JP6627490B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device and a method for manufacturing the same, and for example, relates to a semiconductor light emitting element such as a light emitting diode and a method for manufacturing the same.

  In recent years, light-emitting diodes (Light Emitting Diodes: hereinafter, also referred to as “LEDs”) with lower power consumption have been used in general lighting fixtures and the like in place of conventional incandescent bulbs, and their application fields are also increasing. It is expanding into various fields such as lighting applications, lighting, and in-vehicle applications. In such a light emitting device 1000, an LED 1001 is mounted on a lead frame 1022 as shown in a perspective view of FIG. The lead frame 1022 is used for conduction with the outside. The lead frame 1022 is embedded in a resin package 1030 as shown in the sectional view of FIG.

  In such a light emitting device, it is required to increase the strength of the resin package in order to increase the durability. In response to recent demands for higher output, a large number of LEDs are mounted to increase the amount of light. As a result, more heat dissipation is required. Further, the amount of input power is increased for higher output, and it is also important to increase the breakdown voltage of the element. In addition, it is also required to prevent the discoloration due to sulfuration of the Ag plating of the lead frame due to aging with use.

JP-T-2013-540362 JP 2006-093738 A

  The present invention has been made to solve such a conventional problem. An object of the present invention is to provide a light emitting device with increased mechanical strength.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, according to a light emitting device according to one aspect of the present invention, a light emitting element, a first lead frame for mounting the light emitting element on one surface thereof, and A light emitting device comprising a package having a second lead frame for electrically connecting the first lead frame and a resin portion covering the first lead frame and the second lead frame, wherein the first lead frame and the second lead frame are provided. Has an intersecting portion that is separated from each other with a gap and intersects at least in an X shape in a plan view, wherein the intersecting portion is embedded in the resin portion, and the first lead frame and the second The lead frame can be made of a different metal plate or coated with a different type of metal film.

Further, according to the method for manufacturing a light emitting device according to another aspect of the present invention, a light emitting element, a first lead frame for mounting the light emitting element on one surface thereof, and an electrical connection with the light emitting element are provided. A method for manufacturing a light emitting device, comprising: a package having a second lead frame, and a resin portion covering the first lead frame and the second lead frame, wherein the first lead frame; The frame and a second lead frame formed of a different metal plate or coated with a different type of metal film are separated from each other with a gap therebetween , and at least an intersection that intersects at least in an X-shape in plan view. And holding the first lead frame and the second lead frame with a resin material so as to bury the intersection, and forming the package. It can be.

  With the above configuration, the mechanical strength is improved by embedding the intersection where the first lead frame and the second lead frame overlap with each other in the resin portion.

FIG. 2 is a perspective view showing the light emitting device according to Embodiment 1. It is a top view of the light emitting device of FIG. FIG. 2 is a perspective view of the light emitting device of FIG. 1 as viewed from a bottom surface side. FIG. 2 is a perspective view showing a positional relationship between a first lead frame and a second lead frame of the light emitting device of FIG. 1. FIG. 5 is a perspective plan view illustrating a positional relationship between a first lead frame and a second lead frame in FIG. 4. 6A is a cross-sectional view taken along the line VIA-VIA in FIG. 1, and FIG. 6B is a cross-sectional view taken along the line VIB-VIB in FIG. FIG. 9 is a perspective view showing a light emitting device according to Embodiment 2. It is the perspective view which looked at the light emitting device of FIG. 7 from the bottom surface side. It is a perspective view which shows a manufacturing process. It is a perspective view showing the light emitting device of the background art. It is a vertical sectional view of a light emitting device of background art.

Hereinafter, embodiments and examples according to the present invention will be described with reference to the drawings. However, the embodiments described below exemplify what embodies the technical idea of the present invention, and the present invention is not limited to the following. Further, the present specification does not limit the members described in the claims to the members of the embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention thereto, unless otherwise specified. Only. In addition, the size, positional relationship, and the like of the members illustrated in each drawing may be exaggerated for clarity of description. Further, in the following description, the same names and reference numerals denote the same or similar members, and a detailed description thereof will be omitted as appropriate. Further, each element constituting the present invention may be configured such that a plurality of elements are configured by the same member and one member also serves as the plurality of elements, or conversely, the function of one member may be performed by the plurality of members. It can also be realized by sharing. In addition, the contents described in some examples and embodiments may be used in other examples and embodiments.
(Embodiment 1)

The light emitting device according to Embodiment 1 is shown in FIGS. 1 to 6B. 1 is a perspective view, FIG. 2 is a plan view, FIG. 3 is a perspective view seen from the bottom side, FIG. 4 is a perspective view showing the positional relationship between the first lead frame 10 and the second lead frame 20, 5 is a perspective plan view showing a positional relationship between the first lead frame 10 and the second lead frame 20, FIG. 6A is a sectional view taken along the line VIA-VIA in FIG. 1, and FIG. 6B is a sectional view taken along the line VIB-VIB in FIG. The figures are shown respectively. In FIG. 6B, the frame is omitted to show a state in which the first lead frame 10 and the second lead frame 20 overlap each other. The light emitting device 100 shown in these figures includes a light emitting element 1, a first lead frame 10 for mounting the light emitting element 1 on one surface thereof, and a second lead frame 20 for electrically connecting to the light emitting element 1. And a package 4 having a resin part 30 that covers the first lead frame 10 and the second lead frame 20. The first lead frame 10 mainly has a function of mounting the light emitting element 1 and reflecting light emitted from the light emitting element 1 toward the light extraction surface. On the other hand, the second lead frame 20 is electrically connected to the light emitting element 1 and has a function of supplying power to the light emitting element. The first lead frame 10 and the second lead frame 20 are separated from each other, and at least a part of the first lead frame 10 and the second lead frame 20 are crossed in a state where the second lead frame 20 is located above the first lead frame 10. It is embedded in the part 30. In addition, the first lead frame 10 and the second lead frame 20 are preferably made of different metal plates or covered with different types of metal films.
(Light-emitting element 1)

As the light emitting element 1, a semiconductor light emitting element such as a light emitting diode or a semiconductor laser can be suitably used. Such a semiconductor light emitting device is formed on a substrate by a liquid phase epitaxy method, an HDVPE method, or a MOCVD method. Is preferably used as a light-emitting layer. By selecting the material of the semiconductor layer and the degree of mixed crystal thereof, the emission wavelength of the semiconductor light emitting device can be variously selected from ultraviolet light to infrared light. In particular, when a display device that can be suitably used outdoors can be used, a light-emitting element that can emit light with high luminance is required. Therefore, it is preferable to select a nitride semiconductor as a material of a light emitting element which emits green and blue light with high luminance. For example, In _X Al _Y Ga _{1 -XYN} (0 ≦ X ≦ 1, 0 ≦ Y ≦ 1, X + Y ≦ 1) or the like can be used as the material of the light emitting layer. Further, a light-emitting element in which such a light-emitting element is combined with various phosphors (explained in detail later) which are excited by the light emission and emit light having a wavelength different from the light-emitting wavelength of the light-emitting element can be used. It is preferable to select a gallium-aluminum-arsenic-based semiconductor or an aluminum-indium-gallium-phosphorus-based semiconductor as a material of a light-emitting element that emits red light. In order to form a color display device, it is preferable to combine LED chips having a red emission wavelength of 610 nm to 700 nm, a green emission wavelength of 495 nm to 565 nm, and a blue emission wavelength of 430 nm to 490 nm.

  The light emitting element 1 is mounted on a first lead frame, and a bonding member is used for that. For example, in the case of a light-emitting element that emits blue and green light and is formed by growing a nitride-based semiconductor layer on a sapphire substrate, an epoxy resin, a silicone resin, or the like can be used for a bonding member. Also, in consideration of deterioration due to light or heat from the light emitting element, the back surface of the light emitting element may be plated with a metal such as Al, or a resin such as Au-Sn eutectic may be used without using a resin for the joining member. A brazing material such as a low melting point metal may be used. Further, in the case of a light emitting element having electrodes formed on both sides, such as a light emitting element made of GaAs and emitting red light, die bonding may be performed using a conductive paste of silver, gold, palladium, or the like.

  The light emitting element 1 is electrically connected to the first lead frame 10 and the second lead frame 20. As a connection method, wire bonding via a wire, a method of mounting the light-emitting element 1 with the electrode forming surface as a mounting surface without a wire, and the like can be appropriately used.

When a plurality of light emitting elements 1 are mounted, it is preferable that the light emitting elements 1 are uniformly arranged on the mounting portion 11 which is the light emitting element mounting surface of the first lead frame 10 without being biased in one direction. When one light emitting element 1 is mounted, it is preferable to arrange the light emitting element 1 near the center. With such an arrangement, uniform light emission can be realized without deviation of the light emitting element 1. In this example, a plurality of light emitting elements 1 are mounted using the light emitting device 100 for illumination. In the example of FIG. 1, a total of 36 light emitting elements 1 of 6 rows × 6 columns are mounted in a matrix. However, any number and arrangement pattern of the light emitting elements can be used. For example, they may be arranged in a rectangular shape in which the number of rows and columns are changed, or may be arranged in a circular or polygonal shape. Furthermore, one light emitting element can be used.
(Resin part 30)

  The resin portion 30 has a concave portion for accommodating the light emitting element 1 on an upper surface. As shown in FIGS. 1 and 2, the resin portion 30 has a substantially rectangular outer shape in plan view, and has a frame shape surrounding the light emitting element mounting surface in plan view. That is, the resin portion 30 has the frame 31 and forms a recess inside the frame 31. In addition, the first lead frame 10 is buried in the bottom surface of the concave portion so as to be exposed. Further, the resin part 30 also embeds the second lead frame 20 and protrudes from the side surface. Such a resin portion 30 is preferably made of a resin having excellent insulation properties.

  Examples of the material of the resin portion 30 include aliphatic polyamide resin, semi-aromatic polyamide resin, polyethylene terephthalate, polycyclohexane terephthalate, unsaturated polyester, liquid crystal polymer, polycarbonate resin, syndiotactic polystyrene, polyphenylene ether, polyphenylene sulfide, and polyphenylene sulfide. Thermosetting resins such as thermoplastic resins such as ether sulfone resin, polyether ketone resin and polyarylate resin, epoxy resin, epoxy-modified resin, silicone resin, silicone-modified resin, polybismaleimide triazine resin, polyimide resin, polyurethane resin, etc. Is mentioned. Further, in these resin materials, as a filler or a coloring pigment, glass, silica, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, wollastonite, Mica, zinc oxide, barium titanate, potassium titanate, aluminum borate, aluminum oxide, zinc oxide, silicon carbide, antimony oxide, zinc stannate, zinc borate, iron oxide, chromium oxide, manganese oxide, carbon black, etc. Particles or fibers can be incorporated.

  The outer shape of the resin portion in plan view may be a polygonal shape such as an octagon or a circular shape, in addition to a rectangular shape. If necessary, an optical member such as a lens may be arranged on the upper surface of the resin portion.

In addition to the rectangular shape, the external shape of the concave portion in plan view can be a polygonal shape such as an octagon or a circular shape. Further, the bottom surface of the concave portion and the opening portion may have different shapes.
(Sealing resin 40)

As shown in FIG. 6A, a sealing resin 40 is filled in the concave portion of the resin portion 30. The sealing resin 40 is a member that seals a part of the light emitting element, the wire, and the lead and protects it from dust, smoke, moisture, external force, and the like. The material of the sealing resin is preferably a material having an insulating property and capable of transmitting light emitted from the light-emitting element (preferably, a transmittance of 70% or more). Specific examples include an epoxy resin, an epoxy-modified resin, a silicone resin, a silicone-modified resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, and a hybrid resin containing one or more of these resins. Among them, a silicone resin or an epoxy resin excellent in insulation and weather resistance can be suitably used.
(Wavelength conversion member)

  Further, a wavelength conversion member for converting the wavelength of light emitted from the light emitting element 1 may be added as needed. The wavelength conversion member is arranged at a position facing the light emitting surface of the light emitting element 1 or in the vicinity thereof. For example, a wavelength conversion member is dispersed in a sealing resin 40 for sealing the light emitting element 1. Alternatively, a plate-shaped member including a wavelength conversion member may be separately formed, and this may be joined to the light emitting surface of the light emitting element. With this configuration, the wavelength conversion member can be separated from the light emitting element, and the effect of the wavelength conversion member deteriorating due to heat generated by the light emitting element can be reduced. The light emitting element and the wavelength conversion member can be joined by a method using an inclusion such as an adhesive, a direct joining method, or the like. For direct bonding, for example, a surface activated bond, a hydroxyl group bond, or an atom diffusion bond can be used.

  A phosphor can be used for the wavelength conversion member. For example, a blue LED is used as a light emitting element, and a phosphor that emits yellow light when excited by blue light emitted from the blue LED as a wavelength conversion member, for example, a YAG phosphor, a phosphor that emits red light, for example, a KSF phosphor, etc. Is available. As an example, by using an InGaN LED as a semiconductor light emitting element and using YAG activated by a rare earth element as a phosphor, the blue light of the LED and the phosphor were excited by the blue light and the wavelength was converted. Yellow fluorescence is obtained, and white light is obtained by mixing these colors, whereby a white light-emitting device can be obtained. Further, a plurality of types of phosphors can be used as needed. For example, by adding a red-based phosphor, a warm-colored luminescent color to which a red component is added can be obtained. It is also possible to obtain emission colors other than white light. Here, the light emitting diode has a peak wavelength of 445 to 455 nm in blue, and the phosphor is a combination of YAG that emits yellow fluorescence when excited by this blue light, LAG that emits yellow-green fluorescence, and SCASN that emits red fluorescence. Thus, a light emitting device that generates white light of bulb color as output light by mixing these colors is obtained.

  Further, a light diffusing material may be added to the sealing resin 40. Examples of the light diffusing material include silica, titanium oxide, zirconium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, and oxide. Chromium, manganese oxide, glass, carbon black, or the like can be used.

The sealing resin 40 has a two-layer structure in which a layered wavelength conversion member-containing layer in which a wavelength conversion member is dispersed, and a diffusion material-containing layer in which a diffusion material is dispersed are disposed on the wavelength conversion member-containing layer. be able to. Furthermore, the sealing resin is formed into a first resin mold layer that performs wavelength conversion by blending a wavelength conversion member such as a phosphor, and a second resin mold layer that blends a diffusing agent to reduce uneven light emission. A separate multilayer structure can also be used.
(First lead frame 10)

  The first lead frame 10 and the second lead frame 20 are preferably made of a metal plate. In the example of FIG. 4, the first lead frame 10 includes a mounting portion 11 formed in a flat plate shape and one or more extending portions 12 extending from an edge of the mounting portion 11. The extension portions 12 project from the four corners of the mounting portion 11 in parallel with each other. Preferably, as shown in FIGS. 4 and 6B, the extension portion 12 and the placement portion 11 are formed so as to be on the same plane. Further, the back surface of the mounting portion 11 is exposed from the back surface side of the resin portion 30. The first lead frame 10 and the second lead frame 20 are embedded in the resin portion 30 so as to be flush with the bottom surface of the resin portion 30.

  In this example, the light emitting element 1 is mounted on the first lead frame 10 which is a metal plate, but the first lead frame 10 and the light emitting element 1 are electrically insulated. The first lead frame 10 is electrically insulated from the outside. The first lead frame 10 is configured to easily exhibit heat radiation for conducting heat generated by the light emitting element 1. Specifically, it is made of a metal material having excellent heat conductivity, or is coated with a metal material having excellent heat conductivity.

  Further, as shown in FIG. 3, the first lead frame 10 is exposed on the back surface side. Thereby, an external heat radiating member such as a heat sink is thermally coupled to the back surface side of the resin portion 30, and further heat radiating performance can be exhibited. As described above, since the first lead frame 10 is electrically insulated, the first lead frame 10 can adopt a configuration specialized in heat dissipation.

  The first lead frame 10 is made of a metal plate having excellent heat dissipation, and may be made of Cu, for example. Further, the first lead frame 10 is covered with a first metal film 13 having a higher light reflectance than the second lead frame 20. Accordingly, light emitted from the light emitting element 1 and traveling toward the bottom surface can be reflected on the surface of the first metal film 13 having a higher light reflectance than the second lead frame 20 and can be directed toward the light extraction surface. Thus, the light output is improved. Ag can be suitably used for the first metal film 13. In this example, a Cu metal plate constituting the first lead frame 10 is plated with Ag as the first metal film 13.

Further, the extension portion 12 is exposed from the side surface of the resin portion 30 as shown in the perspective view of FIG. That is, the end surface of the extension portion 12 is configured to be substantially flush with the side surface of the resin portion 30. By doing so, heat can be radiated from this portion. In addition, when the light emitting device is mounted on the mounting substrate, it is possible to accurately perform the positioning.
(Second lead frame 20)

  The second lead frame 20 includes a pair of lead frame pieces 20A and 20B serving as a positive electrode and a negative electrode. The pair of lead frame pieces 20 </ b> A and 20 </ b> B are arranged inside the resin part 30 continuously from the first connection terminal 21 and the first connection terminal 21 arranged outside the resin part 30, respectively. And a second connection terminal 22 extending to the right. The first connection terminal 21 is disposed outside the resin portion 30 and mainly functions as an external connection terminal that performs electrical connection with the outside of the light emitting device. On the other hand, the second connection terminal 22 functions mainly as an internal connection terminal for achieving conduction with the light emitting element 1 and the protection element 2 (described later) inside the resin portion 30.

  As shown in the perspective view of FIG. 1, the first connection terminal 21 is connected to some of the light emitting elements 1 (for example, the light emitting element 1B located at the edge of the light emitting elements connected in series) by wire bonding. Therefore, the material is suitable for such wire bonding and has excellent mechanical connectivity. In addition, a material having low electric resistance and high conductivity is used.

  The second connection terminal 22 is integral with the first connection terminal 21. Here, the second connection terminals 22 extending from the left and right end portions of the first connection terminals 21 extending in one direction, extending in parallel with each other in a direction orthogonal to the extension direction, and in a direction approaching each other, It is formed by bending a plate. The pair of lead frame pieces 20A and 20B preferably have a substantially symmetric shape. This contributes to a reduction in manufacturing cost and simplification of the manufacturing process as a common lead frame piece.

  The first lead frame 10 and the second lead frame 20 are in a state in which the second connection terminal 22 of the second lead frame 20 is located above the first lead frame 10 as shown in FIGS. And is embedded in the resin portion 30. Specifically, as shown in FIG. 5, the first lead frame 10 and the second lead frame 20 are, as viewed in plan, an extension 12 of the first lead frame 10 and a second connection terminal of the second lead frame 20. 22 has an intersection portion CR overlapping the intersection portion 22, and the intersection portion CR is embedded in the resin portion 30. Thereby, the mechanical strength of the package 4 can be increased. In particular, by arranging the intersection CR at a part except for both ends of each lead frame, it is possible to further increase the mechanical strength as compared with the case where the intersection CR is arranged at the end of the lead frame. At the intersection CR, the first lead frame and the second lead frame overlap in a plan view, but are not actually in contact with each other and intersect three-dimensionally at different heights. In the present specification, the crossing part that partially overlaps both ends means that the first lead frame and the second lead frame do not cross in a T shape but cross in an X shape. The intersection angle at this time is not particularly limited. However, considering the strength of the package, it is preferable that the intersection part intersects at an angle close to a right angle.

  The second lead frame 20 is preferably covered with a second metal film 23 having higher conductivity than the first lead frame 10. It is desirable that the second metal film 23 be made of a material that realizes good electrical connection and prevents deterioration due to sulfuration. For example, it is preferable to contain Au. This is advantageous for electrical joining. In particular, when the light emitting element and the second lead frame are bonded by wire bonding, the use of the Au wire improves the bonding property with the second metal film 23 containing Au. Further, it is possible to realize a power supply lead frame with improved reliability by suppressing disconnection due to sulfuration of the wire. In this example, a metal plate made of a copper alloy is coated with Ni and Pd as an underlayer, and then the second metal film 23 is plated with Au. The metal plate is not limited to a copper alloy, but may be made of, for example, iron.

  The first lead frame 10 and the second lead frame 20 are each covered with a resin part 30. At this time, the first lead frame 10 and the first connection terminal 21 of the second lead frame 20 are covered with the resin portion 30 so as to have the same height as shown in the sectional view of FIG. 6B. On the other hand, a part of the second lead frame 20 where the second connection terminal 22 is located is bent at a part located on the first connection terminal side such that the plane is higher than the plane where the first connection terminal 21 is located. Have been.

  When the second metal film 23 is coated, it is preferable to perform the coating after bending the second lead frame 20. By doing so, it is possible to prevent the occurrence of plating and cracks in the base material of plating during bending.

  The second connection terminal 22 is exposed from the upper surface of the resin part 30. The second connection terminal 22 is located above the first lead frame 10 and is arranged in a shape crossing a part of the extension 12. By providing such an intersecting portion CR where the first lead frame 10 and the second lead frame 20 overlap each other, a core arranged in an intersecting shape while three-dimensionally separating the metal plates inside the resin portion 30. As a result, the mechanical strength of the package 4 can be improved.

  Further, the pair of lead frame pieces used as the positive electrode and the negative electrode are spaced apart from each other because it is necessary to achieve electrical insulation. For example, in the light emitting device 1000 shown in the cross-sectional view of FIG. 11, a gap is formed between the lead frames 1022 made of a metal plate at the position indicated by the arrow, so that the mechanical strength of this portion is weakened. It was considered that a bending stress was applied when cutting the plate, and the resin package 1030 was damaged.

  On the other hand, in the present embodiment, by arranging another lead frame so as to intersect with the direction of breaking along the gap between the pair of lead frames that carry out the electrical connection, reinforcement for resisting bending stress is achieved. I have. Specifically, as shown in the perspective view of FIG. 4, the pair of lead frame pieces 20A and 20B that perform electrical connection have substantially symmetric shapes, and are separated from each other so as to be a positive electrode and a negative electrode, respectively. Be placed. At this time, the mechanical strength of a region where the second connection terminals 22 face each other with a space therebetween, that is, a portion of a so-called pn gap PNG becomes weak. In the example of FIG. 4, each second lead frame 20 is provided with the second connection terminals 22 extending in the direction approaching each other on the left and right sides of the first connection terminal 21 extending in one direction. A pn gap PNG is formed between the second connection terminals 22 in FIG. 4 between the pieces 20A and 20B. As a result, it is conceivable that a region connecting the pn gap PNGs (a fragile region FA indicated by a chain line in FIG. 4) becomes mechanically weak against bending stress. Therefore, in the present embodiment, the first lead frame 10, which is a separate member, is arranged in a shape that intersects the fragile area FA. As a result, the fragile area FA is mechanically reinforced, the resistance to stress is increased, the reliability is improved, and the yield during manufacturing can be expected to be improved. In particular, since the first lead frame 10 is a metal plate and the mounting portion 11 has a flat plate shape, the mechanical strength is improved in each step as compared with the conventional configuration as shown in FIG.

  A part of each lead frame is exposed inside the concave portion of the resin portion 30. That is, the upper surfaces of the first lead frame 10 and the second lead frame 20 are exposed in the concave portion of the resin portion 30, and the light emitting element 1 and the lead frame are electrically connected by the exposed surfaces. As described above, the electric connection between the light emitting elements 1 inside the package 4 uses the upper surface of the lead frame, while the electric connection with the outside uses the bottom surface of the lead frame exposed on the bottom surface of the resin portion 30 or the resin portion. The side surface of the lead frame exposed from the side surface 30 can be used.

As shown in the cross-sectional view of FIG. 6B, the first lead frame 10 and the second lead frame 20 are located at almost the same plane where wire bonding is required, while the intersection CR is formed by the second lead frame 20. It is located above the first lead frame 10. In this way, the portions where wire bonding is required are on the same plane, so that the wire bonding operation between lead frames can be easily performed. By providing a difference and arranging the lead frames so that a part of each lead frame except for both ends overlaps, the mechanical strength is maintained. In addition, portions of the pair of lead frame pieces 20A and 20B located above the first lead frame 10 have substantially the same height. Thereby, as shown in the perspective view of FIG. 4, the protection element 2 is mounted on this portion, and the work of wire bonding between the second lead frames 20 is facilitated.
(Protective element 2)

  Further, a protection element 2 for protecting the light emitting element 1 from static electricity or the like can be provided as necessary. The protection element 2 avoids a situation in which the light emitting element 1 is damaged when a reverse voltage is applied. As such a protection element 2, a Zener diode or the like connected in parallel in a direction opposite to the conduction direction of the light emitting element 1 can be suitably used. Alternatively, a varistor or the like may be used for the protection element. In the examples of FIGS. 1 and 2 and the like, the protection element 2 is connected between the second connection portions arranged to face each other. Here, a double-sided electrode zener diode having electrodes on the upper and lower surfaces is mounted on one second connection portion, and the upper surface of the zener diode is connected to the other second connection portion by a wire. In other words, the light emitting element 1 is mounted on the first lead frame 10 and the protection element 2 is mounted on the second lead frame 20, and are physically separated. Further, since the protection element 2 is mounted on the second connection portion of the second lead frame 20 which is bent at a position higher than the first lead frame 10, the height at which the light emitting element 1 and the protection element 2 are mounted is high. It is different. This arrangement makes it difficult for the protection element to be directly irradiated with light from the light-emitting element, thereby reducing light absorption by the protection element. In the example of FIG. 1, a Zener diode having double-sided electrodes is used. However, the present invention is not limited to this configuration. For example, a Zener diode having single-sided electrodes may be used for mounting with two wires. A form can also be used suitably.

  Further, as shown in the plan view of FIG. 2, the second connection terminal 22 provided with the protection element 2 exposes a conductive surface on the frame 31 of the resin portion 30. In other words, the protection element 2 is not disposed on the bottom surface of the recess in which the light emitting element 1 is mounted. With such an arrangement, light absorption of light emitted from the light emitting element 1 by the protection element 2 can be reduced, and a decrease in optical output can be avoided.

  When exposing the second connection terminal 22 from the upper surface of the resin portion 30, it is preferable to expose the second connection terminal 22 at a position lower than the upper surface of the frame 31 of the resin portion 30. Thereby, unnecessary conduction can be avoided. As shown in the perspective view of FIG. 1, a second bottom surface is formed at a position lower than the upper surface of the inner surface of the frame 31 of the resin portion 30, and the second connection terminal 22 is exposed on the upper surface of the second bottom surface. I have. After the protection element 2 is placed on the second bottom surface, the inside of the recess including the second connection terminal 22 can be protected by filling the recess with the sealing resin 40. In the configuration in which the protection element 2 is connected by wire bonding, the height of the wire and the formation position of the second bottom surface are designed so that the wire is embedded in the sealing resin 40.

  In the example of FIG. 2 and the like, the protection element 2 is disposed on the second bottom surface in the concave portion of the resin part 30, but the second connection terminal and the protection element may be embedded inside the resin part.

As described above, the lead frame is separated into the first lead frame 10 and the second lead frame 20 and three-dimensionally intersect with each other, and the intersection CR is embedded in the resin portion to improve the mechanical strength of the light emitting device, By using one lead frame 10 made of a material suitable for mounting the light emitting element 1 and the second lead frame 20 made of a material suitable for supplying power to the light emitting element 1, a light emitting device with improved reliability is realized.
(Embodiment 2)

In the above example, the configuration in which the first connection terminal 21 protrudes from the side surface of the resin portion 30 has been described. However, the present invention is not limited to this configuration, and the first connection terminal may be configured not to protrude from the side surface of the resin portion. In this case, for example, while the first connection terminal is at the same height as the side surface of the resin portion, the surface of the electrode terminal is exposed from the resin portion, or a part of the upper surface of the resin portion 30 is cut out. An electrode that can be electrically connected to the outside can be configured. Such an example is shown in FIGS. 7 and 8 as the light emitting device 200 according to the second embodiment. In these figures, FIG. 7 shows a perspective view, and FIG. 8 shows a perspective view seen from the bottom side. The light emitting device 200 shown in these figures also has a light emitting element 1, a first lead frame 10 'for mounting the light emitting element 1 on one surface thereof, and a second lead frame for electrically connecting to the light emitting element 1. 20 ′ and a package 4 having a resin part 30 ′ covering the first lead frame 10 ′ and the second lead frame 20 ′. The first lead frame 10 'includes a mounting portion 11' formed in a flat plate shape and an extension portion 12 'extending from an edge of the mounting portion 11', and the second lead frame 20 'has a first connection portion. It comprises a terminal 21 'and a second connection terminal 22'. Members having the same configuration as in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

The first connecting terminal 21 ', the resin portion 30' instead not to protrude from the side of, among the upper surface of the resin portion 30 ', by providing the cutout area 32 has notched continuously on the side surface from the edge, The first connection terminal 21 'is exposed on the upper surface side. This eliminates protrusions from the side surfaces of the resin portion 30 ', thereby reducing the external size and securing an area for connection to the outside.

In addition, the first lead frame 10 'employs a structure specialized in heat dissipation so that the light emitting element 1 mounted thereon can be easily dissipated. For example, a metal having excellent heat dissipation properties is employed, or the back side is exposed from the resin portion 30 'as shown in FIG. 8 to increase the heat dissipation area and conduct heat with an external heat sink or the like.
(Manufacturing process of light emitting device)

  Next, a manufacturing process of the light emitting device will be described with reference to perspective views of FIGS. 9A to 9D. First, frame members 15 and 25 in a state where a plurality of first lead frames 10 and second lead frames 20 are connected by punching a metal plate sheet or the like are prepared. In this example, a total of eight lead frames of 4 rows × 2 columns are formed on a rectangular sheet. For each of the frame members 15 and 25, an appropriate metal material or plating material is selected according to the characteristics required for each lead frame. For example, as the frame material 25 for the second lead frame 20 shown in FIG. 9A, an inexpensive Fe plate material plated with Au having higher conductivity than Fe is used as the second metal film 23. Au is not as high in conductivity as Ag or Cu, but is excellent as a terminal material because it is chemically stable. On the other hand, as the frame material 15 for the first lead frame 10 shown in FIG. 9B, a material in which Ag plating having high light reflectance is applied to the first metal film 13 on a Cu plate material having excellent heat dissipation properties is used. It should be noted that punching in which the patterns of the frame members 15 and 25 are formed can be performed efficiently before plating of the metal film. However, by performing plating after punching, a coating film including the punched cut surface is formed, which is preferable in terms of reliability.

  Next, as shown in FIG. 9C, the frame members 15 and 25 are held in an overlapping manner, and further, as shown in FIG. 9D, a resin portion 30 is formed by resin molding or the like. The resin part 30 was formed by holding the frame members 15 and 25 such that the first lead frame 10 and the second lead frame 20 were separated from each other and had a shape having an intersection CR partially overlapping in plan view. In this state, the frame members 15 and 25 are covered with a resin material. Thus, the package 4 in which the intersection CR is embedded in the resin portion 30 is formed. Known methods such as injection molding and transfer molding can be appropriately used for forming the resin portion 30. Further, in this state, after mounting the light emitting element 1 and the protection element 2 and performing wire bonding, the sealing resin 40 is filled in the concave portion of the resin portion 30. Finally, the frame material is cut at a position outside the first lead frame 10 and the second lead frame 20, and each light emitting device 100 is separated from the frame material. Thus, a plurality of light emitting devices are obtained.

  As described above, according to the light emitting device of the present embodiment, the lead frame is separated for the power supply and the mounting of the light emitting element 1 and partially crossed inside the resin portion, so that the height is high. A high-quality light-emitting device that achieves both strength and high withstand voltage can be realized.

  The light emitting device according to the present invention and the method for manufacturing the same, the light source for illumination, LED display, backlight light source, signal, illumination switch, LED used for various sensors and various indicators, not only semiconductor light emitting elements such as laser elements, etc., It can be widely used for manufacturing semiconductor light emitting devices.

100, 200, 1000 Light-emitting device 1, 1B Light-emitting element 2 Protective element 4 Package 10, 10 'First lead frame 11, 11' Mounting part 12, 12 'Extension part 13, First metal Membrane 15 First frame material for lead frame 20, 20 'Second lead frame; 20A, 20B Lead frame pieces 21, 21' First connection terminal 22, 22 'Second connection terminal 23 Second metal Film 25 ... second lead frame frame material 30, 30B, 30 '... resin part 31 ... frame 32 ... cutout area 40 ... sealing resin 1001 ... LED
1022 Lead frame 1030 Resin package CR Intersection PNG PNG pn gap FA Vulnerable area

Claims (16)

A light emitting element,
A first lead frame for mounting the light emitting element on one surface thereof, a second lead frame for electrically connecting to the light emitting element, and a resin portion covering the first lead frame and the second lead frame A package having:
With
The first lead frame and the second lead frame are separated from each other with a gap, and have an intersection that intersects at least in an X shape in a plan view,
The intersection is buried in the resin portion,
A light-emitting device in which the first lead frame and the second lead frame are formed of different metal plates or covered with different types of metal films. The light emitting device according to claim 1,
A light emitting device in which the second lead frame is buried in the resin portion while being located above the first lead frame.   The light emitting device according to claim 1 or 2,
  The first lead frame and the second lead frame are separated from each other on the same plane with the gap,
  A part of the second lead frame is bent and is positioned above the first lead frame,
  The light emitting device according to claim 1, wherein the intersection is such that the second lead frame located above the first lead frame intersects the first frame in a direction along the gap. The light emitting device according to claim 1, wherein:
A light emitting device in which the first lead frame is electrically insulated from the light emitting element. A light emitting device according to any one of claims 1-4,
A light emitting device in which the first lead frame is electrically insulated from the outside and has a heat radiation property to conduct heat generated by the light emitting element. A light emitting device according to any one of claims 1 to 5,
A light emitting device, wherein the first lead frame is covered with a first metal film having a higher light reflectance than the second lead frame. A light emitting device according to any one of claims 1 to 6,
A light emitting device in which the first lead frame is covered with a first metal film containing Ag. A light emitting device according to any one of claims 1-7,
A light emitting device, wherein the second lead frame is covered with a second metal film having higher conductivity than the first lead frame. A light emitting device according to any one of claims 1-8,
A light emitting device in which the second lead frame is covered with a second metal film containing Au. A light emitting device according to any one of claims 1-9,
The first lead frame,
A mounting portion formed in a flat plate shape,
On the same plane as the mounting portion, the device has one or more extensions protruding from the edge of the mounting portion,
The light emitting device, wherein a back surface of the mounting portion is exposed from a back surface side of the resin portion. The light emitting device according to claim 10 ,
The second lead frame is composed of a pair of lead frame pieces serving as a positive electrode and a negative electrode,
The pair of lead frame pieces, respectively,
A first connection terminal arranged outside the resin portion,
Continuing from the first connection terminal, a second connection terminal disposed inside the resin portion and extending in a direction approaching each other,
The light-emitting device in which the intersection is such that the second connection terminal and the extension overlap. The light emitting device according to claim 11 ,
A light emitting device in which a part located on the first connection terminal side is bent so that a plane where the second connection terminal is located is higher than a plane where the first connection terminal is located. A light emitting device according to claim 11 or 12,
A light emitting device in which the second connection terminal is exposed on an upper surface of the resin portion. It is a light emitting device according to any one of claims 11 to 13 , wherein:
A light emitting device in which the lead frame pieces are formed in a substantially symmetric shape. A light emitting device according to any one of claims 11 to 14,
The pair of lead frame pieces are arranged separately from each other and opposed to each other in the resin portion,
The in the region between the separation to arranged a pair of lead frame strip, wherein the first lead frame is disposed the light-emitting device. A light emitting element,
A first lead frame for mounting the light emitting element on one surface thereof, a second lead frame for electrically connecting to the light emitting element, and a resin portion covering the first lead frame and the second lead frame And a package having:
The first lead frame and the second lead frame made of a metal plate different from the first lead frame, or coated with a different type of metal film, are separated from each other with a gap therebetween , and at least planar. Holding in a shape having an intersection that crosses in an X-shape visually;
Forming a package by covering the first lead frame and the second lead frame with a resin material so as to bury the intersection.

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