JPH10294407A - Sheet-form heat conductive structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a heat transfer structure having a comparatively good heat conductivity by providing a sheet structure of a cloth made by weaving a metallic wire with a good heat conductivity and an elastic body which presses the wire in the vertical direction. SOLUTION: A heat transfer sheet structure body 20 for heat transfer of semiconductor packages 51 and 52 and of a heat transfer plate 80 is a sheet structure body made of a structure in which an elastic body 21 and a metallic wire 22 are woven. The construction body 20 is sandwiched between the semiconductor packages 51 and 52 having different heights and the heat transfer plate 80. Then the metallic wire 22 which is exposed from the upper surface caused by the elasticity of the elastic body 21 is pressed to the heat transfer plate 80 and the metallic wire 22 which is exposed from the lower surface is pressed to the surfaces of the semiconductor packages 51 and 52. The cloth whose mesh is small is contacted at many points or curved surfaces. As a result a heat transfer structure having a comparatively good heat transfer can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet-like heat transfer structure for transferring heat generated by a semiconductor component.

[0002]

2. Description of the Related Art A prior art example will be described with reference to an example of a heat transfer structure of a semiconductor component shown in FIG. The semiconductor packages 51 and 52 mounted on a printed circuit board or the like have different heights. Therefore, the heat transfer plate 80 and the semiconductor package 51,
A heat transfer structure that absorbs the step 65 between the 52 is required.
Conventionally, bellows-shaped leaf springs 61 and 62 formed by bending an elastic ribbon-like plate material are inserted and interposed, and heat transfer grease is applied to the upper and lower contact surfaces and pressed and used. With this structure, the plate springs 61, 6
2 can be handled by changing the bending angle.

[0003]

In the above structure,
Since the upper and lower heat transfer portions come into linear contact only at a few points at the bent end portions, there is a drawback that the heat resistance of the heat transfer structure is considerably high. In addition, there is also a problem that the heat transfer grease applied to lower the thermal resistance is diffused to the surroundings, thereby contaminating the printed circuit board. There were practical difficulties from these viewpoints.

An object of the present invention is to realize a sheet-like heat transfer structure having an elastic pressing structure and a multipoint contact structure.

[0005]

FIGS. 1 and 2 show a solution according to the present invention. First, in order to solve the above-mentioned problem, in the configuration of the present invention, a metal wire 22 having good heat conductivity is provided, and the metal wire 22 and the elastic body 21 are braided in a lattice shape to form the elastic body 21. This is a heat transfer sheet structure including an elastic body 21 that presses the metal wire 22 up and down. Thus, a sheet-like heat transfer structure having a multipoint contact structure having an elastic pressing structure is realized.

Secondly, in order to solve the above-mentioned problems, in the configuration of the present invention, a metal wire 22 having elasticity and good heat conductivity is used.
There is a heat transfer sheet structure in which the metal wires 22 are braided in a lattice shape to form an elastic structure that presses the metal wires 22 up and down by the elasticity of the elastic metal wire.

The shape of the metal wire 22 may be a thin metal wire formed in a circle, an ellipse, or a rectangle. Further, as the composition of the metal wire 22, there is a metal wire composition in which a single wire, an ultrafine wire is bundled, or an ultrafine wire is twisted and bundled.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings together with embodiments.

An embodiment of the present invention will be described with reference to a side view of a heat transfer structure of a semiconductor component shown in FIG. 1, an enlarged partial perspective view of a heat transfer structure of FIG. 2, and a sectional view of a metal wire. Elements corresponding to the conventional configuration are denoted by the same reference numerals.

The heat transfer sheet structure 20 for transferring heat between the semiconductor packages 51 and 52 and the heat transfer plate 80 according to the present invention is a sheet having a mesh structure in which an elastic body 21 and metal wires 22 are woven in a lattice. It is a structure. The elastic body 21 is a linear rubber or gel linear body having elasticity,
This is an intervention for pressing up and down 2. As shown in FIG. 2A, a thin metal wire 22 having good thermal conductivity is alternately woven. Due to the pressing deformation action of the elastic body, an action of absorbing the step 65 and pressing the metal wire 22 in the vertical direction can be obtained. When the heat transfer temperature is high, it goes without saying that an elastic material having heat resistance is used.

The metal wire 22 is a metal conductor having good heat conductivity,
For example, a wire made of a thin copper or copper alloy material is used, and a material that can bend and contact the upper and lower heat transfer contact surfaces by pressing the elastic body 21 is used. In addition, as the metal wire 22, FIG.
As shown in the above, in addition to a single wire formed in a circular, elliptical or rectangular shape, a bundle of ultrafine wires or a bundle of extrafine wires may be used. In the case of the metal wire 22 in which ultrafine wires are bundled,
Since bending is easier, there is an advantage that many metal parts can be pressed and adhered to the contact surface of the semiconductor package or the heat transfer plate.

According to the above-described sheet structure, as shown in the mounting state of FIG.
1 and 52 and the heat transfer plate 80. At this time, the metal wires 22 exposed on the upper surface are pressed tightly against the heat transfer plate 80 by the elastic action of the elastic body 21, and the metal wires 22 exposed on the lower surface are pressed tightly against the container surfaces of the semiconductor packages 51 and 52. Further, as a result of the woven lattice being arranged at a narrow interval, the lattice is pressed and contacted at a large number of pressed points or curved surfaces. As a result, a heat transfer structure having relatively good heat conductivity can be realized.

In the description of the above embodiment, the heat transfer sheet structure 20 in which the linear elastic body 21 and the metal wire 22 are woven is described.
However, if desired, a sheet structure may be used in which both are woven with linear metal wires 22 and the metal wires 22 themselves have elasticity. In this case, since both have good thermal conductivity, the heat transfer characteristics as a whole may be improved.

In the above description of the embodiment, an example is described in which one heat transfer sheet structure 20 is interposed.
As shown in a usage example in which the heat transfer sheet structure of FIG.
Is large, two or N heat transfer sheet structures 20 of the present invention can be used in a semiconductor package region having a low height. Thereby, even when there is a large step, an advantage that heat can be transferred relatively easily is obtained, and convenience in use is improved.

[0015]

According to the present invention, the following effects can be obtained from the above description. According to the sheet structure of the above-described invention, the metal wire 22 having good heat conductivity and the sheet structure in which the elastic body that presses the metal wire 22 in the vertical direction are woven in a lattice shape have a large number of metal wires 22 vertically. The effect of pressing the exposed metal end in the vertical direction while the elastic body exposed and opposite to each exposed metal wire is pressed and deformed is obtained. In addition, the effect of absorbing the step 65 can be obtained by the pressing deformation action of the elastic body. Further, since the heat transfer sheet structure 20 is in the form of a sheet, it can be easily cut and used in an arbitrary size corresponding to a semiconductor package, and the advantage of good convenience can be obtained. When there is a large step 65,
By using a plurality of the present heat transfer sheet structures 20, it is possible to obtain an advantage that the heat transfer sheet structure 20 can be applied to a large step.

[Brief description of the drawings]

FIG. 1 is a side view of a heat transfer structure of a semiconductor component according to the present invention.

FIG. 2 is an enlarged partial perspective view of a heat transfer structure and a cross-sectional structure diagram of a metal wire according to the present invention.

FIG. 3 is an example of a conventional heat transfer structure of a semiconductor component.

FIG. 4 is an example of use of the present invention in which a heat transfer sheet structure is partially stacked in two stages.

[Explanation of symbols]

 Reference Signs List 20 heat transfer sheet structure 21 elastic body 22 metal wire 51, 52 semiconductor package 61, 62 leaf spring 80 heat transfer plate

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takashi Okuda 1-32-1, Asahicho, Nerima-ku, Tokyo Advantest Co., Ltd.

Claims (4)

[Claims] 1. A sheet-like sheet comprising: a metal wire having good thermal conductivity; and an elastic body which braids the metal wire and the elastic body in a lattice shape and presses the metal wire up and down. Heat transfer structure. 2. A metal wire having elasticity and good thermal conductivity, and an elastic structure for knitting the metal wires together in a lattice shape and pressing the metal wire up and down is provided. Sheet heat transfer structure. 3. The sheet-shaped heat transfer structure according to claim 1, wherein the shape of the metal wire is a thin metal wire formed in a circle, an ellipse, or a rectangle. 4. The sheet heat transfer structure according to claim 3, wherein the composition of the metal wire is a single wire, a bundle of ultrafine wires, or a bundle of ultrafine wires.