JPH03213317A - Injection molding method and its device - Google Patents
Injection molding method and its deviceInfo
- Publication number
- JPH03213317A JPH03213317A JP813590A JP813590A JPH03213317A JP H03213317 A JPH03213317 A JP H03213317A JP 813590 A JP813590 A JP 813590A JP 813590 A JP813590 A JP 813590A JP H03213317 A JPH03213317 A JP H03213317A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molding
- vibration
- resonator
- injection molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001746 injection moulding Methods 0.000 title claims description 42
- 238000000465 moulding Methods 0.000 claims abstract description 39
- 239000012778 molding material Substances 0.000 claims abstract description 23
- 230000000694 effects Effects 0.000 abstract description 14
- 238000002347 injection Methods 0.000 abstract description 6
- 239000007924 injection Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 25
- 239000000463 material Substances 0.000 description 18
- 229920005989 resin Polymers 0.000 description 15
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- 238000002474 experimental method Methods 0.000 description 11
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- 230000000052 comparative effect Effects 0.000 description 9
- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 210000001015 abdomen Anatomy 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- YMHOBZXQZVXHBM-UHFFFAOYSA-N 2,5-dimethoxy-4-bromophenethylamine Chemical compound COC1=CC(CCN)=C(OC)C=C1Br YMHOBZXQZVXHBM-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 241000545067 Venus Species 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005520 electrodynamics Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- QMRNDFMLWNAFQR-UHFFFAOYSA-N prop-2-enenitrile;prop-2-enoic acid;styrene Chemical compound C=CC#N.OC(=O)C=C.C=CC1=CC=CC=C1 QMRNDFMLWNAFQR-UHFFFAOYSA-N 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 238000010107 reaction injection moulding Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C45/568—Applying vibrations to the mould parts
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野コ
本発明は、高分子材料等の成形材料の射出成形に際し、
物性か高く、かつ外観性の良好な成形品を成形てきるよ
うにした射出成形方法とその装置に関する。[Detailed Description of the Invention] [Industrial Field of Application] The present invention is applicable to injection molding of molding materials such as polymeric materials.
The present invention relates to an injection molding method and apparatus that can mold a molded product with high physical properties and good appearance.
[従来の技術]
従来、射出成形方法は、生産性が高いという大きな利点
を有することから、熱可塑性樹脂あるいは熱可塑性樹脂
を主たる組成物とした材料からなる製品の成形に広く使
用されている。[Prior Art] Conventionally, injection molding methods have the great advantage of high productivity, and have therefore been widely used for molding products made of thermoplastic resins or materials whose main composition is thermoplastic resins.
ところで、近年、熱可塑性樹脂の物性研究の進展により
、成形品の剛性、耐熱性および耐薬品性は、その材料(
熱可塑性樹脂)の分子量によって大きく左右されること
か知られるようになってきた。By the way, in recent years, with the progress of research on the physical properties of thermoplastic resins, the rigidity, heat resistance, and chemical resistance of molded products have been improved depending on the material (
It has become known that the molecular weight of the thermoplastic resin (thermoplastic resin) greatly affects the molecular weight.
しかしながら、従来の射出成形方法において成形てきる
熱可塑性樹脂の分子量はそれ程大きくなく、一般にフィ
ルムグレートとして製品化されているものより分子量は
小さい。したがって、成形品にぶける剛性、耐熱性、耐
薬品性の物性か劣るという問題を生じる場合かあった。However, the molecular weight of thermoplastic resins that can be molded using conventional injection molding methods is not so large, and is generally smaller than that of those commercialized as film grades. Therefore, there have been cases in which problems have arisen in that the physical properties of the molded product, such as rigidity, heat resistance, and chemical resistance, are inferior.
そこで、物性を高める観点から、射出成形時における樹
脂の流れを良くして、成形品を構成する樹脂の分子量が
高いものを使用可能にする成形法が考えられるようにな
り、今までにいくつかの提案がなされている0例えば、
特公昭57−2088号て提案されている金型のゲート
部分に超音波振動を付与する方法、あるいは特開昭61
−44616号て提案されている金型表面を高周波によ
り誘導加熱する方法などがある。Therefore, from the perspective of improving physical properties, molding methods that improve the flow of resin during injection molding and enable the use of resins with high molecular weights constituting molded products have been considered, and several methods have been developed so far. For example,
The method of applying ultrasonic vibration to the gate part of the mold proposed in Japanese Patent Publication No. 57-2088, or the method proposed in Japanese Patent Publication No. 61
There is a method of inductively heating the mold surface using high frequency waves, as proposed in No. 44616.
一方、高分子材料を射出成形に用いた場合、高分子材料
は加熱された状態で金型に充填される。On the other hand, when a polymeric material is used for injection molding, the polymeric material is filled into a mold in a heated state.
このため、加熱時に熱膨張し、金型の中で冷却される際
に収縮するので、金型のキャビティ寸法よりも小さい成
形品しか得られなかった。For this reason, it thermally expands when heated and contracts when cooled in the mold, so that only molded products smaller than the cavity size of the mold can be obtained.
そこて、成形品の寸法精度を向上させる観点から、金型
に充填された材料の収縮を少なくするため、いくつかの
提案かなされている。例えば、射出圧力を著しく高くシ
、かつ型締め力も同様に高くすることにより、材料の温
度を低くして成形する方法、あるいは、特開昭58−1
34722号て提案されているような、キャビティを超
音波振動用のホーンで構成し、材料かキャビティ内に注
入され、冷却される過程での材料温度の不均一性を大幅
に減少しようとした方法等がある。Therefore, from the viewpoint of improving the dimensional accuracy of molded products, several proposals have been made to reduce the shrinkage of the material filled in the mold. For example, a method of molding by lowering the temperature of the material by significantly increasing the injection pressure and also increasing the mold clamping force, or JP-A-58-1
34722, a method in which the cavity is constructed with a horn for ultrasonic vibration, and the material is injected into the cavity and attempts to significantly reduce the non-uniformity of material temperature during the cooling process. etc.
[発明が解決しようとした課題]
しかし、上述した従来の成形方法には次のような問題か
あった。[Problems to be Solved by the Invention] However, the conventional molding method described above has the following problems.
すなわち、特公昭57−2088号、#開開58−13
4722号で提案されている技術は、金型の構造が非常
に複雑になるとともに、超音波振動により金型自体及び
装置の他の部分に悪影響を与えるという問題があり、さ
らに材料とホーンか直接接触する構造となっているため
、ホーンや振動発生部に大きな負荷かかかり1.材料に
超音波振動を十分付与てきないという問題かあった。Namely, Special Publication No. 57-2088, #Kaikai No. 58-13
The technology proposed in No. 4722 has the problem that the structure of the mold is very complicated, that ultrasonic vibrations adversely affect the mold itself and other parts of the device, and that the material and horn are directly connected. Due to the contact structure, a large load is placed on the horn and vibration generating parts.1. There was a problem with not applying enough ultrasonic vibration to the material.
また、特開昭61−44616号で提案されている技術
は、実験の結果、金型表面を加熱しても樹脂の流動性は
期待する程向上しないことが判明した。Further, as a result of experiments, it has been found that the fluidity of the resin does not improve as expected even when the surface of the mold is heated in the technique proposed in JP-A No. 61-44616.
さらに、射出圧力を著しく高くシ、かつ型締め力も同様
に高くすることにより、材料の型締め温度を低くして成
形する方法は、成形品に歪が生し、製品として使用する
際に変形しやすいという問題かあった。Furthermore, the method of molding by lowering the mold clamping temperature of the material by significantly increasing the injection pressure and similarly high mold clamping force causes distortion in the molded product, causing it to deform when used as a product. There was a problem with how easy it was.
そこで、本発明者等は、特願平1−62196号におい
て、金型な共振させつつ射出成形する方法と装置を提案
し、上記の問題点を解決できることを示した。Therefore, the present inventors proposed in Japanese Patent Application No. 1-62196 a method and apparatus for injection molding while making the mold resonate, and showed that the above problems could be solved.
しかしながら、特願平1−62196号で提案した装置
の型締め部は特殊な構造をしているため、従来の射出成
形機に適用する場合には、射出成形機に大幅な改造を加
える必要があった。However, since the mold clamping part of the device proposed in Japanese Patent Application No. 1-62196 has a special structure, it is necessary to make major modifications to the injection molding machine when applying it to a conventional injection molding machine. there were.
本発明は上記の事情にかんかみてなされたもので、従来
の射出成形機に適用する場合でも、大幅な改造を加える
ことなく、型締め部をそのまま利用できるようにしたも
のであり、
成形方法の発明は、単に振動を金型に付与するたけでな
く、金型の一部を共振させることにより材料の流動性を
飛躍的に向上させる射出成形方法n坦謹ル日酷シ1、
さらには、共振体に接触する成形材料が、節部に引き寄
せられるという振動の応力効果(共振の節部)を利用す
ることにより、射出圧力のみで成形材料をキャビティに
圧入する場合に比べ、寸法収縮のきわめて小さい成形品
を得ることのできる射出成形方法の提供を目的としてい
る。The present invention has been made in view of the above circumstances, and allows the mold clamping part to be used as is without major modification even when applied to a conventional injection molding machine, and provides a molding method. The invention is an injection molding method that not only applies vibration to the mold, but also makes a part of the mold resonate to dramatically improve the fluidity of the material. By utilizing the stress effect of vibration where the molding material in contact with the resonator is attracted to the nodes (resonant nodes), dimensional shrinkage is reduced compared to when the molding material is injected into the cavity using only injection pressure. The purpose of this invention is to provide an injection molding method that allows extremely small molded products to be obtained.
また成形装置の発明は、上記方法を円滑に実施てきるよ
うにするとともに、装置構成上無理がなく、従来の射出
成形機への応用も容易な射出成形装置の提供を目的とし
た。Further, the invention of the molding apparatus aims to provide an injection molding apparatus that can smoothly carry out the above method, has a reasonable structure, and can be easily applied to a conventional injection molding machine.
[課題を解決するための手段]
上記目的を達成するため、射出成形方法の発明は、成形
材料を射出成形する方法において、金型内に振動によっ
て共振する共振体を設け、これを共振させつつ成形を行
なう方法としである。[Means for Solving the Problems] In order to achieve the above object, the invention of an injection molding method provides a method for injection molding a molding material, in which a resonator that resonates by vibration is provided in the mold, and while making the resonator resonate. This is a method for performing molding.
そして好ましい態様としては、振動効果て、注入される
材料と金型壁面との接触抵抗を最も効率よく低減させる
ために、共振体の共振の腹部が、金型のキャビティの位
置と一致するよう共振さ妊 藷γに/l、1./l+
煽―児小刑厩へE’Aナスのを防止するため、共振体の
共振の節部が、固定側金型の共振する部分の保持部及び
可動側金型の共振する部分の保持部の位置とそれぞれ一
致するよう共振させる方法としである。In a preferred embodiment, in order to most efficiently reduce the contact resistance between the injected material and the mold wall surface using vibration effects, the resonance belly of the resonator is aligned with the position of the mold cavity. Pregnant women / l, 1. /l+
In order to prevent E'Anasu from being transmitted to the child's prison, the resonance node of the resonator is connected to the holding part of the resonating part of the stationary mold and the holding part of the resonating part of the movable mold. This is a method of resonating to match the respective positions.
また、他の好ましい態様としては、振動の応力効果(共
振の節部)で、成形品の寸法収縮を抑え1寸法績度を向
上させるために、共振体の共振の節部が、金型のキャビ
ティの位置と一致するよう共振させ、及び/もしくは振
動か金型外へ伝達するのを防止するため、共振体の共振
の節部を。In addition, as another preferred embodiment, in order to suppress dimensional shrinkage of the molded product and improve one-dimensional performance due to the stress effect of vibration (resonant nodes), the resonant nodes of the resonator are arranged in the mold. the resonant nodes of the resonator to make it resonate to match the position of the cavity and/or to prevent vibrations from being transmitted outside the mold.
固定側金型の共振する部分の保持部及び可動側金型の共
振する部分の保持部の位置とそれぞれ一致するよう共振
させる方法としである。This is a method of causing resonance to coincide with the positions of the holding part of the resonating part of the stationary mold and the holding part of the resonating part of the movable mold.
また、好ましい態様として、上記成形方法における振動
を超音波による振動しである。Further, in a preferred embodiment, the vibration in the above molding method is performed using ultrasonic waves.
一方、成形機からの成形材料を金型のスプルーを介して
キャビティに供給し、射出成形を行なう装置の発明にお
いては、上記金型を固定側金型と可動側金型によって形
成するとともに、これら固定側金型と可動側金型の一部
に振動によって共振する部分を設け、この部分を固定側
金型と可動側金型へ固定治具によってそれぞれ保持する
構成としてあり、
好ましい態様としては、固定側金型の共振する部分に形
成したスプルーを介して成形機からの成形材料を、固定
側金型の共振する部分に形成したキャビティに供給する
構成としてあり、また好ましくは、可動側金型内の共振
体の任意の位置に、振動発生装置を結合した構成として
あり、
さらに好ましくは、固定側金型及び可動側金型の共振す
る部分の固定治具による保持を、線接触による保持構造
としである。On the other hand, in an invention of an apparatus for performing injection molding by supplying molding material from a molding machine to a cavity via a sprue of a mold, the mold is formed by a fixed mold and a movable mold, and A part of the stationary mold and the movable mold is provided with a part that resonates due to vibration, and this part is held by a fixing jig to the fixed mold and the movable mold, respectively.A preferable embodiment is as follows. The molding material from the molding machine is supplied to the cavity formed in the resonant part of the fixed mold through a sprue formed in the resonant part of the fixed mold, and preferably, the molding material is supplied to the cavity formed in the resonant part of the fixed mold. The configuration is such that a vibration generator is coupled to an arbitrary position of the resonator within the resonator, and more preferably, the resonant parts of the stationary mold and the movable mold are held by a fixing jig using a holding structure using line contact. It's Toshide.
[実施例] 以下、上記解決手段の実施例について説明する。[Example] Examples of the above solution will be described below.
まず、射出成形装置の一具体例を、第1[にもとづいて
説明する。First, a specific example of an injection molding apparatus will be described based on the first example.
同図において、1は金型であり、可動側金型2と固定側
金型3に分割されている。そして、可動側金型2の固定
側金型3との内部に共振体(振動方向変換体を含む)、
すなわち可動側共振体21及び固定側共振体31をそれ
ぞれ具備している。In the figure, 1 is a mold, which is divided into a movable mold 2 and a fixed mold 3. A resonator (including a vibration direction converter) is provided inside the movable mold 2 and the fixed mold 3.
That is, a movable side resonator 21 and a fixed side resonator 31 are respectively provided.
また、可動側共振体21の固定側共振体31との接触面
には、キャビティ(ランナーを含めてキャビティと称す
こともある。)2aか形成しである。また、キャビティ
2aと対応する固定側共振体31の接触面にはスプルー
3aが設けである。Further, a cavity (sometimes referred to as a cavity including a runner) 2a is formed on the contact surface of the movable side resonator 21 with the fixed side resonator 31. Further, a sprue 3a is provided on the contact surface of the fixed side resonator 31 corresponding to the cavity 2a.
共振体21.31には、金属、セラミックス。The resonator 21.31 is made of metal or ceramics.
グラファイト等を用いることができるが、振動の伝達損
失か少なく、また振動の振幅を大きくしても疲労の少な
い材質、例えばチタン合金、に−モネル、リン青銅、ジ
ュラルミン等を用いることか好ましい。共振体21.3
1には、振動方向を変換させるL−L変換体、L−R変
換体、L−L−L変換体等の機構を備えることもできる
。Graphite or the like can be used, but it is preferable to use a material that causes less vibration transmission loss and is less fatigued even when the vibration amplitude is increased, such as titanium alloy, Monel, phosphor bronze, duralumin, or the like. Resonator 21.3
1 can also be provided with a mechanism such as an L-L converter, an L-R converter, an L-L-L converter, etc. for changing the vibration direction.
また、金型lの表面にはメツキや、しぼ加工等の処理を
行なってもよい。さらに、金型lは三個以上に分割する
ことも可能であるが、その際分割面は、振動の伝達を良
くするために、可能な限り、共振の腹部の近くに位置さ
せることか好ましい。Furthermore, the surface of the mold l may be subjected to treatments such as plating and graining. Further, the mold 1 can be divided into three or more pieces, but in this case, it is preferable that the dividing plane be located as close to the resonance abdomen as possible in order to improve vibration transmission.
その他、金型の温調、成形品の突出し方法については、
公知の方法を用いることがてきる。金型の温調について
は、金型の局所加熱方式であるホットランナ−システム
、高周波誘導加熱法も利用することができる。In addition, regarding mold temperature control and molded product ejection methods, please refer to
Known methods can be used. Regarding the temperature control of the mold, a hot runner system, which is a local heating method for the mold, and a high frequency induction heating method can also be used.
金型温調用媒体を金型に導入し、あるいは排出するため
に金型に取り付けられるジヨイントは、節部の近くに取
り付けることが好ましい、また、突出しピンを金星に設
ける場合には、突出しビンとそれを通す穴とのクリアラ
ンスを、突出し前の状態における節部の位置で最小値と
したことか好ましい。The joint attached to the mold for introducing or discharging the mold temperature control medium into the mold is preferably installed near the joint, and if an ejector pin is provided on the Venus, it should be installed near the ejector bottle. It is preferable that the clearance with the hole through which it is passed is set to a minimum value at the position of the knot in the state before protrusion.
4は成形機(図示せず)のノズルてあり、スプルー38
を介してキャビティ2aに成形材料を射出供給する。ス
プルー38とノズル4との接触面は、固定側金型3の内
部に設けた固定側共振体31!、:おける振動(変位波
形)のほぼ節部(後述)に位置するようにしである。4 is the nozzle of the molding machine (not shown), and the sprue 38
The molding material is injected and supplied to the cavity 2a through the. The contact surface between the sprue 38 and the nozzle 4 is the fixed side resonator 31 provided inside the fixed side mold 3! , : The vibration (displacement waveform) is located almost at the node (described later).
5は可動側プレートてあり、シリンダ6により進退する
可動側金型取付盤51に結合されている。また、8は固
定側プレートてあり、固定側金型取付盤81に結合され
ている。Reference numeral 5 denotes a movable side plate, which is connected to a movable side mold mounting board 51 that moves forward and backward through a cylinder 6. Further, reference numeral 8 denotes a stationary side plate, which is coupled to a stationary side mold mounting board 81.
可動側金型2への可動側共振体21の保持は、固定治具
をなす固定板7によって行なわれている。すなわち、固
定板7による可動側共振体21の保持は、可動側共振体
21の外周に溝2bを設け、この溝2bに固定板7の先
細りとなった先端7aを当接させることにより行なって
いる。The movable side resonator 21 is held in the movable mold 2 by a fixing plate 7 forming a fixing jig. That is, the movable resonator 21 is held by the fixed plate 7 by providing a groove 2b on the outer periphery of the movable resonator 21, and by bringing the tapered tip 7a of the fixed plate 7 into contact with this groove 2b. There is.
したかって、この場合の固定板7による可動側共振体2
1の保持は線接触保持となり、可動側共振体21と固定
板7の接触面積はきわめて小さくなる。これにより、共
振体21の振動の外部流出を最小限に抑えることかてき
る。Therefore, in this case, the movable side resonator 2 due to the fixed plate 7
1 is held by line contact, and the contact area between the movable side resonator 21 and the fixed plate 7 becomes extremely small. This makes it possible to minimize the external leakage of the vibrations of the resonator 21.
また、固定側共振体31の保持も、固定側共振体31の
外周に溝3bを設けるとともに、固定板9の先端9aを
先細りとして、上記と同様にして行なう。Further, the fixed side resonator 31 is held in the same manner as described above by providing the groove 3b on the outer periphery of the fixed side resonator 31 and making the tip 9a of the fixed plate 9 tapered.
共振体21.31の保持は、超音波による共振の節部な
、てきるたけ接触面積の小さい保持部材を用いて保持す
ることか好ましい。It is preferable to hold the resonator 21.31 using a holding member having a small contact area, such as a node of resonance caused by ultrasonic waves.
振動は、振動発生装置て発生させるか1本実施例では、
振動子10と超音波発振器12て振動発生装置を構成し
ている。Is the vibration generated by a vibration generator?In this embodiment,
The vibrator 10 and the ultrasonic oscillator 12 constitute a vibration generator.
振動子lOは、ねし等の取付は部材11によって可動側
共振体21に結合しである。なお、この振動子10は仕
様に応し可動側共振体21及び/あるいは固定側共振体
31の任意の位置に任意の数取り付けることかてきる。The vibrator IO is attached to the movable resonator 21 by a member 11. Note that an arbitrary number of the vibrators 10 can be attached to arbitrary positions of the movable side resonator 21 and/or the fixed side resonator 31 according to specifications.
超音波発振器12は、振動子10に超音波振動を発生さ
せ、可動側共振体21及び固定側共振体31を励振し共
振させる。The ultrasonic oscillator 12 causes the vibrator 10 to generate ultrasonic vibrations, and excites the movable side resonator 21 and the fixed side resonator 31 to resonate.
共振周波数は、あらかしめ超音波発振器12の追尾可能
な周波数に設計、製作されているのて、成形機のノズル
4をスプルー38に圧接させ、成形材料をスプルー3a
を介してキャビティ2aに供給する場合の刻々の負荷変
動に対しての共振周波数の変化に対し常に追尾を行ない
、また、必要電力の供給も刻々の変化に応じて必要量(
最大出力以下)を供給するように設定されている。The resonance frequency is designed and manufactured to a frequency that can be tracked by the ultrasonic oscillator 12.The nozzle 4 of the molding machine is brought into pressure contact with the sprue 38, and the molding material is transferred to the sprue 3a.
When supplying power to the cavity 2a via the power source, the system constantly tracks changes in the resonant frequency due to momentary load fluctuations, and also adjusts the required amount of power (
maximum output).
なお、振動としては、周波数がIOH,〜10MH,の
振動を用いることかできる。このような周波数のうち、
短時間で振動の効果か得られ、かつ成形材料の過度の発
熱現象を抑えるため10KH,〜100KH,の超音波
か好ましい。Note that as the vibration, a vibration having a frequency of IOH, ~10 MH, can be used. Among these frequencies,
Ultrasonic waves of 10 KH to 100 KH are preferable because the vibration effect can be obtained in a short time and the excessive heat generation phenomenon of the molding material can be suppressed.
また、振動発生装置は、上述した。超音波発生器のほが
、動電式加振機1機械式加振機等を用いることかてきる
。Further, the vibration generator has been described above. As an ultrasonic generator, an electrodynamic vibrator 1, a mechanical vibrator, etc. can be used.
さらに、振動モードとしては、後述する縦振動のほが、
横振動、ねじり振動、径振動、たわみ振動等公知の振動
モードを用いることがてきる。Furthermore, the vibration modes include longitudinal vibration, which will be described later.
Known vibration modes such as transverse vibration, torsional vibration, radial vibration, and flexural vibration can be used.
次に、上記射出成形装置を用いて行なう射出成形方法の
実施例について説明する。Next, an example of an injection molding method performed using the above injection molding apparatus will be described.
図示せざる成形機のノズ・ル4を固定側金型3のスプル
ー33に圧接し、このスプルー33を介してキャビティ
2aに成形材料を射出し成形を行なうとともに、超音波
発振器12により、振動子10に超音波振動(縦振動)
を発生させることによって金型1の共振する部分、すな
わち共振体をn波長共振させる。超音波振動を発生させ
る時期は、目的とした効果に応じて選ぶことかてきる。The nozzle 4 of a molding machine (not shown) is pressed against the sprue 33 of the stationary mold 3, and the molding material is injected into the cavity 2a through the sprue 33. 10 Ultrasonic vibration (longitudinal vibration)
By generating this, the resonant portion of the mold 1, that is, the resonator, is caused to resonate at n wavelengths. The timing for generating ultrasonic vibrations can be selected depending on the desired effect.
射出成形方法の第一実施例は、共振の腹部(変位波形の
最も離れる部分て、一番強く振動している点)を、キャ
ビティ2aと一致させて成形を行なう。このようにする
と超音波の振動効果を最大限有効利用でき成形材料の流
れが良好になる。In the first embodiment of the injection molding method, molding is performed by aligning the resonance belly (the part of the displacement waveform farthest apart and the point vibrating most strongly) with the cavity 2a. In this way, the vibration effect of the ultrasonic waves can be utilized to the maximum extent possible, and the flow of the molding material can be improved.
また、第二実施例は、共振の節部(変位波形の交差する
部分で、振動してない点)をキャビティ2aに一致させ
て成形を行なう。このようにすると、超音波の応力効果
により、成形品の寸法収縮か著しく小さくなる。Further, in the second embodiment, the molding is performed by aligning the resonance node (the point where the displacement waveforms intersect and are not vibrating) with the cavity 2a. In this way, the dimensional shrinkage of the molded product is significantly reduced due to the stress effect of the ultrasonic waves.
上記成形を行なうときの振動周波数は上述のようにl0
KI(、〜100 Kl(、の周波数としたことが好ま
しい。振動の振幅は、大きいほうかその効果を十分発揮
てきるが、共振体の材質の疲労強度に合わせて設定する
ことか好ましい。The vibration frequency when performing the above molding is l0 as described above.
It is preferable to set the frequency to KI (, ~100 Kl (, ). The larger the vibration amplitude, the more effective it will be, but it is preferable to set it in accordance with the fatigue strength of the material of the resonator.
各種の振動モードにおいて、振動の効果を太きくするた
め可動側共振体21、固定側共振体31をn波長共振さ
せる。このn波長共振におけるnは、m/2(mは正の
整数)であるが、金型固定部やノズルの接触部に共振の
節部を一致させるためには、なるべく節部の数の少ない
n<3としたことか好ましい。In various vibration modes, the movable side resonator 21 and the fixed side resonator 31 are caused to resonate with n wavelengths in order to increase the vibration effect. In this n-wavelength resonance, n is m/2 (m is a positive integer), but in order to match the resonance nodes with the mold fixing part and the nozzle contact part, the number of nodes should be as small as possible. It is preferable that n<3.
また、n<3の場合においても、共振の腹部が、キャビ
ティ2aと一致し、振動効果を最大限有効利用てきるよ
うに共振させると、上述のように成形材料の流れか顕著
に良好となる。In addition, even in the case of n<3, if the resonance abdomen is aligned with the cavity 2a and the vibration effect is made to resonate to the maximum extent possible, the flow of the molding material will be significantly improved as described above. .
上述した第−及び第二実施例を実施するに際し、可動側
金型2及び固定側金型3の共振体21.31を可動側金
型及び固定側金型のそれぞれに保持する位置と、振動に
よる共振の節部を致させて、共振させつつ成形を行なう
と振動の外部への伝達を有効に防止する。When implementing the above-mentioned first and second embodiments, the position where the resonators 21 and 31 of the movable mold 2 and the fixed mold 3 are held in the movable mold and the fixed mold, respectively, and the vibration By aligning the resonance nodes and performing molding while resonating, transmission of vibration to the outside can be effectively prevented.
上述した射出成形方法及びその装置によって成形可能な
成形材料としては、プラスチック、ゴム、エラストマー
等の有機材料、無機高分子、セラミックス、金属1ガラ
ス等の無機材料、その他食料品及びそれらの混合材料等
、成形時に若干の流動性を有する材料を挙げられる。Molding materials that can be molded by the above-mentioned injection molding method and apparatus include organic materials such as plastics, rubber, and elastomers, inorganic materials such as inorganic polymers, ceramics, metal 1 glass, other foods, and mixed materials thereof. Examples include materials that have some fluidity during molding.
ここで、プラスチックとしては、次のようなものを挙げ
ることかできる。Here, examples of plastics include the following:
熱硬化性樹脂として
α−オレフィン系樹脂(ポリエチレン、ポリフロピレン
、ポリスチレン、シンジオタク〃チックーポリスチレン
、塩化ビニル樹脂、ポリブテン、超高分子量ポリエチレ
ン、ポリメチルベンゾン、アイオノマー、ポリブチレン
等)
ポリエステル系樹脂(ポリエチレンテレフタレート、ポ
リブチレンテレフタレート、ボリアリレート等)
ボーリエーテル系樹脂(ポリサルホン、ポリエーテルサ
ルホン、ポリエーテルケトン、ポリエーテルエーテルケ
トン、ポリアリルスルホン、ポリオキシベンシレン、ポ
リフェニレンオキサイド、ポリシアノアリルエーテル[
特開昭62−223226号]等)
ボリカーホネート系樹脂
ポリイミド系樹脂
ポリアミド系樹脂
ポリアミドイミド系樹脂
メタクリル樹脂
フッソ樹脂
MBS (メタクリレート ツタジエン スチレン)樹
脂
AAS(アクリレート アクリロニトリル スチレン)
樹脂
AS(アクリロニトリル スチレン)樹脂ACS(塩素
化アクリロニトリル ポリエチレン スチレン)樹脂
ABS (アクリロニトリル ブタジェン スチレン)
樹脂
ポリアセタール系樹脂
セルロース系樹脂
ポリ塩化ビニリデン
塩素化ポリエチレン
EVA (エチレン ビニル アセテート)樹脂ポリウ
レタン系樹脂
シリコーン樹脂
アリル樹脂
フラン樹脂
液晶性ポリマー など、
熱硬化性樹脂として
エポキシ樹脂
フェノール樹脂
ポリブタジェン樹脂
シリコーン樹脂
不飽和ポリエステル欄内
アミノ樹脂 など、
熱可塑性エラストマーとじて
スチレン−ブタジェン系エラストマー
ポリエステル系エラストマー
ポリエチレ系エラストマー
ウレタン系エラストマー
塩化ビニル系エラストマー など。Thermosetting resins include α-olefin resins (polyethylene, polypropylene, polystyrene, syndiotactic polystyrene, vinyl chloride resin, polybutene, ultra-high molecular weight polyethylene, polymethylbenzone, ionomer, polybutylene, etc.), polyester resins (polyethylene terephthalate, polybutylene terephthalate, polyarylate, etc.) Polyether resins (polysulfone, polyethersulfone, polyetherketone, polyetheretherketone, polyallylsulfone, polyoxybensylene, polyphenylene oxide, polycyanoallyl ether [
Polycarbonate resin Polyimide resin Polyamide resin Polyamideimide resin Methacrylic resin Fluorine resin MBS (Methacrylate Tutadiene Styrene) Resin AAS (Acrylate Acrylonitrile Styrene)
Resin AS (acrylonitrile styrene) Resin ACS (chlorinated acrylonitrile polyethylene styrene) Resin ABS (acrylonitrile butadiene styrene)
Resins Polyacetal resins Cellulose resins Polyvinylidene chloride Chlorinated polyethylene EVA (ethylene vinyl acetate) resins Polyurethane resins Silicone resins Allyl resins Furan resins Liquid crystalline polymers Epoxy resins Phenol resins Polybutadiene resins Silicone resins Unsaturated polyesters as thermosetting resins Amino resins, thermoplastic elastomers, styrene-butadiene elastomers, polyester elastomers, polyethylene elastomers, urethane elastomers, vinyl chloride elastomers, etc.
また1本発明における射出成形とは、多色成形、インサ
ート成形、アウトサート成形、射出圧縮成形、射出発泡
成形1反応射出成形、混色射出成形等を含み、さらに、
流動状態またはゴム様状態の成形材料を金型内に圧入し
、所定の形状に賦形した後、成形品を取り出す方法を採
用するすべての成形方法を含むものである。Injection molding in the present invention includes multicolor molding, insert molding, outsert molding, injection compression molding, injection foam molding, reaction injection molding, mixed color injection molding, etc.
This includes all molding methods in which a molding material in a fluid or rubber-like state is press-fitted into a mold, shaped into a predetermined shape, and then the molded product is taken out.
そして、本発明における射出成形は、家電機器用部品、
自動車用部品9通信機器用部品、情報記録機器用部品1
日用・雑貨品9発電機器用部品。Injection molding in the present invention includes parts for home appliances,
Automotive parts 9 Communication equipment parts, information recording equipment parts 1
Daily necessities/miscellaneous goods 9 Parts for power generation equipment.
光学用部品等の成形に用いることがてきる。It can be used for molding optical parts, etc.
[実験例]
以下、本発明実施例の射出成形方法とその装置を用いて
行なった実験結果を、比較例と比較しつつ説明する。[Experimental Example] Hereinafter, the results of an experiment conducted using an injection molding method and an apparatus according to an example of the present invention will be explained while comparing with a comparative example.
実験例1
射出成形装置:第1図に示す装置
上記条件により、金型の共振体を共振させつつ射出成形
を行ない、そのときの流動長(第2図す参照)を求めた
。Experimental Example 1 Injection molding apparatus: The apparatus shown in FIG. 1 Under the above conditions, injection molding was performed while the resonator of the mold was made to resonate, and the flow length at that time (see FIG. 2) was determined.
流動長は、キャビティ(ランナーを含む)に流れた樹脂
の長さを測定し、10回の平均値をもって評価した。The flow length was evaluated by measuring the length of the resin flowing into the cavity (including the runner) and using the average value of 10 measurements.
その結果を表1に示す。The results are shown in Table 1.
比較例1
超音波の発振を停止し、金型の共振体を共振させない以
外、実験例1と同じ条件で実験を行なった。Comparative Example 1 An experiment was conducted under the same conditions as Experimental Example 1 except that the ultrasonic oscillation was stopped and the resonator of the mold was not caused to resonate.
比較例2
遠赤外線ヒータを用い、金型温度を200℃まて加熱し
、比較例1と同じ条件て実験を行なった。この例は、高
周波誘導加熱装置を用いて金型表面温度を上げて成形を
行なう従来例と同等と考えられる。Comparative Example 2 An experiment was conducted under the same conditions as Comparative Example 1 by heating the mold temperature to 200° C. using a far-infrared heater. This example is considered to be equivalent to the conventional example in which molding is performed by raising the mold surface temperature using a high-frequency induction heating device.
比較例3
第7図に示すように、振動子lOを結合したホーンをス
プル一部3aに位置させた以外は、実験例1と同じ条件
で実験を行なった。このとき、金型は共振状態ではなか
った。Comparative Example 3 As shown in FIG. 7, an experiment was conducted under the same conditions as in Experimental Example 1, except that the horn coupled with the vibrator IO was positioned on the sprue portion 3a. At this time, the mold was not in a resonant state.
比較例1〜3の結果を表1に示す。Table 1 shows the results of Comparative Examples 1 to 3.
表 1
この結果1本発明によれば、超音波を印加しない場合は
勿論のこと、スプル一部に超音波を印加した場合あるい
は、金型を加熱した場合などより、はるかに成形材料の
流動性がよくなることか判明した。Table 1 Results 1 According to the present invention, the fluidity of the molding material is much higher than when ultrasonic waves are applied to a part of the sprue or when the mold is heated, as well as when no ultrasonic waves are applied. It turned out that things got better.
また1本発明によればポリエチレンにカーボンブラック
か良く分散することも判明した。It has also been found that according to the present invention, carbon black is well dispersed in polyethylene.
え蔓璽ユ
射出成形装置:固定側金型及び可動側金型が多少長尺に
なっている以外、第1図に示す装置と同様である。Injection molding apparatus: This is the same as the apparatus shown in FIG. 1, except that the fixed mold and the movable mold are slightly longer.
上記条件により、金型を共振させつつ射出成形を行ない
、そのときの成形品の直径を測定した。Injection molding was performed under the above conditions while making the mold resonate, and the diameter of the molded product at that time was measured.
評価は成形品10個の平均値をもって行なった。Evaluation was performed using the average value of 10 molded products.
その結果を表2に示す。The results are shown in Table 2.
監敷負A
金型の共振体を超音波によって共振させない以外、実験
例2と同じ条件て実験を行なった。An experiment was conducted under the same conditions as Experimental Example 2, except that the resonator of the mold was not caused to resonate by ultrasonic waves.
坂艷璽j
振動子10を結合したホーンをスプル一部に位置させた
(第7図参照)以外は、実験例2と同じ条件で実験を行
なった。An experiment was conducted under the same conditions as in Experimental Example 2, except that the horn to which the vibrator 10 was coupled was located in a part of the sprue (see FIG. 7).
比較例4,5の結果を表2に示す。The results of Comparative Examples 4 and 5 are shown in Table 2.
表 2
この結果、本発明によれば、超音波を印加しない場合は
勿論のこと、単に、超音波を印加した場合と比べても、
顕著に寸法収縮の小さい成形品を得られることか判明し
た。Table 2 As a result, according to the present invention, not only when no ultrasonic waves are applied, but also compared to when ultrasonic waves are simply applied.
It has been found that molded products with significantly small dimensional shrinkage can be obtained.
実験例3
共振体を線接触状態で保持し、実験例1の成形を行なっ
た際における超音波発振器の負荷電流な測定した。Experimental Example 3 The load current of the ultrasonic oscillator was measured when the resonator was held in line contact and the molding of Experimental Example 1 was carried out.
その結果を表3に示す。The results are shown in Table 3.
実験例4
共振体の保持を、先端か先細りとなっていない固定板を
用いて行なった。この場合、固定板は共振体と面接触の
状態となる。Experimental Example 4 The resonator was held using a fixing plate whose tip was not tapered. In this case, the fixed plate is in surface contact with the resonator.
その結果を表3に示す。The results are shown in Table 3.
表 3
負荷電流の高くなる実験例4(面接触)では、振動か固
定板を通して流出していることか明らかに分かった。Table 3 In Experimental Example 4 (surface contact) where the load current was high, it was clear that it was due to vibration or leakage through the fixed plate.
この結果、金型の共振体の保持は、線接触による保持か
非常に有効であることが判明した。As a result, it was found that holding the resonator in the mold using line contact is very effective.
実験例5
射出成形装置:第1図に示す装置
上記条件により、金型の共振体を共振させつつ成形を行
なった。Experimental Example 5 Injection molding apparatus: The apparatus shown in FIG. 1. Molding was carried out under the above conditions while causing the resonator of the mold to resonate.
第6図(b)に示す成形品表面のウェルド部のへこみ(
xmm)を求めた。The weld part on the surface of the molded product has a dent (
xmm) was calculated.
その結果を表4に示す。The results are shown in Table 4.
比較例6
超音波の発振を停止させた以外、実験例5と同し条件で
成形を行なった。Comparative Example 6 Molding was carried out under the same conditions as Experimental Example 5 except that the ultrasonic oscillation was stopped.
その結果を表4に示す。The results are shown in Table 4.
実験例6
出力200Wの超音波振動子を二個に増やしく第1図に
おけるL−L変換体の下側の面、すなわち振動子10の
取付は位置と反対側の面に一個増設)1発振タイミング
をそれぞれ合わせ、実験例4と同じ実験を行なった。Experimental Example 6 Increase the number of ultrasonic transducers with an output of 200 W to two (Add one ultrasonic transducer to the lower surface of the L-L converter in Figure 1, that is, the surface opposite to the mounting position of the transducer 10) 1 oscillation The same experiment as in Experimental Example 4 was conducted by adjusting the timing.
その結果を表4に示す。The results are shown in Table 4.
表4
[発明の効果]
以上のように、射出成形方法の発明によれば、振動によ
って金型の一部を共振させることにより、振動を効率良
く伝達することができる。そして、振動効果を最大限に
発揮せしめ、成形材料の流動性向上を図れ、従来の成形
技術では困難てあった、高分子量のプラスチックやフィ
ラーな多量に混合した複合材料等の成形あるいは低温域
ての成形か容易となり、さらに成形品に生じるウェルト
マークを低減することかてきる。Table 4 [Effects of the Invention] As described above, according to the invention of the injection molding method, vibrations can be efficiently transmitted by causing a part of the mold to resonate due to vibrations. It maximizes the vibration effect and improves the fluidity of the molding material, making it possible to mold composite materials containing large amounts of high-molecular weight plastics and fillers, which was difficult with conventional molding techniques, or in low-temperature ranges. This makes molding easier and reduces welt marks that occur on molded products.
また、振動によって金型の一部を共振させることにより
、振動を効率良く伝達し、かつ超音波の応力効果を利用
てきるため、単に振動を金型に印加した場合よりも、成
形品の寸法収縮を顕著に低減できる。In addition, by making a part of the mold resonate through vibration, the vibration can be transmitted efficiently and the stress effect of ultrasonic waves can be utilized, so the dimensions of the molded product can be improved compared to simply applying vibration to the mold. Shrinkage can be significantly reduced.
射出成形装置の発明によれば、成形材料の流動性の向上
を図れ、物性及び寸法精度の点て優れた製品を成形てき
るとともに、共振する部分の振動の外部流出を最小限に
抑えることかてき、装置の他の部分に悪影響を与えない
という効果かある。According to the invention of the injection molding device, it is possible to improve the fluidity of the molding material, mold products with excellent physical properties and dimensional accuracy, and minimize the outflow of vibrations from resonant parts. This has the effect of not adversely affecting other parts of the device.
また、従来の射出成形機における型締部を利用てきるの
て、従来の射出成形機に容易に応用することか可能にな
り、利用価値か非常に高い。Moreover, since the mold clamping part of a conventional injection molding machine can be used, it can be easily applied to a conventional injection molding machine, and its utility value is very high.
第1図は実験例1に用いた射出成形装置の要部断側面図
、第2図(a)は実験例1に用いるキャビティの平面図
、第2図(b)は流動長の説明図、第3図は共振体の共
振時における変位波形、波長の説明図、第4図は実験例
2の成形実験に使用したキャビティの説明図、第5図は
実験例2の成形実験における共振条件の説明図、第6図
(a)は実験例5の成形実験に使用したキャビティの説
明図、第6図(b)はウェルト部へこみの説明図、第7
図は比較例3及び5に用いた装置側概略図を示す。
1:金型
21:可動側共振体
3:固定側金型
2b、3b:溝
7.9:固定治具
2:可動側金型
2a:キャビティ
31:固定側共振体
3aニスブルー
lO:振動子FIG. 1 is a cross-sectional side view of the main parts of the injection molding apparatus used in Experimental Example 1, FIG. 2(a) is a plan view of the cavity used in Experimental Example 1, and FIG. 2(b) is an explanatory diagram of the flow length. Figure 3 is an explanatory diagram of the displacement waveform and wavelength when the resonator resonates, Figure 4 is an explanatory diagram of the cavity used in the molding experiment of Experimental Example 2, and Figure 5 is an explanatory diagram of the resonance conditions in the molding experiment of Experimental Example 2. Explanatory drawing, Fig. 6(a) is an explanatory drawing of the cavity used in the molding experiment of Experimental Example 5, Fig. 6(b) is an explanatory drawing of the welt part dent, Fig. 7
The figure shows a schematic view of the apparatus used in Comparative Examples 3 and 5. 1: Mold 21: Movable side resonator 3: Fixed side mold 2b, 3b: Groove 7.9: Fixing jig 2: Movable side mold 2a: Cavity 31: Fixed side resonator 3a Varnish blue lO: Vibrator
Claims (2)
び固定側の金型の一部分を振動によって共振させつつ成
形を行なうことを特徴とした射出成形方法。(1) An injection molding method for injection molding a molding material, characterized in that molding is performed while parts of the molds on the movable side and the fixed side are resonated by vibration.
た請求項1記載の射出成形方法。(3)成形機からの成
形材料を金型のスプルーを介してキャビティに供給し射
出成形を行なう装置において、上記金型を固定側金型と
可動側金型によって形成するとともに、これら固定側金
型と可動側金型の一部に振動によって共振する部分を設
け、この部分を固定側金型と可動側金型へ固定治具によ
ってそれぞれ保持することを特徴とした射出成形装置。(2) The injection molding method according to claim 1, wherein the vibration is ultrasonic vibration. (3) In an apparatus that performs injection molding by supplying molding material from a molding machine to a cavity via a sprue of a mold, the mold is formed by a fixed side mold and a movable side mold, and these fixed side molds are An injection molding apparatus characterized in that a part of a mold and a movable mold is provided with a part that resonates due to vibration, and this part is held by a fixing jig to a fixed mold and a movable mold, respectively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP813590A JPH03213317A (en) | 1990-01-19 | 1990-01-19 | Injection molding method and its device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP813590A JPH03213317A (en) | 1990-01-19 | 1990-01-19 | Injection molding method and its device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03213317A true JPH03213317A (en) | 1991-09-18 |
Family
ID=11684850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP813590A Pending JPH03213317A (en) | 1990-01-19 | 1990-01-19 | Injection molding method and its device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03213317A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2306378A (en) * | 1995-10-21 | 1997-05-07 | Univ Warwick | Injection moulding apparatus |
US6464485B1 (en) * | 1999-06-24 | 2002-10-15 | Pioneer Corporation | Ultrasonic injection mold for an optical disk |
JP2008201122A (en) * | 2007-09-19 | 2008-09-04 | Toshin Seiko:Kk | Injection molding method for resin molding, transparent optical element, injection molding machine, and mold for injection molding machine |
JP2012204886A (en) * | 2011-03-23 | 2012-10-22 | Nec Corp | Pressure resistant container of sensor |
-
1990
- 1990-01-19 JP JP813590A patent/JPH03213317A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2306378A (en) * | 1995-10-21 | 1997-05-07 | Univ Warwick | Injection moulding apparatus |
US6464485B1 (en) * | 1999-06-24 | 2002-10-15 | Pioneer Corporation | Ultrasonic injection mold for an optical disk |
JP2008201122A (en) * | 2007-09-19 | 2008-09-04 | Toshin Seiko:Kk | Injection molding method for resin molding, transparent optical element, injection molding machine, and mold for injection molding machine |
JP2012204886A (en) * | 2011-03-23 | 2012-10-22 | Nec Corp | Pressure resistant container of sensor |
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