JPH0828968A - Heat pump device - Google Patents

Abstract

PURPOSE:To enable simplification of a structure of a refrigerant passage from a condenser to an expansion means by supercooling a refrigerant flowing through the condenser on the occasion when the refrigerant to be sent from the condenser to the expansion means is supercooled by the refrigerant in a refrigerant circulating passage. CONSTITUTION:A cooler which supercools a refrigerant to be sent from a condenser Cd to an expansion means Vex1 by the refrigerant in a refrigerant circulating passage is provided in the refrigerant circulating passage in a state that a heat absorbing part Nsr thereof and the condenser Cd are in thermal contact with each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pump device in which a refrigerant circulation passage is provided with a cooler for supercooling the refrigerant sent from a condenser to an expansion means by the refrigerant in the refrigerant circulation passage.

[0002]

2. Description of the Related Art A heat pump device can supply a stable liquid-phase refrigerant having a large degree of subcooling to an expansion means, but conventionally, as shown in FIG. 6, the refrigerant is compressed by a compressor Cmp and a condenser Cd.
-Expansion means Vex-Evaporator Ev-Accumulator Acc In the refrigerant circulation path that circulates in this order, from condenser Cd to expansion means V
A diversion channel 01 for diverting a part of the liquid-phase refrigerant sent to ex is connected, and a diversion refrigerant expansion means DVex for expanding the diversion refrigerant and a diversion refrigerant expansion means D are connected to the diversion path 01.
The split refrigerant that has passed through Vex is expanded from the condenser Cd to the expansion means V.
A split refrigerant evaporator DEv that evaporates by heat exchange with the liquid phase refrigerant sent to ex is provided, and the expansion means Vex is expanded from the condenser Cd.
It constitutes a cooler that supercools the refrigerant sent to the sub-cooled refrigerant evaporator DEv.

[0003]

Therefore, in the middle of the refrigerant passage 02 for sending the remaining refrigerant after the diversion to the expansion means Vex,
Since it is necessary to make thermal contact with the split refrigerant evaporator DEv, the refrigerant passage 0 from the condenser Cd to the expansion means Vex
2 has a drawback that the structure is complicated.

The present invention has been made in view of the above circumstances, and when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path, the refrigerant passage to be supercooled is selected properly. Thus, it is an object of the present invention to simplify the structure of the refrigerant path from the condenser to the expansion means.

Further, according to the present invention, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path,
It is an object of the present invention to simplify the assembly structure of the cooler while simplifying the structure of the refrigerant path from the condenser to the expansion means.

Further, according to the present invention, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path,
The objective is to simplify the structure of the refrigerant path from the condenser to the expansion means, to fully utilize the condensation function of the condenser, and to efficiently supercool the refrigerant sent from the condenser to the expansion means. To do.

Further, according to the present invention, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path,
An object of the present invention is to enable a refrigerant having a high degree of superheat to be sent to a compressor while simplifying the structure of the refrigerant path from the condenser to the expansion means.

Further, according to the present invention, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path,
An object of the present invention is to simplify the structure of the refrigerant passage from the condenser to the expansion means and to make it difficult for the structure of the refrigerant circulation passage to become complicated.

[0009]

A feature of the present invention for achieving the above object is to provide a cooler for supercooling a refrigerant sent from a condenser to an expansion means with a refrigerant in the refrigerant circulation path in the refrigerant circulation path. In the heat pump device, the heat absorption part of the cooler and the condenser are provided so as to be in thermal contact with each other.

When the heat absorbing portion and the condenser are provided in a state of being in thermal contact with each other via a heat conducting member, or the heat absorbing portion and the condenser are arranged from the heat absorbing portion side to the heat absorbing portion side. When provided in a state of being in thermal contact with each other through a cooling medium flowing toward the condenser side, or, the heat absorbing portion and the condenser, a heat conducting member, from the heat absorbing portion side In the case where they are provided in a state where they are in thermal contact with each other via the cooling medium flowing toward the condenser side, in both cases, the structure of the refrigerant passage from the condenser to the expansion means is simplified while the cooler is being simplified. The assembling structure of can be simplified.

The refrigerant passage of the condenser is arranged such that its downstream side is located at a position lower than its upstream side, and the heat absorbing portion and the condenser are heat-exchanged with each other at a position on the downstream side of the refrigerant passage. If it is provided in a state of being in contact with each other, while simplifying the structure of the refrigerant path from the condenser to the expansion means,
The condensing function of the condenser can be fully utilized, and the refrigerant sent from the condenser to the expansion means can be efficiently subcooled.

In the case where the cooler is provided with a heat exchanger in the refrigerant passage for sending the refrigerant from the evaporator to the compressor, and the heat exchanger is formed in the heat absorbing part, the condenser is expanded to the expansion means. It is possible to send a refrigerant having a high degree of superheat to the compressor while simplifying the structure of the refrigerant path leading to the compressor.

The cooler expands the split refrigerant into a split passage for splitting a part of the refrigerant sent from the condenser to the expanding means, and the split refrigerant expanding means for expanding the split refrigerant and the split refrigerant passing through the split refrigerant expanding means. If the split refrigerant evaporator to be evaporated is provided, and the split refrigerant evaporator is configured in the heat absorbing portion, or, the cooler splits a part of the refrigerant sent from the evaporator to the compressor. It is configured by providing a heat exchanger in the branch flow path, and when the heat exchanger is configured in the heat absorbing portion, or the cooler diverts a part of the refrigerant sent from the expansion means to the evaporator. The split flow path to be configured is provided with a split flow refrigerant evaporator that evaporates the split flow refrigerant, and in the case where the split flow refrigerant evaporator is configured to the heat absorption part, in both cases, the refrigerant path from the condenser to the expansion means is Do not simplify the structure Al, is hardly complicated structure of the refrigerant circuit.

[0014]

The refrigerant flowing through the condenser is subcooled by the cooler.

When the heat absorbing part and the condenser are provided in a state of being in thermal contact with each other via the heat conducting member, or the heat absorbing part and the condenser are directed from the heat absorbing part side to the condenser side. When provided in a state of being in thermal contact with each other via a flowing cooling medium, or the heat absorbing portion and the condenser, the heat conducting member and the cooling medium flowing from the heat absorbing portion side toward the condenser side. In the case where they are provided in a state of being in thermal contact with each other via, it is possible to assemble the heat absorbing part in close proximity to the condenser, and in particular, the heat absorbing part and the condenser form a heat conducting member. If they are provided in a state of being in thermal contact with each other via the heat absorbing portion and the condenser, it is easy to assemble them.

When the heat absorbing portion and the condenser are provided in a state in which they are in thermal contact with each other at a position on the upstream side of the refrigerant flow path of the condenser, the vapor phase refrigerant before condensation is provided for supercooling. The cooling function of the condenser is not enough to utilize the original condensation function of the condenser, and even if the refrigerant cooled by the heat absorbing section further flows through the refrigerant passage of the condenser, the refrigerant will be condensed. Since it cannot be cooled below the temperature of the cooling medium,
Although the refrigerant cannot be subcooled efficiently, the refrigerant passage of the condenser is arranged such that its downstream side is located at a position lower than the upstream side, and the heat absorbing portion and the condenser are located at the downstream side of the refrigerant passage. If they are provided in thermal contact with each other,
The gas-phase refrigerant before condensation is hard to be cooled by the heat absorption part, and after condensation by the condensation function of the condenser, the liquid-phase refrigerant accumulated on the downstream side of the refrigerant flow path of the condenser is easily overcooled by the heat absorption part. .

The cooler is constructed by providing a heat exchanger in the refrigerant passage for sending the refrigerant from the evaporator to the compressor, and when the heat exchanger is constructed in the heat absorbing part, the cooler is sent from the evaporator to the compressor. The generated refrigerant is superheated by heat exchange with the refrigerant sent from the condenser to the expansion means.

The cooler expands the split refrigerant into a split passage for splitting a part of the refrigerant sent from the condenser to the expansion means, and a split flow for evaporating the split refrigerant having passed through the split refrigerant expansion means. When a refrigerant vaporizer is provided and the split-flow refrigerant evaporator is configured in the heat absorption part, or the cooler exchanges heat with a diversion flow path that diverts a part of the refrigerant sent from the evaporator to the compressor. In the case where the heat exchanger is provided in the heat absorbing portion, or the cooler evaporates the split refrigerant in the diversion channel that diverts a part of the refrigerant sent from the expansion means to the evaporator. When the split refrigerant evaporator is provided and the split refrigerant evaporator is formed in the heat absorbing part, in both cases, the split passage is connected to the refrigerant circulation path without separately changing the structure of the refrigerant circulation path. To provide a cooler for supercooling It can be.

[0019]

In the heat pump device according to the first aspect of the present invention, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path, the refrigerant flowing in the condenser is supercooled. The structure of the refrigerant passage from the expansion means to the expansion means can be simplified.

In any of the heat pump devices of claims 2, 3 and 4, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path, the refrigerant path from the condenser to the expansion means is It is possible to simplify the assembly structure of the cooler while simplifying the structure.

In a heat pump device according to a fifth aspect of the present invention, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path, the condensation is performed while simplifying the structure of the refrigerant path from the condenser to the expansion means. The condensing function of the condenser can be fully utilized, and the refrigerant sent from the condenser to the expansion means can be efficiently subcooled.

In the heat pump device according to the sixth aspect, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path, the structure of the refrigerant path from the condenser to the expansion means is simplified and overheated. Refrigerant refrigerant can be sent to the compressor.

In any of the heat pump devices according to claims 7, 8 or 9, when the refrigerant sent from the condenser to the expansion means is supercooled by the refrigerant in the refrigerant circulation path, the refrigerant path from the condenser to the expansion means is While simplifying the structure, it is difficult for the structure of the refrigerant circulation path to be complicated.

[0024]

【Example】

[First Embodiment] FIG. 1 shows a heat pump circuit of a heat pump device for cooling in which an outdoor unit Uo and an indoor unit Ui are connected by refrigerant passages L2 and L4. The refrigerant is compressed by a compressor Cmp and a condenser Cd. In the refrigerant circulation path that circulates the expansion means Vex1 and the evaporator Ev in this order, a cooler that supercools the refrigerant sent from the condenser Cd to the expansion means Vex1 with the refrigerant in the refrigerant circulation path is provided.

In the figure showing the heat pump circuit,
The thick black line indicates that the refrigerant in that part is in a high-pressure vapor phase state, the thick line with hatching indicates that the refrigerant in that part is in a liquid phase state, and the thick line with dot hatching indicates that part. The refrigerant is in the gas-liquid two-phase state (wet vapor state), and the white thick line indicates that the refrigerant in that portion is in the low-pressure gas phase state.

The outdoor unit Uo includes a compressor Cmp.
And an outdoor heat exchanger No as a condenser Cd for radiating heat from the outdoor air OA, and an outdoor fan Fo that ventilates the outdoor air OA to the outdoor heat exchanger No. The indoor unit Ui serves as expansion means. First expansion valve Vex1 and an indoor heat exchanger Ni as an evaporator Ev for absorbing indoor air
And an air supply fan Fs for sending the air supply SA passing through the indoor heat exchanger Ni to the air conditioning target area.

The refrigerant circulation path for circulating the refrigerant is the first refrigerant path L1 connecting the compressor Cmp and the outdoor heat exchanger No.
, A second refrigerant passage L2 connecting the outdoor heat exchanger No and the first expansion valve Vex1, the first expansion valve Vex1 and the indoor heat exchanger N.
A third refrigerant passage L3 connecting i and a fourth refrigerant passage L4 connecting the indoor heat exchanger Ni and the compressor Cmp are provided, and the third refrigerant passage L3 for gas-liquid separation is provided in the middle of the fourth refrigerant passage L4. An accumulator Acc is provided.

The cooler splits a part of the liquid-phase refrigerant sent from the outdoor heat exchanger No to the first expansion valve Vex1 over the middle of the second refrigerant passage L2 and the middle of the fourth refrigerant passage L4. A second expansion valve Vex2 as a split refrigerant expansion means for expanding the split refrigerant and a split refrigerant evaporator for evaporating the split refrigerant that has passed through the second expansion valve Vex2 while connecting the split passage 1 And a heat exchanger Nsr for supercooling as a heat-absorbing part.
Due to heat exchange with the refrigerant passing through sr, the refrigerant sent from the outdoor heat exchanger No to the first expansion valve Vex1 is supercooled, and the shunt channel 1
The second refrigerant passage L2 are connected to each other via a three-way valve Vd for adjusting the flow dividing ratio.

As shown in FIG. 2, the supercooling heat exchanger Nsr and the outdoor heat exchanger No are provided with a condenser refrigerant pipe 3 which is a refrigerant passage of the outdoor heat exchanger No. It is arranged at a low position, and the supercooling refrigerant pipe 2 of the supercooling heat exchanger Nsr is arranged so that its upstream side is located at a lower position than the downstream side, and the downstream side of the condensing refrigerant pipe 3 is arranged. The side and the supercooling refrigerant pipe 2 are integrally connected via a large number of heat absorbing / dissipating fins 4 serving as a heat conducting member, and the outdoor fan Fo is connected to the supercooling heat exchanger Nsr side for outdoor heat exchange. Bowl No
It is also used as a flow means for flowing the outside air OA as a cooling medium toward the side.

Then, the supercooling refrigerant pipe 2 and the condensing refrigerant pipe 3 are brought into thermal contact with each other at a position on the downstream side of the condensing refrigerant pipe 3 through the heat absorbing / radiating fins 4, and For absorbing and radiating the liquid-phase refrigerant accumulated downstream of the condensing refrigerant tube 3 and the refrigerant passing through the supercooling refrigerant tube 2 by bringing them into thermal contact with each other through the outside air OA ventilated by the outdoor fan Fo By heat exchange through the fins 4 and the outside air OA, the refrigerant passing through the supercooling refrigerant pipe 2 is evaporated, and the liquid-phase refrigerant in the condensing refrigerant pipe 3 is supercooled and led to the second refrigerant passage L2. Is configured to.

[Second Embodiment] FIG. 3 shows another embodiment of the heat pump device, in which the indoor heat exchanger Ni is connected to the fourth refrigerant passage L4.
A part of the low-pressure gas-phase refrigerant sent from the compressor to the compressor Cmp is branched off at the upstream side of the fourth refrigerant passage L4 and returned to the downstream side of the fourth refrigerant passage L4. 1 is provided with a supercooling heat exchanger Nsr to form a cooler having the supercooling heat exchanger Nsr as an endothermic part, and a low-temperature low-pressure gas-phase refrigerant passing through the supercooling heat exchanger Nsr is used. Due to the heat exchange, the refrigerant sent from the outdoor heat exchanger No to the first expansion valve Vex1 is supercooled, and the upstream side of the diversion channel 1 and the upstream side of the fourth refrigerant passage L4 are passed through the three-way valve Vd for adjusting the diversion ratio. Connected. Other configurations such as the supercooling heat exchanger Nsr are the same as those in the first embodiment.

[Third Embodiment] FIG. 4 shows another embodiment of the heat pump device, in the middle of the third refrigerant passage L3 and the fourth refrigerant passage L3.
A part of the gas-liquid two-phase refrigerant sent from the first expansion valve Vex1 to the indoor heat exchanger Ni is connected to the branch passage 1 over the middle of 4, and the split refrigerant is evaporated into this branch passage 1. Supercooling heat exchanger Nsr as a split-flow refrigerant evaporator
Is provided to form a cooler having the supercooling heat exchanger Nsr as an endothermic part, and the heat exchanger exchanges heat with the refrigerant passing through the subcooling heat exchanger Nsr to change the outdoor heat exchanger No to the first expansion valve Vex1. The refrigerant to be sent is subcooled, and the branch passage 1 and the third refrigerant passage L3 are connected via a three-way valve Vd for adjusting the split flow ratio. Other configurations such as the supercooling heat exchanger Nsr are the same as those in the first embodiment.

[Fourth Embodiment] FIG. 5 shows another embodiment of the heat pump device, in which a subcooling heat exchanger Nsr is provided in the middle of the fourth refrigerant passage L4, and the subcooling heat exchanger Nsr is used as a heat absorbing portion. The outdoor heat exchanger No is formed by heat exchange with the low-pressure low-pressure gas-phase refrigerant passing through the supercooling heat exchanger Nsr.
The refrigerant sent from the first expansion valve Vex1 to the first expansion valve Vex1 is supercooled.
Other configurations such as the supercooling heat exchanger Nsr are the same as those in the first embodiment.

Other Embodiments 1. The present invention may be a heat pump device for heating. 2. The heat pump device according to the present invention is not limited to air-conditioning applications such as cooling and heating, but can be applied to heat pump devices for various applications in various fields dealing with cold heat and hot heat. 3. In order to bring the heat absorbing part of the cooler and the condenser into thermal contact with each other via the heat conducting member, the heat conducting member can be of various shapes, structures and materials. It is not limited to the fin 4. Further, the heat absorbing part and the condenser may be brought into mechanical direct contact with each other, or both may be integrally structured so that the heat absorbing part and the condenser are brought into thermal contact with each other. You may employ | adopt the structure which makes a heat absorption part and a condenser thermally contact via a means.

It should be noted that although reference numerals are given in the claims for convenience of comparison with the drawings, the present invention is not limited to the configurations of the accompanying drawings by the entry.

[Brief description of drawings]

[Figure 1] Heat pump circuit diagram

FIG. 2 is a perspective view of a main part

FIG. 3 is a heat pump circuit diagram showing a second embodiment.

FIG. 4 is a heat pump circuit diagram showing a third embodiment.

FIG. 5 is a heat pump circuit diagram showing a fourth embodiment.

FIG. 6 is a heat pump circuit diagram showing a conventional example.

[Explanation of symbols]

 1 minute flow path 3 refrigerant flow path 4 heat conduction member Cd condenser Cmp compressor Ev evaporator L4 refrigerant path Nsr heat absorption section (heat exchanger, split refrigerant evaporator) OA cooling medium Vex1 expansion means Vex2 split flow refrigerant expansion means

Claims (9)

[Claims] 1. A heat pump device, wherein a refrigerant circulation path is provided with a cooler for supercooling a refrigerant sent from a condenser (Cd) to an expansion means (Vex1) with the refrigerant in the refrigerant circulation path, A heat pump device in which a heat absorbing portion (Nsr) of a cooler and the condenser (Cd) are provided so as to be in thermal contact with each other. 2. The heat absorbing part (Nsr) and the condenser (Cd)
The heat pump device according to claim 1, wherein the heat pump device and the heat pump member are provided in a state of being in thermal contact with each other via the heat conducting member (4). 3. The heat absorbing part (Nsr) and the condenser (Cd)
) And the condenser (Cd) from the heat absorbing portion (Nsr) side.
The heat pump device according to claim 1, wherein the heat pump device is provided in a state of being in thermal contact with each other via a cooling medium (OA) flowing toward the () side. 4. The heat absorbing part (Nsr) and the condenser (Cd)
) Are provided in a state where they are in thermal contact with each other through the heat conducting member (4) and the cooling medium (OA) flowing from the heat absorbing portion (Nsr) side toward the condenser (Cd) side. The heat pump device according to claim 1. 5. The refrigerant flow path (3) of the condenser (Cd) is arranged such that its downstream side is located at a lower position than its upstream side, and the heat absorption part (Nsr) and the condenser (Cd) are connected to each other. But,
The heat pump device according to claim 1, 2, 3, or 4, wherein the heat pump device is provided in a position downstream of the refrigerant flow path (3) so as to be in thermal contact with each other. 6. The heat exchanger (N) is provided in the refrigerant passage (L4) for feeding the refrigerant from the evaporator (Ev) to the compressor (Cmp).
6. The heat pump device according to claim 1, wherein the heat exchanger (Nsr) is provided in the heat absorbing portion. 7. A split refrigerant expansion unit (1) for expanding the split refrigerant into a split passage (1) for splitting a part of the refrigerant sent from the condenser (Cd) to the expansion unit (Vex1) by the cooler. Vex2) and a diversion refrigerant evaporator (Nsr) for evaporating the diversion refrigerant that has passed through the diversion refrigerant expansion means (Vex2), and the diversion refrigerant evaporator (Nsr) is configured in the heat absorbing section. The heat pump device according to claim 1, 2, 3, 4 or 5. 8. The heat exchanger (Nsr) is provided in the diversion flow passage (1) for diverting a part of the refrigerant sent from the evaporator (Ev) to the compressor (Cmp), and the cooler is constituted by the heat exchanger (Nsr). A heat exchanger (Nsr) is configured in the heat absorbing portion.
The heat pump device according to 2, 3, 4 or 5. 9. The cooler comprises the expansion means (Vex1)
The partial flow refrigerant evaporator (Nsr) for evaporating the partial flow refrigerant is provided in the partial flow path (1) for dividing a part of the refrigerant sent from the partial flow refrigerant evaporator (Ev) to the evaporator (Ev).
r) is formed in the heat absorbing portion.
The heat pump device according to 4 or 5.