JPS6288345A - プラスチツク封止固体イメ−ジセンサ− - Google Patents

プラスチツク封止固体イメ−ジセンサ−

Info

Publication number
JPS6288345A
JPS6288345A JP60229272A JP22927285A JPS6288345A JP S6288345 A JPS6288345 A JP S6288345A JP 60229272 A JP60229272 A JP 60229272A JP 22927285 A JP22927285 A JP 22927285A JP S6288345 A JPS6288345 A JP S6288345A
Authority
JP
Japan
Prior art keywords
epoxy
image sensor
state image
bonded
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60229272A
Other languages
English (en)
Inventor
Seiichi Iwamatsu
誠一 岩松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP60229272A priority Critical patent/JPS6288345A/ja
Publication of JPS6288345A publication Critical patent/JPS6288345A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は固体イメージ・センサーの封止構造に関する。
［発明の概要〕 本発明は、プラスチック封止固体イメージ・センサーに
関し、エポキシ基板にはリード・フレームが接着され、
該リード・フレームには固体イメージ・センサー、ワイ
ヤー配線及びエポキシ・キャップ等が接着され、該エポ
キシ・キャップにはガラス捷たはプラスチックから成る
透明窓が接着されて成ることを特徴とする。
〔従来の技術〕
従来、固体イメージ・センサーの封止構造は、一般にセ
ラミック・パッケージと呼ばれるセラミック基板に配線
、リード付けされたパッケージ内に固体イメージ・セン
サーを接着し、透明窓としてガラス窓ｅセラミック・パ
ッケージに低融点ガラス等で接着するのが通例であった
。
〔発明が解決しようとする問題点及び目的〕しかし、上
記従来技術によると、セラミック原材斜方高価な事、セ
ラミック焼成等の熱処理に高温を要し、エネルギー・コ
ストがかさむ事、及び部品点数が多い事等から高コスト
につくという問題点があった。
本発明は、かかる従来技術の問題点をなくし、低コスト
の固体イメージ・センサーを提供できる封止構造を提案
することを目的 〔問題点を解決するための手段〕 上記問題点を解決するための本発明の基本的な構成は、
いわゆるプラスチック封止構造体を固体イメージ・セン
サーの封正に提供する手段をとる。
〔実施例〕
以下、実施例により本発明を詳述する。
第１図は不発明の一実施例を示すプラスチック封止固体
イメージ・センサーの断面図である。すなわち、エポキ
シ製の基板１上にはアルミ・クラッド鉄から成るリード
・フレーム２がエポキシ系接着剤５によシ接着され、前
記リード・フレームの一部には、固体イメージ・センサ
ー・チップ５がエポキシ系導電性接着剤４により接着さ
れると共に、アルミ・ワイヤー６がチップ５とリード・
フレーム２との配線の為に超音波ボンディングされて成
る。更に、エボーＰ７材から成るギロツブ７がエポキシ
系接着剤５によりエポキシ基板１及びリード・フレーム
２の表面に接着され、前記エポキシ・キャップ７の表面
には、ガラス又はアクリルあるいは、ハード・コートし
たプラスチック等から成る透明窓８がエポキシ系接着剤
等の接着剤５により接着されて成る。尚、リード・フレ
ーム２の外部リード線はニッケル・メッキ後、半田メン
キされてプリント基板への半田付けを容易ならしめてい
る。
〔発明の効果〕
本発明の如く、プラスチック封止固体イメージセンサ−
構造では （１）　　プラスチック材のコストが低廉（２）　　プ
ラスチック成形時の熱処理温度が低く、エネルギーコス
トが低廉 （３）封着時に合成樹脂系接着剤を用いると、常温での
接着、硬化も可能となり、エネルギーコストが低廉 ＋４１　　有機性（ゼラチン等〕カラー・フィルターを
用いたカラー・イメージ・センサーの封正に本構造を用
いると、高温処理が無い為に、カラー・フィルターの熱
による光学特性劣化が全く起らない。
等の効果がある。
【図面の簡単な説明】
第１図は本発明の一実施例を示すプラスチック封止固体
イメージ・センサーの断面図である。 １・・・エポキシ基板 ２・・・１１−ド・フレーム ３・・・接着剤 ル・・・チップ接着剤 ５・・・イメージ・センサー ６・・・ワイヤー ７・・・エポキシ・キャップ ８・・・透明窓 以　　　上

Claims (1)

    【特許請求の範囲】
  1. エポキシ基板にはリード・フレームが接着されており、
    該リード・フレームには固体イメージ・センサー、ワイ
    ヤー配線、及びエポキシ・キャップ等が接着されており
    、該エポキシ・キャップにはガラスまたはプラスチック
    から成る透明窓が接着されていることを特徴とするプラ
    スチック封止固体イメージセンサー。
JP60229272A 1985-10-15 1985-10-15 プラスチツク封止固体イメ−ジセンサ− Pending JPS6288345A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60229272A JPS6288345A (ja) 1985-10-15 1985-10-15 プラスチツク封止固体イメ−ジセンサ−

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60229272A JPS6288345A (ja) 1985-10-15 1985-10-15 プラスチツク封止固体イメ−ジセンサ−

Publications (1)

Publication Number Publication Date
JPS6288345A true JPS6288345A (ja) 1987-04-22

Family

ID=16889510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60229272A Pending JPS6288345A (ja) 1985-10-15 1985-10-15 プラスチツク封止固体イメ−ジセンサ−

Country Status (1)

Country Link
JP (1) JPS6288345A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140384A (en) * 1990-06-14 1992-08-18 Rohm Co., Ltd. Semiconductor laser device mounted on a stem
US5982038A (en) * 1997-05-01 1999-11-09 International Business Machines Corporation Cast metal seal for semiconductor substrates
JP2010086595A (ja) * 2008-09-30 2010-04-15 Alps Electric Co Ltd 磁気ディスク装置
US20120112042A1 (en) * 1999-12-08 2012-05-10 Amkor Technology, Inc. Molded image sensor package and method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5140384A (en) * 1990-06-14 1992-08-18 Rohm Co., Ltd. Semiconductor laser device mounted on a stem
US5982038A (en) * 1997-05-01 1999-11-09 International Business Machines Corporation Cast metal seal for semiconductor substrates
US20120112042A1 (en) * 1999-12-08 2012-05-10 Amkor Technology, Inc. Molded image sensor package and method
US8994860B2 (en) * 1999-12-08 2015-03-31 Amkor, Technology, Inc. Molded image sensor package and method
US9735191B2 (en) 1999-12-08 2017-08-15 Amkor Technology, Inc. Molded semiconductor package
JP2010086595A (ja) * 2008-09-30 2010-04-15 Alps Electric Co Ltd 磁気ディスク装置
US8107185B2 (en) 2008-09-30 2012-01-31 Alps Electronics Co., Ltd. Magnetic disk device including a sensor in a case

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