JPH11298357A - High frequency device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make a high frequency device thin in thickness by providing an input terminal, a data input terminal, a power supply terminal and an output terminal which respectively have the same shape on one surface of a case and directly soldering the terminals to a master printed board. SOLUTION: A circuit is mounted on a printed circuit board and is housed in a metallic case 30. Both vertical side plates 33 of a frame 31 of the case 30 extend downward and are provided with legs 34 which are attached to a master printed board, an input terminal 11 is provided in a horizontal side plate 35 near one leg 34 and also, an output terminal 19 is provided near another leg 34. A power supply terminal 22 and a data input terminal 21 are provided on the same side face between the terminals 11 and 19. All of these terminals are a lead wire type and can be collectively dip-soldered to the master printed board. Also, the terminal can be electromagnetically isolated from the outside since they are encircled with the legs 34 and the plate 35.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency device for receiving television radio waves and the like.

[0002]

2. Description of the Related Art A conventional high-frequency device will be described below. A conventional high-frequency device includes an input terminal to which a high-frequency signal is input, a high-frequency amplifier circuit to which a signal input to the input terminal is supplied, and an output of the high-frequency amplifier circuit supplied to one input and the other input terminal. A mixing circuit to which the output of the local oscillation circuit is supplied, an intermediate frequency amplification circuit to which the output of the mixing circuit is supplied, an output terminal to which the output of the intermediate frequency amplification circuit is supplied, and The PLL circuit has a loop connection, a data input terminal for inputting data to the PLL circuit, and a power supply terminal for supplying power to these circuits.

[0003] These circuits are mounted on a printed circuit board, and the printed circuit board is housed in a substantially rectangular metal case 1 as shown in FIG. The input terminal 3 was mounted on one vertical side surface 2 of the case 1. As the input terminal 3, a large F-shaped plug or a large phono connector is used. A pin-shaped data input terminal 5, a power supply terminal 6, and an output terminal 7 are provided on a lateral side 4 adjacent to the vertical side 2.
These terminals except the input terminal 3 were directly dip-soldered to the parent printed circuit board.

[0004]

However, in such a conventional configuration, since a large-sized connector is used as the input terminal 3, a thin high-frequency device is provided which is restricted by the size of the connector. Was difficult.

Accordingly, an object of the present invention is to solve this problem and to provide a thinned high-frequency device.

[0006]

In order to achieve this object, a high-frequency device according to the present invention comprises an input terminal, a data input terminal, a power supply terminal, and an output terminal each having the same shape on one surface of a case. Are provided so that these terminals can be directly soldered to the parent printed circuit board.

As a result, a thinned high-frequency device can be provided.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention provides an input terminal to which a high-frequency signal is input, a high-frequency amplifier circuit to which a signal input to the input terminal is supplied, and this high-frequency amplifier circuit The output of the mixer is supplied to one input and the other input is supplied with the output of the local oscillation circuit, the intermediate frequency amplifier supplied with the output of the mixer, and the intermediate frequency amplifier. An output terminal to which an output is supplied, and a PL loop-connected to the local oscillation circuit.
An L circuit, a data input terminal for inputting data to the PLL circuit, a power supply terminal for supplying power to these circuits,
A substantially rectangular metal case for mounting these circuits on a printed circuit board and accommodating the printed circuit board is provided, and the input terminal and the data input terminal each having the same shape on one surface of the case. , The power supply terminal and the output terminal, these terminals are high-frequency devices that can be directly soldered to the parent printed circuit board, and without using a large-sized connector as an input terminal, other data input terminals and power supply Since a terminal having the same shape as the terminal and the output terminal is used, the high-frequency device can be made thinner.

Further, since these terminals are provided on the same surface and are provided so as to be directly solderable to the parent printed circuit board, it is not necessary to mount a cable having a high-frequency connector mounted in a separate process as in the prior art. Since these steps can be performed in the same step, the productivity of the device using this high-frequency device can be improved.

[0010] Furthermore, since it can be soldered directly to the parent printed circuit board, reliability against vibrations is particularly increased.

Furthermore, since a large connector is not required, weight reduction and cost reduction can be achieved. The case according to the second aspect of the present invention is the high-frequency device according to the first aspect, which is vertically mounted on the parent printed circuit board, and can be vertically mounted on the parent printed circuit board. Mounting density is improved.

According to a third aspect of the present invention, an input terminal, a data input terminal, a power supply terminal, and an output terminal are mounted on a lower surface of a case, and both vertical side surfaces adjacent to the lower surface of the case are mounted on the case. 2. The high-frequency device according to claim 1, further comprising legs that extend and are attached to the parent printed circuit board. Both ends of these terminals are shielded at high frequencies by the legs and the lower surface. The terminal is protected from the outside in high frequency.

According to a fourth aspect of the present invention, a first signal separating means provided between an input terminal and a high-frequency circuit, and a tuning signal input between the input terminal and a local oscillation circuit are provided. A second signal separating means, wherein the first signal separating means allows a high frequency signal component input to the input terminal to pass therethrough and prevents a DC component from passing therethrough; and the second signal separating means comprises a DC component. 4. The high-frequency device according to claim 3, wherein the tuning voltage of the local oscillation circuit is superimposed on the input terminal.
The tuning of the high-frequency device can be performed directly from the outside, and the inspection efficiency can be improved. Further, since a terminal for deriving the tuning voltage is not required, the size can be reduced and the cost can be reduced.

According to a fifth aspect of the present invention, in the high-frequency device according to the fourth aspect, the wiring of the second signal separating means is thinner than the wiring through which the high-frequency signal is transmitted. The size can be reduced.

According to a sixth aspect of the present invention, in the high frequency device according to the fourth aspect, the first signal separating means uses a capacitor of about 10 PF and the second signal separating means uses an inductance of about 5 μH. In addition, the first signal separating means and the second signal separating means can be realized with a simple circuit.

According to a seventh aspect of the present invention, the first signal separating means provided between the input terminal and the high-frequency circuit, and the power supply supplied to the input terminal and each circuit are provided. A second signal separating means, wherein the first signal separating means allows a high frequency signal component input to the input terminal to pass therethrough and prevents a DC component from passing therethrough; and the second signal separating means comprises a DC component. 4. The high-frequency device according to claim 3, wherein power is supplied from an input terminal, so that a terminal for supplying power is not required, and the high-frequency device is reduced in size. At the same time, lower prices can be realized.

According to the eighth aspect of the present invention, the wiring of the second signal separating means is thicker than the wiring through which the high frequency signal is transmitted, and the power supply pattern is thicker. The DC resistance is small, the voltage drop due to the pattern is small, and no wasteful power is consumed.

According to a ninth aspect of the present invention, in the high frequency device according to the seventh aspect, the first signal separating means uses a capacitor of about 10 PF and the second signal separating means uses an inductance of about 5 μH. In addition, the first signal separating means and the second signal separating means can be realized with a simple circuit.

According to a tenth aspect of the present invention, there is provided the high-frequency device according to the third aspect, wherein an input terminal is provided near one vertical side surface and an output terminal is provided near the other vertical side surface. Since the signal is separated from the output signal, the influence between the two signals is reduced.

According to an eleventh aspect of the present invention, there is provided the high-frequency device according to the first aspect, wherein the case is mounted on the parent printed circuit board in a down position. The thickness of the parent printed circuit board after mounting can be reduced, and an apparatus in which the parent printed circuit boards are stacked and stored can be realized.

According to a twelfth aspect of the present invention, a first signal separating means provided between an input terminal and a high-frequency circuit, and a tuning voltage input of the local oscillation circuit are provided between the input terminal and a local oscillation circuit. A second signal separating means, wherein the first signal separating means allows a high frequency signal component input to the input terminal to pass therethrough and prevents a DC component from passing therethrough; and the second signal separating means comprises a DC component. The high-frequency device according to claim 11, wherein the high-frequency device is configured to pass the high-frequency component and to prevent the high-frequency component from passing.
Since the tuning voltage of the local oscillation circuit is superimposed on the input terminal, it is possible to select a high-frequency device directly from the outside,
Inspection efficiency can be increased. Further, since a terminal for deriving the tuning voltage is not required, the size can be reduced and the cost can be reduced.

According to a thirteenth aspect of the present invention, in the high-frequency device according to the twelfth aspect, the wiring of the second signal separating means is thinner than the wiring through which the high-frequency signal is transmitted. The size can be reduced.

According to a fourteenth aspect of the present invention, the first signal separating means uses a capacitor of approximately 10 PF and a second signal separating means.
13. The high-frequency device according to claim 12, wherein the signal separating means uses an inductance of about 5 μH,
And the second signal separating means can be realized.

According to a fifteenth aspect of the present invention, the first signal separating means provided between the input terminal and the high frequency circuit and the power supply supplied to each circuit are provided between the input terminal and the power supply supplied to each circuit. A second signal separating means, wherein the first signal separating means allows a high frequency signal component input to the input terminal to pass therethrough and prevents a DC component from passing therethrough; and the second signal separating means comprises a DC component. 12. The high-frequency device according to claim 11, wherein the power is supplied from an input terminal, so that a terminal for supplying power is not required, and the high-frequency device is reduced in size. At the same time, lower prices can be realized.

According to a sixteenth aspect of the present invention, in the high frequency device according to the fifteenth aspect, the wiring of the second signal separating means is wider than the wiring through which the high frequency signal is transmitted. The DC resistance is small, the voltage drop due to the pattern is small, and no wasteful power is consumed.

The first signal separating means of the present invention uses a capacitor of about 10 PF and a second signal separating means.
16. The high frequency device according to claim 15, wherein said signal separating means uses an inductance of approximately 5 μH,
And the second signal separating means can be realized.

The invention according to claim 18 is the high-frequency device according to claim 11, wherein an input terminal is provided near one side surface of the frame and an output terminal is provided near the other side surface of the frame. Since the input signal and the output signal are separated from each other, the influence between the two signals is reduced.

According to a nineteenth aspect of the present invention, there is provided the high-frequency device according to the first aspect of the present invention, wherein the printed circuit board is a surface mounting board capable of being reflow-soldered to the parent printed board. A good device can be realized. Further, downsizing can be realized.

According to a twentieth aspect of the present invention, a first signal separating means provided between an input terminal and a high-frequency circuit and a tuning voltage input of a local oscillation circuit are provided between the input terminal and a local oscillation circuit. A second signal separating means, wherein the first signal separating means allows a high frequency signal component input to the input terminal to pass therethrough and prevents a DC component from passing therethrough; and the second signal separating means comprises a DC component. 20. The high-frequency device according to claim 19, wherein the high-frequency device is configured to allow the passage of
Since the tuning voltage of the local oscillation circuit is superimposed on the input terminal, it is possible to select a high-frequency device directly from the outside,
Inspection efficiency can be increased. Further, since a terminal for deriving the tuning voltage is not required, the size can be reduced and the cost can be reduced.

According to the twenty-first aspect of the present invention, the wiring of the second signal separating means is the high-frequency device according to the twentieth aspect, wherein the wiring is thinner than the wiring through which the high-frequency signal is transmitted. Can be achieved.

The first signal separating means of the present invention uses a capacitor of about 10 PF and a second signal separating means.
21. The high frequency device according to claim 20, wherein the signal separating means uses an inductance of approximately 5 μH,
And the second signal separating means can be realized.

According to a twenty-third aspect of the present invention, the first signal separating means provided between the input terminal and the high frequency circuit and the power supply supplied to each circuit are provided between the input terminal and the power supply supplied to each circuit. A second signal separating means, wherein the first signal separating means allows a high frequency signal component input to the input terminal to pass therethrough and prevents a DC component from passing therethrough; and the second signal separating means comprises a DC component. 20. The high-frequency device according to claim 19, wherein the power is supplied from an input terminal, so that a terminal for supplying power is not required, and the high-frequency device is reduced in size. At the same time, lower prices can be realized.

According to a twenty-fourth aspect of the present invention, in the high-frequency device according to the twenty-third aspect, the wiring of the second signal separating means is thicker than the wiring through which the high-frequency signal is transmitted. The DC resistance is small, the voltage drop due to the pattern is small, and no wasteful power is consumed.

According to a twenty-fifth aspect of the present invention, the first signal separating means uses a capacitor of about 10 PF and a second signal separating means.
24. The high frequency apparatus according to claim 23, wherein the signal separating means uses an inductance of about 5 μH,
And the second signal separating means can be realized.

The invention according to claim 26 is the high-frequency device according to claim 19, wherein an input terminal is provided on one side surface of the printed circuit board and an output terminal is provided on the other side surface of the printed circuit board. The separation between the input signal and the output signal of the device is reduced, and the influence between the two signals is reduced.

An embodiment of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 1 is a block diagram of a high-frequency device according to Embodiment 1 of the present invention. In FIG. 1, the high-frequency device according to the present embodiment includes an input terminal 11 to which a high-frequency signal is input, a first signal separating unit 12 connected to the input terminal 11, and a first signal separating unit 12 connected to the input terminal 11. An input circuit 13 connected to the output, a high-frequency amplifier circuit 14 connected to the output of the input circuit 13, an inter-stage tuning circuit 15 connected to the output of the high-frequency amplifier circuit 14, and an inter-stage tuning circuit 15 Is connected to one input and the other input is connected to the output of a local oscillation circuit 16, an intermediate frequency amplifying circuit 18 connected to the output of the mixing circuit 17, An output terminal 19 to which the output of the frequency amplifying circuit 18 is connected; a PLL circuit 20 loop-connected to the local oscillation circuit 16;
Data input terminal 21 for inputting data to LL circuit 20
And a power supply terminal 22 for supplying power to these circuits. The power supply terminal 22 includes a 5V power supply supplied to the PLL circuit 20, a 9V power supply supplied to the amplifier circuits 14 and 18, and a 30V power supply supplied as a tuning voltage of the local oscillation circuit 16. The data input terminal 21 connected to the PLL circuit 20 has a data signal, a clock signal, and an enable signal. A lock detection signal is connected to a terminal from the PLL circuit 20.

The first signal separating means 12 is for passing a high frequency signal of approximately 50 MHz or more inputted to the input terminal 11 without loss and for blocking the passage of a DC signal. Is used. Reference numeral 23 denotes a second signal separating means connected between the input terminal 11 and the tuning voltage input of the local oscillation circuit 16, which prevents passage of the high-frequency signal and allows passage of a DC signal. In the embodiment, an inductance of 5 μH is used. It is desirable to make the input and output pattern wiring of the second signal separating means 23 as thin as possible when supplying a tuning voltage in order to reduce the size. Further, when used for power supply, it is desirable to increase the thickness as much as possible to reduce impedance. In the present embodiment, the width is made thinner or thicker than at least the wiring pattern of the high-frequency signal.

These circuits are printed circuit boards (not shown)
And housed in a metal case 30 as shown in FIG. The case 30 includes a substantially rectangular frame (frame body) 31 and covers 32 respectively placed on the front and back of the frame 31. Both vertical side plates 33 of the frame 31 are provided with legs 34 extending downward and attached to a parent printed circuit board (not shown). The input terminal 11 is provided on the lateral plate 35 near the one leg 34, and the output terminal 19 is provided near the other leg 34. By arranging the input terminal 11 and the output terminal 19 apart in this manner, interference between input and output can be prevented. A power supply terminal 22 and a data input terminal 21 are provided on the same side surface between the input terminal 11 and the output terminal 19. These terminals are all of the lead wire type, and can be collectively dip-soldered to the parent printed circuit board.

Since these terminals are surrounded by the legs 34 and the side plates 35, the terminals can be electromagnetically isolated from the outside.

(Embodiment 2) FIG. 3 shows a case 40 of a high-frequency device according to Embodiment 2. The electric circuit is the same as in the first embodiment. These circuits are mounted on a printed circuit board (not shown) and housed in a metal case 40 as shown in FIG. The case 40 includes a substantially rectangular frame (frame body) 41 and this frame 41.
And a cover 42 respectively placed on the front and back. Legs 44 are provided which extend downward from the frame 41 and are attached to a parent printed circuit board (not shown). The input terminal 1 is connected to the side plate near the one leg 44.
1 and an output terminal 1 near the other leg 44.
9 are provided. By arranging in this way,
Since the distance between the input and the output is increased, interference can be prevented. A power supply terminal 22 and a data input terminal 21 are provided on the same side surface between the input terminal 11 and the output terminal 19. These terminals are all of the lead wire type, and can be collectively dip-soldered to the parent printed circuit board.

These terminals are led out from an elliptical slit 45 provided in the lower cover 42 to the outside.

(Embodiment 3) FIG. 4 shows a high-frequency device 50 as a surface-mounted component according to Embodiment 3. The electric circuit is the same as in the first embodiment. These circuits are mounted on a printed board 51 and covered with a metal case 52 as shown in FIG. The printed board 51 has a substantially square shape, and terminals are provided on side surfaces thereof to enable reflow soldering. Printed circuit board 5
The input terminal 11 and the power supply terminal 22 are provided on one side of the device 1, and the data input terminal 21 and the output terminal 19 of the PLL circuit 20 are provided on the other side. Here, too, the input terminal 11 and the output terminal 19 are provided on a diagonal line, and the distance therebetween is large.

Reference numeral 53 denotes a ground terminal provided on an adjacent side surface.
1 and the output terminal 19 are separated at a high frequency.

[0044]

As described above, according to the present invention, an input terminal, a data input terminal, a power supply terminal, and an output terminal, each having the same shape, are provided on one surface of a case. It can be soldered directly to Therefore, since a terminal having the same shape as the other data input terminal, power supply terminal, and output terminal is used without using a large-sized connector as the input terminal, the high-frequency device can be made thinner.

Also, since these terminals are provided on the same surface and can be directly and simultaneously soldered to the parent printed circuit board, it is not necessary to mount a cable having a high-frequency connector mounted in a separate process as in the prior art. Instead, these terminals can be soldered in the same step, so that the productivity of the device using this high-frequency device can be improved.

Further, since it can be soldered directly to the parent printed circuit board, the reliability particularly against vibration is increased.

Further, since a large connector is not required, the weight and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram of a high-frequency device according to a first embodiment of the present invention.

2A is a front view of the high-frequency device housed in the case, and FIG.

FIG. 3A is a front view of a high-frequency device housed in a case according to Embodiment 2, and FIG.

FIG. 4A is a rear view of the high-frequency device according to the third embodiment, and FIG.

FIG. 5A is a front view of a conventional high-frequency device, and FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Input terminal 12 1st signal separation means 14 High frequency amplification circuit 16 Local oscillation circuit 17 Mixing circuit 18 Intermediate frequency amplification circuit 19 Output terminal 20 PLL circuit 21 Data input terminal 22 Power supply terminal 23 Second signal separation means 30 Case 31 Frame 33 vertical side plate 34 legs

Claims (26)

[Claims] An input terminal to which a high-frequency signal is input, a high-frequency amplifier circuit to which a signal input to the input terminal is supplied, and an output of the high-frequency amplifier circuit supplied to one input and the other input A mixing circuit to which the output of the local oscillation circuit is supplied, an intermediate frequency amplification circuit to which the output of the mixing circuit is supplied, an output terminal to which the output of the intermediate frequency amplification circuit is supplied, and A PLL circuit connected in a loop, a data input terminal for inputting data to the PLL circuit, a power supply terminal for supplying power to these circuits, and a circuit for mounting these circuits on a printed circuit board and housing the printed circuit board. A metal case having a rectangular shape, the input terminal having the same shape on one surface of the case, the data input terminal, the power supply terminal, A high-frequency device that has output terminals and these terminals can be directly soldered to the parent printed circuit board. 2. The high-frequency device according to claim 1, wherein the case is mounted vertically on the parent printed circuit board. 3. An input terminal, a data input terminal, a power supply terminal, and an output terminal are mounted on a lower surface of the case.
2. The high-frequency device according to claim 1, further comprising legs extending on both vertical side surfaces adjacent to a lower surface of the case and mounted on the parent printed circuit board. 4. A first signal separating means provided between an input terminal and a high-frequency circuit, and a second signal separating means provided between the input terminal and a tuning voltage input of a local oscillation circuit. Wherein the first signal separating means allows the high frequency signal component input to the input terminal to pass and prevents the DC component from passing, and the second signal separating means allows the DC component to pass and simultaneously The high-frequency device according to claim 3, which blocks passage. 5. The high-frequency device according to claim 4, wherein the wiring of the second signal separating means is thinner than the wiring through which the high-frequency signal is transmitted. 6. The first signal separating means uses a capacitor of about 10 PF, and the second signal separating means uses about 5 μm.
The high-frequency device according to claim 4, wherein an inductance of H is used. 7. A first signal separating means provided between an input terminal and a high-frequency circuit, and a second signal separating means provided between the input terminal and a power supply supplied to each circuit. Wherein the first signal separating means allows the high frequency signal component input to the input terminal to pass and prevents the DC component from passing, and the second signal separating means allows the DC component to pass and simultaneously The high-frequency device according to claim 3, which blocks passage. 8. The high-frequency device according to claim 7, wherein the wiring of the second signal separating means is thicker than the wiring through which the high-frequency signal is transmitted. 9. The first signal separating means uses a capacitor of about 10 PF, and the second signal separating means uses about 5 μm.
The high-frequency device according to claim 7, wherein an inductance of H is used. 10. An input terminal is provided near one of the vertical side surfaces, and an output terminal is provided near the other vertical side surface.
2. The high-frequency device according to claim 1. 11. The high-frequency device according to claim 1, wherein the case is mounted on the parent printed circuit board in a protruding manner. 12. A first signal separating means provided between an input terminal and a high-frequency circuit, and a second signal separating means provided between the input terminal and a tuning voltage input of a local oscillation circuit. Wherein the first signal separating means allows the high frequency signal component input to the input terminal to pass and prevents the DC component from passing, and the second signal separating means allows the DC component to pass and simultaneously Claim 1 for preventing passage
2. The high-frequency device according to 1. 13. The high-frequency device according to claim 12, wherein the wiring of the second signal separating means is thinner than the wiring through which the high-frequency signal is transmitted. 14. The first signal separating means uses a capacitor of about 10 PF, and the second signal separating means uses about 5 PF.
13. The high-frequency device according to claim 12, wherein an inductance of [mu] H is used. 15. A first signal separating means provided between an input terminal and a high-frequency circuit, and a second signal separating means provided between the input terminal and a power supply supplied to each circuit. Wherein the first signal separating means allows the high frequency signal component input to the input terminal to pass and prevents the DC component from passing, and the second signal separating means allows the DC component to pass and simultaneously The high-frequency device according to claim 11, which blocks passage. 16. The high-frequency device according to claim 15, wherein the wiring of the second signal separating means is thicker than the wiring through which the high-frequency signal is transmitted. 17. The first signal separating means uses a capacitor of about 10 PF, and the second signal separating means uses about 5 PF.
The high-frequency device according to claim 15, wherein an inductance of [mu] H is used. 18. The high-frequency device according to claim 11, wherein an input terminal is provided near one side surface of the frame, and an output terminal is provided near the other side surface of the frame. 19. The high-frequency device according to claim 1, wherein the printed circuit board is a surface mounting board that can be reflow-soldered to the parent printed circuit board. 20. A first signal separating means provided between an input terminal and a high-frequency circuit, and a second signal separating means provided between the input terminal and a tuning voltage input of a local oscillation circuit. Wherein the first signal separating means allows the high frequency signal component input to the input terminal to pass and prevents the DC component from passing, and the second signal separating means allows the DC component to pass and simultaneously Claim 1 for preventing passage
10. The high-frequency device according to 9. 21. The high-frequency device according to claim 12, wherein the wiring of the second signal separating means is thinner than the wiring through which the high-frequency signal is transmitted. 22. The first signal separating means uses a capacitor of about 10 PF, and the second signal separating means uses a capacitor of about 5 PF.
The high-frequency device according to claim 20, wherein an inductance of μH is used. 23. A first signal separating means provided between an input terminal and a high-frequency circuit, and a second signal separating means provided between the input terminal and a power supply supplied to each circuit. Wherein the first signal separating means allows the high frequency signal component input to the input terminal to pass and prevents the DC component from passing, and the second signal separating means allows the DC component to pass and simultaneously The high-frequency device according to claim 19, which blocks passage. 24. The high-frequency device according to claim 23, wherein the wiring of the second signal separating means is thicker than the wiring through which the high-frequency signal is transmitted. 25. The first signal separating means uses a capacitor of about 10 PF, and the second signal separating means uses a capacitor of about 5 PF.
24. The high-frequency device according to claim 23, wherein an inductance of μH is used. 26. The high-frequency device according to claim 19, wherein an input terminal is provided on one side surface of the printed circuit board, and an output terminal is provided on the other side surface of the printed circuit board.