JP4951036B2 - Exposure equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide exposure equipment which performs efficient exposure to a large exposure region by using a small mask. <P>SOLUTION: Exposure equipment 1 is provided with an exposure optical system 2 for irradiating a color filter board 6 with an exposure light from a light source 7, and a transfer means 4, on which the color filter board 6 arranged to face the exposure optical system 2 is placed to be transferred onto the board 6 at a fixed speed. The exposure equipment exposes an image on an opening part 10a of a mask 10, arranged on an optical path of the exposure optical system 2; the exposure equipment is provided with an imaging means 3, which performs image pickup of a black matrix 11 previously formed on the color filter board 6, having the front side of an exposure position of the exposure optical system 2, in the direction of shifting of the transfer means 4 as an imaging position. The equipment is further provided with a control means 5, which detects a previously set reference position in the black matrix 11 of which image has been picked up by the imaging means 3, controls the irradiation timing of the exposure light of the exposure optical system 2 with the reference position as the standard, and exposes the image of the opening part 10a of the mask 10 at a prescribed position on the color filter board 6. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an exposure apparatus that irradiates exposure light with an exposure optical system and exposes an image of an opening of a mask interposed on the path of the exposure optical system on an exposure object. Efficiently using a mask by controlling the exposure position setting and exposure light irradiation timing based on a reference position preset in a reference pattern formed on the object to be exposed while moving at a constant speed The present invention relates to an exposure apparatus that attempts to expose a wide exposure area.

  In this type of conventional exposure apparatus, the substrate is held with the photosensitive material surface facing up, and can be controlled to move in the X, Y, Z axis directions and θ directions, and at least a predetermined distance in one direction of the X and Y directions. A stage that can be moved stepwise, a mask stage that holds a mask on the upper side of the substrate, a light source unit that irradiates exposure light from above the mask to the substrate side, and alignment of the substrate and mask on the stage is automatically performed It is equipped with an automatic alignment mechanism and a gap control mechanism for controlling the gap between the substrate and the mask, the substrate and the mask are controlled and aligned by the alignment mechanism and the gap control mechanism, and when the gap adjustment is completed, the light source unit The first exposure is performed by irradiating with the exposure light, and then the stage is moved by a predetermined pitch, for example, in the X direction to perform alignment again, thereby completing the gap adjustment. , Exposure for the second time, so that can be exposed to a predetermined pattern on the entire surface of the large substrate by repeating this (e.g., see Patent Document 1).

JP-A-9-127702

  However, in such a conventional exposure apparatus, once the exposure to a predetermined area is completed, the exposure operation is once ended, the mask is moved stepwise relative to the substrate, the substrate and the mask are aligned again, and the gap Since exposure was performed after adjustment, it took time for the alignment and gap adjustment to be performed a plurality of times, and it took a long time for exposure.

  In addition, the conventional exposure apparatus described above uses a small area mask so that a predetermined pattern can be exposed on the entire surface of a large substrate, and has an advantage that the cost of the mask to be used can be reduced. There is a problem that the smaller the area, the greater the number of times of alignment and gap adjustment, and the longer the adjustment time and the longer the exposure time.

  Furthermore, in order to shorten the time required for the alignment and gap adjustment, when a somewhat large mask is used, the exposure light requires a large amount of energy, and the exposure light irradiation time must be lengthened due to the power limit of the light source. As a result, the exposure time could not be shortened.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an exposure apparatus that addresses such problems and efficiently exposes a wide exposure area using a small mask.

In order to achieve the above object, a first invention of an exposure apparatus includes an exposure optical system that irradiates an exposure object with exposure light from a light source, and the exposure object disposed opposite the exposure optical system. An exposure apparatus that exposes an image of an opening of a mask interposed on the optical path of the exposure optical system on the object to be exposed. opening movement of the said by the conveying means is formed in an elongated shape in a direction perpendicular to the moving direction of the subject to be exposed, longer than the longitudinal length of the opening of the front SL mask, the object to be exposed by said conveying means are arranged in a row in succession in a direction orthogonal to the direction having a plurality of light receiving elements Ru formed, the front side of the exposure position by the exposure optical system in a moving direction of the subject to be exposed to an imaging position, the having preformed matrix of pixels exposed object An imaging means for imaging a quasi pattern, by processing the image captured by the imaging means, it detects a predetermined reference position in said pixel, the exposure of the exposure optical system with respect to the said reference position and controlling the irradiation timing of the light, the a control hand stage exposing the image of the opening portion of the mask at a predetermined position of the object to be exposed, the pitch of the array of the plurality of light receiving elements, the object to be exposed of the pixel It is smaller than the length in the direction orthogonal to the body moving direction .

With such a configuration, conveying the object to be exposed at a constant speed by the conveying means, it is formed in an elongated shape in a direction perpendicular to the moving direction of the subject to be exposed by the transport means openings of the mask, the mask openings Exposure of matrix pixels longer than the length in the longitudinal direction and continuously arranged in a line in a direction orthogonal to the direction of movement of the object to be exposed by the conveying means , and the arrangement pitch thereof being formed in advance on the object to be exposed A reference pattern having the above-mentioned pixels formed in advance on the object to be exposed is imaged by an imaging unit having a plurality of light receiving elements arranged so as to be smaller than a length in a direction orthogonal to the moving direction of the body . by processing the images captured by the imaging unit, detect a preset reference position in said pixel, the irradiation timing of the exposure light from the light source of the exposure optical system with respect to the said reference position An exposure optical system exposes an image of a mask opening formed in an elongated shape in a direction perpendicular to the moving direction of the object to be exposed by the conveying means interposed in the optical path at a predetermined position of the object to be exposed. To do. Thereby, it exposes to a wide exposure area | region efficiently using a mask.

  The exposure optical system includes an imaging lens that forms an image of the opening of the mask on the object to be exposed. Thus, the image of the opening of the mask is formed on the exposure object by the imaging lens and exposed.

According to a second aspect of the present invention, an exposure apparatus irradiates exposure light from a light source through a mask having a predetermined opening to the object to be exposed, and an image of the opening of the mask on the object to be conveyed. an exposure apparatus that exposes a, a conveying means for conveying the object to be exposed at a constant speed, is disposed above the conveying means, it is interposed in the optical path from the light source to the object to be exposed the opening of the mask with an exposure optical system having an arrangement beam splitter inclined on an optical path between said mask and imaging lens and said imaging lens for forming on a subject to be exposed was the opening of the mask, said by the conveying means is formed in an elongated shape in a direction perpendicular to the moving direction of the subject to be exposed, longer than the longitudinal length of the opening of the front SL mask, the object to be exposed by said conveying means Continuously in a direction perpendicular to the direction of movement A plurality of light receiving elements Ru formed are arranged in, the disposed for receiving reflected light in the imaging lens side reflecting surface of the beam splitter, the object to be exposed preformed matrix of pixels a reference pattern having an imaging means for imaging through the imaging lens, by processing the image captured by the imaging means, detects a predetermined reference position in said pixel, reference the reference position and controlling the irradiation timing of the exposure light of the exposure optical system in the, a control hand stage exposing the image of the opening portion of the mask at a predetermined position of the subject to be exposed consistent with a position for imaging by the imaging means, A pitch of the array of the plurality of light receiving elements is smaller than a length of the pixel in a direction orthogonal to a moving direction of the object to be exposed .

With such a configuration, conveying the object to be exposed at a constant speed by the conveying means, it is formed in an elongated shape in a direction perpendicular to the moving direction of the subject to be exposed by the transport means openings of the mask, the mask openings Exposure of matrix pixels longer than the length in the longitudinal direction and continuously arranged in a line in a direction orthogonal to the direction of movement of the object to be exposed by the conveying means , and the arrangement pitch thereof being formed in advance on the object to be exposed An exposure optical system is provided with a reference pattern having the above-mentioned pixels formed in advance on an object to be exposed by an imaging means having a plurality of light receiving elements arranged so as to be smaller than the length in a direction perpendicular to the moving direction of the body. captured through an image lens, the control unit, by processing the image captured by the imaging unit, detect a preset reference position in said pixel comprises an exposure optical system, based on the The exposure image of the exposure light from the source is controlled, and the image of the opening of the mask formed in a slender shape in the direction perpendicular to the direction of movement of the object to be exposed by the conveying means that is interposed on the optical path by the imaging lens Is imaged and exposed at a predetermined position of the object to be exposed that coincides with the position imaged by the imaging means. Thereby, the exposure position by an exposure optical system and the imaging position by an imaging means are made to correspond, and exposure accuracy is improved.

  The light source is a flash lamp that intermittently emits exposure light. Thereby, the exposure light is intermittently emitted by the flash lamp.

  Further, the control means calculates a deviation between an exposure planned position of the opening of the mask defined in the reference pattern and an actual exposure position based on the reference position, and either the transport means or the exposure optical system. On the other hand, an alignment means for correcting the deviation calculated by the control means is provided. As a result, the deviation between the planned exposure position of the mask opening defined in the reference pattern by the alignment means and the actual exposure position is corrected.

  Further, the mask is configured such that a single elongated opening is formed in an opaque member in a direction orthogonal to the moving direction of the object to be exposed in an exposure member, and the length of the opening in the longitudinal direction can be changed. It is what. Thereby, the length in the longitudinal direction of the opening formed in the opaque member in the exposure region in the direction orthogonal to the moving direction of the object to be exposed is changed as necessary.

According to the invention of claim 1, longer than the longitudinal length of the opening of the mask, in a row in succession in a direction perpendicular to the moving direction of the subject to be exposed by the conveying means, and the arrangement pitch The object to be exposed is fixed by an imaging means having a plurality of light receiving elements arranged in advance so as to be smaller than the length in the direction orthogonal to the moving direction of the object to be exposed of the matrix-shaped pixels formed in advance on the object to be exposed. imagewise Taking a reference pattern having a preformed said pixel while moving at a speed object to be exposed, by the control means, by processing the image captured by the imaging means, the preset reference position in said pixel The exposure light irradiation timing is controlled with reference to the reference position, and the exposure optical system is elongated in a direction perpendicular to the moving direction of the object to be exposed by the conveying means interposed in the optical path. The image of the opening portion of the formed mask by which is adapted to expose a predetermined position of the object to be exposed, it is possible to efficiently exposed to wide exposure region using a mask. Further, the position on the near side of the exposure position by the exposure optical system in the transport direction of the object to be exposed is longer than the length in the longitudinal direction of the opening of the mask, and is continuous in the direction orthogonal to the moving direction of the object to be exposed by the transport means. The image pickup means can be picked up by an image pickup means having a plurality of light receiving elements which are arranged in a line and whose arrangement pitch is smaller than the length of the pixel in the direction orthogonal to the moving direction of the exposed object. Since the exposure position on the object to be exposed is set based on the reference position of the pixel imaged in (1), the exposure accuracy can be improved. Further, the mask size can be reduced by using a mask in which an elongated opening is formed in a direction orthogonal to the moving direction of the object to be exposed by the conveying means. Therefore, the cost of the mask can be reduced, the exposure optical system can be miniaturized, and the cost of the apparatus can be reduced.

  According to the second aspect of the present invention, the image of the opening of the mask is formed on the object to be exposed using the imaging lens, and the mask is exposed to the object to be exposed. They can be spaced apart, reducing the risk of soiling or damaging the mask.

Furthermore, according to the invention according to claim 3, an imaging lens of an exposure optical system, longer than the length in the longitudinal direction of the opening of the mask, continuous in the direction perpendicular to the moving direction of the subject to be exposed by the transport means A plurality of light-receiving elements arranged in a row and arranged so that the arrangement pitch thereof is smaller than the length in the direction orthogonal to the moving direction of the exposed body of the matrix-like pixels formed in advance on the exposed body share an imaging lens of the imaging means with, preformed in the optical path of the exposure optical system is reflected by the beam splitter which is arranged to be inclined between the imaging lens and the mask the object to be exposed above imaging a reference pattern having a pixel, the control unit, by processing the image captured by the imaging unit, detect a preset reference position in said pixel, dew based on the reference position By which is adapted to control the irradiation timing of the light, it matches the imaging position and the exposure position, it is possible to further improve the exposure precision. In addition, the use of a mask having an elongated opening in a direction perpendicular to the moving direction of the object to be exposed by the transport means can reduce the mask size, thereby reducing the cost of the mask. In addition, the exposure optical system can be miniaturized and the cost of the apparatus can be reduced.

  Furthermore, according to the fourth aspect of the invention, the use of the flash lamp as the light source makes it easy to control the exposure light irradiation timing.

  According to the fifth aspect of the present invention, the control means for calculating the deviation between the planned exposure position of the mask opening defined in the reference pattern and the actual exposure position based on the reference position, and the alignment for correcting the deviation. By providing the means, alignment adjustment can be performed before the object to be exposed is moved to the next exposure position. Therefore, the alignment time can be shortened and exposure can be performed with high accuracy at any location in the exposure region.

  According to the sixth aspect of the present invention, the elongated member is formed in the opaque region in the exposure region in the direction orthogonal to the moving direction of the object to be exposed, and the length of the opening in the longitudinal direction is formed. Since the height can be changed, it is possible to cope with exposure patterns having different sizes by changing the length of the opening in the longitudinal direction.

1 is a conceptual diagram showing a first embodiment of an exposure apparatus according to the present invention. It is explanatory drawing which shows the relationship with the opening part of an imaging means, a mask, and the to-be-exposed area | region of a black matrix. It is a block diagram which shows the first half part of a processing system in the internal structure of an image processing part. It is a block diagram which shows the latter half part of a processing system in the internal structure of an image processing part. 6 is a flowchart for explaining the operation of the exposure apparatus according to the present invention. It is explanatory drawing which shows the method of binarizing the output of a ring buffer memory. It is explanatory drawing which shows the image of the 1st reference position preset to the pixel of a black matrix, and its lookup table. It is explanatory drawing which shows the image of the 2nd reference position previously set to the pixel of the black matrix, and its lookup table. It is a figure explaining the method to adjust the inclination of a color filter board | substrate. It is a figure explaining the alignment adjustment method of the Y-axis direction of a color filter substrate. It is a figure explaining the other method of alignment adjustment of the Y-axis direction of a color filter substrate. It is a figure which shows the other structural example of a mask, (a) is a top view, (b) is a cross-sectional view. It is a side view which shows the principal part of 2nd Embodiment of the exposure apparatus by this invention.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a conceptual view showing a first embodiment of an exposure apparatus according to the present invention. This exposure apparatus 1 irradiates exposure light by an exposure optical system and exposes an image of an opening of a mask interposed on the path of the exposure optical system on an object to be exposed. The imaging unit 3, the transport unit 4, and the control unit 5 are provided. Hereinafter, a color filter substrate of a liquid crystal display element will be described as an example of the object to be exposed.

  The exposure optical system 2 irradiates a color filter substrate 6 coated with a photosensitive agent with exposure light to expose a predetermined color filter pattern, and includes a light source 7, a mask stage 8, and an imaging lens 9. And.

  The light source 7 is, for example, a lamp that emits ultraviolet light, and is a flash lamp that emits light intermittently under the control of the control means 5 described later. The mask stage 8 is used to place and hold the mask 10 and is interposed on an optical path between the light source 7 and an imaging lens 9 described later. The imaging lens 9 forms an image of the opening 10 a of the mask 10 on the color filter substrate 6 and is disposed so as to face the color filter substrate 6. The mask 10 is formed by forming one elongated opening 10a in the direction orthogonal to the moving direction (arrow A direction) of the color filter substrate 6 in the exposure region, and in the first embodiment, The openings 10a are formed to correspond to, for example, five pixels 12 arranged in a line in the horizontal direction of the black matrix 11 as shown in FIG. The light source 7 may be a normal ultraviolet lamp instead of a flash lamp. In this case, the intermittent irradiation of the exposure light may be performed, for example, by providing a shutter in front of the exposure light irradiation direction and controlling the opening and closing of the shutter.

  Further, an imaging unit 3 is provided with an imaging position in front of an exposure position by the exposure optical system 2 in the moving direction of the color filter substrate 6 (arrow A direction). The image pickup means 3 picks up the pixels 12 of the black matrix 11 as a reference pattern formed in advance on the color filter substrate 6 and is, for example, a line CCD in which light receiving elements are arranged in a line. Here, as shown in FIG. 2, the imaging position of the imaging means 3 and the exposure position by the exposure optical system 2 are separated by a predetermined distance D, and after the pixel 12 is imaged by the imaging means 3. The pixel 12 reaches the exposure position after a predetermined time has elapsed. In addition, the said distance D is so preferable that it is small. Thereby, the movement error of the color filter substrate 6 can be reduced, and the exposure position can be more accurately positioned with respect to the pixel 12. As shown in the figure, the imaging center of the imaging means 3 and the center of the opening 10a of the mask 10 are the optical axes of the imaging lens 9 in the transport direction (arrow A direction) of the color filter substrate 6. It is arrange | positioned so that it may correspond to the surface containing. Further, illumination means (not shown) is provided in the vicinity of the imaging means 3 so that the imaging area of the imaging means 3 can be illuminated.

  Further, a conveying means 4 is provided below the exposure optical system 2. The transport means 4 is configured such that the color filter substrate 6 is placed on the stage so as to be movable in the XY axis direction, and a transport motor (not shown) is controlled by the control means 5 so as to move the stage 4a. It has become. Note that the X-axis direction coincides with the conveyance direction (arrow A direction) of the color filter substrate 6 and the Y-axis direction is a direction orthogonal thereto. Further, the transport means 4 is provided with a position detection sensor and a speed sensor (not shown) such as an encoder and a linear sensor, and the output is fed back to the control means 5 to enable position control and speed control. Yes. Further, the transport unit 4 is provided with an alignment unit 29, which calculates a shift between the exposure planned position in the black matrix 11 and the exposure position of the opening 10a of the mask 10 based on the reference position, and the stage 4a. The displacement can be corrected by moving the rotation angle or the position in the Y-axis direction. The angle of the stage 4a can be detected by an angle sensor.

  A control unit 5 is provided in connection with the light source 7, the imaging unit 3, and the transport unit 4. The control unit 5 controls the entire apparatus to be appropriately driven. The image processing unit 13 detects a reference position set in advance for the pixel 12 imaged by the imaging unit 3, and the black matrix 11. Pixels using the storage unit 14 for storing the design data and the look-up table data corresponding to the reference position, the distance D between the imaging position and the exposure position, and the moving speed V of the color filter substrate 6 The position t of the opening 10a of the mask 10 and the planned exposure position (hereinafter referred to as “exposed area”) calculated based on the reference position is calculated by calculating the time t during which 12 moves from the imaging position to the exposure position. A calculating unit 15 for calculating a deviation, a lamp controller 16 for controlling the irradiation timing of the exposure light of the light source 7 with reference to the reference position, and a stay of the conveying means 4 The includes a transfer means controller 17 for driving the alignment means comprising a conveying means 4 to drive at a predetermined speed in the X-axis direction, and a control unit 18 for controlling integrated the entire apparatus.

  3 and 4 are block diagrams illustrating an example configuration of the image processing unit 13. As shown in FIG. 3, the image processing unit 13 includes, for example, three ring buffer memories 19A, 19B, 19C connected in parallel, and, for example, three lines connected in parallel for each of the ring buffer memories 19A, 19B, 19C. A buffer circuit 20A, 20B, and 20C; a comparator circuit 21 that is connected to the line buffer memories 20A, 20B, and 20C and compares the determined threshold value and outputs gray level data; and the nine line buffer memories A look-up table of image data corresponding to the first reference position that defines the left end of the exposure area obtained from the output data 20A, 20B, and 20C and the storage unit 14 shown in FIG. 1 (hereinafter referred to as “left end LUT”) Left end determination circuit 22 that outputs a left end determination result when both data match, The output data of the nine line buffer memories 20A, 20B, and 20C and a look-up table (hereinafter referred to as image data) corresponding to the second reference position that defines the right end of the exposed area obtained from the storage unit 14 shown in FIG. And a right end determination circuit 23 that outputs a right end determination result when the two data match each other.

  As shown in FIG. 4, the image processing unit 13 receives the left end determination result and counts the number of coincidence of image data corresponding to the first reference position, and the output of the counting circuit 24A. 1 is compared with the left end pixel number obtained from the storage unit 14 shown in FIG. 1, and when both numerical values match, a comparison circuit 25A that outputs a left end designation signal to the storage unit 14 and the right end determination result are input. The counting circuit 24B that counts the number of times that the image data corresponding to the second reference position is matched, and the output of the counting circuit 24B and the rightmost pixel number obtained from the storage unit 14 shown in FIG. A comparison circuit 25B that outputs a right end designation signal to the storage unit 14, a left end pixel counting circuit 26 that counts the left end pixel number n based on the output of the counting circuit 24A, and the left end pixel. A comparison circuit that compares the output of the counting circuit 26 with the exposure end pixel column number N obtained from the storage unit 14 shown in FIG. 1 and outputs an exposure end pixel column designation signal to the storage unit 14 when both values match. 27. The counting circuits 24A and 24B are reset by the reading start signal when the reading operation by the imaging means 3 is started. Further, the left end pixel counting circuit 26 is reset by an exposure end signal when the exposure for a predesignated region is completed.

Next, the operation of the exposure apparatus configured as described above will be described with reference to the flowchart of FIG.
First, when the exposure apparatus 1 is turned on, the image pickup means 3, the illumination means, and the control means 5 shown in FIG. 1 are activated to enter a standby state. Next, when the color filter substrate 6 is placed on the stage 4 a of the transport unit 4 and a switch (not shown) is operated, the transport unit 4 is controlled by the transport unit controller 17 of the control unit 5 to be controlled by the color filter. The substrate 6 is transported at a constant speed in the direction of arrow A. When the color filter substrate 6 reaches the imaging position of the imaging means 3, an exposure operation is executed according to the following procedure.

  First, in step S <b> 1, the image of the pixel 12 of the black matrix 11 is acquired by the imaging unit 3. The acquired image data is captured and processed in the three ring buffer memories 19A, 19B, and 19C of the image processing unit 13 shown in FIG. Then, the latest three data are output from each ring buffer memory 19A, 19B, 19C. In this case, for example, the previous data is output from the ring buffer memory 19A, the previous data is output from the ring buffer memory 19B, and the latest data is output from the ring buffer memory 19C. Further, for each of these data, for example, 3 × 3 CCD pixel images are arranged on the same clock (time axis) by three line buffer memories 20A, 20B, and 20C. The result is obtained as an image as shown in FIG. When this image is digitized, it corresponds to a numerical value of 3 × 3 as shown in FIG. Since these digitized images are arranged on the same clock, they are compared with a threshold value by a comparison circuit and binarized. For example, if the threshold value is “45”, the image in FIG. 10A is binarized as shown in FIG.

  In step S2, the reference positions at the left and right ends of the exposed area are detected. Specifically, the reference position is detected in the left end determination circuit 22 by comparing the binarized data with the data of the left end LUT obtained from the storage unit 14 shown in FIG.

  For example, when the first reference position for designating the left end of the exposure area is set at the upper left corner of the pixel 12 of the black matrix 11 as shown in FIG. Is as shown in FIG. 5B, and the data of the left-end LUT at this time is “000011011”. Therefore, the binarized data is compared with the data “000011011” of the left end LUT, and when the two data match, it is determined that the image data acquired by the imaging unit 3 is the first reference position, The left end determination result is output from the left end determination circuit 22. When five pixels 12 are arranged as shown in FIG. 10, the upper left corner of each pixel 12 corresponds to the first reference position.

Based on the determination result, the number of matches is counted in the counting circuit 24A shown in FIG. Then, the count number is compared with the left end pixel number obtained from the storage unit 14 shown in FIG. 1 in the comparison circuit 25A, and a left end designation signal is output to the storage unit 14 when both numerical values match. In this case, as shown in FIG. 10, for example, when determining the first pixel 12 ₁ as the leftmost pixel number, upper left end corner portion of the pixel 12 ₁ is set to the first reference position. Therefore, the element address in the line CCD of the image pickup means 3 corresponding to the first reference position, for example, EL ₁ is stored in the storage unit 14.

  On the other hand, the binarized data is compared with data in the right end LUT obtained from the storage unit 14 shown in FIG. For example, when the second reference position for designating the right end of the exposure area is set at the upper right corner of the pixel 12 of the black matrix 11 as shown in FIG. Is as shown in FIG. 5B, and the data of the right end LUT at this time is “000110110”. Therefore, the binarized data is compared with the data “000110110” of the right end LUT, and when the two data match, the image data acquired by the imaging means 3 is the right end reference position of the exposed area. The right end determination result is output from the right end determination circuit 23. Similarly to the above, when five pixels 12 are arranged as shown in FIG. 10, for example, the upper right corner of each pixel 12 corresponds to the second reference position.

Based on the determination result, the number of matches is counted in the counting circuit 24B shown in FIG. Then, the count number is compared with the right end pixel number obtained from the storage unit 14 shown in FIG. 1 in the comparison circuit 25B, and a right end designation signal is output to the storage unit 14 when both numerical values match. In this case, as shown in FIG. 10, for example, when determining the 5 th pixel 12 ₅ as the rightmost pixel number, right upper corner of the pixel 12 ₅ is set as the second reference position. Therefore, the element address in the line CCD of the image pickup means 3 corresponding to the second reference position, for example, EL ₅ is stored in the storage unit 14. When the left and right reference positions of the exposure area are detected as described above, the process proceeds to step S3.

In step S3, as shown in FIG. 9, the calculation unit 15 calculates the inclination angle θ of the color filter substrate 6 with respect to the transport direction based on the detection times t1 and t2 of the first reference position and the second reference position. Is done. For example, when the transport speed is V, the amount of deviation between the first reference position and the second reference position in the transport direction is (t1-t2) V. Further, the interval between the first reference position and the second reference position is set such that the element address EL ₁ of the imaging means 3 corresponding to the first reference position and the imaging corresponding to the second reference position are shown in FIG. Based on the element address EL ₅ of the means 3, it can be obtained from K ( EL ₅ -EL ₁ ). Note that K is an imaging magnification. Therefore, the inclination angle θ of the color filter substrate 6 is
θ = arctan (t1−t2) V / {K ( EL ₅ −EL ₁ )}
Can be obtained by calculating.

  When the tilt angle θ is calculated, the alignment unit 29 of the transfer unit 4 is driven by the transfer unit controller 17 to rotate the stage 4a by the angle θ. As a result, as shown in FIG. 10, each side of the exposed area of the black matrix 11 and each side of the opening 10 a of the mask 10 become parallel.

Next, in step S4, the calculation unit 15 calculates an intermediate position between the first reference position and the second reference position. Specifically, based on the element address EL ₁ of the imaging means 3 corresponding to the first reference position read from the storage unit 14 and the element address EL ₅ of the imaging means 3 corresponding to the second reference position, the intermediate The position can be obtained by ( EL ₁ + EL ₅ ) / 2.

Next, in step S5, it is determined whether or not the intermediate position obtained in step S4 matches the imaging center (element address EL _c ) of the imaging means 3. If “NO determination” is determined here, the process proceeds to step S6.

In step S6, the alignment unit 29 is controlled by the transport unit controller 17 and is indicated by an arrow B in the Y-axis direction by K {EL _C − (EL ₁ + EL ₅ ) / 2} as shown in FIG. The stage 4a is moved in the direction. As a result, as shown in FIG. 2, the center position of the exposed region and the imaging center of the imaging means 3 (or the central position of the opening 10a of the mask 10) coincide. Then, the process proceeds to step S7.

  On the other hand, also when it becomes "YES determination" in step S5, it progresses to step S7.

  In step S <b> 7, it is determined whether or not the exposure area of the black matrix 11 is set at the exposure position of the exposure optical system 2. This determination is based on the detection time t1 of the first reference position stored in the storage unit 14, the width W and the transport speed V of the pixel 12 in the transport direction shown in FIG. 2, and the distance D between the imaging position and the exposure position. The time t during which the color filter substrate 6 is transported by the distance D after the center position of the pixel row is imaged by the imaging means 3 is calculated by the calculation unit 15 and is managed by managing the time t. If it is determined that the time t has elapsed, that is, the exposure area of the black matrix 11 has been set to the exposure position (“YES determination”), the process proceeds to step S8.

  In step S8, the lamp controller 16 is activated to cause the light source 7 to emit light for a predetermined time. In this case, since the color filter substrate 6 is moving at a constant speed, the edge in the conveyance direction of the exposure pattern may be blurred. Therefore, the conveyance speed, the exposure time, and the power of the light source 7 are set in advance so that the blur amount becomes an allowable value.

  In step S9, the leftmost pixel number n is counted by the leftmost pixel counting circuit 26 shown in FIG. In step S10, the leftmost pixel number n is set in advance and compared with the exposure end pixel column number N stored in the storage unit 14 by the comparator 27, and it is determined whether or not both numerical values match. The

  If “NO determination” is determined in step S10, the process returns to step S1 and proceeds to the operation for detecting the next reference position. In this case, the counting circuits 24A and 24B shown in FIG.

  On the other hand, if “YES determination” is made in step S10, all exposure to a predetermined area of the color filter substrate 6 is completed, and the left end pixel counting circuit 26 is reset by an exposure end signal shown in FIG. Then, the transport unit 4 returns the stage 4a to the start position at high speed.

  When the exposure possible area by the exposure optical system 2 is narrower than the width of the color filter substrate 6, when the step S10 is completed, the stage 4a is moved by a predetermined distance in the Y direction, and the steps S1 to S10 are performed again. Execute and perform exposure on the area adjacent to the already exposed area. Note that a plurality of the exposure optical system 2 and the imaging means 3 may be arranged in a row in the Y-axis direction so that the entire width of the color filter substrate 6 can be exposed once. Further, when the imaging area by the imaging means 3 is narrower than the exposed area, a plurality of imaging means 3 may be installed side by side in the Y-axis direction.

  For convenience of explanation, steps S1 to S10 have been described as a series of operations. However, the detection of the reference position is performed in parallel with the execution of the above steps, and the detection data is stored in the storage unit 14 as needed. Therefore, the θ adjustment of the color filter substrate 6 in step S3 and the Y-axis adjustment of the color filter substrate 6 in step S6 are performed by reading the necessary data from the storage unit 14 and moving the color filter substrate 6 from the previous exposure position to the next. It is executed within the time to move to the exposure position.

  As described above, according to the exposure apparatus 1 of the present invention, the light source is based on the reference position set for the pixel 12 of the black matrix 11 imaged by the imaging means 3 while transporting the color filter substrate 6 at a constant speed. 7 is used to control the light emission timing of the color filter substrate 6, and an image of the aperture 10a is color-filtered using a mask 10 in which an elongated aperture 10a is formed in a direction orthogonal to the moving direction of the color filter substrate 6 in the exposure region. By exposing to the predetermined position of the board | substrate 6, it can expose to a wide exposure area | region efficiently using the small mask 10. FIG.

  Further, the alignment of the angle θ of the stage 4a and the Y axis is adjusted within the time required for the color filter substrate 6 to move from the previous exposure position to the next exposure position based on the reference position. The time can be shortened and the exposure can be performed with high accuracy at any location in the exposure region.

  In the first embodiment, the case where the alignment unit 29 is provided in the transport unit 4 has been described. However, the present invention is not limited to this, and the alignment unit may be provided in a mechanism that holds the exposure optical system 2 and the imaging unit 3. . In this case, the alignment in the Y-axis direction may be performed by moving the mask stage 8 or the imaging lens 9 that holds the mask 10 as shown in FIG. For example, when adjustment is performed by moving the mask stage 8, as shown in FIG. 5A, when the mask stage 8 is shifted in the direction of arrow C, the image on the color filter substrate 6 moves in the direction of arrow D. Therefore, adjustment is performed by shifting the mask stage 8 in the direction opposite to the adjustment direction of the exposure pattern. For example, when adjustment is performed by moving the imaging lens 9, the imaging lens 9 is moved in the same direction as the exposure pattern adjustment direction (arrow E direction) as shown in FIG. .

  FIG. 12 is a diagram illustrating another configuration example of the mask 10. The mask 10 is formed by forming a single elongated opening 10a ′ in a direction perpendicular to the moving direction of the color filter substrate 6 in an exposure region on an opaque member, for example, a black alumite-treated metal member 28. Both end members 28a in the direction (Y-axis direction) orthogonal to the transport direction in the longitudinal direction 10a ′ are movable in the Y-axis direction. Therefore, the alignment in the Y-axis direction is performed by moving the both end members 28a by a predetermined amount. According to this, alignment adjustment in the Y-axis direction can be performed if the both end members 28a are moved by the same amount in the same direction, and the width of the exposure pattern can be arbitrarily set by appropriately setting each movement amount and movement direction of the both end members 28a. can do. This adjustment can be performed by automatic control by the control means 5.

  In the first embodiment, the case where the image of the opening 10a or the slit of the mask 10 is formed on the color filter substrate 6 using the imaging lens 9 has been described. The present invention can also be applied to a proximity exposure apparatus that directly exposes 10 close to the color filter substrate 6.

  FIG. 13 is a side view showing an essential part of a second embodiment of the exposure apparatus according to the present invention. In the second embodiment, a beam splitter 30 is disposed between the mask stage 8 and the imaging lens 9 to form an exposure optical system 2 ′, and the reflection on the imaging lens side reflecting surface 30a of the beam splitter 30 is reflected. The imaging means 3 is disposed so as to be able to receive light, and the imaging lens 9 is shared with an imaging lens that forms an image of the black matrix 11 formed on the color filter substrate 6 on the light receiving element surface of the imaging means 3. It is like that. Here, in FIG. 13, reference numeral 31 denotes an illumination light source, and reference numeral 32 denotes a half mirror. The imaging position of the imaging means 3 can be illuminated through the imaging lens 9. Note that by selecting the wavelength of light from the light source 7, the exposure light source 7 can also be used for illumination instead of the illumination light source 31 of the imaging means 3.

  In the second embodiment configured as described above, the black color on the color filter substrate 6 is conveyed by the image pickup unit 3 via the imaging lens 9 while the color filter substrate 6 is conveyed at a constant speed in the direction of arrow A by the conveyance unit 4. The pixel 12 of the matrix 11 is imaged, the reference position preset in the pixel 12 imaged by the imaging means 3 is detected by the control means 5, and the mask 10 is based on the reference position in the same manner as in the first embodiment. And the color filter substrate 6 are adjusted, the light source 7 of the exposure optical system 2 is caused to emit light, and an image of the opening 10a of the mask 10 is formed at a predetermined position of the color filter substrate 6 by the imaging lens 9. The image is exposed.

  As described above, according to the second embodiment, since the imaging lens 9 of the exposure optical system 2 ′ and the imaging lens of the imaging means 3 are shared, the exposure position and the imaging of the exposure optical system 2 ′ are captured. When the imaging position of the means 3 coincides and the planned exposure position on the color filter substrate 6 is imaged and detected by the imaging means 3, exposure can be performed immediately, and the exposure accuracy is further improved as compared with the first embodiment. Can do.

  In the first and second embodiments, the case where the alignment means is provided has been described. However, the deviation amount between the exposure position and the actual exposure position is allowed only by setting the color filter substrate 6 on the stage 4a. If it can fall within the range, the alignment means is unnecessary.

  In the first and second embodiments, the case where the color filter substrate 6 is used as the object to be exposed has been described. However, the present invention is not limited to this, and the substrate having a predetermined pattern arranged in a matrix is used. Can also be applied.

DESCRIPTION OF SYMBOLS 1 ... Exposure apparatus 2, 2 '... Exposure optical system 3 ... Imaging means 4 ... Conveyance means 5 ... Control means 6 ... Color filter substrate (exposed body)
7 ... Light source 9 ... Imaging lens 10 ... Mask 10a, 10a '... Opening 11 ... Black matrix (reference pattern)
12 ... Pixel 29 ... Alignment means 30 ... Beam splitter 30a ... Imaging lens side reflecting surface

Claims (6)

An exposure optical system that irradiates an object to be exposed with exposure light from a light source; and a conveying unit that is disposed opposite to the exposure optical system and that carries the object to be exposed and conveys the object at a constant speed. An exposure apparatus that exposes an image of an opening of a mask interposed on an optical path of an optical system on the object to be exposed,
The opening of the mask is formed in an elongated shape in a direction perpendicular to the moving direction of the object to be exposed by the transport unit,
Said longitudinal opening in the mask greater than the length, has a plurality of light receiving elements wherein Ru formed by arranging in a row in succession in a direction perpendicular to the moving direction of the subject to be exposed by said conveying means, the object to be An image pickup means for picking up an image of a reference pattern having matrix-shaped pixels formed in advance on the object to be exposed, with an image pickup position on the near side of the exposure position by the exposure optical system in the moving direction of the exposure object;
By processing an image picked up by the image pickup means, a reference position preset for the pixel is detected, exposure light irradiation timing of the exposure optical system is controlled based on the reference position, and a control hand stage exposing the image of the opening portion of the mask at a predetermined position of the exposure member,
The exposure apparatus according to claim 1, wherein a pitch of the array of the plurality of light receiving elements is smaller than a length of the pixel in a direction orthogonal to a moving direction of the object to be exposed .   2. The exposure apparatus according to claim 1, wherein the exposure optical system includes an imaging lens that forms an image of the opening of the mask on the object to be exposed. An exposure apparatus that irradiates an object with exposure light from a light source through a mask having a predetermined opening, and exposes an image of the opening of the mask on the object to be conveyed,
A transport means for transporting the object to be exposed at a constant speed;
An imaging lens that is disposed above the conveying means and forms an image of the opening of the mask disposed on the optical path from the light source to the object to be exposed on the object to be exposed, and the image forming lens and includes an exposure optical system having an arrangement beam splitter inclined on the optical path between the mask,
The opening of the mask is formed in an elongated shape in a direction perpendicular to the moving direction of the object to be exposed by the transport unit,
Longer than the longitudinal length of the opening of said mask having a plurality of light receiving elements wherein Ru formed by arranging in a row in succession in a direction perpendicular to the moving direction of the subject to be exposed by said conveying means, said beam An imaging means arranged to receive the reflected light from the reflecting surface on the imaging lens side of the splitter, and to image a reference pattern having a matrix of pixels formed in advance on the object to be exposed through the imaging lens ; Prepared ,
By processing the image picked up by the image pickup means, a reference position preset in the pixel is detected, the exposure light irradiation timing of the exposure optical system is controlled based on the reference position, and the image pickup a control hand stage exposing the image of the opening portion of the mask at a predetermined position of the subject to be exposed consistent with a position for imaging by means,
The exposure apparatus according to claim 1, wherein a pitch of the array of the plurality of light receiving elements is smaller than a length of the pixel in a direction orthogonal to a moving direction of the object to be exposed .   The exposure apparatus according to claim 1, wherein the light source is a flash lamp that intermittently emits exposure light. The control means calculates a deviation between an exposure planned position of the opening of the mask defined in the reference pattern and an actual exposure position based on the reference position,
5. The exposure apparatus according to claim 1, wherein an alignment unit that corrects the deviation calculated by the control unit is provided in one of the transport unit and the exposure optical system. .   The mask is configured such that a single elongated opening is formed in an opaque member in a direction orthogonal to the moving direction of the object to be exposed in an exposure region, and the length in the longitudinal direction of the opening can be changed. The exposure apparatus according to any one of claims 1 to 5, wherein:

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