JP4682559B2 - Dielectric ceramic composition and electronic component - Google Patents

Description

  The present invention relates to a dielectric ceramic composition having resistance to reduction and an electronic component such as a multilayer ceramic capacitor using the dielectric ceramic composition.

  Multilayer ceramic capacitors as electronic components have high dielectric constant, long life of insulation resistance IR, good DC bias characteristics (low relative dielectric constant change over time), and good temperature characteristics In particular, depending on the application, the temperature characteristics are required to be flat under severe conditions. In recent years, multilayer ceramic capacitors have been used in various electronic devices such as an engine electronic control unit (ECU), a crank angle sensor, and an antilock brake system (ABS) module mounted in an engine room of an automobile. Since these electronic devices are for performing engine control, drive control, and brake control stably, it is required that the circuit has good temperature stability.

  The environment in which these electronic devices are used is expected to decrease to about −20 ° C. or lower in winter in cold regions, and to increase to about + 130 ° C. or higher in summer after engine startup. Recently, there is a tendency to reduce the number of wire harnesses that connect an electronic device and its control target equipment, and the electronic device is sometimes installed outside the vehicle, so the environment for the electronic device has become increasingly severe. Therefore, capacitors used in these electronic devices need to have flat temperature characteristics over a wide temperature range. Specifically, it is not sufficient for the capacity-temperature characteristic to satisfy the EIA standard X7R characteristic (−55 to 125 ° C., ΔC / C = within ± 15%), but the EIA standard X8R characteristic (−55 to 150 ° C.). , ΔC / C = within ± 15%) is required.

  There are several proposals for dielectric ceramic compositions that satisfy the X8R characteristics.

In Patent Documents 1 and 2, in order to satisfy X8R characteristics in a dielectric ceramic composition containing BaTiO ₃ as a main component, the Curie temperature is increased to a high temperature side by replacing Ba in BaTiO ₃ with Bi, Pb or the like. It has been proposed to shift. It has also been proposed to satisfy X8R characteristics by selecting a BaTiO ₃ + CaZrO ₃ + ZnO + Nb ₂ O ₅ composition (Patent Documents 3 to 7).

  However, in any of these composition systems, Pb, Bi, and Zn, which are likely to be evaporated and scattered, are used, and thus firing in an oxidizing atmosphere such as in air is a prerequisite. For this reason, there is a problem that an inexpensive base metal such as Ni cannot be used for the internal electrode of the capacitor, and an expensive noble metal such as Pd, Au, or Ag must be used.

On the other hand, the present applicant has already proposed the dielectric ceramic composition shown below for the purpose of having a high dielectric constant, satisfying X8R characteristics, and enabling firing in a reducing atmosphere. (Patent Document 8). The dielectric ceramic composition described in Patent Document 8 includes BaTiO _{3 as} a main component, a first subcomponent including at least one selected from MgO, CaO, BaO, SrO, and Cr ₂ O ₃ ; _{Ba, Ca) x SiO 2 +} x ( where, first comprises a second subcomponent expressed by x = 0.8 to _1.2), at least one selected from V ₂ O 5, MoO ₃ and WO ₃ 3 subcomponents and at least a fourth subcomponent including an oxide of R1 (where R1 is at least one selected from Sc, Er, Tm, Yb and Lu), and each subcomponent with respect to 100 moles of the main component The ratio of the first subcomponent: 0.1-3 mol, the second subcomponent: 2-10 mol, the third subcomponent: 0.01-0.5 mol, the fourth subcomponent: 0.5-7 Moles (provided that the number of moles of the fourth subcomponent is the ratio of R1 alone).

Further, the present applicant has already proposed the following dielectric ceramic composition (Patent Document 9). The dielectric ceramic composition described in Patent Document 9 includes a main component including barium titanate, a first subcomponent including at least one selected from MgO, CaO, BaO, SrO, and Cr ₂ O ₃ ; A second subcomponent containing silicon oxide as a main component; a third subcomponent containing at least one selected from V ₂ O ₅ , MoO ₃ and WO _3; and an oxide of R1 (wherein R1 is Sc, A fourth subcomponent containing at least one selected from Er, Tm, Yb and Lu) and a fifth subcomponent containing CaZrO ₃ or CaO + ZrO ₂ , and the ratio of each component to 100 mol of the main component is , 1st subcomponent: 0.1-3 mol, 2nd subcomponent: 2-10 mol, 3rd subcomponent: 0.01-0.5 mol, 4th subcomponent: 0.5-7 mol (however, The number of moles of the fourth subcomponent is R1 alone Ratio), the fifth subcomponent: 0 <fifth subcomponent ≦ 5 mol.

  In any of the above-mentioned applications by the present applicant, the ratio of the first subcomponent such as MgO to 100 mol of the main component is 0.1 mol or more.

  According to the dielectric ceramic composition according to the above-mentioned application by the present applicant, the dielectric constant is certainly high, the X8R characteristic is satisfied, and firing in a reducing atmosphere is possible.

  However, in the dielectric ceramic composition of the above application, when the dielectric layer is further thinned, it is difficult for the capacity-temperature characteristic to satisfy the X8R characteristic, and the life of the insulation resistance tends to decrease. It has been made clear by the inventors. Regarding the capacity-temperature characteristics, the capacity change rate on the high temperature side tends to increase, and it is desired to improve this. Further, among rare earth oxides, those containing lanthanoid series elements are expensive, and search for inexpensive substitution elements that can obtain the same characteristics has been advanced. In addition, the trend toward higher integration and higher density of circuits has become stronger in recent years, and in response to the increasing demand for small and large-capacitance capacitors, internal dielectric layers can be made even thinner. It has been demanded.

Therefore, in order to satisfy these requirements, the present applicant has already proposed the dielectric ceramic composition shown below (Patent Document 10). The dielectric ceramic composition described in Patent Document 10 includes a main component containing barium titanate and an AE oxide (where AE is at least one selected from Mg, Ca, Ba and Sr). 1 subcomponent and a second subcomponent including an oxide of R (where R is at least one selected from Y, Dy, Ho and Er), and each subcomponent with respect to 100 moles of the main component The ratio of the first subcomponent: 0 mol <first subcomponent <0.1 mol, and the second subcomponent: 1 mol <second subcomponent <7 mol.
Although the technique of Patent Document 10 can satisfy the X8R characteristic, the IR temperature dependence from room temperature to the high temperature part is poor, and the actual use as a product may be difficult.

Japanese Patent Laid-Open No. 10-25157 Japanese Patent Laid-Open No. 9-40465 JP-A-4-295048 JP-A-4-292458 Japanese Unexamined Patent Publication No. Hei 4-29259 JP-A-5-109319 JP-A-6-243721 JP 2000-154057 A JP 2001-192264 A JP 2002-255639 A

  The object of the present invention is that the dielectric constant is high, the life of the insulation resistance can be maintained, and the capacitance-temperature characteristic satisfies the X8R characteristic (−55 to 150 ° C., ΔC / C = ± 15% or less) of the EIA standard. It is intended to provide a dielectric ceramic composition that can be fired in a neutral atmosphere and has improved IR temperature dependency. Another object of the present invention is to provide an electronic component such as a multilayer ceramic capacitor that can be reduced in size and increased in capacity using such a dielectric porcelain composition, and is particularly suitable for thin layer size reduction.

In order to achieve the above object, according to the present invention,
A main component consisting of barium titanate,
A first subcomponent comprising an oxide of AE (where AE is at least one selected from Mg, Ca, Ba and Sr);
A second subcomponent comprising an oxide of R (where R is at least one selected from Y, Dy, Tm, Ho and Er);
MxSiO ₃ (where M is at least one selected from Ba, Ca, Sr, Li, and B. When M = Ba, x = 1, when M = Ca, x = 1, M A third subcomponent consisting of x = 1 for S =, x = 2 for M = Li, and x = 2/3 for M = B;
A fourth subcomponent comprising MnO;
A fifth subcomponent consisting of at least one selected from V ₂ O ₅ , MoO ₃ and WO ₃ ;
A sixth subcomponent consisting of CaZrO ₃ ;
A dielectric ceramic composition comprising a seventh subcomponent comprising an oxide of A (where A is at least one selected from the group of cation elements of Al, Cr, Ga, Ge ),
The ratio of each subcomponent to 100 moles of the main component is
First subcomponent: 0 to 0.1 mol (excluding 0 mol and 0.1 mol),
Second subcomponent: 1 to 7 mol (excluding 1 mol and 7 mol),
Third subcomponent: 2 to 10 mol,
Fourth subcomponent: 0 to 0.5 mol (excluding 0 mol),
5th subcomponent: 0.01-0.5 mol,
Sixth subcomponent: 0 to 5 mol (excluding 0 mol and 5 mol),
Seventh subcomponent: 1 to 3.5 mol (excluding 1 mol and 3.5 mol; value converted to oxide A),
Provided is a dielectric ceramic composition in which the ratio of the number of moles of the second subcomponent to the number of moles of the first subcomponent (second subcomponent / first subcomponent) is 10 to 500 (excluding 10 and 500). Is done.

  The electronic component according to the present invention is not particularly limited as long as it is an electronic component having a dielectric layer. For example, the electronic component is a multilayer ceramic capacitor element having a capacitor element body in which internal electrodes are alternately laminated together with dielectric layers. is there. In the present invention, the dielectric layer is composed of any one of the above dielectric ceramic compositions. The conductive material contained in the internal electrode layer is not particularly limited, but is Ni or Ni alloy, for example. In the present invention, the effect is great particularly when the thickness of the dielectric layer is less than about 10 μm.

  In addition, the ionic radius described in the present specification is a value based on the document “RD Shannon, Acta Crystallogr., A32, 751 (1976)”.

  As a result of research on a specific element group that can improve IR temperature dependency without affecting the target temperature characteristic (X8R characteristic), the present inventors have found that the effective ion radius at the time of six coordination is within a predetermined range. The present inventors have found that a group of cation elements that fall within the range is effective, and have reached the present invention based on this finding.

  “IR temperature dependency” is an index for ascertaining how the insulation resistance IR fluctuates with respect to a temperature change. This IR temperature dependency can be evaluated by calculating a rate (change rate) at which IR at a predetermined temperature (for example, 150 ° C.) changes with respect to IR at a reference temperature (for example, room temperature of 25 ° C.). It can be determined that the IR temperature dependency is better as the IR change rate between a plurality of temperatures is smaller, and the IR temperature dependency is worse as the IR change rate is larger. Even if the temperature characteristics of capacitance satisfy the EIA standard X8R, if the IR temperature dependence in the temperature range of X8R (especially from room temperature to high temperature) is poor, actual use as a product is difficult. become.

In the present invention, room temperature (25 ° C.) and high temperature part (150 ° C.) are exemplified as a plurality of temperatures, and when the insulation resistance at each temperature is IR ₂₅ and IR ₁₅₀ , “IR” By calculating the magnitude of “digit loss”, the IR temperature dependency is evaluated for good or bad.
log (IR ₁₅₀ / IR ₂₅ ) ... Equation 1

  In the present invention, the seventh subcomponent composed of a specific element group is added to the dielectric composition having a high relative dielectric constant and satisfying the X8R characteristic. For this reason, the dielectric ceramic composition according to the present invention satisfies the X8R characteristic and has a small IR temperature dependency from room temperature (25 ° C.) to a high temperature portion (150 ° C.). Specifically, the IR loss represented by the above formula 1 can be set to −2.00 or more.

  Since the dielectric ceramic composition according to the present invention has a high relative dielectric constant and the capacitance-temperature characteristic satisfies the X8R characteristic of the EIA standard, an electronic component such as a ceramic chip capacitor using the dielectric ceramic composition of the present invention is It can also be suitably used in an environment such as an automobile engine room exposed to high temperatures.

  Moreover, the dielectric ceramic composition according to the present invention does not contain an element such as Pb, Bi, or Zn that evaporates and scatters. For this reason, firing in a reducing atmosphere is possible.

  That is, according to the present invention, the dielectric constant is high, the life of the insulation resistance can be maintained, the capacitance-temperature characteristic satisfies the X8R characteristic of the EIA standard, the firing in a reducing atmosphere is possible, and the IR temperature A dielectric ceramic composition with improved dependency can be provided.

  When manufacturing electronic parts such as ceramic chip capacitors using the dielectric ceramic composition of the present invention, it becomes possible to use base metals such as Ni and Ni alloys as internal electrodes, thereby realizing cost reduction of electronic parts. . Moreover, even when the dielectric ceramic composition is fired in a reducing atmosphere, the obtained electronic component satisfies the X8R characteristics and has good capacity aging characteristics by applying a DC electric field (= small change in capacity with time). Insulation resistance is small and reliability is excellent.

  That is, an electronic component such as a multilayer ceramic capacitor having a dielectric layer composed of the dielectric ceramic composition of the present invention operates stably in various devices used in harsh environments such as an automobile electronic device. Since it is possible, the reliability of the applied apparatus can be remarkably improved.

  As described above, the dielectric composition of the present invention can be expected to be effective as a technique for suppressing the deterioration of the temperature change rate in the high temperature region accompanying the thinning of the dielectric layer.

  Furthermore, the dielectric ceramic composition according to the present invention has a long life of insulation resistance, and further has stable DC bias characteristics (dependence of dielectric constant on DC voltage application) and TC bias characteristics (capacitance-temperature characteristics when DC voltage is applied). is doing. In particular, the TC bias characteristics are remarkably improved by adding the seventh subcomponent.

  Furthermore, since the dielectric ceramic composition according to the present invention does not contain harmful substances such as Pb and Bi, the adverse effects on the environment due to disposal and disposal after use are small.

  Therefore, by using the dielectric ceramic composition of the present invention, it becomes easy to provide an electronic component such as a multilayer ceramic capacitor having excellent characteristics. In addition, when the dielectric ceramic composition according to the present invention is used, the X8R characteristic can be satisfied even when the dielectric layer is thinned, and the life of the insulation resistance can be effectively prevented from decreasing. Therefore, electronic parts such as multilayer ceramic capacitors can be reduced in size and increased in capacity, and can be easily adapted to further downsizing of the thin layer. For this reason, mounting on a highly integrated circuit becomes easier.

  In the conventional dielectric ceramic composition, the capacity-temperature characteristic on the high temperature side tends to deteriorate as the dielectric layer per layer is made thinner. That is, the capacity-temperature change rate curve on the high temperature side tended to go in the clockwise direction. On the other hand, according to the present invention, the capacity temperature change rate curve on the high temperature side can be directed in the counterclockwise direction. If this phenomenon is applied to an electronic component that satisfies the X7R characteristic, it is possible to realize a further thinner dielectric layer per layer than in the past.

  The electronic component according to the present invention is not particularly limited, and examples thereof include a multilayer ceramic capacitor, a piezoelectric element, a chip inductor, a chip varistor, a chip thermistor, a chip resistor, and other surface mount (SMD) chip type electronic components.

  Hereinafter, the present invention will be described based on embodiments shown in the drawings. FIG. 1 is a cross-sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention.

  In this embodiment, the multilayer ceramic capacitor 1 shown in FIG. 1 is illustrated as an electronic component, and the structure and manufacturing method thereof will be described.

Multilayer Ceramic Capacitor As shown in FIG. 1, a multilayer ceramic capacitor 1 as an electronic component according to an embodiment of the present invention has a capacitor element body 10 in which dielectric layers 2 and internal electrode layers 3 are alternately stacked. . At both ends of the capacitor element body 10, a pair of external electrodes 4 are formed which are electrically connected to the internal electrode layers 3 arranged alternately in the element body 10. The internal electrode layers 3 are laminated so that the end faces are alternately exposed on the surfaces of the two opposite ends of the capacitor element body 10. The pair of external electrodes 4 are formed at both ends of the capacitor element body 10 and are connected to the exposed end surfaces of the alternately arranged internal electrode layers 3 to constitute a capacitor circuit.

  The outer shape and dimensions of the capacitor element body 10 are not particularly limited and can be appropriately set according to the application. Usually, the outer shape is substantially a rectangular parallelepiped shape, and the dimensions are usually vertical (0.4 to 5.6 mm) × It can be about horizontal (0.2-5.0 mm) × height (0.2-1.9 mm).

The dielectric layer dielectric layer 2 contains the dielectric ceramic composition according to the present invention.

The dielectric ceramic composition of the present invention has barium titanate (preferably represented by the composition formula Ba _m TiO _{2 + m} , m is 0.995 ≦ m ≦ 1.010, and the ratio of Ba to Ti is 0.00. 995 ≦ Ba / Ti ≦ 1.010)
A first subcomponent comprising an oxide of AE (wherein AE is at least one selected from Mg, Ca, Ba and Sr);
A second subcomponent comprising an oxide of R (where R is at least one selected from Y, Dy, Tm, Ho and Er);
MxSiO ₃ (where M is at least one selected from Ba, Ca, Sr, Li, and B. When M = Ba, x = 1, when M = Ca, x = 1, M A third subcomponent including: x = 1 when = Sr, x = 2 when M = Li, and x = 2/3 when M = B;
A fourth subcomponent comprising MnO;
A fifth subcomponent comprising at least one selected from V ₂ O ₅ , MoO ₃ and WO ₃ ;
And a seventh subcomponent including an oxide of A (provided that A is at least one selected from the group of cationic elements having an effective ionic radius of 0.065 nm to 0.085 nm at the time of six coordination).

The first subcomponent exhibits an effect of flattening the capacity-temperature characteristic.
The second subcomponent exhibits an effect of shifting the Curie temperature to the high temperature side and an effect of flattening the capacity-temperature characteristic.
The third subcomponent mainly acts as a sintering aid, but has an effect of improving the defective rate of the initial insulation resistance IR when the layer is thinned.
The fourth subcomponent exhibits an effect of promoting sintering, an effect of increasing IR, and an effect of improving the IR life.
The fifth subcomponent exhibits the effect of flattening the capacity-temperature characteristic above the Curie temperature and the effect of improving the IR lifetime.
The seventh subcomponent does not significantly affect the capacity-temperature characteristics and has the effect of improving the IR temperature dependency.
The present invention is characterized in that a seventh subcomponent composed of a specific element group is contained in a predetermined amount with respect to the dielectric composition satisfying the X8R characteristic.

  The cationic element group of the seventh subcomponent includes I (0.067 nm), Ge (0.067 nm), Al (0.0675 nm), Cu (0.068 nm), Fe (0.069 nm), Ni ( 0.070 nm), Au (0.071 nm), As (0.072 nm), Cr (0.0755 nm), Ga (0.076 nm), At (0.076 nm), Os (0.077 nm), Nb (0 0.078 nm), Ta (0.078 nm), Co (0.079 nm), Rh (0.080 nm), Ir (0.082 nm), Ru (0.082 nm), Sn (0.083 nm), P (0.052 nm) and K (0.152 nm) are not included. In addition, the number in parenthesis shows the effective ion radius at the time of 6 coordination. The same applies hereinafter.

  Among the cation element group, it is preferable to use an element having an effective ion radius of 0.067 to 0.076 nm at the time of six coordination. Such preferred element groups include I, Ge, Al, Cu, Fe, Ni, Au, As, Cr, Ga, At, and more preferably from the cationic element group of Al, Cr, Ga, Ge. At least one selected is used. When two or more types are used in combination, particularly preferred combinations are Al + Cr, Al + Ga, and Al + Ge.

The content of the seventh subcomponent is a value converted to oxide A with respect to 100 mol of the main component, and is 0 to 3.5 mol (excluding 0 mol and 3.5 mol), preferably 0. -3 mol (excluding 0 mol), more preferably 0.5-3 mol, still more preferably 1-2 mol, particularly preferably 1-1.5 mol. When there is too little content of a 7th subcomponent, the effect which improves IR temperature dependence will become inadequate. On the other hand, if the content is too large, the capacity-temperature characteristic tends to deteriorate. In particular, when the seventh subcomponent exceeding 1 mol is added, the TC bias characteristics are remarkably improved.
The ratio of the seventh subcomponent is not the molar ratio of A alone but the molar ratio of A oxide. That is, for example, when using an oxide of Al as the seventh subcomponent, that the ratio of the seventh subcomponent being 1 mole ratio of Al instead of 1 mole, the ratio of Al ₂ O ₃ is 1 mole It means that.
In addition, when using 2 or more types of multiple elements (oxide) as a 7th subcomponent, what is necessary is just to make it a total content be the said range with respect to 100 mol of said main components. That is, the constituent ratio of each oxide in the seventh subcomponent is arbitrary.

  By containing the first to fifth subcomponents, the X8R characteristic can be satisfied while maintaining a high dielectric constant. The preferred contents and reasons for the first to fifth subcomponents are as follows.

  The ratio of the first subcomponent to 100 mol of the main component is 0 to 0.1 mol (excluding 0 mol and 0.1 mol), preferably 0.01 to 0.1 mol (provided that 0.1 mol). Excluding moles), more preferably 0.04 to 0.08 moles.

  The ratio of the second subcomponent to 100 mol of the main component is 1 to 7 mol (excluding 1 mol and 7 mol), preferably 1 to 6 mol (excluding 1 mol), more preferably 3 to 3 mol. 5 moles.

  The ratio of the number of moles of the second subcomponent to the number of moles of the first subcomponent (second subcomponent / first subcomponent) is preferably 10 to 500 (excluding 10 and 500), more preferably It is 37.5 to 250, more preferably 37.5 to 125.

  The ratio of the third subcomponent to 100 mol of the main component is preferably 2 to 10 mol, more preferably 2 to 6 mol.

  The ratio of the fourth subcomponent to 100 mol of the main component is preferably 0 to 0.5 mol (excluding 0 mol), more preferably 0.1 to 0.5 mol.

  The ratio of the fifth subcomponent with respect to 100 mol of the main component is preferably 0.01 to 0.5 mol, more preferably 0.01 to 0.2 mol.

  In this specification, each oxide constituting the main component and each subcomponent is represented by a stoichiometric composition, but the oxidation state of each oxide may be out of the stoichiometric composition. However, the said ratio of each subcomponent is calculated | required by converting into the oxide of the said stoichiometric composition from the metal amount contained in the oxide which comprises each subcomponent.

  The reasons for limiting the contents of the subcomponents are as follows.

  If the content of the first subcomponent is too small, this effect is insufficient, and the capacity-temperature characteristic is generally deteriorated. On the other hand, when the content of the first subcomponent increases beyond the range of the present invention, the capacity-temperature characteristic on the high temperature side tends to deteriorate again.

  When there is too little content of a 2nd subcomponent, such an effect will become inadequate and a capacity | capacitance temperature characteristic will worsen. On the other hand, when there is too much content, it exists in the tendency for sinterability to deteriorate rapidly. In particular, there is a merit that the capacity-temperature characteristic can be further flattened by increasing the content of the second subcomponent while reducing the content of the first subcomponent as much as possible.

  When the ratio of the number of moles of the second subcomponent to the number of moles of the first subcomponent (second subcomponent / first subcomponent) is too small, the capacity-temperature characteristic is deteriorated and the X8R characteristic cannot be satisfied. On the other hand, if these ratios are too large, the sinterability tends to deteriorate.

The ratio of the second subcomponent is not the molar ratio of R alone but the molar ratio of the oxide of R. That is, for example, when an oxide of Y is used as the second subcomponent, the ratio of the second subcomponent is 1 mol. The ratio of Y is not 1 mol but the ratio of Y ₂ O ₃ is 1 mol. It means that.

  If the content of the third subcomponent is too small, the capacity-temperature characteristic tends to be unsatisfactory, the insulation resistance tends to deteriorate, and the sinterability tends to deteriorate particularly. On the other hand, when the content is too large, the life characteristics of the insulation resistance become insufficient, and the dielectric constant tends to decrease rapidly. The constituent ratio of each oxide in the third subcomponent is arbitrary.

  When there is too much content of a 4th subcomponent, there exists a possibility of having a bad influence on a capacity temperature characteristic and making IR life worse.

  When there is too little content of a 5th subcomponent, there exists a tendency for the effect mentioned above to become inadequate. On the other hand, when there is too much content, IR will fall remarkably. The constituent ratio of each oxide in the fifth subcomponent is arbitrary.

It is preferable that a sixth subcomponent containing CaZrO ₃ or CaO + ZrO ₂ is further added to the dielectric ceramic composition of the present invention. In addition to shifting the Curie temperature to the high temperature side, the sixth subcomponent has effects such as flattening of the capacitance temperature characteristic, improvement of insulation resistance (IR), improvement of breakdown voltage, and reduction of the firing temperature.

  The ratio of the sixth subcomponent to 100 mol of the main component is preferably 0 to 5 mol (excluding 0 mol and 5 mol), more preferably 0 to 3 mol (excluding 0 mol). . When the added amount of the sixth subcomponent is too large, the IR life is remarkably lowered and the capacity-temperature characteristic tends to be deteriorated.

The addition form of CaZrO ₃ is not particularly limited, and examples thereof include oxides composed of Ca such as CaO, carbonates such as CaCO ₃ , organic compounds, and CaZrO ₃ . The ratio of Ca and Zr is not particularly limited, and may be determined so as not to be dissolved in barium titanate contained in the main component. The molar ratio of Ca to Zr (Ca / Zr) is preferably 0.5 to 1.5, more preferably 0.8 to 1.5, particularly preferably 0.9 to 1.1.

In addition, when at least one of Sr, Zr, and Sn substitutes Ba or Ti in the main component constituting the perovskite structure, the Curie temperature shifts to a low temperature side, so that the capacity-temperature characteristics at 125 ° C. or higher Becomes worse. For this reason, it is preferable not to use BaTiO ₃ [for example, (Ba, Sr) TiO ₃ ] containing these elements as a main component. However, there is no particular problem as long as the level is contained as an impurity (about 0.1 mol% or less of the entire dielectric ceramic composition).

  The average crystal grain size of the dielectric ceramic composition of the present invention is not particularly limited, and may be appropriately determined from a range of, for example, 0.1 to 3 μm according to the thickness of the dielectric layer. Capacitance-temperature characteristics tend to deteriorate as the dielectric layer is thinner, and worsen as the average crystal grain size is reduced. Therefore, the dielectric ceramic composition of the present invention is particularly effective when the average crystal grain size needs to be reduced, specifically when the average crystal grain size is 0.1 to 0.5 μm. is there. In addition, if the average crystal grain size is reduced, the IR lifetime becomes longer, and the change with time of the capacity under a direct current electric field is reduced. From this point, the average crystal grain size is preferably small as described above. .

  The Curie temperature (phase transition temperature from ferroelectric to paraelectric) of the dielectric ceramic composition of the present invention can be changed by selecting the composition, but is preferable for satisfying the X8R characteristics. Is 120 ° C. or higher, more preferably 123 ° C. or higher. The Curie temperature can be measured by DSC (differential scanning calorimetry) or the like.

The multilayer ceramic capacitor using the dielectric ceramic composition of the present invention is suitable for use as an electronic component for equipment used in an environment of 80 ° C. or higher, particularly 125 to 150 ° C. In such a temperature range, the temperature characteristic of the capacitance satisfies the R characteristic of the EIA standard, and further satisfies the X8R characteristic. In addition, the X7R characteristic (-55 to 125 ° C., ΔC / C = within ± 15%) of the EIA standard can be satisfied at the same time.
Moreover, for example, when the insulation resistances at room temperature (25 ° C.) and high temperature part (150 ° C.) are IR ₂₅ and IR ₁₅₀ , the “IR digit loss” expressed by the following formula 1 is −2. It can be set to 00 or more. That is, IR temperature dependency is small.
log (IR ₁₅₀ / IR ₂₅ ) ... Equation 1

  In a multilayer ceramic capacitor, an AC electric field of 0.02 V / μm or more, particularly 0.2 V / μm or more, more preferably 0.5 V / μm or more, and generally about 5 V / μm or less is superimposed on the dielectric layer. Then, a DC electric field of 5 V / μm or less is applied, but even if such an electric field is applied, the temperature characteristics of the capacitance are stable.

Although the conductive material contained in the internal electrode layer 3 is not particularly limited, a base metal can be used because the constituent material of the dielectric layer 2 has reduction resistance. As the base metal used as the conductive material, Ni or Ni alloy is preferable. The Ni alloy is preferably an alloy of Ni and one or more elements selected from Mn, Cr, Co, and Al, and the Ni content in the alloy is preferably 95% by weight or more.

  In addition, in Ni or Ni alloy, various trace components, such as P, may be contained about 0.1 wt% or less.

  The thickness of the internal electrode layer may be appropriately determined according to the application, etc., but it is usually preferably about 0.5 to 5 μm, particularly preferably about 0.5 to 2.5 μm.

The conductive material contained in the external electrode external electrode 4 is not particularly limited, but in the present invention, inexpensive Ni, Cu, and alloys thereof can be used.

  The thickness of the external electrode may be appropriately determined according to the use, etc., but is usually preferably about 10 to 50 μm.

Manufacturing Method of Multilayer Ceramic Capacitor A multilayer ceramic capacitor using the dielectric ceramic composition of the present invention is a green chip produced by a normal printing method or sheet method using a paste, as in the case of a conventional multilayer ceramic capacitor. After firing, the external electrode is printed or transferred and fired. Hereinafter, the manufacturing method will be specifically described.

  First, the dielectric ceramic composition powder contained in the dielectric layer paste is prepared, and this is made into a paint to prepare the dielectric layer paste.

  The dielectric layer paste may be an organic paint obtained by kneading a dielectric ceramic composition powder and an organic vehicle, or may be a water-based paint.

  As the dielectric ceramic composition powder, the above-described oxides, mixtures thereof, and composite oxides can be used. In addition, various compounds that become the above-described oxides and composite oxides by firing, such as carbonates and An acid salt, a nitrate, a hydroxide, an organometallic compound, or the like can be appropriately selected and mixed for use. What is necessary is just to determine content of each compound in a dielectric ceramic composition powder so that it may become a composition of the above-mentioned dielectric ceramic composition after baking.

  The particle size of the dielectric ceramic composition powder is usually about 0.1 to 3 [mu] m in average before the coating.

  An organic vehicle is obtained by dissolving a binder in an organic solvent. The binder used for the organic vehicle is not particularly limited, and may be appropriately selected from usual various binders such as ethyl cellulose and polyvinyl butyral. Further, the organic solvent to be used is not particularly limited, and may be appropriately selected from various organic solvents such as terpineol, butyl carbitol, acetone, toluene, and the like, depending on a method to be used such as a printing method or a sheet method.

  Further, when the dielectric layer paste is used as a water-based paint, a water-based vehicle in which a water-soluble binder or a dispersant is dissolved in water and a dielectric material may be kneaded. The water-soluble binder used for the water-based vehicle is not particularly limited, and for example, polyvinyl alcohol, cellulose, water-soluble acrylic resin, or the like may be used.

  The internal electrode layer paste is prepared by kneading the above-mentioned organic vehicle with various conductive metals made of various dielectric metals and alloys, or various oxides, organometallic compounds, resinates, etc. that become the above-mentioned conductive materials after firing. Prepare.

  The external electrode paste may be prepared in the same manner as the internal electrode layer paste described above.

  There is no restriction | limiting in particular in content of the organic vehicle in each above-mentioned paste, For example, what is necessary is just about 1-5 weight% of binders, for example, about 10-50 weight% of binders. Each paste may contain additives selected from various dispersants, plasticizers, dielectrics, insulators, and the like as necessary. The total content of these is preferably 10% by weight or less.

  When the printing method is used, the dielectric layer paste and the internal electrode layer paste are laminated and printed on a substrate such as PET, cut into a predetermined shape, and then peeled from the substrate to obtain a green chip.

  When the sheet method is used, a dielectric layer paste is used to form a green sheet, the internal electrode layer paste is printed thereon, and these are stacked to form a green chip.

Before firing, the green chip is subjected to binder removal processing. The binder removal treatment may be appropriately determined according to the type of the conductive material in the internal electrode layer paste, but when a base metal such as Ni or Ni alloy is used as the conductive material, the oxygen partial pressure in the binder removal atmosphere is 10 It is preferable to be ⁻⁴⁵ to 10 ⁵ Pa. When the oxygen partial pressure is less than the above range, the binder removal effect is lowered. If the oxygen partial pressure exceeds the above range, the internal electrode layer tends to oxidize.

As other binder removal conditions, the temperature rising rate is preferably 5 to 300 ° C./hour, more preferably 10 to 100 ° C./hour, and the holding temperature is preferably 180 to 400 ° C., more preferably 200 to 350. The temperature holding time is preferably 0.5 to 24 hours, more preferably 2 to 20 hours. The firing atmosphere is preferably air or a reducing atmosphere, and as an atmosphere gas in the reducing atmosphere, for example, a mixed gas of N ₂ and H ₂ is preferably used after being humidified.

The atmosphere at the time of green chip firing may be appropriately determined according to the type of conductive material in the internal electrode layer paste, but when a base metal such as Ni or Ni alloy is used as the conductive material, the oxygen content in the firing atmosphere The pressure is preferably 10 ⁻⁷ to 10 ⁻³ Pa. When the oxygen partial pressure is less than the above range, the conductive material of the internal electrode layer may be abnormally sintered and may be interrupted. Further, when the oxygen partial pressure exceeds the above range, the internal electrode layer tends to be oxidized.

  Moreover, the holding temperature at the time of baking becomes like this. Preferably it is 1100-1400 degreeC, More preferably, it is 1200-1380 degreeC, More preferably, it is 1260-1360 degreeC. If the holding temperature is lower than the above range, the densification becomes insufficient. If the holding temperature is higher than the above range, the electrode temperature is interrupted due to abnormal sintering of the internal electrode layer, the capacity temperature characteristic deteriorates due to diffusion of the constituent material of the internal electrode layer, and the dielectric Reduction of the body porcelain composition is likely to occur.

As other firing conditions, the rate of temperature rise is preferably 50 to 500 ° C./hour, more preferably 200 to 300 ° C./hour, and the temperature holding time is preferably 0.5 to 8 hours, more preferably 1 to 3 hours. The time and cooling rate are preferably 50 to 500 ° C./hour, more preferably 200 to 300 ° C./hour. Further, the firing atmosphere is preferably a reducing atmosphere, and as the atmosphere gas, for example, a mixed gas of N ₂ and H ₂ is preferably used by humidification.

  When firing in a reducing atmosphere, it is preferable to anneal the capacitor element body. Annealing is a process for re-oxidizing the dielectric layer, and this can significantly increase the IR lifetime, thereby improving the reliability.

  The oxygen partial pressure in the annealing atmosphere is preferably 0.1 Pa or more, particularly 0.1 to 10 Pa. When the oxygen partial pressure is less than the above range, it is difficult to reoxidize the dielectric layer, and when it exceeds the above range, the internal electrode layer tends to be oxidized.

  The holding temperature at the time of annealing is preferably 1100 ° C. or less, particularly 500 to 1100 ° C. When the holding temperature is lower than the above range, the dielectric layer is not sufficiently oxidized, so that the IR is low and the IR life tends to be short. On the other hand, if the holding temperature exceeds the above range, not only the internal electrode layer is oxidized and the capacity is lowered, but the internal electrode layer reacts with the dielectric substrate, the capacity temperature characteristic is deteriorated, the IR is lowered, the IR Life is likely to decrease. In addition, you may comprise annealing only from a temperature rising process and a temperature falling process. That is, the temperature holding time may be zero. In this case, the holding temperature is synonymous with the maximum temperature.

As other annealing conditions, the temperature holding time is preferably 0 to 20 hours, more preferably 2 to 10 hours, and the cooling rate is preferably 50 to 500 ° C./hour, more preferably 100 to 300 ° C./hour. . Further, as the annealing atmosphere gas, for example, humidified N ₂ gas or the like is preferably used.

In the above-described binder removal processing, firing and annealing, for example, a wetter or the like may be used to wet the N ₂ gas, mixed gas, or the like. In this case, the water temperature is preferably about 5 to 75 ° C.

The binder removal treatment, firing and annealing may be performed continuously or independently. When these are performed continuously, after removing the binder, the atmosphere is changed without cooling, and then the temperature is raised to the holding temperature at the time of baking to perform baking, and then cooled to reach the annealing holding temperature. Sometimes it is preferable to perform annealing by changing the atmosphere. On the other hand, when performing these independently, at the time of firing, after raising the temperature under N ₂ gas atmosphere with N ₂ gas or wet to the holding temperature of the binder removal processing, further continuing the heating to change the atmosphere Preferably, after cooling to the holding temperature at the time of annealing, it is preferable to change to the N ₂ gas or humidified N ₂ gas atmosphere again and continue cooling. In annealing, the temperature may be changed to a holding temperature in an N ₂ gas atmosphere, and then the atmosphere may be changed, or the entire annealing process may be a humidified N ₂ gas atmosphere.

The capacitor element body obtained as described above is subjected to end surface polishing, for example, by barrel polishing or sand blasting, and the external electrode paste is printed or transferred and baked to form the external electrode 4. The firing conditions of the external electrode paste are preferably, for example, about 10 minutes to 1 hour at 600 to 800 ° C. in a humidified mixed gas of N ₂ and H ₂ . Then, if necessary, a coating layer is formed on the surface of the external electrode 4 by plating or the like.

  The multilayer ceramic capacitor of the present invention thus manufactured is mounted on a printed circuit board by soldering or the like and used for various electronic devices.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to such embodiment at all, Of course, in the range which does not deviate from the summary of this invention, it can implement in various aspects. .

  For example, in the above-described embodiment, the multilayer ceramic capacitor is exemplified as the electronic component according to the present invention. However, the electronic component according to the present invention is not limited to the multilayer ceramic capacitor, and is composed of a dielectric ceramic composition having the above composition. Any material having a dielectric layer can be used.

  Next, the present invention will be described in more detail with reference to examples that further embody the embodiment of the present invention. However, the present invention is not limited to only these examples.

Example 1
First, as starting materials for producing a dielectric material, a main component material (BaTiO ₃ ) and first to seventh subcomponent materials having an average particle diameter of 0.1 to 1 μm were prepared. Carbonates (first subcomponent: MgCO ₃ , fourth subcomponent: MnCO ₃ ) are used as raw materials for MgO and MnO, and oxides (second subcomponent: Y ₂ O ₃ , _third subcomponents) are used as the other raw materials. Component: (Ba _0.6 Ca _0.4 ) SiO ₃ , fifth subcomponent: V ₂ O ₅ , sixth subcomponent: CaZrO ₃ , and seventh subcomponent: Al ₂ O ₃ ) were used. The second subcomponent (Ba _0.6 Ca _0.4 ) SiO ₃ is obtained by wet-mixing BaCO ₃ , CaCO ₃ and SiO ₂ with a ball mill for 16 hours, drying, and firing in air at 1150 ° C., It was manufactured by wet grinding with a ball mill for 100 hours. CaZrO _{3 as} the sixth subcomponent was produced by wet mixing CaCO ₃ and ZrO ₂ with a ball mill for 16 hours, drying, firing in air at 1150 ° C., and further wet pulverizing with a ball mill for 24 hours.

In addition, BaTiO _{3 as} a main component is obtained by weighing BaCO ₃ and TiO ₂ respectively, wet-mixing them for about 16 hours using a ball mill, drying them, and then firing them in air at a temperature of 1100 ° C. Similar characteristics were obtained even when a ball mill was used for approximately 16 hours of wet pulverization. Further, the same characteristics were obtained even when BaTiO ₃ as the main component was produced by hydrothermal synthesis powder, oxalate method or the like.

These raw materials are blended so that the composition after firing is as shown in Table 1 with respect to 100 moles of BaTiO _{3 as} a main component, wet mixed by a ball mill for 16 hours, and dried to obtain a dielectric material. It was.

  Next, 100 parts by weight of the obtained dielectric material after drying, 4.8 parts by weight of acrylic resin, 100 parts by weight of ethyl acetate, 6 parts by weight of mineral spirit, and 4 parts by weight of toluene were mixed with a ball mill. A dielectric layer paste was obtained by pasting.

  Next, 100 parts by weight of Ni particles having an average particle size of 0.2 to 0.8 μm, 40 parts by weight of an organic vehicle (8 parts by weight of ethyl cellulose dissolved in 92 parts by weight of butyl carbitol), and 10 parts by weight of butyl carbitol Were kneaded with three rolls to obtain a paste, and an internal electrode layer paste was obtained.

  Next, 100 parts by weight of Cu particles having an average particle size of 0.5 μm, 35 parts by weight of an organic vehicle (8 parts by weight of ethyl cellulose resin dissolved in 92 parts by weight of butyl carbitol) and 7 parts by weight of butyl carbitol were kneaded. To obtain a paste for an external electrode.

  Next, a 4.5 μm-thick green sheet was formed on the PET film using the dielectric layer paste, and the internal electrode layer paste was printed thereon, and then the green sheet was peeled from the PET film. Next, these green sheets and protective green sheets (not printed with internal electrode layer paste) were laminated and pressure-bonded to obtain green chips. The number of sheets having internal electrodes was four.

  Next, the green chip was cut into a predetermined size and subjected to binder removal processing, firing and annealing to obtain a multilayer ceramic fired body.

  The binder removal treatment was performed under conditions of a temperature rising time of 15 ° C./hour, a holding temperature of 280 ° C., a holding time of 2 hours, and an air atmosphere.

Firing is performed in a temperature rising rate of 200 ° C./hour, a holding temperature of 1260 to 1340 ° C., a holding time of 2 hours, a cooling rate of 300 ° C./hour, and a humidified N ₂ + H ₂ mixed gas atmosphere (oxygen partial pressure is 10 ⁻⁶ Pa). Performed under conditions.

  The annealing was performed under the conditions of a holding temperature of 1050 ° C., a temperature holding time of 2 hours, a cooling rate of 300 ° C./hour, and a nitrogen atmosphere. Note that a wetter with a water temperature of 35 ° C. was used for humidifying the atmospheric gas during the debinding process and firing.

Next, after polishing the end face of the multilayer ceramic fired body by sand blasting, the external electrode paste is transferred to the end face and fired at 800 ° C. for 10 minutes in a humidified N ₂ + H ₂ atmosphere to form the external electrode. A sample of the multilayer ceramic capacitor having the configuration shown in FIG. 1 was obtained.

  The size of each sample thus obtained is 3.2 mm × 1.6 mm × 0.6 mm, the number of dielectric layers sandwiched between internal electrode layers is 4, and the thickness is 3.5 μm. The thickness of the internal electrode layer was 1.0 μm.

  The obtained capacitor sample was evaluated for IR temperature dependency (digit loss), capacitance temperature characteristic (Tc), and TC bias. The results are shown in Table 1.

The IR temperature dependency (digit loss) was evaluated by measuring the insulation resistance IR ₁₅₀ at 150 ° C. and the insulation resistance IR _{25 at} 25 ° C. of the obtained sample, and calculating the digit loss represented by the following formula 1. . The evaluation criterion was -2.00 or better.
log (IR ₁₅₀ / IR ₂₅ ) ... Equation 1
The insulation resistance at each temperature was measured using a variable temperature IR measuring instrument at a measurement voltage of 7.0 V / μm and a voltage application time of 60 s.

  For the capacity-temperature characteristic (Tc), the capacitance was measured in the temperature range of −55 ° C. to 150 ° C. for the obtained sample. The capacitance was measured using a digital LCR meter (YHP 4274A) under the conditions of a frequency of 1 kHz and an input signal level of 1 Vrms. Then, the rate of change in capacitance (ΔC / C. The unit is%) under a temperature environment of 150 ° C. at which the capacity-temperature characteristic becomes the worst in these temperature ranges is calculated, and the X8R characteristic (−55 to 150 ° C. is calculated). , ΔC / C = within ± 15%).

  The TC bias is obtained by changing the temperature of the obtained sample from −55 ° C. to 150 ° C. with a digital LCR meter (YHP 4274A) at a bias voltage (DC voltage) of 1 kHz, 1 Vrms, 7.0 V / μm. Measurement was performed, and the rate of change in capacitance was calculated and evaluated from a measured value during application of no bias voltage at 25 ° C. The capacitance was measured using an LCR meter under conditions of a frequency of 1 kHz and an input signal level of 1 Vrms. The evaluation standard was -40% or better.

  In addition, relative permittivity (ε), dielectric loss (tan δ), IR life under DC electric field, DC breakdown strength, DC bias characteristics (dependence of dielectric constant on DC voltage application) for the obtained capacitor sample Was also evaluated.

  The relative dielectric constant ε was measured for a capacitor sample at a reference temperature of 25 ° C. using a digital LCR meter (4274A manufactured by YHP) under the conditions of a frequency of 1 kHz and an input signal level (measurement voltage) of 1.0 Vrms. Calculated from the electric capacity (no unit). As a result, all the samples had a good result of 1000 or more.

  Dielectric loss (tan δ) was measured with a digital LCR meter (YHP 4274A) at a reference temperature of 25 ° C. and a frequency of 1 kHz and an input signal level (measurement voltage) of 1.0 Vrms with respect to a capacitor sample. . As a result, good results were obtained for all samples of 10% or less.

  The IR life under a direct current electric field was calculated by performing an acceleration test on a capacitor sample at 200 ° C. under an electric field of 10 V / μm, and calculating the time until the insulation resistance was 1 MΩ or less as the life time. As a result, good results were obtained for all samples of 10 hours or more.

  The DC breakdown strength is 100 V / sec. The voltage (DC breakdown voltage VB, unit is V / μm) when a leakage current of 100 mA was detected was measured and the average value was calculated. As a result, good results were obtained for all samples of 100 V / μm or more.

  The DC bias characteristics were plotted by measuring the change in capacitance (ΔC / C) when a DC voltage was gradually applied to each sample at a constant temperature (25 ° C.) with respect to the capacitor sample. As a result, it was confirmed that any sample had a stable DC bias characteristic because the capacitance was difficult to decrease even when a high voltage was applied.

As shown in Table 1, if the content of the seventh subcomponent is too small, the X8R characteristic is satisfied, but the IR loss is over -2.00, the IR temperature dependency is deteriorated, and the TC bias characteristic is also improved. Getting worse. If the content of the seventh subcomponent is too large, the IR temperature dependency is improved, but the X8R characteristics cannot be satisfied.
On the other hand, it can be confirmed that the content of the seventh subcomponent is in the appropriate range, satisfies the X8R characteristic, and the IR loss becomes −2.00 or more, and the IR temperature dependency is improved. It was.

Example 2
A capacitor sample was prepared in the same manner as in Example 1 except that the type and content of the seventh subcomponent material were changed as shown in Tables 2 to 5, and the same evaluation was performed.

As shown in Tables 2 to 4, even if the seventh subcomponent material is changed to Cr ₂ O ₃ , Ge ₂ O ₂ , or Ga ₂ O ₃ , the same effect as that of Al ₂ O _{3 of} Example 1 can be obtained. Can be confirmed.

As shown in Table 5, it can be confirmed that even if the seventh subcomponent material is changed to a composite form of Al ₂ O ₃ and Cr ₂ O ₃ , the same effect as that obtained when Al ₂ O ₃ is added alone can be obtained. .

Comparative Example 1
A capacitor sample was prepared in the same manner as in Example 1 except that the type and content of the seventh subcomponent material were changed as shown in Table 6, and the same evaluation was performed.

  As shown in Table 6, when the effective ionic radius at the time of 6 coordination is changed to a cation element P (0.052 nm) or K (0.152 nm) outside the appropriate range, the content is set to the appropriate range. However, it was confirmed that the effect of adding the seventh subcomponent could not be obtained.

FIG. 1 is a cross-sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Multilayer ceramic capacitor 10 ... Capacitor element main body 2 ... Dielectric layer 3 ... Internal electrode layer 4 ... External electrode

Claims (3)

A main component consisting of barium titanate,
A first subcomponent comprising an oxide of AE (where AE is at least one selected from Mg, Ca, Ba and Sr);
A second subcomponent comprising an oxide of R (where R is at least one selected from Y, Dy, Tm, Ho and Er);
MxSiO ₃ (where M is at least one selected from Ba, Ca, Sr, Li, and B. When M = Ba, x = 1, when M = Ca, x = 1, M A third subcomponent consisting of x = 1 for S =, x = 2 for M = Li, and x = 2/3 for M = B;
A fourth subcomponent comprising MnO;
A fifth subcomponent consisting of at least one selected from V ₂ O ₅ , MoO ₃ and WO ₃ ;
A sixth subcomponent consisting of CaZrO ₃ ;
A dielectric ceramic composition comprising a seventh subcomponent comprising an oxide of A (where A is at least one selected from the group of cation elements of Al, Cr, Ga, Ge ),
The ratio of each subcomponent to 100 moles of the main component is
First subcomponent: 0 to 0.1 mol (excluding 0 mol and 0.1 mol),
Second subcomponent: 1 to 7 mol (excluding 1 mol and 7 mol),
Third subcomponent: 2 to 10 mol,
Fourth subcomponent: 0 to 0.5 mol (excluding 0 mol),
5th subcomponent: 0.01-0.5 mol,
Sixth subcomponent: 0 to 5 mol (excluding 0 mol and 5 mol),
Seventh subcomponent: 1 to 3.5 mol (excluding 1 mol and 3.5 mol; value converted to oxide A),
A dielectric ceramic composition wherein the ratio of the number of moles of the second subcomponent to the number of moles of the first subcomponent (second subcomponent / first subcomponent) is 10 to 500 (excluding 10 and 500). An electronic component having a dielectric layer composed of a dielectric ceramic composition,
The dielectric ceramic composition comprises a main component comprising barium titanate;
A first subcomponent comprising an oxide of AE (where AE is at least one selected from Mg, Ca, Ba and Sr);
A second subcomponent comprising an oxide of R (where R is at least one selected from Y, Dy, Tm, Ho and Er);
MxSiO ₃ (where M is at least one selected from Ba, Ca, Sr, Li, and B. When M = Ba, x = 1, when M = Ca, x = 1, M A third subcomponent consisting of x = 1 for S =, x = 2 for M = Li, and x = 2/3 for M = B;
A fourth subcomponent comprising MnO;
A fifth subcomponent consisting of at least one selected from V ₂ O ₅ , MoO ₃ and WO ₃ ;
A sixth subcomponent consisting of CaZrO ₃ ;
A seventh subcomponent consisting of an oxide of A (where A is at least one selected from the group of cation elements of Al, Cr, Ga, Ge ),
The ratio of each subcomponent to 100 moles of the main component is
First subcomponent: 0 to 0.1 mol (excluding 0 mol and 0.1 mol),
Second subcomponent: 1 to 7 mol (excluding 1 mol and 7 mol),
Third subcomponent: 2 to 10 mol,
Fourth subcomponent: 0 to 0.5 mol (excluding 0 mol),
5th subcomponent: 0.01-0.5 mol,
Sixth subcomponent: 0 to 5 mol (excluding 0 mol and 5 mol),
Seventh subcomponent: 1 to 3.5 mol (excluding 1 mol and 3.5 mol; value converted to oxide A),
An electronic component in which the ratio of the number of moles of the second subcomponent to the number of moles of the first subcomponent (second subcomponent / first subcomponent) is 10 to 500 (excluding 10 and 500). A multilayer ceramic capacitor having a capacitor element body in which dielectric layers composed of dielectric ceramic compositions and internal electrode layers are alternately laminated,
The dielectric ceramic composition comprises a main component comprising barium titanate;
A first subcomponent comprising an oxide of AE (where AE is at least one selected from Mg, Ca, Ba and Sr);
A second subcomponent comprising an oxide of R (where R is at least one selected from Y, Dy, Tm, Ho and Er);
MxSiO ₃ (where M is at least one selected from Ba, Ca, Sr, Li, and B. When M = Ba, x = 1, when M = Ca, x = 1, M A third subcomponent consisting of x = 1 for S =, x = 2 for M = Li, and x = 2/3 for M = B;
A fourth subcomponent comprising MnO;
A fifth subcomponent consisting of at least one selected from V ₂ O ₅ , MoO ₃ and WO ₃ ;
A sixth subcomponent consisting of CaZrO ₃ ;
Oxide of A (where, A is, Al, Cr, Ga, at least one selected from cationic group of elements Ge) and a seventh auxiliary component composed of, has,
The ratio of each subcomponent to 100 moles of the main component is
First subcomponent: 0 to 0.1 mol (excluding 0 mol and 0.1 mol),
Second subcomponent: 1 to 7 mol (excluding 1 mol and 7 mol),
Third subcomponent: 2 to 10 mol,
Fourth subcomponent: 0 to 0.5 mol (excluding 0 mol),
5th subcomponent: 0.01-0.5 mol,
Sixth subcomponent: 0 to 5 mol (excluding 0 mol and 5 mol),
Seventh subcomponent: 1 to 3.5 mol (excluding 1 mol and 3.5 mol; value converted to oxide A),
A multilayer ceramic capacitor wherein a ratio of the number of moles of the second subcomponent to the number of moles of the first subcomponent (second subcomponent / first subcomponent) is 10 to 500 (excluding 10 and 500).

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