JP4398297B2 - Microparts laminating apparatus and microparts laminating method - Google Patents

Description

  The present invention relates to a micro component bonding apparatus and a micro component bonding method, and more particularly to a micro component bonding apparatus and a micro component bonding method that can bond two micro components with an accurate interval.

Various proposals have been made regarding a micro-component bonding apparatus that can bond two micro-components while maintaining an accurate interval. For example, the chip mounting method and the device proposed in Patent Document 1 include a height detection unit that detects a change in the height position of the tool holder that holds the chip with respect to the holder support unit. A change in the height position of the tool holder with respect to the holder support means is fed back to a Z-axis feed device that moves the tool holder up and down to drive and control the Z-axis feed device. As a result, even when the Z-axis feeding device is thermally expanded due to the influence of the environmental temperature, it is possible to mount the bump while maintaining the shape of the bump.
JP 2000-353725 A

  However, the technique proposed in Patent Document 1 can detect a change in the height position of the tool holder with respect to the holder support means by the height detection means, but the distance between the opposing surfaces of the two microparts. It is difficult to know this distance accurately because it is not directly measured.

  Furthermore, it does not take into account fluctuations in the detection results of the height detection means due to changes in the environmental temperature due to heating during mounting, etc., and it is more difficult to accurately know the distance between the mounting surfaces of the microparts to be mounted. is there. Therefore, the distance between the opposing surfaces of the two microparts cannot be accurately bonded to the target value.

  The present invention pays attention to this point, and provides a micro-component bonding apparatus and a micro-component bonding method capable of accurately bonding the distance between the opposing surfaces of two micro-components to a target value. For the purpose.

  In order to achieve the above object, a microcomponent bonding apparatus according to a first aspect of the present invention includes a mounting portion on which a first microcomponent is mounted, and a joining member that is disposed on the first microcomponent. And a holding unit that holds the second micro component so as to face the first micro component, and the above-described mounting unit or the above-described holding unit that is mounted on the above-described mounting unit by moving at least one of the above-described holding unit A drive unit for bringing the first micro component and the second micro component held by the holding unit into contact with each other through the bonding member, and the bonding of the first micro component and the second micro component. A load setting unit that controls a relative distance between the placement unit and the holding unit, a gap detection unit that detects the relative distance, and the gap detection unit by changing a load applied when contacting through the member. And a temperature stabilizing unit for maintaining the temperature at a desired temperature. .

  In order to achieve the above object, the method for bonding microcomponents according to the second aspect of the present invention includes a load setting step for setting a load applied when the first microcomponent and the second microcomponent are joined. , An interval detection unit temperature setting step for stabilizing the temperature of the interval detection unit for detecting a relative distance between the placement unit and the holding unit to a desired temperature, the first micro component, and the second micro component And a bonding step of bonding and fixing so that the interval at the time of bonding becomes a desired value.

  According to the first and second aspects, the temperature of the interval detection unit that detects the interval at the time of joining the first micro component and the second micro component is stabilized, so that the two micro components face each other. It is possible to bond the distance between the surfaces to be accurately matched to the target value.

  ADVANTAGE OF THE INVENTION According to this invention, the micro component bonding apparatus and the micro component bonding method which can be bonded together correctly according to the value which aimed at the distance between the surfaces where two micro components each face each other can be provided. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 shows the configuration of a microcomponent bonding apparatus according to the first embodiment of the present invention. FIG. 1 is a left side view of the microcomponent bonding apparatus according to the first embodiment. In FIG. 1, only the periphery of the mounting block is shown in cross section.

  In the microcomponent bonding apparatus of FIG. 1, the first microcomponent 11 is mounted on the mounting plate 2 and mounted and fixed on the mounting plate 2 by a technique such as vacuum suction. Further, the second micro component 12 is arranged so as to face the first micro component 11. The second micro component 12 is held by the holding unit 14 by a technique such as vacuum suction. The first microcomponent 11 and the second microcomponent 12 are bonded and fixed via a joining member 13. Here, a so-called thermosetting material that joins and fixes the adherend by softening and curing due to temperature change, such as solder, Au, or resin, is used for the bonding member 13.

  A heater 3 is provided below the mounting plate 2. The mounting plate 2 is heated by the heater 3 to change the temperature of the bonding member 13 and harden the bonding member 13. A heat insulating material 4 is disposed around the heater 3, and the heater 3 is fixed to the mounting block 5 via the heat insulating material 4. Thus, by interposing the heat insulating material 4 between the heater 3 and the mounting block 5, the heat of the heater 3 is efficiently transmitted to the mounting plate 2 and is unnecessary to the mounting block 5. Heat transfer is prevented.

  The mounting block 5 is fixed on the tilt mechanism 201, the tilt mechanism 201 is fixed on the XY moving mechanism 202, and the XY moving mechanism 202 is fixed on the rotating mechanism 203. Here, the tilt mechanism 201 includes a motor and a feed screw (not shown), and changes the tilt of the mounting block 5 with respect to the holding unit 14. Further, the XY moving mechanism 202 includes a motor and a ball screw (not shown), and changes the horizontal position of the mounting block 5 with respect to the holding unit 14. Further, the rotation mechanism 203 is composed of a motor and a gear (not shown), and changes the position in the rotation direction around the vertical axis of the mounting block 5.

  Further, distance sensors 6 are installed on the left and right sides of the mounting plate 2 of the mounting block 5, and the distance sensors 6 are conductively connected to the distance control device 9. The distance sensor 6 measures the distance between the surface of the mounting plate 2 on the side where the first microcomponent 11 is placed and the surface of the holding portion 14 on the side where the second microcomponent 12 is held. The measurement result is output to the interval control device 9.

The interval control device 9 as a drive calculation unit and an inter-plane distance calculation unit is connected to a Z moving mechanism 103 as a drive unit and a voice coil motor (VCM) 102 as a load setting unit. The interval control unit 9, the output of the distance sensor 6 and the first microcomponents 11 distance between the respective opposite faces of the second microcomponents 12 is calculated, the with these computed first microcomponents 2 as distance between the respective opposing surfaces is a desired value of the microcomponents, and a driving current instruction to the movement amount instruction and VCM102 to Z movement mechanism 103 is performed. Here, one end of the linear motion gas bearing 101 is attached to the VCM 102, and the holding portion 14 moves to the other end of the linear motion gas bearing 101 in the bonding direction (vertical direction in the figure) of two micro components. Supported as possible. The linear motion gas bearing 101 and the VCM 102 are fixed to a moving table 1031 of the Z moving mechanism 103. In such a configuration, the VCM 102 changes the amount and direction of a current flowing in a coil (not shown) inside, so that the holding unit 14 (second micro component 12) is replaced with the first micro component 11 and the bonding member 13. Change the force applied to. The Z moving mechanism 103 is composed of a motor and a ball screw (not shown), and moves the moving table 1031 in the vertical direction in the figure.

  Further, a flow path 51 is provided in the mounting block 5 so as to surround the distance sensor 6. And the flow path 51 is connected to the chiller 7 as a temperature stabilization part via the piping 8. FIG. Here, the chiller 7 designates the temperature of the distance sensor 6 by circulating the heat exchange medium kept at the designated temperature in the flow path 51 to keep the temperature of the mounting block 5 at the designated temperature. At a controlled temperature. That is, even when the mounting plate 2 is heated by the heater 3, the mounting block 5 is maintained at a temperature specified by the heat exchange medium flowing through the internal flow path 51. Along with this, the distance sensor 6 installed on the mounting block 5 is also maintained at the specified temperature. Therefore, the distance between the surface of the mounting plate 2 on which the first microcomponent 11 is placed by the distance sensor 6 and the surface of the holding portion 14 on the side of holding the second microcomponent 12 is determined. The measurement result at the time of measurement is not affected by the temperature change caused by the heater 3 or the like. As a result, the distance between the opposing surfaces of the first microcomponent 11 and the second microcomponent can be accurately known.

  Next, a method for bonding microcomponents according to the first embodiment will be described with reference to FIG. First, a load at the time of contact between the first microcomponent 11 and the second microcomponent 12 is set (step S1 load setting step). In this load setting step, the interval control device 9 instructs the current value and current direction of the drive current of the VCM 102 based on the load detected by the load detection element (for example, load cell). That is, the weight of the holding unit 14 is reduced by causing the VCM 102 to generate a thrust that is slightly smaller than the weight of the holding unit 14 and pulls up the holding unit 14 (upward).

  Next, the temperature of the distance sensor 6 is set to a specified temperature (step S2 interval detection unit temperature setting step). In this interval detection unit temperature setting step, the heat exchange medium maintained at a predetermined temperature by the chiller 7 is circulated through the flow path 51 so that the temperature of the distance sensor 6 is maintained at the predetermined temperature.

  In this state, the first microcomponent 11 and the second microcomponent 12 are bonded together (step S3 bonding step).

  In this bonding step, first, the first microcomponent 11 is vacuum-sucked and held by the holding unit 14. Then, the Z moving mechanism 103 is lowered to a position where the first micro component 11 and the mounting plate 2 are in contact with each other. The distance to the holding part 14 at this time is measured by the distance sensor 6, and the measurement result is stored in the interval control device 9 as the thickness value of the first microcomponent 11. It is assumed that the output of the distance sensor 6 is corrected in advance so as to be zero when the mounting plate 2 and the holding unit 14 are in parallel contact with each other. Further, the zero point correction of the distance sensor 6 may be performed each time before the first microcomponent 11 is supplied to the mounting plate 2 as necessary.

  Next, the suction holding of the holding portion 14 is released, and the first micro component 11 is placed and fixed on the placement plate 2 by vacuum suction. Then, the holding unit 14 is lifted and retracted by the Z moving mechanism 103.

Next, the second microcomponent 12 is vacuum-sucked and held by the holding unit 14. Thereafter, XY moving mechanism 202, Before moving the mount block 5 by the rotating mechanism 203.

  Next, the Z movement mechanism 103 is driven, and the first microcomponent stored in the interval control device 9 is set so that the interval between the first microcomponent 11 and the second microcomponent 12 becomes a desired value. The moving table 1031 is stopped while referring to the thickness values of 11 and the second microcomponent 12.

  At this time, the interval control device 9 calculates the distance between the opposing surfaces of the first microcomponent 11 and the second microcomponent. When the distance and tilt between the first microcomponent 11 and the second microcomponent 12 are different from the desired values, the distance control device 9 sends a command for the movement amount to the tilt mechanism 201 and the Z moving mechanism 103. The distance between the first microcomponent 11 and the second microcomponent 12 and the inclination of the first microcomponent 11 are adjusted to a desired value.

  Thereafter, the mounting plate 2 is heated by the heater 3 to give a temperature change for the bonding member 13 to be cured. Also at this time, the interval control device 9 always calculates the distance between the opposing surfaces of the first microcomponent 11 and the second microcomponent. When the distance and the inclination between the first microcomponent 11 and the second microcomponent 12 are different from the desired values, a movement amount command is sent to the inclination mechanism 201 and the Z movement mechanism 103, and the first Adjustment is made so that the distance and the inclination between the micro component 11 and the second micro component 12 become desired values.

  Further, at this time, the heat exchange medium maintained at the temperature specified by the chiller 7 is circulated in the flow path 51 inside the mounting block 5, so that the mounting block 5 is kept at the specified temperature. It is kept. Therefore, even if the temperature of the heater 3 changes, the distance sensor 6 installed in the mounting block 5 remains at the specified temperature, and the output value of the distance sensor 6 is affected by the temperature change of the heater 3. There is nothing.

  As described above, according to the first embodiment, even in the process of temperature change until the bonding member 13 is cured, the surface of the mounting plate 2 on the side where the first microcomponent 11 is mounted Since the distance between the holding portion 14 and the surface on the side where the second microcomponent 12 is held can be accurately measured, the distance between the opposing surfaces of the first microcomponent 11 and the second microcomponent 12 is different. The distance between the first microcomponent 11 and the second microcomponent 12 can be maintained at a desired value, and the two microcomponents can be bonded together.

  In the first embodiment, during the bonding process, the Z moving mechanism 103 moves the holding unit 14 side in the vertical direction in the drawing, but conversely, the mounting plate 2 The side may be moved, or both the holding unit 14 side and the mounting plate 2 side may be moved.

  In the figure, two distance sensors 6 are shown on both sides of the mounting plate, but it goes without saying that the distance sensor on one side may be composed of a plurality of sensors.

[Second Embodiment]
FIG. 3 shows the configuration of a microcomponent bonding apparatus according to the second embodiment of the present invention. FIG. 3 is a cross-sectional view of the periphery of the mounting block, which is a main part of the microcomponent bonding apparatus according to the second embodiment. Since other configurations are the same as those in the first embodiment, illustration is omitted.

  As shown in FIG. 3, the second embodiment is different from the first embodiment in that a temperature sensor 53 as a temperature detection unit is fixed to a distance sensor 6 installed in the mounting block 5. The temperature sensor 53 is conductively connected to the chiller 7.

  Next, a micropart bonding method according to the second embodiment will be described with reference to FIG. In the process of FIG. 4, first, the same load setting process as described in FIG. 2 is performed (step S21). Description of this process is omitted.

  Next, the temperature of the distance sensor 6 is measured by the temperature sensor 53 (step S22 temperature detection step). As described above, the temperature sensor 53 is connected to the chiller 7. The chiller 7 adjusts the temperature of the heat exchange medium based on the temperature measurement result of the temperature sensor 53 (step S23 temperature correction step). Thereby, the temperature of the distance sensor 6 can be more reliably maintained constant compared to the first embodiment, and the output value of the distance sensor 6 is not affected by the temperature change of the heater 3. After the temperature correction step in step S23, the first microcomponent 11 and the second microcomponent 12 are bonded together in the same manner as described in FIG. 2 (step S24).

  As described above, according to the second embodiment, the surface of the mounting plate 2 on the side where the first microcomponent 11 is placed and the second microcomponent 12 of the holding portion 14 are held. Since the distance to the surface on the other side can be accurately measured, the distance between the opposing surfaces of the first microcomponent 11 and the second microcomponent 12 can be accurately known, and the first microcomponent The two minute parts can be bonded together while maintaining the distance and the inclination between the part 11 and the second minute part 12 at desired values. Further, since the temperature of the distance sensor 6 is detected, the temperature of the distance sensor 6 can be kept constant more reliably.

[Third Embodiment]
FIG. 5 shows the configuration of a microcomponent bonding apparatus according to the third embodiment of the present invention. FIG. 5 is a cross-sectional view of the periphery of the mounting block, which is a main part of the microcomponent bonding apparatus according to the third embodiment. Since other configurations are the same as those in the first embodiment, illustration is omitted.

  As shown in FIG. 5, a heating / cooling element 54 is provided inside the mounting block 5 so as to surround the distance sensor 6, and the heating / cooling element 54 is connected to a temperature adjustment device 72.

  Here, a Peltier element is used as the heating / cooling element 54. The Peltier element is installed so that one surface is in contact with the distance sensor 6 and the other surface is in contact with the mounting block 5. And a cooling surface and a heating surface can be switched by changing the direction of the electric current sent through a Peltier device.

  That is, the temperature adjustment device 72 supplies a current to the heating / cooling element 54 so that the temperature of the distance sensor 6 becomes a predetermined temperature based on the temperature measurement result of the temperature sensor 53.

  In the third embodiment, a part of the distance sensor 6 is used as the fluctuation correction distance sensor 61, and the fluctuation correction fixed to the mounting block 5 is provided above the fluctuation correction distance sensor 61. A detection member 62 is installed. The fluctuation correction distance sensor 61 is connected to a fluctuation correction amount calculation unit 73 as a temperature stabilization calculation unit. The fluctuation correction amount calculation unit 73 is connected to the temperature adjustment device 72 and the interval control device 9 (not shown). Here, the distance measurement result of the fluctuation correction distance sensor 61 is normally a constant value and does not change. A plurality of distance sensors 6 may be provided, and one of them may be used as the fluctuation correction distance sensor 61.

Next, a micropart bonding method according to the third embodiment will be described with reference to FIG. In the process of FIG. 6, first, the same load setting process, temperature detection process, and temperature correction process as those of the second embodiment are performed (steps S31 to S33). Description of these processes is omitted. Thereafter, the fluctuation correction amount calculation unit 73 detects the output value of the fluctuation correction distance sensor 61 (step S34 fluctuation detection step). Then, based on the detected output value of the fluctuation correction distance sensor 61, the fluctuation correction amount calculation unit 73 corrects the temperature command correction value (that is, current correction value) sent to the heating / cooling element 54, and the Z movement mechanism of the interval control device 9. Based on this, the interval control device 9 calculates at least one of the temperature adjustment device 72, the Z moving mechanism 103, and the VCM 102. Is controlled to cancel the influence of the temperature change of the distance sensor 6 (step S35, fluctuation correction step). This ensures that there is no possibility that the output value of the distance sensor 6 is affected by the temperature change of the heater 3. After the fluctuating temperature correction step in step S35, the first microcomponent 11 and the second microcomponent 12 are bonded together in the same manner as described in FIG. 2 (step S36).

  As described above, according to the third embodiment, the surface of the mounting plate 2 on the side where the first microcomponent 11 is placed and the second microcomponent 12 of the holding portion 14 are held. Since the distance to the surface on the other side can be accurately measured, the distance between the opposing surfaces of the first microcomponent 11 and the second microcomponent 12 can be accurately known, and the first microcomponent The two minute parts can be bonded together while maintaining the distance and the inclination between the part 11 and the second minute part 12 at desired values.

  In the third embodiment, since the heating / cooling element 54 is installed in contact with the distance sensor 6, the temperature of the distance sensor 6 can be changed in a short time and responds to the temperature stabilization of the distance sensor 6. This is particularly effective when sex is required.

  Furthermore, since the fluctuation correction distance sensor 61 can always check whether the output value of the distance sensor 6 is affected by the temperature change of the heater 3, the output value of the distance sensor 6 should be influenced by the temperature change of the heater 3. When a sign is received, the fluctuation correction amount calculation unit 73 can correct the temperature amount of the heating / cooling element 54, the movement amount of the Z moving mechanism 103, and the current amount of the VCM 102. As a result, the distance between the bonding surfaces of the first microcomponent 11 and the second microcomponent 12 and the inclination of the first microcomponent 11 and the second microcomponent 12 can be reliably bonded to each other.

  Although the present invention has been described based on the above embodiments, the present invention is not limited to the above-described embodiments, and various modifications and applications are naturally possible within the scope of the gist of the present invention.

  Further, the above-described embodiments include various stages of the invention, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the column of the effect of the invention Can be extracted as an invention.

It is a block diagram of the micro component bonding apparatus which concerns on the 1st Embodiment of this invention. It is a flowchart which shows the procedure of the micro component bonding method which concerns on the 1st Embodiment of this invention. It is a block diagram of the micro component bonding apparatus which concerns on the 2nd Embodiment of this invention. It is a flowchart illustrating a procedure of a method combined microcomponent bonded according to a second embodiment of the present invention. It is a block diagram of the micro component bonding apparatus which concerns on the 3rd Embodiment of this invention. It is a flowchart which shows the procedure of the micro component bonding method which concerns on the 3rd Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Mounting plate, 3 ... Heater, 4 ... Heat insulating material, 5 ... Mounting block, 6 ... Distance sensor, 7 ... Chiller, 8 ... Piping, 9 ... Space | interval control apparatus, 11 ... 1st micro component, 12 ... 2nd micro component, 13 ... joining member, 14 ... holding part, 51 ... flow path, 53 ... temperature sensor, 54 ... heating / cooling element, 61 ... variation correction distance sensor, 62 ... variation correction detection member, 72 ... Temperature adjusting device, 73 ... fluctuation correction amount calculation unit, 101 ... linear motion gas bearing, 102 ... voice coil motor (VCM), 103 ... Z moving mechanism, 201 ... tilt mechanism, 202 ... XY moving mechanism, 203 ... rotating mechanism, 1031 ... Moving table

Claims (8)

A placement section for placing the first microcomponent;
A joining member disposed on the first micropart;
A holding unit for holding the second microcomponent so as to face the first microcomponent;
By moving at least one of the placement portion or the holding portion, the first micro component placed on the placement portion and the second micro component held by the holding portion are connected to the joining member. A drive unit to be contacted through,
A load setting unit that controls a relative distance between the placement unit and the holding unit by changing a load applied when the first micro component and the second micro component are brought into contact with each other via the joining member. When,
An interval detector for detecting the relative distance;
A temperature stabilization unit for maintaining the interval detection unit at a desired temperature;
An apparatus for laminating a micro component, comprising: The distance detecting unit measures the distance between the surface of the mounting unit on the side on which the first microcomponent is placed and the surface of the holding unit on the side of holding the second microcomponent. A distance sensor that detects a relative distance between the placement unit and the holding unit;
2. The micropart bonding apparatus according to claim 1, wherein the temperature stabilizing unit includes a heat exchange medium circulation unit and a heat exchange medium temperature adjustment unit. A temperature detector for measuring the temperature of the interval detector;
Based on the output value of the temperature detection unit, the temperature correction amount of the temperature stabilization unit is calculated, and based on the temperature correction amount, the temperature stabilization unit keeps the temperature of the interval detection unit at a desired temperature. A temperature stabilization calculator that sends commands to
The device for laminating microcomponents according to claim 1 or 2, further comprising: An inter-surface distance calculation unit that calculates the distance between the opposing surfaces of the first micro component and the second micro component based on the relative distance between the placement unit and the holding unit detected by the interval detection unit. When,
Drive for calculating the drive correction amount of the drive unit so that the distance between the opposing surfaces of the first micro component and the second micro component calculated by the inter-surface distance calculation unit becomes a desired value. An arithmetic unit;
The microcomponent bonding apparatus according to any one of claims 1 to 3, further comprising: A variation correction interval detection unit that is provided on at least one upper portion of the interval detection unit and outputs a distance measurement result with the variation correction detection member installed together with the interval detection unit ;
When the distance measurement result of the variation correction interval detection unit changes due to a temperature change, the inter-surface distance calculation unit calculates so as to cancel the change in the relative distance detection result of the interval detection unit due to the temperature change. A fluctuation correction amount calculation unit for calculating at least one of a correction amount of a distance between the opposing surfaces of the first micro component and the second micro component and a temperature correction amount of the temperature stabilization unit ; The micropart bonding apparatus according to claim 4, further comprising: A load setting step for setting a load applied at the time of joining the first micro component and the second micro component;
An interval detection unit temperature setting step for stabilizing the temperature of the interval detection unit for detecting a relative distance between the placement unit and the holding unit to a desired temperature;
A laminating step of laminating and fixing the first micro component and the second micro component so that the interval at the time of joining becomes a desired value;
A method for laminating a minute part, comprising: The interval detector temperature setting step
A temperature detection step of detecting the temperature of the interval detection unit;
A temperature for calculating a temperature correction amount for stabilizing the temperature of the interval detection unit based on the temperature detected in the temperature detection step, and a temperature for stabilizing the temperature of the interval detection unit based on the calculated temperature correction amount A correction process;
The method for bonding microcomponents according to claim 6, comprising: The interval detector temperature setting step
A variation correction interval detecting step , which is provided on at least one upper portion of the interval detection unit and detects a distance from the variation correction detection member installed on the placement unit together with the interval detection unit by the variation correction interval detection unit. When,
A variation detecting step for detecting a change in the constant distance due to a temperature change;
When the change in the constant distance due to the temperature change is detected, the change in the detection result of the relative distance of the interval detection unit due to the temperature change is canceled out so as to cancel the change in the relative distance. A variation correction step of correcting at least one of the interval at the time of joining the components and the temperature of the interval detection unit;
The method for bonding microcomponents according to claim 7, comprising:

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