JPS62207008A - Piezoelectric oscillator - Google Patents

Piezoelectric oscillator

Info

Publication number
JPS62207008A
JPS62207008A JP4976386A JP4976386A JPS62207008A JP S62207008 A JPS62207008 A JP S62207008A JP 4976386 A JP4976386 A JP 4976386A JP 4976386 A JP4976386 A JP 4976386A JP S62207008 A JPS62207008 A JP S62207008A
Authority
JP
Japan
Prior art keywords
circuit board
flexible conductive
piezoelectric
oscillator
piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4976386A
Other languages
Japanese (ja)
Inventor
Iwao Nakayama
中山 巖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsushima Kogyo KK
Original Assignee
Matsushima Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushima Kogyo KK filed Critical Matsushima Kogyo KK
Priority to JP4976386A priority Critical patent/JPS62207008A/en
Publication of JPS62207008A publication Critical patent/JPS62207008A/en
Pending legal-status Critical Current

Links

Landscapes

  • Oscillators With Electromechanical Resonators (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE:To obtain an oscillator with excellent shock-resistance by inserting a supporter having >=1 elastic layer to a fixed part between a piezoelectric oscillator chip and a circuit board mounted with an electric element oscillating the chip. CONSTITUTION:A flexible conductive adhesives 7 is placed on the circuit board 3 as a supporter and the flexible conductive adhesives is not completely cured but semi-cured. Moreover, another layer of a flexible conductive adhesive 4 is applied onto the flexible conductive adhesive agent 7 in the semi-cured state, electric conductivity is taken, a crystal oscillation chip 5 is placed on it and the layer of the flexible conductive adhesives 7 being a rubber elastic member after curing is provided between the crystal oscillation chip 5 and the circuit board 3. Thus, the buffer layer absorbs shock/vibration and even if shock/ vibration due to falling is exerted, the piezoelectric oscillation chip is hardly cracked.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は圧電発振片と発振回路とが同一パッケージ内に
収納されてなる圧電発振器に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a piezoelectric oscillator in which a piezoelectric oscillation piece and an oscillation circuit are housed in the same package.

〔従来の技術〕[Conventional technology]

従来の圧電発振6ヲiπ7図に正面図で示し説明するう セラミック基板51上に構成され之導電パターン(図示
せず)に、トランジスタ、抵抗、コンデンサー等の素子
52を半田付は等によってDin載置して成る回路基板
55上に金@判の円筒形サポータ−(サポートビン)5
8を前記素子類52と同様に半田付等で固着してあシ、
前記サポートピン58上に圧電発振片(本例では水晶発
撮片)55が導電性接着剤54によって固着されている
A conventional piezoelectric oscillation device 6 is shown in a front view in FIG. A gold @ size cylindrical supporter (support bin) 5 is placed on the circuit board 55 which is placed on the circuit board 55.
8 is fixed by soldering etc. in the same manner as the elements 52,
A piezoelectric oscillation piece (in this example, a crystal oscillation piece) 55 is fixed onto the support pin 58 with a conductive adhesive 54 .

更に金属キャップ59がステム56と抵抗溶接等によっ
て接合封止されている。
Furthermore, a metal cap 59 is bonded and sealed to the stem 56 by resistance welding or the like.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし前述による従来の構成によれば、ステム回路基板
、サポートビン、がほとんど弾性を有しておらず、又そ
れらを接合する導電性接着剤もほとんど弾性を有してい
ないために、外部からの衝撃、振動が直接圧電発振片に
伝わるため圧電発振片のワレ等が発生しやすく、耐衝爆
性が劣るという問題点を有している・ 本発明はかかる間1嘘点?M決するためのものでその目
的とするところは、耐衝撃性の優れ、た・圧電発振器上
提供することにある。
However, according to the conventional configuration described above, the stem circuit board and support bin have almost no elasticity, and the conductive adhesive that joins them also has almost no elasticity, so Since shocks and vibrations are directly transmitted to the piezoelectric oscillating piece, cracking of the piezoelectric oscillating piece is likely to occur, and there is a problem that the impact and explosion resistance is poor. Its purpose is to provide a piezoelectric oscillator with excellent shock resistance.

〔間頂点を解決するための手段〕[Means for solving intervening vertices]

本発明の圧電発振器は、圧゛成発撮片と、圧電発振片を
発振させる機能を有した心気素子を装着した回路基板と
の7着部分に少なくとも1層以上の弾性剤を有する構成
のサポータ−全弁していることを特徴としている□ 〔実施例〕 本発明の圧電発振器の実施例を水晶発振片を用いた水晶
発振器により、第1図(a)、第1図(b)、第2図に
示して説明する。
The piezoelectric oscillator of the present invention has a configuration in which at least one layer of elastic agent is provided between the piezoelectric oscillator piece and the circuit board on which the air-chondrium element having the function of oscillating the piezoelectric oscillator piece is mounted. □ [Example] An example of the piezoelectric oscillator of the present invention is shown in FIG. 1(a), FIG. 1(b), and a crystal oscillator using a crystal oscillating piece. This will be explained with reference to FIG.

本例はベースとなるステム6上に固定されたセラミック
基板1上に構成された導’rI!、パターン8にトラン
ジスタ、抵仇、コンデンサ等の素子類2が半田付は等に
よって固着されて構成される回路基板6上にサポータ−
として、導電性を有する弾性剤(以下フレキシブル4C
1,接着Th1l ) 7 ′!i1″戟罐し、このフ
レキシブル導、を接層剤を完全に硬化させずに半硬化状
態にさせる。更に前記半硬化状態となったフレキシブル
導北接着剤7上にもう一層の前記と同じフレキシブル導
磁接着剤4′!r7塗布し電気的に導通を取υこの上に
水晶発振片5全載せて完全に硬化させ、第2図の如く水
晶発振片5と回路基板3との間に、硬化してゴム状の弾
性材となるフレキシブル導電接着剤7の1傭を設けたm
造となっている。ここで半硬化状態のフレキシブル41
1接層剤1i1を設けたのは、確実にゴム状の弾性体を
導電性を損ねることなく作成するためのもので、粘性の
低い接着剤に直接水晶発振片を載せると、接N剤が横に
広がり、水晶発振片と回路基板とのスキマが極端に少な
くなり、弾性1i1がほとんど無くなってしまって、充
分な効果が発揮できなくなるためである。
In this example, a conductor is constructed on a ceramic substrate 1 fixed on a stem 6 serving as a base. , a supporter is placed on a circuit board 6 which is constructed by fixing elements 2 such as transistors, resistors, capacitors, etc. to patterns 8 by soldering or the like.
as an elastic agent with electrical conductivity (hereinafter referred to as flexible 4C)
1, Adhesion Th1l) 7'! i1'' and make this flexible conductor into a semi-hardened state without completely curing the adhesive.Furthermore, on top of the flexible guide adhesive 7 which is in the semi-hardened state, another layer of the same flexible adhesive as above is applied. Apply a magnetically conductive adhesive 4'!r7 to establish electrical continuity. Place the entire crystal oscillator piece 5 on top of this and allow it to harden completely. As shown in Figure 2, between the crystal oscillator piece 5 and the circuit board 3, A flexible conductive adhesive 7 that hardens to become a rubber-like elastic material is provided.
It is constructed. Here, the semi-hardened flexible 41
1 The reason for providing the adhesive 1i1 is to reliably create a rubber-like elastic body without impairing conductivity.If you place the crystal oscillator directly on a low-viscosity adhesive, the adhesive This is because the crystal oscillation piece spreads laterally, the gap between the crystal oscillation piece and the circuit board becomes extremely small, and the elasticity 1i1 is almost completely lost, making it impossible to exhibit a sufficient effect.

ここで、弾性材として、フレキシブル導電接着剤をガに
したが、導電性でなくても良く、第6図に示すようにゴ
ム状の接着剤27で水晶発振片25を固定し、前記接層
剤27の外周に導邂材料24を固着して導通をとっても
効果は同等である〇又第4図に示す如く、セラミック基
板11上に金14製円筒上のサポートビン7あるいは板
状のサポータ−(図示せず)等を載1#する構成でもセ
ラミック基板11とサポートビン17とのIgl、ある
いはサポートビン17と水晶発振片15との間にフレキ
シブル導1接着剤等140弾性体を便用しても同等の効
果を有している。又第5図に示す様にサポートビン67
のスリットに氷晶発振片65が挿入されても、すき間を
フレキシブル4電@瘤剤454の弾性材で埋めて固定す
れば同等の効果全イしている。
Here, a flexible conductive adhesive is used as the elastic material, but it does not have to be conductive.As shown in FIG. The effect is the same even if the conductive material 24 is fixed to the outer periphery of the agent 27 to establish conduction. Also, as shown in FIG. 4, a cylindrical support bottle 7 made of gold 14 or a plate-like support (not shown) etc., it is convenient to use an elastic material such as a flexible conductive adhesive between the ceramic substrate 11 and the support bin 17, or between the support bin 17 and the crystal oscillation piece 15. However, it has the same effect. Also, as shown in Fig. 5, the support bin 67
Even if the ice crystal oscillation piece 65 is inserted into the slit, the same effect can be obtained if the gap is filled and fixed with the elastic material of the flexible 4-electromagnetic agent 454.

本発明の実施1刈による水晶発振器及び従来列の構成に
よる水晶発振器の落下試験結果を第6吠に示す。46図
は縦軸にワレの発生率(憾)、横軸に落下高さくcrn
)を表わしている。本(ゾ1によれば従来例の水晶′@
撮器Aは約25cyy+からワレが発生するのに対し、
本発明による水晶発振器Bは約75αからワレが発生し
ておシ、本発明の構成による水晶発す原器は従来例と比
べ約6倍の高さから落下した時の衝撃に耐えることがで
きる。
The drop test results of the crystal oscillator according to the first embodiment of the present invention and the crystal oscillator according to the conventional row configuration are shown in the sixth column. In Figure 46, the vertical axis shows the crack occurrence rate (regrettably), and the horizontal axis shows the fall height (crn).
). According to the book (Zo 1, the conventional crystal '@
In contrast to camera A, cracks occur from about 25 cyy+.
The crystal oscillator B according to the present invention cracks from about 75α, and the crystal oscillator with the structure of the present invention can withstand the impact when dropped from about 6 times the height compared to the conventional example.

又本例は水晶発振片を用いた水晶発振器により説明した
が、他の圧電発振片例えば、タンタル岐リチウム、セラ
ミック等にも同等の効果を有している。
Further, although this example has been explained using a crystal oscillator using a crystal oscillation piece, other piezoelectric oscillation pieces such as tantalum-plated lithium, ceramic, etc. have the same effect.

[発明の効果] 以上述べた本発明の構成の圧電発振器によれば圧電発振
片と回路基板との間に設けられている弾性材による緩衝
層が衝撃、振gIhを吸収することによって、圧電発振
器の落下等による衝撃、振動が加わっても直接圧電発振
片に伝わらず、圧電発振片のワレが起こシにくくなる。
[Effects of the Invention] According to the piezoelectric oscillator having the configuration of the present invention described above, the buffer layer made of an elastic material provided between the piezoelectric oscillation piece and the circuit board absorbs shock and vibration gIh, so that the piezoelectric oscillator Even if a shock or vibration is applied due to a fall, etc., it is not directly transmitted to the piezoelectric oscillating piece, making it difficult for the piezoelectric oscillating piece to crack.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(a)、第1図(b)、第2図は本発明の圧電発
振器実施例を示し、第1図(alは平面図、第1図(1
))は正面図、第2図は接層部分の拡大図。 1・・・セラミック基板 2・・・素子類 5・・・回
路基板 4・・・フレキシブル導電接着剤 5・・・水
晶発振片 6・・・ステム 7・・・半硬fヒさせたフ
レキシブル導電接着剤 第5図、第4図、第5図は本発明の圧!発振器の[6用
例を表わす正面図の拡大図。 第6I図は本発明の圧電発振器の効果を表わす°聞(樅
軸に水晶発振片のワレの発生率、横軸に落下高さを表わ
す。) ’:!! 7 (メJは従来の圧′α発振器を表わす正
面断面図O以   上
1(a), 1(b), and 2 show embodiments of the piezoelectric oscillator of the present invention.
)) is a front view, and Figure 2 is an enlarged view of the contact layer. 1...Ceramic board 2...Elements 5...Circuit board 4...Flexible conductive adhesive 5...Crystal oscillator piece 6...Stem 7...Semi-rigid flexible conductive material Adhesive Figures 5, 4, and 5 are the pressure of the present invention! FIG. 6 is an enlarged front view of the oscillator. Figure 6I shows the effect of the piezoelectric oscillator of the present invention (the fir axis shows the cracking rate of the crystal oscillator piece, and the horizontal axis shows the falling height). ! 7 (Member J is a front cross-sectional view of a conventional pressure α oscillator.

Claims (1)

【特許請求の範囲】[Claims]  圧電発振片を発振させる機能を有する発振回路を構成
した回路基板が、ベースとなるステムに固着されており
、前記基板上に圧電発振片が、電気的に導通を取つて固
着されてなる圧電発振器の、前記圧電発振片と前記回路
基板との間に少なくとも1層以上の弾性材を有した構成
のサポーターを有していることを特徴とする圧電発振器
A piezoelectric oscillator in which a circuit board forming an oscillation circuit having a function of oscillating a piezoelectric oscillator piece is fixed to a base stem, and a piezoelectric oscillator piece is fixed on the substrate with electrical continuity. A piezoelectric oscillator according to the above, further comprising a supporter having at least one layer of elastic material between the piezoelectric oscillation piece and the circuit board.
JP4976386A 1986-03-07 1986-03-07 Piezoelectric oscillator Pending JPS62207008A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4976386A JPS62207008A (en) 1986-03-07 1986-03-07 Piezoelectric oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4976386A JPS62207008A (en) 1986-03-07 1986-03-07 Piezoelectric oscillator

Publications (1)

Publication Number Publication Date
JPS62207008A true JPS62207008A (en) 1987-09-11

Family

ID=12840213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4976386A Pending JPS62207008A (en) 1986-03-07 1986-03-07 Piezoelectric oscillator

Country Status (1)

Country Link
JP (1) JPS62207008A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01171311A (en) * 1987-12-25 1989-07-06 Nippon Dempa Kogyo Co Ltd Piezoelectric vibrator
JPH01291510A (en) * 1988-05-18 1989-11-24 Nippon Dempa Kogyo Co Ltd Surface acoustic wave device
JPH0215707A (en) * 1988-07-01 1990-01-19 Seiko Electronic Components Ltd Supporting structure for crystal resonator
EP0680663A1 (en) * 1993-11-24 1995-11-08 Motorola, Inc. Method of mounting a piezoelectric element to a substrate
EP0686310A1 (en) * 1993-12-23 1995-12-13 Motorola, Inc. A method of compliantly mounting a piezoelectric device
US7015627B2 (en) 2000-09-06 2006-03-21 Seiko Epson Corporation Piezoelectric device and manufacturing method therefor
AU2002221088B2 (en) * 2000-12-07 2007-01-18 Ge Healthcare Bio-Sciences Kk Chip quartz oscillator and liquid-phase sensor

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01171311A (en) * 1987-12-25 1989-07-06 Nippon Dempa Kogyo Co Ltd Piezoelectric vibrator
JPH01291510A (en) * 1988-05-18 1989-11-24 Nippon Dempa Kogyo Co Ltd Surface acoustic wave device
JPH0215707A (en) * 1988-07-01 1990-01-19 Seiko Electronic Components Ltd Supporting structure for crystal resonator
EP0680663A1 (en) * 1993-11-24 1995-11-08 Motorola, Inc. Method of mounting a piezoelectric element to a substrate
EP0680663A4 (en) * 1993-11-24 1996-04-03 Motorola Inc Method of mounting a piezoelectric element to a substrate.
EP0686310A1 (en) * 1993-12-23 1995-12-13 Motorola, Inc. A method of compliantly mounting a piezoelectric device
EP0686310A4 (en) * 1993-12-23 1996-04-03 Motorola Inc A method of compliantly mounting a piezoelectric device
US7015627B2 (en) 2000-09-06 2006-03-21 Seiko Epson Corporation Piezoelectric device and manufacturing method therefor
AU2002221088B2 (en) * 2000-12-07 2007-01-18 Ge Healthcare Bio-Sciences Kk Chip quartz oscillator and liquid-phase sensor

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