JPH07111371A - Flexible printed board - Google Patents

Flexible printed board

Info

Publication number
JPH07111371A
JPH07111371A JP5256792A JP25679293A JPH07111371A JP H07111371 A JPH07111371 A JP H07111371A JP 5256792 A JP5256792 A JP 5256792A JP 25679293 A JP25679293 A JP 25679293A JP H07111371 A JPH07111371 A JP H07111371A
Authority
JP
Japan
Prior art keywords
layer
fpc
shielding layer
flexible printed
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5256792A
Other languages
Japanese (ja)
Other versions
JP2889471B2 (en
Inventor
Takafumi Ohata
孝文 大畠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP5256792A priority Critical patent/JP2889471B2/en
Publication of JPH07111371A publication Critical patent/JPH07111371A/en
Application granted granted Critical
Publication of JP2889471B2 publication Critical patent/JP2889471B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To provide a flexible printed board of improved flexibility while reducing processing cost by a method wherein an electromagnetic shielding layer is partially pasted on the flexible printed board with adhesive agent. CONSTITUTION:A shielding layer FPC 7 is pasted on both the sides of a single- sided flexible printed board (FPC) 1 through the intermediary of adhesive agent 10 making an electromagnetic shielding layer 8 of the shielding layer FPC 7 come into contact with the single-sided FPC 1, and an electromagnetic shielding layer 2 and the electromagnetic shielding layer 8 are electrically connected together with conductive paste 11 through the intermediary of a through- hole. As mentioned above, the single-sided FPC 1 and the electromagnetic shielding layer 2 are partially pasted together through the intermediary of the adhesive agent 10, and the electromagnetic shielding layer 2 of the single- sided FPC 1 and the electromagnetic shielding layer 8 of the shielding layer FPC 7 are electrically connected together through the conductive paste 11, whereby the single-sided FPC 1 and the shielding layer FPC 7 are reinforced in connection. By this setup, a flexible printed board of this constitution can be lessened in processing cost and improved in flexibility.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、信号パターンを導体か
ら成る電磁シールド層で被覆したフレキシブルプリント
基板（以下、「ＦＰＣ」と略す。）に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board (hereinafter abbreviated as "FPC") in which a signal pattern is covered with an electromagnetic shield layer made of a conductor.

【０００２】[0002]

【従来の技術】従来、電磁シールド層を有するＦＰＣ
は、電磁シールド層となる導体層を積層プレスする方法
か、又は、銅ペーストの様な導体ペースト層を被覆する
方法が用いられている。2. Description of the Related Art Conventionally, an FPC having an electromagnetic shield layer
Is used, a method of laminating and pressing a conductor layer to be an electromagnetic shield layer or a method of coating a conductor paste layer such as a copper paste.

【０００３】以下、図２及び図３を用いて、従来の導体
層を積層プレスする方法及び導体ペースト層を被覆する
方法によって製造されたＦＰＣについて説明する。尚、
図２は、従来の導体層を積層プレスする方法により製造
されたＦＰＣの断面図であり、図３は従来の導体ペース
ト層を被覆する方法により製造されたＦＰＣの断面図で
ある。An FPC manufactured by a conventional method of laminating and pressing a conductor layer and a method of coating a conductor paste layer will be described below with reference to FIGS. 2 and 3. still,
FIG. 2 is a cross-sectional view of an FPC manufactured by a conventional method of laminating and pressing conductor layers, and FIG. 3 is a cross-sectional view of an FPC manufactured by a method of coating a conventional conductor paste layer.

【０００４】まず、導体層を積層プレスする方法におい
ては、図２に示す様に信号層２１及びベースフィルム２
２をシールド層２３ａ及び２３ｂではさみ、積層し、ス
ルーホール２４にて、電気的に接続している。その後、
カバーコート２５ａ及び２５ｂではさみ、積層してい
る。First, in the method of laminating and pressing the conductor layers, as shown in FIG. 2, the signal layer 21 and the base film 2 are formed.
2 is sandwiched between the shield layers 23a and 23b, laminated, and electrically connected through the through hole 24. afterwards,
The cover coats 25a and 25b are sandwiched and laminated.

【０００５】次に、導体ペースト層を被覆する方法にお
いては、図３に示す様に、ベースフィルム３２の一の面
に信号層３１を他の面にグランド層３５を形成し、スル
ーホールで接続している。また、信号層３１の上にアン
ダーコート層３３を被覆した後、銅等の導体ペースト層
３４をコーティングしている。このとき、アンダーコー
ト層３３に予め設けられたコンタクトホールにおいて、
導体ペースト層３４と信号層３１との導通を取ってい
る。更に、シールド層としての導体ペースト層３４及び
グランド層３５の表面にカバーコート３６ａ及び３６ｂ
を被覆している。Next, in the method of coating the conductor paste layer, as shown in FIG. 3, the signal layer 31 is formed on one surface of the base film 32 and the ground layer 35 is formed on the other surface, and the connection is made by through holes. is doing. Further, after coating the signal layer 31 with the undercoat layer 33, the conductor paste layer 34 of copper or the like is coated. At this time, in the contact hole previously provided in the undercoat layer 33,
The conductor paste layer 34 and the signal layer 31 are electrically connected. Further, cover coats 36a and 36b are formed on the surfaces of the conductor paste layer 34 and the ground layer 35 as the shield layers.
Is covered.

【０００６】[0006]

【発明が解決しようとする課題】上述の従来の技術に関
して、導体層を積層プレスする方法においては、プロセ
スが複雑で、加工コストが高く、更に、ＦＰＣ自体が硬
く、折り曲げに適さないという問題点があった。With respect to the above-mentioned conventional technique, the method of laminating and pressing the conductor layers has a problem that the process is complicated, the processing cost is high, and the FPC itself is hard and not suitable for bending. was there.

【０００７】また、導体ペースト層を被覆する方法にお
いては、プロセスが長くなり、加工コストが比較的高
く、ＦＰＣ自体が硬く、折り曲げに適さないという問題
点があった。Further, in the method of coating the conductor paste layer, there are problems that the process is long, the processing cost is relatively high, the FPC itself is hard, and it is not suitable for bending.

【０００８】本発明は、加工コストが安価で、柔軟性に
富むフレキシブルプリント基板を提供することを目的と
するものである。An object of the present invention is to provide a flexible printed circuit board which has a low processing cost and is highly flexible.

【０００９】[0009]

【課題を解決するための手段】本発明のフレキシブルプ
リント基板は、所定の位置に第１コンタクトホールを有
する第１絶縁層、配線層及び所定の位置に第２コンタク
トホールを有する第２絶縁層が順次積層されており、且
つ、上記第１コンタクトホール上に第１スルーホールが
重ねて設けられている、第３絶縁層と第１導電層とから
成る第１電磁シールド層が、上記第１導電層と上記第１
絶縁層とが接するように設けられており、上記第１コン
タクトホール及び上記第１スルーホールを通して、上記
配線層と上記第１電磁シールド層とが導電材料により電
気的に接続しており、上記第１絶縁膜と上記第１導電層
との間の上記導電材料の周囲に接着剤が塗布されてお
り、且つ、上記第２コンタクトホール上に第２スルーホ
ールが重ねて設けられている、第４絶縁層と第２導電層
とから成る第２電磁シールド層が、上記第２導電層と上
記第２絶縁層とが接するように設けられており、上記第
２コンタクトホール及び上記第２スルーホールを通し
て、上記配線層と上記第２電磁シールド層とが導電材料
により電気的に接続しており、上記第２絶縁膜と上記第
２導電層との間の上記導電材料の周囲に接着剤が塗布さ
れていることを特徴とするものである。A flexible printed circuit board according to the present invention comprises a first insulating layer having a first contact hole at a predetermined position, a wiring layer and a second insulating layer having a second contact hole at a predetermined position. The first electromagnetic shield layer, which is sequentially laminated and in which the first through hole is provided so as to overlap the first contact hole, and which includes the third insulating layer and the first conductive layer, is the first conductive layer. Layer and above first
The insulating layer is provided so as to be in contact with the insulating layer, and the wiring layer and the first electromagnetic shield layer are electrically connected by a conductive material through the first contact hole and the first through hole. An adhesive is applied around the conductive material between the first insulating film and the first conductive layer, and a second through hole is provided so as to overlap the second contact hole. A second electromagnetic shield layer including an insulating layer and a second conductive layer is provided so that the second conductive layer and the second insulating layer are in contact with each other, and through the second contact hole and the second through hole. The wiring layer and the second electromagnetic shield layer are electrically connected by a conductive material, and an adhesive is applied around the conductive material between the second insulating film and the second conductive layer. Is characterized by Is shall.

【００１０】[0010]

【作用】上記構成とすることによって、部分的に接着剤
を用いて、電磁シールド層をフレキシブルプリント基板
に貼り合わせるため、加工コストが安価であり、又、従
来のように折り曲げ部分に接着剤層や導体ペーストが存
在することが少なくなり、柔軟性が向上する。With the above-mentioned structure, the electromagnetic shield layer is partially adhered to the flexible printed circuit board by using the adhesive, so that the processing cost is low, and the adhesive layer is formed on the bent portion as in the conventional case. The presence of the conductor paste is reduced, and the flexibility is improved.

【００１１】[0011]

【実施例】以下、一実施例に基づいて、本発明を詳細に
説明する。The present invention will be described in detail below based on an example.

【００１２】図１は本発明の一実施例の電磁シールド層
を有するフレキシブルプリント基板（以下、「ＦＰＣ」
という。）の断面図であり、図２（ａ）乃至（ｃ）は同
フレキシブルプリント基板の製造工程図である。FIG. 1 shows a flexible printed circuit board (hereinafter referred to as "FPC") having an electromagnetic shield layer according to an embodiment of the present invention.
Say. 2A to 2C are manufacturing process diagrams of the flexible printed circuit board.

【００１３】図１及び図２において、１は信号層となる
第１の導体層２と第１のベースフィルム３とから成る片
面ＦＰＣであり、第１の導体層２搭載面にはカバーレイ
４が形成されている。また、５は半田付け用開口ラン
ド、６はＦＰＣに設けられたスルーホール、７は第２の
導体層８と第２のベースフィルム９とから成るシールド
層ＦＰＣ、１０は接着剤、１１は電気的接続を取るため
の半田又は導体ペーストを示す。In FIGS. 1 and 2, reference numeral 1 denotes a single-sided FPC composed of a first conductor layer 2 serving as a signal layer and a first base film 3, and a coverlay 4 is provided on the mounting surface of the first conductor layer 2. Are formed. Further, 5 is an opening land for soldering, 6 is a through hole provided in the FPC, 7 is a shield layer FPC including the second conductor layer 8 and the second base film 9, 10 is an adhesive, 11 is an electric 3 shows a solder or a conductor paste for making a physical connection.

【００１４】本発明は、片面ＦＰＣとシールド層ＦＰＣ
とを部分的に貼り合わせることを特徴とするものであ
る。The present invention is directed to a single-sided FPC and a shield layer FPC.
It is characterized by partially bonding and.

【００１５】次に、図２を用いて、本発明の一実施例の
電磁シールド層を有するＦＰＣの製造方法について説明
する。Next, a method of manufacturing an FPC having an electromagnetic shield layer according to an embodiment of the present invention will be described with reference to FIG.

【００１６】まず、片面ＦＰＣ１の第１の導体層１側面
にカバーレイ４を形成し、所望の箇所に、半田付け用開
口ランド５及びスルーホール６を形成する。First, a cover lay 4 is formed on the side surface of the first conductor layer 1 of the single-sided FPC 1, and soldering opening lands 5 and through holes 6 are formed at desired positions.

【００１７】次に、片面ＦＰＣ１の一方の面に、第２の
導体層８が片面ＦＰＣ１側に接するようにシールド層Ｆ
ＰＣ７を接着剤１０を介して貼り合わせる。このとき、
シールド層ＦＰＣ７の端部は、第２の導体層８が外側に
なるように折り曲げ、シールド層ＦＰＣ７に設けられた
スルーホール６を介して、半田又は導体ペースト１１に
よって半田付け用開口ランド５と、グランドパターンで
ある第２の導体層８とを電気的に接続する。Next, the shield layer F is formed on one surface of the single-sided FPC 1 so that the second conductor layer 8 is in contact with the one-sided FPC 1 side.
The PC 7 is attached via the adhesive 10. At this time,
The end portion of the shield layer FPC7 is bent so that the second conductor layer 8 is on the outer side, and the soldering opening land 5 is formed by the solder or the conductor paste 11 through the through hole 6 provided in the shield layer FPC7. The second conductor layer 8 which is a ground pattern is electrically connected.

【００１８】同様にして、片面ＦＰＣ１の他方の面に、
第２の導電体層８が片面ＦＰＣ１側に接するように、シ
ールド層ＦＰＣ７を接着剤１０を介して貼り合わせる。
このとき、シールド層ＦＰＣ７の端部は、第２の導体層
８が外側になるように折り曲げ、シールド層ＦＰＣ７及
び片面ＦＰＣ１に設けられたスルーホール６を介して、
半田又は導体ペースト１１によって第１導体層２とグラ
ンドパターンである第２の導体層８とを電気的に接続す
る。Similarly, on the other surface of the one-sided FPC 1,
The shield layer FPC7 is bonded via the adhesive 10 so that the second conductor layer 8 is in contact with the one-sided FPC1 side.
At this time, the end portion of the shield layer FPC7 is bent so that the second conductor layer 8 is on the outer side, and the shield layer FPC7 and the through hole 6 provided in the one-sided FPC1 are used to
The first conductor layer 2 and the second conductor layer 8, which is a ground pattern, are electrically connected by solder or conductor paste 11.

【００１９】以上のように、本実施例においては、片面
ＦＰＣ１の周縁部に部分的に接着剤１０を介して、片面
ＦＰＣ１と電磁シールド層２とを貼り合わせるのに加
え、片面ＦＰＣ１の第１の導電層２と電磁シールド層Ｆ
ＰＣ７の第２の導電層とを電気的に接続するための半田
又は導体ペースト１１によって、更に、片面ＦＰＣ１と
電磁シールド層ＦＰＣ７との接着性を補強している。As described above, in this embodiment, in addition to bonding the single-sided FPC1 and the electromagnetic shield layer 2 to the peripheral portion of the single-sided FPC1 with the adhesive 10 partially, the first-sided FPC1 is first Conductive layer 2 and electromagnetic shield layer F
The adhesiveness between the one-sided FPC1 and the electromagnetic shield layer FPC7 is further reinforced by the solder or the conductor paste 11 for electrically connecting the second conductive layer of the PC7.

【００２０】[0020]

【発明の効果】以上、詳細に説明した様に、本発明を用
いることにより、以下の効果を奏する。As described above in detail, the following effects can be achieved by using the present invention.

【００２１】まず、接着剤を介して、簡単な貼り合せに
よって電磁シールド層を形成するため、加工コストの高
い積層プレス方式を用いる必要がなく、熱やロールラミ
ネータ等の簡易な加工設備を用いて比較的安価に加工す
る事ができる。First, since the electromagnetic shield layer is formed by simple bonding via an adhesive, it is not necessary to use a laminating press method which requires a high processing cost, and simple processing equipment such as heat or a roll laminator is used. It can be processed relatively inexpensively.

【００２２】また、半田接続する部分の近辺のみ接着剤
を介して電磁シールド層と貼り合せをするため、ＦＰＣ
の大部分は信号層とシールド層とが完全に貼り合せられ
ているのではなく、物理的にシールド層が浮いた状態に
保たれているため、ＦＰＣ自体の柔軟性が向上し、折り
曲げを多用する仕様のＦＰＣや駆動する仕様のＦＰＣに
最適である。Further, since only the vicinity of the portion to be soldered is bonded to the electromagnetic shield layer via the adhesive, the FPC
In most of the cases, the signal layer and the shield layer are not completely bonded to each other, but the shield layer is physically kept in a floating state, so that the flexibility of the FPC itself is improved and the bending is frequently used. It is most suitable for FPC of specifications to drive and FPC of specifications to drive.

【００２３】更に、シールド層ＦＰＣを貼り合せる事に
より、シールド層のカバーコートを行う必要がないた
め、加工量、材料量共に安価に加工することができる。Furthermore, since it is not necessary to cover-coat the shield layer by bonding the shield layer FPC, both the processing amount and the material amount can be processed at low cost.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例のフレキシブルプリント基板
の断面図である。FIG. 1 is a cross-sectional view of a flexible printed circuit board according to an embodiment of the present invention.

【図２】同フレキシブルプリント基板の製造工程図であ
る。FIG. 2 is a manufacturing process diagram of the flexible printed circuit board.

【図３】第１の従来のフレキシブルプリント基板の断面
図である。FIG. 3 is a cross-sectional view of a first conventional flexible printed circuit board.

【図４】第２の従来のフレキシブルプリント基板の断面
図である。FIG. 4 is a sectional view of a second conventional flexible printed circuit board.

【符号の説明】[Explanation of symbols]

１ 片面フレキシブルプリント基板 ２ 第１の導体層 ３ 第１のベースフィルム ４ カバーレイ ５ 半田付け用の開口ランド ６ スルーホール ７ シールド層ＦＰＣ ８ 第２の導体層 ９ 第２のベースフィルム １０ 接着剤 １１ 半田又は導体ペースト DESCRIPTION OF SYMBOLS 1 Single-sided flexible printed circuit board 2 1st conductor layer 3 1st base film 4 Coverlay 5 Opening land 6 for soldering 6 Through hole 7 Shield layer FPC 8 2nd conductor layer 9 2nd base film 10 Adhesive 11 Solder or conductor paste

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 所定の位置に第１コンタクトホールを有
する第１絶縁層、配線層及び所定の位置に第２コンタク
トホールを有する第２絶縁層が順次積層されており、 且つ、上記第１コンタクトホール上に第１スルーホール
が重ねて設けられている、第３絶縁層と第１導電層とか
ら成る第１電磁シールド層が、上記第１導電層と上記第
１絶縁層とが接するように設けられており、上記第１コ
ンタクトホール及び上記第１スルーホールを通して、上
記配線層と上記第１電磁シールド層とが導電材料により
電気的に接続しており、上記第１絶縁膜と上記第１導電
層との間の上記導電材料の周囲に接着剤が塗布されてお
り、 且つ、上記第２コンタクトホール上に第２スルーホール
が重ねて設けられている、第４絶縁層と第２導電層とか
ら成る第２電磁シールド層が、上記第２導電層と上記第
２絶縁層とが接するように設けられており、上記第２コ
ンタクトホール及び上記第２スルーホールを通して、上
記配線層と上記第２電磁シールド層とが導電材料により
電気的に接続しており、上記第２絶縁膜と上記第２導電
層との間の上記導電材料の周囲に接着剤が塗布されてい
ることを特徴とするフレキシブルプリント基板。1. A first insulating layer having a first contact hole at a predetermined position, a wiring layer, and a second insulating layer having a second contact hole at a predetermined position are sequentially stacked, and the first contact is formed. The first electromagnetic shield layer including the third insulating layer and the first conductive layer, in which the first through hole is provided so as to overlap the hole, so that the first conductive layer and the first insulating layer are in contact with each other. The wiring layer and the first electromagnetic shield layer are electrically connected by a conductive material through the first contact hole and the first through hole, and the first insulating film and the first insulating film are provided. A fourth insulating layer and a second conductive layer, wherein an adhesive is applied around the conductive material between the conductive layer and the second contact hole, and a second through hole is provided so as to overlap the second contact hole. The second electromagnetic consisting of A shield layer is provided so that the second conductive layer and the second insulating layer are in contact with each other, and the wiring layer and the second electromagnetic shield layer are connected to each other through the second contact hole and the second through hole. A flexible printed circuit board that is electrically connected by a conductive material, and an adhesive is applied around the conductive material between the second insulating film and the second conductive layer.
JP5256792A 1993-10-14 1993-10-14 Flexible printed circuit board Expired - Fee Related JP2889471B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5256792A JP2889471B2 (en) 1993-10-14 1993-10-14 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5256792A JP2889471B2 (en) 1993-10-14 1993-10-14 Flexible printed circuit board

Publications (2)

Publication Number Publication Date
JPH07111371A true JPH07111371A (en) 1995-04-25
JP2889471B2 JP2889471B2 (en) 1999-05-10

Family

ID=17297510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5256792A Expired - Fee Related JP2889471B2 (en) 1993-10-14 1993-10-14 Flexible printed circuit board

Country Status (1)

Country Link
JP (1) JP2889471B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882858B1 (en) 1998-11-24 2005-04-19 Nec Corporation Flexible board and method of fabricating the same
EP1898680A1 (en) * 2006-09-11 2008-03-12 LG Electronics Inc. Display module and apparatus for mobile communication having the same
US7505278B2 (en) 2006-09-11 2009-03-17 Lg Electronics Inc. Display module and apparatus for mobile communication having the same
JP2010199405A (en) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd Coverlay film, flexible printed wiring board, and optical transceiver
WO2012147870A1 (en) * 2011-04-28 2012-11-01 株式会社カネカ Novel flexible printed circuit integrated with conductive layer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111525355A (en) * 2019-02-01 2020-08-11 亚旭电脑股份有限公司 Ethernet transmission line

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6882858B1 (en) 1998-11-24 2005-04-19 Nec Corporation Flexible board and method of fabricating the same
EP1898680A1 (en) * 2006-09-11 2008-03-12 LG Electronics Inc. Display module and apparatus for mobile communication having the same
US7505278B2 (en) 2006-09-11 2009-03-17 Lg Electronics Inc. Display module and apparatus for mobile communication having the same
JP2010199405A (en) * 2009-02-26 2010-09-09 Shin Etsu Polymer Co Ltd Coverlay film, flexible printed wiring board, and optical transceiver
WO2012147870A1 (en) * 2011-04-28 2012-11-01 株式会社カネカ Novel flexible printed circuit integrated with conductive layer
CN103493605A (en) * 2011-04-28 2014-01-01 株式会社钟化 Novel flexible printed circuit integrated with conductive layer
JPWO2012147870A1 (en) * 2011-04-28 2014-07-28 株式会社カネカ New flexible printed circuit board with integrated conductive layer
US9237645B2 (en) 2011-04-28 2016-01-12 Kaneka Corporation Flexible printed circuit integrated with conductive layer

Also Published As

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JP2889471B2 (en) 1999-05-10

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