JP7290814B2 - Adhesive tape peeling device and peeling method - Google Patents

Description

The present invention relates to an adhesive tape peeling apparatus and peeling method for peeling off various adhesive tapes attached to a substrate such as a semiconductor wafer.

Conventionally, in a general semiconductor manufacturing process, first, a protective tape is attached to a circuit forming surface of a semiconductor wafer (hereinafter referred to as a wafer), and then the back surface of the wafer is ground to be thinned. . After that, the wafer attached to the protective tape is mounted on a dicing frame (hereinafter simply referred to as the frame) through the dicing tape, and the protective tape is peeled off with a peeling tape or the like. Subsequently, the wafer is diced into chips.

After the dicing, the chip wafer must be turned upside down at the time of subsequent die bonding due to the pattern formation in the preceding process. Also, in order not to contaminate the pattern during dicing, the patterned surface may be attached to a dicing tape for mounting. In this case also, the chip must be turned upside down during die bonding.

Furthermore, in order to prevent the diced chips from interfering with each other at the time of die bonding, expansion may be performed to expand the gap between chips, and it is necessary to transport the chips to the next process while maintaining the gap between the chips once expanded. The dicing tape needs to be replaced in order to maintain the distance between the chips.

As a method for replacing the dicing tape as described above, the wafer supported by the first support (corresponding to the frame) is expanded by stretching the first UV tape of the first support using an extension ring, A second UV tape, which is a second support, is attached to the wafer with the chip spacing widened by a predetermined amount (for example, Patent Document 1). Then, after releasing the expanded state of the first support, the first UV tape of the first support is peeled off to complete the replacement.

However, the method of Patent Document 1 has a problem that the first UV tape of the first support shrinks when releasing the expanded state of the first support, and the chip falls down. If re-sticking is performed in such a state, there is a problem of defective re-sticking.

Therefore, in order to solve the above problem, after the first support is expanded, the first support and the second support on the outer periphery of the chip are bonded together to seal the outer periphery of the chip. A re-sticking device is disclosed that prevents the chip from falling down by releasing the expansion after the expansion (for example, Patent Document 2).

Japanese Patent No. 3064979 Japanese Patent No. 4643514

In the re-bonding device of Patent Document 2, the first support and the second support are bonded together at the periphery of the chip, and after re-bonding the chip to the second support, the first support is applied. The adhesive sheet of the body is peeled off from the chip.

However, it is difficult to peel off the bonded portion of the first support and the second support, and there is a problem that the necessary adhesive sheet of the second support is damaged. Moreover, there is also a problem that the chip near the bonded portion is displaced due to the impact at the time of peeling.

Especially when the amount of expansion is small, the method of Patent Document 1 and Patent Document 2 reduces the distance between the first support and the second support, resulting in adhesion between the first support and the second support. There is a problem that it becomes more difficult to separate the second support from the first support as the area increases.

Further, in Patent Document 2, when the expansion ratio between chips is reduced by expansion, the distance between the first support and the second support becomes narrower, so when the first support is subsequently peeled off, However, there is a problem that it becomes difficult to insert the spatula between the first support and the second support, and there is a problem that the first support cannot be peeled off accurately.

Therefore, in the present invention, the adhesive tape of the first support that becomes unnecessary when the chip attached to the adhesive tape of the first support is replaced with the adhesive tape of the second support is replaced with the second adhesive tape. To provide a peeling device and a peeling method for peeling an adhesive tape which does not damage a chip and does not cause the chip to fall even when the chip sticks to the adhesive tape of a support.

Therefore, according to the first aspect of the present invention, a second adhesive tape is attached onto a substrate supported by a first support via a first adhesive tape, and after the substrate is replaced with the second support, the An adhesive tape peeling device for applying a peeling tape to a first adhesive tape on a substrate supported by a second support and peeling the first adhesive tape together with the peeling tape,
a notch forming means for forming an acute-angled notch at the starting end of peeling of the first adhesive tape outside the substrate supported by the first support;
cutting means for circumferentially cutting through the first adhesive tape to connect the ends of the notch;
and a pressing means for pressing the peeling starting end of the peeling tape ,
The notch forming means forms at least one acute-angled notch at the beginning of peeling of the first adhesive tape, and the first adhesive tape is hollowed out by the cutting means. affixing the second adhesive tape together to form a second support;
After the peeling tape is attached to the first adhesive tape on the substrate, the first adhesive tape is integrated with the peeling tape by pressing the peeling tape positioned above the notch with the pressing means. The adhesive tape peeling device is characterized in that the adhesive tape is peeled by

Further, according to the second aspect of the present invention, after a second adhesive tape is adhered onto a substrate supported by a first support via a first adhesive tape to replace the substrate with a second support, the A method for peeling an adhesive tape, wherein a peeling tape is attached to a first adhesive tape on a substrate supported by a second support, and the first adhesive tape and the peeling tape are peeled integrally,
forming at least one acute-angled notch on the peeling start side of the first adhesive tape on the outside of the substrate supported by the first support; cutting the first adhesive tape through the substrate; forming a second support by integrally attaching the second adhesive tape to the back surface of the second frame and the second frame;
After the peeling tape is stuck on the first adhesive tape, the peeling tape positioned above the notch is pressed by a pressing means provided on the peeling starting end portion, so that the notch serves as a trigger for the first adhesive tape. is peeled off together with the peeling tape.

According to the present invention, since at least one acute-angled notch is formed on the side of the starting end of peeling of the first adhesive tape to be peeled, the second adhesive tape and the first adhesive tape of the second support are in contact with each other. Even if the tape is adhered by pressing, it can be peeled off using the sharp notch as a trigger for peeling. In addition, since the acute-angled notch serves as a trigger for peeling, peeling can be performed from a portion with a small adhesion area toward a direction with a large adhesion area, and the peeling can be performed smoothly, so that damage to the substrate and dropout of the chip do not occur.

According to the present invention, since the release tape positioned on the notch is pressed, the adhesion between the release tape and the first adhesive tape can be enhanced, and the occurrence of peeling mistakes can be prevented.

1] is a schematic overall plan view of an adhesive tape replacement device used in the present invention. [FIG. 1 is a view taken along line AA of FIG. 1. FIG. [Fig. 2] is a plan view of a changing part of the adhesive tape changing device used in the present invention; [Fig. 2] is a front view of a changing part of the adhesive tape changing device used in the present invention. 3 is a cross-sectional view taken along line BB in FIG. 4] is a partially cutaway CC direction view of FIG. 4. [FIG. [FIG. 2] is a right side view of a changing part of the adhesive tape changing device used in the present invention; [Fig. 2] is a plan view of a positioning/notch forming section to which the peeling device of the present invention is applied; 8 is a cross-sectional view taken along line DD of FIG. (a) and (b) are explanatory diagrams of an adhesive tape replacement operation according to the first embodiment. (c) and (d) are explanatory diagrams of the adhesive tape replacement operation according to the first embodiment. (e) and (f) are explanatory diagrams of the adhesive tape replacement operation according to the first embodiment. (a) and (b) are explanatory diagrams of an adhesive tape replacement operation according to the second embodiment. (c) and (d) are explanatory diagrams of the adhesive tape replacement operation according to the second embodiment. (e) and (f) are explanatory diagrams of the adhesive tape replacement operation according to the second embodiment. (a) and (b) are explanatory diagrams of an adhesive tape replacement operation according to the third embodiment. [Fig. 2] is an explanatory diagram of notch formation in a positioning/notch forming part; [Fig. 10] is an explanatory view of the first adhesive tape cutting operation in the adhesive tape replacement portion after notch formation; [FIG. 2] is an explanatory view of the peeling operation of the first adhesive tape; (a) and (b) are the principal part enlarged explanatory drawing of peeling operation|movement of a 1st adhesive tape. [FIG. 2] is a partially omitted plan view of a separation trigger forming portion; [FIG. 2] is a schematic operation explanatory diagram of a separation trigger forming unit; (a) and (b) are explanatory diagrams of a substrate mounted on a frame and having an expansion ratio of 0%. (a) and (b) are explanatory diagrams of a substrate with an extended gap between chips mounted on a frame.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to FIGS. 1 to 9. FIG.

FIG. 1 is a schematic overall plan view of an adhesive tape replacement device 1 to which the peeling device of the present invention is applied. The adhesive tape replacement device 1 is formed on a substantially rectangular base 2 . The adhesive tape replacement apparatus 1 also includes a first support supply section a in which the first supports S1 before the adhesive tapes are replaced are stored in multiple stages, the first supports S1 are positioned, and the first adhesive tapes T1 are provided. a positioning/notch-forming portion b that forms an acute-angled notch (hereinafter referred to as a notch N) in the center of the substrate W; A frame supply section d in which the second frames F2 forming the second support body S2 after re-pasting are stored in multiple stages, a frame transfer section e for conveying the second frames to the re-pasting section d, and a frame transfer section e for transferring the second frames F2. , a frame recovering part f for recovering the first frame F1 that is no longer needed, an adhesive tape removing part g for removing the first adhesive tape T1 that is no longer needed from the second support body S2 after replacement, and the adhesive tape. It is configured to include a second support storing portion h and the like for storing, in multiple stages, the second support S2 after the first adhesive tape T1 has been peeled off at the peeling portion g.

The first support S1 is formed by attaching a substrate W chipped by dicing to a first frame F1 via a first adhesive tape T1. In addition, the first frame F1 is provided with a notch portion 3 that serves as a reference for positioning. The first support supply unit a is provided with a supply cassette 49 in which the first supports S1 are stored in multiple stages. The first supports S1 are sequentially supplied one by one.

The first support S1 supplied from the first support supply section a is transported to the positioning/notch forming section b by an appropriate transport mechanism (not shown). The peeling device of the present invention is mainly composed of the positioning/notch forming portion b and the adhesive tape peeling portion g.

A holding table 47 for placing and fixing the substrate W on the first support S1 supplied as shown in FIGS. 8 and 9, a sensor 48 for positioning the first support S1, and the first support. It comprises a notch forming unit 80 and the like for forming a notch N (see FIG. 17) that triggers peeling in the first adhesive tape T1 of S1.

As shown in FIGS. 8 and 9, the holding table 47 is formed in a substantially circular shape and is connected to a motor 12 erected on the machine base 2 so as to be rotatable. Further, the holding table 47 is provided with fixing means 47a for fixing the frame F by pinching or the like on the upper surface thereof. Further, the holding table 47 is provided with an opening 47b, and below the opening 47b is provided a backup 81 for supporting the first adhesive tape T1 from the back surface when the notch N is formed.

A sensor 48 is provided near the holding table 47 . The sensor 48 is, for example, an optical sensor, and detects the notch 3 of the first support S1 placed on the holding table 47. As shown in FIG. Note that means such as various sensors and physical pins can be used as long as the first support S1 can be positioned at a predetermined position. When the first support S1 is placed on the holding table 47, the holding table 47 rotates integrally with the first support S1 after the first support S1 is fixed by the fixing means 47a. When the notch 3 of the frame F1 is detected by the sensor 48, the holding table 47 stops at a predetermined position to position the first support S1.

8 is a plan view of the positioning/notch forming portion b, and FIG. 9 is a cross-sectional view taken along line DD of FIG. The positioning/notch forming portion b includes the above-described holding table 47, a backup 81 provided below the holding table 47 facing the opening 10b formed in the holding table 47, and a notch provided above the holding table 47. It is composed of the forming unit 80 and the like (the positioning mechanism is as described above, and the description thereof is omitted).

The backup 81 is positioned below the first adhesive tape T1 positioned on the outer peripheral portion of the substrate W of the first support S1. Further, the backup 81 is connected to a cylinder shaft of a cylinder 83 erected on the machine base 2. Extension of the cylinder shaft raises the backup 81 to move the first cylinder through the opening 47b. It contacts the back surface of the adhesive tape T1. The backup 81 supports the back surface of the first adhesive tape T1 when a notch cutter 84, which will be described later, forms a notch N in the first adhesive tape T1. In addition, the backup 81 may be changed in position according to the outer diameter of the substrate W, or a plurality of backups 81 may be provided and selectively used.

The notch forming unit 80 includes the notch cutter 84, an elevating cylinder 85 for elevating the notch cutter 84, a motor 86 for horizontally moving the notch cutter 84, and the like.

The notch forming unit 80 includes a post 87a erected on the machine base 2 on the side of the holding table 47, a support plate 87b suspended above the holding table 47 on the post 87a, It is supported by a support frame 87c suspended on the support plate 87b along the outer peripheral direction from the center of the first support S1.

A ball screw 88 is pivotally supported along the support frame 87c, and a motor 86 is connected to one end of the ball screw 88 via the support frame 87c. A nut member 89 is screwed onto the ball screw 88 , and a support frame 90 for supporting the notch cutter 84 is fixed to the nut member 89 . Also, the lifting cylinder 85 is erected on the support frame 90 . Therefore, by driving the motor 86, the notch cutter 84 is moved on the first adhesive tape T1 between the substrate W and the frame F2. Further, by operating the elevating cylinder 85 , the notch cutter 84 is raised and lowered at a position facing the backup 81 .

The notch cutter 84 has a V-shaped cutting edge, and forms a V-shaped notch N at the peeling starting end of the first adhesive tape T1 by the vertical movement. The notch N is, for example, a V-shaped notch, but the shape is not limited as long as the shape widens from the narrower side to the wider side in the peeling direction from the tip.
As shown in FIG. 17, the notch N is formed by rotating the holding table 47 by a predetermined amount each time the notch N is formed to form a plurality of continuous notches N along the circumferential direction at the starting edge of peeling. It's like The number of notches N to be formed and the size of the notches N can be appropriately selected according to the adhesive strength of the first adhesive tape T1 to be peeled and the rigidity of the tape.

Further, on the machine base 2, there is provided a frame supply section d for supplying a second frame F2 for replacement to a replacement section c, which will be described later. The frame supply unit d has supply cassettes 49 capable of storing the frames F in a multistage manner. It has become. Further, in the present embodiment, the supply cassette 49 accommodates the second frames F2 in multiple stages.

Adequate transfer hands (not shown) are provided in the vicinity of the frame supply section d to suck and hold the second frame F2 and transfer it to the frame transfer section e. The frame conveying section e includes a conveying table 40 provided between the machine frames 5, 5 erected at intervals along the replacement section c. Rails 5a, 5a are laid on the inner upper side of both machine frames 5, 5, respectively, from the frame supply portion d to the replacement portion c.

The conveying table 40 is adapted to fix the frame F to be placed thereon by fixing means (not shown) such as suction, and corresponds to the support table of the present invention. Further, the carrying table 40 is formed with an opening 40a (see FIG. 3) having substantially the same diameter as the inner diameter of the frame F, and the frame F is placed so as to surround the opening 40a.

Further, the transfer table 40 is provided with sliders 41, 41 on both sides, and is movably fitted to the rails 5a, 5a. The conveying table 40 is horizontally movable along the rails 5a, 5a from the side of the frame supply section d to above the replacement section c by an appropriate driving source (not shown). Accordingly, the second frame F2 taken out from the frame supply section d is placed on the conveying table 40 and conveyed onto the replacement section c.

Next, the re-bonding portion c where the substrate W is re-bonded from the positioned first support S1 to the second support S2 will be described below with reference to FIGS. 2 to 7. FIG. The thickness of the substrate W, the frame F, the first adhesive tape T1 and the second adhesive tape T2 is exaggerated in all drawings for easy understanding.

2 is a view in the direction of arrows AA in FIG. 1, FIG. 3 is a plan view of the replacement portion c, FIG. 4 is a front view of the replacement portion c, and FIG. 5 is a view in the direction of arrows BB in FIG. FIG. 6 is a partially cutaway CC direction view of FIG. 4, and FIG. 7 is a right side view of the reattaching portion.

A re-sticking unit 4 is vertically erected in the re-sticking portion c. The replacement unit 4 includes a suction table 12 that sucks and holds the substrate W on the first support S1 via a first adhesive tape T1, and a frame base 13 that supports the first frame F1 on the outer periphery of the suction table 12. , a cutter unit 14 which is provided below the suction table 12 and which can be vertically and rotatably moved, a frame retainer 15 which sandwiches the first frame F1 of the first support S1 placed on the frame base 13, and It is configured with an adhesive tape applying unit 50 and the like for supplying the second adhesive tape T2 for replacement.

A support plate 6 is erected on the machine base 2 of the replacement portion c, and a rail 6a is laid on the support plate 6 . The replacement unit 4 is entirely supported by a support frame 7 at the bottom. The support frame 7 is fixed with a support base 8 provided vertically along the support plate 6 . A support plate 16 is erected on the support frame 7 , and a lower plate 10 is horizontally provided on the upper end of the support plate 16 . A slider 8a is provided on the rear surface of the support base 8, and the slider 8a is movably fitted to the rail 6a. Therefore, the support table 8 is lifted and lowered by an appropriate driving source (not shown), so that the replacement unit 4 can be lifted and lowered integrally. Further, in the vicinity of the center of the replacement unit 4, an upper plate 9 is horizontally provided with a gap from the lower plate 10. 7).

The suction table 12 is fixed to the upper end of a pillar 17 erected at the center of the lower plate 10 . The suction table 12 is formed of a porous body 12a that serves as a suction portion, an outer frame 12b that holds the porous body 12a, and the like. The porous body 12a holds the chipped substrate W via the first adhesive tape T1 during expansion, which will be described later, and prevents the chip from slipping. It should be noted that the suction table 12 may be a suction hole type table other than a porous table as long as the chip displacement of the substrate W does not occur. In doing so, a porous body can be preferably used. As for the pore diameter and porosity, suitable ones can be used according to the size and shape of the chip. Further, the adsorption table 12 has an appropriate heater (not shown) built therein so that the first adhesive tape T1 can be heated and softened during expansion.

The frame base 13 is formed in a rectangular shape and has a circular opening 13a having substantially the same diameter as the inner diameter of the frame F in the center. Further, the frame base 13 is provided so as to surround the suction table 12 . The frame base 13 is fixed to the upper end of an elastic body 18 such as a spring erected on the lower plate 10, and the elastic body 18 biases the frame base 13 upward. Therefore, by pressing the frame base 13 from above, the frame base 13 is lowered against the elastic body 18 . The lowering amount of the frame table 13 is determined according to a preset expansion ratio between the chips Wa.

The cutter unit 14 includes a cutter blade 19 for cutting the first adhesive tape T1, a motor 21 for rotating the cutter blade 19, an elevating means 25 for elevating the cutter blade 19, and the like.

The cutter blade 19 is exchangeably held in a cutter holder 20 . The cutter holder 20 can be fixed at an appropriate position by changing the radius of rotation using a slider 20a and a rail 20b. The cutter holder 20 is erected on a donut-shaped rotating disk 22 . A gear 22a is provided on the outer periphery of the rotating disk 22. As shown in FIG. Although the details will be described later, the cutter blade 19 cuts the first adhesive tape T1 along the outer periphery of the substrate W. As shown in FIG.

The elevating means 25 includes an elevating board 26, a guide 27 that supports the elevating board 26 so that it can be lifted and lowered with respect to the lower plate 10, a motor 28 that drives the elevating board 26 up and down, and a driving force of the motor 28. A ball screw 29 or the like for transmitting is provided.

The lifting board 26 is provided below the suction table 12 and has a through hole at its center. In addition, the lifting board 26 has the support 17 of the suction table 12 inserted through the through hole, and is movable up and down with respect to the support 17 . The elevator board 26 is connected to the upper end of a guide shaft of a guide 27 penetrating through the lower plate 10 , and the lower end of the guide shaft is connected to the support plate 30 .

The ball screw 29 has an upper end supported by the lower plate 10 and a lower end supported by the support frame 7 . A driven pulley 31 is provided below the support frame 7 at the lower end of the ball screw 29 . The motor 28 is provided with a drive pulley 32 via the support frame 7 , and an endless belt 33 is stretched between the drive pulley 32 and the driven pulley 31 . Therefore, by driving the motor 28, the ball screw 29 is rotationally driven.

The support plate 30 is provided with a nut member 34 , and the nut member 34 is screwed onto the ball screw 29 . Therefore, when the motor 28 is rotationally driven, the elevator board 26 is moved up and down.

The rotating plate 22 is pivotally supported on the lifting plate 26 via a bearing 26a. A gear 22a is formed on the outer periphery of the rotating disk 22. As shown in FIG. A motor frame 26b is fixed below the elevator board 26, and the motor 21 is provided through the motor frame 26b. A gear 35 is connected upward to the motor 21 , and the gear 35 is engaged with a gear 22 a provided on the outer periphery of the rotating disk 22 . Therefore, the cutter unit 14 can be swiveled by the rotational drive of the motor 21 and vertically moved by the rotational drive of the motor 28 .

The frame retainer 15 is provided horizontally between the frame base 13 and the carrier table 40 . The frame retainer 15 is formed in a rectangular shape, and has an opening 15a that is approximately the same as the inner diameter of the frame F. As shown in FIG. Four corners of the frame retainer 15 are respectively supported by upper ends of guide shafts 36a. The guide shaft 36 a is supported so as to be vertically movable via a guide 36 provided on the upper plate 9 , and the lower end of the guide shaft 36 a is connected to a lifting plate 37 . Two elevator plates 37 are provided symmetrically, and a nut member 37a is fixed to each lower surface. Between the lower plate 10 and the upper plate 9, two ball screws 38, 38 are installed symmetrically with the suction table 12 as the center. supported. Both nut members 37a, 37a are screwed onto ball screws 38, 38, respectively.

One of the ball screws 38 is rotatable by connecting a motor 39 to its lower end through the lower plate 10 . Further, the motor 39 is provided with a driving pulley 42 and its rotation is transmitted to a driven pulley 44 via an endless belt 43 . Further, the driven pulley 44 is connected to the lower end of the other ball screw 38 so that both the ball screws 38 rotate synchronously. Therefore, by rotating the motor 39, the elevating plate 37 is lifted and lowered, and the frame presser 15 is lifted and lowered in a horizontal state via the guide shaft 36a.

The frame presser 15 lowers while holding the first frame F1 of the first support S1 placed on the frame table 13 between itself and the frame table 13 when lowered. When the frame base 13 is lowered, the substrate W portion of the first support S1 is held by suction on the fixed suction table 12 via the first adhesive tape T1. , the first adhesive tape T1 is pulled and expanded.

The lowering amount of the frame presser 15 can be controlled, and by controlling the stretching amount of the first adhesive tape T1 on the first support S1, the expansion ratio of the chip of the substrate W on the first support S1 can be adjusted. can be set arbitrarily. This expansion ratio is not particularly limited, but can be preferably set in the range of 0 to 30%, for example.

Next, the adhesive tape applying unit 50 that supplies the second adhesive tape T2 to be replaced and applies it to the substrate W and the second frame F2 will be described below.

The adhesive tape applying unit 50 is positioned on the replacement portion c, and separates and winds up a supply roll 51 that supplies the second adhesive tape T2 and a separator 52 temporarily attached to the second adhesive tape T2. a collection roll 53; a winding roll 54 for winding an unnecessary portion of the second adhesive tape T2; a bonding roller 55 for pressing and bonding the second adhesive tape T2 to the second frame F2 and the substrate W; It comprises a tensioning unit 56 for applying a predetermined tension to the second adhesive tape T2, a cutter unit 57 for cutting the second adhesive tape T2 into the shape of the second frame F2, and the like.

The supply roll 51 is wound with a second adhesive tape T2 for holding the substrate W via the second frame F2. The second adhesive tape T2 may be the same as the first adhesive tape T1 described above. The second adhesive tape T2 has an adhesive layer formed on one surface and a separator 52 temporarily attached to the surface of the adhesive layer. It is also possible to use a type of adhesive tape in which the separator 52 is not formed.

The second adhesive tape T2 supplied from the supply roll 51 passes through a plurality of guide rollers 58, the separator 52 is peeled off by the pinch roller 59, and the adhesive layer is the bottom surface. After that, the second adhesive tape T2 passes through a tension unit 56 and is wound up on a take-up roll 54 through a guide roller 60 and a pinch roller 61. As shown in FIG. After being separated from the second adhesive tape T2 by a pinch roller 59, the separator 52 is wound around a recovery roll 53. As shown in FIG.

The sticking roller 55 is provided on the second adhesive tape T2 and pivotally supported by a support frame 46 supported by the machine frame 5 . Further, the support frame 46 is provided with a cylinder 63 for moving the sticking roller 55 up and down. The affixing roller 55 is horizontally moved on the second adhesive tape T2 by a driving source (not shown), presses and rolls on the second adhesive tape T2, and adheres the second adhesive tape to the second frame F2 and the substrate W. T2 is attached. A cutter unit 57 for circularly cutting out the second adhesive tape T2 is provided above the adhesive tape applying unit 50 along the second frame F2 to which the second adhesive tape T2 is applied. there is

The cutter unit 57 includes an elevating cylinder 65 that raises and lowers the entire unit, a cutter blade 68 that cuts the pasted second adhesive tape T2, and the second adhesive tape T2 cut by the cutter blade 68 to the second frame. It is configured with a pressing roller 69 and the like for pressing against F2.

The elevating cylinder 65 is erected and fixed to the machine frame 5 , and the cylinder shaft of the elevating cylinder 65 is connected to a support frame 64 that supports the entire cutter unit 57 . A motor 66 is provided on the upper surface of the support frame 64, and a cutter holder 67 is rotatably provided on the shaft of the motor 66. As shown in FIG. A circular cutter blade 68 is provided at one end of the cutter holder 67, and a pressing roller 69 is pivotally supported at the other end.

By operating the elevating cylinder 65, the cutter unit 57 is lifted so that the cutter blade 68 and the pressing roller 69 come into contact with the second adhesive tape T2 adhered to the second frame F2. By rotating the motor 66 in this state, the second adhesive tape T2 is cut into a circular shape and the inside of the cut edge is pressed and attached to the second frame F2 by the pressing roller 69. .

The tension unit 56 is composed of a plurality of guide rollers 62, and while holding the second adhesive tape T2 at an angle, moves horizontally in front of the bonding roller 56 to apply appropriate tension to the second adhesive tape T2 during bonding. It is designed to be granted. Further, the tension unit 56 peels off the unnecessary second adhesive tape T2 cut out by the cutter unit 57 from the conveying table 40 when retreating after pasting the second adhesive tape T2.

The replacement portion c is configured as described above. Next, the frame recovery portion f, the adhesive tape peeling portion g, and the second support storage portion h will be described below.

The frame collecting section f collects the first frames F1 that are no longer needed after the first adhesive tape T1 of the first support S1 is cut at the replacement section c, and stores them in the storage cassette 45. . The storage cassette 45 is lifted and lowered by an appropriate lifting mechanism (not shown) to store the first frames F1 in multiple stages. Further, the first frame F1 is taken out from the frame base 13 by an appropriate transport mechanism (not shown) and stored in the storage cassette 45. As shown in FIG.

As shown in FIGS. 1 and 19, the adhesive tape peeling section g is located on the opposite side of the frame supply section d via the machine frames 5 and 5, and the replacement is completed at the replacement section c. It is adapted to receive a second support S2. The adhesive tape peeling portion g peels off the unnecessary first adhesive tape T1 before replacement from the second support S2.

The adhesive tape peeling section g includes a horizontally movable peeling table 71, a peeling unit 72 provided on the peeling table 71, and the like.

The peeling table 71 holds the second support S2 on its upper surface by an appropriate fixing mechanism (not shown). Masks M and M are provided on the front and rear sides of the stripping table 71 along the stripping tape RT, and both masks M and M are pivotally supported by support frames 71a erected on the stripping table 71, respectively. In addition, the surface of the mask M is subjected to an adhesive treatment such as fluorine processing, and the tip of the mask M is formed in an arc shape along the outer circumference of the substrate W, and the tip is inclined toward the substrate W. ing.

When the second support S2 is placed and fixed, the mask M rotates from the retracted position to sandwich the second frame F2 of the second support S2 and press the second adhesive tape T2 at its tip. It is designed to be covered with Therefore, when the peeling tape RT is stuck on the first adhesive tape T1, the peeling tape RT does not stick to the second adhesive tape T2.

The second support S2, which has been reattached at the reattaching portion c, is conveyed to the vicinity of the adhesive tape peeling portion g while being held on the conveying table 40. FIG. The conveyed second support S2 is taken out from the opening of the machine frame 5 by an appropriate suction hand (not shown), turned upside down, and placed and fixed on the peeling table 71. . As a result of the reversal, the substrate W to which the first adhesive tape T1 is attached becomes the upper surface.

A rail 70 is laid between the machine frame 5 on the machine base 2 and the housing h of the second support S2. The peeling table 71 is provided on the rail 70 , and the slider 73 provided on the lower surface of the peeling table 71 is movably fitted to the rail 70 . The stripping table 71 is horizontally movable along the rails 70 by an appropriate drive source (not shown).

Further, the stripping unit 72 is erected on the side of the rail 70 near the center thereof so as to be vertically movable on the machine base 2 by an appropriate driving mechanism. The peeling unit 72 includes a machine frame 74 erected on the machine base 2, a supply roll 75 of the peeling tape RT pivotally supported by the machine frame 74, and the peeling tape RT pasted on the first adhesive tape T1. It is configured to include a sticking roller 77 and the like for sticking.

The peeling tape RT is unwound from a supply roll 75 , guided by a guide roller 76 , and then taken up by a collection roll 78 via a sticking roller 77 . When the second support S2 is conveyed by the peeling table 71 below the peeling unit 72, the peeling unit 72 descends. Then, the peeling tape RT is pressed against the peeling starting end portion of the first adhesive tape T1 by the sticking roller 77 . Subsequently, the peeling table 71 moves forward (to the left in the figure), so that the peeling tape RT is attached to the first adhesive tape T1.

When the peeling tape RT is adhered to the first adhesive tape T1, the peeling table 71 moves backward (to the right in the drawing) while the peeling tape RT is being supplied as shown in FIG. , the first adhesive tape T1 is peeled off together with the peeling tape RT and wound around a recovery roll 78. As shown in FIG. A folding roller 82 is provided in front of the sticking roller 77 so as to fold back the first adhesive tape T1 integrated with the peeling tape RT at an acute angle. Therefore, since no lifting force acts on the substrate W, the first adhesive tape T1 can be peeled off without applying a load to the substrate W.

The reattached second support S2 from which the unnecessary first adhesive tape T1 has been peeled off is transported to the second support housing h by an appropriate transport mechanism (not shown). The second support housing portion h is provided with storage cassettes 79 for storing a plurality of second supports S2 in multiple stages. The second support S2 is accommodated.

The above is the configuration of the adhesive tape changing device 1 to which the peeling device of the present invention is applied. Next, the operation of the adhesive tape changing device 1 will be described with reference to FIGS. 10 to 17. FIG. 10 to 13 show the re-sticking operation when the interval between the chips Wa is a relatively large expansion ratio (for example, 5% or more). In this case, it is not necessary to form the notch N in the first adhesive tape T1 with the peeling device of the present invention. Formation of the notches N in the first adhesive tape T1 can be preferably performed in the non-expanded state described below or when the expansion ratio (for example, less than 5%) is relatively low.

As shown in FIG. 10A, in the initial state, the suction table 12 and the frame base 13 are positioned horizontally as indicated by the two-dot chain line. In this state, the first support body S1 positioned on the frame table 13 is mounted and fixed, and the substrate W is sucked and held via the first adhesive tape T1. At this time, if necessary, the suction table 12 may be heated to soften the first adhesive tape T1. Subsequently, the frame presser 15 descends as indicated by the solid line in the drawing to hold the first frame F1 between itself and the frame table 13 . Further, by lowering the frame presser 15 by a predetermined amount, the first adhesive tape T1 is pulled at a predetermined expansion ratio and expanded to a predetermined chip spacing. It is preferable to chamfer the outer peripheral portion of the upper surface of the suction table 12 so as not to damage the first adhesive tape T1 during expansion.

As shown in FIG. 10(b), with the first support S1 expanded, the entire replacement unit 4 is lifted by driving the motor 28 (see FIG. 7). The surface of the chip Wa of the first support S1 is aligned with the surface of the second adhesive tape T2 of the second frame F2 on the carrier table 40. FIG. Also, the sticking roller 55 and tension unit 56 of the adhesive tape sticking unit 50 face the sticking start end side of the second frame F2.

Next, as shown in FIG. 11(c), the tensioning unit 56 advances (to the right in the drawing) while applying a predetermined tension to the second adhesive tape T2 by means of a plurality of guide rollers 62, while the sticking roller 55 is moved. By pressing and rolling the second adhesive tape T2, the second adhesive tape T2 is attached onto the second frame F2 and the chip Wa.

Next, as shown in FIG. 11(d), the cutter unit 14 is raised by driving the motor 28, and the cutter blade 19 pierces the inclined portion of the expanded first adhesive tape T1. After that, by driving the motor 21, the cutter unit 14 is rotated to cut the first adhesive tape T1 into a circular shape. Subsequently, the cutter unit 14 descends and retreats. As described above, since the slanted portion of the first adhesive tape T1 is cut during expansion, the outer periphery of the first adhesive tape T1 hangs downward and does not stick to the second adhesive tape T2 after re-sticking.

Further, by sucking the chip Wa onto the suction table 12 through the first adhesive tape T1, the first adhesive tape T1 is cut while maintaining the expanded state. As a result, the replacement is completed in a state where the stress remaining in the first adhesive tape T1 is released. Therefore, the tip Wa after replacement due to shrinkage of the first adhesive tape T1 does not fall down.

Next, as shown in FIG. 12(e), the cutter unit 57 for cutting the second adhesive tape T2 is lowered by the action of the elevating cylinder 65. Then, as shown in FIG. Subsequently, the cutter blade 68 is rotated by driving the motor 66, and the second adhesive tape T2 is circularly cut along the shape of the second frame F2. 2 An adhesive tape T2 is attached to the second frame F2 and the chip Wa. Next, the cutter unit 57 is lifted and retreated upward, so that the chip Wa is replaced with the second adhesive tape T2.

Next, as shown in FIG. 12(f), the sticking roller 55 and tension unit 56 are retracted to their initial positions. At this time, the guide roller 62 of the tension unit 56 passes under the second adhesive tape T2 so that the unnecessary second adhesive tape T2 is peeled off from the suction table 12 and the conveying table 40.例文帳に追加After that, the whole re-sticking unit 4 descends, and the re-sticking of the substrate W from the first adhesive tape T1 to the second adhesive tape T2 is completed. Next, the second support S2 that has been reattached is conveyed to the side of the adhesive tape peeling portion g while being held by the conveying table 40 .

The second support S2 transported to the side of the adhesive tape peeling portion g is in a state in which the surface to which the chip Wa is attached faces downward, and the unnecessary first support S2 is placed on the lower surface of the chip Wa. Adhesive tape T1 remains. Therefore, after this, the second support S2 on the conveying table 40 is taken out from the opening of the machine frame 5 by an appropriate conveying mechanism (not shown), and the first adhesive tape T1 side is moved by the rotation of the conveying mechanism. After being turned upside down, it is placed on the peeling table 71 .

As shown in FIG. 19, the second support S2 to which the first adhesive tape T1 is attached is placed and fixed on the peeling table 71 at the two-dot chain line position. Subsequently, the peeling table 71 advances (to the left in the drawing) to the solid line position in the figure, so that the peeling tape RT is attached onto the first adhesive tape T1 on the surface of the second support S2.

The second support S2 to which the peeling tape RT is attached is rolled up while the peeling table 71 moves backward (toward the right in the figure), so that the peeling tape RT is integrated with the first adhesive tape T1. is peeled off. When peeling, the peeling tape RT and the first adhesive tape T1 on the peeling start side are folded back at an acute angle (to the left in the figure) below the folding roller 82 as shown in FIG. Since no upward force acts on the second support S2, the second support S2 is not lifted. Moreover, since no load is applied to the chip Wa, the chip Wa does not come off or is damaged such as chipping.

As the peeling table 71 moves forward, the second support S2 from which the unnecessary first adhesive tape T1 has been peeled off is transported to the front of the second support accommodating portion h. It is stored in the storage cassette 79 of the second support body storage portion h by an appropriate transport mechanism.

The above is an embodiment that can be preferably used when the expansion ratio is 5% or more. When the gap between the first adhesive tape T1 and the second adhesive tape T2 is small and the first adhesive tape T1 and the second adhesive tape T2 contact or may contact each other regardless of the expansion ratio. Alternatively, a notch N may be formed in the positioning/notch forming portion b, and the following re-sticking operation may be performed.

Next, an embodiment that can be preferably used when the expansion ratio is 0 to less than 5% will be described first with reference to FIGS. 1, 8 and 9. FIG. Note that an expansion ratio of 0% is defined as a non-expanded state.

In this embodiment, description of the same parts as in the previous embodiment is partially omitted. In FIG. 1, the first support S1 taken out from the first support supplying section a is placed and fixed on the holding table 47 of the positioning/notch forming section b, which is the same as the previous embodiment. .

The first support S1 having the notch N formed thereon is placed and fixed on the suction table 12 and the frame base 13 of the replacement portion c. Next, the operation of re-bonding the first support S1 conveyed to the re-bonding portion c to the second adhesive tape T2 will be described with reference to FIGS. 13 to 15. FIG.

As shown in FIG. 13A, the first frame F1 of the first support S1 is fixed to the frame table 13, and the substrate W (chip Wa) is held by suction by the suction table 12. As shown in FIG. Then, the cutter blade 19 is raised to cut the first adhesive tape T1 on the first support S1 into a circular shape at the outer peripheral portion of the substrate W as shown in FIG. At this time, the cutting is performed so that the cutting start end and the cut end end of the notch N forming portion are connected.

Next, as shown in FIG. 13(b), the frame presser 15 is driven by the motor 39 to move down, hold the first frame F1 therebetween, and push down the frame table 13 from the suction surface of the suction table 12, thereby removing the first adhesive tape T1. separate the cut edges of the

Next, as shown in FIG. 14(c), the entire replacement unit 4 is raised so that the surface of the substrate W is aligned with the surface of the second adhesive tape T2.

Next, as shown in FIG. 14D, the second adhesive tape T2 is pressed by the attaching roller 55, and the second adhesive tape T2 is attached to the second frame F2 and the substrate W integrally. Note that the attaching method is the same as in the first embodiment.

Next, as shown in FIG. 15(e), the cutter unit 57 descends and rotates to cut the second adhesive tape T2 along the second frame F2 in a circular shape, and press the pressure roller 69 to cut the second adhesive tape T2. The cut edge of T2 is pressed and attached to the second frame F2. After that, the cutter unit 57 is raised and withdrawn. Subsequently, as in the first embodiment, the second support S2 is conveyed by the conveying table 40 and placed and fixed on the peeling table 71 of the adhesive tape peeling section g.

When the second support S2 is placed and fixed on the peeling table 71, the peeling unit 72 operates in the same manner as in the first embodiment to remove the unnecessary first support S2 from the second support S2. A peeling tape RT is attached to the adhesive tape T1. Since the peeling starting end of the first adhesive tape T1 slightly protrudes from the substrate W, the protruding portion may contact and stick to the second adhesive tape T2. Therefore, the adhesive tape peeling portion g is provided with a peel trigger pressing portion 91 in addition to the first embodiment. The separation trigger pressing portion 91 will be described below with reference to FIGS. 19 to 22. FIG.

The peel trigger pressing portion 91 presses and adheres the peel tape RT to the V-shaped notch N formed by the notch forming unit 80 . The separation trigger pressing portion 91 is formed on a support frame 95 supported by the machine frame 74, and includes a pressure roller 92 that presses the separation tape RT, an elevating cylinder 93 that elevates the pressure roller 92, and a substrate W. It comprises an arc-shaped rail 94 provided along the arc on the separation start side, and a cylinder 96 for driving the pressure roller 92 to travel along the arc-shaped rail 94, and the like.

The elevating cylinder 93 is erected on the support frame 95, and an elevating frame 97 is provided at the lower end of the cylinder shaft of the elevating cylinder 93 so as to be able to move up and down. An arc-shaped rail 94 is suspended from the elevating frame 97 so as to extend along the arc of the peeling start edge of the substrate W. As shown in FIG.

The pressing roller 92 is pivotally supported by a swing frame 98 provided on its upper portion. A plurality of guide rollers 99 are provided on the top of the swinging frame 98 , and the guide rollers 99 clamp the arc-shaped rail 94 so that the swinging frame 98 moves along the arc-shaped rail 94 . It moves in an arc integrally with the pressing roller 92 .

As shown in FIG. 21, a cylinder 96 is provided on the far side of the arc-shaped rail 94, and the upper end of the cylinder 96 is rotatably supported by a support plate 97a fixed to the lift frame 97. As shown in FIG. The tip of the cylinder shaft of the cylinder 96 is supported by one end of the swing frame 98, and the swing frame 98 moves in an arc along the arc-shaped rail 94 as the cylinder shaft expands and contracts. It's like Along with the arc motion of the swing frame 98, the pressure roller 92 presses the release tape RT onto the notch N of the first adhesive tape T1 of the second support S2 as shown in FIG. It's like As a result, the peeling tape RT can be brought into close contact with the portion of the notch N, which is the starting point of peeling of the first adhesive tape T1, and a trigger for peeling of the first adhesive tape T1 is formed.

Next, the peeling operation of the first adhesive tape T1 in the second embodiment will be described below. Note that the operation up to the operation of attaching the peeling tape RT to the first adhesive tape T1 on the second support S2 is the same as in the first embodiment, so the description is omitted.

As shown in FIG. 20(a), when the peeling tape RT is attached to the first adhesive tape T1, the peeling table 71 stops and the lift frame 97 descends. Then, as shown in FIGS. 21 and 22, the pressure roller 92 moves in an arc shape to press the release tape RT in an arc shape against the notch N portion of the first adhesive tape T1. RT is in close contact. The adhesion operation of the peeling tape RT to the notch N portion can be performed by reciprocatingly driving the pressure roller 92 in an arc or by driving it in one direction.

When the peeling tape RT is brought into close contact with the notch N portion as described above, the peeling tape RT is wound and folded while the peeling table 71 retreats as shown in FIG. 20B, as in the first embodiment. While the peeling tape RT and the first adhesive tape T1 are folded back at an acute angle by the roller 82, the first adhesive tape T1 is peeled off. At this time, since the notch N portion and the peeling tape RT are in close contact with each other, the first adhesive tape T1 is peeled off by the acute-angled portion of the V-shaped cut in the notch N portion. Therefore, even if the first adhesive tape T1 protrudes to the outer periphery of the substrate W and sticks to the second adhesive tape T2, the first adhesive tape T1 is peeled off by using a portion where the two sticking areas are small as a starting point for peeling. The peeling is smooth, and the substrate W is not lifted, chipped, or damaged.

After that, as in the first embodiment, the second support S2 after re-sticking is stored in the second support storage portion h. The above is the re-pasting operation in the second embodiment, but the first embodiment and the second embodiment are not limited to the expansion ratio described above, and can be appropriately used according to the embodiment. . Also, the operating mechanism is not limited to this embodiment, and known means can be employed within the scope of the invention.

N Notch RT Release tape T1 First adhesive tape T2 Second adhesive tape F Frame F1 First frame F2 Second frame M Mask W Substrate (wafer)
Wa chip S1 first support S2 second support a first support supply unit b positioning/notch formation unit c replacement unit d frame supply unit e frame transport unit f frame recovery unit g adhesive tape peeling unit h second support Body storage part 1 Adhesive tape replacement device 2 Machine base 3 Notch 4 Replacement unit 5 Machine frame 5a Rail 6 Support plate 7 Support frame 8 Support base 9 Upper plate 10 Lower plate 11 Post 12 Adsorption table 13 Frame base 13a Opening 14 Cutter unit 15 Frame holder 15a Opening 16 Support plate 17 Support 18 Elastic body 19 Cutter blade 20 Cutter holder 20a Slider 20b Rail 21 Motor 22 Rotating board 22a Gear 25 Elevating means 26 Elevating board 26a Bearing 26b Motor frame 27 Guide 28 Motor 29 Ball screw 30 support plate 31 driven pulley 32 drive pulley 33 endless belt 34 nut member 35 gear 36 guide 36a guide shaft 37 lifting plate 37a nut member 38 ball screw 39 motor 40 transport table (support table)
40a Opening 41 Slider 42 Drive pulley 43 Endless belt 44 Driven pulley 45 Storage cassette 46 Support frame 47 Holding table 47a Fixing means 47b Opening 48 Sensor 49 Supply cassette 50 Adhesive tape applying unit 51 Supply roll 52 Separator 53 Recovery roll 54 Winding roll 55 Pasting roller 56 Tension unit 56a Guide roller 57 Cutter unit 58 Guide roller 59 Pinch roller 60 Guide roller 61 Pinch roller 62 Guide roller 63 Cylinder 64 Support frame 65 Lifting cylinder 66 Motor 67 Cutter holder 68 Cutter blade 69 Press roller 70 Rail 71 Separation table 71a Support frame 72 Separation unit 73 Slider 74 Machine frame 75 Supply roll 76 Recovery roll 77 Pasting roller 78 Recovery roll 79 Storage cassette 80 Notch forming unit 81 Backup 82 Folding roller 83 Cylinder 84 Notch cutter 85 Lifting cylinder 86 Motor 87a Post 87b support plate 87c support frame 88 ball screw 89 nut member 90 support frame 91 peel trigger pressing portion 92 pressure roller 93 lift cylinder 94 arc-shaped rail 95 support frame 96 cylinder 97 lift frame 98 swing frame 99 guide roller

Claims (2)

After attaching a second adhesive tape onto a substrate supported by a first support via a first adhesive tape to replace the substrate with the second support, the substrate is supported by the second support. An adhesive tape peeling device for attaching a peeling tape to an upper first adhesive tape and peeling the first adhesive tape together with the peeling tape,
a notch forming means for forming an acute-angled notch at the starting end of peeling of the first adhesive tape outside the substrate supported by the first support;
cutting means for circumferentially cutting through the first adhesive tape to connect the ends of the notch;
and a pressing means for pressing the peeling starting end of the peeling tape,
The notch forming means forms at least one acute-angled notch at the beginning of peeling of the first adhesive tape, and the first adhesive tape is hollowed out by the cutting means. affixing the second adhesive tape together to form a second support;
After the peeling tape is attached to the first adhesive tape on the substrate, the first adhesive tape is integrated with the peeling tape by pressing the peeling tape positioned above the notch with the pressing means. An adhesive tape peeling device, characterized in that the adhesive tape is peeled off. After attaching a second adhesive tape onto a substrate supported by a first support via a first adhesive tape to replace the substrate with the second support, the substrate is supported by the second support. A peeling method for an adhesive tape, wherein a peeling tape is attached to the upper first adhesive tape, and the first adhesive tape and the peeling tape are peeled integrally,
forming at least one acute-angled notch on the peeling start side of the first adhesive tape on the outside of the substrate supported by the first support; cutting the first adhesive tape through the substrate; forming a second support by integrally attaching the second adhesive tape to the back surface of the second frame and the second frame;
After the peeling tape is stuck on the first adhesive tape, the peeling tape positioned above the notch is pressed by a pressing means provided on the peeling starting end portion, so that the notch serves as a trigger for the first adhesive tape. is peeled off together with the peeling tape.

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