JP4427299B2 - Processing method of plate - Google Patents

Description

  The present invention relates to a plate-like material processing method for adjusting a cutting device.

  A semiconductor wafer in which a plurality of circuits such as ICs and LSIs are partitioned by streets and formed on the surface is divided into individual semiconductor chips by cutting (dicing) the streets vertically and horizontally and used for various electronic devices. In recent years, in order to reduce the weight and size of electronic devices, it has been required to form a semiconductor chip as extremely thin as 100 μm or less and 50 μm or less. Technology has been developed and put into practical use.

  In this tip dicing, each semiconductor is formed by forming a cutting groove having a depth corresponding to the thickness of the semiconductor chip on the surface of the semiconductor wafer, and then grinding the back surface of the semiconductor wafer to expose the cutting groove from the back surface side. It is a technique of dividing into chips, and when forming a cutting groove on the surface, a cutting device having a cutting blade capable of high-speed rotation is used.

  For example, in the cutting apparatus 200 shown in FIG. 12, a chuck table 201 for holding a semiconductor wafer W, a cutting means 202 for cutting the semiconductor wafer W held on the chuck table 201, and a semiconductor wafer W are cut. Alignment means 203 for detecting the power position is provided, and the alignment means 203 is fixed to the cutting means 202. The chuck table 201 can move in the X-axis direction (feed direction), and the alignment means 203 can move together with the cutting means 202 in the Y-axis direction (indexing direction) and the Z-axis direction (cutting direction). In the cutting means 202, a cutting blade 205 is attached to the tip of the spindle 20 4, and the cutting blade 205 is also rotated as the spindle 20 4 rotates.

  The semiconductor wafer W is held on the chuck table 201 in a state integrated with the frame F via the tape T, and the semiconductor wafer W is first positioned directly below the imaging unit 206 by the movement of the chuck table 201 in the + X direction. The position to be cut is detected by processing such as pattern matching with a key pattern that is imaged on the surface and stored in the alignment unit 203 in advance, and the position and the position of the cutting blade 205 in the indexing direction are aligned. Is made. Further, by moving the chuck table 201 in the + X direction and lowering the cutting means 202, the cutting blade 205 that rotates at a high speed is cut into the detected position to be cut, and the position is cut.

  In the first dicing, the depth of the cutting groove corresponds to the final thickness of the semiconductor chip, and therefore it is necessary to accurately control the cutting depth when forming the cutting groove. Therefore, the cutting blade is lowered vertically to cut the dummy wafer to form a cutting groove, and the depth of the cutting groove is calculated based on the length of the cutting groove in the feed direction. If the calculated depth does not match the desired depth, the position of the cutting blade 205 in the cutting direction is shifted by the difference, or the control of the cutting direction of the cutting means 202 when forming the cutting groove is adjusted. Thus, a cutting groove having a desired depth can be formed.

  As shown in FIG. 13, an alignment reference line 207 for alignment is formed in the imaging unit 206. The cutting blade 205 is disposed on the + X direction extension line of the reference line 207, and the alignment means 203 and the cutting means 202 are fixed. Since these move in the Y-axis direction in conjunction with each other, the position to be cut is determined. When aligning with the cutting blade 205 in the Y-axis direction, the position to be cut and the alignment reference line 207 may be matched. Therefore, before the actual cutting, the dummy wafer is cut to form a cutting groove, the cutting groove is detected by the alignment means 203, and the alignment reference line 207 and the cutting groove are adjusted so as to coincide with each other. (See, for example, Patent Document 1).

  Thus, in order to adjust the position of the cutting blade 205 in the cutting direction, it is necessary to form a cutting groove in the dummy wafer. In order to adjust the position in the indexing direction by matching the cutting blade 205 and the alignment reference line 207. In addition, it is necessary to form a cutting groove in the dummy wafer. Therefore, an auxiliary table is disposed adjacent to the chuck table, and a cutting groove is formed on the dummy wafer by cutting a dummy wafer held on the auxiliary table to form a cutting groove. Adjustment based on the length and direction of the groove is also performed (see, for example, Patent Document 2).

Japanese Patent Laid-Open No. 11-260763 JP 2001-308034 A

  However, every time the cutting blade is worn or replaced, it is necessary to form a cutting groove on the dummy wafer each time. Are formed in parallel. The alignment means cannot determine whether each cutting groove is for position adjustment in the cutting direction or position adjustment in the indexing direction. Therefore, the cutting groove formed for adjusting the position in the cutting direction is used for adjusting the position in the indexing direction, and conversely, the cutting groove formed for adjusting the position in the indexing direction is adjusted for the position in the cutting direction. I may use it for the purpose.

  Therefore, the problem to be solved by the present invention is to make it possible to reliably distinguish the cutting groove for position adjustment in the cutting direction from the cutting groove for position adjustment in the indexing direction.

The present invention includes a chuck table that holds a plate-like object, an auxiliary table that can hold and rotate a small piece plate-like object, and a cutting means that includes a cutting blade that cuts the plate-like object held on the chuck table; An alignment unit having an imaging unit for imaging the surface of the plate-like object, and the chuck table, the auxiliary table, and the cutting unit are relatively movable in the feeding direction, the indexing direction, and the cutting direction. In a cutting apparatus in which an alignment reference line is formed on an extension line in the feed direction of the cutting blade, the rotating cutting blade is cut in the cutting direction with respect to the small piece plate-like object to form the first cutting groove, and the first cutting groove is formed. A cutting depth calculation step for calculating the cutting depth of the cutting blade from the length of the cutting groove and the diameter of the cutting blade, and a small piece by rotating the small plate plate horizontally. Jo was the first cut groove and the non-parallel second cutting groove formed by the second cutting grooves and alignment alignment means reference line and performs the alignment of the indexing direction of the cutting blade to conform The main feature is to include a process.

The alignment process is performed at least after replacing the cutting blade with a new one, but may be performed at other times. Further, when the first cutting groove that is not parallel to the alignment reference line is detected in the alignment step, the second cutting groove that is parallel to the alignment reference line is scanned, and the alignment reference line and the second cutting groove are It is desirable to align the cutting blade in the indexing direction so that they match .

When the cutting means includes the first cutting means and the second cutting means, the second cutting groove formed by the first cutting means and the first cutting means formed by the second cutting means The cutting groove and the second cutting groove formed by the second cutting means are all formed non-parallel.

  In the present invention, the cutting groove formed for recognizing the position of the cutting blade in the cutting direction and the cutting groove for recognizing the position of the cutting blade in the indexing direction are non-parallel to the small plate-like object. Therefore, when the small piece plate-like object is imaged later by the imaging means, it is possible to clearly distinguish which cutting groove, and no erroneous recognition will occur.

  An example of the processing method of the plate-like object in the cutting apparatus 100 shown in FIG. 1 will be described. The cutting apparatus 1 includes a cassette 1 for storing a plate-like object to be cut and a plate-like object that has been cut, and a carry-in / out operation for carrying out the plate-like object from the cassette 1 and carrying the plate-like object into the cassette 1. Means 2, a chuck table 3 for holding a plate-like object, an auxiliary table 4 which is disposed at a position adjacent to the chuck table 3 and holds a small plate-like object such as a dummy wafer, and a chuck table 3 or an auxiliary table 4 Cutting means 5 for cutting the plate-like object held on the first plate, first alignment means 60, 61 for detecting the position to be cut by imaging the plate-like object held on the chuck table 3, and cutting A cleaning unit 7 that cleans the subsequent plate-like object and a conveying unit 8 that conveys the cut plate-like object to the cleaning unit 7 are provided.

  The cassette 1 is mounted on the cassette mounting table 10. A nut (not shown) provided inside the cassette mounting table 10 is screwed into a ball screw 11 disposed in the Z-axis direction, and the ball screw 11 is driven by a pulse motor (not shown) to rotate. Accordingly, the cassette mounting table 10 moves up and down, and the cassette 10 can be positioned at an appropriate height.

  The carry-in / out means 2 includes a ball screw 20 and a guide rail 21 arranged in the Y-axis direction, a pulse motor 22 connected to one end of the ball screw 20 and rotating the ball screw 20, and a nut (not shown) provided therein. Is engaged with the ball screw 20 and is guided by the guide rail 21 by the rotation of the ball screw 20 to move in the Y-axis direction (indexing direction), and an elevating unit 24 that can move up and down in the vertical direction with respect to the moving unit 23. And a holding part 25 that extends in the horizontal direction from the tip of the elevating part 24 and holds a plate-like object. The moving part 23 moves to the guide rail 21 as the ball screw 20 is rotated by being driven by the pulse motor 22. The holding unit 25 is positioned at an appropriate height by being guided and moved in the Y-axis direction, and the elevating unit 24 moving up and down. The pulse motor 22 is connected to the control unit 9 and operates by pulses supplied from the control unit 9.

  The chuck table 3 can be moved in the X-axis direction (feed direction) by the feed unit 30 and can be rotated by being driven by the rotation drive unit 31. The feed unit 30 includes a ball screw 300 and a guide rail 301 disposed in the X-axis direction, a pulse motor (not shown) that is connected to one end of the ball screw 300 and rotates the ball screw 300, and a nut (see FIG. (Not shown) screwed into the ball screw 300 and guided by the guide rail 301 by the rotation of the ball screw 300 and moved in the X-axis direction (feed direction), and the Y-axis direction with respect to the moving base 302 The movable unit 303 is movable. The pulse motor connected to the ball screw 300 is operated by pulses supplied from the control unit 9. The rotation drive unit 31 is also controlled by the control unit 9.

  The auxiliary table 4 is disposed at a position adjacent to the chuck table 3 in the illustrated example. The auxiliary table 4 can hold a small plate-like object such as a dummy wafer, and is preferably disposed at a position that does not interfere with the cutting of the plate-like object held on the chuck table 3. In the illustrated example, the auxiliary table 4 is fixed to the side of the chuck table 3, moves in the same direction as the chuck table 3 moves in the X-axis direction, and rotates as the chuck table 3 rotates. It has a configuration. The auxiliary table 4 may be configured to move and rotate in the X-axis direction independently of the chuck table 3.

  The cutting means 5 includes a first cutting means 50 and a second cutting means 51 in the illustrated example. The first cutting means 50 is configured such that a cutting blade 501 is attached to the tip of a spindle 500 disposed in the Y-axis direction, and the cutting blade 501 rotates as the spindle 500 rotates. The first cutting means 50 as a whole can be moved in the Y-axis direction (index direction) by the first index feed section 52 and can be moved in the Z-axis direction (cut direction) by the first cut feed section 53. It has become.

  On the other hand, the second cutting means 51 is configured such that a cutting blade 511 is attached to the tip of a spindle 510 arranged in the Y-axis direction, and the cutting blade rotates as the spindle rotates. The spindle 510 and the cutting blade 511 constituting the second cutting means 51 are not shown in FIG. 1, but are shown in FIG. The second cutting means 51 as a whole can be moved in the Y-axis direction (index direction) by the second index feed section 54 and can be moved in the Z-axis direction (cut direction) by the second cut feed section 55. It has become.

  The first index feed section 52 includes a ball screw 520 disposed in the Y-axis direction, a pulse motor 521 coupled to one end of the ball screw 520, a guide rail 522 disposed in parallel to the ball screw 520, a guide A linear scale 523 arranged in parallel with the rail 522 and a moving part 524 in which an internal nut is screwed into the ball screw 520 are provided, and the ball screw 520 is moved as the ball screw 520 is rotated by being driven by the pulse motor 521. The part 524 is configured to move in the Y-axis direction. The pulse motor 521 is connected to the control unit 9 and operates according to pulses supplied from the control unit 9. Further, the position of the moving unit 524 is measured by the linear scale 523 and used for control in the control unit 9.

  Similarly, the second indexing and feeding portion 54 includes a ball screw 540 disposed in the Y-axis direction, a pulse motor 541 connected to one end of the ball screw 540, and a moving portion in which an internal nut is screwed into the ball screw 540. 542, and the moving unit 542 moves in the Y-axis direction as the ball screw 540 rotates by being driven by the pulse motor 541. The guide rail 522 and the linear scale 523 arranged in parallel with the ball screw 540 are also used as the first index feeding unit 52. The pulse motor 541 is connected to the control unit 9 and operates by pulses supplied from the control unit 9. The position of the moving unit 542 is measured by the linear scale 523 and used for control in the control unit 9.

  The first cut feed portion 53 includes a ball screw 530 arranged in the Z-axis direction, a pulse motor 531 connected to the ball screw 530, a guide rail 532 arranged in parallel to the ball screw 530, and an internal not shown. The nut is screwed to the ball screw 530 and the lift plate 533 is slidably engaged with the guide rail 532. The lift plate 533 is driven by the pulse motor 531 to rotate the ball screw 530. It is configured to move up and down while being guided by the guide rail 532. The pulse motor 531 is connected to the control unit 9 and operates according to pulses supplied from the control unit 9. Further, the first cutting means 50 is fixed to the lifting plate 533, and the first cutting means 50 moves up and down as the lifting plate 533 moves up and down.

  On the other hand, the second incision feeding section 55 includes a ball screw 550 disposed in the Z-axis direction, a pulse motor 551 coupled to the ball screw 550, a guide rail 552 disposed in parallel with the ball screw 550, and not shown. An internal nut is screwed to the ball screw 550 and is also composed of an elevating plate 553 slidably engaged with the guide rail 552. The elevating plate is driven by the pulse motor 551 and the ball screw 550 rotates. 553 is guided by a guide rail 552 and configured to move up and down. The pulse motor 551 is connected to the control unit 9 and operates by pulses supplied from the control unit 9. The second cutting means 51 is fixed to the lifting plate 553, and the second cutting means 51 moves up and down as the lifting plate 553 moves up and down.

  The first alignment means 60 includes an imaging unit 600 that images the surface of a plate-like object, and a processing unit 601 that performs processing such as detecting a region to be cut based on an image acquired by the imaging unit 600. Yes. The first alignment means 60 is fixed to the first cutting means 50 in the illustrated example. Similarly, the second alignment unit 61 includes an imaging unit 610 that images the surface of a plate-like object, and a processing unit 611 that performs processing based on an image acquired by the imaging unit 610. The second alignment means 61 is fixed to the second cutting means 51 in the illustrated example.

  The cleaning means 7 includes a holding table 70 that can hold and rotate a plate-like object after cutting, and a nozzle (not shown) that ejects cleaning water, and is a plate-like shape held by the holding table 70. The object is washed with washing water, and the cutting waste is removed.

  The conveying means 8 includes a ball screw 80 arranged in the Y-axis direction, a pulse motor 81 connected to one end of the ball screw 80, a guide rail 82 arranged in parallel to the ball screw 80, and an internal nut (not shown). The moving unit 83 is screwed to the ball screw 80 and the holding unit 84 is movable up and down in the Z-axis direction with respect to the moving unit 83. The moving unit is driven by the pulse motor 81 and rotates as the ball screw 80 rotates. 83 is guided by the guide rail 82 and moves in the Y-axis direction. The pulse motor 81 is connected to the control unit 9 and operates by pulses supplied from the control unit 9.

  As shown in FIG. 2, alignment reference lines 602 and 612 are formed in the optical systems that form the imaging units 600 and 610, respectively. The alignment reference lines 602 and 612 are used for alignment between the region to be cut and the cutting blades 501 and 511. On the extension line in the X-axis direction of the alignment reference line 602 constituting the imaging unit 600, The cutting blade 501 that constitutes the cutting means 50 must be located. That is, the alignment reference line 602 and the cutting blade 501 are adjusted so that the positions in the indexing direction (Y coordinate) are equal. Similarly, the cutting blade 511 that constitutes the second cutting means 51 must be positioned on the extended line in the X-axis direction of the alignment reference line 612 that constitutes the imaging unit 610, and the alignment reference line 612 and the cutting The blade 511 is adjusted so that the position in the indexing direction (Y coordinate) is equal.

  Next, the case where it is going to cut the semiconductor wafer which is an example of a plate-shaped object using the cutting device 1 is demonstrated. As shown in FIG. 1, a plurality of semiconductor wafers W before cutting are accommodated in the cassette 10, and are unloaded from the inside of the cassette 10 by the loading / unloading means 2, and placed and held on the chuck table 3. Next, when the chuck table 3 moves in the + X direction, the semiconductor wafer W is positioned immediately below the first alignment means 60 and / or the second alignment means 61. Here, when the first cutting means 50 and the second cutting means 51 are simultaneously applied to the semiconductor wafer W to perform cutting, the first alignment means 60 and the second alignment means 61 are both semiconductors. Although it moves just above the wafer W, below, the case where it cuts using only the 1st cutting means 50 as an example is demonstrated.

  When the semiconductor wafer W is positioned immediately below the first alignment means 60, the imaging unit 600 images the surface of the semiconductor wafer W while moving the first alignment means 60 in the Y-axis direction. Then, the processing unit 601 detects a street to be cut from the image acquired by the imaging unit 600 by processing such as pattern matching, and matches the street with the alignment reference line 602 (see FIG. 2). Since the first alignment means 60 is fixed to the first cutting means 50, the first cutting means 50 moves in the same direction by the same amount by the movement of the first alignment means 60 in the Y-axis direction. As shown in FIG. 2, the cutting blade 501 is on an extension line of the alignment reference line 602. Therefore, when the street to be cut matches the alignment reference line 602, the street and the cutting blade 501 are aligned in the Y-axis direction.

  After the alignment of the street to be cut and the cutting blade 501 in this way, the chuck table 3 moves in the + X direction, and the first cutting means 50 descends while the cutting blade 501 rotates at a high speed. The cutting blade 501 that rotates at a high speed cuts into the street to be cut, and the street is cut.

  In the case of so-called dicing, since a groove having a depth corresponding to the final thickness of the semiconductor chip must be formed, it is necessary to control the cutting depth of the cutting blade 501 with respect to the semiconductor wafer W with high accuracy. . For this purpose, it is necessary to accurately recognize the position of the cutting blade 501 in the cutting direction (Z-axis direction). Therefore, before cutting an actual semiconductor wafer, for example, a dummy wafer is cut to form a cutting groove, and the cutting groove depth is calculated by calculating the depth of the cutting groove based on the length of the cutting groove. Find the direction position.

  For example, when the first cutting means 50 is used to form the cutting groove, the auxiliary table 4 is moved in the + X direction together with the chuck table 3 so that the dummy wafer W1 is positioned immediately below the cutting blade 501 as shown in FIG. Then, the cutting blade 501 is rotated at a high speed and the first cutting means 50 is lowered to cut the cutting blade 501 into the dummy wafer by a predetermined amount, thereby forming a cutting groove. Since the outer periphery of the cutting blade 501 is worn by use, the depth of the cutting groove may be obtained by forming a cutting groove every use for a certain period of time. Therefore, for example, as shown in FIG. 4, a plurality of first cutting grooves G1, G2, G3, G4, and G5 are formed in one dummy wafer W1. When the cutting blade 501 is replaced with a new one, it is necessary to form a cutting groove each time and recognize the position in the cutting direction of the newly mounted cutting blade.

  After forming the cutting grooves as described above, the auxiliary table 4 is moved in the −X direction to position the dummy wafer W1 directly below the imaging unit 600 as shown in FIG. The first cutting groove G5 formed immediately before is detected. The image at that time is, for example, as shown in FIG. In FIG. 6, the length of the first cutting groove G5 in the X-axis direction is L1, and first, the processing unit 601 determines the length of L1 based on the pixels constituting this image.

  As shown in FIG. 7, when the depth of the first cutting groove G5 is D, the length is L1, and the radius of the cutting blade 501 is R, the depth D of the first cutting groove G5 is It can obtain | require by the following formula | equation (cutting depth calculation process).

  Since the lowering amount of the first cutting means 50 is determined by the number of pulses supplied from the control unit 9 to the pulse motor 531, the control unit 9 determines a desired cutting amount of the cutting blade 501 based on the number of pulses, that is, the first cutting amount. The desired depth of the cutting groove G5 is recognized. Assuming that the desired depth of the first cutting groove G5 is D0, if the value of the difference (D−D0) from the actual depth D of the first cutting groove G5 is not 0, Z of the cutting blade 501 The position in the axial direction may be adjusted, or control of the position in the cutting direction of the cutting blade 501 at the time of cutting may be adjusted by (D−D0) in the control unit 9. Thus, by recognizing the position of the cutting blade 501 in the cutting direction, the cutting amount can be controlled with high accuracy.

  On the other hand, in order to align the street to be cut with the cutting blade 501 when cutting an actual semiconductor wafer, the cutting blade 501 and the alignment reference line 602 (see FIG. 2) must be positioned in a straight line. Therefore, before the actual cutting is performed, the positional relationship between the cutting blade 501 and the alignment reference line 602 is confirmed in advance, and if this positional relationship is broken, adjustment is necessary.

  Therefore, the dummy wafer W1 held on the auxiliary table 4 is cut to form a second cutting groove for alignment of the cutting blade 501, and the positional relationship between the second cutting groove and the alignment reference line 602 is examined. Thus, the positional relationship between the cutting blade 501 and the alignment reference line 602 is obtained.

  When forming the second cutting groove, the chuck table 3 is rotated. When the chuck table 3 rotates, the auxiliary table 4 fixed to the chuck table 3 also rotates by the same amount. This rotation angle may be any number other than 180 degrees or 360 degrees.

  While maintaining the state after the chuck table 3 and the auxiliary table 4 are rotated, the auxiliary table 4 is moved together with the chuck table 3 in the + X direction so that the dummy wafer W1 is positioned immediately below the cutting blade 501, and the cutting blade 501 is moved at high speed. The second cutting groove G6 shown in FIG. 8 is formed by rotating and lowering the first cutting means 50 to cut the cutting blade 501 into the dummy wafer by a predetermined amount. As shown in FIG. 8, the dummy wafer W1 has a plurality of cutting grooves including the first cutting grooves G1 to G5 for adjusting the cutting direction of the cutting blade 501. Since the second cutting groove G6 is formed after the auxiliary table 4 is rotated, it is not parallel to the first cutting grooves G1 to G5.

  Next, the auxiliary table 4 is rotated and moved in the −X direction so that the dummy wafer W1 is positioned immediately below the imaging unit 600 and the surface thereof is imaged. Then, as shown in FIG. 9, when a cutting groove that is not parallel to the alignment reference line 602 is detected, it can be determined that the cutting groove is the first cutting groove, and is mistaken as the second cutting groove. There is nothing. If the first cutting groove G5 is not parallel to the alignment reference line 602 as shown in FIG. 9, the image is scanned for the second cutting groove G6, and as shown in FIG. When the alignment reference line 602 matches, it can be determined that the cutting blade 501 and the alignment reference line 602 are positioned on a straight line.

  On the other hand, when the second cutting groove G6 and the alignment reference line 602 do not match, it can be determined that the cutting blade 501 and the alignment reference line 602 are not positioned on a straight line (alignment process). In this case, if the cutting is performed as it is, the center of the street may be off or other than the street may be cut. Therefore, the cutting blade 501 is aligned with the alignment reference line 602 so that the second cutting groove G6 and the alignment reference line 602 coincide. The position with respect to the reference line 602 is adjusted.

  In the above example, the case of adjusting one cutting blade has been described. However, in a cutting apparatus having two cutting blades such as the cutting apparatus 1 in FIG. 1, the first cutting blade 501 is used for adjustment. A cutting groove and a cutting groove for adjusting the second cutting blade 511 are formed, and the positions of the cutting direction and the indexing direction must be adjusted for each cutting blade.

  Therefore, for example, as in the dummy wafer W2 shown in FIG. 11, the first cutting groove G11 for adjusting the cutting direction of the first cutting blade 501 and the second for adjusting the indexing direction of the first cutting blade 501 are used. The cutting groove 12, the first cutting groove G21 for adjusting the cutting direction of the second cutting blade 511, and the second cutting groove 22 for adjusting the indexing direction of the second cutting blade 511 are formed. If they are non-parallel, it is possible to clearly distinguish which adjustment groove each is.

  In the present embodiment, the case where the chuck table 3 moves in the feed direction and the cutting means 5 and the alignment means 6 move in the indexing direction and the cutting direction has been described as an example. What is necessary is just to move to 3 directions, and is not limited to the example shown by this embodiment.

  Since the position of the cutting blade in the cutting direction and the indexing direction can be accurately grasped, it can be used for a cutting apparatus that requires high-precision cutting.

It is a perspective view which shows an example of a cutting device. It is explanatory drawing which shows the relationship between a cutting blade and an alignment reference line. It is explanatory drawing which shows a mode that the cutting groove is formed in a dummy wafer. It is a top view which shows an example of the dummy wafer in which the 1st cutting groove was formed. It is a front view which shows a mode that the surface of a dummy wafer is imaged. It is explanatory drawing which shows an example of the image acquired by imaging. It is explanatory drawing which shows the length and depth of a cutting groove, and the radius of a cutting blade. It is a top view which shows an example of the dummy wafer in which the 1st cutting groove and the 2nd cutting groove were formed. It is explanatory drawing which shows an example of the image acquired by imaging. It is explanatory drawing which shows an example of the image after scanning. It is a top view which shows another example of the dummy wafer in which the 1st cutting groove and the 2nd cutting groove were formed. It is a perspective view which shows a mode that the surface of a semiconductor wafer is imaged by the alignment means. It is explanatory drawing which shows the relationship between a cutting blade and an alignment reference line.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Cassette 10: Cassette mounting table 11: Ball screw 2: Carrying in / out means 20: Ball screw 21: Guide rail 22: Pulse motor 23: Moving part 24: Lifting part 25: Holding part 3: Chuck table 30: Feeding part 300: Ball screw 301: Guide rail 302: Moving base 303: Moving unit 31: Rotating drive unit 4: Auxiliary table 5: Cutting means 50: First cutting means 500: Spindle 501: Cutting blade 51: Second cutting means 510: Spindle 511: Cutting blade 52: First index feed unit 520: Ball screw 521: Pulse motor 522: Guide rail 523: Linear scale 524: Moving unit 53: First cut feed unit 530: Ball screw 531: Pulse motor 532: Guide rail 533: Lift plate 54: Second split Feeding part 540: Ball screw 541: Pulse motor 542: Moving part 55: Second notch feeding part 550: Ball screw 551: Pulse motor 552: Guide rail 553: Lifting plate 60: First alignment means 600: Imaging part 601: Processing unit 602: Alignment reference line 61: Second alignment unit 610: Imaging unit 611: Processing unit 612: Alignment reference line 7: Cleaning unit 70: Holding table 8: Conveying unit 80: Ball screw 81: Pulse motor 82: Guide rail 83: Moving unit 9: Control unit 100: Cutting device W: Semiconductor wafer W1: Dummy wafer G1 to G5: First cutting groove G6: Second cutting groove W2: Dummy wafer G11, G12, G21, G22: Cutting groove

Claims (4)

A chuck table for holding a plate-like object, an auxiliary table capable of holding and rotating a small piece plate-like object, a cutting means having a cutting blade for cutting the plate-like object held on the chuck table, and the plate-like object An alignment unit having an imaging unit for imaging the surface of an object, and the chuck table, the auxiliary table, and the cutting unit are relatively movable in a feeding direction, an indexing direction, and a cutting direction, and the imaging unit In the cutting apparatus in which an alignment reference line is formed on an extension line in the feed direction of the cutting blade, a processing method for a plate-like object for adjusting the position in the cutting direction and the indexing direction of the cutting blade,
A rotating cutting blade is cut in the cutting direction with respect to a small plate-like object to form a first cutting groove, and the cutting blade is cut from the length of the first cutting groove and the diameter of the cutting blade. A cutting depth calculation step for calculating the depth;
The small piece plate-like object is rotated in the horizontal direction to form a second cutting groove non-parallel to the first cutting groove on the small piece plate-like object, and the second cutting groove and the alignment reference line are A plate-like material processing method including at least an alignment step of aligning the cutting blade in the indexing direction so as to match .   The plate-shaped object processing method according to claim 1, wherein the positioning step is performed after the cutting blade is replaced with a new cutting blade. In the alignment step, when a first cutting groove that is not parallel to the alignment reference line is detected, a second cutting groove that is parallel to the alignment reference line is scanned to scan the alignment reference line and the first cutting groove. The method for processing a plate-like object according to claim 1 or 2, wherein the cutting blade is aligned in the indexing direction so that the two cutting grooves coincide with each other . The cutting means includes a first cutting means and a second cutting means, a second cutting groove formed by the first cutting means, and a first cutting formed by the second cutting means. The processing method of the plate-shaped object according to claim 1, 2 or 3 , wherein the cutting groove and the second cutting groove formed by the second cutting means are all non-parallel.

Images