JPS57141945A - Cooling module - Google Patents

Cooling module

Info

Publication number
JPS57141945A
JPS57141945A JP56026525A JP2652581A JPS57141945A JP S57141945 A JPS57141945 A JP S57141945A JP 56026525 A JP56026525 A JP 56026525A JP 2652581 A JP2652581 A JP 2652581A JP S57141945 A JPS57141945 A JP S57141945A
Authority
JP
Japan
Prior art keywords
shielding plate
substrate
cap
module
heating elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56026525A
Other languages
Japanese (ja)
Other versions
JPS636144B2 (en
Inventor
Nobuo Kamehara
Kishio Yokouchi
Koichi Niwa
Kyohei Murakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56026525A priority Critical patent/JPS57141945A/en
Publication of JPS57141945A publication Critical patent/JPS57141945A/en
Publication of JPS636144B2 publication Critical patent/JPS636144B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the stagnation and accumulation of air bubbles and to improve the cooling efficiency of the subject module by a method wherein, in the module in which a substrate is hermetically covered by a cap and a refrigerant is sealed, a refeigerant shielding plate is provided on the plurality of heating elements to be installed on the substrate. CONSTITUTION:A metal cap 16 with a radiation fin 15 is hermetically sealed on a ceramic substrate 12 whereon a plurality of heating elements 11 are installed in line. A shielding plate 17, which partitions between each heating element, is arranged on the substrate 12 located inside the cap 16, and a refrigerant 19 is sealed in the plurality of chambers which are pertitioned by a shielding plate in such a manner that a space region 18 is provided at the upper part of the chambers. A metal of good thermal conductivity such as Al and the like is used as the material for the metal cap and the shielding plate 17, and the shielding plate 17 which was assembled in lattice type is inserted and fixed in the grooves 20a and 20b which were provided on the substrate 12 and the cap 16. Accordingly, the radiation efficiency of the module is improved and the cooling capacity thereof can be increased, because no air bubbles are accumulated between the heating elements and the shielding plates.
JP56026525A 1981-02-25 1981-02-25 Cooling module Granted JPS57141945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56026525A JPS57141945A (en) 1981-02-25 1981-02-25 Cooling module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56026525A JPS57141945A (en) 1981-02-25 1981-02-25 Cooling module

Publications (2)

Publication Number Publication Date
JPS57141945A true JPS57141945A (en) 1982-09-02
JPS636144B2 JPS636144B2 (en) 1988-02-08

Family

ID=12195890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56026525A Granted JPS57141945A (en) 1981-02-25 1981-02-25 Cooling module

Country Status (1)

Country Link
JP (1) JPS57141945A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215797A (en) * 1983-03-24 1984-12-05 ユ−オ−ピ−・インコ−ポレ−テツド Intensified nuclear boiling surface tape and cooling of electronic part
JPH0414248A (en) * 1990-04-27 1992-01-20 Digital Equip Corp <Dec> Independent cooling chamber of multichip unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59215797A (en) * 1983-03-24 1984-12-05 ユ−オ−ピ−・インコ−ポレ−テツド Intensified nuclear boiling surface tape and cooling of electronic part
JPH0414248A (en) * 1990-04-27 1992-01-20 Digital Equip Corp <Dec> Independent cooling chamber of multichip unit

Also Published As

Publication number Publication date
JPS636144B2 (en) 1988-02-08

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