JPS5210845A - Method of improving brazability of conductive plate - Google Patents

Method of improving brazability of conductive plate

Info

Publication number
JPS5210845A
JPS5210845A JP51082854A JP8285476A JPS5210845A JP S5210845 A JPS5210845 A JP S5210845A JP 51082854 A JP51082854 A JP 51082854A JP 8285476 A JP8285476 A JP 8285476A JP S5210845 A JPS5210845 A JP S5210845A
Authority
JP
Japan
Prior art keywords
conductive plate
brazability
improving
improving brazability
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51082854A
Other languages
English (en)
Inventor
Andorasutsueku Erunsuto
Hadaasubetsuku Hansu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5210845A publication Critical patent/JPS5210845A/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206Cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/12Copper or alloys thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0315Oxidising metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0392Pretreatment of metal, e.g. before finish plating, etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157Using means for chemical reduction
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/122Organic non-polymeric compounds, e.g. oil, wax or thiol
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Switches (AREA)
JP51082854A 1975-07-11 1976-07-12 Method of improving brazability of conductive plate Pending JPS5210845A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2531163A DE2531163C2 (de) 1975-07-11 1975-07-11 Verfahren zur Verbesserung der Lötbarkeit elektrischer Leiterplatten

Publications (1)

Publication Number Publication Date
JPS5210845A true JPS5210845A (en) 1977-01-27

Family

ID=5951332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51082854A Pending JPS5210845A (en) 1975-07-11 1976-07-12 Method of improving brazability of conductive plate

Country Status (11)

Country Link
US (1) US4046620A (ja)
JP (1) JPS5210845A (ja)
AT (1) AT352206B (ja)
BE (1) BE843979A (ja)
CH (1) CH603298A5 (ja)
DE (1) DE2531163C2 (ja)
FR (1) FR2317374A1 (ja)
GB (1) GB1484542A (ja)
IT (1) IT1067053B (ja)
NL (1) NL7607452A (ja)
SE (1) SE413329B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921635A (ja) * 1982-07-01 1984-02-03 エクソン・リサ−チ・アンド・エンヂニアリング・コムパニ− オスミウム酸化物触媒およびカルボン酸塩助触媒の存在下に於けるオレフインのヒドロキシル化方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2849894A1 (de) * 1978-11-17 1980-05-29 Hoechst Ag Verfahren zum reinigen von kupfer enthaltenden metalloberflaechen
US4373656A (en) * 1981-07-17 1983-02-15 Western Electric Company, Inc. Method of preserving the solderability of copper
US4574094A (en) * 1983-06-09 1986-03-04 Kollmorgen Technologies Corporation Metallization of ceramics
US4666744A (en) * 1984-05-10 1987-05-19 Kollmorgen Technologies Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
US4701352A (en) * 1984-05-10 1987-10-20 Kollmorgen Corporation Surface preparation of ceramic substrates for metallization
US4654116A (en) * 1984-11-09 1987-03-31 American Electronic Laboratories, Inc. Method for producing high resolution etched circuit patterns from clad laminates
US4927700A (en) * 1988-02-24 1990-05-22 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4846918A (en) * 1988-02-24 1989-07-11 Psi Star Copper etching process and product with controlled nitrous acid reaction
US4956035A (en) * 1989-08-01 1990-09-11 Rd Chemical Company Composition and process for promoting adhesion on metal surfaces
US6383723B1 (en) * 1998-08-28 2002-05-07 Micron Technology, Inc. Method to clean substrate and improve photoresist profile
US20040147422A1 (en) 2003-01-23 2004-07-29 Hatch Andrew M. Cleaner composition for formed metal articles

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020175A (en) * 1958-06-12 1962-02-06 Gen Dynamics Corp Chemical cleaning of printed circuits
US3367875A (en) * 1964-08-19 1968-02-06 Hunt Chem Corp Philip A Composition for etching copper and copper-containing alloys
IL33876A0 (en) * 1969-03-28 1970-04-20 Miles Lab Anti-tarnish composition for metal surfaces and process for its use
GB1320589A (en) * 1971-02-05 1973-06-13 Formica Int Surface cleaning compositions for copper and copper alloys
US3887405A (en) * 1974-05-10 1975-06-03 Minnesota Mining & Mfg Method and composition for cleaning copper surfaces

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921635A (ja) * 1982-07-01 1984-02-03 エクソン・リサ−チ・アンド・エンヂニアリング・コムパニ− オスミウム酸化物触媒およびカルボン酸塩助触媒の存在下に於けるオレフインのヒドロキシル化方法

Also Published As

Publication number Publication date
DE2531163A1 (de) 1977-02-03
SE7607677L (sv) 1977-01-12
US4046620A (en) 1977-09-06
BE843979A (fr) 1976-11-03
ATA364276A (de) 1979-02-15
FR2317374A1 (fr) 1977-02-04
NL7607452A (nl) 1977-01-13
FR2317374B1 (ja) 1978-09-01
AT352206B (de) 1979-09-10
IT1067053B (it) 1985-03-12
GB1484542A (en) 1977-09-01
DE2531163C2 (de) 1985-05-15
CH603298A5 (ja) 1978-08-15
SE413329B (sv) 1980-05-19

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