JP4876415B2 - Organic EL device manufacturing method, device manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing an organic EL device (organic electroluminescence device) and a method for manufacturing a device represented by a color filter and the like.

In recent years, a technique for manufacturing an organic EL device has been developed by an ink jet method in which a light emitting material such as an organic fluorescent material is converted into an ink and the ink is ejected onto a substrate (for example, see Patent Document 1).
JP 2002-22932 A

  When an organic EL device is manufactured using an inkjet method as in Patent Document 1, a bank (partition wall) is formed around a pixel, and ink is ejected to a region surrounded by the bank. Such a bank is made liquid-repellent by fluorine treatment so that when ink is applied, color mixing, white spots, and ink do not leak out. Since the fluorinated bank has very high liquid repellency, and the bank and the ink are in a repulsive relationship, the film shape obtained after drying the ink hangs around the pixel (near the bank), and the pixel There are cases where the shape is raised at the center, or sags around the pixel (near the bank), rises slightly inside, and is recessed at the center of the pixel. When such a film shape is obtained, the flatness of the film is lost, which may be a cause of reducing the light emission characteristics.

  The present invention has been made in order to solve the above-described problems. The object of the present invention is to provide a method for forming an irregular surface on a surface of a functional layer when the functional layer is formed using an inkjet method in a method of manufacturing an inkjet device. An object of the present invention is to provide a technique that can provide a small flat surface and does not deteriorate the light emission characteristics. Another object of the present invention is to provide a method for suitably manufacturing a device represented by a color filter or the like by a similar technique.

  In order to solve the above-described problems, a method for manufacturing an organic EL device according to the present invention includes, as a first aspect, a partition portion forming step for forming a partition portion for partitioning pixels on a substrate, and a surface of the partition portion. A liquid repellent process for making liquid repellent, and a coating process for applying a liquid composition in which a material for forming a functional layer constituting at least a part of the organic EL element is dissolved or dispersed in a solvent in a region surrounded by the partition wall; A drying step of drying the applied liquid composition to form a functional layer, wherein in the coating step, a solvent containing a fluorine group-containing solvent containing a fluorine group is used as the solvent. To do.

  According to such a manufacturing method, a functional layer with high flatness can be formed, and as a result, it is possible to provide an organic EL device with good light emission characteristics that hardly causes uneven light emission. That is, since the liquid composition is composed of a solvent containing a fluorine group-containing solvent so that the liquid composition does not exhibit extreme liquid repellency with respect to the partition wall portion that has been made liquid-repellent, the liquid composition The functional layer formed by coating and drying this has high flatness. Specifically, the functional layer formed of the liquid composition containing the fluorine group-containing solvent hangs around the partition wall and swells around the center of the pixel, or hangs around the partition wall. A functional layer having a flat surface is obtained (see Example 2 in FIG. 11), which rises on the inside and does not easily have a concave shape at the center of the pixel (see Comparative Example 1 in FIG. 11). In the present invention, “applying a liquid composition” means that the liquid composition is formed on a substrate by any method, for example, applying the liquid composition by a spin coating method, or inkjet This includes all application (discharge) of a liquid composition by a method.

  In the production method of the first aspect, it is preferable that the fluorine group-containing solvent is contained in an amount of 10% by volume to 50% by volume in the entire solvent. When the volume content of the fluorine group-containing solvent is less than 10% by volume, the liquid repellency with respect to the partition wall portion becomes too high, and the flatness of the formed functional layer may be lowered. On the other hand, when the volume content exceeds 50% by volume, the lyophilicity to the partition wall portion becomes too high, and the formed functional layer hangs down along the partition wall portion and tends to be concave at the center of the pixel. Flatness may be lowered.

  Next, in order to solve the above-described problem, as a second aspect of the method for manufacturing an organic EL device of the present invention, a partition wall forming step for forming a partition wall partitioning pixels on a substrate, and the partition wall And a liquid composition obtained by dissolving or dispersing a material for forming a functional layer constituting at least a part of the organic EL element in a solvent in a region surrounded by the partition wall. A coating step, a drying step of drying the applied liquid composition to form a functional layer, and the functional layer thus formed are dissolved in a solvent containing a fluorine group-containing solvent containing a fluorine group, and then dried again. And a functional layer flattening step for performing.

  According to such a manufacturing method, a functional layer with high flatness can be formed, and as a result, it is possible to provide an organic EL device with good light emission characteristics that hardly causes uneven light emission. In other words, the functional layer formed by drying the applied liquid composition is redissolved using a solvent containing a fluorine group-containing solvent, and then re-dried to improve the flatness of the functional layer. Specifically, the functional layer that is re-formed with the solvent containing the fluorine group-containing solvent hangs around the partition wall, rises around the center of the pixel, or hangs around the partition wall. It is a functional layer that rises on the inside and does not easily have a concave shape at the center of the pixel, and has a flat surface. In the present invention, “applying a liquid composition” means that the liquid composition is formed on a substrate by any method, for example, applying the liquid composition by a spin coating method, or inkjet This includes all application (discharge) of a liquid composition by a method.

  About each aspect of the said manufacturing method, in the said liquid-repellent process, the surface of the said partition part shall be fluorinated. By such fluorination treatment, the surface of the partition wall can be suitably made liquid repellent, and the affinity with the solvent containing the fluorine group-containing solvent is also improved, and the effect of improving the flatness of the functional layer is more remarkable. It will be a thing.

  Next, in order to solve the above-described problem, a device manufacturing method according to the present invention includes, as a first aspect, a partition wall forming step of forming a partition wall partitioning a predetermined region on a substrate, A liquid repellent process for repelling the surface, and a coating process for applying a liquid composition in which a material for forming a functional layer constituting at least part of the device is dissolved or dispersed in a solvent in a region surrounded by the partition wall And a drying step of drying the applied liquid composition to form a functional layer, wherein in the coating step, a solvent containing a fluorine group-containing solvent containing a fluorine group is used as the solvent. And

  According to such a device manufacturing method, a functional layer with high flatness can be formed, and as a result, it is possible to provide a device in which unevenness of predetermined device characteristics in a predetermined region is unlikely to occur. That is, since the liquid composition is composed of a solvent containing a fluorine group-containing solvent so that the liquid composition does not exhibit extreme liquid repellency with respect to the partition wall portion that has been made liquid-repellent, the liquid composition The functional layer formed by coating and drying this has high flatness. Specifically, the functional layer formed of the liquid composition containing the fluorine group-containing solvent hangs around the partition wall and swells around the center of the pixel, or hangs around the partition wall. It is a functional layer that rises on the inside and does not easily have a concave shape at the center of the pixel, and has a flat surface. In the present invention, “applying a liquid composition” means that the liquid composition is formed on a substrate by any method, for example, applying the liquid composition by a spin coating method, or inkjet This includes all application (discharge) of a liquid composition by a method.

  The device manufacturing method of the present invention includes, as a second aspect thereof, a partition wall forming step for forming a partition wall partitioning a predetermined region on the substrate, and a liquid repellent process for repelling the surface of the partition wall. An application step of applying a liquid composition in which a material for forming a functional layer constituting at least a part of the device is dissolved or dispersed in a region surrounded by the partition wall; and the applied liquid composition A drying step of drying to form a functional layer, and a functional layer flattening step of dissolving the formed functional layer with a solvent containing a fluorine group-containing solvent containing a fluorine group and then drying again. It is characterized by that.

  According to such a device manufacturing method, a functional layer with high flatness can be formed, and as a result, it is possible to provide a device in which unevenness of predetermined device characteristics in a predetermined region is unlikely to occur. In other words, the functional layer formed by drying the applied liquid composition is redissolved using a solvent containing a fluorine group-containing solvent, and then re-dried to improve the flatness of the functional layer. Specifically, the functional layer that is re-formed with the solvent containing the fluorine group-containing solvent hangs around the partition wall, rises around the center of the pixel, or hangs around the partition wall. It is a functional layer that rises on the inside and does not easily have a concave shape at the center of the pixel, and has a flat surface. In the present invention, “applying a liquid composition” means that the liquid composition is formed on a substrate by any method, for example, applying the liquid composition by a spin coating method, or inkjet This includes all application (discharge) of a liquid composition by a method.

  Embodiments of the present invention will be described below with reference to the drawings. In the present embodiment, the structure of an organic EL device manufactured by the manufacturing method according to the present invention will be described, and then the manufacturing method will be described in detail. Further, in the present embodiment, in each drawing, the scale is different for each layer and each member so that each layer and each member has a size that can be recognized on the drawing.

(Organic EL device)
FIG. 1 is an explanatory view showing the wiring structure of an organic EL device manufactured by the manufacturing method according to the present invention, FIG. 2 is a schematic plan view of the organic EL device, and FIG. 3 is the organic EL device. It is a cross-sectional schematic diagram of the display area of an apparatus.

  As shown in FIG. 1, the organic EL device of the present embodiment includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction intersecting the scanning lines 101, and a direction parallel to the signal lines 102. A plurality of power supply lines 103 extending in a line are respectively wired, and a pixel region P is provided in the vicinity of each intersection of the scanning line 101 and the signal line 102.

Connected to the signal line 102 is a data side driving circuit 104 including a shift register, a level shifter, a video line, and an analog switch. Further, a scanning side driving circuit 105 including a shift register and a level shifter is connected to the scanning line 101.
Further, in each pixel region P, a switching thin film transistor 122 to which a scanning signal is supplied to the gate electrode via the scanning line 101, and a pixel signal supplied from the signal line 102 via this switching thin film transistor 122. A storage capacitor cap that holds the pixel signal, a driving thin film transistor 123 to which a pixel signal held by the storage capacitor cap is supplied to the gate electrode, and the power supply line 103 via the driving thin film transistor 123 In addition, a pixel electrode (anode) 111 into which a driving current flows from the power line 103 and an organic EL layer 110 sandwiched between the pixel electrode 111 and the counter electrode (cathode) 12 are provided. The pixel electrode 111, the counter electrode 12, and the organic EL layer 110 constitute a light emitting element.

  When the scanning line 101 is driven and the switching thin film transistor 122 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor cap, and the driving thin film transistor 123 is turned on / off according to the state of the holding capacitor cap. The off state is determined. Then, current flows from the power supply line 103 to the pixel electrode 111 through the channel of the driving thin film transistor 123, and further current flows to the cathode 12 through the organic EL layer 110. In the organic EL layer 110, light emission occurs according to the amount of current flowing.

As shown in FIG. 3, the organic EL device of the present embodiment includes a transparent substrate 2 made of glass or the like, and a light emitting element unit 11 formed on the substrate 2 including light emitting elements arranged in a matrix. And a cathode 12 formed on the light emitting element portion 11. Here, the display element 10 is configured by the light emitting element portion 11 and the cathode 12.
The substrate 2 is a transparent substrate such as glass, for example, and as shown in FIG. 2, a display region 2a located at the center of the substrate 2 and a non-display region 2c that is located at the periphery of the substrate 2 and surrounds the display region 2a. It is divided into. The display area 2a is an area formed by light emitting elements arranged in a matrix.

  Further, the aforementioned power supply lines 103 (103R, 103G, 103B) are wired in the non-display area 2c. On the both sides of the display area 2a, the above-described scanning side drive circuits 105 and 105 are arranged. Further, on both sides of the scanning side driving circuits 105 and 105, a driving circuit control signal wiring 105a and a driving circuit power wiring 105b connected to the scanning side driving circuits 105 and 105 are provided. On the upper side of the display area 2a in the figure, an inspection circuit 106 for inspecting the quality and defects of the display device during manufacturing or at the time of shipment is arranged.

  In the cross-sectional configuration diagram of FIG. 3, three pixel regions A are illustrated. In the organic EL device of this embodiment, a circuit element unit 14 in which circuits such as TFTs are formed, a light emitting element unit 11 in which an organic EL layer 110 is formed, and a cathode 12 are sequentially stacked on a substrate 2. The light emitted from the organic EL layer 110 to the substrate 2 side passes through the circuit element unit 14 and the substrate 2 and is emitted to the lower side (observer side) of the substrate 2 and from the organic EL layer 110. Light emitted to the opposite side of the substrate 2 is reflected by the cathode 12, passes through the circuit element unit 14 and the substrate 2, and is emitted to the lower side (observer side) of the substrate 2. If a transparent material is used as the cathode 12, light emitted from the cathode side can be emitted. Examples of the transparent cathode material include ITO (indium tin oxide), Pt, Ir, Ni, or Pd.

  In the circuit element portion 14, a base protective film 2c made of a silicon oxide film is formed on the substrate 2, and an island-shaped semiconductor film 141 made of polycrystalline silicon is formed on the base protective film 2c. In the semiconductor film 141, a source region 141a and a drain region 141b are formed by high concentration phosphorus ion implantation. A portion where the phosphorus ions are not introduced is a channel region 141c.

  Further, a transparent gate insulating film 142 covering the base protective film 2c and the semiconductor film 141 is formed, and a gate electrode 143 (scanning line 101) made of Al, Mo, Ta, Ti, W or the like is formed on the gate insulating film 142. A transparent first interlayer insulating film 144a and a second interlayer insulating film 144b are formed on the gate electrode 143 and the gate insulating film 142. The gate electrode 143 is provided at a position corresponding to the channel region 141c of the semiconductor film 141. In addition, contact holes 145 and 146 are formed through the first and second interlayer insulating films 144a and 144b and connected to the source and drain regions 141a and 141b of the semiconductor film 141, respectively.

  On the second interlayer insulating film 144b, a transparent pixel electrode 111 made of ITO or the like is formed by patterning into a predetermined shape, and one contact hole 145 is connected to the pixel electrode 111. The other contact hole 146 is connected to the power supply line 103. In this way, the driving thin film transistor 123 connected to each pixel electrode 111 is formed in the circuit element unit 14.

  The light emitting element unit 11 includes an organic EL layer 110 stacked on each of the plurality of pixel electrodes 111... And a bank unit that is provided between each pixel electrode 111 and the organic EL layer 110 to partition each organic EL layer 110. 112 as a main component. A cathode 12 is disposed on the organic EL layer 110. The pixel electrode 111, the organic EL layer 110, and the cathode 12 constitute a light emitting element. Here, the pixel electrode 111 is made of, for example, ITO, and is patterned in a substantially rectangular shape in plan view. Bank sections 112 are provided so as to partition the pixel electrodes 111.

As shown in FIG. 3, the bank 112 includes an inorganic bank layer (first bank layer) 112a as a first partition located on the substrate 2 side, and an organic substance as a second partition located away from the substrate 2. A bank layer (second bank layer) 112b is stacked. The inorganic bank layer 112a is formed of, for example, TiO ₂ or SiO ₂ , and the organic bank layer 112b is formed of, for example, an acrylic resin or a polyimide resin.

  The inorganic bank layer 112 a and the organic bank layer 112 b are formed so as to run on the peripheral edge of the pixel electrode 111. In plan view, the periphery of the pixel electrode 111 and the inorganic bank layer 112a are arranged so as to partially overlap. The same applies to the organic bank layer 112b, and the organic bank layer 112b is disposed so as to overlap a part of the pixel electrode 111 in a planar manner. The inorganic bank layer 112a is formed so as to protrude further toward the center of the pixel electrode 111 than the edge of the organic bank layer 112b. In this manner, each first stacked portion (projecting portion) 112e of the inorganic bank layer 112a is formed inside the pixel electrode 111, so that a lower opening 112c corresponding to the formation position of the pixel electrode 111 is provided. Yes.

  An upper opening 112d is formed in the organic bank layer 112b. The upper opening 112d is provided so as to correspond to the formation position of the pixel electrode 111 and the lower opening 112c. As shown in FIG. 3, the upper opening 112 d has a wider opening than the lower opening 112 c and is narrower than the pixel electrode 111. In some cases, the upper position of the upper opening 112d and the end of the pixel electrode 111 are substantially the same position. In this case, as shown in FIG. 3, the upper opening 112d of the organic bank layer 112b has an inclined cross section. In this way, the bank 112 has an opening 112g in which the lower opening 112c and the upper opening 112d communicate with each other.

  In the bank portion 112, a region showing lyophilicity and a region showing liquid repellency are formed. The regions showing lyophilicity are the first stacked portion 112e of the inorganic bank layer 112a and the electrode surface 111a of the pixel electrode 111. These regions are surface-treated lyophilically by plasma treatment using oxygen as a processing gas. ing. The regions exhibiting liquid repellency are the wall surface of the upper opening 112d and the upper surface 112f of the organic bank layer 112. The surface of these regions is fluorinated (plasma repellent) by plasma treatment using tetrafluoromethane as a processing gas. Processed liquid).

The organic EL layer 110 includes a hole injection / transport layer 110a laminated on the pixel electrode 111 and a light emitting layer 110b formed adjacent to the hole injection / transport layer 110a.
The hole injection / transport layer 110a has a function of injecting holes into the light emitting layer 110b and a function of transporting holes inside the hole injection / transport layer 110a. By providing such a hole injecting / transporting layer 110a between the pixel electrode 111 and the light emitting layer 110b, device characteristics such as light emitting efficiency and life of the light emitting layer 110b are improved. In the light emitting layer 110b, the holes injected from the hole injection / transport layer 110a and the electrons injected from the cathode 12 are recombined in the light emitting layer to emit light.

  The hole injection / transport layer 110a is located in the lower opening 112c and formed on the pixel electrode surface 111a, and the flat portion 110a1 is formed in the upper opening 112d. The first stacked portion 112e of the inorganic bank layer is located in the upper opening 112d. It is comprised from the peripheral part 110a2 formed on top. Further, depending on the structure, the hole injection / transport layer 110a is formed only on the pixel electrode 111 and between the inorganic bank layers 110a (the lower opening 110c) (on the flat portion described above). Some forms are only formed).

  The light emitting layer 110b is formed over the flat portion 110a1 and the peripheral portion 110a2 of the hole injection / transport layer 110a, and the thickness on the flat portion 111 is in the range of 50 nm to 80 nm. The light emitting layer 110b has three types, a red light emitting layer 110b1 that emits red (R), a green light emitting layer 110b2 that emits green (G), and a blue light emitting layer 110b3 that emits blue (B). As shown in FIG. 5, the light emitting layers 110b1 to 110b3 are arranged in stripes.

Since the peripheral portion 110a2 having a non-uniform thickness is formed on the first stacked portion 112e of the inorganic bank layer, the peripheral portion 110a2 is insulated from the pixel electrode 111 by the first stacked portion 112e, and the peripheral portion 110a2 is formed. Thus, holes are not injected into the light emitting layer 110b. Thereby, current from the pixel electrode 111 flows only in the flat portion 112a1, holes can be transported uniformly from the flat portion 112a1 to the light emitting layer 110b, and only the central portion of the light emitting layer 110b can emit light. The light emission amount in the light emitting layer 110b can be made constant.
Further, since the inorganic bank layer 112a extends further to the center side of the pixel electrode 111 than the organic bank layer 112b, the shape of the joint portion between the pixel electrode 111 and the flat portion 110a1 is trimmed by the inorganic bank layer 112a. Thus, variation in the emission intensity between the light emitting layers 110b can be suppressed.

Furthermore, since the electrode surface 111a of the pixel electrode 111 and the first laminated portion 112e of the inorganic bank layer are lyophilic, the organic EL layer 110 is uniformly adhered to the pixel electrode 111 and the inorganic bank layer 112a, and the inorganic bank layer 112a. As a result, the organic EL layer 110 is not extremely thin, and a short circuit between the pixel electrode 111 and the cathode 12 can be prevented.
Further, since the upper surface 112f of the organic bank layer 112b and the wall surface of the upper opening 112d exhibit liquid repellency, the adhesion between the organic EL layer 110 and the organic bank layer 112b is lowered, and the organic EL layer 110 is removed from the opening 112g. There is no overflow.

  As the hole injection / transport layer forming material, for example, a mixture of a polythiophene derivative such as polyethylenedioxythiophene and polystyrenesulfonic acid can be used. Examples of the material of the light emitting layer 110b include (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyfluorene derivatives, polyvinyl carbazole, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes, or polymers thereof. The material can be used by doping with rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like.

  The cathode 12 is formed on the entire surface of the light emitting element portion 11 and plays a role of flowing a current through the organic EL layer 110 in a pair with the pixel electrode 111. For example, the cathode 12 is formed by laminating a calcium layer and an aluminum layer. At this time, it is preferable to provide a cathode having a low work function on the cathode near the light emitting layer, and in this embodiment, in particular, it plays a role of injecting electrons into the light emitting layer 110b in direct contact with the light emitting layer 110b.

  In some cases, LiF for increasing the light emission efficiency is formed between the light emitting layer 110 b and the cathode 12. The red and green light emitting layers 110b1 and 110b2 are not limited to lithium fluoride, and other materials may be used. Therefore, in this case, a layer made of lithium fluoride may be formed only on the blue (B) light emitting layer 110b3, and layers other than lithium fluoride may be laminated on the other red and green light emitting layers 110b1 and 110b2. Alternatively, only calcium may be formed on the red and green light emitting layers 110b1 and 110b2 without forming lithium fluoride.

The aluminum forming the cathode 12 reflects light emitted from the light emitting layer 110b toward the substrate 2, and is preferably made of an Ag film, an Al / Ag laminated film, or the like in addition to the Al film. Furthermore, an antioxidant protective layer made of SiO, SiO ₂ , SiN or the like may be provided on aluminum.

  In the actual organic EL device, a sealing portion is provided on the light emitting element portion 11 shown in FIG. The sealing portion can be formed by, for example, applying a sealing resin in a ring shape around the substrate 2 and further sealing with a sealing can. The sealing resin is made of a thermosetting resin, an ultraviolet curable resin, or the like, and is particularly preferably made of an epoxy resin that is a kind of thermosetting resin. This sealing portion is provided for the purpose of preventing oxidation of the light emitting layer formed in the cathode 12 or the light emitting element portion 11. Further, a getter agent that absorbs water, oxygen, or the like may be provided inside the sealing can so that water or oxygen that has entered the sealing can can be absorbed.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device will be described with reference to the drawings.
The manufacturing method of the present embodiment includes (1) a bank portion forming step, (2) a bank portion surface treatment step (liquid repellency step), (3) a hole injection / transport layer forming step, (4) a light emitting layer forming step, (5) It has a cathode forming step and (6) a sealing step.
In addition, the manufacturing method demonstrated here is an example, Comprising: Another process is added as needed, A part of said process is removed. The (3) hole injection / transport layer forming step and (4) light emitting layer forming step are performed using a liquid discharge method (inkjet method) using a droplet discharge device.

(1) Bank Portion Forming Step In the bank portion forming step, a bank portion 112 as shown in FIG. The bank part 112 has a structure in which an inorganic bank layer 112a is formed as a first bank layer, and an organic bank layer 112b is formed as a second bank layer.

(1) -1 Formation of Inorganic Bank Layer 112a First, as shown in FIG. 4, the inorganic bank layer 112a is formed at a predetermined position on the substrate. The position where the inorganic bank layer 112 a is formed is on the second interlayer insulating film 144 b and the pixel electrode 111. The second interlayer insulating film 144b is formed on the circuit element portion 14 in which a thin film transistor, a scanning line, a signal line, and the like are arranged. The inorganic bank layer 112a can be made of an inorganic material such as SiO ₂ or TiO ₂ , for example. These materials are formed by, for example, a CVD method, a coating method, a sputtering method, a vapor deposition method, or the like. Furthermore, the film thickness of the inorganic bank layer 112a is preferably in the range of 50 nm to 200 nm, particularly 150 nm.

  The inorganic bank layer 112a is formed in a form having an opening by forming an inorganic film on the entire surface of the interlayer insulating layer 144 and the pixel electrode 111 and then patterning the inorganic film by a photolithography method or the like. This opening corresponds to the formation position of the electrode surface 111a of the pixel electrode 111, and is provided as a lower opening 112c as shown in FIG. At this time, the inorganic bank layer 112a is formed so as to partially overlap with the peripheral edge of the pixel electrode 111, whereby the planar light emitting region of the light emitting layer 110 is controlled.

(1) -2 Formation of Organic Bank Layer 112b Next, an organic bank layer 112b as a second bank layer is formed.
Specifically, as shown in FIG. 4, the organic bank layer 112b is formed on the inorganic bank layer 112a. As the material constituting the organic bank layer 112b, a material having heat resistance and solvent resistance such as acrylic resin and polyimide resin is used. Using these materials, the organic bank layer 112b is formed by patterning using a photolithography technique or the like. When patterning, an upper opening 112d is formed in the organic bank layer 112b. The upper opening 112d is provided at a position corresponding to the electrode surface 111a and the lower opening 112c.

As shown in FIG. 4, the upper opening 112d is preferably formed wider than the lower opening 112c formed in the inorganic bank layer 112a. Furthermore, the organic bank layer 112b preferably has a tapered cross-sectional shape. The bottom surface of the organic bank layer 112b is narrower than the width of the pixel electrode 111, and the top surface of the organic bank layer 112b is substantially the same as the width of the pixel electrode 111. It is preferable to form in the width.
As a result, the first stacked portion 112e surrounding the lower opening 112c of the inorganic bank layer 112a protrudes toward the center of the pixel electrode 111 from the organic bank layer 112b. In this manner, the upper opening 112d formed in the organic bank layer 112b and the lower opening 112c formed in the inorganic bank layer 112a are connected to each other, thereby opening the inorganic bank layer 112a and the organic bank layer 112b. 112g is formed. In the present embodiment, the protruding amount of the portion of the inorganic bank layer 112a protruding toward the center of the pixel electrode 111 has a different value for each pixel. Specifically, each light emitting layer 110b1, 110b2, The protrusion amount is different for each 110b3.

The thickness of the organic bank layer 112b is preferably in the range of 0.1 μm to 3.5 μm, and particularly preferably about 2 μm. The reason for this range is as follows.
That is, when the thickness is less than 0.1 μm, the organic bank layer 112b becomes thinner than the total thickness of the hole injection / transport layer and the light emitting layer, which will be described later, and the light emitting layer 110b may overflow from the upper opening 112d. It is not preferable. On the other hand, if the thickness exceeds 3.5 μm, the step due to the upper opening 112d becomes large, and step coverage of the cathode 12 in the upper opening 112d cannot be secured, which is not preferable. Further, if the thickness of the organic bank layer 112b is 2 μm or more, it is preferable in that the insulation between the cathode 12 and the driving thin film transistor 123 can be enhanced.

(2) Bank part surface treatment process Furthermore, the surface of the formed bank part 112 and the pixel electrode 111 is subjected to an appropriate surface treatment by plasma treatment. Specifically, a lyophobic process on the surface of the bank unit 112 and a lyophilic process for the pixel electrode 111 are performed.

First, the surface treatment of the pixel electrode 111 can be performed by O ₂ plasma treatment using oxygen gas, for example, plasma power 100 kW to 800 kW, oxygen gas flow rate 50 ml / min to 100 ml / min, plate conveyance speed 0.5 mm / min. By processing under conditions of sec to 10 mm / sec and a substrate temperature of 70 ° C. to 90 ° C., the region including the surface of the pixel electrode 111 can be made lyophilic. Moreover, the cleaning of the surface of the pixel electrode 111 and the adjustment of the work function are simultaneously performed by this O ₂ plasma treatment.

Next, the surface treatment of the bank portion 112 can be performed by CF ₄ plasma treatment using tetrafluoromethane. For example, the plasma power is 100 kW to 800 kW, the tetrafluoromethane gas flow rate is 50 ml / min to 100 ml / min, the substrate transport speed is 0. By performing the treatment under conditions of 5 mm / sec to 10 mm / sec and a substrate temperature of 70 ° C. to 90 ° C., the upper opening 112d and the upper surface 112f of the bank 112 can be made liquid repellent.

(3) Hole Injection / Transport Layer Formation Step Next, a hole injection / transport layer is first formed on the pixel electrode 111 in order to form a light emitting element. In the hole injection / transport layer forming step of the present embodiment, an ink jet method is employed, but other liquid phase coating methods such as a spin coating method can be employed.

  As described above, in the hole injection / transport layer forming step, the liquid composition containing the hole injection / transport layer forming material is formed on the electrode surface 111a by an ink jet method, that is, by using, for example, an ink jet device as a droplet discharge device. Discharge. Thereafter, a drying process and a heat treatment are performed to form a hole injection / transport layer 110a on the pixel electrode 111 and the inorganic bank layer 112a. Here, the hole injection / transport layer 110a may not be formed on the first stacked portion 112e, that is, the hole injection / transport layer may be formed only on the pixel electrode 111.

The manufacturing method by inkjet is as follows.
That is, as shown in FIG. 5, a liquid composition containing a hole injection / transport layer forming material is discharged from a plurality of nozzles formed in the inkjet head H1. Here, the composition is filled for each pixel by scanning the ink jet head, but it is also possible to scan the substrate 2. Further, the composition can be filled by moving the inkjet head and the substrate 2 relatively. In addition, in the process performed using the inkjet head after this, said point is the same.

  The ejection by the inkjet head is as follows. That is, the discharge nozzle H2 formed on the ink jet head H1 is disposed to face the electrode surface 111a, and the liquid composition is discharged from the nozzle H2. A bank 112 that defines a lower opening 112c is formed around the pixel electrode 111, and the inkjet head H1 is opposed to the pixel electrode surface 111a located in the lower opening 112c. , The liquid composition droplet 110c of which liquid amount per droplet is controlled is discharged from the discharge nozzle H2 onto the electrode surface 111a.

  As the liquid composition used in this step, for example, a composition obtained by dissolving a mixture of a polythiophene derivative such as polyethylenedioxythiophene (PEDOT) and polystyrenesulfonic acid (PSS) in a polar solvent can be used. Examples of the polar solvent include isopropyl alcohol (IPA), normal butanol, γ-butyrolactone, N-methylpyrrolidone (NMP), 1,3-dimethyl-2-imidazolidinone (DMI) and its derivatives, carbitol acetate And glycol ethers such as butyl carbitol acetate.

  As a more specific composition, a PEDOT / PSS mixture (PEDOT / PSS = 1: 20): 12.52% by weight, IPA: 10% by weight, NMP: 27.48% by weight, DMI: 50% by weight It can be illustrated. The viscosity of the liquid composition is preferably about 1 mPa · s to 20 mPa · s, particularly about 4 mPa · s to 15 mPa · s.

  As shown in FIG. 5, the discharged droplets 110c of the composition spread on the lyophilic electrode surface 111a and the first laminated portion 112e, and are filled in the lower and upper openings 112c and 112d. Even if the first composition droplet 110c deviates from the predetermined ejection position and is ejected onto the upper surface 112f, the upper surface 112f is not wetted by the first composition droplet 110c, and the repelled first composition droplet 110c. Rolls into the lower and upper openings 112c and 112d.

  The amount of the composition discharged onto the electrode surface 111a is the size of the lower and upper openings 112c and 112d, the thickness of the hole injection / transport layer to be formed, and the hole injection / transport layer in the liquid composition. It is determined by the concentration of the forming material. Further, the liquid composition droplets 110c may be discharged not only once but also several times onto the same electrode surface 111a. In this case, the amount of the liquid composition at each time may be the same, and the liquid composition may be changed every time. Furthermore, you may discharge the said liquid composition not only to the same location of the electrode surface 111a but to the different location in the electrode surface 111a every time.

  Next, a drying process as shown in FIG. 6 is performed. That is, the first composition after discharge is dried, the solvent contained in the first composition is evaporated, and the hole injection / transport layer 110a is formed. When the drying process is performed, the evaporation of the solvent contained in the liquid composition mainly occurs near the inorganic bank layer 112a and the organic bank layer 112b, and the hole injection / transport layer forming material is concentrated along with the evaporation of the solvent. To precipitate. As a result, as shown in FIG. 6, a peripheral edge portion 110a2 made of a hole injection / transport layer forming material is formed on the first stacked portion 112e. The peripheral edge 110a2 is in close contact with the wall surface (organic bank layer 112b) of the upper opening 112d. The thickness of the peripheral edge 110a2 is thin on the side close to the electrode surface 111a, and the side remote from the electrode surface 111a, ie, the organic bank layer 112b. It is thicker on the side closer to.

  At the same time, the evaporation of the solvent also occurs on the electrode surface 111a by the drying process, thereby forming the flat portion 110a1 made of the hole injection / transport layer forming material on the electrode surface 111a. Since the evaporation rate of the solvent is almost uniform on the electrode surface 111a, the material for forming the hole injection / transport layer is uniformly concentrated on the electrode surface 111a, thereby forming a flat portion 110a1 having a uniform thickness. . In this way, the hole injection / transport layer 110a composed of the peripheral portion 110a2 and the flat portion 110a1 is formed. Note that the hole injection / transport layer may be formed only on the electrode surface 111a without being formed on the peripheral edge portion 110a2.

  The drying process is performed, for example, in a nitrogen atmosphere at room temperature and a pressure of, for example, about 133.3 Pa (1 Torr). If the pressure is too low, the composition droplets 110c will bump, which is not preferable. On the other hand, if the temperature is higher than room temperature, the evaporation rate of the polar solvent increases and a flat film cannot be formed. After the drying treatment, it is preferable to remove the polar solvent and water remaining in the hole injecting / transporting layer 110a by performing heat treatment in nitrogen, preferably in vacuum, at 200 ° C. for about 10 minutes.

  In the hole injecting / transporting layer forming step, the discharged composition droplet 110c is filled in the lower and upper openings 112c and 112d, while the liquid repellent treated organic bank layer 112b is used as a liquid composition. Objects are repelled and roll into the lower and upper openings 112c and 112d. Thus, the discharged droplets 110c of the composition can be surely filled in the lower and upper openings 112c and 112d, and the hole injection / transport layer 110a can be formed on the electrode surface 111a.

(3) Light emitting layer forming step The light emitting layer forming step includes a light emitting layer forming material discharging step and a drying step.
Here, prior to the light emitting layer forming material discharge step, the surface of the flat portion 110a1 of the hole injection / transport layer 110a formed as shown in FIG. On the other hand, the peripheral portion 110a2 and the bank portion 112 surface are made lyophobic by CF ₄ plasma treatment. Then, after the surface treatment step, the liquid composition for forming the light emitting layer is discharged onto the hole injection / transport layer 110a by the ink jet method in the same manner as the hole injection / transport layer formation step described above. Thereafter, the discharged liquid composition is dried (and heat-treated) to form the light emitting layer 110b on the hole injection / transport layer 110a.

FIG. 7 shows a discharging process of a liquid composition containing a light emitting layer forming material by an ink jet method. As illustrated, the inkjet head H5 and the substrate 2 are relatively moved, and a liquid composition containing a light emitting layer forming material for each color (for example, blue (B) in this case) is ejected from an ejection nozzle H6 formed on the inkjet head. Is done.
At the time of discharge, the liquid composition is discharged while the discharge nozzle is opposed to the hole injection / transport layer 110a located in the lower and upper openings 112c and 112d and the inkjet head H5 and the substrate 2 are relatively moved. The The amount of liquid discharged from the discharge nozzle H6 is controlled per drop. Thus, the liquid (liquid composition droplet 110e) whose liquid amount is controlled is discharged from the discharge nozzle, and the liquid composition droplet 110e is discharged onto the hole injection / transport layer 110a.

  In the present embodiment, following the arrangement of the liquid composition droplets 110e, another liquid composition for the light emitting layer is discharged. That is, as shown in FIG. 8, the liquid composition droplets 110f and 110g are ejected and arranged without drying the liquid composition droplets 110e dropped on the substrate 2. When the liquid composition droplets 110e to 110g for forming the light emitting layers 110b1 to 110b3 for the respective colors are dropped as described above, a plurality of ejection heads respectively filled with the liquid compositions for the respective colors are independently scanned. The liquid composition droplets 110e to 110g may be arranged on the substrate 2 and the liquid compositions 110e to 110f can be arranged almost simultaneously by scanning the plurality of ejection heads integrally. Also good.

  As shown in FIG. 8, the discharged liquid compositions 110e to 110g spread on the hole injection / transport layer 110a and fill the lower and upper openings 112c and 112d. On the other hand, even if the liquid composition droplets 110e to 110g are removed from the predetermined discharge position and discharged onto the upper surface 112f on the upper surface 112f subjected to the liquid repellent treatment, the upper surface 112f gets wet with the liquid composition droplets 110e to 110g. The liquid composition droplets 110e to 110g roll into the lower and upper openings 112c and 112d.

  The amount of the liquid composition discharged onto each hole injection / transport layer 110a is the size of the lower and upper openings 112c and 112d, the thickness of the light emitting layer 110b to be formed, and the concentration of the light emitting layer material in the liquid composition. Etc. are determined. Further, the liquid compositions 110e to 110g may be discharged not only once but also several times on the same hole injection / transport layer 110a. In this case, the amount of the liquid composition at each time may be the same, and the amount of the liquid composition may be changed every time. Furthermore, the liquid composition may be discharged and arranged not only at the same location of the hole injection / transport layer 110a but also at different locations within the hole injection / transport layer 110a each time.

  Examples of the light emitting layer forming material include polyfluorene polymer derivatives, (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyvinyl carbazole, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes, and organic polymers mentioned above. An EL material can be used after being doped. For example, it can be used by doping rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like. The solvent for dissolving or dispersing these light emitting layer forming materials is the same type for each color light emitting layer, specifically, a mixed solvent of trimethylbenzene and fluorobenzene (fluorine group-containing solvent) (trimethylbenzene: Fluorobenzene = 3: 7 (volume ratio)) was used.

  Here, for the liquid composition for forming the light emitting layer (functional layer) 110b, a mixed solvent containing the above fluorine group-containing solvent is used as a solvent for dissolving or dispersing the light emitting layer forming material. The light emitting layer 110b formed after drying has a very high flatness. That is, according to the liquid composition using the above mixed solvent, liquid droplets are disposed in the bank portion 112 in order to exhibit appropriate liquid repellency on the surface of the bank portion 112 subjected to the liquid repellency treatment. In order to show lyophilicity with respect to the surface of the bank part 112, the light emitting layer 110b sinks around the bank part 112 due to the surface tension between the light emitting layer 110b and the bank part 112 (the bank part 112). This prevents or suppresses the light emitting layer 110b from drooping around the periphery, and as a result, the flatness of the light emitting layer 110b is very high.

  As the fluorine group-containing solvent, in addition to fluorobenzene, benzotrifluoride having a higher valence of fluorine than fluorobenzene, fluorotoluene, bis (4-fluorophenyl) ether, fluoroxylene, 4-fluoro-α -Methylstyrene, 1- (4-fluoro-1-methylphenyl) -3,3,5-5-tetramethyl-cyclohexane, fluoroaniline, fluoroanisole and the like can be used.

  Further, the fluorine group-containing solvent is preferably one containing 10% by volume to 50% by volume in the entire mixed solvent. When the volume content of the fluorine group-containing solvent is less than 10% by volume, the liquid repellency with respect to the bank portion 112 becomes too high, and the flatness of the formed light emitting layer 110b may be lowered. On the other hand, when the volume content exceeds 50% by volume, the lyophilicity with respect to the bank portion 112 becomes too high, and the formed light emitting layer 110b hangs down along the bank portion 112 and tends to be concave at the pixel center portion. As a result, the flatness may be lowered.

  Next, after the liquid compositions 110e to 110g for the respective colors have been disposed at predetermined positions, the light emitting layers 110b1 to 110b3 are formed by collectively drying. That is, the solvent contained in the liquid composition droplets 110e to 110g evaporates by drying to form a red (R) light emitting layer 110b1, a green (G) light emitting layer 110b2, and a blue (B) light emitting layer 110b3 as shown in FIG. Is done. In FIG. 9, one light emitting layer emitting red, green, and blue is shown one by one. However, as apparent from FIG. 1 and other figures, the light emitting elements are originally formed in a matrix. There are a large number of light-emitting layers (corresponding to each color) not shown.

  Moreover, it is preferable to dry the liquid composition of the light emitting layer by vacuum drying. To give a specific example, it is performed under a condition in which a pressure is set to about 133.3 Pa (1 Torr) in a nitrogen atmosphere at room temperature. it can. If the pressure is too low, the liquid composition will be bumped, which is not preferable. Further, if the temperature is higher than room temperature, the evaporation rate of the solvent is increased, and a large amount of the light emitting layer forming material adheres to the wall surface of the upper opening 112d.

Next, when the vacuum drying is completed, it is preferable to anneal the light emitting layer 110b using a heating means such as a hot plate. This annealing process is performed at a common temperature and time that can maximize the light emission characteristics of each organic EL layer.
In this manner, the hole injection / transport layer 110a and the light emitting layer 110b are formed on the pixel electrode 111.

(5) Cathode Formation Step Next, as shown in FIG. 10, the cathode 12 that forms a pair with the pixel electrode (anode) 111 is formed. That is, the cathode 12 having a structure in which, for example, a calcium layer and an aluminum layer are sequentially stacked is formed on the entire surface of the substrate 2 including the light emitting layers 110b and the organic bank layers 112b. Thereby, the cathode 12 is laminated | stacked on the whole formation area of each color light emitting layer 110b, and the organic EL element corresponding to each color of red, green, and blue is each formed.

The cathode 12 is preferably formed by, for example, an evaporation method, a sputtering method, a CVD method, or the like, and particularly preferably formed by an evaporation method in terms of preventing damage to the light emitting layer 110b due to heat. Further, a protective layer such as SiO ₂ or SiN may be provided on the cathode 12 to prevent oxidation.

(6) Sealing process Finally, the board | substrate 2 with which the organic EL element was formed, and the sealing substrate prepared separately are sealed via sealing resin. For example, a sealing resin made of a thermosetting resin or an ultraviolet curable resin is applied to the peripheral portion of the substrate 2 and the sealing substrate is disposed on the sealing resin. The sealing step is preferably performed in an inert gas atmosphere such as nitrogen, argon, or helium. If it is carried out in the air, when a defect such as a pinhole has occurred in the cathode 12, water or oxygen may enter the cathode 12 from the defective portion and the cathode 12 may be oxidized, which is not preferable.

  Thereafter, the cathode 12 is connected to the wiring of the substrate 2, and the wiring of the circuit element unit 14 is connected to a driving IC (driving circuit) provided on or outside the substrate 2, whereby the organic EL device of the present embodiment. Complete.

  According to the manufacturing method as described above, since the solvent constituting the liquid composition to be used includes the fluorine group-containing solvent, as described above, it does not exhibit extreme liquid repellency with respect to the bank portion 112. As a result, the flatness of the surface of the light emitting layer 110b to be formed becomes very high, and the light emission characteristics of the organic EL device are extremely excellent.

  In this embodiment, a mixed solvent containing a fluorine group-containing solvent is used for the liquid composition. However, different methods may be employed to realize planarization of the light emitting layer 110b. . That is, in the light emitting layer forming step, the fluorine-containing solvent is not included in the liquid composition, and after forming the light-emitting layer, the formed light-emitting layer is redissolved with a solvent containing a fluorine-group-containing solvent (mixed solvent), By re-drying this, the light emitting layer 110b having high surface flatness can be formed.

  Specifically, after performing the same (1) bank portion forming step, (2) bank portion surface treatment step, and (3) hole injection / transport layer forming step as described above, (4) light emitting layer forming step In this method, a solvent that does not contain a fluorine group-containing solvent, that is, trimethylbenzene, is used as a solvent for the liquid composition, and is ejected by an ink jet method and subsequently dried. Then, the formed light emitting layer is redissolved with a mixed solvent of fluorobenzene and / or benzotrifluoride and trimethylbenzene, and dried to form the light emitting layer 110b having high flatness by the same action as described above. be able to.

  In this embodiment, the fluorine group-containing solvent is used when forming the light emitting layer 110b. For example, the fluorine group-containing solvent may also be used when forming the hole injection / transport layer 110a. In addition, the hole injection / transport layer 110a with high flatness can be formed.

  As described above, the manufacturing method of the organic EL device has been described. In the above-described method, a color filter in which a plurality of color material layers are arranged and formed for each partition wall portion (bank portion), or a wiring pattern is connected to the partition wall portion (bank). For example, in the case of forming a pattern for each part), the present invention can be applied to the manufacture of other devices. Also in these devices, the effect of improving the flatness of the color material layer and the wiring to be formed can be obtained. Hereinafter, a color filter manufacturing method will be described as an example of a device manufacturing method.

(Device manufacturing method)
Also in the manufacturing process of the color filter CF as shown in FIG. 15, that is, the color filter CF in which the color material layers R, G, and B are arranged and formed for each bank portion 112, the fluorine group-containing solvent as described above is used. The color material layers R, G, and B can be formed by the ink jet method used.

  Specifically, after the bank portion 112 is formed on the substrate 20 by the same method as the manufacturing process of the organic EL device, the same surface treatment is performed. Then, a liquid composition is prepared by dissolving or dispersing a material (R forming material) for forming the color material layer R with a mixed solvent containing a fluorine group-containing solvent, that is, trimethylbenzene containing fluorobenzene. Are selectively ejected to a predetermined region (R forming region) surrounded by the bank portion 112 by an inkjet method. Subsequently, also for the color material layer G and the color material layer B, a liquid composition is prepared by dissolving or dispersing the G forming material and the B forming material with the above mixed solvent, and this is formed into the remaining predetermined region ( G is selectively discharged to the G formation region and the B formation region. Thereafter, the color material layers R, G, and B are formed by collectively drying the solvent, and the color filter CF is manufactured.

  Even when such a color filter is manufactured, it is also possible to adopt a method in which after the color material layer is formed, it is redissolved with a solvent containing a fluorine group-containing solvent and then dried again. In any method, it is possible to manufacture a color filter having high flatness of the color material layers R, G, and B and less color unevenness.

(Electronics)
FIG. 16 shows an embodiment of an electronic apparatus using an organic EL device manufactured by the method of the present invention. The electronic apparatus of this embodiment includes the organic EL device shown in FIG. 1 manufactured by the above-described method as a display unit. Here, an example of a mobile phone is shown in a perspective view, reference numeral 1000 indicates a mobile phone main body, and reference numeral 1001 indicates a display unit using the organic EL device 1 described above. Thus, in an electronic apparatus provided with an organic EL device as a display means, good display characteristics can be obtained.

  Hereinafter, in order to confirm the effect of the present invention, the following examples and comparative examples were examined. That is, in the light emitting layer forming step shown in the above embodiment, the organic EL devices of the examples and the comparative examples were manufactured by using different solvents. Specifically, as shown in FIG. 11, each organic EL device of Comparative Example 1 and Examples 1 to 4 manufactured using solvents having different composition ratios (volume ratios) of fluorobenzene and trimethylbenzene was manufactured. .

  As shown in FIG. 11, for each of the produced organic EL devices, the film shape of the light emitting layer 110b is observed with a microscope, and the maximum height y of the film as shown in FIGS. 12 (a) and 12 (b) is obtained. Calculation was made for the minimum height x of the membrane. 12A shows a shape in which the film surface of the light emitting layer 110b hangs around the pixel (near the bank), rises slightly inside, and is recessed at the center of the pixel. FIG. 12B shows a shape in which the film surface of the light emitting layer 110b does not sag around the pixel (near the bank).

  The light emitting layer 110b of Examples 1 to 4 had a very high flatness as compared with the light emitting layer 110b of Comparative Example 1. That is, in Comparative Example 1, the sag is generated around the bank portion 112 and both x and y are high. However, the light emitting layer 110b of Examples 1 to 4 has no or almost no sag. , X, y were low values.

  On the other hand, as shown in FIG. 13, the organic EL devices of Comparative Example 2 and Examples 5 and 6 manufactured using solvents having different composition ratios (volume ratios) of benzotrifluoride and trimethylbenzene were manufactured. For each of the produced organic EL devices, as shown in FIG. 13, the film shape of the light emitting layer 110b is observed with a microscope, and the maximum height y of the film as shown in FIG. 12 (a) and FIG. Calculation was made for the minimum height x of the membrane.

  The light emitting layer 110b of Examples 5 and 6 had a very high flatness as compared with the light emitting layer 110b of Comparative Example 2. That is, in Comparative Example 2, the sag is generated around the bank portion 112 and both x and y are high. However, the light emitting layer 110b in Examples 5 and 6 has no or almost no sag. , X, y were low values.

  Further, after forming a light emitting layer using a solvent not containing a fluorine group-containing solvent, that is, trimethylbenzene, this was redissolved with a fluorine group containing solvent, and re-dried to form the light emitting layer 110b (Example) 7) and an organic EL device (Comparative Example 1) in which re-dissolution and re-drying were not performed were prepared. For the organic EL devices of Example 7 and Comparative Example 3, as shown in FIG. 14, the film shape of the light emitting layer 110b is observed with a microscope, and the film as shown in FIGS. 12 (a) and 12 (b). The maximum height y and the minimum height x of the film were calculated.

  The light emitting layer 110b of Example 7 has a much higher flatness than the light emitting layer 110b of Comparative Example 3. That is, in Comparative Example 3, the sag occurs around the bank portion 112 and both x and y are high. However, since the light emitting layer 110b of Example 7 does not sag or hardly occurs, x , Y were low values.

1 is a circuit diagram of an organic EL device manufactured by a method according to the present invention. FIG. The cross-sectional block diagram of a display area same as the above. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Explanatory drawing which shows the film | membrane shape etc. of the light emitting layer of each organic EL apparatus concerning Examples 1-4 and the comparative example 1. FIG. Explanatory drawing which defines about the maximum height y and minimum height x of the film | membrane shown in FIG. Explanatory drawing which shows the film | membrane shape etc. of the light emitting layer of each organic EL device concerning Examples 5 and 6 and comparative example 1. FIG. Explanatory drawing which shows the film | membrane shape etc. of the light emitting layer of each organic EL apparatus which concerns on Example 7 and Comparative Example 1. FIG. The cross-sectional schematic diagram of the color filter manufactured by the method which concerns on this invention. FIG. 11 is a perspective configuration diagram illustrating an example of an electronic device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Substrate, 110 ... Organic EL layer (electro-optic layer), 110a ... Hole injection / transport layer (functional layer), 110b ... Light emitting layer (functional layer), 111 ... Pixel electrode, 112 ... Bank part (partition wall part)

Claims (3)

A partition wall forming step of forming a partition wall partitioning pixels on the substrate;
A liquid repellency step for making the surface of the partition wall liquid repellant;
An application step of applying a liquid composition in which a functional layer forming material constituting at least a part of the organic EL element is dissolved or dispersed in a solvent not containing a fluorine group in a region surrounded by the partition;
Drying the applied liquid composition to form a functional layer; and
A functional layer flattening step in which the formed functional layer is dissolved in a solvent containing a fluorine group-containing solvent containing a fluorine group, and then dried again. The method of manufacturing an organic EL device according to claim 1 , wherein, in the liquid repellency step, the surface of the partition wall is fluorinated. A partition wall forming step of forming a partition wall partitioning a predetermined region on the substrate;
A liquid repellency step for making the surface of the partition wall liquid repellant;
An application step of applying a liquid composition in which a functional layer forming material constituting at least a part of the device is dissolved or dispersed in a solvent not containing a fluorine group in a region surrounded by the partition;
Drying the applied liquid composition to form a functional layer; and
A functional layer flattening step in which the functional layer thus formed is dissolved in a solvent containing a fluorine group-containing solvent containing a fluorine group, and then dried again.

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