JPH06136244A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH06136244A JPH06136244A JP28623692A JP28623692A JPH06136244A JP H06136244 A JPH06136244 A JP H06136244A JP 28623692 A JP28623692 A JP 28623692A JP 28623692 A JP28623692 A JP 28623692A JP H06136244 A JPH06136244 A JP H06136244A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- fine powder
- silica fine
- weight
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、エポキシ樹脂組成物に
関する。詳しくは、金属あるいはセラミックの基材と金
属箔との張り合わせに適し、特に、高放熱性配線板の絶
縁接着層として好適なエポキシ樹脂組成物に関する。FIELD OF THE INVENTION The present invention relates to an epoxy resin composition. More specifically, the present invention relates to an epoxy resin composition suitable for laminating a metal or ceramic base material and a metal foil, and particularly suitable as an insulating adhesive layer for a high heat dissipation wiring board.
【０００２】[0002]
【従来の技術】従来より、高放熱性配線板は、金属ある
いはセラミックのベース基材と金属箔及び両者を張り合
わせるための絶縁接着層からなるものが主流となってい
る。この絶縁接着層には、エポキシ樹脂あるいはフェノ
ール樹脂などの樹脂系に無機系充填剤を配合して熱伝導
性を高めた接着剤が用いらることが多い。例えば、樹脂
系に金属酸化物を１０〜６０重量％配合したもの（実公
昭４６−２５７５６号）や樹脂系に酸化アルミニウムを
６０〜６５体積％とシランまたはチタン系カップリング
剤を配合したもの（特公昭６３−４９９２０号）などが
ある。2. Description of the Related Art Conventionally, a high heat radiation wiring board is mainly composed of a metal or ceramic base material, a metal foil, and an insulating adhesive layer for bonding the both. For this insulating adhesive layer, an adhesive in which a resin system such as an epoxy resin or a phenol resin is mixed with an inorganic filler to improve thermal conductivity is often used. For example, a resin system containing 10 to 60% by weight of a metal oxide (Jitsuko Sho 46-25756) or a resin system containing 60 to 65% by volume of aluminum oxide and a silane or titanium coupling agent ( Japanese Patent Publication No. 63-49920).
【０００３】[0003]
【発明が解決しようとする課題】近年、高放熱性配線板
はより低熱抵抗化が要求され、絶縁接着層も無機系充填
剤を高充填することによる低熱抵抗化が必要となってき
ている。絶縁接着層形成用の接着剤に充填剤を高充填さ
せるには、使用する接着剤のベースとなる樹脂系の硬化
前の液体状態の粘度が低いことが必要である。また、例
えばコンマコーター等を用いて塗布する場合等の作業性
からも接着剤として低粘度であることが望まれる。しか
しながら、粘度が低いと充填剤の沈降が生じやすくな
り、例えば、保存中においても充填剤の沈降が生じ、使
用条件が限定されることになる。In recent years, a high heat dissipation wiring board is required to have a lower thermal resistance, and an insulating adhesive layer is also required to have a low thermal resistance by being highly filled with an inorganic filler. In order to highly fill the adhesive for forming the insulating adhesive layer with the filler, it is necessary that the viscosity of the resin system, which is the base of the adhesive used, before curing is low. In addition, it is desirable that the adhesive has a low viscosity in terms of workability in the case of applying it using a comma coater or the like. However, if the viscosity is low, sedimentation of the filler is likely to occur, and, for example, the sedimentation of the filler occurs even during storage, which limits the use conditions.
【０００４】充填剤の沈降は、ベースとなる樹脂系の粘
度を高くする以外に、充填剤の粒径を小さくすることで
抑えられる。しかしながら、粒径が小さいと樹脂系への
混合が困難となるという問題が生じる。このようなこと
をふまえ、本発明は、無機充填剤を高い割合で含有し、
しかも硬化前の無機系充填剤の沈降がないエポキシ樹脂
組成物を提供することを目的とする。Sedimentation of the filler can be suppressed by increasing the viscosity of the base resin system and reducing the particle size of the filler. However, if the particle size is small, there arises a problem that it becomes difficult to mix it with the resin system. Based on the above, the present invention contains a high proportion of an inorganic filler,
Moreover, it is an object of the present invention to provide an epoxy resin composition in which the inorganic filler before curing does not precipitate.
【０００５】[0005]
【課題を解決するための手段】すなわち、本発明は、エ
ポキシ樹脂、硬化剤及びシリカ微粉末を必須成分として
含有してなるエポキシ樹脂組成物において、前記シリカ
微粉末の含有割合が前記エポキシ樹脂、硬化剤及びシリ
カ微粉末の合計量の６０〜８０重量％であって、前記シ
リカ微粉末は３−メタクリロキシプロピルメトキシシラ
ンで表面処理されていて、その平均粒径が０．５〜５．
２μｍ、粒径０．２μｍ以下の累積重量％が１０％未満
かつ粒径１２．０μｍ未満の累積重量％が９０％以上の
ものであることを特徴とするエポキシ樹脂組成物であ
る。That is, the present invention provides an epoxy resin composition comprising an epoxy resin, a curing agent and silica fine powder as essential components, wherein the silica fine powder content is the epoxy resin, It is 60 to 80% by weight of the total amount of the curing agent and the silica fine powder, the silica fine powder is surface-treated with 3-methacryloxypropylmethoxysilane, and the average particle size thereof is 0.5 to 5.
The epoxy resin composition is characterized in that the cumulative weight% of 2 μm and the particle size of 0.2 μm or less is less than 10% and the cumulative weight% of the particle size of less than 12.0 μm is 90% or more.
【０００６】本発明に用いられるエポキシ樹脂として
は、ビスフェノールＡ型、ノボラック型等が挙げられ
る。本発明に用いられるエポキシ樹脂の硬化剤として
は、ジシアンジアミド等などがあげられ、従来公知の硬
化剤が使用できる。また、本発明のエポキシ樹脂組成物
には、必要に応じて硬化促進剤が用いられる。Examples of the epoxy resin used in the present invention include bisphenol A type and novolac type. Examples of the curing agent for the epoxy resin used in the present invention include dicyandiamide and the like, and conventionally known curing agents can be used. Further, a curing accelerator is used in the epoxy resin composition of the present invention, if necessary.
【０００７】また、本発明においては無機系充填剤とし
てシリカ微粉末を使用し、そのシリカ微粉末は、３−メ
タクリロキシプロピルメトキシシランで表面処理されて
いて、その平均粒径が０．５〜５．２μｍ、粒径０．２
μｍ以下の累積重量％が１０％未満かつ粒径１２．０μ
ｍ未満の累積重量％が９０％以上のものが用いられる。
特に、３−メタクリロキシプロピルメトキシシランで表
面処理が施されることによって、分散性がよくなり樹脂
系への均一な混合及び高充填が可能となる。さらに、上
記の平均粒径、累積重量％のシリカ微粉末が用いられる
ことにより、樹脂系の粘度が低くてもシリカ微粉末の沈
降が防がれる。平均粒径が０．５μｍ未満または、粒径
０．２μｍ以下の累積重量％が１０％以上であると樹脂
系への混合に困難を生じる。平均粒径が５．２μｍを越
えるかまたは、粒径１２．０μｍ未満の累積重量％が９
０％未満であると沈降が生じる。In the present invention, fine silica powder is used as the inorganic filler, and the fine silica powder is surface-treated with 3-methacryloxypropylmethoxysilane and has an average particle size of 0.5 to 0.5. 5.2 μm, particle size 0.2
Cumulative weight% of less than μm is less than 10% and particle size is 12.0μ
Those having a cumulative weight% of less than m of 90% or more are used.
In particular, the surface treatment with 3-methacryloxypropylmethoxysilane improves the dispersibility and enables uniform mixing and high filling in the resin system. Further, by using the silica fine powder having the above-mentioned average particle size and cumulative weight%, sedimentation of the silica fine powder can be prevented even if the viscosity of the resin system is low. If the average particle size is less than 0.5 μm or the cumulative weight% of the particle size of 0.2 μm or less is 10% or more, mixing into the resin system becomes difficult. If the average particle size exceeds 5.2 μm, or if the cumulative weight% of the particle size less than 12.0 μm is 9
If it is less than 0%, sedimentation occurs.
【０００８】本発明に用いられるシリカ微粉末として
は、結晶性シリカ、溶融シリカ等が挙げられる。硬化物
の熱伝導性の点からは結晶性シリカが望ましいが特に限
定されるものではない。Examples of the silica fine powder used in the present invention include crystalline silica and fused silica. From the viewpoint of the thermal conductivity of the cured product, crystalline silica is desirable, but it is not particularly limited.
【０００９】本発明のエポキシ樹脂組成物は、硬化前の
液体状態のときには、塗布作業性とシリカ微粉末が高配
合されることから粘度が常温において１０００〜５００
００ｃｐｓであることが望ましい。より望ましくは３０
００〜２００００ｃｐｓである。１０００〜５００００
ｃｐｓの範囲内であれば、塗布作業性が良好である。こ
の粘度の範囲でかつ上記のシリカ微粉末が用いられるこ
とにより、シリカ微粉末の高含有が可能となり、しかも
シリカ微粉末の沈降が生じることがない。粘度が５００
００ｃｐｓを越えると塗布作業性が低下し、更にシリカ
微粉末の混合が困難となる。また、１０００ｃｐｓ以下
では、シリカ微粉末の沈降が顕著となる。硬化前の液体
状態のときの粘度は、溶剤の添加等により調整できる。In the liquid state before curing, the epoxy resin composition of the present invention has a viscosity of 1000 to 500 at room temperature because of its coating workability and high silica fine powder content.
00 cps is desirable. More preferably 30
It is from 00 to 20000 cps. 1000-50000
Within the range of cps, the coating workability is good. By using the above silica fine powder within this viscosity range, a high content of the silica fine powder can be achieved, and the silica fine powder does not precipitate. Viscosity is 500
When it exceeds 00 cps, the coating workability is deteriorated and it becomes difficult to mix fine silica powder. At 1000 cps or less, sedimentation of the silica fine powder becomes remarkable. The viscosity in the liquid state before curing can be adjusted by adding a solvent or the like.
【００１０】本発明のエポキシ樹脂組成物は硬化前時に
溶剤により希釈し塗布作業が良好にできる程度に低粘度
としても、シリカ微粉末の沈降が生じなることがなく、
冷蔵保存しておくことができる。そしてシリカ微粉末の
沈降が生じることなくシリカ微粉末の高含有が可能とな
ったものである。また、シリカ微粉末を高割合で含有す
るため、本発明のエポキシ樹脂組成物の硬化物は熱伝導
性に優れたものである。The epoxy resin composition of the present invention does not cause precipitation of fine silica powder even if it is diluted with a solvent before curing and has a viscosity low enough to allow good coating work.
Can be stored refrigerated. Further, the high content of the silica fine powder can be achieved without the precipitation of the silica fine powder. Further, since the silica fine powder is contained in a high proportion, the cured product of the epoxy resin composition of the present invention has excellent thermal conductivity.
【００１１】[0011]
【実施例】以下、本発明の実施例及び比較例を示す。以
下に示した組成について三本ロールにより混合して本発
明のエポキシ樹脂組成物及び比較例のエポキシ樹脂組成
物を作成した。固体エポキシ樹脂の場合は予め溶剤にて
液状として粘度を調整しておいた。粘度はＥ型粘度計を
用い、２５℃において１０rpm で測定した。EXAMPLES Examples and comparative examples of the present invention will be shown below. The compositions shown below were mixed by a triple roll to prepare an epoxy resin composition of the present invention and an epoxy resin composition of a comparative example. In the case of a solid epoxy resin, the viscosity was adjusted in advance as a liquid with a solvent. The viscosity was measured with an E-type viscometer at 25 ° C. and 10 rpm.
【００１２】実施例１ 組成 クレゾールノボラック型エポキシ樹脂 １００重量部 ジシアンジアミド ５重量部 結晶性シリカＡ ２４５重量部 ３−メタクリロキシプロピルメトキシシランで表面処理 メチルエチルケトン （ 粘度 10000cpsに調整 ）Example 1 Composition Cresol novolac type epoxy resin 100 parts by weight Dicyandiamide 5 parts by weight Crystalline silica A 245 parts by weight Surface treatment with 3-methacryloxypropylmethoxysilane Methyl ethyl ketone (viscosity adjusted to 10,000 cps)
【００１３】実施例２ 組成 クレゾールノボラック型エポキシ樹脂 １００重量部 ジシアンジアミド ５重量部 結晶性シリカＢ ２４５重量部 ３−メタクリロキシプロピルメトキシシランで表面処理 メチルエチルケトン （ 粘度 10000cpsに調整 ）Example 2 Composition Cresol novolac type epoxy resin 100 parts by weight Dicyandiamide 5 parts by weight Crystalline silica B 245 parts by weight Surface treatment with 3-methacryloxypropylmethoxysilane Methyl ethyl ketone (viscosity adjusted to 10,000 cps)
【００１４】比較例１ 組成 クレゾールノボラック型エポキシ樹脂 １００重量部 ジシアンジアミド ５重量部 結晶性シリカＡ ２４５重量部 無処理 メチルエチルケトン （ 粘度 10000cpsに調整 ）Comparative Example 1 Composition Cresol novolac type epoxy resin 100 parts by weight Dicyandiamide 5 parts by weight Crystalline silica A 245 parts by weight Untreated methyl ethyl ketone (viscosity adjusted to 10000 cps)
【００１５】比較例２ 組成 クレゾールノボラック型エポキシ樹脂 １００重量部 ジシアンジアミド ５重量部 結晶性シリカＢ ２４５重量部 ３−アミノプロピルトリエトキシシランで表面処理 メチルエチルケトン （ 粘度 10000cpsに調整 ）Comparative Example 2 Composition Cresol novolac type epoxy resin 100 parts by weight Dicyandiamide 5 parts by weight Crystalline silica B 245 parts by weight Surface treatment with 3-aminopropyltriethoxysilane Methyl ethyl ketone (viscosity adjusted to 10,000 cps)
【００１６】比較例３ 組成 クレゾールノボラック型エポキシ樹脂 １００重量部 ジシアンジアミド ５重量部 結晶性シリカＢ ２４５重量部 ３−グリシドキシプロピルトリメトキシシランで表面処理 メチルエチルケトン （ 粘度 10000cpsに調整 ）Comparative Example 3 Composition Cresol novolac type epoxy resin 100 parts by weight Dicyandiamide 5 parts by weight Crystalline silica B 245 parts by weight Surface treatment with 3-glycidoxypropyltrimethoxysilane Methyl ethyl ketone (viscosity adjusted to 10,000 cps)
【００１７】比較例４ 組成 クレゾールノボラック型エポキシ樹脂 １００重量部 ジシアンジアミド ５重量部 結晶性シリカＣ ２４５重量部 ３−メタクリロキシプロピルメトキシシランで表面処理 メチルエチルケトン （ 粘度 10000cpsに調整 ）Comparative Example 4 Composition Cresol novolac type epoxy resin 100 parts by weight Dicyandiamide 5 parts by weight Crystalline silica C 245 parts by weight Surface treatment with 3-methacryloxypropylmethoxysilane Methyl ethyl ketone (viscosity adjusted to 10,000 cps)
【００１８】比較例５ 組成 クレゾールノボラック型エポキシ樹脂 １００重量部 ジシアンジアミド ５重量部 結晶性シリカＤ ２４５重量部 ３−メタクリロキシプロピルメトキシシランで表面処理 メチルエチルケトン （ 粘度 10000cpsに調整 ）Comparative Example 5 Composition Cresol novolac type epoxy resin 100 parts by weight Dicyandiamide 5 parts by weight Crystalline silica D 245 parts by weight Surface treatment with 3-methacryloxypropylmethoxysilane Methyl ethyl ketone (viscosity adjusted to 10,000 cps)
【００１９】比較例６ 組成 クレゾールノボラック型エポキシ樹脂 １００重量部 ジシアンジアミド ５重量部 結晶性シリカＥ ２４５重量部 無処理 メチルエチルケトン （ 粘度 10000cpsに調整 ）Comparative Example 6 Composition Cresol novolac type epoxy resin 100 parts by weight Dicyandiamide 5 parts by weight Crystalline silica E 245 parts by weight Untreated methyl ethyl ketone (viscosity adjusted to 10000 cps)
【００２０】使用した結晶性シリカ微粉末の平均粒径及
び粒度分布を表１に示す。The average particle size and particle size distribution of the crystalline silica fine powder used are shown in Table 1.
【００２１】[0021]
【表１】 ○ 請求範囲に入るもの × 請求範囲から外れるもの[Table 1] ○ Items within the claim range × Items outside the claim range
【００２２】以上、実施例１、２及び比較例１〜６の組
成は固形分に対してシリカ微粉末が７０重量％を占める
組成であり、三本ロールで直接混合してエポキシ樹脂組
成物を得た。得られたエポキシ樹脂組成物を７℃で１週
間冷蔵保存した後、シリカ微粉末の沈降具合いを観察し
た。この結果を表２に示す。シリカ微粉末の沈降は冷蔵
保存したサンプルの上部と下部で灰分量を測定し、その
差が３％以上となった場合にシリカ微粉末の沈降が生じ
たとした。As described above, the compositions of Examples 1 and 2 and Comparative Examples 1 to 6 are compositions in which silica fine powder accounts for 70% by weight with respect to the solid content, and the epoxy resin composition is prepared by directly mixing with three rolls. Obtained. The obtained epoxy resin composition was refrigerated and stored at 7 ° C. for 1 week, and then the state of sedimentation of silica fine powder was observed. The results are shown in Table 2. As for the sedimentation of the fine silica powder, the ash content was measured at the upper part and the lower part of the refrigerated sample, and when the difference was 3% or more, the fine silica powder was settled.
【００２３】[0023]
【表２】 １）接着剤の作成 可：三本ロールでの混合可能 不可：充分混合できず ２）シリカ微粉末の沈降 有：サンプルの下部にシリカ
微粉末が沈降 無：シリカ微粉末の沈降無し[Table 2] 1) Preparation of adhesive Yes: Mixable with three rolls No: Not able to mix well 2) Silica fine powder sedimentation Yes: Silica fine powder does not settle at the bottom of the sample No: No silica fine powder sedimentation
【００２４】[0024]
【発明の効果】本発明のエポキシ樹脂組成物は、硬化前
においてのシリカ微粉末の沈降を生じさせることなく、
シリカ微粉末の高含有ができたものである。即ち、本発
明のエポキシ樹脂組成物は硬化前においてシリカ微粉末
の沈降が生じないため、冷蔵保存が可能であり、また、
硬化前の粘度が低粘度であるため、塗布作業等の作業性
が良好である。さらに、本発明のエポキシ樹脂組成物
は、シリカ微粉末を高含有ししかも硬化前のシリカ微粉
末の沈降がなくシリカ微粉末を常に均一に含有するた
め、本発明のエポキシ樹脂組成物の硬化物は良好な熱伝
導性をむらなく示す。従って本発明のエポキシ樹脂組成
物は、高放熱性配線板用の絶縁接着層として極めて有用
である。The epoxy resin composition of the present invention can prevent the precipitation of fine silica powder before curing,
This is a high content of fine silica powder. That is, since the epoxy resin composition of the present invention does not cause precipitation of fine silica powder before curing, it can be stored in a refrigerator.
Since the viscosity before curing is low, workability such as coating work is good. Furthermore, since the epoxy resin composition of the present invention contains a high amount of silica fine powder and does not cause precipitation of the silica fine powder before curing and always contains the silica fine powder uniformly, a cured product of the epoxy resin composition of the present invention is obtained. Shows evenly good thermal conductivity. Therefore, the epoxy resin composition of the present invention is extremely useful as an insulating adhesive layer for a high heat dissipation wiring board.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中村 信之 東京都千代田区丸の内２丁目６番１号 古 河電気工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nobuyuki Nakamura 2-6-1, Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Co., Ltd.
Claims (1)
を必須成分として含有してなるエポキシ樹脂組成物にお
いて、前記シリカ微粉末の含有割合が前記エポキシ樹
脂、硬化剤及びシリカ微粉末の合計量の６０〜８０重量
％であって、前記シリカ微粉末は３−メタクリロキシプ
ロピルメトキシシランで表面処理されていて、その平均
粒径が０．５〜５．２μｍ、粒径０．２μｍ以下の累積
重量％が１０％未満かつ粒径１２．０μｍ未満の累積重
量％が９０％以上のものであることを特徴とするエポキ
シ樹脂組成物。1. In an epoxy resin composition comprising an epoxy resin, a curing agent and silica fine powder as essential components, the content ratio of the silica fine powder is the total amount of the epoxy resin, the curing agent and the silica fine powder. 60-80% by weight, the silica fine powder is surface-treated with 3-methacryloxypropylmethoxysilane, the average particle size is 0.5-5.2 μm, and the cumulative weight of the particle size is 0.2 μm or less. % Of less than 10% and particle size of less than 12.0 μm, cumulative weight% is 90% or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28623692A JPH06136244A (en) | 1992-10-23 | 1992-10-23 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28623692A JPH06136244A (en) | 1992-10-23 | 1992-10-23 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06136244A true JPH06136244A (en) | 1994-05-17 |
Family
ID=17701743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28623692A Pending JPH06136244A (en) | 1992-10-23 | 1992-10-23 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06136244A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4822912A (en) * | 1987-02-20 | 1989-04-18 | Bayer Aktiengesellschaft | Process for the preparation of 2,3,5,6-tetrafluorobenzoic acid |
| WO2007088889A1 (en) | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article |
| US20130244402A1 (en) * | 2012-03-16 | 2013-09-19 | Lintec Corporation | Adhesive Composition, An Adhesive Sheet and a Production Method of a Semiconductor Device |
| WO2014021386A1 (en) | 2012-07-31 | 2014-02-06 | 旭化成イーマテリアルズ株式会社 | Epoxy resin composition, epoxy resin, and cured article |
| WO2014192745A1 (en) * | 2013-05-28 | 2014-12-04 | リンテック株式会社 | Adhesive agent composition, adhesive sheet, and method for manufacturing semiconductor device |
| JP2014231542A (en) * | 2013-05-28 | 2014-12-11 | リンテック株式会社 | Adhesive composition, adhesive sheet, and method for manufacturing semiconductor device |
| JP2015000959A (en) * | 2013-06-17 | 2015-01-05 | リンテック株式会社 | Adhesive composition, adhesive sheet, and method for producing semiconductor device |
| DE102016121533A1 (en) | 2015-11-13 | 2017-06-01 | Ajinomoto Co., Inc. | Coated particles |
| CN107964380A (en) * | 2017-12-28 | 2018-04-27 | 石家庄惠得科技有限公司 | A kind of Non-Gaussian Distribution aluminium hydrate powder and its preparation method and application |
| WO2018169059A1 (en) | 2017-03-17 | 2018-09-20 | 旭化成株式会社 | Thermosetting resin composition |
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-
1992
- 1992-10-23 JP JP28623692A patent/JPH06136244A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4822912A (en) * | 1987-02-20 | 1989-04-18 | Bayer Aktiengesellschaft | Process for the preparation of 2,3,5,6-tetrafluorobenzoic acid |
| WO2007088889A1 (en) | 2006-02-03 | 2007-08-09 | Asahi Kasei Chemicals Corporation | Microcapsule type hardener for epoxy resin, masterbatch type hardener composition for epoxy resin, one-pack type epoxy resin composition, and processed article |
| US7927514B2 (en) | 2006-02-03 | 2011-04-19 | Asahi Kasei Chemicals Corporation | Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good |
| US9382455B2 (en) | 2012-03-16 | 2016-07-05 | Lintec Corporation | Adhesive composition, an adhesive sheet and a production method of a semiconductor device |
| US20130244402A1 (en) * | 2012-03-16 | 2013-09-19 | Lintec Corporation | Adhesive Composition, An Adhesive Sheet and a Production Method of a Semiconductor Device |
| JP2013194103A (en) * | 2012-03-16 | 2013-09-30 | Lintec Corp | Adhesive composition, adhesive sheet and method for manufacturing semiconductor device |
| WO2014021386A1 (en) | 2012-07-31 | 2014-02-06 | 旭化成イーマテリアルズ株式会社 | Epoxy resin composition, epoxy resin, and cured article |
| WO2014192745A1 (en) * | 2013-05-28 | 2014-12-04 | リンテック株式会社 | Adhesive agent composition, adhesive sheet, and method for manufacturing semiconductor device |
| JP2014231542A (en) * | 2013-05-28 | 2014-12-11 | リンテック株式会社 | Adhesive composition, adhesive sheet, and method for manufacturing semiconductor device |
| US20160086908A1 (en) * | 2013-05-28 | 2016-03-24 | Lintec Corporation | Adhesive agent composition, adhesive sheet, and method for manufacturing semiconductor device |
| JP2015000959A (en) * | 2013-06-17 | 2015-01-05 | リンテック株式会社 | Adhesive composition, adhesive sheet, and method for producing semiconductor device |
| DE102016121533A1 (en) | 2015-11-13 | 2017-06-01 | Ajinomoto Co., Inc. | Coated particles |
| WO2018169059A1 (en) | 2017-03-17 | 2018-09-20 | 旭化成株式会社 | Thermosetting resin composition |
| CN107964380A (en) * | 2017-12-28 | 2018-04-27 | 石家庄惠得科技有限公司 | A kind of Non-Gaussian Distribution aluminium hydrate powder and its preparation method and application |
| CN107964380B (en) * | 2017-12-28 | 2020-05-12 | 石家庄惠得科技有限公司 | Non-normal distribution aluminum hydroxide powder and preparation method and application thereof |
| US11441015B2 (en) | 2018-01-12 | 2022-09-13 | Ajinomoto Co., Inc. | Coated particle |
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