JPS5210845A - Method of improving brazability of conductive plate - Google Patents
Method of improving brazability of conductive plateInfo
- Publication number
- JPS5210845A JPS5210845A JP51082854A JP8285476A JPS5210845A JP S5210845 A JPS5210845 A JP S5210845A JP 51082854 A JP51082854 A JP 51082854A JP 8285476 A JP8285476 A JP 8285476A JP S5210845 A JPS5210845 A JP S5210845A
- Authority
- JP
- Japan
- Prior art keywords
- conductive plate
- brazability
- improving
- improving brazability
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2531163A DE2531163C2 (de) | 1975-07-11 | 1975-07-11 | Verfahren zur Verbesserung der Lötbarkeit elektrischer Leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5210845A true JPS5210845A (en) | 1977-01-27 |
Family
ID=5951332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51082854A Pending JPS5210845A (en) | 1975-07-11 | 1976-07-12 | Method of improving brazability of conductive plate |
Country Status (11)
Country | Link |
---|---|
US (1) | US4046620A (ja) |
JP (1) | JPS5210845A (ja) |
AT (1) | AT352206B (ja) |
BE (1) | BE843979A (ja) |
CH (1) | CH603298A5 (ja) |
DE (1) | DE2531163C2 (ja) |
FR (1) | FR2317374A1 (ja) |
GB (1) | GB1484542A (ja) |
IT (1) | IT1067053B (ja) |
NL (1) | NL7607452A (ja) |
SE (1) | SE413329B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5921635A (ja) * | 1982-07-01 | 1984-02-03 | エクソン・リサ−チ・アンド・エンヂニアリング・コムパニ− | オスミウム酸化物触媒およびカルボン酸塩助触媒の存在下に於けるオレフインのヒドロキシル化方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2849894A1 (de) * | 1978-11-17 | 1980-05-29 | Hoechst Ag | Verfahren zum reinigen von kupfer enthaltenden metalloberflaechen |
US4373656A (en) * | 1981-07-17 | 1983-02-15 | Western Electric Company, Inc. | Method of preserving the solderability of copper |
US4574094A (en) * | 1983-06-09 | 1986-03-04 | Kollmorgen Technologies Corporation | Metallization of ceramics |
US4666744A (en) * | 1984-05-10 | 1987-05-19 | Kollmorgen Technologies Corporation | Process for avoiding blister formation in electroless metallization of ceramic substrates |
US4701352A (en) * | 1984-05-10 | 1987-10-20 | Kollmorgen Corporation | Surface preparation of ceramic substrates for metallization |
US4654116A (en) * | 1984-11-09 | 1987-03-31 | American Electronic Laboratories, Inc. | Method for producing high resolution etched circuit patterns from clad laminates |
US4927700A (en) * | 1988-02-24 | 1990-05-22 | Psi Star | Copper etching process and product with controlled nitrous acid reaction |
US4846918A (en) * | 1988-02-24 | 1989-07-11 | Psi Star | Copper etching process and product with controlled nitrous acid reaction |
US4956035A (en) * | 1989-08-01 | 1990-09-11 | Rd Chemical Company | Composition and process for promoting adhesion on metal surfaces |
US6383723B1 (en) * | 1998-08-28 | 2002-05-07 | Micron Technology, Inc. | Method to clean substrate and improve photoresist profile |
US20040147422A1 (en) | 2003-01-23 | 2004-07-29 | Hatch Andrew M. | Cleaner composition for formed metal articles |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3020175A (en) * | 1958-06-12 | 1962-02-06 | Gen Dynamics Corp | Chemical cleaning of printed circuits |
US3367875A (en) * | 1964-08-19 | 1968-02-06 | Hunt Chem Corp Philip A | Composition for etching copper and copper-containing alloys |
IL33876A0 (en) * | 1969-03-28 | 1970-04-20 | Miles Lab | Anti-tarnish composition for metal surfaces and process for its use |
GB1320589A (en) * | 1971-02-05 | 1973-06-13 | Formica Int | Surface cleaning compositions for copper and copper alloys |
US3887405A (en) * | 1974-05-10 | 1975-06-03 | Minnesota Mining & Mfg | Method and composition for cleaning copper surfaces |
-
1975
- 1975-07-11 DE DE2531163A patent/DE2531163C2/de not_active Expired
-
1976
- 1976-04-05 CH CH422776A patent/CH603298A5/xx not_active IP Right Cessation
- 1976-05-04 GB GB18120/76A patent/GB1484542A/en not_active Expired
- 1976-05-19 AT AT364276A patent/AT352206B/de not_active IP Right Cessation
- 1976-06-30 FR FR7619957A patent/FR2317374A1/fr active Granted
- 1976-07-05 SE SE7607677A patent/SE413329B/xx unknown
- 1976-07-06 NL NL7607452A patent/NL7607452A/xx not_active Application Discontinuation
- 1976-07-08 US US05/703,373 patent/US4046620A/en not_active Expired - Lifetime
- 1976-07-08 IT IT25128/76A patent/IT1067053B/it active
- 1976-07-09 BE BE168783A patent/BE843979A/xx unknown
- 1976-07-12 JP JP51082854A patent/JPS5210845A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5921635A (ja) * | 1982-07-01 | 1984-02-03 | エクソン・リサ−チ・アンド・エンヂニアリング・コムパニ− | オスミウム酸化物触媒およびカルボン酸塩助触媒の存在下に於けるオレフインのヒドロキシル化方法 |
Also Published As
Publication number | Publication date |
---|---|
DE2531163A1 (de) | 1977-02-03 |
SE7607677L (sv) | 1977-01-12 |
US4046620A (en) | 1977-09-06 |
BE843979A (fr) | 1976-11-03 |
ATA364276A (de) | 1979-02-15 |
FR2317374A1 (fr) | 1977-02-04 |
NL7607452A (nl) | 1977-01-13 |
FR2317374B1 (ja) | 1978-09-01 |
AT352206B (de) | 1979-09-10 |
IT1067053B (it) | 1985-03-12 |
GB1484542A (en) | 1977-09-01 |
DE2531163C2 (de) | 1985-05-15 |
CH603298A5 (ja) | 1978-08-15 |
SE413329B (sv) | 1980-05-19 |
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