JP6031265B2 - Parts inspection device - Google Patents

Description

  The present invention relates to a component inspection apparatus.

2. Description of the Related Art Conventionally, in an electronic component mounting apparatus for mounting an electronic component on a substrate, the component inspection device for imaging the electronic component in order to inspect the flatness (coplanarity) of the electrode of the electronic component before mounting the electronic component on the substrate. (For example, refer to Patent Document 1).
In the conventional component inspection apparatus, since the coplanarity inspection of one electronic component is performed at a time, it takes time compared to the two-dimensional recognition process that is the previous process and the electronic component mounting that is the subsequent process. In order to fill this time difference, an apparatus that can execute a coplanarity inspection of a plurality of electronic components at a time by installing a plurality of component inspection devices has been developed.

Japanese Patent No. 4610437

  However, when a plurality of component inspection apparatuses are installed, the installation space is inevitably increased, and the electronic component mounting apparatus itself is actually large.

  An object of the present invention is to enable the coplanarity inspection of a plurality of electronic components at a time by using a single component inspection apparatus, thereby reducing the time required for the coplanarity inspection while suppressing an increase in the size of the electronic component mounting apparatus itself. It is to plan.

The component inspection apparatus according to the invention of claim 1
An irradiating unit for irradiating the electronic component with light;
An imaging unit that images the electronic component irradiated by the irradiation unit;
A holding unit that individually holds the plurality of electronic components such that the plurality of electronic components are disposed within an imaging range of the imaging unit;
A plurality of interval adjustment units for individually adjusting the intervals between the plurality of electronic components held by the holding unit and the imaging unit;
The plurality of electronic components within the imaging range of the imaging unit are intermittently imaged while the interval is varied at a predetermined predetermined pitch for each of the plurality of electronic components by the plurality of interval adjustment units. And an inspection unit that acquires a predetermined number of image data, individually recognizes the plurality of electronic components based on the predetermined number of image data, and inspects each flatness. .

The invention according to claim 2 is the component inspection apparatus according to claim 1,
The plurality of electronic components are different types.

The invention described in claim 3 is the component inspection apparatus according to claim 1 or 2,
The predetermined number of the image data necessary for inspecting the electronic component is different for each of the plurality of electronic components,
The inspection unit is characterized in that the flatness is measured in order from the electronic component from which the predetermined number of image data is obtained.

Invention of Claim 4 is the components inspection apparatus as described in any one of Claims 1-3,
The interval adjustment speed, the pitch, and the predetermined number can be changed for each of the plurality of electronic components.

Invention of Claim 5 is the components inspection apparatus as described in any one of Claims 1-4,
The adjustment range of the interval by the interval adjustment unit can be changed for each electronic component.

  According to the present invention, the coplanarity inspection of a plurality of electronic components can be performed at one time by using a single component inspection apparatus, thereby reducing the time required for the coplanarity inspection while suppressing an increase in the size of the electronic component mounting apparatus. It is to plan.

It is a block diagram which shows the main control structure of the component inspection apparatus which concerns on this embodiment. It is a perspective view which shows schematic structure of the drive part with which the component inspection apparatus of FIG. 1 is equipped. It is a flowchart which shows the flow of a process in the components inspection apparatus of FIG. 2A and 2B are explanatory diagrams in the case where a coplanarity inspection is simultaneously performed on two electronic components with different accuracies using the component inspection apparatus of FIG. 1, in which FIG. 1A is a bottom view, and FIG. It is a modification of the flowchart shown in FIG. It is explanatory drawing which shows the state by which the area | region for each electronic component was set within the imaging range. It is explanatory drawing at the time of implementing a coplanarity test | inspection simultaneously with a different precision after setting an area | region with respect to two electronic components, (a) is a bottom view, (b) is a side view. It is explanatory drawing which shows the example of arrangement | positioning of the electronic component arrange | positioned in the imaging range.

An embodiment of a component inspection apparatus according to the present invention will be described. This component inspection apparatus is installed in a component mounting apparatus for mounting an electronic component on a substrate. FIG. 1 is a block diagram showing a main control configuration of the component inspection apparatus. As shown in FIG. 1, the component inspection apparatus 1 includes a drive unit 10, an image processing device 20, and a main control unit 30 that controls them.
The drive unit 10 includes an irradiation unit 11 that irradiates light to the electronic components P1 and P2 (see FIG. 2), an imaging unit 12 that images the electronic components P1 and P2 irradiated by the irradiation unit 11, and a plurality of A holding unit 13 that holds the plurality of electronic components P1 and P2 is provided so that the electronic components P1 and P2 are arranged within the imaging range of the imaging unit 12.

FIG. 2 is a perspective view showing a schematic configuration of the drive unit 10. As shown in FIG. 2, the irradiation unit 11 is arranged above the imaging unit 12, and the electronic components P <b> 1 and P <b> 2 held by the holding unit 13 are arranged above the imaging unit 12.
The imaging unit 12 is provided with an optical system including a CCD or CMOS imaging device that captures a subject image and a fixed focus lens provided in front of the imaging device. That is, the imaging unit 12 is a fixed-focus imaging device. Note that an image signal obtained at the time of imaging by the imaging unit 12 is output to the image processing device 20.

The irradiation unit 11 has a square shape in a plan view and has a hollow rectangular parallelepiped case 11a, a plurality of light emitting elements 11b that irradiate light from four sides of the inner bottom of the case, and a plurality of light emitting elements that irradiate light from four sides of the upper part in the case. 11c.
The case 11a of the irradiation unit 11 is open at the top and bottom. Then, the electronic components P1 and P2 descend from the upper opening by driving the holding unit and enter the case 11a, and the image pickup unit 12 passes through the lower opening and the electronic component is irradiated with light from four sides. Imaging of P1 and P2 is performed.

  The holding unit 13 is provided with a first suction nozzle 131 and a second suction nozzle 132 that individually hold a plurality of electronic components P1 and P2. Then, as shown in FIG. 2, the holding unit 13 is moved in the Z direction, an X axis motor 131a for moving the first suction nozzle 131 in the X direction, a Y axis motor 131b for moving in the Y direction. A Z-axis motor 131c for rotating around the Z-axis and a θ-axis motor 131d for rotating around the Z-axis are provided. Similarly, the holding unit 13 includes an X-axis motor 132a for moving the second suction nozzle 132 in the X direction, a Y-axis motor 132b for moving in the Y direction, a Z-axis motor 132c for moving in the Z direction, A θ-axis motor 132d for rotating around the Z-axis is provided. Here, since the Z-axis is a direction along the optical axis of the imaging unit 12, the Z-axis motors 131 c and 132 c are driven so that the electronic components P 1 and P 2 held by the holding unit 13 and the imaging unit 12 are driven. The interval will be adjusted. That is, the Z-axis motors 131c and 132c are the interval adjustment unit according to the present invention.

  The execution of imaging by the imaging unit 12 and the execution of light irradiation by the irradiation unit 11 are controlled by the main control unit 30. Then, the image signal obtained by the imaging of the imaging unit 12 is input to the image processing device 20 as described above.

The main control unit 30 controls each part of the electronic component mounting apparatus together with the component inspection apparatus 1. The main control unit 30 receives a list of electronic components P1 and P2 to be mounted and their mounting order, mounting positions of the electronic components P1 and P2 on the board, and the electronic components P1 and P2 from any electronic component feeder. The memory mainly includes a memory (not shown) that stores mounting schedule data in which a receiving position indicating the position is determined, and a CPU 31 that executes a mounting operation control program.
When mounting electronic components, the mounting schedule data is read and the X-axis motors 131a and 132a and the Y-axis motors 131b and 132b are controlled to receive the first suction nozzle 131 or the second suction at a predetermined electronic component feeder receiving position. The nozzle 132 is conveyed, the Z-axis motors 131c and 132c are controlled, the electronic parts P1 and P2 are adsorbed by the first adsorption nozzle 131 or the second adsorption nozzle 132, moved to the imaging unit 12, and the electronic part P1 is moved from below. , P2 is picked up and then the electronic components P1 and P2 are transported to the board mounting position defined in the mounting schedule data for mounting.
And it mounts about all the electronic components P1 and P2 defined by mounting schedule data, and complete | finishes operation control.

  The main control unit 30 is connected to the image processing apparatus 20 so as to be communicable. Then, the information on the central positions of the electronic components P1 and P2 and the angle around the Z axis obtained based on the analysis result of the omnifocal image generated by imaging the electronic components P1 and P2 is received from the image processing device 20, The center position shift of the electronic components P1 and P2 and the angle shift about the Z axis with respect to the first suction nozzle 131 and the second suction nozzle 132 are set to X axis motors 131a and 132a, Y axis motors 131b and 132b, and θ axis motors 131d and 132d. The mounting operation on the board is controlled after correction by the above control.

Further, the main control unit 30 sets a predetermined interval in the Z direction between the electronic components P1 and P2 held by the first suction nozzle 131 and the second suction nozzle 132 and the imaging unit 12 when the electronic components P1 and P2 are inspected. The Z-axis motors 131c and 132c are controlled so as to be different at different pitches (imaging pitches), and the electronic parts P1 and P2 are imaged by the imaging unit 12 at each pitch. At this time, since the electronic components P1 and P2 held by the first suction nozzle 131 and the second suction nozzle 132 are arranged in the imaging range of the imaging unit 12 as shown in FIG. Thus, a plurality of electronic components P1 and P2 can be imaged.
For example, the lower end of the electronic component P1 held by the first suction nozzle 131 and the lower end of the electronic component P2 held by the second suction nozzle 132 are located closer to the imaging unit 12 than the focusing range of the imaging unit 12. The first suction nozzle 131 and the second suction nozzle 132 are raised to a predetermined height that has passed through the focusing range of the imaging unit 12 as a starting point, and the imaging unit 12 is configured to capture the electronic components P1 and P2 at each imaging pitch. Control.
The imaging pitch of each suction nozzle 131 and 132 and the number of times of imaging at the time of imaging are stored in a memory (not shown) and can be arbitrarily set from the outside. Note that the imaging pitch, the number of times of imaging (predetermined number), the adjustment speed, and the adjustment range of each suction nozzle 131, 132 can be changed for each electronic component P1, P2. Further, in the same range, imaging may be performed while lowering the suction nozzles 131 and 132.

(Image processing device)
Then, the image processing device 20 acquires a predetermined number of image data by the predetermined number of imaging, and an in-focus position at the position of each pixel constituting the image (the imaging unit 12 when one pixel is in focus). And the relative position or distance between the electronic component P1 held by the first suction nozzle 131 and the electronic component P2 held by the second suction nozzle 132), and all the pixels made up of focused images for all pixels are obtained. Processing for generating a focus image is performed.

  For this reason, as shown in FIG. 1, the image processing apparatus 20 includes an A / D converter 21, an image storage unit 22, a focus position calculation unit 23, a processing condition storage unit 24, and a processing result storage unit 25. A height calculation unit 26, a component position detection unit 27, an omnifocal image generation unit 28, a coplanarity inspection unit 29, and a CPU 200 for controlling them.

The A / D converter 21 performs A / D conversion on an image signal obtained by a plurality of times of imaging by the imaging unit 12 to generate image data for each imaging, and outputs the image data to the image storage unit 22.
The image storage unit 22 stores the image input from the A / D converter 21.
The focus position calculation unit 23 calculates a focus position within the imaging range Q from each image data stored in the image storage unit 22. As a focus position calculation method, for example, a method disclosed in Japanese Patent Application Laid-Open No. 2012-23340 can be given.

  The processing condition storage unit 24 stores a movement condition storage unit 241 that stores the movement conditions (imaging start position, imaging pitch, number of imaging operations, etc.) of the suction nozzles 131 and 132 with respect to the electronic components P1 and P2, and the electronic components P1 and P2. A component data storage unit 242 that stores each component data (each dimension, shape, flatness, etc.) of P2 is provided.

  The processing result storage unit 25 includes a focus position storage unit 251 that stores the calculation result of the focus position calculation unit 23, a height data storage unit 272 that stores the calculation result of the height calculation unit 26, and an omnifocal image. An omnifocal image storage unit 253 that stores the generation result of the generation unit 28, a component position storage unit 254 that stores the detection result of the component position detection unit 27, and an inspection result storage unit 255 that stores the inspection result of the coplanarity inspection unit 29. And are provided.

  The height calculation unit 26 calculates height data using the imaging start position, imaging pitch, and the like stored in the movement condition storage unit 241 and the in-focus position stored in the in-focus position storage unit 251, To the data storage unit 252.

The omnifocal image generation unit 28 generates an omnifocal image using the in-focus position stored in the in-focus position storage unit 251 and outputs it to the omnifocal image storage unit 253.
The component position detection unit 27 performs image processing using the omnifocal image stored in the omnifocal image storage unit 253 and the component data stored in the component data storage unit 242, and detects each component position. The result is output to the part position storage unit 254.
The coplanarity inspection unit 29 uses the component position stored in the component position storage unit 254 and the height data stored in the height data storage unit 252 to calculate each electronic component P1 by a known coplanarity value calculation method. , P2 is calculated, a coplanarity test is performed, and the result is output to the test result storage unit 255.
Then, the image processing apparatus 20 outputs the inspection result of the coplanarity inspection stored in the inspection result storage unit 255 to the main control unit 30. As described above, the main control unit 30 and the image processing apparatus 20 are inspection units according to the present invention.

  Next, the flow of processing in the component inspection apparatus 1 will be described. FIG. 3 is a flowchart showing the flow of processing. As shown in FIG. 3, in step S1, the main control unit 30 determines imaging conditions for the electronic components P1 and P2. Specifically, the imaging pitch for each of the first suction nozzle 131 and the second suction nozzle 132 is determined and stored in the movement condition storage unit 241. This imaging pitch may be calculated from component data stored in advance in the component data storage unit 242 or may be a method of inputting an arbitrary imaging pitch by the user. When determining the imaging pitch, the imaging pitch may be determined from the viewpoint of whether the coplanarity inspection is performed with high accuracy or simply with emphasis on processing time.

  Here, FIG. 4 is an explanatory view when the coplanarity inspection is simultaneously performed on the two electronic components P1 and P2 with different accuracy, (a) is a bottom view, and (b) is a side view. When the coplanarity inspection is performed on the two electronic components P1 and P2 at the same time, as shown in FIG. 4A, any one of the electronic components P1 and P2 is arranged by the suction nozzles 131 and 132 in the imaging range Q. Here, in the case of a simple inspection that is a simple inspection, the imaging pitch is widened, and in the case of a high-accuracy inspection that is a more accurate inspection, the imaging pitch is made narrower than that of the simple inspection. For example, assuming 81 images from 0 to 80 at different imaging pitches, as shown in FIG. 4B, the imaging pitch on the electronic component P1 side where the simple inspection is performed becomes wide, and high-precision inspection is performed. The imaging pitch on the electronic component P2 side to be applied becomes narrow.

In step S <b> 2, the main control unit 30 calculates the imaging start positions of the suction nozzles 131 and 132 from the imaging pitch and the component heights of the electronic components P <b> 1 and P <b> 2 stored in the component data storage unit 242.
In step S3, the main control unit 30 turns the X-axis motors 131a and 131b, the Y-axis motors 132a and 132b, and the Z-axis motors 131c and 132c so that the electronic components P1 and P2 are arranged at the respective imaging start positions. Control.
Steps S1 to S3 are the imaging preparation process.

In step S4, the main control unit 30 starts imaging.
In step S5, the main control unit 30 determines whether or not the current number of shots has reached a predetermined number. If not, the process proceeds to step S6, and if it has reached, the process proceeds to step S8.

In step S <b> 6, the main control unit 30 controls the imaging unit 12 to capture the electronic components P <b> 1 and P <b> 2.
In step S7, the main control unit 30 controls the Z-axis motors 131c and 132c so that the suction nozzles 131 and 132 move by the imaging pitch, and the process proceeds to step S5.
Steps S5 to S7 are repeated, and when the number of shots reaches a predetermined number, the process proceeds to step S8.
Steps S4 to S8 are the imaging process.

In step S8, the main control unit 30 controls the image processing device 20 to calculate a focus position from a predetermined number of image data obtained by imaging. The calculated in-focus position is stored in the in-focus position storage unit 251.
In step S <b> 9, the main control unit 30 controls the image processing device 20 to use the focus position stored in the focus position storage unit 251 and the information stored in the movement condition storage unit 241 to use the height data. Is calculated. The calculated height data is stored in the height data storage unit 252.
In step S <b> 10, the main control unit 30 controls the image processing device 20 to generate an omnifocal image using the in-focus position stored in the in-focus position storage unit 251. The generated omnifocal image is stored in the omnifocal image storage unit 253.
Steps S8 to S10 are the height data calculation process.

In step S <b> 11, the main control unit 30 controls the image processing device 20 to use the omnifocal image stored in the omnifocal image storage unit 253 and the component data stored in the component data storage unit 242. Component recognition is performed and the position of each electronic component is specified.
In step S12, the main control unit 30 controls the image processing device 20 to calculate the coplanarity values of the individual electronic components P1 and P2.
In step S13, the main control unit 30 controls the image processing apparatus 20, compares the coplanarity values of the electronic components P1 and P2 with the coplanarity determination values, and performs an inspection. When it is within the total number of P2, the process proceeds to step S14, and when it exceeds the total number, the process proceeds to step S17.

In step S14, the main control unit 30 controls the image processing apparatus 20 to determine whether or not the coplanarity value has cleared the coplanarity determination value. If cleared, the process proceeds to step S15. Proceeds to step S16.
In step S <b> 15, the main control unit 30 controls the image processing apparatus 20 to determine that the electronic components P <b> 1 and P <b> 2 that have cleared the coplanarity determination value are non-defective products, and stores the result in the inspection result storage unit 255.
In step S <b> 16, the main control unit 30 controls the image processing device 20 to determine the electronic components P <b> 1 and P <b> 2 that have not cleared the coplanarity determination value as defective products, and stores the results in the inspection result storage unit 255. .
By repeating these steps S13 to S16 as many times as the number of electronic components P1 and P2, the coplanarity inspection is executed for all the electronic components P1 and P2 within the imaging range Q. As the coplanarity determination value, the same value may be used for all the electronic components P1 and P2, or different values may be used for the respective electronic components P1 and P2.
Steps S11 to S16 are the coplanarity inspection process.

In step S17, the main control unit 30 determines whether or not the electronic components P1 and P2 to be mounted on the board by the component mounting apparatus are based on the determination result stored in the inspection result storage unit 255, When there is a non-defective product, the process proceeds to step S18, and when there is no non-defective product, the process proceeds to step S19.
In step S18, the main control unit 30 controls each part of the component mounting apparatus to mount the non-defective electronic components P1 and P2 on the board.

In step S19, based on the determination result stored in the inspection result storage unit 255, the main control unit 30 determines whether or not the electronic components P1 and P2 to be mounted on the board by the component mounting apparatus are defective. If there is a defective product, the process proceeds to step S20, and if there is no defective product, the process ends.
In step S20, the main control unit 30 controls each part of the electronic component mounting apparatus, discharges the defective electronic components P1 and P2, and ends the process.
Steps S17 to S20 are the mounting / discharging process.

As described above, according to the present embodiment, the main control unit 30 can change the intervals between the electronic components P1 and P2 and the imaging unit 12 at a predetermined imaging pitch, while the plurality of imaging units Q are within the imaging range Q of the imaging unit 12. The image processing apparatus 20 acquires a predetermined number of image data by intermittently capturing the electronic components P1 and P2, and recognizes the plurality of electronic components P1 and P2 individually based on the predetermined number of image data. Since each flatness is measured, a single component inspection apparatus 1 can perform a coplanarity inspection of a plurality of electronic components P1 and P2 at the same time, while suppressing an increase in the size of the electronic component mounting apparatus, The time required for inspection can be shortened.
In addition, if the imaging range Q is set according to the size of the electronic component that is supposed to be inspected by the component inspection apparatus 1, it is not necessary to perform XY scanning to capture the entire image even for a large electronic component. Therefore, the time required for the coplanarity inspection can be suppressed.
In addition, since three-dimensional component recognition using an omnifocal image is possible, coplanarity inspection and three-dimensional component recognition can be performed on the same component.

In addition, since the electronic components to be inspected are different types, it is possible to perform coplanarity inspection and three-dimensional component recognition even for different components.
Further, since the adjustment speed of the distance between the electronic components P1, P2 and the imaging unit 12, the imaging pitch, the predetermined number of image data necessary for the inspection, and the adjustment range can be changed for each of the plurality of electronic components P1, P2. Inspection accuracy, inspection time, and the like can be set for each of the electronic components P1 and P2.

Note that the present invention is not limited to the above embodiment, and can be modified as appropriate.
For example, in the above embodiment, the positions of the plurality of electronic components P1 and P2 are specified immediately after the omnifocal image generation (step S10), but before the start of imaging (step S4) as shown in FIG. In addition, the positions of the plurality of electronic components P1 and P2 may be specified (step S11a in FIG. 5). In step S11a, the main control unit 30 controls the image processing device 20 to set areas Q1 and Q2 including the electronic components P1 and P2 from the imaging range Q as shown in FIG. At the time of this setting, for example, it may be calculated from the component data stored in the component data storage unit 242, or a method in which the areas Q1 and Q2 are designated by the user may be used.
Thus, if it can set for every electronic component P1, P2, it will become possible to set the number of imaging required for inspecting electronic component P1, P2 for every electronic component P1, P2.

FIG. 7 is an explanatory view when coplanarity inspection is simultaneously performed with different accuracy after setting the regions Q1 and Q2 for the two electronic components P1 and P2, respectively, (a) is a bottom view, (b) ) Is a side view. In this case, it is assumed that a simple inspection is performed on the electronic component P1 and a high-precision inspection is performed on the electronic component P2.
As shown in FIG. 7, the predetermined number of sheets is 41 for the electronic component P1 to be subjected to the simple inspection, and the predetermined number is 81 for the electronic component P2 that is the object of the high-precision inspection. It becomes the number of sheets. Since the simple inspection finishes the imaging earlier, the main control unit 30 executes the coplanarity inspection from the electronic component P1 for which the predetermined number of imaging is completed earlier.
As described above, since the flatness measurement is executed from the electronic component P1 from which a predetermined number of image data is obtained, it is possible to inspect the plurality of electronic components P1 and P2 at a higher speed.

  In the above embodiment, the case where the two electronic components P1 and P2 are arranged in a line within the imaging range Q and the coplanarity inspection of the two electronic components P1 and P2 is executed at the same time is described as an example. If three or more electronic components are arranged within the range Q, it is possible to simultaneously execute the coplanarity inspection of three or more electronic components. As an arrangement example, as shown in FIG. 8, a plurality of electronic components P are arranged in a matrix.

DESCRIPTION OF SYMBOLS 1 Component inspection apparatus 10 Drive part 11 Irradiation part 12 Imaging part 13 Holding part 20 Image processing apparatus (inspection part)
30 Main control unit (inspection unit)
131 First suction nozzle 131a X-axis motor 131b Y-axis motor 131c Z-axis motor (interval adjustment unit)
131d θ-axis motor 132 Second suction nozzle 132a X-axis motor 132b Y-axis motor 132c Z-axis motor (interval adjustment unit)
132d θ-axis motor P1, P2 Electronic component Q Imaging range

Claims (5)

An irradiating unit for irradiating the electronic component with light;
An imaging unit that images the electronic component irradiated by the irradiation unit;
A holding unit that individually holds the plurality of electronic components such that the plurality of electronic components are disposed within an imaging range of the imaging unit;
A plurality of interval adjustment units for individually adjusting the intervals between the plurality of electronic components held by the holding unit and the imaging unit;
The plurality of electronic components within the imaging range of the imaging unit are intermittently imaged while the interval is varied at a predetermined predetermined pitch for each of the plurality of electronic components by the plurality of interval adjustment units. And an inspection unit that acquires a predetermined number of image data, individually recognizes the plurality of electronic components based on the predetermined number of image data, and inspects each flatness. Parts inspection device. The component inspection apparatus according to claim 1,
The component inspection apparatus, wherein the plurality of electronic components are different types. In the component inspection apparatus according to claim 1 or 2,
The predetermined number of the image data necessary for inspecting the electronic component is different for each of the plurality of electronic components,
The inspection unit performs flatness measurement in order from the electronic component from which the predetermined number of image data is obtained. In the component inspection apparatus according to any one of claims 1 to 3,
The interval inspection speed, the pitch, and the predetermined number can be changed for each of the plurality of electronic components. In the component inspection apparatus according to any one of claims 1 to 4,
2. The component inspection apparatus according to claim 1, wherein the interval adjustment range by the interval adjustment unit is changeable for each electronic component.

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