JPH0989525A - Position detecting method for lead shoulder and for lead end - Google Patents
Position detecting method for lead shoulder and for lead endInfo
- Publication number
- JPH0989525A JPH0989525A JP7241126A JP24112695A JPH0989525A JP H0989525 A JPH0989525 A JP H0989525A JP 7241126 A JP7241126 A JP 7241126A JP 24112695 A JP24112695 A JP 24112695A JP H0989525 A JPH0989525 A JP H0989525A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- inspection area
- obtaining
- luminance histogram
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Image Analysis (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品のリードの半
田付状態の検査のためのリード肩部の位置検出方法およ
びリード先端部の位置検出方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead shoulder position detecting method and a lead tip position detecting method for inspecting a soldered state of a lead of an electronic component.
【０００２】[0002]
【従来の技術】リード付電子部品を基板に半田付けした
後、リードの先端部が基板の電極に正しく半田付けされ
ているか否かを検査する半田付け状態の検査が行われ
る。半田付状態の検査は、リードの先端部付近に検査エ
リアを設定し、検査エリアの輝度などの光学情報を入手
することにより行われる。ところが近年、リードの幅は
小さくなってリードは狭ピッチ化していることから、リ
ード先端部付近の正しい位置に検査エリアを的確に設定
することは困難になってきている。2. Description of the Related Art After soldering an electronic component with leads to a board, a soldering state inspection is performed to inspect whether the tip portions of the leads are correctly soldered to the electrodes of the board. The inspection of the soldering state is performed by setting an inspection area near the tip of the lead and obtaining optical information such as the brightness of the inspection area. However, in recent years, since the width of the lead has become smaller and the pitch of the lead has become narrower, it has become difficult to accurately set the inspection area at the correct position near the tip of the lead.
【０００３】そこで本出願人は、先きにリードの先端部
付近に検査エリアを設定する方法を提案した（特開平２
−４２３４４号）。このものは、リード肩部の重心位置
を求めた後、この重心位置からリード長の位置に検査エ
リアを設定するようにしている。Therefore, the present applicant first proposed a method of setting an inspection area in the vicinity of the tip of the lead (Japanese Patent Laid-Open No. Hei 2 (1999) -211).
-42344). In this device, after the barycentric position of the lead shoulder is obtained, the inspection area is set to the position of the lead length from this barycentric position.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら電子部品
の製造誤差のためにリード長にはばらつきがあり、この
ため上記従来方法ではリード先端部付近の正しい位置に
検査エリアを設定しにくく、そのため後工程で行われる
半田付状態の検査結果の信頼性が低いという問題点があ
った。However, there are variations in the lead length due to manufacturing errors of electronic parts, which makes it difficult to set the inspection area at the correct position near the tip of the lead in the above-mentioned conventional method. There is a problem that the reliability of the inspection result of the soldering state performed in 1) is low.
【０００５】したがって本発明は、電子部品のリードの
先端部付近の正しい位置に半田付状態の検査のための検
査エリアを設定するためのリードの肩部の位置検出方法
およびリード先端部の位置検出方法を提供することを目
的とする。Therefore, the present invention is directed to a method for detecting the position of the shoulder of the lead and a position detection of the tip of the lead for setting an inspection area for inspecting the soldering state at a correct position near the tip of the electronic component. The purpose is to provide a method.
【０００６】[0006]
【課題を解決するための手段】このために本発明は、リ
ードの上方から光を照射して上方のカメラで観察し、暗
い部分を検出する工程と、暗い部分を乞含する第１の検
査エリアを設定する工程と、第１の検査エリアにおける
リードの幅方向の輝度のヒストグラムを求める工程と、
輝度のヒストグラムの頂点を通る線を求めることにより
リードのＹ座標を求める工程と、暗い部分を乞含する第
２の検査エリアを設定する工程と、第２の検査エリアに
おけるリードの長手方向の輝度のヒストグラムを求める
工程と、輝度のヒストグラムの立下り点を求めることに
よりリードの肩部のＸ座標を求める工程とからリード肩
部の位置検出方法を構成した。To this end, according to the present invention, a step of irradiating light from above a lead and observing with a camera above to detect a dark portion, and a first inspection including a dark portion. A step of setting an area, a step of obtaining a histogram of luminance in the width direction of the lead in the first inspection area,
The step of obtaining the Y coordinate of the lead by obtaining the line passing through the vertex of the luminance histogram, the step of setting the second inspection area including the dark portion, and the luminance in the longitudinal direction of the lead in the second inspection area. The method for detecting the position of the lead shoulder portion is configured by the step of obtaining the histogram and the step of obtaining the X coordinate of the lead shoulder portion by obtaining the falling point of the luminance histogram.
【０００７】また電子部品の基準位置を求める工程と、
基準位置からリード長離れたリード先端部付近に検査エ
リアを設定する工程と、検査エリアにおけるリードの長
手方向の輝度のヒストグラムを求める工程と、輝度のヒ
ストグラムを微分して輝度のヒストグラムが高から低へ
変化する立下り点をリード先端部の候補点として複数点
求める工程と、リード先端部の輝度条件から各々の候補
点を得点化し、この得点化の結果から何れかの候補点を
リード先端部として決定する工程とからリード先端部の
位置検出方法を構成した。Also, a step of obtaining a reference position of the electronic component,
The step of setting the inspection area near the tip of the lead away from the reference position by the lead length, the step of obtaining the histogram of the luminance in the longitudinal direction of the lead in the inspection area, and the luminance histogram is differentiated to obtain a luminance histogram from high to low. The step of obtaining a plurality of falling points that change to a candidate point for the lead tip, and scoring each candidate point from the brightness condition of the lead tip. Then, the method for detecting the position of the tip of the lead is constituted.
【０００８】[0008]
【作用】上記構成によれば、検査エリアの輝度のヒスト
グラムに基づいてリード肩部やリード先端部の正しい位
置を求めることができる。According to the above construction, the correct position of the lead shoulder portion or the lead tip portion can be obtained based on the luminance histogram of the inspection area.
【０００９】[0009]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。図１は本発明の一実施例の電子部品の半田付
状態の検査装置の斜視図、図２および図３は同電子部品
のリード肩部の位置検出方法の説明図である。図１にお
いて、可動テーブル１上に基板２が載置されている。基
板２には電子部品３が半田付けされている。電子部品３
のモールド体４からはリード５が屈曲して延出してお
り、リード５の先端部には半田フィレット６が形成され
ている。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of a soldering state inspection apparatus for an electronic component according to an embodiment of the present invention, and FIGS. 2 and 3 are explanatory views of a lead shoulder position detecting method for the electronic component. In FIG. 1, a substrate 2 is placed on a movable table 1. Electronic components 3 are soldered to the board 2. Electronic component 3
Leads 5 are bent and extend from the mold body 4, and solder fillets 6 are formed at the tip ends of the leads 5.
【００１０】７は可動テーブル１の上方に設けられたカ
メラ、８はリング状の光源である。カメラ７は画像認識
部９に接続されている。また画像認識部９は制御部１０
に接続されている。制御部１０は可動テーブル１、光源
８などを制御する。上方の光源８から基板２に向って光
を照射し、可動テーブル１を駆動して基板をＸ方向やＹ
方向に水平移動させながら、カメラ７はリード５の先端
部付近の画像を入手する。また制御部１０は、カメラ７
に入手された画像データに基づいて、後述する様々な演
算や判定などを行う。Reference numeral 7 is a camera provided above the movable table 1, and 8 is a ring-shaped light source. The camera 7 is connected to the image recognition unit 9. Further, the image recognition unit 9 is controlled by the control unit 10.
It is connected to the. The control unit 10 controls the movable table 1, the light source 8, and the like. Light is emitted from the upper light source 8 toward the substrate 2, and the movable table 1 is driven to move the substrate in the X and Y directions.
The camera 7 acquires an image near the tip of the lead 5 while moving horizontally in the direction. Further, the control unit 10 controls the camera 7
Various calculations and determinations described later are performed on the basis of the image data obtained in.
【００１１】次に、図２および図３を参照してリード肩
部の位置検出方法を説明する。まず図２（ａ）に示すよ
うに、リード５に向って上方の光源８から光を照射し、
上方のカメラ７により観察する。図２（ｂ）は、この観
察においてカメラ７に入手された明暗の輝度画像を示し
ている。図２（ａ）に示すように、フラットなリード基
端部５ａ、リード先端部５ｃに垂直に入射した光は垂直
に反射してカメラ７に入光するので、リード基端部５ａ
とリード先端部５ｃは図２（ｂ）に示すように明るく
（白く）観察される。またリード傾斜部５ｂや半田フィ
レット６の傾斜した上面に垂直に入射した光は斜下方へ
反射されるのでカメラ７には入光せず、暗く（黒く）観
察される。またモールド体４は黒色樹脂であるから暗く
（黒く）観察される。また本実施例の基板２は暗緑色の
ガラエポ樹脂であり暗く（黒く）観察される。また暗く
観察される部分には、ノイズｎのために部分的に明るく
観察される。Next, a method of detecting the position of the lead shoulder will be described with reference to FIGS. First, as shown in FIG. 2 (a), light is emitted from the light source 8 above the lead 5,
Observe with the upper camera 7. FIG. 2B shows a brightness / darkness brightness image obtained by the camera 7 in this observation. As shown in FIG. 2A, the light that is vertically incident on the flat lead end portion 5a and the lead end portion 5c is reflected vertically and enters the camera 7, so that the lead base end portion 5a is formed.
The lead tip portion 5c is observed bright (white) as shown in FIG. 2 (b). Further, the light vertically incident on the inclined upper surface of the lead inclined portion 5b and the solder fillet 6 is reflected obliquely downward, so that it does not enter the camera 7 and is observed dark (black). Further, since the molded body 4 is a black resin, it is observed dark (black). Further, the substrate 2 of this embodiment is a dark green glass epoxy resin and is observed dark (black). Further, in the portion that is observed darkly, due to noise n, it is observed partially brightly.
【００１２】次に図２（ｃ）に示すように、リード肩部
（リード傾斜部５ｂの立下り点）Ｋを乞含すると予想さ
れる位置に第１の検査エリアＡを設定する。次に図３
（ａ）に示すように、リード５の幅方向における輝度の
ヒストグラムａを求め、かつヒストグラムａの頂点を通
る線Ｎを求める。この線のＹ座標がリード肩部ＫのＹ座
標となる。Next, as shown in FIG. 2C, the first inspection area A is set at a position expected to include the lead shoulder portion (falling point of the lead inclined portion 5b) K. Next in FIG.
As shown in (a), a histogram a of luminance in the width direction of the lead 5 is obtained, and a line N passing through the apex of the histogram a is obtained. The Y coordinate of this line becomes the Y coordinate of the lead shoulder K.
【００１３】次に図３（ｂ）に示すように、リード肩部
Ｋを乞含すると予想される位置に第２の検査エリアＢを
設定する。この場合、第２の検査エリアＢの巾Ｗはリー
ド幅とほぼ同じになるように、なるべく小さく設定す
る。このようにして第２の検査エリアＢの面積を極力小
さく設定することにより、第２の検査エリアＢ内のノイ
ズをできるだけ削減する。なお図３（ａ）の工程におい
て、リード５のＹ座標は既知となっており、またリード
幅はチップデータから既知であるので、リード５を乞含
できるように第２の検査エリアＢの巾Ｗを小さく設定で
きる。Next, as shown in FIG. 3B, a second inspection area B is set at a position where the lead shoulder K is expected to be included. In this case, the width W of the second inspection area B is set as small as possible so that it is almost the same as the lead width. By thus setting the area of the second inspection area B as small as possible, the noise in the second inspection area B is reduced as much as possible. Note that in the step of FIG. 3A, the Y coordinate of the lead 5 is already known and the lead width is already known from the chip data, so that the width of the second inspection area B can be included so as to include the lead 5. W can be set small.
【００１４】次に図３（ｃ）に示すように、リード５の
長手方向における第２の検査エリアＢ内の輝度のヒスト
グラムｂを求め、次にヒストグラムｂの立下り点の座標
（Ｘ座標）を求める。以上により、リード肩部Ｋのセン
ター座標（Ｘ、Ｙ）を正確に求めることができる。Next, as shown in FIG. 3C, a histogram b of the luminance in the second inspection area B in the longitudinal direction of the lead 5 is obtained, and then the coordinates of the falling point of the histogram b (X coordinate). Ask for. As described above, the center coordinates (X, Y) of the lead shoulder K can be accurately obtained.
【００１５】次に、リード肩部Ｋの位置に基づいて、リ
ード先端部の位置を検出する方法を説明する。図４は本
発明の一実施例の電子部品のリード先端部の位置検出方
法の説明図である。まず図４（ａ）に示すように、リー
ド肩部Ｋ（Ｘ、Ｙ）を基準位置として、ここから先端部
方向に所定距離Ｓ離れた位置のリード先端部が存在する
と予想される位置に、検査エリアＣを設定する。この所
定距離Ｓや検査エリアＣの面積は、チップデータを基に
しておおまかに設定する。Next, a method for detecting the position of the lead tip based on the position of the lead shoulder K will be described. FIG. 4 is an explanatory diagram of a method of detecting the position of the lead tip of the electronic component according to the embodiment of the present invention. First, as shown in FIG. 4A, with the lead shoulder K (X, Y) as a reference position, a position at which a lead tip portion at a position separated from the lead shoulder portion by a predetermined distance S in the tip portion direction is expected to exist, The inspection area C is set. The predetermined distance S and the area of the inspection area C are roughly set based on the chip data.
【００１６】次に図４（ｂ）に示すように、リード５の
長手方向における検査エリアＣ内の輝度のヒストグラム
ｃを求める。次にこのヒストグラムｃを微分する。図４
（ｃ）は微分図形を示している。本例では、３つの立下
り点Ｄ１、Ｄ２、Ｄ３があらわれる。図４（ａ）から明
らかなように、リード先端部は明（白）から暗（黒）に
切り変わる箇所であり、したがって３つの立下り点Ｄ
１、Ｄ２、Ｄ３のいずれかが、真のリードの先端部であ
る。なお立下り点Ｄ１、Ｄ２、Ｄ３が複数点あらわれる
のは、検査エリアＣ内のノイズｎのためである。Next, as shown in FIG. 4B, a luminance histogram c in the inspection area C in the longitudinal direction of the lead 5 is obtained. Next, this histogram c is differentiated. FIG.
(C) has shown the differential figure. In this example, three falling points D1, D2 and D3 appear. As is clear from FIG. 4A, the tip of the lead is a portion where light (white) changes to dark (black), and therefore three falling points D
Any one of 1, D2, and D3 is the tip portion of the true lead. A plurality of falling points D1, D2, D3 appear because of noise n in the inspection area C.
【００１７】次に３つの立下り点Ｄ１、Ｄ２、Ｄ３の中
から、以下に述べる得点化方法によって真のリードの先
端部を見つけだす方法を説明する。まず、第１の得点化
方法を説明する。この方法は、「求められた座標Ｄｘが
リード長Ｌに基づく座標に近いならば、リード先端部で
ある可能性は高い」というルールを設定して得点化する
ものである。具体的には、座標Ｄｘがリード長Ｌから±
３画素以内ならば得点５、±６画素以内ならば得点３、
±１０画素以内ならば得点１、それ以上なら得点０とす
る。Next, a method for finding the true tip of the lead from the three falling points D1, D2, D3 by the scoring method described below will be described. First, the first scoring method will be described. This method sets a rule that "if the obtained coordinate Dx is close to the coordinate based on the lead length L, there is a high possibility that it is the tip of the lead" and points are scored. Specifically, the coordinate Dx is ± from the lead length L.
If within 3 pixels, score 5; within ± 6 pixels, score 3;
If it is within ± 10 pixels, the score is 1;
【００１８】次に第２の得点化方法を説明する。この方
法は、座標Ｄｘの前後の３画素の白・黒の割合を検分す
る。すなわち、前３画素の白の総数をＷＦ、後３画素の
白の総数をＷＢとする。そしてＷＦ÷（ＷＦ＋ＷＢ）が
８０％以上であれば得点５、６０％以上であれば得点
４、３０％以上であれば得点２、２０％以上であれば得
点１、それ以下であれば得点０とする。この第２の得点
化方法も、リード先端部の前後は図４（ａ）から明らか
なように、白から黒に切り変わること、すなわち前は白
の可能性が高く、後は黒の可能性が高いことに着眼して
なされたものである。Next, the second scoring method will be described. In this method, the ratio of white and black of three pixels before and after the coordinate Dx is checked. That is, the total number of whites in the front three pixels is WF, and the total number of whites in the rear three pixels is WB. If WF ÷ (WF + WB) is 80% or more, the score is 5, if it is 60% or more, the score is 4, if 30% or more, the score is 2, and if 20% or more, the score is 1, and if it is less than 0, the score is 0. And Also in this second scoring method, as is clear from FIG. 4 (a), it is possible to switch from white to black before and after the tip of the lead, that is, there is a high possibility that the front is white and the latter is black. It was made by focusing on the high cost.
【００１９】上述の方法により得点を計算した結果、例
えばＤ１の総得点が９、Ｄ２が６、Ｄ３が５であったと
すると、最大得点のＤ１が真のリード先端部であると決
定される。勿論、上述した得点を何点づつ配分するかや
前後の画素をいくつにするかなどは任意に設定できる。As a result of calculating the scores by the above method, if the total score of D1 is 9, D2 is 6, and D3 is 5, it is determined that the maximum score D1 is the true lead tip. Of course, it is possible to arbitrarily set how many points the above-mentioned points are distributed and how many pixels are before and after.
【００２０】以上のようにしてリード先端部の位置が決
定されたならば、その結果を基にして、リード先端部に
形成される半田フィレットを検査するための検査エリア
を決定する。図５は本発明の一実施例の電子部品の半田
フィレットの検査エリアの設定図である。上述した結果
により、リード先端部の位置（本実施例では上述したよ
うにＤ１）が決定されているので、リード先端部の前方
付近に存在する半田フィレット６を確実に乞含する検査
エリアＤを設定できる。そしてこの検査エリアＤを図１
に示すカメラ７により観察して輝度データなどの必要な
光学情報を入手して、半田フィレット６の良否検査を行
う。なお図４に示す実施例では、図２および図３で求め
たリード肩部の位置Ｋを検査エリアＣを設定するための
基準位置としているが、この基準位置としては、必ずし
も上述のようにして求めたリード肩部の位置Ｋを採用し
なくてもよく、例えばモールド体４とリード５の境界点
を基準位置にしてもよいものである。When the position of the lead tip is determined as described above, the inspection area for inspecting the solder fillet formed on the lead tip is determined based on the result. FIG. 5 is a setting diagram of the inspection area of the solder fillet of the electronic component according to the embodiment of the present invention. Since the position of the lead tip portion (D1 as described above in the present embodiment) is determined from the above result, the inspection area D that surely includes the solder fillet 6 existing near the front of the lead tip portion is determined. Can be set. And this inspection area D is shown in FIG.
Observing with the camera 7 shown in FIG. 1 to obtain necessary optical information such as brightness data, the quality of the solder fillet 6 is inspected. In the embodiment shown in FIG. 4, the position K of the lead shoulder obtained in FIGS. 2 and 3 is used as the reference position for setting the inspection area C, but the reference position is not always the same as described above. The obtained position K of the lead shoulder may not be adopted, and for example, the boundary point between the mold body 4 and the lead 5 may be used as the reference position.
【００２１】[0021]
【発明の効果】本発明によれば、検査エリアの輝度のヒ
ストグラムを解析することにより、リード肩部の位置や
リード先端部の位置を正確に求めることができる。した
がって求められた位置に基づいて、半田フィレットの検
査エリアなどを正しく設定し、半田付状態の検査を行う
ことができる。According to the present invention, the position of the lead shoulder and the position of the lead tip can be accurately obtained by analyzing the brightness histogram of the inspection area. Therefore, based on the obtained position, the inspection area of the solder fillet or the like can be correctly set and the soldering state can be inspected.
【図１】本発明の一実施例の電子部品の半田付状態の検
査装置の斜視図FIG. 1 is a perspective view of a soldering state inspection device for an electronic component according to an embodiment of the present invention.
【図２】本発明の一実施例の電子部品のリード肩部の位
置検出方法の説明図FIG. 2 is an explanatory diagram of a method for detecting the position of a lead shoulder portion of an electronic component according to an embodiment of the present invention.
【図３】本発明の一実施例の電子部品のリード肩部の位
置検出方法の説明図FIG. 3 is an explanatory diagram of a method for detecting a position of a lead shoulder portion of an electronic component according to an embodiment of the present invention.
【図４】本発明の一実施例の電子部品のリード先端部の
位置検出方法の説明図FIG. 4 is an explanatory diagram of a method for detecting the position of a lead tip of an electronic component according to an embodiment of the present invention.
【図５】本発明の一実施例の電子部品の半田フィレット
の検査エリアの設定図FIG. 5 is a setting diagram of a solder fillet inspection area of an electronic component according to an embodiment of the present invention.
２ 基板 ３ 電子部品 ４ モールド体 ５ リード ６ 半田フィレット ７ カメラ ８ 光源 2 substrate 3 electronic component 4 molded body 5 lead 6 solder fillet 7 camera 8 light source
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｇ０６Ｆ 15/70 ３２５ Continuation of front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location G06F 15/70 325
Claims (7)
るリード肩部の位置検出方法であって、リードの上方か
ら光を照射して上方のカメラで観察し、暗い部分を検出
する工程と、暗い部分を乞含する第１の検査エリアを設
定する工程と、第１の検査エリアにおけるリードの幅方
向の輝度のヒストグラムを求める工程と、輝度のヒスト
グラムの頂点を通る線を求めることによりリードのＹ座
標を求める工程と、暗い部分を乞含する第２の検査エリ
アを設定する工程と、第２の検査エリアにおけるリード
の長手方向の輝度のヒストグラムを求める工程と、輝度
のヒストグラムの立下り点を求めることによりリードの
肩部のＸ座標を求める工程と、を含むことを特徴とする
リード肩部の位置検出方法。1. A method for detecting the position of a lead shoulder bent and extending from a molded body of an electronic component, the method comprising irradiating light from above the lead and observing with a camera above to detect a dark portion. And a step of setting a first inspection area including a dark portion, a step of obtaining a luminance histogram in the width direction of the lead in the first inspection area, and a line passing through the vertices of the luminance histogram. A step of obtaining the Y coordinate of the lead, a step of setting a second inspection area including a dark portion, a step of obtaining a luminance histogram in the longitudinal direction of the lead in the second inspection area, and a step of establishing the luminance histogram. And a step of determining the X coordinate of the shoulder portion of the lead by determining the descending point, the method for detecting the position of the lead shoulder portion.
ほぼ等しくすることにより、前記第２の検査エリア内の
ノイズを削減することを特徴とする請求項１記載のリー
ド肩部の位置検出方法。2. The lead shoulder according to claim 1, wherein noise in the second inspection area is reduced by making the width of the second inspection area substantially equal to the width of the lead. Position detection method.
るリード先端部の位置検出方法であって、 電子部品の基準位置を求める工程と、基準位置からリー
ド長離れたリード先端部付近に検査エリアを設定する工
程と、検査エリアにおけるリードの長手方向の輝度のヒ
ストグラムを求める工程と、輝度のヒストグラムを微分
して輝度のヒストグラムが高から低へ変化する立下り点
をリード先端部の候補点として複数点求める工程と、リ
ード先端部の輝度条件から各々の候補点を得点化し、こ
の得点化の結果から何れかの候補点をリード先端部とし
て決定する工程と、を含むことを特徴とするリード先端
部の位置検出方法。3. A method for detecting the position of a lead tip portion that is bent and extends from a molded body of an electronic component, the method comprising: determining a reference position of the electronic component; The step of setting the inspection area, the step of obtaining the luminance histogram in the longitudinal direction of the lead in the inspection area, and the step of differentiating the luminance histogram to determine the fall point at which the luminance histogram changes from high to low as the lead tip candidate. A step of obtaining a plurality of points as points, and scoring each candidate point from the brightness condition of the lead tip, and determining any one of the candidate points as a lead tip from the result of the scoring. A method for detecting the position of the lead tip.
ら何画素離れているかにより前記得点化を行うことを特
徴とする請求項３記載のリード先端部の位置検出方法。4. The lead tip position detecting method according to claim 3, wherein the scoring is performed based on how many pixels the candidate point is away from the lead length as the brightness condition.
数個の画素における白黒画素数に基づいて前記得点化を
行うことを特徴とする請求項４記載のリード先端部の位
置検出方法。5. The lead tip position detecting method according to claim 4, wherein the scoring is performed based on the number of black and white pixels in a plurality of pixels before and after each of the plurality of candidate points.
徴とする請求項３ないし５のいずれか１つに記載のリー
ド先端部の位置検出方法。6. The lead tip position detecting method according to claim 3, wherein the reference position is a lead shoulder portion.
ら光を照射して上方のカメラで観察し、暗い部分を検出
する工程と、暗い部分を乞含する第１の検査エリアを設
定する工程と、第１の検査エリアにおけるリードの幅方
向の輝度のヒストグラムを求める工程と、輝度のヒスト
グラムの頂点を通る線を求めることによりリードのＹ座
標を求める工程と、暗い部分を乞含する第２の検査エリ
アを設定する工程と、第２の検査エリアにおけるリード
の長手方向の輝度のヒストグラムを求める工程と、輝度
のヒストグラムの立下り点を求めることによりリードの
肩部のＸ座標を求める工程とから求めることを特徴とす
る請求項６記載のリード先端部の位置検出方法。7. A step of irradiating light from above the lead to observe the position of the lead shoulder portion with an upper camera to detect a dark portion, and a first inspection area including the dark portion is set. And a step of obtaining a luminance histogram in the width direction of the lead in the first inspection area, a step of obtaining a Y coordinate of the lead by obtaining a line passing through a vertex of the luminance histogram, and a dark portion. A step of setting a second inspection area, a step of obtaining a luminance histogram in the longitudinal direction of the lead in the second inspection area, and an X coordinate of the shoulder portion of the lead by obtaining a falling point of the luminance histogram. 7. The lead tip position detecting method according to claim 6, wherein the lead tip position is detected from the process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24112695A JP3189642B2 (en) | 1995-09-20 | 1995-09-20 | Lead tip position detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24112695A JP3189642B2 (en) | 1995-09-20 | 1995-09-20 | Lead tip position detection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0989525A true JPH0989525A (en) | 1997-04-04 |
| JP3189642B2 JP3189642B2 (en) | 2001-07-16 |
Family
ID=17069678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24112695A Expired - Fee Related JP3189642B2 (en) | 1995-09-20 | 1995-09-20 | Lead tip position detection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3189642B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6743645B2 (en) | 2001-03-30 | 2004-06-01 | Kabushiki Kaisha Toshiba | Method of inspecting process for manufacturing semiconductor device and method of manufacturing semiconductor device |
| EP1736758A3 (en) * | 2005-06-22 | 2007-11-14 | Omron Corporation | Board inspecting apparatus, its parameter setting method and parameter setting apparatus |
| US8244040B2 (en) | 2009-08-05 | 2012-08-14 | Mitsubishi Electric Corporation | Object position recognition system, object positioning system, and system and method for adjoining objects |
| KR101501914B1 (en) * | 2012-11-12 | 2015-03-12 | 주식회사 고영테크놀러지 | Inspection method for solder joint |
| JP2020094886A (en) * | 2018-12-12 | 2020-06-18 | トヨタ自動車株式会社 | Position detection method and position detection device |
-
1995
- 1995-09-20 JP JP24112695A patent/JP3189642B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6743645B2 (en) | 2001-03-30 | 2004-06-01 | Kabushiki Kaisha Toshiba | Method of inspecting process for manufacturing semiconductor device and method of manufacturing semiconductor device |
| EP1736758A3 (en) * | 2005-06-22 | 2007-11-14 | Omron Corporation | Board inspecting apparatus, its parameter setting method and parameter setting apparatus |
| US7822261B2 (en) | 2005-06-22 | 2010-10-26 | Omron Corporation | Board inspecting apparatus, its parameter setting method and parameter setting apparatus |
| US8244040B2 (en) | 2009-08-05 | 2012-08-14 | Mitsubishi Electric Corporation | Object position recognition system, object positioning system, and system and method for adjoining objects |
| KR101501914B1 (en) * | 2012-11-12 | 2015-03-12 | 주식회사 고영테크놀러지 | Inspection method for solder joint |
| US9221128B2 (en) | 2012-11-12 | 2015-12-29 | Koh Young Technology Inc. | Method of inspecting a solder joint |
| JP2020094886A (en) * | 2018-12-12 | 2020-06-18 | トヨタ自動車株式会社 | Position detection method and position detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3189642B2 (en) | 2001-07-16 |
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