JPS63315574A - Method for removing binder from powder moldings - Google Patents

Method for removing binder from powder moldings

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Publication number
JPS63315574A
JPS63315574A JP62149135A JP14913587A JPS63315574A JP S63315574 A JPS63315574 A JP S63315574A JP 62149135 A JP62149135 A JP 62149135A JP 14913587 A JP14913587 A JP 14913587A JP S63315574 A JPS63315574 A JP S63315574A
Authority
JP
Japan
Prior art keywords
melting point
organic compound
softening point
binder
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62149135A
Other languages
Japanese (ja)
Inventor
Hiroyoshi Takano
高野 裕喜
Yasunobu Kawaguchi
川口 泰伸
Hiroichi Fukuda
博一 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP62149135A priority Critical patent/JPS63315574A/en
Publication of JPS63315574A publication Critical patent/JPS63315574A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To remove a binder from powder moldings without accompanying occurrence of defect such as deformation, cracking or swelling by heating the powder moldings containing two or more kinds of organic compound binders while dividing into specific temperature having two steps and removing the organic compound. CONSTITUTION:Powder moldings molded using at least two kind of organic compounds which are not mutually and completely melted and are different each in softening point and melting point as binder is heated to the temperature which is softening point or above or melting point or above of an organic compound having the lowest softening point or melting point and softening point or below or melting point or below of an organic compound having the highest softening point or melting point to remove only melted organic compound. Then the remaining organic compound is removed by heating the compound to softening point of above or melting point or above of the organic compound having the highest softening point or melting point. Thus removing rate of the binder can be reduced to sufficiently small value and the powder moldings free from occurrence of defect such as deformation, cracking or swelling can be obtained.

Description

【発明の詳細な説明】 jLLk、−夏旦ユユ1 本発明は、セラミック粉末または全屈粉末に粘結剤とし
ての有機化合物を混合し、これを射出成形法、トランス
ファー成形法等の手法で成形して1!?た焼結用粉末成
形品から粘結剤を除去する方法に関するものである。
[Detailed Description of the Invention] jLLk, -Xiatan Yuyu 1 The present invention involves mixing ceramic powder or total bending powder with an organic compound as a binder, and molding the mixture by a method such as injection molding or transfer molding. Do 1! ? The present invention relates to a method for removing a binder from a powder molded product for sintering.

−お び の、 。-Obino,.

近年)↑目をあびているセラミックス製品は、■セラミ
ック粉末に加熱状態で粘結剤(有機化合物)を混練し、
■得られた混合物を射出成形法によって成形し、■射出
成形品を加熱して粘結剤を分解除去し、■所定焼結温度
で加熱焼成することによって製造される。前記第三工程
■は脱脂工程と呼称され、射出成形品に含まれる粘結剤
を加熱によって完全に分解除去させる工程であり、その
加熱昇温速度が急激であると成形品の変形1割れ、iれ
等が発生する。従来では、この欠陥発生を防ぐために、
昇温速度を小さく抑えるか、あるいは適当な低温で長時
間の加熱を行なって対処していた。
In recent years) ↑ Ceramic products that have attracted attention are: ■Ceramic powder is kneaded with a binder (organic compound) under heating.
It is manufactured by (1) molding the obtained mixture by injection molding, (2) heating the injection molded product to decompose and remove the binder, and (2) heating and firing at a predetermined sintering temperature. The third step (2) is called a degreasing step, and is a step in which the binder contained in the injection molded product is completely decomposed and removed by heating.If the heating temperature rise rate is rapid, the molded product may deform, crack, or crack. Irregularities, etc. occur. Conventionally, in order to prevent this defect from occurring,
This has been dealt with by keeping the temperature increase rate low or by heating at an appropriate low temperature for a long time.

しかしながら、成形品の肉厚がある程度人きい場合には
加熱条件を十分に制御しても欠陥が生じがちであった。
However, if the wall thickness of the molded product is too thick to some extent, defects tend to occur even if the heating conditions are sufficiently controlled.

11  t   るた の  rよ −■本発明の目的
は、有機化合物を粘結剤として成形された粉末成形品か
ら、変形1割れ、膨れ等の欠陥発生を伴うことなく粘結
剤を加熱除去することである。
11 t Ruta no Ryo -■ The purpose of the present invention is to remove the binder by heating from a powder molded product molded using an organic compound as a binder without causing defects such as deformation, cracking, and blistering. That's true.

この目的は、相互に完全に溶け合うことがなく、かつそ
れぞれ軟化点または融点が異なる少なくとも二種類の有
機化合物を粘結剤として成形された粉末成形品を、軟化
点または融点が最も低い有機化合物の軟化点または融点
以上の温度であって軟化点または融点が最も高い有機化
合物の軟化点または融点よりも低い温度に加熱して、溶
融した有機化合物のみを除去し、次いで軟化点または融
点が最も高い有機化合物の軟化点または融点以上の温度
に加熱して該有機化合物を粉末成形品から除去すること
によって達成される。
The purpose of this is to create a powder molded product that is molded using at least two types of organic compounds as binders that do not completely dissolve in each other and have different softening or melting points. Heating to a temperature above the softening point or melting point but below the softening point or melting point of the organic compound with the highest softening point or melting point to remove only the molten organic compound, then with the highest softening point or melting point This is achieved by heating the organic compound to a temperature above the softening point or melting point of the organic compound to remove the organic compound from the powder molded article.

粘結剤を構成する有機化合物を二段階に分けて除去する
斯かる手法によれば、粘結剤の除去速度を十分小さく抑
えることができ、欠陥発生のない焼結用粉末成形品を得
ることが可能である。
According to such a method of removing the organic compound constituting the binder in two stages, the removal rate of the binder can be kept sufficiently low, and a powder molded product for sintering without defects can be obtained. is possible.

粉末成形品を形成するための粉末とし又は、窒化けい素
(SL3N + )、炭化けい素(SLC)、アルミナ
(AJ20 s )、ジルコニア(Zr O2)、窒化
アルミニウム(へIN1等の粉末を挙げることができる
As a powder for forming a powder molded article, powders such as silicon nitride (SL3N + ), silicon carbide (SLC), alumina (AJ20s), zirconia (ZrO2), aluminum nitride (IN1, etc.) may be used. Can be done.

粘結剤用の有機化合物としては、パラフィンワックス、
微晶ろう(llicrocrystalline wa
x) 、ボリエヂレン樹脂、ボリエヂレン樹脂、ポリプ
ロピレン樹脂、尿素樹脂等を挙げることができ、これ等
を、軟化点または融点が前記条件を満たず様に適宜組合
せて使用する。
Organic compounds for binders include paraffin wax,
microcrystalline wax
x) Polyethylene resins, polyethylene resins, polypropylene resins, urea resins, etc. can be mentioned, and these are used in appropriate combinations so that the softening point or melting point does not satisfy the above conditions.

溶融した粘結剤を粉末成形品から除去するに当り、次の
手法を採用することが推奨される。
When removing molten binder from powder molded products, it is recommended to use the following method.

■相互に完全に溶け合うことがなく、かつそれぞれ軟化
点または融点が異なる少なくとも二種類の有機化合物を
粘結剤として成形された粉末成形品を、該粉末成形品の
粉末組成と同一または類似組成の粉末中に置き、全体を
加熱して溶融した粘結剤を前記周囲の粉末中に拡散、浸
透させる。
■ Powder molded products molded using at least two types of organic compounds that do not completely dissolve each other and have different softening points or melting points, respectively, as binders, can be molded with powder compositions that are the same or similar to the powder composition of the powder molded product. Placed in powder, the whole is heated to cause the melted binder to diffuse and permeate into the surrounding powder.

■相互に完全に溶け合うことがなく、かつそれぞれ軟化
点または融点が異なる少なくとも二種類の有機化合物を
粘結剤として成形された粉末成形品を、軟化点または融
点が最も低い有機化合物の軟化点または融点以上の温度
であって軟化点または融点が最も高い有機化合物の軟化
点または融点よりも低い温度に加熱した液体中に浸漬し
、溶融した有機化合物のみを液体中に溶解させて除去す
る。
■Powder molded products that are molded using at least two types of organic compounds that do not completely dissolve each other and have different softening points or melting points as binders, or It is immersed in a liquid heated to a temperature higher than the melting point and lower than the softening point or melting point of the organic compound with the highest softening point, and only the molten organic compound is dissolved in the liquid and removed.

■相互に完全に溶け合うことがなく、かつそれぞれ軟化
点または融点が異なる小なくとも二種類の有機化合物を
粘結剤として成形された粉末成形品を、気圧500トー
ルBorr)以下の真空中におき、第一段階として軟化
点または融点が最も低い有機化合物の軟化点または融点
以上の温度であって軟化点または融点が最も高い有機化
合物の軟化点または融点よりも低い温度に加熱して溶融
した有機化合物を気化させて除去し、第二段階として軟
化点または融点が最も高い有機化合物の軟化点または融
点以上の温度に加熱して溶融した残余の有機化合物を気
化させて除去する。
■Powder molded products made using binders of at least two organic compounds that do not completely dissolve in each other and each having a different softening point or melting point are placed in a vacuum at an atmospheric pressure of 500 torr (Borr) or less. , in the first step, the organic compound is melted by heating to a temperature higher than the softening point or melting point of the organic compound with the lowest softening point or melting point, but lower than the softening point or melting point of the organic compound with the highest softening point or melting point. The compound is vaporized and removed, and in the second step, the remaining organic compound is heated to a temperature higher than the softening point or melting point of the organic compound having the highest softening point or melting point to vaporize and remove the melted remaining organic compound.

あるいは、第二段階の加熱を行うことなく、一部の有機
化合物が除去された粉末成形品を真空容器から取出して
加熱し、残余の有機化合物を除去する。
Alternatively, the powder molded product from which some of the organic compounds have been removed is taken out from the vacuum container and heated to remove the remaining organic compounds without performing the second stage of heating.

■相互に完全に溶け合うことがなく、かつそれぞれ軟化
点またはFjA魚が賃なる少なくとも二種類の有機化合
物を粘結剤として成形された粉末成形品の最小肉厚が1
0mm以上である場合には、全有機化合物中の高軟化点
または高融点を有する有機化合物の含有けを20〜80
Φ徂%とする。
■The minimum wall thickness of a powder molded product molded using at least two types of organic compounds as binders that do not completely melt into each other and each having a softening point or FJA temperature is 1.
If it is 0 mm or more, the content of organic compounds with a high softening point or high melting point in all organic compounds should be 20 to 80 mm.
Let it be Φ徂%.

■軟化点または融点が最も低い有機化合物の軟化点また
は融点と、前記軟化点または融点が最も高い有機化合物
の軟化点または融点との温度差を10℃〜80℃とする
(2) The temperature difference between the softening point or melting point of the organic compound having the lowest softening point or melting point and the softening point or melting point of the organic compound having the highest softening point or melting point is 10°C to 80°C.

項目■の手法によれば、粉末成形品中の有機化合物を加
熱溶融させて除去する間、粉末成形品が周囲の粉末によ
って背圧(支持圧)を与えられているため、粉末成形品
の変形9割れ、膨れ等の発生が効果的に防止される利点
がある。
According to the method in item ■, while the organic compound in the powder molded product is removed by heating and melting, the powder molded product is given back pressure (supporting pressure) by the surrounding powder, which causes deformation of the powder molded product. There is an advantage that the occurrence of cracks, blisters, etc. can be effectively prevented.

項目■の手法によれば、粉末成形品の加熱が均等に行わ
れる、有機化合物の離脱速度が液体への溶解速度で規定
されて離脱が十分ゆっくりと行われる、相対的に低温で
溶融する有機化合物が除去される間、相対的に高温で溶
融する有機化合物によって粉末成形品の形状が保持され
る、粉末成形品が周囲の液体によって背圧(支持圧〉を
与えられている等の理由により粉末成形品の変形1割れ
According to the method in item While the compound is removed, the shape of the powder molded product is maintained by the organic compound that melts at a relatively high temperature, and the powder molded product is given back pressure (support pressure) by the surrounding liquid, etc. Deformation and cracking of powder molded product.

膨れ等の発生が効果的に防止される利点がある。This has the advantage of effectively preventing the occurrence of blisters, etc.

項目■の手法によれば、溶解した有機化合物の気化が促
進され、有機化合物の除去を確実に行うことができる。
According to the method of item (2), the vaporization of dissolved organic compounds is promoted, and the organic compounds can be reliably removed.

この場合、真空度が500トールを越えると、常圧(大
気圧)との差が少なく気化促進効果が得られない。
In this case, if the degree of vacuum exceeds 500 Torr, the difference from normal pressure (atmospheric pressure) is small and the effect of promoting vaporization cannot be obtained.

項目■の数値限定は、後記試験例1に基づいてなされた
。すなわち、肉厚15#l111の粉末成形品にあつで
は、全有機化合物中の高軟化点または高融点を有する有
機化合物の含有量が22.2重M%(4/18)以上必
要であり、肉厚20m+の粉末成形品にあっては、前記
含有量が27,8重間%(5/18)以上必要であるこ
とから、肉厚10#IIの粉末成形品では20重量%(
>3/18)を下限とした。また、前記含有ωが17.
8重量%(14/18)を超えると、成形性、脱脂性が
悪化するため、80.0重量%を上限とした。
The numerical limitations for item (2) were made based on Test Example 1 described later. That is, for a powder molded product with a wall thickness of 15#l111, the content of organic compounds having a high softening point or high melting point in all organic compounds must be 22.2% by weight (4/18) or more, For a powder molded product with a wall thickness of 20 m+, the content must be at least 27.8% by weight (5/18), so for a powder molded product with a wall thickness of 10#II, the content must be 20% by weight (5/18) or more.
>3/18) was set as the lower limit. Further, the content ω is 17.
If it exceeds 8% by weight (14/18), moldability and degreasing properties deteriorate, so the upper limit was set at 80.0% by weight.

項目■で有機化合物の温度特性を数値限定したのは、粘
結剤を構成する有機化合物の軟化点または融点の差が1
0℃以下では低融点有機化合物のみを溶融させる温度を
維持するのが難しく、その差が80℃以上では粉末の成
形性が非常に悪くなり粘結剤として不適当であるからで
ある。
The reason for numerically limiting the temperature characteristics of organic compounds in item
This is because if the temperature is below 0°C, it is difficult to maintain a temperature at which only the low-melting point organic compound is melted, and if the difference is above 80°C, the moldability of the powder becomes very poor, making it unsuitable as a binder.

敏1■ユ ■セラミック粉末として、平均粒径1.IMの窒化けい
素(酸化マグネシウム(8gO)を101a%含有する
)を用意した。
As a ceramic powder, the average particle size is 1. IM silicon nitride (containing 101a% of magnesium oxide (8gO)) was prepared.

■粘結剤用有機化合物として、パラフィンワックスと、
その融点よりも40℃高い軟化点を有するポリスチレン
樹脂と、ステアリン酸とを用意した。
■ Paraffin wax and organic compounds for binders,
A polystyrene resin having a softening point 40° C. higher than its melting point and stearic acid were prepared.

■窒化けい素82重量%、パラフィンワックス11.2
重量%、ポリスチレン樹脂5重ω%およびステアリン1
1.8t![%を配合し、これを高温ニーダ−(混線機
)にて温度150℃で十分に混合し、押出機を用いてこ
れを細い棒状に押出しして冷却後に裁断してベレットを
得た。
■Silicon nitride 82% by weight, paraffin wax 11.2%
Weight%, polystyrene resin 5w% and stearin 1
1.8t! [%], thoroughly mixed in a high temperature kneader at a temperature of 150°C, extruded into a thin rod using an extruder, cooled and cut to obtain pellets.

■得られたベレットを用い、加熱シリンダ一温度150
℃、射出圧力1トン/IIJ!、金型温度30℃として
射出成形を行い、肉厚20m+の板状粉末成形品を得た
■Using the obtained pellet, heat the cylinder at a temperature of 150
°C, injection pressure 1 ton/IIJ! Injection molding was performed at a mold temperature of 30° C. to obtain a plate-shaped powder molded product with a wall thickness of 20 m+.

■粉末成形品を前記項目■で用意した窒化けい素粉末と
同一組成の粉末中に埋め込み、真空度0.5トール以下
の雰囲気下で、パラフィンワックスの融点とポリスチレ
ン樹脂の軟化点との中間の温度で40時間保持した。そ
の結果、粉末成形品中のパラフィンワックスが、周囲の
粉末中への拡散。
■The powder molded product is embedded in a powder having the same composition as the silicon nitride powder prepared in the above item (■), and in an atmosphere with a degree of vacuum of 0.5 torr or less, Hold at temperature for 40 hours. As a result, the paraffin wax in the powder molded product diffuses into the surrounding powder.

浸透および気化によって当初の約50%に減少している
ことが確認された。また、粉末成形品に割れは生じなか
った。
It was confirmed that the amount was reduced to about 50% of the original value due to infiltration and vaporization. Moreover, no cracks occurred in the powder molded product.

■前記項目■の処理を行なった粉末成形品を、1気圧の
窒素ガス中で、胃温速度り0℃/時間として温度500
℃までが潟、加熱したところ、有機化合物を完全に除去
することができた。また、粉末成形品に割れは生じなか
った。
■The powder molded product treated in the above item (■) was heated to a temperature of 500°C in a nitrogen gas atmosphere of 1 atm, with a stomach temperature rate of 0°C/hour.
When heated to a temperature of up to ℃, it was possible to completely remove organic compounds. Moreover, no cracks occurred in the powder molded product.

■同様な試験を、射出された板状粉末成形品の肉厚が1
5m+のちのについても行なった。また、パラフィンワ
ックスとポリスブレン樹脂の比率が前記項目■とは異な
るものについて、板状粉末成形品の肉J7を151nM
、20#lllとして同様な試験を行なった。
■A similar test was conducted when the wall thickness of the injected plate-shaped powder molded product was 1
5m+ was also carried out later. In addition, for those whose ratio of paraffin wax and polybrene resin is different from the above item (■), the flesh J7 of the plate-shaped powder molded product was
, 20#llll was used in a similar test.

以上の全試験結束を表1に示す。Table 1 shows all the above test ties.

(以下、余白) 表1 *注に数字はいずれも重量%である。(Hereafter, margin) Table 1 *All numbers in the notes are % by weight.

*注2二〇は割れ発生がないことを、×は割れ発生があ
ることをそれぞれ意味している。
*Note 220 means that no cracking occurred, and × means that cracking occurred.

〈試験結果の評価〉 ■粉末形成品の肉厚が15.のちのにおいては、ポリス
チレン樹脂を4重品%(有機化合物全体の22重量%(
=4/18) )以上配合する必要がある。
<Evaluation of test results> ■The wall thickness of the powdered product is 15. Later, polystyrene resin was added to 4% by weight (22% by weight of all organic compounds).
=4/18)) It is necessary to mix the above.

■粉末成形品の肉厚が20.のちのにおいては、ポリス
チレン樹脂を5重層%(有機化合物全体の28重量%(
=5/18) )以上配合する必要がある。
■The wall thickness of the powder molded product is 20. Later, polystyrene resin was added at 5% by weight (28% by weight of the total organic compounds).
=5/18)) It is necessary to mix the above.

■ポリスチレン樹脂の配合色が14重量%(有機化合物
全体の77!t! m%(=14/18) )に達する
と成形性が悪くなるだけでなく、脱脂の際に割れが生じ
るため、その配合遇を14111%よりも少なくする必
要がある。
■If the blended color of polystyrene resin reaches 14% by weight (77!t!m% (=14/18) of the total organic compounds), not only will the moldability deteriorate, but cracks will occur during degreasing. It is necessary to reduce the combined allowance to less than 14111%.

L監■ユ ■セラミック粉末として、平均粒径1.IMの窒化けい
素(酸化マグネシウム(Had)を10重量%含有する
)を用意した。
As a ceramic powder, the average particle size is 1. IM silicon nitride (containing 10% by weight of magnesium oxide (Had)) was prepared.

■粘結剤用有機化合物として、微晶ろうと、その融点よ
りも40℃高い軟化点を有するポリスチレン樹脂と、ス
テアリン酸とを用意した。
(2) As an organic compound for a binder, a microcrystalline wax, a polystyrene resin having a softening point 40° C. higher than its melting point, and stearic acid were prepared.

■窒化けい素82重量%、微晶ろう11.2重量%、ポ
リスチレン樹脂5(酊%およびステアリン酸1.8重量
%を配合し、これを高温ニーダ−(混線機)にて温度1
50℃で十分に混合し、押出機を用いてこれを細い棒状
に押出しして冷却後に裁断してベレットを得た。
■82% by weight of silicon nitride, 11.2% by weight of microcrystalline wax, 5% by weight of polystyrene resin (5% by weight and 1.8% by weight of stearic acid), and mixed in a high-temperature kneader (mixer) at a temperature of 1.
The mixture was thoroughly mixed at 50° C., extruded into a thin rod using an extruder, cooled, and then cut to obtain pellets.

■得られたペレットを用い、加熱シリンダー塩IQ 1
50℃、射出圧力1トン/ci、全型温度30℃として
射出成形を行い、肉厚10slIの板状粉末成形品を得
た。
■ Using the obtained pellets, heat cylinder salt IQ 1
Injection molding was performed at 50°C, injection pressure of 1 ton/ci, and total mold temperature of 30°C to obtain a plate-shaped powder molded product with a wall thickness of 10 slI.

■粉末成形品を、微晶ろうの融点とポリスチレン樹脂の
軟化点との中間の温度に維持した灯油中にa’ il 
して40時間放置した。その結果、粉末成形品中の微晶
ろうがほぼ100%灯油中に溶解したことが確認された
。また、粉末成形品に割れは生じなかった。
■The powder molded product is placed in kerosene maintained at a temperature between the melting point of the microcrystalline wax and the softening point of the polystyrene resin.
and left for 40 hours. As a result, it was confirmed that almost 100% of the microcrystalline wax in the powder molded product was dissolved in the kerosene. Moreover, no cracks occurred in the powder molded product.

■前記項目■の処理を行なった粉末成形品を、1気圧の
窒素ガス中で、昇温速度60℃/時間として温度500
℃まで昇温、加熱したところ、イj磯化合物を完全に除
去することができた。また、粉末成形品に割れは生じな
かった。
■The powder molded product subjected to the treatment in the above item
When the temperature was raised to ℃ and heated, the Ijiso compound could be completely removed. Moreover, no cracks occurred in the powder molded product.

■試験例1における試料No、 3相当品(同一条件に
て成形)を、1気圧の窒素ガス中で、昇温速度60℃/
時間として温度500℃まで昇温、加熱したところ、粉
末成形品全体に微細なひび割れが認められた。
■A product equivalent to sample No. 3 in Test Example 1 (molded under the same conditions) was heated at a heating rate of 60°C/in nitrogen gas at 1 atm.
When the temperature was increased to 500° C. and heated, fine cracks were observed throughout the powder molded product.

几1至11 以上の説明から明らかな様に、相互に完全に溶け合うこ
とがなく、かつそれぞれ軟化点または融点が異なる少な
くとも二種類の有機化合物を粘結剤として成形された粉
末成形品を、軟化点または融点が最も低い有機化合物の
軟化点または融点以上の温度であって軟化点または融点
が最も高い有機化合物の軟化点または融点よりも低い温
度に加熱して、溶融した有機化合物のみを除去し、次い
で軟化点または融点が最も高い有機化合物の軟化点また
は融点以上の温度に加熱して該有機化合物を除去するこ
とを特徴とする粉末成形品からの粘結剤の除去方法が提
案された。
几1~11 As is clear from the above explanation, a powder molded product formed using at least two types of organic compounds that do not completely melt with each other and have different softening points or melting points as a binder can be softened. Remove only the molten organic compound by heating to a temperature that is higher than the softening point or melting point of the organic compound with the lowest softening point or melting point and lower than the softening point or melting point of the organic compound with the highest softening point or melting point. Then, a method for removing a binder from a powder molded article was proposed, which comprises heating the organic compound to a temperature higher than the softening point or melting point of the organic compound having the highest softening point or melting point to remove the organic compound.

斯様に、粘結剤を構成する有機化合物を二段階に分けて
加熱、除去するならば、粘結剤の除去速度を十分小さく
抑えることができ、変形1割れ。
In this way, if the organic compound constituting the binder is heated and removed in two stages, the removal rate of the binder can be kept sufficiently low, resulting in less deformation.

膨れ等の欠陥発生のない粉末成形品を得ることが可能で
ある。
It is possible to obtain powder molded products without defects such as blisters.

なお、本発明は、セラミックス用粉末成形品に限らず粉
末冶金用予備成形品の製造にも適用され得るものである
Note that the present invention can be applied not only to the production of powder molded products for ceramics but also to the production of preformed products for powder metallurgy.

Claims (6)

【特許請求の範囲】[Claims] (1)相互に完全に溶け合うことがなく、かつそれぞれ
軟化点または融点が異なる少なくとも二種類の有機化合
物を粘結剤として成形された粉末成形品を、軟化点また
は融点が最も低い有機化合物の軟化点または融点以上の
温度であって軟化点または融点が最も高い有機化合物の
軟化点または融点よりも低い温度に加熱して、溶融した
有機化合物のみを除去し、次いで軟化点または融点が最
も高い有機化合物の軟化点または融点以上の温度に加熱
して該有機化合物を除去することを特徴とする粉末成形
品からの粘結剤の除去方法。
(1) A powder molded product that is molded using at least two types of organic compounds that do not completely dissolve each other and have different softening points or melting points as a binder, is made by softening the organic compound with the lowest softening point or melting point. The organic compound with the highest softening point or melting point is removed by heating to a temperature above the softening point or melting point of the organic compound with the highest softening point or melting point, and then the organic compound with the highest softening point or melting point is removed. A method for removing a binder from a powder molded article, which comprises removing the organic compound by heating to a temperature higher than the softening point or melting point of the compound.
(2)前記粉末成形品を、該粉末成形品の粉末組成と同
一または類似組成の粉末中に置き、全体を加熱して溶融
した粘結剤を前記周囲の粉末中に拡散、浸透させること
を特徴とする特許請求の範囲第1に記載された粉末成形
品からの粘結剤の除去方法。
(2) The powder molded product is placed in a powder having the same or similar powder composition to that of the powder molded product, and the whole is heated to cause the melted binder to diffuse and permeate into the surrounding powder. A method for removing a binder from a powder molded article according to claim 1.
(3)前記粉末成形品を、軟化点または融点が最も低い
有機化合物の軟化点または融点以上の温度であって軟化
点または融点が最も高い有機化合物の軟化点または融点
よりも低い温度に加熱した液体中に浸漬し、溶融した有
機化合物のみを液体中に溶解させて除去することを特徴
とする特許請求の範囲第1項に記載された粉末成形品か
らの粘結剤の除去方法。
(3) The powder molded article was heated to a temperature that was higher than the softening point or melting point of the organic compound having the lowest softening point or melting point and lower than the softening point or melting point of the organic compound having the highest softening point or melting point. A method for removing a binder from a powder molded article according to claim 1, which comprises immersing it in a liquid and dissolving only the molten organic compound in the liquid to remove it.
(4)前記粉末成形品を気圧500トール以下の真空中
におき、溶融した有機化合物を気化させて除去すること
を特徴とする特許請求の範囲第1項に記載された粉末成
形品からの粘結剤の除去方法。
(4) The powder molded product is placed in a vacuum with an atmospheric pressure of 500 torr or less, and the molten organic compound is vaporized and removed. How to remove binder.
(5)前記粉末成形品の最小肉厚が10mm以上であり
、全有機化合物中の高軟化点または高融点を有する有機
化合物の含有量が20〜80重量%であることを特徴と
する特許請求の範囲第1項に記載された粉末成形品から
の粘結剤の除去方法。
(5) A patent claim characterized in that the minimum wall thickness of the powder molded product is 10 mm or more, and the content of organic compounds having a high softening point or high melting point in all organic compounds is 20 to 80% by weight. A method for removing a binder from a powder molded product as described in Item 1.
(6)前記軟化点または融点が最も低い有機化合物の軟
化点または融点と、前記軟化点または融点が最も高い有
機化合物の軟化点または融点との温度差が10℃〜80
℃であることを特徴とする特許請求の範囲第1項に記載
された粉末成形品からの粘結剤の除去方法。
(6) The temperature difference between the softening point or melting point of the organic compound having the lowest softening point or melting point and the softening point or melting point of the organic compound having the highest softening point or melting point is 10°C to 80°C.
A method for removing a binder from a powder molded article according to claim 1, wherein the temperature is .degree.
JP62149135A 1987-06-17 1987-06-17 Method for removing binder from powder moldings Pending JPS63315574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62149135A JPS63315574A (en) 1987-06-17 1987-06-17 Method for removing binder from powder moldings

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62149135A JPS63315574A (en) 1987-06-17 1987-06-17 Method for removing binder from powder moldings

Publications (1)

Publication Number Publication Date
JPS63315574A true JPS63315574A (en) 1988-12-23

Family

ID=15468509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62149135A Pending JPS63315574A (en) 1987-06-17 1987-06-17 Method for removing binder from powder moldings

Country Status (1)

Country Link
JP (1) JPS63315574A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06122902A (en) * 1992-06-02 1994-05-06 Advanced Materials Technol Pte Ltd Injection-moldable metallic material, and production of injection-molded metallic article

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06122902A (en) * 1992-06-02 1994-05-06 Advanced Materials Technol Pte Ltd Injection-moldable metallic material, and production of injection-molded metallic article

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