melting point is selected from a range of 150 ° C. or higher (for example, 180 to 450 ° C.). Preferably, it may be 200 ° C. or higher (for example, 230 to 430 ° C.), more preferably 250 ° C. or higher (for example, 270 to 400 ° C.). In particular, the melting point of the aromatic polyether ketone resin may be, for example, 300 ° C. or higher, preferably 310 to 400 ° C., more preferably about 320 to 380 ° C.

  The glass transition temperature and the melting point can be measured, for example, by differential scanning calorimetry (DSC).

  Although the melt viscosity of the thermoplastic resin is not particularly limited, it may be preferable that the thermoplastic resin has an appropriate viscosity from the viewpoint of efficiently dispersing the fluorine-containing resin and obtaining a sufficient light resistance improvement function. is there.

From such a viewpoint, for example, when the melt viscosity at 400 ° C. and a shear rate of 60 s ⁻¹ of the aromatic polyetherketone resin is Va, Va is, for example, 50 to 4000 Pa · s, preferably 100 to 3000 Pa · s. More preferably, it may be about 150 to 2500 Pa · s, particularly about 200 to 2000 Pa · s. The melt viscosity can be measured using a conventional apparatus such as a capillary rheometer.

From the viewpoint of dispersibility, it may be preferable to appropriately adjust the melt viscosity ratio between the thermoplastic resin and the fluorine-containing resin. For example, when a predetermined temperature of the fluorine-containing resin [for example, a temperature during melt mixing such as a cylinder temperature in an extruder (eg, 390 ° C.)] and a melt viscosity at a shear rate of 60 s ⁻¹ is Vb, a thermoplastic resin and fluorine The melt viscosity ratio with the containing resin is, for example, Va / Vb = 0.05 / 1 to 10/1, preferably 0.1 / 1 to 8/1, more preferably 0.2 / 1 to 7/1. In particular, the combination of both components may be selected so as to be about 0.3 / 1 to 6/1 (for example, about 0.3 / 1 to 5/1).

  The use ratio (addition ratio) of the additive (light resistance improver) of the present invention is, for example, 0.1 to 300 parts by weight (for example, 0.5 to 200 parts by weight) with respect to 100 parts by weight of the thermoplastic resin. 1 to 150 parts by weight, preferably 3 to 100 parts by weight, more preferably 5 to 90 parts by weight, and even more preferably 7 to 80 parts by weight (for example, 10 to 70 parts by weight). May be.

  In particular, since the additive of the present invention can obtain a sufficient light resistance improvement effect even at a small ratio, the use ratio (addition ratio) of the light resistance improver is set to, for example, 100 parts by weight of a thermoplastic resin. On the other hand, 20 parts by weight or less (for example, 1 to 18 parts by weight), preferably 15 parts by weight or less (for example, 2 to 12 parts by weight), more preferably about 10 parts by weight or less (for example, 3 to 8 parts by weight). It can also be.

  On the other hand, since the light resistance improver of the present invention is in the form of a resin, even if it is in a relatively large proportion, the light resistance improvement effect can be obtained efficiently without causing bleeding. Therefore, in a case where it is preferable to positively impart the properties derived from the fluorine-containing resin to the thermoplastic resin, the usage ratio of the light resistance improver is 20 parts by weight or more (100 parts by weight of the thermoplastic resin). For example, 20 to 200 parts by weight), preferably 25 parts by weight or more (for example, 27 to 150 parts by weight), more preferably about 30 parts by weight or less (for example, 35 to 100 parts by weight).

  In addition, the volume ratio (volume use ratio) of the fluorine-containing resin (or a dispersed phase described later) is 0.1 to 95% (for example, 0.3%) with respect to the total amount of the non-fluorinated thermoplastic resin and the fluorine-containing resin. -90%), for example, 0.5-85% (eg, 0.7-80%), preferably 1-70% (eg, 1.5-60%), more preferably It may be about 2 to 60% (for example, 2.5 to 50%), particularly about 3 to 45% (for example, 4 to 40%).

  As described above, a resin (resin composition) with improved (or imparted or expressed) light resistance can be obtained by the light resistance improver of the present invention. The present invention also includes such a resin composition, that is, a resin composition containing a thermoplastic resin (non-fluorinated thermoplastic resin) and a light resistance improver (fluorine-containing resin).

  In such a resin composition, the type of thermoplastic resin and light resistance improver (fluorine-containing resin) and the mixing ratio thereof can be selected from the same ranges as described above.

  If necessary, the resin composition may contain other additives as long as the effects of the present invention are not impaired. Other additives include, for example, stabilizers (heat stabilizers, light stabilizers, etc.), fillers [eg, glass fiber, glass powder, carbon fiber, carbon powder, carbon nanotube, metal oxide (aluminum oxide, zinc oxide) Etc.), inorganic fillers such as metal nitrides (aluminum nitride, boron nitride, etc.)], plasticizers, lubricants, colorants and the like. These other additives can be used alone or in combination of two or more.

  In particular, the resin composition may suitably contain a filler (or reinforcing material).

  The filler (or filler) may be any of a fibrous shape, a needle shape (whisker), a particle shape, a plate shape, and the like, but a fibrous shape or a needle shape is particularly preferable.

  Examples of the fibrous filler include inorganic fibers (for example, glass fibers, carbon fibers, boron fibers, activated carbon fibers, aluminosilicate fibers, aluminum oxide fibers, silicon carbide fibers, metal fibers, potassium titanate fibers, etc.), organic Examples thereof include fibers (for example, aramid fibers, liquid crystal polyester fibers, etc.). Examples of the acicular filler include silicate (such as wollastonite), potassium titanate whisker, aluminum borate whisker, aluminum oxide whisker, and calcium carbonate whisker. The fillers may be used alone or in combination of two or more.

  Among these, from the viewpoint of light resistance in combination with non-fluorinated thermoplastic resins (and fluorine-containing resins), glass fibers, needle-like fillers, and the like may be preferably used. These fillers are also suitable from the viewpoint of maintaining rigidity and strength of the thin-walled portion.

  The filler may be surface-treated with a surface treatment agent for the purpose of improving dispersibility in the thermoplastic resin. Examples of the surface treatment agent include organic surface treatment agents [eg, coupling agents (eg, silane coupling agents, titanium coupling agents, etc.), resins (eg, acrylic resins, urethane resins, epoxy resins, etc.), etc.] Etc. The surface treatment agents may be used alone or in combination of two or more.

  The ratio of the other additive can be selected according to the type and the like. For example, the ratio of the filler is, for example, 0.5 to 200 parts by weight (for example, 0.7 to 100 parts by weight with respect to 100 parts by weight of the thermoplastic resin). 150 parts by weight), and may be 1 to 100 parts by weight, preferably 3 to 80 parts by weight, more preferably 5 to 60 parts by weight, and particularly about 10 to 50 parts by weight.

  Moreover, the ratio of a filler can be selected from the range of about 0.3-150 weight part (for example, 0.5-120 weight part) with respect to 100 weight part of total amounts of a thermoplastic resin and a fluorine-containing resin, The amount may be about 100 parts by weight, preferably 2 to 80 parts by weight, more preferably 3 to 60 parts by weight, particularly about 5 to 50 parts by weight (for example, 8 to 40 parts by weight).

The melt viscosity of the resin composition can be appropriately selected according to the type of the thermoplastic resin. For example, when the thermoplastic resin is an aromatic polyetherketone resin, the melt viscosity at a temperature of 400 ° C. and a shear rate of 60 s ⁻¹ is For example, it may be 50 to 4000 Pa · s, preferably 100 to 3000 Pa · s, more preferably about 150 to 2500 Pa · s.

  The resin composition may have a phase separation structure. In the case of having such a phase separation structure, either the thermoplastic resin or the light resistance improver may form a continuous phase or a dispersed phase. Whether to form a continuous phase or a dispersed phase is determined by the type of thermoplastic resin and the addition ratio (mixing ratio) of the light resistance improver, etc., but usually the thermoplastic resin has a continuous phase. It may be formed (or configured), and the light resistance improver (fluorine-containing resin) may form (or configure) the dispersed phase. The dispersed phase may have an isotropic shape or an anisotropic shape.

  The average particle size of the dispersed phase is, for example, 300 μm or less (for example, 0.01 to 250 μm), preferably 200 μm or less (for example, 0.03 to 150 μm), and more preferably 100 μm or less (for example, 0.05 to 70 μm). It may be. In particular, depending on the type of resin, it may be preferable to reduce (that is, finely disperse) the average particle size of the dispersed phase in order to obtain an effect of improving light resistance efficiently. In such a case, the average particle size of the dispersed phase can be selected from a range of 30 μm or less (for example, 10 μm or less), 5 μm or less, for example, 3 μm or less (for example, 2 μm or less), preferably 1 μm or less (for example, 0.1 μm or less). 7 μm or less), more preferably 0.6 μm or less (for example, about 0.01 to 0.5 μm), 0.5 μm or less, preferably 0.4 μm or less, more preferably 0.3 μm or less. May be. In the case of such an average particle size of 3 μm or less, the maximum particle size of the dispersed phase is, for example, 4 μm or less, preferably 3 μm or less (for example, 2 μm or less), more preferably 1 μm or less (for example, 0.8 μm or less). There may be.

  The average interparticle distance of the dispersed phase (for example, fluorine-containing resin) can be selected from a range of about 200 μm or less (for example, 150 μm or less, preferably 100 μm or less), usually 30 μm or less (for example, 20 μm or less). 10 μm or less (for example, 7 μm or less), preferably 5 μm or less (for example, 0.01 to 4 μm), more preferably 3 μm or less (for example, 0.1 to 2.5 μm), especially 2 μm or less (for example, 0.2 to 1.5 μm).

  In this way, by adjusting the particle diameter and interparticle distance (and volume ratio) of the dispersed phase, a high light resistance improvement effect may be obtained more efficiently.

  In addition, the particle diameter and the interparticle distance [further ratio (weight ratio and / or volume ratio)] of the dispersed phase are determined by using a conventional apparatus [transmission electron microscope (TEM), scanning type] for the sheet formed of the resin composition. The electron microscope (SEM), laser microscope, atomic force microscope (AFM), etc.] can be observed with a microscope, and the obtained image can be measured by binarizing with an optical analyzer.

  The method for producing the resin composition (or the method for adding or using the light resistance improver) is not particularly limited, but a thermoplastic resin and a light resistance improver (fluorine-containing resin) are mixed (the light resistance is improved in the thermoplastic resin). It can be produced by adding or mixing an agent. In addition, you may disperse | distribute a light resistance improver in a thermoplastic resin with mixing as above-mentioned. Specifically, the resin composition may be usually prepared by melt-kneading each component. More specifically, each component is premixed with a mixer (a tumbler, a V-type blender, a Henschel mixer, a Nauta mixer, a ribbon mixer, a mechanochemical device, an extrusion mixer, etc.) as necessary, and then various kneaders ( For example, melt kneading (or melt mixing) is often performed with a kneader, a single screw or twin screw extruder, or the like. The mixing or kneading temperature (melt kneading temperature) may be at least a temperature at which the thermoplastic resin can be melted (particularly, a temperature at which the thermoplastic resin and the fluorine-containing resin can be melted). It can be selected from the above range (for example, 130 to 500 ° C), preferably 150 ° C or more (for example, 180 to 450 ° C), and more preferably 200 ° C or more (for example, 250 to 400 ° C). In particular, when the thermoplastic resin is an aromatic polyether ketone resin, the mixing temperature may be, for example, about 300 to 450 ° C., preferably about 350 to 400 ° C. The stirring speed (rotational speed) may be, for example, about 150 to 500 rpm, preferably about 200 to 400 rpm (for example, 250 to 350 rpm). The molten mixture (melt kneaded product) may be pelletized by conventional pelletizing means (such as a pelletizer).

  In this way, a resin composition is obtained. The resin composition can be used after being molded by a conventional method. Therefore, the present invention also includes a molded body formed from the resin composition. The shape of the molded body may be, for example, a two-dimensional shape such as a film shape or a sheet shape, or a three-dimensional shape such as a rod shape, a pipe shape, or a plate shape.

  The molded body is formed by a conventional method such as extrusion molding, injection molding, or press molding. In injection molding or the like, the cylinder temperature can be selected from a range equivalent to the melt mixing temperature.

  Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. In addition, the various raw materials used and the evaluation method of various physical properties are as follows.

[material]
(Non-fluorinated thermoplastic resin)
PEEK (Polyetheretherketone): Daicel Evonik Co., Ltd., Vesta Keep-J ZV7403
PPA (semiaromatic polyamide): Daicel-Evonik Co., Ltd., Bestamide HT plus M1000
LCP (Liquid crystal polyester): Polyplastics Co., Ltd., Vectra A130 (containing 30% glass fiber)
(Fluorine-containing resin)
Tetrafluoroethylene-hexafluoropropylene copolymer (composition weight ratio: tetrafluoroethylene / hexafluoropropylene / perfluoro (propyl vinyl ether) = 87.5 / 11.5 / 1.0, MFR: 27 g / 10 min) Hereinafter, it is referred to as “FEP”.

  Tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (composition weight ratio: tetrafluoroethylene / perfluoro (propyl vinyl ether) = 94.5 / 5.5, MFR; 23 g / 10 min), hereinafter referred to as “PFA” .

  Polytetrafluoroethylene: trade name “KTH-645”, manufactured by Kitamura Co., Ltd., hereinafter referred to as “PTFE”.

(Antioxidant)
Product name "SUMILIZER GA-80", manufactured by Sumitomo Chemical Co., Ltd. (light stabilizer)
Product name “TINUVIN 234”, manufactured by BASF [Light resistance test]
Using a metal halide light resistance tester (Super Winmini SWM-03FS manufactured by Daipura Wintes Co., Ltd.) under the conditions of 200 hours, 120 ° C. and irradiation intensity of 160 W / m ² (strength at 300 to 400 nm), Light irradiation was performed.

[Retention rate of tensile strength and retention rate of tensile fracture strain]
Before and after the light resistance test, tensile strength and tensile fracture strain were measured according to JIS K7113. And from these measured values, these change rates were calculated by the following formulas.

Tensile strength retention = [B ₁ / A ₁ ] × 100 (%)
(In the formula, A ₁ represents the tensile strength of the resin composition before the light resistance test, and B ₁ represents the tensile strength of the resin composition after the light resistance test.)
Tensile fracture strain retention = [B ₂ / A ₂ ] × 100 (%)
(In the formula, A ₂ represents the tensile fracture strain of the resin composition before the light resistance test, and B ₂ represents the tensile fracture strain of the resin composition after the light resistance test.)
[Extrudability]
When the viscosity was increased in the extruder and a pellet-shaped resin composition (resin pellets) could not be obtained, the case was evaluated as x, and the case other than that was evaluated as o.

[Average particle diameter of dispersed phase (fluorine-containing resin) and average distance between particles]
A press sheet formed from the resin composition by hot pressing at a predetermined temperature (380 ° C. for PEEK, 340 ° C. for PPA, 350 ° C. for LCP) is fixed to a sample holder of an ultramicrotome (manufactured by Leica Corporation, ULTRACUT S). The inside of the chamber was cooled to −80 ° C. with liquid nitrogen, and a thin slice having a thickness of 90 nm was cut out. The obtained thin slice was collected with a platinum ring to which a 20% ethanol solution was attached, and attached to a copper sheet mesh (200A manufactured by Oken Shoji Co., Ltd.). Using a transmission electron microscope (Hitachi Ltd., H7100FA), a thin film adhered to the copper sheet mesh was observed to produce a negative film, and this negative film was scanned with a scanner (EPSON, GT-9400UF). An electronic image was converted into an electronic image using an optical analyzer (manufactured by Nireco Corporation, LUZEX AP), and the average particle diameter and average interparticle distance of the dispersed phase (fluorine-containing resin) were calculated.

(Examples 1-7 and Comparative Examples 1-2)
After premixing the components shown in the table at the blending ratios (weight ratio, volume ratio) shown in the following table (Examples 1 to 7 and Comparative Example 1) or as they are (Comparative Example 2), the main of the twin-screw kneading extruder It was put into a hopper, melt kneaded and extruded under the conditions of a cylinder temperature of 370 ° C. and a screw rotation speed of 300 rpm to obtain a resin composition (a pellet-shaped resin composition for those having an evaluation of extrudability of ○). .

  The obtained resin composition pellets were put into an injection molding machine (cylinder temperature 380 ° C.) equipped with a JIS test piece preparation mold (die temperature 200 ° C.), injection molded, and various JIS test pieces. And various characteristics were measured. In Comparative Example 1, since a pellet-shaped resin composition was not obtained, various characteristics were not measured.

(Example 8 and Comparative Example 3)
After premixing the components shown in the table (Example 8) or as they are (Comparative Example 3) at the blending ratios (weight ratio, volume ratio) shown in the following table, they are put into the main hopper of the twin-screw kneading extruder, and the cylinder The mixture was melt kneaded and extruded under conditions of a temperature of 340 ° C. and a screw rotation speed of 300 rpm to obtain a resin composition.

  The pellets of the resin composition thus obtained were put into an injection molding machine (cylinder temperature 340 ° C.) equipped with a JIS test piece preparation mold (mold temperature 140 ° C.) and injection molded, and various JIS test pieces. And various characteristics were measured.

(Example 9 and Comparative Example 4)
After premixing the components shown in the table (Example 9) or as they are (Comparative Example 4) at the blending ratios (weight ratio, volume ratio) shown in the following table, they are put into the main hopper of the twin-screw kneading extruder, and the cylinder The mixture was melt kneaded and extruded under conditions of a temperature of 370 ° C. and a screw rotation speed of 300 rpm to obtain a resin composition.

  The obtained resin composition pellets were put into an injection molding machine (cylinder temperature 350 ° C.) equipped with a JIS test piece preparation mold (mold temperature 80 ° C.) and injection molded, and various JIS test pieces were obtained. And various characteristics were measured.

  The results are shown in the table. In the table, the volume ratio is the volume ratio relative to the total amount of the non-fluorinated thermoplastic resin (PEEK, PPA, LCP) and the fluorine-containing resin (FEP, PFA, or PTFE).

  As is clear from the results in the table, it was found that the light resistance was improved by adding a fluorine-containing resin to a non-fluorinated thermoplastic resin (PEEK, PPA, LCP).

  The additive of the present invention is useful as an additive for improving or improving the light resistance of a non-fluorinated thermoplastic resin. Moreover, since the additive of the present invention can maintain the light resistance improving function even after undergoing a melt mixing process at a high temperature, super engineering plastics (for example, aromatic polyamide, liquid crystal polyester, aromatic polyaryl ketone resin) are particularly preferred. It can be suitably used to improve or improve the light resistance of.

  And the non-fluorine-type thermoplastic resin (resin composition of a non-fluorine-type thermoplastic resin and a light resistance improver) whose light resistance has been improved or improved by such an additive of the present invention depends on the type of resin. It can be used for various purposes, and for example, it can be suitably used as a component for home appliances, office automation (OA) devices, mobile devices, and the like. In particular, such resin compositions are often excellent in mechanical properties, and are suitable as thin switches for smartphones, personal computers (notebooks, tablets, etc.), electronic book readers, and digital cameras. It is.

Claims (10)

  A light resistance improver composed of a fluorine-containing resin, which is an additive for improving or improving the light resistance of a non-fluorinated thermoplastic resin.   The light resistance improver according to claim 1, wherein the fluorine-containing resin is a fluorine-containing resin containing tetrafluoroethylene as a polymerization component.   The light resistance improver according to claim 1 or 2, wherein the fluorine-containing resin is a thermoplastic fluororesin.   The light resistance improver according to any one of claims 1 to 3, wherein the fluorine-containing resin is a tetrafluoroethylene copolymer.   Fluorine-containing resins are copolymers of tetrafluoroethylene and other fluorinated olefins, copolymers of tetrafluoroethylene and fluorinated vinyl ethers, and copolymers of tetrafluoroethylene and other fluorinated olefins and fluorinated vinyl ethers. The light resistance improver according to any one of claims 1 to 4, which is at least one selected from polymers.   Fluorine-containing resins are copolymers of tetrafluoroethylene and other perfluoroolefins, copolymers of tetrafluoroethylene and perfluoro (alkyl vinyl ethers), and tetrafluoroethylene and other perfluoroolefins and perfluoro ( The light resistance improver according to any one of claims 1 to 5, which is at least one selected from a copolymer with an alkyl vinyl ether).   The light resistance improver according to any one of claims 1 to 6, wherein the non-fluorinated thermoplastic resin is a super engineering plastic.   The light resistance improver according to any one of claims 1 to 7, wherein the non-fluorinated thermoplastic resin is at least one selected from an aromatic polyamide, a liquid crystal polyester, and an aromatic polyether ketone resin.   The light resistance improver according to any one of claims 1 to 8, wherein the non-fluorinated thermoplastic resin is polyetheretherketone.   A method for improving the light resistance of a non-fluorinated thermoplastic resin by adding the light resistance improver according to claim 1 to a non-fluorinated thermoplastic resin.