JPH03110887A - Wiring of remodeled wire - Google Patents

Abstract

PURPOSE:To execute a wiring operation easily, to eliminate a movement completely, to execute a remodeling operation easily and to increase a bonding area of a connecting pad by a method wherein a wire is laid between input/ output terminals which are bonded to a connecting pad which must be remodeled. CONSTITUTION:A connecting pattern 11-3 which has been continued to connecting pads 11-1b whose circuit on a substrate 11 must be remodeled is cut; a wire 3 is connected between input/output terminals 2-2a of a pin grid array type semiconductor device LSi 2 bonded to the connecting pads 11-1b by using other input/output terminals 2-2b as guides; the LSi 2 is mounted on the substrate 11; thereby, the wire 3 for remodeling use is wired between the connecting pads 11-1b whose circuit must be remodeled. As a result, the wire 3 can be laid easily, its movement is eliminated and a remodeling operation can be executed easily. Since only the connecting pattern 11-3 to a Via 11-2 is formed at respective connecting pads 11-1 arranged at a fine pitch on a main face of the substrate 11, a bonding area of the individual connecting pads 11-1 can be made large and the LSi 2 can be mounted easily.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a wiring method for modification wires that are wired for modifying the patterns of various printed circuit boards on which pin-grit array type semiconductor devices are mounted, which facilitates the wiring of modification wires. With the aim of providing a new modified wire wiring method that eliminates the movement of wires and increases the bonding area of connection pads, we mainly use connection pads that connect to input/output terminals of semiconductor devices. Vi arranged on the surface and electrically connected to the internal conductor
a printed circuit board on which a connection pattern is formed between a and each of the connection pads, the connection pattern connected to each connection pad that requires circuit modification of the board is cut, and the semiconductor device is bonded to the connection pad. A wire for modification is stretched between the input and output terminals using other input and output terminals as a guide, and the wire and the input and output terminal are connected by a bonding means to connect the group of connection pads on the board and the semiconductor device. and the input/output terminal.

[Industrial application field]

The present invention relates to a method for wiring wires for pattern modification of various printed circuit boards on which pin-grit array type semiconductor devices are mounted.

Recently, pin-grit array type semiconductor devices (hereinafter abbreviated as LSi) have been especially mounted on printed boards of various computers, etc.
are becoming more and more highly integrated and the number of input/output terminals is increasing.
A printed circuit board (hereinafter abbreviated as the board) has connection pads that are densely arranged to connect with the input/output terminals. However, when modifying the pattern to change the pattern formed on the board or dealing with broken vias, etc., the modification wires with a small diameter are wired between adjacent connection pads arranged at a micro pitch, so the wires are not connected to the LSi input. Wires that are moved onto the connection pads that connect to the output terminals and are wired when mounting the electronic component become an obstacle and require skill and a lot of time to perform the mounting work. There is a need for a new modified wire wiring method that eliminates all wire movement.

[Prior Art] A method of wiring a modified wire that has been used in the past is shown in the step-by-step plan view of FIG.

(a) is a fine material coated with polyurethane resin.

For example, a wire 3 with a diameter of 80 μm is cut to the length of the wiring route, the coating on the edge of the image is peeled off, and the wire 3 is
When the i-mounting board is shaped into the wiring route shape (0:1), the above LSi is placed on the electronic component mounting surface as shown in Figure 5.
The connection pads 1-1 to be connected to the input/output terminals of are arranged at a minute pitch, for example, 0.45 mm,
1 and V i a 1-2, which are electrically connected to the internal conductor, are connected by a connection pattern 1-4 via a modification pad 1-3, and a circuit is constructed as shown in FIG. 4(b). (C) shows the state in which the connection pattern 1-4 of each connection pad 1-1b, which requires modification, is cut between the modification pad 1-3 and Vial-2. It is pinched with tweezers (not shown), and one edge of it is placed on the substrate 1.
One modification pad I with connection pattern 1-4 cut off.
-3, and by pressing and heating with a chip of a wire bonding device (not shown), the solder film formed on the surface of the modification pad 1-3 is reflowed and connected, and the other end is connected in the same way. A state in which wires 3 are wired between adjacent connection pads 1-1 arranged at minute pitches on the main surface of the board 1 by sandwiching them with tweezers and soldering them to the other modification pad 1-3, (d ) is solder formed on the surface of the connection pad 1-1 by placing the input/output terminal 2-2 of the LSi2 in contact with the connection pad 1-1 of the board 1 and inserting it into a reflow tank (not shown). By reflowing the film, the modification wire 3 is wired to the main surface of the substrate 1 on which the LSi 2 is mounted in the order shown in the state in which the LSi 2 is mounted on the component mounting surface of the substrate 1.

[Problem to be solved by the invention]

The problem with the conventional modified wire wiring method described above is that the fine-diameter wire formed on the wiring route is held between tweezers and both ends are soldered to the modified pads. Since the wires are wired between adjacent connection pads arranged on the main surface of the board at a minute pitch, the homing of the wires needs to be formed into an accurate shape with respect to the wiring route, and the wiring is difficult to perform when mounting the LSi. As a result of the movement of the wires, they become caught between the connection patterns of the input/output terminals and the board, resulting in short circuits, resulting in the problem that wiring the modification wires requires skill and a lot of time.

In addition, since it is necessary to provide connection patterns with modification pads and vias for each connection pad arranged at a minute pitch on the main surface of the board, the bonding area of the connection pad becomes small, making it difficult to mount the LSi. The problem has arisen that it is difficult to

In view of the above-mentioned problems, the present invention is a new modification that facilitates wiring of modified wires, eliminates movement of the wires, and increases the bonding area of connection pads. The purpose is to provide a method for wiring wires.

Means for Solving Problem C] As shown in FIG. 3, the present invention provides a group of connection pads 11-1 to be connected to input/output terminals of an LSi on the main surface, and conducts V i to an internal conductor. a 11-2 and each corresponding connection band 1
A substrate 11 on which a connection pattern 11-3 is formed between 1-1.
As shown in FIG.
A wire 3 for modification is stretched between the input/output terminals 2-2b of the LSi2 to be joined to the input/output terminal 2-2b using the other input/output terminal 2-2a as a guide, and the wire 3 and the input/output terminal 2-2 are connected by the joining means 15. 2b to connect the connection pad 11 of the board 11.
-1 group and the input/output terminals 2-2a, 2-2b of the LSi2
to join.

[For production]

In the present invention, the connection band 1 requires circuit modification of the board 11.
The LSi connected to the connection pad 11-1b is cut off and connected to the connection pad 11-1b.
By connecting the wire 3 between the input/output terminals 2-2b of the second input/output terminal 2-2b using the other input/output terminal 2-2a as a guide, and mounting the LSi2 on the board II, the connection pads 1i-tb which require circuit modification are connected. Since the wires 3 for modification are wired, the wiring of the wires 3 is facilitated, and there is no movement of the wires, which facilitates the modification work.

In addition, in order to form only the connection pattern 11-3 with the Vial 14 on each connection pad 11-1 arranged at a minute pitch on the main surface of the substrate 11, the bonding area of each connection pad 11-1 is LSi2 can be made larger
This makes it possible to easily implement the .

[Example] The present invention will be described in detail below with reference to FIGS. 1 to 3.

FIG. 1 is a perspective view showing a modified wire wiring method according to one embodiment of the present invention, FIG. 2 is a perspective view showing another embodiment, and FIG.
The figure shows a partial plan view of the connection pad of the printed circuit board according to this embodiment, and the same members as in FIG.
i mounting board.

14 is a robot hand that stretches the modification wire on the wiring route, and 15 is a bonding head that joins the stretched wire to the input/output pad of the LSi.

As shown in FIG. 3, the substrate 11 has connection pads 11-1 that are connected to the input/output terminals of the LSi arranged at minute pitches on the electronic component mounting surface, and V i conductors that are electrically connected to the connection pads 111 and the inner layer conductor. A connection pattern 11-3 is formed that conducts between the a and 11-2.

The robot hand 14 has an engagement groove 14 on which the modification wire 3 to be wired is hooked and slid, as shown in FIG. 1(b).
a is provided at the tip, and the engaging groove 14a is parallel to the main surface of the substrate 11 by an actuator (not shown).
Moreover, it is moved in the orthogonal direction and rotated.

As shown in FIG. 1(C), the pounding head 15 has a tip end formed into a cylindrical shape with an inner diameter into which the input/output terminal 2-2b vertically installed on the human output pad 2-1 of the LSi2 can be inserted. , is a pressing member that thermally presses the wire 3 wired to the input/output pad 2-1 of the LSi2 by moving in a direction perpendicular to the LSi2.

The modified wire wiring method using the above-mentioned members is as shown in the process order perspective view of FIG. 11-2
(b) with connection pattern 11-3 connected to
) is the input/output terminal 2 of the LSi2 mounted on the board 11.
-28 is placed on a table (not shown) facing the robot hand 14, and the wire 3 is pulled out from the reel.
The distal end side of the retaining groove 14 of one robot hand 14-1
a, and bring it into contact with the input/output terminal 2-2b that is connected to one connection pad 11-1b, which requires circuit modification of the board 11, and the engagement groove 14a of the other robot hand 141.
By hooking the reel side of the wire 3 to the wire and moving the robot hand 14-1 along the wiring route, the wire is connected to the other input/output terminal 2-2b using the other input/output terminal 2-2a as a wiring guide. 3 is stretched, (C) shows that the tip hole of the bonding head 15 is inserted into the respective human output terminal 2-2b that the wire 3 is in contact with, and the wire 3 is pressed against the input/output pad 21 of the LSi2. (d) shows a state in which the wire 3 for modification is bonded by thermocompression between the input and output terminals 2-2b by heating the input and output terminals 2-2a and 2 of the LSi2 to the connection band 11-1 group of the board 11.
-2b in contact with 'i1. The LSi2 is mounted on the component mounting surface of the board 11 by inserting it into a reflow tank (not shown) and reflowing the solder film formed on the surface of the connection pad 11-1 group. Wire 3 is wired.

In addition, as another example, as shown in FIG.
), the wire 3 wired between the input/output terminals 2-2b of the LSi 2 may be irradiated with a laser beam 25, and the input/output pad 2-1 and the wire 3 may be joined by the heated rays.

As a result, the wire 3 is wired between the input/output terminals 2-2b that are connected to the connection pads 11-1b that require modification using the input/output terminals 2-28 of the LSi2 as a guide, making the wiring easy. In addition, the main surface of the board 11 is provided with connection pads 11-
Since only the connection pattern 11-3 between the connection pad ll-1 and the connection pad ll-1 is formed, the bonding area of the connection pad ll-1 can be increased.

〔Effect of the invention〕

As is clear from the above description, the present invention has an extremely simple configuration, facilitates wiring of modification wires, eliminates movement of the wires, and increases the bonding area of connection pads. There are advantages such as being able to
It is possible to provide a modified wire wiring method that can be expected to be significantly economical and to improve reliability.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a modified wire wiring method according to one embodiment of the present invention, FIG. 2 is a perspective view showing another embodiment, and FIG. 3 is a perspective view showing a connection pad of a printed circuit board according to the present embodiment. FIG. 4 is a perspective view showing a conventional modified wire wiring method; FIG. 5 is a partial plan view showing a conventional connection pad. In the figure, 2 is LS i. 2-1 is an input/output pad, 2-2a, 2-2b is an input/output terminal, 3 is a wire, 11 is a board, 11-1 is a group of connection pads, 1l-1a, 1l-1b are connection pads, 11-2 is V
ia. 11-3 is a connection pattern, 14 is a robot hand, 14a is an engagement groove, 15 is a bonding head, 25 is a laser beam, ++JbJJtJ/lshiΔ4 Nodou (呵＾-length) white 4PJl=tsdshiE wire rope zero block Figure 1 of D Huai Tree ψ Chi 7i 1 μa Birth tm O 11 Scarcity 2r Growth - 1 Diagonal Exit I Death Cl Old Tozo ΣJ Indicates 1 I 31 Figure 2 Figure 4 W use f J + - yo) From 1st to 0
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Claims (1)

[Claims] A connection pad (11-
1) Via (
11-2) and each of the connection pads (11-1) with a connection pattern (11-3) formed thereon.
), and a connection pattern (11-3) connected to each connection pad (11-1b) which requires circuit modification of the board (11).
and the input/output terminal (2-2b) of the semiconductor device (2) to be connected to the connection pad (11-1b).
), using the other input/output terminal (2-2a) as a guide, stretch the wire (3) for modification, and connect the wire (3) and the input/output terminal (2-2b) to the connecting means (15). to connect the group of connection pads (11-1) of the substrate (11) and the input/output terminals (2-2a, 2-2b) of the semiconductor device (2).
) A modified wire wiring method characterized by combining the following.