JPH0655891B2 - Heat dissipation sheet - Google Patents
Heat dissipation sheetInfo
- Publication number
- JPH0655891B2 JPH0655891B2 JP63170043A JP17004388A JPH0655891B2 JP H0655891 B2 JPH0655891 B2 JP H0655891B2 JP 63170043 A JP63170043 A JP 63170043A JP 17004388 A JP17004388 A JP 17004388A JP H0655891 B2 JPH0655891 B2 JP H0655891B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- heat dissipation
- heat
- parts
- silicone rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、パワートランジスタやサイリスタ等の発熱性
電子部品と放熱フインや金属放熱板との間に介在させて
用いる電気絶縁性、熱伝導性を有する放熱シートに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an electric insulating property and a thermal conductivity which are used by being interposed between a heat-generating electronic component such as a power transistor and a thyristor and a heat dissipation fin or a metal heat dissipation plate. The present invention relates to a heat dissipation sheet.
〔従来の技術〕 従来、熱伝導率の良い放熱シートとしては、シリコーン
ゴムに窒化硼素を含有させたものが知られているが（特
公昭４７−７１５０号公報）、材料費が高く充填作業性
が悪いため生産コストが高いという欠点がある。[Prior Art] Conventionally, as a heat dissipation sheet having a high thermal conductivity, a silicone rubber containing boron nitride is known (Japanese Patent Publication No. 47-7150), but the material cost is high and the filling workability is high. However, there is a drawback that the production cost is high because
最近に至り、低価格の窒化珪素粉末を用いた改良タイプ
が提案されているが（特開昭６１−１０８６６２号公報
等）、熱伝導率は最大でも１×１０-3ｃａｌ／ｃｍ・ｓ
ｅｃ・℃であり、窒化硼素を含有した市販の放熱シート
の４×１０-3cal/cm.sec.℃程度と比較すると非常に悪
いものである。Recently, an improved type using low-priced silicon nitride powder has been proposed (JP-A-61-108662, etc.), but the maximum thermal conductivity is 1 × 10 −3 cal / cm · s.
It is ec.degree. C., which is very bad as compared with about 4.times.10.sup.- 3 cal / cm.sec..degree. C. of a commercially available heat dissipation sheet containing boron nitride.
本発明者らは、すぐれた熱伝導性を有する窒化珪素粉末
を放熱シートの充填剤に利用するために種々研究を進め
たところ、シリコーンゴムに特定粒度の窒化珪素粉末と
窒化珪素粉末よりも粒子の小さい特定粒度のアルミナ及
び／又は酸化亜鉛からなる熱伝導性無機質粉末とを配合
すると、窒化硼素含有並みの熱伝導率をもつた放熱シー
トが得られることを見い出し、本発明を完成したもので
ある。The inventors of the present invention have conducted various studies to utilize silicon nitride powder having excellent thermal conductivity as a filler for a heat dissipation sheet, and found that silicon rubber has a particle size smaller than that of silicon nitride powder having a specific particle size and silicon nitride powder. It was found that a heat-dissipating sheet having a thermal conductivity comparable to that containing boron nitride can be obtained by blending with a heat-conductive inorganic powder composed of alumina and / or zinc oxide having a small particle size of is there.
すなわち、本発明は、シリコーンゴム１００重量部、粒
子の大きさが２００μｍ以下でしかも１０μｍ以下の割
合が５０重量％以下の窒化珪素粉末２５０〜４００重量
部、２０μｍ以下の粒子の割合が９０重量％以上である
アルミナ及び／又は酸化亜鉛からなる熱伝導性無機質粉
末２００〜３５０重量部の割合で含有してなることを特
徴とする放熱シートである。That is, the present invention is 100 parts by weight of silicone rubber, 250 to 400 parts by weight of silicon nitride powder having a particle size of 200 μm or less and a ratio of 10 μm or less of 50% by weight or less, and a ratio of particles of 20 μm or less of 90% by weight. A heat dissipation sheet characterized by containing 200 to 350 parts by weight of a thermally conductive inorganic powder made of alumina and / or zinc oxide as described above.
以下、さらに詳しく本発明について説明すると、本発明
の放熱シートは、シリコーンゴム、窒化珪素粉末及びア
ルミナ及び／又は酸化亜鉛からなる熱伝導性無機質粉末
（以下、単に熱伝導性無機質粉末という）を含有してな
るものである。The present invention will be described in more detail below. The heat dissipation sheet of the present invention contains a heat conductive inorganic powder (hereinafter, simply referred to as a heat conductive inorganic powder) made of silicone rubber, silicon nitride powder and alumina and / or zinc oxide. It will be done.
シリコーンゴムとしては、加熱加硫型シリコーンゴム
と、常温加硫型シリコーンゴムがあげられるが、加熱加
硫型シリコーンゴムが作業性の点から好ましい。Examples of the silicone rubber include a heat-vulcanizable silicone rubber and a room temperature vulcanizable silicone rubber, and a heat-vulcanizable silicone rubber is preferable from the viewpoint of workability.
次に窒化珪素粉末について説明すると、窒化珪素粉末は
シリコーンゴム１００重量部に対して２５０〜４００重
量部好ましくは３００〜３５０重量部の割合で含有させ
る。２５０重量部未満では熱伝導率が低下し、一方、４
００重量部を越えると、シートは硬くかつもろくなつて
引張り強さが低下すると共に発熱性電子部品や放熱フイ
ン等への密着性が悪くなり熱伝導率が低下する。Next, the silicon nitride powder will be described. The silicon nitride powder is contained in an amount of 250 to 400 parts by weight, preferably 300 to 350 parts by weight, based on 100 parts by weight of the silicone rubber. If it is less than 250 parts by weight, the thermal conductivity will decrease, while 4
If the amount exceeds 100 parts by weight, the sheet becomes hard and brittle, the tensile strength is lowered, the adhesion to the heat-generating electronic components, the heat radiation fins, etc. is deteriorated, and the thermal conductivity is lowered.
窒化珪素粉末としては、金属窒化法、ハロゲン化珪素
法、還元窒化法などの方法で製造した粉末のいずれをも
使用できるが、粒子の大きさは、２００μｍ以下でしか
も１０μｍ以下の割合が５０重量％以下好ましくは３０
〜４５重量％であることが必要である。粒子の大きさが
２００μｍを越えるとシートの表面が粗らくなるため発
熱性電子部品や放熱フイン等への密着性が悪くなり熱伝
導率が低下する。また、１０μｍ以下の粒子割合が５０
重量％を越えるとシリコーンゴムへの充填量を増やすに
したがいシリコーンゴムがゲル化をおこすので高充填が
出来なくなり熱伝導率が低下する。As the silicon nitride powder, any of powders produced by a method such as a metal nitriding method, a silicon halide method, and a reduction nitriding method can be used, but the particle size is 200 μm or less and the proportion of 10 μm or less is 50% by weight. % Or less, preferably 30
It is necessary to be ˜45% by weight. If the size of the particles exceeds 200 μm, the surface of the sheet becomes rough, so that the adhesion to the heat-generating electronic components, the heat dissipation fins, etc. deteriorates and the thermal conductivity decreases. Also, the proportion of particles of 10 μm or less is 50
If it exceeds 5% by weight, the silicone rubber gels as the amount filled in the silicone rubber increases, so that high filling cannot be achieved and the thermal conductivity decreases.
熱伝導性無機質粉末は、シリコーンゴム１００重量部に
対して２００〜３５０重量部の割合で含有させる。好ま
しくは前記窒化珪素粉末に対し等重量以下で２５０重量
部以上である。２００重量部未満では熱伝導率と引張り
強さが低下し、一方、３５０重量部を越えるとシートが
硬くなり熱伝導率は低下する。The heat conductive inorganic powder is contained in a proportion of 200 to 350 parts by weight with respect to 100 parts by weight of silicone rubber. The amount is preferably equal to or less than 250 parts by weight with respect to the silicon nitride powder. If it is less than 200 parts by weight, the thermal conductivity and tensile strength will decrease, while if it exceeds 350 parts by weight, the sheet will become hard and the thermal conductivity will decrease.
熱伝導性無機質粉末は、上記割合を逸脱しない限り、た
とえば酸化マグネシウム、シリカ、炭酸カルシウム、水
酸化アルミニウムの熱伝導性付与剤と併用することもで
きる。The heat-conductive inorganic powder can be used together with a heat-conductivity-imparting agent such as magnesium oxide, silica, calcium carbonate, or aluminum hydroxide as long as it does not deviate from the above ratio.
熱伝導性無機質粉末の粒子の大きさとし熱伝導性無機質
粉末の粒子の大きさとしては、２０μｍ以下の割合が９
０重量％以上である。９０重量％未満であると高充填が
出来なくなりシートは硬くしかももろくなつて引張り強
さが低下し、熱伝導率が低下する。As the particle size of the thermally conductive inorganic powder, the particle size of the thermally conductive inorganic powder is 9% or less.
It is 0% by weight or more. If it is less than 90% by weight, high filling cannot be performed, the sheet becomes hard and brittle, the tensile strength decreases, and the thermal conductivity decreases.
以上説明したように、本発明の放熱シートはシリコーン
ゴム、窒化珪素粉末及び熱伝導性無機質粉末を必須成分
として含有するものであるが、必要に応じて、シランカ
ツプリング剤等の表面処理剤、着色剤、補強材としての
ガラスクロス等を含ませることは何等さしつかえない。As described above, the heat dissipation sheet of the present invention contains silicone rubber, silicon nitride powder and thermally conductive inorganic powder as essential components, but if necessary, a surface treatment agent such as a silane coupling agent, It does not matter at all to include a colorant, a glass cloth as a reinforcing material, or the like.
本発明品の製造にあたつては、シリコーンゴム、窒化珪
素粉末及び熱伝導無機質粉末を配合した後、ドクターブ
レード法、カレンダーロール法、押し出し法等でシート
化する。In the production of the product of the present invention, after blending silicone rubber, silicon nitride powder and heat conductive inorganic powder, a sheet is formed by a doctor blade method, a calendar roll method, an extrusion method or the like.
以下、実施例と比較例をあげて本発明を更に具体的に説
明する。Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples.
シリコーンゴム（東芝シリコーン(株)製、商品名SRH −
３２）１００重量部に対し、最大粒子径１８０μｍ（但
し実験番号１５と２０は最大粒子径５０μｍ）の市販窒
化珪素粉末（電気化学工業(株)製）及び熱伝導性無機質
粉末として、アルミナ（昭和電工(株)製）又は酸化亜鉛
（石津製薬(株)製、１級試薬、２０μｍ以下の割合１０
０重量％）を第１表に示す割合で配合し、更に、1.1.1.
トリクロロエタンを加えてスラリーとし、それをドクタ
ーブレード法にてグリーンシートとした。それを乾燥し
て溶媒除去した後、加熱加硫して厚さ０．３mmの放熱シ
ートを得た。Silicone rubber (Toshiba Silicone Co., Ltd., trade name SRH-
32) 100 parts by weight of commercially available silicon nitride powder (manufactured by Denki Kagaku Kogyo Co., Ltd.) having a maximum particle diameter of 180 μm (however, experiment numbers 15 and 20 have a maximum particle diameter of 50 μm) and alumina (Showa KK) as a heat conductive inorganic powder. Denko Co., Ltd. or zinc oxide (Ishizu Pharmaceutical Co., Ltd., first-grade reagent, ratio of 20 μm or less 10
0% by weight) in the ratio shown in Table 1, and further 1.1.1.
Trichloroethane was added to make a slurry, which was made into a green sheet by the doctor blade method. After it was dried to remove the solvent, it was heated and vulcanized to obtain a heat dissipation sheet having a thickness of 0.3 mm.
この放熱シートの物性結果を第１表に示す。The physical property results of this heat dissipation sheet are shown in Table 1.
実験番号１〜１２は実施例、１３〜２３は比較例であ
る。Experiment numbers 1 to 12 are examples, and 13 to 23 are comparative examples.
なお、第１表に示した物性測定は次の方法によつた。The physical properties shown in Table 1 were measured by the following methods.
熱伝導率：熱流通過面積をトランジスターＴＯ−３相当
のヒーターと放熱フインとの間に放熱シートを実装し、
ヒーターと放熱フインとの温度を測定。Thermal conductivity: A heat dissipation sheet is mounted between the heater and the heat dissipation fin whose heat flow passage area is equivalent to the transistor TO-3,
Measure the temperature of the heater and the radiating fin.
粒度分布：粗粉は、CILAS社のGranulome′tre７１３タ
イプを用いた。微粉はLEEDS & NORTHRUP社のMicro Trac
k７９９１−３タイプを用いた。Particle size distribution: The coarse powder used was Granulome'tre 713 type manufactured by CILAS. Fine powder is Micro Trac from LEEDS & NORTHRUP
The k7991-3 type was used.
引張り強さ：東洋精機製作所(株)のStrograph Wを用い
た。Tensile strength: Strograph W manufactured by Toyo Seiki Seisaku-sho, Ltd. was used.
ゲル化観察：シリコーンゴムのゲル化の状態を混合時に
肉眼観察により行つたところ、実験番号２０のシートに
のみそれが認められた。Gelation observation: When the gelling state of the silicone rubber was visually observed during mixing, it was found only in the sheet of Experiment No. 20.
〔発明の効果〕 本発明によれば、高価な窒化硼素を使用しなくても熱伝
導率が３×１０-3ｃａ１／ｃｍ・ｓｅｃ・℃以上で引張
り強さが４０Ｋｇ／ｃｍ２以上の放熱シートが提供され
る。 EFFECTS OF THE INVENTION According to the present invention, heat dissipation with a thermal conductivity of 3 × 10 −3 ca1 / cm · sec · ° C. or more and a tensile strength of 40 Kg / cm 2 or more without using expensive boron nitride Seats are provided.
Claims (1)
さが２００μｍ以下でしかも１０μｍ以下の割合が５０
重量％以下の窒化珪素粉末２５０〜４００重量部、２０
μｍ以下の粒子の割合が９０重量％以上であるアルミナ
及び／又は酸化亜鉛からなる熱伝導性無機質粉末２００
〜３５０重量部の割合で含有してなることを特徴とする
放熱シート。1. A silicone rubber of 100 parts by weight, a particle size of not more than 200 μm and a ratio of not more than 10 μm being 50.
250% to 400 parts by weight of silicon nitride powder of up to 20% by weight, 20
Thermally conductive inorganic powder 200 made of alumina and / or zinc oxide in which the proportion of particles having a size of μm or less is 90% by weight or more.
A heat-dissipating sheet, characterized in that the heat-dissipating sheet contains it in a proportion of 350 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63170043A JPH0655891B2 (en) | 1988-07-09 | 1988-07-09 | Heat dissipation sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63170043A JPH0655891B2 (en) | 1988-07-09 | 1988-07-09 | Heat dissipation sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0220558A JPH0220558A (en) | 1990-01-24 |
| JPH0655891B2 true JPH0655891B2 (en) | 1994-07-27 |
Family
ID=15897553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63170043A Expired - Lifetime JPH0655891B2 (en) | 1988-07-09 | 1988-07-09 | Heat dissipation sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0655891B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2732792B2 (en) * | 1993-12-24 | 1998-03-30 | 富士高分子工業株式会社 | Heat dissipation device for IC package |
| JP5776019B2 (en) | 2009-11-20 | 2015-09-09 | パナソニックＩｐマネジメント株式会社 | Prepreg, laminate, metal foil clad laminate, circuit board, and circuit board for LED mounting |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4584336A (en) * | 1984-10-29 | 1986-04-22 | Sws Silicones Corporation | Thermally conductive room temperature vulcanizable compositions |
| US4544696A (en) * | 1984-10-29 | 1985-10-01 | Sws Silicones Corporation | Silicone elastomers having thermally conductive properties |
| US4588768A (en) * | 1984-10-29 | 1986-05-13 | Sws Silicones Corporation | Thermally conductive heat curable organopolysiloxane compositions |
-
1988
- 1988-07-09 JP JP63170043A patent/JPH0655891B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0220558A (en) | 1990-01-24 |
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