JPH06203627A - Conductive composition - Google Patents
Conductive compositionInfo
- Publication number
- JPH06203627A JPH06203627A JP34758092A JP34758092A JPH06203627A JP H06203627 A JPH06203627 A JP H06203627A JP 34758092 A JP34758092 A JP 34758092A JP 34758092 A JP34758092 A JP 34758092A JP H06203627 A JPH06203627 A JP H06203627A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- nitrile rubber
- conductive composition
- resin binder
- silver powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 38
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 38
- 239000011230 binding agent Substances 0.000 claims abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract description 5
- 239000000178 monomer Substances 0.000 abstract description 4
- 229920002554 vinyl polymer Polymers 0.000 abstract description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 11
- 229920003986 novolac Polymers 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- -1 dicyclopentadiene epoxide Chemical class 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 125000002560 nitrile group Chemical group 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- MOBNLCPBAMKACS-UHFFFAOYSA-N 2-(1-chloroethyl)oxirane Chemical compound CC(Cl)C1CO1 MOBNLCPBAMKACS-UHFFFAOYSA-N 0.000 description 1
- RSNDTPFSMDVWCS-UHFFFAOYSA-N 2-(butoxymethyl)prop-2-enamide Chemical compound CCCCOCC(=C)C(N)=O RSNDTPFSMDVWCS-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- GLVVKKSPKXTQRB-UHFFFAOYSA-N ethenyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC=C GLVVKKSPKXTQRB-UHFFFAOYSA-N 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- HVAMZGADVCBITI-UHFFFAOYSA-M pent-4-enoate Chemical compound [O-]C(=O)CCC=C HVAMZGADVCBITI-UHFFFAOYSA-M 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- JIYNFFGKZCOPKN-UHFFFAOYSA-N sbb061129 Chemical compound O=C1OC(=O)C2C1C1C=C(C)C2C1 JIYNFFGKZCOPKN-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、銀粉末を含有し、良好
な導電性を有する導電性組成物に関する。より詳しく
は、液晶、ＬＥＤ等の表示素子および水晶振動子等の電
子部品の電極とリードの接着に適し、加熱硬化によっ
て、良好な導電性および密着性を有する導電性組成物に
関するものである。FIELD OF THE INVENTION The present invention relates to a conductive composition containing silver powder and having good conductivity. More specifically, the present invention relates to a conductive composition suitable for adhering electrodes and leads of electronic components such as liquid crystal, LED and other display devices and crystal oscillators, and having good conductivity and adhesion by heat curing.
【０００２】[0002]
【従来の技術】プリント基板上への各種電子部品の接着
もしくは半田付け前の仮接着や、電子部品中の電極とリ
ードの接着等の導電性を必要とする部分には接着材とし
て導電性組成物が使用されている。そして、これらの導
電性組成物の主成分は、銀を主体とした導電性粉末とエ
ポキシ樹脂バインダーとからなっている。2. Description of the Related Art A conductive composition is used as an adhesive for a portion of the electronic component that requires conductivity, such as adhesion of various electronic components on a printed circuit board, temporary adhesion before soldering, or adhesion of electrodes and leads in an electronic component. Things are being used. Then, the main components of these conductive compositions are composed of a conductive powder mainly composed of silver and an epoxy resin binder.
【０００３】このエポキシ樹脂バインダーとは、結合剤
としてエポキシ樹脂を含有し、エポキシ樹脂の硬化剤と
して、ポリアミド樹脂、アミン類、イミダゾール類、メ
ラミン類、酸無水物類等の多種類のものの中からいずれ
かを選択し、エポキシ樹脂にこの硬化剤を加えたもので
ある。The epoxy resin binder contains an epoxy resin as a binder, and a curing agent for the epoxy resin is selected from a wide variety of polyamide resins, amines, imidazoles, melamines, acid anhydrides and the like. One of them is selected and this curing agent is added to the epoxy resin.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、結合剤
としてエポキシ樹脂バインダーを用いた従来の導電性組
成物にあっては、硬化速度の速いものは安定性に欠け、
安定性のよいものは硬化速度が遅くて密着性に劣るとい
う欠点があった。However, in a conventional conductive composition using an epoxy resin binder as a binder, one having a fast curing rate lacks stability.
Those with good stability had a drawback that the curing speed was slow and the adhesion was poor.
【０００５】本発明は従来の技術の有するこのような問
題点に鑑みてなされたものであって、その目的は、硬化
速度が速く、安定性に優れ且つ密着性のよい導電性組成
物を提供することにある。The present invention has been made in view of the above problems of the prior art, and an object thereof is to provide a conductive composition having a high curing rate, excellent stability and good adhesion. To do.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に本発明の導電性組成物は、エポキシ樹脂、硬化剤およ
び必須成分としてニトリルゴムを含有するエポキシ樹脂
バインダーに銀粉を配合したことを特徴としている。In order to achieve the above object, the conductive composition of the present invention is characterized in that an epoxy resin, a curing agent and an epoxy resin binder containing nitrile rubber as an essential component are mixed with silver powder. I am trying.
【０００７】エポキシ樹脂としては、１分子中に２個以
上のエポキシ基を有する多価エポキシ樹脂であれば、一
般的に用いられているエポキシ樹脂が使用可能で、例え
ば、フェノールノボラック・クレゾールノボラック等の
ノボラック樹脂、ビスフェノールＡ・ビスフェノールＦ
・レゾルシン・ビスヒドロキシジフェニルエーテル等の
多価フェノール類、エチレングリコール・ネオペンチル
グリコール・グリセリン・トリメチロールプロパン・ペ
ンタエリスリトール・トリエチレングリコール・ポリプ
ロピレングリコール等の多価アルコール類、エチレンジ
アミン・トリエチレンテトラミン・アニリン等のポリア
ミノ化合物、アジピン酸・フタル酸・イソフタル酸等の
多価カルボキシ化合物等とエピクロルヒドリンまたは２
−メチルエピクロルヒドリンを反応させて得られるグリ
シジル型のエポキシ樹脂、ジシクロペンタジエンエポキ
サイド・ブタジエンダイマージエポキサイド等の脂肪族
および脂環族エポキシ樹脂等を挙げることができ、これ
らの１種以上を使用することができる。As the epoxy resin, a generally used epoxy resin can be used as long as it is a polyvalent epoxy resin having two or more epoxy groups in one molecule, and examples thereof include phenol novolac and cresol novolac. Novolak resin, bisphenol A / bisphenol F
・ Polyhydric phenols such as resorcin / bishydroxydiphenyl ether, polyhydric alcohols such as ethylene glycol, neopentyl glycol, glycerin, trimethylolpropane, pentaerythritol, triethylene glycol, polypropylene glycol, ethylenediamine, triethylenetetramine, aniline, etc. Polyamino compounds, polycarboxylic compounds such as adipic acid, phthalic acid, isophthalic acid, etc. and epichlorohydrin or 2
-Glycidyl-type epoxy resins obtained by reacting methyl epichlorohydrin, aliphatic and alicyclic epoxy resins such as dicyclopentadiene epoxide / butadiene dimer epoxide, and the like, and one or more of them may be used. You can
【０００８】硬化剤は、１分子中に２個以上の活性水素
を有するものであれば使用可能で、例えば、ジエチレン
トリアミン・トリエチレンテトラミン・メタフェニレン
ジアミン・ジシアンジアミド・ポリアミドアミン等のポ
リアミノ化合物、無水フタル酸・無水メチルナジック酸
・ヘキサヒドロッジ無水フタル酸・無水ピロメリット酸
等の有機酸無水物、フェノールノボラック・クレゾール
ノボラック等のノボラック樹脂等を挙げることができ、
これらの１種以上を使用することができる。The curing agent can be used as long as it has two or more active hydrogens in one molecule, and examples thereof include polyamino compounds such as diethylenetriamine, triethylenetetramine, metaphenylenediamine, dicyandiamide, polyamidoamine, and anhydrous phthalic acid. Organic acid anhydrides such as acids, methyl nadic acid anhydride, hexahydrodide phthalic anhydride, pyromellitic dianhydride, and novolac resins such as phenol novolac and cresol novolac can be mentioned.
One or more of these can be used.
【０００９】エポキシ樹脂バインダーにニトリルゴムを
導入する方法としては、エポキシ樹脂の存在下でアクリ
ロニトリルを必須成分とするビニルモノマーをグラフト
重合して得られるニトリルゴム変性エポキシ樹脂を用い
る方法、ＣＴＢＮ等のカルボキシル基を有するニトリル
ゴムを硬化剤として用いる方法があるが、エポキシ樹脂
バインダーへのニトリルゴムの導入量が、結合アクリロ
ニトリルとして０．１〜２０重量％、好ましくは１〜１
０重量％であれば、上記いずれの方法でもよく、もちろ
ん併用することもできる。As a method of introducing nitrile rubber into an epoxy resin binder, a method of using a nitrile rubber-modified epoxy resin obtained by graft polymerization of a vinyl monomer containing acrylonitrile as an essential component in the presence of an epoxy resin, a carboxyl such as CTBN, etc. There is a method of using a nitrile rubber having a group as a curing agent, but the amount of the nitrile rubber introduced into the epoxy resin binder is 0.1 to 20% by weight as bound acrylonitrile, preferably 1 to 1
As long as it is 0% by weight, any of the above methods may be used and, of course, they may be used in combination.
【００１０】ニトリルゴムは、必須成分であるアクリロ
ニトリルを含めたビニルモノマーを公知の方法で重合さ
せることにより得ることができる。アクリロニトリル以
外で用いることのできるビニルモノマーとしては、例え
ば、スチレン・ビニルトルエン等のアルケニル芳香族
類、メチルメタクリレート・メチルアクリレート・２−
エチルヘキシルアクリレート・ヒドロキシエチルアクリ
レート等のアクリルエステル類、アクリル酸・ブトキシ
メチルアクリルアミド等のエステル基を持たないアクリ
ル化合物、ビニルアセテート・ビニルラウレート・エチ
レン・アリルアセテート等の非共役ビニル化合物、ブタ
ジエン・イソプレン・クロロプレン等の共役ジエン化合
物等を挙げることができる。The nitrile rubber can be obtained by polymerizing a vinyl monomer containing acrylonitrile, which is an essential component, by a known method. Examples of vinyl monomers that can be used other than acrylonitrile include alkenyl aromatics such as styrene and vinyltoluene, methyl methacrylate, methyl acrylate, and 2-.
Acrylic esters such as ethylhexyl acrylate / hydroxyethyl acrylate, acrylic compounds not having ester groups such as acrylic acid / butoxymethyl acrylamide, non-conjugated vinyl compounds such as vinyl acetate / vinyl laurate / ethylene / allyl acetate, butadiene / isoprene / Examples thereof include conjugated diene compounds such as chloroprene.
【００１１】エポキシ樹脂と硬化剤の配合比は、エポキ
シ当量／活性水素当量＝０．５〜２．０が安定性および
密着性の点で好ましい。The mixing ratio of the epoxy resin and the curing agent is preferably epoxy equivalent / active hydrogen equivalent = 0.5 to 2.0 in terms of stability and adhesion.
【００１２】本発明に使用する銀粉としては、平均粒径
が３０μｍ以下であれば、フレーク状粉、球状粉、樹枝
状粉のいずれでもよく、また、ステアリン酸等の高級脂
肪酸の分散剤あるいは滑剤で処理した銀粉も用いること
ができる。また、それらの銀粉は各々単独で使用するこ
ともできるが、混合して使用することもできる。The silver powder used in the present invention may be any of flake powder, spherical powder and dendritic powder as long as it has an average particle size of 30 μm or less, and a dispersant for higher fatty acids such as stearic acid or a lubricant. It is also possible to use silver powder treated with. Further, those silver powders can be used alone or in a mixture.
【００１３】また、エポキシ樹脂バインダーに対する銀
粉の配合比は、樹脂固形分１００重量部に対し、銀粉５
００〜１５００重量部とするのが好ましい。The mixing ratio of the silver powder to the epoxy resin binder is 5 parts by weight of silver powder to 100 parts by weight of the resin solid content.
It is preferably from 0.00 to 1500 parts by weight.
【００１４】本発明の導電性組成物は、以上の成分範囲
に含まれるものを３本ロール等により混練し、所定の場
所にディスペンサー、刷毛塗り等によって塗布した後各
種電子部品、リード等を載せて加熱硬化させて使用する
ことができる。The electrically conductive composition of the present invention is kneaded by using a three-roll mill or the like within the above-mentioned range of components, applied to a predetermined place with a dispenser, brush coating, etc., and then various electronic parts, leads and the like are placed thereon. It can be heated and cured before use.
【００１５】本発明の導電性組成物は、種々の硬化条件
で硬化できるが、１８０〜２００℃で３０分間保持する
か、または１５０℃で６０分間保持するのが好ましい。The conductive composition of the present invention can be cured under various curing conditions, but it is preferable to hold it at 180 to 200 ° C. for 30 minutes or 150 ° C. for 60 minutes.
【００１６】[0016]
【作用】エポキシ樹脂中のエーテル酸素とニトリル基の
相乗効果により密着性が改善される。しかし、ニトリル
基の導入量が０．１重量％未満では良好な密着性が得ら
れず、一方、２０重量％を超えると安定性、硬化性に問
題を生じる。また、エポキシ樹脂と硬化剤の配合比は、
エポキシ当量／活性水素当量＝０．５〜２．０が安定性
および密着性の点で優れている。さらに、エポキシ樹脂
バインダーに対する銀粉の配合比として、樹脂固形分１
００重量部に対し銀粉５００重量部未満では導電性に劣
り、一方、銀粉の含有量が１５００重量部より多くなる
と良好な密着性が得られない。[Function] Adhesion is improved by the synergistic effect of ether oxygen and nitrile groups in the epoxy resin. However, if the introduced amount of the nitrile group is less than 0.1% by weight, good adhesion cannot be obtained, while if it exceeds 20% by weight, problems occur in stability and curability. Also, the mixing ratio of the epoxy resin and the curing agent is
Epoxy equivalent / active hydrogen equivalent = 0.5 to 2.0 is excellent in stability and adhesiveness. Further, the resin solid content is 1 as the mixing ratio of the silver powder to the epoxy resin binder.
If the amount of silver powder is less than 500 parts by weight with respect to 00 parts by weight, the conductivity is poor, and if the content of silver powder is more than 1500 parts by weight, good adhesion cannot be obtained.
【００１７】[0017]
【実施例】以下に本発明の実施例を説明するが、本発明
はこれら実施例により何ら限定されるものではない。以
下の表１に示すように配合した各実施例ならびに比較例
の導電性材料を３本ロール等により混練し、導電性組成
物を製造した。得られた導電性組成物の導電性、密着性
および可使時間に関する特性値は同表に示す通りであ
る。EXAMPLES Examples of the present invention will be described below, but the present invention is not limited to these examples. The conductive materials of the respective Examples and Comparative Examples compounded as shown in Table 1 below were kneaded with a three-roll mill or the like to produce a conductive composition. The characteristic values relating to the conductivity, adhesion and pot life of the obtained conductive composition are as shown in the same table.
【００１８】[0018]
【表１】 [Table 1]
【００１９】表１に明らかなように、実施例１、２はニ
トリルゴムと銀粉をエポキシ樹脂バインダー中に適量配
合したものであるから、導電性・密着性が良好で、可使
時間が長い。しかし、比較例１〜３の導電性材料には、
ニトリルゴムが配合されていないので、密着性が不良
で、可使時間が短い。As is clear from Table 1, in Examples 1 and 2, since the nitrile rubber and the silver powder were mixed in an appropriate amount in the epoxy resin binder, the conductivity and adhesion were good, and the pot life was long. However, in the conductive materials of Comparative Examples 1 to 3,
Since it contains no nitrile rubber, the adhesion is poor and the pot life is short.
【００２０】[0020]
【発明の効果】本発明の導電性組成物は、可使時間が長
く、良好な導電性を示し、且つ密着性に優れているた
め、液晶、ＬＥＤ等の表示素子および水晶振動子等の電
子部品の電極とリードの接着に好適に用いることができ
る。EFFECTS OF THE INVENTION The conductive composition of the present invention has a long pot life, exhibits good conductivity, and is excellent in adhesiveness. Therefore, it can be used in electronic devices such as liquid crystal, LED and other display devices and crystal oscillators. It can be preferably used for bonding electrodes and leads of parts.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/32 Ｂ 7128−4Ｅ (72)発明者 岩坂 光富 京都府京都市中京区三条通猪熊西入ル御供 町309─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical indication location H05K 3/32 B 7128-4E (72) Inventor Mitsutomi Iwasaka Sanjo Dori Inokuma, Nakagyo-ku, Kyoto City, Kyoto Prefecture Nishiiri Ru Ogomi Town 309
Claims (4)
してニトリルゴムを含有するエポキシ樹脂バインダーに
銀粉を配合した導電性組成物。1. A conductive composition comprising an epoxy resin, a curing agent, and an epoxy resin binder containing nitrile rubber as an essential component and silver powder mixed therein.
ムの導入量が、結合アクリロニトリルとして０．１〜２
０重量％である請求項１記載の導電性組成物。2. The amount of nitrile rubber introduced into the epoxy resin binder is 0.1 to 2 as bound acrylonitrile.
The conductive composition according to claim 1, which is 0% by weight.
キシ当量／活性水素当量＝０．５〜２．０である請求項
１または２記載の導電性組成物。3. The conductive composition according to claim 1, wherein the compounding ratio of the epoxy resin and the curing agent is epoxy equivalent / active hydrogen equivalent = 0.5 to 2.0.
配合比が、樹脂固形分１００重量部に対し、銀粉５００
〜１５００重量部である請求項１、２または３記載の導
電性組成物。4. The blending ratio of silver powder to epoxy resin binder is such that silver powder is 500 parts by weight with respect to 100 parts by weight of resin solid content.
The conductive composition according to claim 1, 2 or 3, which is ˜1500 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34758092A JPH06203627A (en) | 1992-12-28 | 1992-12-28 | Conductive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34758092A JPH06203627A (en) | 1992-12-28 | 1992-12-28 | Conductive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06203627A true JPH06203627A (en) | 1994-07-22 |
Family
ID=18391181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34758092A Pending JPH06203627A (en) | 1992-12-28 | 1992-12-28 | Conductive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06203627A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998003047A1 (en) * | 1996-07-15 | 1998-01-22 | Hitachi Chemical Company, Ltd. | Film-like adhesive for connecting circuit and circuit board |
| CN1301509C (en) * | 2003-12-12 | 2007-02-21 | 李郁忠 | Method for preparing current conducting high molecular material and heating element |
| CN100334125C (en) * | 2002-06-28 | 2007-08-29 | 兰州思特创新科技有限责任公司 | High temperature corrosion-resisting resin |
| JP2012092201A (en) * | 2010-10-26 | 2012-05-17 | Kyocera Chemical Corp | Electroconductive resin composition, and semiconductor device using the same |
-
1992
- 1992-12-28 JP JP34758092A patent/JPH06203627A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998003047A1 (en) * | 1996-07-15 | 1998-01-22 | Hitachi Chemical Company, Ltd. | Film-like adhesive for connecting circuit and circuit board |
| US6328844B1 (en) | 1996-07-15 | 2001-12-11 | Hitachi Chemical Company, Ltd. | Filmy adhesive for connecting circuits and circuit board |
| CN100334125C (en) * | 2002-06-28 | 2007-08-29 | 兰州思特创新科技有限责任公司 | High temperature corrosion-resisting resin |
| CN1301509C (en) * | 2003-12-12 | 2007-02-21 | 李郁忠 | Method for preparing current conducting high molecular material and heating element |
| JP2012092201A (en) * | 2010-10-26 | 2012-05-17 | Kyocera Chemical Corp | Electroconductive resin composition, and semiconductor device using the same |
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