JP4631984B2 - Circuit member connecting adhesive, circuit board, and manufacturing method thereof - Google Patents

Description

  In the present invention, for example, a circuit chip connecting adhesive is used to bond and fix a semiconductor chip and a substrate by a flip chip mounting method and to electrically connect both electrodes to each other. It is related with a circuit board and its manufacturing method.

  In the semiconductor mounting field, flip chip mounting, in which an IC (Integrated Circuit) chip is directly mounted on a printed circuit board or a flexible wiring board, is attracting attention as a new mounting form corresponding to cost reduction and high accuracy.

  As a flip chip mounting method, there are known a method in which solder bumps are provided on the terminals of the chip and solder connection is performed, and a method in which electrical connection is performed through a conductive adhesive. In these methods, when exposed to various environments, there is a problem that stress based on the difference in thermal expansion coefficient between the chip to be connected and the substrate is generated at the connection interface and connection reliability is lowered. For this reason, in general, a method of injecting an epoxy resin-based underfill material into the gap between the chip and the substrate for the purpose of alleviating the stress at the connection interface has been studied.

  However, the underfill injection process complicates the process and is disadvantageous in terms of productivity and cost. In order to solve such a problem, flip chip mounting using an anisotropic conductive adhesive having anisotropic conductivity and a sealing function has recently attracted attention from the viewpoint of process simplicity.

  However, when the chip is directly mounted on the substrate via the anisotropic conductive adhesive, stress based on the difference in thermal expansion coefficient between the chip and the substrate is generated in the temperature cycle test at the connection portion. Therefore, the thermal shock test, PCT (Pressure Cooker When a reliability test such as a test test or a solder bath immersion test is performed, there is a problem that the connection resistance increases or the adhesive peels off. Further, when a protruding electrode is formed on the connection terminal of the chip, stress based on a difference in thermal expansion coefficient between the chip and the substrate is concentrated on the interface between the protruding electrode and the chip in the reliability test, and the protruding electrode is the chip electrode. There is a problem that peeling from the interface causes poor conduction.

  The present invention relates to an adhesive for circuit member connection that does not increase connection resistance at the connection part and does not peel off the adhesive, and greatly improves connection reliability, a circuit board to which circuit members are connected, and a method for manufacturing the circuit board And provide.

  The first circuit member connecting adhesive of the present invention is interposed between circuit electrodes facing each other, presses the circuit electrodes facing each other, and electrically connects the electrodes in the pressurizing direction. An adhesive for use, comprising an adhesive resin composition and an inorganic filler, and containing 10 to 200 parts by weight of the inorganic filler with respect to 100 parts by weight of the adhesive resin composition.

  The second adhesive for connecting a circuit member of the present invention is a circuit member for interposing between opposing circuit electrodes, pressurizing the opposing circuit electrodes, and electrically connecting the electrodes in the pressurizing direction. A first adhesive layer comprising a bonding resin composition and an inorganic filler, and containing 10 to 200 parts by weight of the inorganic filler with respect to 100 parts by weight of the adhesive resin composition; It has a multilayer structure including a second adhesive layer mainly composed of a resin composition.

  The third circuit member connecting adhesive of the present invention is interposed between the circuit electrodes facing each other, and pressurizes the circuit electrodes facing each other to electrically connect the electrodes in the pressurizing direction. An adhesive for connecting circuit members, comprising an adhesive resin composition and an inorganic filler, wherein an average coefficient of thermal expansion at 110 to 130 ° C. after curing of the adhesive is 200 ppm / ° C. or less. And The average coefficient of thermal expansion at 110 to 130 ° C. after curing of the adhesive is preferably 30 to 200 ppm / ° C.

  The fourth circuit member connecting adhesive of the present invention is a circuit member that is interposed between the opposing circuit electrodes and presses the opposing circuit electrodes to electrically connect the electrodes in the pressing direction. A connecting adhesive having a multilayer structure including a third adhesive layer and a fourth adhesive layer having different physical property values.

  The elastic modulus after curing of the adhesive is such that the third adhesive layer> the fourth adhesive layer, and the elastic modulus at 40 ° C. after curing of the fourth adhesive layer is 100 to 2000 MPa. preferable.

  Further, the thermal expansion coefficient of the adhesive is the third adhesive layer <the fourth adhesive layer, and the thermal expansion coefficient of the third adhesive layer from 30 to 100 ° C. is 20 to 70 ppm / ° C. It is preferable.

  Moreover, it is preferable that the glass transition temperature of an adhesive is 3rd adhesive layer> 4th adhesive layer, and the glass transition temperature of a 3rd adhesive layer is 120 degreeC or more.

  At least one of the third and fourth adhesive layers may contain 10 to 200 parts by weight of an inorganic filler with respect to 100 parts by weight of the adhesive resin composition.

  The said adhesive agent can contain 0.1-30 volume parts of electroconductive particles with respect to 100 volume parts of adhesive resin compositions.

  In the said adhesive agent, it is preferable that the elasticity modulus in 40 degreeC after hardening of an adhesive resin composition is 30-2000 Mpa.

  The adhesive composition can contain an epoxy resin, an acrylic rubber, and a latent curing agent, and the acrylic rubber preferably contains a glycidyl ether group in the molecule.

  The adhesive may have a film shape.

The circuit board of the present invention
A first circuit member having a first connection terminal;
A second circuit member having a second connection terminal;
The first connection terminal and the second connection terminal are arranged to face each other,
An adhesive is interposed between the first connection terminal and the second connection terminal arranged opposite to each other,
A circuit board in which the first connection terminal and the second connection terminal that are disposed opposite to each other by heating and pressing are electrically connected,
The adhesive is the adhesive for connecting circuit members of the present invention.

  The first circuit member having the first connection terminal is an inorganic insulating substrate having the first connection terminal, and the second circuit member having the second connection terminal is an organic insulating substrate having the second connection terminal. In this case, the first adhesive layer or the third adhesive layer of the multi-layered adhesive is used by being adhered to the first circuit member side.

  The adhesive for connecting a circuit member of the present invention is interposed between circuit electrodes facing each other, presses the circuit electrodes facing each other, and electrically connects the electrodes in the pressurizing direction. An adhesive for circuit member connection containing an adhesive resin composition and an inorganic filler, and containing 10 to 200 parts by weight of the inorganic filler with respect to 100 parts by weight of the adhesive resin composition, or an adhesive resin composition For connecting a circuit member having a multilayer structure comprising a first adhesive layer containing 10 to 200 parts by weight of an inorganic filler with respect to 100 parts by weight and a second adhesive layer mainly composed of an adhesive resin composition It is an adhesive. In such an adhesive for adhering circuit members of the present invention, the adhesive resin composition of the adhesive for connecting circuit members containing 10 to 200 parts by weight of an inorganic filler with respect to 100 parts by weight of the adhesive resin composition is cured. The elastic modulus at 40 ° C. is preferably 30 to 2000 MPa. At this time, the elastic modulus at 40 ° C. of the adhesive can be 100 to 5000 MPa, preferably more than 2000 MPa and 3500 MPa or less.

  If the elastic modulus at 40 ° C. after curing of the adhesive resin composition is 30 to 2000 MPa, and an inorganic filler is contained, the elastic modulus at 40 ° C. of the adhesive exceeds 2000 MPa. The thermal expansion coefficient can be reduced by the inorganic filler as well as the stress relaxation by the resin composition, and an adhesive for connecting circuit members excellent in connection reliability can be provided.

  The second adhesive layer containing the adhesive resin composition as a main component preferably contains no inorganic filler, but an amount smaller than the amount of the inorganic filler in the first adhesive layer in order to adjust the characteristics, For example, it can be contained in an amount of less than 50% by weight, preferably less than 20% by weight.

  Moreover, the 2nd adhesive bond layer which has an adhesive resin composition as a main component can be made into the adhesive bond layer whose elasticity modulus in 40 degreeC after hardening is 100-2000 Mpa.

  The multi-layered adhesive used in the present invention is desirably arranged in accordance with the elastic modulus or thermal expansion coefficient of the circuit members to be connected. That is, the third adhesive layer side having a relatively large elastic modulus, a low thermal expansion coefficient, or a high glass transition temperature is relatively positioned on the side where the elastic modulus of the circuit member is relatively large or the thermal expansion coefficient is small. The fourth adhesive layer side having a relatively low elastic modulus, a large thermal expansion coefficient, or a low glass transition temperature is adhered to the side having a low elastic modulus or a large thermal expansion coefficient. It is desirable to arrange.

  In the adhesive having a multi-layer structure used in the present invention, for example, when connecting a semiconductor chip and an organic insulating substrate, the organic insulating substrate is used for the purpose of relieving stress based on a difference in thermal expansion coefficient between the chip and the organic insulating substrate. The elastic modulus at 40 ° C. after curing of the fourth adhesive layer constituting the side surface is preferably 100 to 2000 MPa. The elastic modulus at 40 ° C. after curing of the third adhesive layer constituting the surface on the semiconductor chip side is larger than that of the fourth adhesive layer, and 500 to 5000 MPa is used.

  Moreover, the thermal expansion coefficient up to 30 to 100 ° C. of the third adhesive layer constituting the surface on the semiconductor chip side is 20 to 20 for the purpose of relaxing the stress based on the difference in thermal expansion coefficient between the semiconductor chip and the organic insulating substrate. It is preferable that it is 70 ppm / ° C., and the fourth adhesive layer constituting the surface on the organic insulating substrate side has a thermal expansion coefficient of 30 to 100 ° C. larger than that of the third adhesive layer, and is 30 to 100 ppm / ° C. Preferably there is.

  In addition, the glass transition temperature of the third adhesive layer constituting the surface on the semiconductor chip side is 120 ° C. or higher, more preferably 180 ° C. for the purpose of relieving stress based on the difference in thermal expansion coefficient between the semiconductor chip and the organic insulating substrate. The glass transition temperature of the fourth adhesive layer constituting the surface on the organic insulating substrate side is preferably smaller than that of the third adhesive layer.

  At least one of the third and fourth adhesive layers can contain an inorganic filler.

  The thermal expansion coefficient and glass transition temperature of the adhesive film cured product corresponding to the stage after the adhesive is bonded are, for example, Vacuum Riko Co., Ltd. thermomechanical tester TM-7000 (tensile mode, load 5 gf, 5 ° C./min. Temperature). In addition, hardening of an adhesive film is performed on the same conditions as the heating temperature and time at the time of an adhesion | attachment process, and hardening can be performed by immersing an adhesive film in an oil bath. Such a cured cured adhesive film has a heat generation of 90% or more of the total curing calorific value in measurement using DSC (Differential Scanning Calorimeter).

  As described above, according to the present invention, there is no increase in connection resistance at the connection portion or peeling of the adhesive, and it is possible to manufacture a circuit board with greatly improved connection reliability.

It is sectional drawing which shows an example of a structure of the electronic component apparatus of this invention. It is sectional drawing which shows an example of the connection state of an electronic component and a mounting board.

  The adhesive resin composition used in the present invention includes a mixture of an epoxy resin and a latent curing agent such as an imidazole series, a hydrazide series, a boron trifluoride-amine complex, a sulfonium salt, an amine imide, a polyamine salt, or dicyandiamide. An adhesive resin composition having an elastic modulus of 30 to 2000 MPa at 40 ° C. after bonding is preferable in order to relieve stress based on the difference in thermal expansion coefficient of circuit members.

  For example, as an adhesive resin composition that can obtain good fluidity and high connection reliability at the time of connection, epoxy resin, imidazole, hydrazide, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, What mixed the acrylic rubber with the latent hardeners, such as dicyandiamide, so that the elasticity modulus in 40 degreeC after adhesion | attachment may be 30-2000 Mpa is preferable.

  The elastic modulus of the cured adhesive resin composition corresponding to the stage after the adhesion of the adhesive resin composition is, for example, a rheology Co., Ltd. product Leospectra DVE-4 (tensile mode, frequency 10 Hz, 5 ° C./min. Measured from −40 ° C. to 250 ° C.) by the DVE method. In addition, hardening of an adhesive resin composition is performed on the same conditions as the heating temperature and time at the time of an adhesion | attachment process, and hardening can be performed by immersing an adhesive resin composition film in an oil bath. Such an adhesive resin composition film cured product has a heat generation of 90% or more of the total curing calorific value when measured using DSC.

Epoxy resins include bisphenol-type epoxy resins derived from epichlorohydrin and bisphenol A, F, AD, and the like, epoxy novolac resins derived from epichlorohydrin and phenol novolac and cresol novolac, and naphthalene-based compounds having a naphthalene ring. Various epoxy compounds having two or more glycidyl groups in one molecule such as epoxy resin, glycidylamine, glycidyl ether, biphenyl, and alicyclic can be used alone or in admixture of two or more. . These epoxy resins, impurity ions (Na ^+, Cl ^-, etc.) or hydrolyzable chlorine and the like using a high-purity product was reduced to 300ppm or less preferred in order to prevent electron migration.

  The epoxy resin is preferably a trifunctional or higher polyfunctional epoxy resin and / or a naphthalene-based epoxy resin for decreasing the thermal expansion coefficient and improving the glass transition temperature. Examples of the trifunctional or higher polyfunctional epoxy resin include phenol novolac type epoxy resin, cresol novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylolethane type epoxy resin, dicyclopentadiene phenol type epoxy resin and the like. Naphthalene-based epoxy resins have a skeleton containing at least one naphthalene ring in one molecule, and include naphthol-based and naphthalenediol-based resins.

  Examples of the acrylic rubber include a polymer or copolymer containing at least one of acrylic acid, acrylic acid ester, methacrylic acid ester, and acrylonitrile as a monomer component. Among them, glycidyl acrylate or glycidyl methacrylate containing a glycidyl ether group is used. A copolymer-based acrylic rubber is preferably used.

  The molecular weight of these acrylic rubbers is preferably 200,000 or more from the viewpoint of increasing the cohesive strength of the adhesive resin composition. When the blending amount of the acrylic rubber in the adhesive resin composition is 15% by weight or less, the elastic modulus at 40 ° C. after bonding exceeds 2000 MPa, and when it is 40% by weight or more, a low elastic modulus can be achieved. Since the melt viscosity at the time of connection increases and the exclusion of the molten adhesive between the connection electrodes or at the interface between the connection electrodes and the conductive particles decreases, the electrical continuity between the connection electrodes or between the connection electrodes and the conductive particles is reduced. Cannot be secured. For this reason, 15-40 weight% is preferable as an acrylic compounding quantity. Since these acrylic rubbers blended in the adhesive resin composition have a peak temperature of dielectric loss tangent due to the rubber component in the vicinity of 40 to 60 ° C., the elastic modulus of the adhesive composition can be reduced.

  The elastic modulus at 40 ° C. after curing of the adhesive resin composition is preferably 30 to 2000 MPa, and the elastic modulus at 40 ° C. of the adhesive can be 100 to 5000 MPa, and exceeds 2000 MPa. Can do.

  In addition, a thermoplastic resin such as a phenoxy resin can be blended in the adhesive in order to make film forming easier. In particular, the phenoxy resin is preferable because it has a similar structure to the epoxy resin and has characteristics such as excellent compatibility with the epoxy resin and excellent adhesion. For film formation, the adhesive composition consisting of at least epoxy resin, acrylic rubber, phenoxy resin, and latent curing agent and conductive particles are liquefied by dissolving or dispersing them in an organic solvent and applied to the surface of the peelable substrate. It is carried out by removing the solvent below the activation temperature of the curing agent. As the solvent used at this time, a mixed solvent of an aromatic hydrocarbon solvent and an oxygen-containing solvent is preferable because the solubility of the material is improved.

  The inorganic filler used in the present invention is not particularly limited, and examples thereof include powders such as fused silica, crystalline silica, calcium silicate, alumina, and calcium carbonate. The blending amount of the inorganic filler is 10 to 200 parts by weight with respect to 100 parts by weight of the adhesive resin composition, and the larger the blending amount, the more effective for reducing the thermal expansion coefficient. 20 to 90 parts by weight is preferable because poor conduction due to deterioration in adhesiveness and exclusion of the adhesive at the connection portion occurs and the thermal expansion coefficient cannot be sufficiently reduced when the blending amount is small. The average particle size is preferably 3 μm or less for the purpose of preventing poor conduction at the connection. In addition, it is desirable to use a spherical filler for the purpose of preventing a decrease in resin fluidity during connection and damage to the passivation film of the chip.

  In the adhesive of the present invention, conductive particles can be mixed and dispersed for the purpose of positively imparting anisotropic conductivity in order to absorb the height variation of the bumps of the chip and the substrate electrodes. In the present invention, the conductive particles are, for example, metal particles such as Au, Ag, Cu, and solder, and a polymer spherical core material such as polystyrene provided with a conductive layer such as Ni, Cu, Au, and solder. More preferred. Furthermore, a surface layer of Sn, Au, solder or the like can be formed on the surface of the conductive particles. The particle size needs to be smaller than the minimum distance between the electrodes of the substrate, and when there is a variation in the height of the electrodes, it is preferably larger than the variation in height, and preferably 1 to 10 μm. The amount of conductive particles dispersed in the adhesive is 0.1 to 30 parts by volume, preferably 0.2 to 15 parts by volume with respect to 100 parts by volume of the adhesive resin composition.

  The adhesive of the present invention can be used as a film adhesive.

  The film adhesive is liquefied by dissolving or dispersing an adhesive composition composed of epoxy resin, acrylic rubber, latent curing agent, etc. in an organic solvent, and is applied onto a peelable substrate to activate the curing agent. It can be obtained by removing the solvent below the temperature.

  For example, the multilayered film-like adhesive is a separator film (peelable) made of polyethylene terephthalate, fluorine-based resin, or the like, separately for each of the first or third film-like adhesive and the second or fourth film-like adhesive. The first or third film adhesive and the second or fourth film adhesive are laminated while being pressurized or heated simultaneously with the pressurization. A method of obtaining a film adhesive comprising the film adhesive of No. 3 and the second or fourth film adhesive, and the first or third film adhesive (or the second or (4th film adhesive) is formed, and the second or 4th film adhesive (or 1st or 3rd film adhesive) is applied to form the first or 3rd film. Film adhesive and the first Or there is a method of obtaining a fourth made of a film-like adhesive film adhesive.

  The total thickness of the first or third film adhesive and the film adhesive formed by laminating the second or fourth film adhesive is preferably 20 to 120 μm in total, The ratio of the individual thicknesses of the third film adhesive and the second or fourth film adhesive is the first or third film adhesive: second or fourth film adhesive = A range of 1: 9 to 9: 1 is preferable. In particular, in the connection between the semiconductor chip and the organic insulating substrate, the first or third film adhesive: the second or fourth film adhesive = 3: 7 to 7: 3 is more preferable. preferable.

  The film adhesive is preferably thicker than the gap between the first and second circuit members. In general, the film adhesive is preferably thicker than the gap by 5 μm or more.

  In the present invention, as the circuit member, a chip component such as a semiconductor chip, a resistor chip, a capacitor chip, a printed board, a substrate such as a flexible wiring board based on polyimide or polyester, and the like are used.

  A chip component has many connection terminals formed on a non-metallic inorganic insulating substrate such as silicon, glass, ceramics, and a compound semiconductor substrate. A printed circuit board, a substrate such as a flexible wiring board based on polyimide or polyester, Many connection terminals are formed on the organic insulating substrate.

  As a substrate on which chip components are mounted, an organic insulating substrate on which electrodes (connection terminals) corresponding to semiconductor chip terminals are formed is used.

  As an organic insulating substrate, a laminated board obtained by impregnating and curing a resin material such as a polyimide resin, an epoxy resin or a phenol resin on a glass substrate such as a polyimide resin or a polyester resin, or a glass cloth or a glass nonwoven fabric. Is used.

  An electrode for connecting to the chip terminal, a surface insulating layer on which the electrode is formed, a predetermined number of insulating layers, a predetermined number of wiring layers disposed between the insulating layers, and the predetermined electrode And a multilayer wiring board having conductive holes for electrically connecting the wiring layers can be used.

  As such a multilayer wiring board, a build-up multilayer in which insulating layers and conductor circuit layers are alternately formed on the surface of a substrate having an insulating layer using glass cloth or a wiring substrate having one or more conductor circuits A substrate is preferred.

  A resin film can be used for the surface insulating layer, and this resin film is an epoxy resin, a polyimide resin, a polyamide-imide resin, a modified polyphenylene ether resin, a phenoxy resin, an amide epoxy resin, a phenol resin, a mixture thereof, a copolymer, or the like. A film of heat-resistant thermoplastic engineering plastic such as polysulfone, polyethersulfone, polyetheretherketone, wholly aromatic liquid crystal polyester, and fluorine resin can be used. A resin film containing an organic or inorganic filler can be used. As the insulating layer made of a resin reinforced with a glass substrate, a prepreg obtained by impregnating and curing a resin such as an epoxy resin or a phenol resin on a glass substrate such as glass cloth or glass nonwoven fabric can be used.

  The circuit member is usually provided with a large number of connection terminals (or a single connection terminal in some cases), and at least one set of the circuit members is disposed so as to face at least a part of the connection terminals provided on the circuit members, An adhesive is interposed between the connection terminals arranged opposite to each other, and the connection terminals arranged opposite to each other by heating and pressing are electrically connected to form a circuit board.

  By heating and pressing at least one set of circuit members, the connection terminals arranged opposite to each other are electrically connected by direct contact or through conductive particles of an anisotropic conductive adhesive.

  On the electrode pad of the semiconductor chip or substrate, the bump formed by plating or the tip of the gold wire is melted with a torch or the like to form a gold ball, and after the ball is pressed onto the electrode pad, the wire is cut. Protruding electrodes such as wire bumps obtained in this way can be provided and used as connection terminals.

  A method for manufacturing a circuit board will be described by taking as an example a case where a first circuit member made of an inorganic insulating substrate and a second circuit member made of an organic insulating substrate are connected by a film adhesive.

  A first circuit member made of an inorganic insulating substrate having a first connection terminal, and a second circuit member made of an organic insulating substrate having a second connection terminal, the first connection terminal and the second connection member The connection terminals are arranged to face each other, and the adhesive for connecting circuit members of the present invention is provided between the first connection terminal and the second connection terminals arranged to face each other, the first or third adhesive layer. Is arranged so as to be on the first circuit member side, pressurized, and electrically connect the first connection terminal and the second connection terminal arranged opposite to each other. Circuit boards can be manufactured.

  Specifically, for example, first, the surface of the film-like second or fourth adhesive layer is brought into contact with the second circuit member, and the film-like adhesive is temporarily fixed to the second circuit member. Subsequently, the electrode of the first circuit member and the electrode of the second circuit member are aligned, and the film adhesive is 180 while applying a load of 20 to 150 gf per electrode from the first circuit member side. The film adhesive is cured by applying a temperature for 10 to 20 seconds so that the temperature becomes ~ 200 ° C. As a result, the electrode of the first circuit member and the electrode of the second circuit member are electrically connected, and at the same time, the connection between the first circuit member and the second circuit member is caused by the curing of the film adhesive. Hold.

  An example of connecting a semiconductor chip to a mounting substrate will be described with reference to FIGS. FIG. 1 shows an example in which a semiconductor chip and a mounting substrate are connected using an adhesive that does not contain conductive particles. FIG. 2 shows a connection portion in the case of FIG. 1 when the semiconductor chip and the mounting substrate are connected using an adhesive containing conductive particles.

  The electronic component device shown in FIG. 1 includes a mounting substrate 20 and a semiconductor chip 10 mounted thereon. FIG. 1 shows a part of the electronic component device. In practice, other components such as other semiconductor chips are mounted on the mounting substrate 20.

  The semiconductor chip 10 is provided with protruding electrodes (bumps) to be connection electrodes 11 on one surface. The connection electrode 11 is electrically connected to the mounting substrate.

  The mounting substrate 20 is connected to the plurality of insulating layers 21 and 22, the plurality of wiring layers 32 and 33 disposed via the insulating layers 21 and 22, and the connection electrode 11 of the semiconductor chip 10. And a conductor 34 provided through the insulating layers 21 and 22 in order to electrically connect a specific wiring layer of the wiring layers 32 and 33. In order to penetrate the conductor 34, the insulating layers 21 and 22 are provided with holes 25 for forming through holes at necessary places. That is, this mounting substrate constitutes a resin composite multilayer wiring board. Here, the wiring layer 32 is provided as an inner layer circuit, and the wiring layer 33 and the connection electrode terminal 31 are provided as an outer layer circuit. The connection electrode terminal 31 functions as a conductor circuit for mounting a chip thereon.

  The protruding electrodes (bumps) that are the connection electrodes 11 provided on the semiconductor chip 10 are aligned with the connection electrode terminals 31 provided on the surface of the mounting substrate 20. A film-like adhesive 40 for adhesion is disposed between the semiconductor chip 10 and the mounting substrate 20. In this state, by pressing and heating from the semiconductor chip 10 side, the adhesive 40 flows and hardens, whereby the connection electrode 11 provided on the semiconductor chip 10 and the connection electrode terminal provided on the surface of the mounting substrate 20. 31 is in direct mechanical contact to obtain an electrical connection.

  In the case of using an adhesive 40 such as an anisotropic conductive adhesive in which conductive particles 41 are dispersed, as shown in FIG. 2, the connection electrode 11 and the connection electrode terminal 31 have a conductive particle 41 between them. They are connected in an intervening state and are bonded and fixed. When the anisotropic conductive adhesive 40 is used, conduction is performed between the opposing electrodes through the conductive particles existing between the opposing electrodes in a state where the opposing electrode surfaces to be connected are pressed. In addition, between the adjacent electrodes, the adhesive contains conductive particles, but does not exhibit conductivity because the density of the conductive particles is low.

  The mounting substrate 20 includes at least one or more first insulating layers 21 made of a resin reinforced with a glass base material, and an outermost layer constituting at least one layer on the side to which the electronic component is bonded and fixed. Two insulating layers 22. In the example of FIG. 1, the second insulating layer 22 is also provided on the side different from the side on which the electronic component is bonded and fixed.

  According to the adhesive of the present invention, stress at the interface between the semiconductor chip and the circuit member connecting adhesive can be relieved. Further, when the elastic modulus at 40 ° C. is 30 to 2000 MPa as the adhesive resin composition, the adhesive is further bonded. Since the resin composition can absorb stress generated in reliability tests such as thermal shock, PCT and solder bath immersion tests, there is no increase in connection resistance or peeling of the adhesive even after reliability testing, and connection reliability The characteristics are greatly improved. According to the present invention, since it is possible to create a gradient of physical properties in the thickness direction of the adhesive for connecting circuit members, internal stress generated in reliability tests such as thermal shock, PCT and solder bath immersion tests can be absorbed, Even after the property test, there is no increase in connection resistance at the connection portion and no peeling of the adhesive, and connection reliability is improved. The film adhesive is also convenient for handling.

  Therefore, the adhesive of the present invention is applied in the pressing direction when connecting the LCD (Liquid Crystal Display) panel and TAB (Tape Automated Bonding), TAB and flexible circuit board, LCD panel and IC chip, and IC chip and printed board. It is preferably used only for electrical connection.

  The circuit board of the present invention can absorb the stress generated in the reliability test, and even after the reliability test, there is no increase in connection resistance and no peeling of the adhesive, and the connection reliability is greatly improved. Further, in the circuit board of the present invention, the stress at the interface between the chip and the adhesive can be relieved by using an adhesive film having a small coefficient of thermal expansion on the chip side. Peeling of the protruding electrode from the electrode pad under the test can be greatly reduced.

Reference example 1
To 400 g of ethyl acetate, 50 g of phenoxy resin and 125 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) Dissolved to give a 30% solution.

  Next, 325 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and fused silica (average particle size: 0.5 μm) is added to 100 parts by weight of the adhesive resin composition. On the other hand, 40 parts by weight and further 2% by volume of nickel particles (diameter: 3 μm) were dispersed to obtain a film coating solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film a having a thickness of 45 μm. In addition, the 40 degreeC elastic modulus measured with the dynamic viscoelasticity measuring device only of the adhesive resin composition except the fused silica and nickel particle of this adhesive film a was 800 MPa.

  Next, using the obtained adhesive film a, a chip (10 mm × 10 mm, thickness: 0.5 mm) with gold bumps (area: 80 μm × 80 μm, space 30 μm, height: 15 μm, number of bumps: 288), Connection with the Ni / Au plated Cu circuit printed circuit board was performed as follows.

First, the adhesive film a (12 mm × 12 mm) was attached to a Ni / Au plated Cu circuit printed board (electrode height: 20 μm, thickness: 0.8 mm) at 80 ° C. and 10 kgf / cm ² , and then the separator was peeled off. The alignment of the bumps of the chip and the Ni / Au plated Cu circuit printed circuit board (thickness: 0.8 mm) was performed. Subsequently, the main connection was performed by heating and pressing from above the chip under the conditions of 180 ° C., 30 g / bump, and 20 seconds.

The connection resistance after this connection is a maximum of 6 mΩ per bump, an average of 2 mΩ, and an insulation resistance of 10 ⁸ Ω or more. No change even after 10 seconds of immersion in a solder bath at 260 ° C. for 200 hours at 2 ° C., and good connection reliability was exhibited.

Reference example 2
To 525 g of ethyl acetate, 50 g of phenoxy resin and 175 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) Dissolved to give a 30% solution.

  Next, 275 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and fused silica (average particle diameter: 0.5 μm) is added to 100 parts by weight of the adhesive resin composition. On the other hand, 60 parts by weight and further 2% by volume of nickel particles (diameter: 5 μm) were dispersed to obtain a film coating solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film b having a thickness of 45 μm. The elastic modulus at 40 ° C. measured by a dynamic viscoelasticity measuring instrument using only the adhesive resin composition excluding fused silica and nickel particles of the adhesive film b was 400 MPa.

  Next, using the obtained adhesive film b, a chip (10 mm × 10 mm) with gold bumps (area: 80 μm × 80 μm, space 30 μm, height: 15 μm, number of bumps: 288), and Ni / Au plated Cu circuit print Connection to the substrate (electrode height: 20 μm, thickness: 0.8 mm) was performed as shown below.

First, an adhesive film b (12 mm × 12 mm) was attached to a Ni / Au plated Cu circuit printed board at 80 ° C. and 10 kgf / cm ² , then the separator was peeled off, and the chip bump and Ni / Au plated Cu circuit printed board And alignment. Next, main connection was performed by heating and pressing from above the chip under the conditions of 170 ° C., 30 g / bump, and 20 seconds.

The connection resistance after this connection is 18 mΩ at the maximum per bump, the average is ⁸ mΩ, and the insulation resistance is 10 ⁸ Ω or more. These values are the thermal shock test at −55 to 125 ° C., 1000 cycle treatment, PCT test (121 No change even after 10 seconds of immersion in a solder bath at 260 ° C. for 200 hours at 2 ° C., and good connection reliability was exhibited.

Reference example 3
50 g of phenoxy resin and 100 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) in 350 g of ethyl acetate Dissolved to give a 30% solution.

  Next, 350 g of liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and fused silica (average particle size: 0.5 μm) is added to 100 parts by weight of the adhesive resin composition. On the other hand, 60% by weight of conductive particles having an Au layer formed on the surface of a polystyrene core (diameter: 5 μm) were dispersed in an amount of 5% by volume to obtain a film coating solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film c having a thickness of 45 μm. The elastic modulus at 40 ° C. measured by a dynamic viscoelasticity measuring instrument using only the adhesive resin composition excluding fused silica and conductive particles of the adhesive film c was 1000 MPa.

  Next, using the obtained adhesive film c, a chip (10 mm × 10 mm, thickness: 0.5 mm) with gold bumps (area: 80 μm × 80 μm, space 30 μm, height: 15 μm, number of bumps: 288), Ni, / Au plating Cu circuit printed circuit board (electrode height: 20 μm, thickness: 0.8 mm) was connected as shown below.

First, an adhesive film c (12 mm × 12 mm) was attached to a Ni / Au plated Cu circuit printed board at 80 ° C. and 10 kgf / cm ² , and then the separator was peeled off, and the chip bump and the Ni / Au plated Cu circuit printed board And alignment. Next, main connection was performed by heating and pressing from above the chip under the conditions of 170 ° C., 30 g / bump, and 20 seconds.

The connection resistance after this connection is a maximum of 5 mΩ per bump, an average of 1.5 mΩ, and an insulation resistance of 10 ⁸ Ω or more. (121 ° C., 2 atm) No change even after 10 seconds of immersion in a solder bath at 260 ° C. for 200 hours, showing good connection reliability.

Reference example 4
50 g of phenoxy resin and 100 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) in 350 g of ethyl acetate Dissolved to give a 30% solution.

  Next, 350 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and 100 parts by weight of an adhesive resin composition is added with fused silica (average particle size: 0.5 μm). The conductive particles having an Au layer formed on the surface of a polystyrene core (diameter: 5 μm) were dispersed in an amount of 40% by weight, and a solution for film coating was obtained.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film d having a thickness of 45 μm. The elastic modulus at 40 ° C. measured by a dynamic viscoelasticity measuring instrument using only the adhesive resin composition excluding fused silica and conductive particles of the adhesive film d was 1000 MPa. Moreover, the average thermal expansion coefficient of 110-130 degreeC measured by TMA method of the adhesive film d was 111 ppm.

  Next, using the obtained adhesive film d, a chip (1.7 mm × 17 mm, thickness: 0.5 mm) with gold bumps (area: 50 μm × 50 μm, 362 bumps, space: 20 μm, height: 15 μm) and The connection with the ITO (Indium Tin Oxide) circuit-equipped glass substrate (thickness: 1.1 mm) was performed as follows.

First, an adhesive film d (12 mm × 12 mm) was attached to a glass substrate with an ITO circuit at 80 ° C. and 10 kgf / cm ² , and then the separator was peeled off to align the chip bumps with the glass substrate with an ITO circuit. It was. Next, main connection was performed by heating and pressing from above the chip under the conditions of 180 ° C., 40 g / bump, and 20 seconds.

The connection resistance after this connection is a maximum of 150 mΩ per bump, an average of 80 mΩ, and an insulation resistance of 10 ⁸ Ω or more. (° C., 1.2 atm.) No change even after 100 hours, showing good connection reliability.

Reference Example 5
To 400 g of ethyl acetate, 50 g of phenoxy resin and 125 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) Dissolved to give a 30% solution.

  Next, 325 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and fused silica (average particle size: 0.5 μm) is added to 100 parts by weight of the adhesive resin composition. On the other hand, 60 parts by weight and further 2% by volume of nickel particles (diameter: 5 μm) were dispersed to obtain a film coating solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film e having a thickness of 45 μm. The elastic modulus at 40 ° C. measured by a dynamic viscoelasticity measuring device using only the adhesive resin composition excluding fused silica and nickel particles of the adhesive film e was 800 MPa.

  Next, using the obtained adhesive film e, a bumpless chip (10 mm × 10 mm, thickness: 0.5 mm, pad electrode: Al, pad diameter: 120 μm), and Ni / Au plated Cu bump (diameter: on the circuit) Connection with a Ni / Au plated Cu circuit printed circuit board on which 100 μm, space 50 μm, height: 15 μm, number of bumps: 200) was formed was performed as shown below.

First, the adhesive film e (12 mm × 12 mm) was attached to a Ni / Au plated Cu circuit printed board (electrode height: 20 μm, thickness: 0.8 mm) at 80 ° C. and 10 kgf / cm ² , and then the separator was peeled off. The alignment of the Al pad of the chip and the Ni / Au plated Cu circuit printed board (thickness: 0.8 mm) with Ni / Au plated Cu bumps was performed. Subsequently, the main connection was performed by heating and pressing from above the chip under the conditions of 180 ° C., 30 g / bump, and 20 seconds.

The connection resistance after this connection is a maximum of 8 mΩ per bump, an average of 4 mΩ, and an insulation resistance of 10 ⁸ Ω or more, and these values are the thermal shock test at −55 to 125 ° C., 1000 cycle treatment, PCT test (121 No change even after 10 seconds of immersion in a solder bath at 260 ° C. for 200 hours at 2 ° C., and good connection reliability was exhibited.

Reference Example 6
To 400 g of ethyl acetate, 50 g of phenoxy resin and 125 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) Dissolved to give a 30% solution.

  Next, 325 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and 100 parts by weight of fused silica (average particle size: 0.5 μm) is added to the resin adhesive composition. A film coating solution was obtained by dispersing 40 parts by weight of the solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film f (thickness: 25 μm) as a first adhesive layer. ) Was formed. The elastic modulus at 40 ° C. measured by a dynamic viscoelasticity measuring device using only the adhesive resin composition excluding fused silica of the adhesive film f was 800 MPa.

  Further, an adhesive film g (thickness: 25 μm) as the second adhesive layer was produced in the same manner as the production of the adhesive film f except that 2% by volume of nickel particles (diameter: 3 μm) was dispersed instead of dispersing the fused silica. Formed. The obtained adhesive film g had an elastic modulus at 40 ° C. of 800 MPa.

  Next, the obtained adhesive film f and adhesive film g were laminated to obtain a laminated film adhesive h that was a composite film.

  Using this laminated film adhesive h, a chip (10 mm × 10 mm, thickness: 0.5 mm) with gold bumps (area: 80 μm × 80 μm, space 30 μm, height: 15 μm, number of bumps: 288), Ni / Connection with the Au plated Cu circuit printed circuit board was performed as shown below.

First, an adhesive film g (second adhesive layer) of this laminated film adhesive h (12 mm × 12 mm) is applied to a Ni / Au plated Cu circuit printed circuit board (electrode height: 20 μm, thickness: 0.8 mm). After bonding at 10 ° C. and 10 kgf / cm ² , the separator is peeled off, the chip is made to face the adhesive film f (first adhesive layer) side, the chip bump and the Ni / Au plated Cu circuit printed circuit board (thickness: 0.8mm). Next, the main connection was performed by heating and pressing from above the chip under the conditions of 180 ° C., 50 g / bump, and 20 seconds.

The connection resistance after this connection is a maximum of 6 mΩ per bump, an average of 2 mΩ, and an insulation resistance of 10 ⁸ Ω or more. No change even after 10 seconds of immersion in a solder bath at 260 ° C. for 200 hours at 2 ° C., and good connection reliability was exhibited.

Reference Example 7
To 525 g of ethyl acetate, 50 g of phenoxy resin and 175 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) Dissolved to give a 30% solution.

  Next, 275 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution, stirred, and fused silica (average particle size: 1 μm) is added to 100 parts by weight of the adhesive resin composition. 60 parts by weight were dispersed to obtain a film coating solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater, dried at 100 ° C. for 10 minutes, and then an adhesive film i corresponding to the first adhesive layer (thickness: 20 μm). ) Was formed. The elastic modulus at 40 ° C. measured by a dynamic viscoelasticity measuring device using only the adhesive resin composition excluding the fused silica of the adhesive film i was 400 MPa.

  Further, an adhesive film j (thickness: 20 μm) corresponding to the second adhesive layer was prepared in the same manner as the production of the adhesive film i except that 2% by volume of nickel particles (diameter: 5 μm) was dispersed instead of dispersing the fused silica. Formed. The obtained adhesive film j had an elastic modulus at 40 ° C. of 400 MPa.

  Next, the obtained adhesive film i and adhesive film j were laminated to obtain a laminated film adhesive k which was a composite film. Using this laminated film adhesive k, a chip (10 mm × 10 mm, thickness: 0.5 mm) with gold bumps (area: 80 μm × 80 μm, space 30 μm, height: 15 μm, number of bumps: 288), Ni / Connection with the Au plated Cu circuit printed circuit board was performed as shown below.

First, an adhesive film j (second adhesive layer) of this laminated film adhesive k (12 mm × 12 mm) is applied to a Ni / Au plated Cu circuit printed board (electrode height: 20 μm, thickness: 0.8 mm). After bonding at 10 ° C. and 10 kgf / cm ² , the separator is peeled off, the chip is made to face the adhesive film i (first adhesive layer) side, the chip bump and the Ni / Au plated Cu circuit printed circuit board (thickness: 0) .8 mm). Next, the main connection was performed by heating and pressing from above the chip under the conditions of 180 ° C., 50 g / bump, and 20 seconds.

The connection resistance after this connection is a maximum of 18 mΩ per bump, an average of ⁸ mΩ, and an insulation resistance of 10 ⁸ Ω or more. No change even after 10 seconds of immersion in a solder bath at 260 ° C. for 200 hours at 2 ° C., and good connection reliability was exhibited.

Reference Example 8
50 g of phenoxy resin and 100 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) in 350 g of ethyl acetate Dissolved to give a 30% solution.

  Next, 350 g of liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and fused silica (average particle size: 0.5 μm) is added to 100 parts by weight of the adhesive resin composition. On the other hand, 60 parts by weight was dispersed to obtain a film coating solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater, dried at 100 ° C. for 10 minutes, and then an adhesive film m (thickness: 25 μm) corresponding to the first adhesive layer. Formed. The elastic modulus at 40 ° C. measured by a dynamic viscoelasticity measuring instrument using only the adhesive resin composition excluding fused silica of the adhesive film m was 1000 MPa.

  Further, in the same manner as the production of the adhesive film m, except that 5% by volume of conductive particles having an Au layer formed on the surface of a polystyrene core (diameter: 5 μm) was dispersed instead of dispersing the fused silica, the second An adhesive film n (thickness: 25 μm) corresponding to the adhesive layer was formed. The obtained adhesive film n had an elastic modulus at 40 ° C. of 1000 MPa.

  Next, the obtained adhesive film m and the adhesive film n were laminated to obtain a laminated film adhesive p which was a composite film. Using this laminated film adhesive p, a chip (10 mm × 10 mm, thickness: 0.5 mm) with gold bumps (area: 80 μm × 80 μm, space 30 μm, height: 15 μm, number of bumps: 288), Ni / Connection with the Au plated Cu circuit printed circuit board was performed as shown below.

First, an adhesive film n (second adhesive layer) of this laminated film adhesive p (12 mm × 12 mm) is applied to a Ni / Au plated Cu circuit printed circuit board (electrode height: 20 μm, thickness: 0.8 mm). After bonding at 10 ° C. and 10 kgf / cm ² , the separator is peeled off, the chip is made to face the adhesive film m (first adhesive layer) side, the chip bump and the Ni / Au plated Cu circuit printed circuit board (thickness: 0) .8 mm). Next, the main connection was performed by heating and pressing from above the chip under the conditions of 180 ° C., 50 g / bump, and 20 seconds.

The connection resistance after this connection is a maximum of 5 mΩ per bump, an average of 1.5 mΩ, and an insulation resistance of 10 ⁸ Ω or more. (121 ° C., 2 atm) No change even after 10 seconds of immersion in a solder bath at 260 ° C. for 200 hours, showing good connection reliability.

Reference Example 9
To 400 g of ethyl acetate, 50 g of phenoxy resin and 125 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) Dissolved to give a 30% solution.

  Next, 325 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution, stirred, and fused silica (average particle size: 0.5 μm) is added to 100 parts by weight of the adhesive resin composition. 60 parts by weight was dispersed to obtain a film coating solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 25 μm) with a roll coater, dried at 100 ° C. for 10 minutes, and then an adhesive film q (thickness: 25 μm) corresponding to the first adhesive layer. Formed. The elastic modulus at 40 ° C. of the adhesive film q measured by a dynamic viscoelasticity measuring device using only the adhesive resin composition excluding fused silica was 800 MPa.

  An adhesive film r (thickness: 25 μm) corresponding to the second adhesive layer was formed in the same manner as the production of the adhesive film q except that 2% by volume of nickel particles (diameter: 3 μm) was dispersed instead of dispersing the fused silica. . The obtained adhesive film r had an elastic modulus at 40 ° C. of 800 MPa.

  Next, the obtained adhesive film q and the adhesive film r were laminated to obtain a laminated film adhesive s as a composite film.

  Using this laminated film adhesive s, a bumpless chip (10 mm × 10 mm, thickness: 0.5 mm, pad electrode: Al, pad diameter: 120 μm) and Ni / Au plated Cu bump (diameter: 100 μm) on the circuit , Space 50 μm, height: 15 μm, number of bumps: 200) were formed and connected to a Ni / Au plated Cu circuit printed circuit board as shown below.

First, an adhesive film r (second adhesive layer) of this laminated film adhesive s (12 mm × 12 mm) is made of Ni / Au plated Cu bumps (diameter: 100 μm, space 50 μm, height: 15 μm, number of bumps: 200 ) Formed on an Ni / Au plated Cu circuit printed circuit board (electrode height: 20 μm, thickness: 0.8 mm) at 80 ° C. and 10 kgf / cm ² , and then the separator is peeled off to form an adhesive film q (first The chip was opposed to the adhesive layer) side, and the bumps of the chip and the Ni / Au plated Cu circuit printed circuit board (thickness: 0.8 mm) were aligned. Next, the main connection was performed by heating and pressing from above the chip under the conditions of 180 ° C., 50 g / bump, and 20 seconds.

The connection resistance after this connection is a maximum of 8 mΩ per bump, an average of 4 mΩ, and an insulation resistance of 10 ⁸ Ω or more. No change even after 10 seconds of immersion in a solder bath at 260 ° C. for 200 hours at 2 ° C., and good connection reliability was exhibited.

Example 10
195 g of phenoxy resin and 130 g of polyfunctional epoxy (epoxy equivalent: 212) were dissolved in 1,083 g of ethyl acetate to obtain a 30% solution.

  Next, 325 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution, stirred, and 2% by volume of nickel particles (diameter: 5 μm) are dispersed for film coating. A solution was obtained.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film t (thickness: 25 μm) corresponding to the third adhesive layer. ) Was formed. The cured adhesive film t had a thermal expansion coefficient of 45 ppm up to 30 to 100 ° C., a glass transition temperature of 150 ° C., and an elastic modulus at 40 ° C. of 2,600 MPa.

  Further, 50 g of phenoxy resin and 100 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (20 parts), acrylonitrile (30 parts), and glycidyl methacrylate (3 parts) in ethyl acetate Dissolved in 500 g, a 30% solution was obtained.

  Next, 350 g of liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution, stirred, and 2% by volume of nickel particles (diameter: 5 μm) are dispersed to form a film coating solution. Got.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film u corresponding to the fourth adhesive layer (thickness: 25 μm). Formed. The cured adhesive film u had a thermal expansion coefficient of 30 ppm to 30-100 ° C., a glass transition temperature of 125 ° C., and an elastic modulus at 40 ° C. of 1,000 MPa.

  Next, the adhesive film t and the adhesive film u were laminated to form a laminated film adhesive v (thickness: 50 μm) as a composite film.

  Next, using the obtained laminated film adhesive v, a chip (size: 10 × 10 mm, thickness: 0.55 mm) with gold bumps (height: 30 μm, number of bumps: 184), Ni / Au Connection with a plated Cu circuit printed board (electrode height: 20 μm, substrate thickness: 0.8 mm) was performed as shown below.

  First, with the adhesive film u (fourth adhesive layer) surface of the laminated film adhesive v (size: 12 × 12 mm) as the printed circuit board side, the Ni / Au plated Cu circuit printed circuit board has a temperature of 60 ° C. and 0.5 MPa. The laminated film adhesive v was temporarily connected under the conditions. After the temporary connection process, the bumps of the chip and the Ni / Au plated Cu circuit printed circuit board are aligned and the chip is placed on the laminated film adhesive v, followed by the conditions of 180 ° C., 50 g / bump, 20 seconds. The main connection was made by heating and pressing from above the chip.

The connection resistance after this connection is a maximum of 10 mΩ per bump, an average of 2 mΩ, and an insulation resistance of 10 ⁸ Ω or more. These values are 1000 cycles of a thermal shock test of −55 to 125 ° C. and 110 ° C. and 85% RH. The PCT test showed good connection reliability by in-situ resistance measurement during the test for 500 hours.

Example 11
195 g of phenoxy resin and 130 g of polyfunctional epoxy (epoxy equivalent: 212) were dissolved in 1,083 g of ethyl acetate to obtain a 30% solution.

  Next, 325 g of liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and fused silica (average particle size: 0.5 μm) is added to 100 parts by weight of the resin composition. Then, 20 parts by weight and 2% by volume of nickel particles (diameter: 5 μm) were dispersed to obtain a film coating solution.

  This film coating solution is applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater, and dried at 100 ° C. for 10 minutes to form an adhesive film w (thickness: 25 μm) corresponding to the third adhesive layer. Formed. The adhesive film w after curing had a thermal expansion coefficient of 38 ppm, glass transition temperature of 153 ° C., and an elastic modulus at 40 ° C. of 3,000 MPa.

  Further, 50 g of phenoxy resin and 100 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (20 parts), acrylonitrile (30 parts), and glycidyl methacrylate (3 parts) in ethyl acetate Dissolved in 500 g, a 30% solution was obtained.

  Next, 350 g of liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution and stirred, and fused silica (average particle size: 0.5 μm) is added to 100 parts by weight of the resin composition. Then, 20 parts by weight and 2% by volume of nickel particles (diameter: 5 μm) were dispersed to obtain a film coating solution.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater, dried at 100 ° C. for 10 minutes, and an adhesive film x (thickness: 25 μm) corresponding to the fourth adhesive layer Formed. The cured adhesive film x had a coefficient of thermal expansion of 30 ppm to 30-100 ° C., a glass transition temperature of 127 ° C., and an elastic modulus at 40 ° C. of 1,400 MPa.

  Next, the adhesive film w and the adhesive film x were laminated to form a laminated film adhesive y (thickness: 50 μm) as a composite film.

  Next, using the obtained laminated film adhesive y, a chip (size: 10 × 10 mm, thickness: 0.55 mm) with gold bumps (height: 30 μm, number of bumps: 184), Ni / Au Connection with a plated Cu circuit printed board (electrode height: 20 μm, substrate thickness: 0.8 mm) was performed as shown below.

  With the adhesive film x (fourth adhesive layer) surface of the laminated film adhesive y (size: 12 × 12 mm) as the printed circuit board side, the Ni / Au plated Cu circuit printed circuit board is subjected to conditions of 60 ° C. and 0.5 MPa. The laminated film adhesive y was temporarily connected. After the temporary connection step, the bumps of the chip and the Ni / Au plated Cu circuit printed circuit board are aligned and the chip is placed on the laminated film adhesive y, followed by the conditions of 180 ° C., 50 g / bump, 20 seconds. The main connection was made by heating and pressing from above the chip.

The connection resistance after this connection is a maximum of 10 mΩ per bump, an average of 2 mΩ, and an insulation resistance of 10 ⁸ Ω or more. The PCT test showed good connection reliability by in-situ resistance measurement during the test for 500 hours.

Comparative Example 1
Using the laminated film adhesive v obtained in Example 10, a chip (size: 10 × 10 mm, thickness: 0.55 mm) with gold bumps (height: 30 μm, number of bumps: 184), Ni / Connection with an Au plated Cu circuit printed circuit board (electrode height: 20 μm, substrate thickness: 0.8 mm) was performed in the same manner as in Example 10. However, in this comparative example, the surface of the adhesive film t (third adhesive layer) of the laminated film adhesive v (size: 12 × 12 mm) was the printed circuit board side.

The connection resistance after this connection was a maximum of 10 mΩ per bump, an average of 2 mΩ, and an insulation resistance of 10 ⁸ Ω or more, but these values were 500 cycles of a thermal shock test at −55 to 125 ° C. and 110 The electrical continuity was poor after 300 hours at 85 ° C. and PCT test.

Comparative Example 2
195 g of phenoxy resin and 130 g of polyfunctional epoxy (epoxy equivalent: 212) were dissolved in 1,083 g of ethyl acetate to obtain a 30% solution.

  Next, 325 g of a liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution, stirred, and further 2% by volume of nickel particles (diameter: 5 μm) are dispersed to form a film coating solution. Got.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film z having a thickness of 50 μm. The adhesive film z after curing had a coefficient of thermal expansion of 45 ppm, a glass transition temperature of 150 ° C., and an elastic modulus at 40 ° C. of 2,600 MPa.

  Next, using only the obtained adhesive film z, a chip (size: 10 × 10 mm, thickness: 0.55 mm) with gold bumps (height: 30 μm, number of bumps: 184), Ni / Au plating Cu Connection to a circuit printed board (electrode height: 20 μm, board thickness: 0.8 mm) was performed as shown below.

  First, the adhesive film z was temporarily connected to a Ni / Au plated Cu circuit printed circuit board at 60 ° C. and 0.5 MPa. After the temporary connection process, the bumps of the chip and the Ni / Au plated Cu circuit printed circuit board are aligned and the chip is placed on the adhesive film z, and then the upper part of the chip at 180 ° C., 50 g / bump, 20 seconds. Then, this connection was made by heating and pressurizing.

The connection resistance after this connection was 10 mΩ at the maximum per bump, 3 mΩ on average, and the insulation resistance was 10 ⁸ Ω or more. These values are 300 cycles of the thermal shock test at −55 to 125 ° C. Electrical continuity was poor after 10 seconds of immersion in the solder bath. As a result of cross-sectional observation of the connection portion, peeling of the adhesive film interface was observed in a part of the poor conduction portion.

Comparative Example 3
50 g of phenoxy resin and 100 g of acrylic rubber (molecular weight: 850,000) copolymerized with butyl acrylate (40 parts), ethyl acrylate (20 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) in 500 g of ethyl acetate Dissolved to give a 30% solution.

  Next, 350 g of liquid epoxy (epoxy equivalent: 185) containing a microcapsule-type latent curing agent is added to this solution, stirred, and 2% by volume of nickel particles (diameter: 5 μm) are dispersed to form a film coating solution. Got.

  This film coating solution was applied to a separator (silicone-treated polyethylene terephthalate film, thickness: 40 μm) with a roll coater and dried at 100 ° C. for 10 minutes to form an adhesive film α having a thickness of 25 μm. The cured adhesive film α had a thermal expansion coefficient of 30 ppm to 30 ° C., a glass transition temperature of 125 ° C., and an elastic modulus at 40 ° C. of 1,000 MPa.

  Next, using only the obtained adhesive film α, a chip (size: 10 × 10 mm, thickness: 0.55 mm) with gold bumps (height: 30 μm, number of bumps: 184), Ni / Au plating Cu Connection to a circuit printed board (electrode height: 20 μm, board thickness: 0.8 mm) was performed as shown below.

  First, the adhesive film α was temporarily connected to a Ni / Au plated Cu circuit printed circuit board at 60 ° C. and 0.5 MPa. After the temporary connection process, the bumps of the chip and the Ni / Au plated Cu circuit printed circuit board are aligned, and the chip is placed on the adhesive film α. Then, heating and pressurization were performed to make the main connection.

The connection resistance after this connection was a maximum of 10 mΩ per bump, an average of 2 mΩ, and an insulation resistance of 10 ⁸ Ω or more, but these values were the thermal shock test in 30 cycles of −55 to 125 ° C. There was a phenomenon that electrical continuity was poor during the high temperature test.

Claims (15)

A first circuit member having a first connection terminal and a second circuit member having a second connection terminal facing the first connection terminal; and the first connection terminal An adhesive for connecting a circuit member for electrically connecting the second connection terminal,
A third adhesive layer and a fourth adhesive layer;
The elastic modulus at 40 ° C. after curing of the fourth adhesive layer is 100 to 2000 MPa,
The elastic modulus at 40 ° C. after curing of the third adhesive layer is larger than the elastic modulus at 40 ° C. after curing of the fourth adhesive layer, and is 500 to 5000 MPa,
Of the first circuit member and the second circuit member, the third adhesive layer side is bonded to the side having a relatively large elastic modulus, and the fourth bond is bonded to the side having a relatively small elastic modulus. An adhesive for connecting circuit members, arranged so that the agent layer side is bonded. A first circuit member having a first connection terminal and a second circuit member having a second connection terminal facing the first connection terminal; and the first connection terminal An adhesive for connecting a circuit member for electrically connecting the second connection terminal,
A third adhesive layer and a fourth adhesive layer;
The elastic modulus at 40 ° C. after curing of the fourth adhesive layer is 100 to 2000 MPa,
The elastic modulus at 40 ° C. after curing of the third adhesive layer is larger than the elastic modulus at 40 ° C. after curing of the fourth adhesive layer, and is 500 to 5000 MPa,
Of the first circuit member and the second circuit member, the third adhesive layer side is bonded to the side having a relatively small thermal expansion coefficient, and the fourth circuit member is disposed to the side having a relatively large thermal expansion coefficient. An adhesive for connecting circuit members, which is arranged so that the adhesive layer side of is adhered. A first circuit member made of an inorganic insulating substrate having a first connection terminal; and a second circuit member made of an organic insulating substrate having a second connection terminal facing the first connection terminal. An adhesive for circuit member connection that is interposed between and electrically connects the first connection terminal and the second connection terminal,
A third adhesive layer and a fourth adhesive layer;
The elastic modulus at 40 ° C. after curing of the fourth adhesive layer is 100 to 2000 MPa,
The elastic modulus at 40 ° C. after curing of the third adhesive layer is larger than the elastic modulus at 40 ° C. after curing of the fourth adhesive layer, and is 500 to 5000 MPa,
Circuit member connecting adhesive arranged such that the third adhesive layer side is bonded to the first circuit member side and the fourth adhesive layer side is bonded to the second circuit member side . At least one of the third and fourth adhesive layers is:
An adhesive resin composition;
The adhesive for circuit member connection according to any one of claims 1 to 3 , comprising 10 to 200 parts by weight of an insulating inorganic filler with respect to 100 parts by weight of the adhesive resin composition. The adhesive for circuit member connection according to claim 4, wherein the insulating inorganic filler has an average particle size of 3 μm or less. The adhesive layer is
The adhesive for circuit member connection according to claim 4 or 5 , comprising 0.1 to 30 parts by volume of conductive particles with respect to 100 parts by volume of the adhesive resin composition. The adhesive layer is
The large conductive particles having an average particle diameter than the average particle diameter of the insulating inorganic filler, any of claims 4 to 6 containing 0.1 to 30 parts by volume with respect to the adhesive resin composition 100 parts by volume of The adhesive for a circuit member connection according to claim 1. The adhesive for circuit member connection according to any one of claims 4 to 7 , wherein the adhesive resin composition contains an epoxy resin and a latent curing agent. The adhesive for circuit member connection as described in any one of Claims 4-8 in which the said adhesive resin composition contains an epoxy resin, an acrylic rubber, and a latent hardener. The adhesive for circuit member connection according to claim 9 , wherein the acrylic rubber contains a glycidyl ether group in a molecule. The adhesive for circuit member connection as described in any one of Claims 1-10 whose shape is a film form. A first circuit member having a first connection terminal;
A second circuit member having a second connection terminal;
The first connection terminal and the second connection terminal are arranged to face each other,
An adhesive is interposed between the first connection terminal and the second connection terminal arranged opposite to each other,
A circuit board in which the first connection terminal and the second connection terminal which are arranged opposite to each other by applying pressure are electrically connected;
The circuit board whose said adhesive agent is the adhesive agent for a circuit member connection as described in any one of Claims 1-11 . The first circuit member is an inorganic insulating substrate;
The second circuit member is an organic insulating substrate;
The circuit board according to claim 12, wherein at least one of the third adhesive layers is bonded to the first circuit member side. The circuit board according to claim 12 or 13 , wherein the first circuit member is a semiconductor chip. A first circuit member made of an inorganic insulating substrate having a first connection terminal;
A second circuit member made of an organic insulating substrate having a second connection terminal;
The first connection terminal and the second connection terminal are arranged to face each other,
The adhesive for circuit member connection according to any one of claims 1 to 11 , wherein the third adhesive layer is between the first connection terminal and the second connection terminal that are arranged to face each other. Arranged so as to be on the first circuit member side,
A method of manufacturing a circuit board, comprising a step of electrically connecting the first connection terminal and the second connection terminal that are arranged opposite to each other by applying pressure.

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