JP4317351B2 - Circuit board management method and electronic circuit production system - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to management of a circuit board that is equipped with electronic circuit components and constitutes an electronic circuit.is there.
[0002]
[Prior art]
Electronic circuits are manufactured as an integrated circuit by arranging cream solder applicators, adhesive applicators, electronic circuit component mounting machines, automatic inspection machines, reflow furnaces, etc. in order from the upstream side to the downstream side. Often this is done using a component mounting system. The circuit board carried into such a system is sequentially subjected to predetermined operations in each device to be an electronic circuit. Each work machine constituting the electronic circuit production system may be made to work based on information specific to the circuit board to be worked. In that case, each work machine is attached to any circuit board. The unique information may be obtained by reading the display or the like. For example, when the circuit board is a so-called “multi-board” in which a plurality of sub boards are assembled to form a single board, information on the relative position of each sub board on the circuit board corresponds to the specific information, Such relative position information is acquired, for example, by imaging a reference mark attached to the circuit board and each child board by an imaging device that images the surface of the board and performing image processing on the obtained image data.
[0003]
In the case of the multi-board, the unique information further includes information indicating that the sub-board is a work unnecessary area when the circuit pattern of some of the sub-boards is defective. If operations such as cream solder application and electronic circuit component mounting are performed on the child substrate, the operation itself is not only wasted, but a defective product is produced. Therefore, in that case, it is desirable that information for preventing work from being performed on some of the sub-boards is supplied to each work machine, and it is determined whether or not work is required for each of a plurality of specific work areas. This is because the necessity determination information for this is unique information.
[0004]
As described above, in a multi-board, it is effective to treat each child board as a specific work area. However, considering a specific work area is not effective only in the case of a multi-board. For example, when there is an electronic circuit component that requires particularly high mounting position accuracy in one circuit pattern, one or more reference marks are provided in the vicinity of the circuit board where the electronic circuit component is mounted. If the mounting operation is performed based on the position of the reference mark, the mounting position accuracy of these electronic circuit components can be increased. In this case, an electronic circuit component that requires particularly high mounting position accuracy can be obtained. It is convenient to treat the attached area as a specific work area.
[0005]
In the conventional electronic circuit production system, the unique information as described above is recognized and acquired by each work implement that needs the information, and each work implement is based on the obtained unique information. It was supposed to do the scheduled work. On the other hand, according to Japanese Patent Application No. 2001-288617, the present applicant provides each circuit board with a bar code or a two-dimensional code indicating an identification code of each circuit board, and reads each code by a code reader or the like. In addition to making the board identifiable, the storage device of the computer that controls the electronic circuit component mounting system stores the unique information of each circuit board in association with the identification code, and supplies the information to each work machine to supply the electronic circuit Proposed to be used for the manufacture of In this way, if the upstream side of the plurality of work machines constituting the electronic circuit production system obtains the unique information, the work machine on the downstream side does not need to perform the work of obtaining the unique information. The work efficiency of the entire circuit production system is improved.
[0006]
The information unique to each circuit board has been described above, but it may be effective to supply information common to the same type of circuit board to each work machine in association with the identification code of each circuit board. For example, the electronic circuit component mounting program for the circuit board is selected and executed based on the identification code of the circuit board. It is also possible to change the mounting program to one for the next type of circuit board when the mounting operation of the electronic circuit components on the predetermined number of circuit boards is completed. However, in that case, for example, when some circuit boards are extracted from the substrate transfer apparatus by an operator for some reason, there is a possibility that the mounting operation is performed by an incorrect mounting program. If the mounting program is selected based on the identification code of the circuit board, such a situation can be surely avoided.
[0007]
[Problems to be solved by the invention, means for solving problems and effects]
As mentioned above, it is effective to give an identification code to each circuit board, but in order to use barcodes and two-dimensional codes as in the past, stickers such as barcodes are affixed to circuit boards. Alternatively, a device for printing a barcode or the like is necessary, and there is a problem that the equipment cost becomes high. In recent years, circuit boards have also been miniaturized in accordance with miniaturization of electronic devices, and it has become difficult to secure a space for providing a barcode or the like. Furthermore, in order to recognize a barcode or the like, it is necessary to make the barcode or the like and a recognition device such as a barcode reader face each other, and it may take time to reduce the work efficiency.
[0008]
  In view of the above circumstances, the present invention makes it possible to record information on a circuit board on the circuit board by using a small space of the circuit board or by an inexpensive device, or information on the circuit board. A plurality of machines including an electronic circuit component mounting machine for mounting an electronic circuit component on a circuit board according to the present invention, which is intended to be read without causing a reduction in work efficiency.And a computer connected to those machinesIn an electronic circuit production system that produces electronic circuits, production history information that is information related to work performed on a circuit board by at least some of the plurality of machinesIs stored in the computer, a memory is mounted on the circuit board in the electronic circuit component mounting machine, and production history information stored in the computer before the memory is mounted after the memory is mounted.A circuit board management method characterized by storing in a memory is obtained.
  In this way, the circuit board production history informationOnce on a computer connected to multiple machinesIf it is stored and later stored in the memory provided on the circuit board, the production history information acquisition time, the memory installation time to the circuit board, and the production history information writing time to the memory There is no restriction on each other, and the degree of freedom of the means for disposing the memory on the circuit board and the degree of freedom of acquisition and use of production history information are increased, and the use of production history information is facilitated.If the production history information stored in the computer before the memory is mounted on the circuit board is stored in the memory after the memory is mounted, the effect of increasing the degree of freedom can be enjoyed particularly well.
  In addition, the present invention allows the memory to be mounted on the circuit board by the electronic circuit component mounting machine included in the electronic circuit production system, and therefore it is not necessary to previously mount the memory on the circuit board. The mounting machine can be used as the memory mounting means, and the effect of simplifying the configuration of the apparatus can be obtained.
  Further, according to the present invention, a plurality of machines including an electronic circuit component mounting machine for mounting an electronic circuit component supplied from a component supply device on a circuit board by a mounting device.And a computer connected to those machinesAn electronic circuit production system for producing an electronic circuit, comprising: (a) production history information that is information related to work performed on a circuit board by at least some of the plurality of machines. Get and beforeWritingProduction history information acquisition means stored in a computer, (b) tag chip mounting means for mounting a tag chip having a memory on the circuit board, and (c) acquired by the production history information acquisition means and stored in the computer. Production history information writing means for writing production history information into the memory of the tag chip by wireless communication with the tag chip mounted by the tag chip mounting means.And the tag chip mounting means causes the electronic circuit component mounting machine to mount the tag chip on the circuit board, and the production history information writing means is adapted to attach the tag chip to the circuit board by the tag chip mounting means. Write the production history information stored in the computer before mounting to the tag chip after mounting the tag chipAn electronic circuit production system characterized by this can be obtained.
  According to this electronic circuit production system, the circuit board management method can be implemented.
[0009]
  According to the present invention, a circuit board management method, a tag chip mounting method, an electronic circuit production system, a taped tag chip, and the like of the following aspects can be obtained. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating understanding of the present invention, and should not be construed as limiting the technical features described in the present specification and the combinations thereof to those described in the following sections. . In addition, when a plurality of items are described in one section, it is not always necessary to employ the plurality of items together. It is also possible to select and employ only some items. The electronic circuit assembly system is a component of the above-described electronic circuit production system, and is mainly composed of an electronic circuit component mounting machine that mounts electronic circuit components on a circuit board.
[0010]
(1) A circuit board management method for managing a circuit board by mounting a tag chip on a circuit board constituting an electronic circuit by mounting electronic circuit components and reading information on the tag chip by wireless communication.
A tag chip is generally configured in a chip shape including a memory for storing information, a communication circuit, and a logic circuit that connects the memory and the communication circuit. The tag chip is preferably mounted on the circuit board in the same state as other electronic circuit components. It is desirable that an adhesive is applied to a place where the tag chip is to be attached on the circuit board in the same manner as when the electronic circuit component is attached to the circuit board, and the tag chip is pressed against the adhesive and attached. It is desirable that the tag chip mounting operation be the same as that of the electronic circuit component. It is desirable that the tag chip is taken out from a feeder or tray having the same configuration as that for supplying electronic circuit components by a component mounting apparatus for mounting electronic circuit components, and mounted on the circuit board. However, it is possible to attach the tag chip by applying an adhesive to the back surface of the tag chip, or by attaching a double-sided adhesive tape to the circuit board, and it is also possible to attach the tag chip using a dedicated mounting device for the tag chip.
[0011]
Various information can be stored in the memory of the tag chip, but in the present invention, at least information about the circuit board is stored. Information related to circuit boards includes information common to multiple circuit boards (common information), such as circuit board type, manufacturer, lot number, and specifications, and identification codes for individual circuit boards. At least one of information (unique information) can be included. The common information can be used to determine, for example, the application work of a high-viscosity fluid such as cream solder or adhesive or the mounting work of electronic circuit components to be performed on the circuit board. In addition, the unique information can include “information on the relative position of each child board on the circuit board” and “information indicating the work unnecessary area” in the multi-board.
[0012]
Further, the unique information can be used for recording production history. The production history includes, for example, the common information, production facility information such as a factory, a production line, a production apparatus (for example, a mounting apparatus) that produced the circuit board, and a work apparatus that performed the work on the circuit board. Production condition information such as operating conditions, working environment conditions such as ambient temperature, production date and time, production time information such as time required for various work, worker information such as worker name, ID, years of experience, nationality, etc. There is item information. Special note information refers to the circuit board that the component mounting device has failed to mount in the electronic circuit component mounting machine, or the circuit board that has not been mounted because there is no specific electronic circuit component to be supplied. When a circuit component is installed, information such as the type and position of the electronic circuit component that has been re-installed, suction failure (including suction failure), mounting failure (including cases where it has not been installed), etc. occur. Information on the feeder of the component supply device, the nozzle of the component mounting device, and the like. It is also possible to classify information such as feeders and nozzles into production equipment information.
[0013]
As a usage form of the unique information, for example, a computer controlling the electronic circuit component mounting system can record a production history in association with an identification code of each circuit board. The production history can be stored in the tag chip as information unique to each circuit board. In the former case, there is no problem even if the information amount of the production history associated with the identification code is large, it is easy to record various production histories and use the information for the control of the electronic circuit component mounting system. Become. For example, if the inspection result of the manufactured electronic circuit and the production history are used in combination, the electronic circuit component mounting system can be controlled more accurately. Furthermore, from the statistics of production history, etc., to evaluate the productivity by product, factory, line, person in charge, temperature, etc. (production efficiency such as yield, production efficiency such as production speed, etc.) Productivity management information can be acquired, and can be used to manage production facilities and workers. On the other hand, when the production history is recorded on the tag chip, it is effective to record information that is effective when the electronic circuit is used, repaired, or replaced later. For example, when it is allowed to selectively mount multiple types of electronic circuit components at the same mounting point on one type of circuit board, if the type of electronic circuit components actually mounted is recorded on the tag chip, It is convenient for using and repairing the electronic circuit.
[0014]
The tag chip may have a function of storing readable information. However, the tag chip may be a semiconductor chip (IC chip) including an integrated circuit such as an IC that can calculate input information and output the result. As long as it has unique information. Moreover, information may be memorize | stored and the calculation result based on the memory | storage information and the input information may be output.
[0015]
The tag chip may be mounted on the circuit board before the circuit board is supplied to the electronic circuit production system, or may be mounted after it is supplied to the system. In the latter case, for example, when the electronic circuit production system includes one or more circuit board feeders, high-viscosity fluid applicators, electronic circuit component mounting machines, etc., the tag chip is installed at the most upstream part of the system. It may be mounted on the circuit board, may be mounted in the middle stream part of the system, or may be mounted in the most downstream part. However, if it is mounted on the electronic circuit component mounting machine, it is possible to mount the tag chip using a component mounting device that mounts the electronic circuit component on the circuit board, and the purpose is to suppress the increase in device cost. Can be achieved.
[0016]
(2) The circuit board management method according to (1), wherein the information includes an identification code of a circuit board on which the tag chip is mounted.
(3) The circuit board management method according to (1) or (2), wherein after the information is recorded on the tag chip, the tag chip is mounted on the circuit board.
If information necessary for the tag chip is recorded before the tag chip is mounted on the circuit board, it is not indispensable to provide an information recording device in the electronic circuit component mounting system.
(4) The circuit board management method according to (1) or (2), wherein the information is recorded on the tag chip after the tag chip is mounted on the circuit board.
The tag chip may be mounted on the circuit board before or after the circuit board is supplied to the electronic circuit production system, but information recording on the tag chip is supplied to the electronic circuit production system by the circuit board. Done after being done. Note that other information may already be recorded on the tag chip at that time. Furthermore, for example, when recording the production history on a tag chip, it is also possible to record the production history of each circuit board in the computer of the electronic circuit production system and later record the production history on the tag chip of each circuit board outside the system. It is also possible to provide a recording device in the electronic circuit production system and record the production history directly on the tag chip.
[0017]
(5) In an electronic circuit component mounting machine for assembling an electronic circuit by mounting an electronic circuit component supplied from a component supply device on a circuit board by a component mounting device, a tag chip is formed in the same form as the electronic circuit component by the component supply device. A tag chip mounting method of supplying and mounting the tag chip on the circuit board in the same form as the electronic circuit component by the component mounting device.
(6) At least an electronic circuit production system including an electronic circuit component mounting machine for assembling an electronic circuit by mounting an electronic circuit component supplied from a component supply device on a circuit board by a component mounting device,
A tag chip mounting device for storing a tag chip capable of storing information and transmitting the information wirelessly to the circuit board;
An information reading device that reads by receiving information transmitted from the tag chip;
An electronic circuit production system comprising:
The electronic circuit production system only needs to include at least one electronic circuit component mounting machine, and the simplest system consists of only one electronic circuit component mounting machine. However, in many cases, it is configured as an electronic circuit assembly line that includes one or more circuit board feeders, high-viscosity fluid applicators, electronic circuit component mounting machines, etc., or a reflow furnace or adhesive curing furnace. It is configured as an electronic circuit production line including. In this case, the tag chip mounting device and the information reading device may be provided in any of the above working machines, or may be provided in a peripheral device such as a substrate transfer device that connects these working machines. When the tag chip mounting device is provided on the upstream side of the high-viscosity fluid applicator, the tag chip mounting device may include a coating device that applies a high-viscosity fluid to either the circuit board or the tag chip. desirable.
(7) The electronic circuit component mounting machine includes a tag chip supply unit that the component supply device supplies the tag chip in the same manner as the electronic circuit component, and the component mounting device receives the tag chip supplied from the tag chip supply unit. The electronic circuit production system according to item (6), which is mounted on a circuit board and functions as the tag chip mounting device.
[0018]
(8) The electronic circuit production system according to (6) or (7), including an information recording device that records the information on the tag chip by wireless communication.
If the information recording device is provided in the electronic circuit production system, necessary information can be recorded on the tag chip after the circuit board is supplied to the system. For example, it becomes possible to record a circuit board identification code and production history.
[0019]
(9) The tag chip supply unit
(a) a tag chip that can store information and transmit the information wirelessly; (b) a carrier tape that includes a plurality of receiving recesses in the longitudinal direction and that stores the tag chip in the receiving recess; and (c) the carrier. A tape storage device for storing a taped tag chip that includes a cover tape that is attached to a tape and closes the storage recess;
A feeding device for pulling out the taped tag chip from the tape housing device and feeding it in the longitudinal direction to position each of the plurality of housing recesses at a chip supply position;
An electronic circuit production system according to item (7) or (8), including a tag chip feeder comprising:
(10) The tag chip supply unit includes:
A tray support member that supports a tag chip supply tray that contains the tag chip in each of a plurality of receiving recesses of a tray that is generally dish-shaped;
A tray positioning device for positioning each of the receiving recesses at a chip supply position;
The electronic circuit production system according to any one of (7) to (9), including a tray-type supply unit including:
(11) The tag chip supply unit
A tag chip storage device for storing the tag chip in bulk;
A chip feeder that aligns tag chips from the tag chip storage device and sends them to a chip supply position;
An electronic circuit production system according to any one of (7) to (10), comprising a bulk feeder provided with
[0020]
(12) a tag chip that stores information and can transmit the information wirelessly;
A plurality of receiving recesses in the longitudinal direction, and a carrier tape for storing the tag chip in the receiving recesses;
A cover tape affixed to the carrier tape and closing the housing recess;
Tapered tag chip containing.
If the tag chip is a taped tag chip, the tag chip can be supplied using a tape feeder that supplies taped electronic circuit components.
(13) a tag chip that stores information and can transmit the information wirelessly;
A tray that is generally dish-shaped, includes a plurality of receiving recesses, and each of the receiving recesses contains one tag chip;
Including tag chip supply tray.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows an electronic circuit production system according to an embodiment of the present invention. This electronic circuit production system includes a solder application machine (for example, a screen printing machine) 10 that applies cream solder to a circuit board from the upstream side (left side in FIG. 1) to the downstream side, and an electronic circuit component (hereinafter referred to as a circuit board). 2, which are abbreviated as components), and a reflow furnace 16 for soldering the components mounted on the circuit board. Between the above working machines, there is a board transporter 18 that connects them, a board loader 20 that loads a circuit board into the system upstream of the solder coating machine 10, and a downstream of the reflow furnace 16. A substrate unloader 22 for unloading circuit boards from the system is disposed, and a system controller 24 mainly composed of a computer for centrally managing these working machines is disposed outside the line. The upstream electronic circuit component mounting machine 12 (hereinafter abbreviated as the component mounting machine 12 and referred to as the “first mounting machine 12” to distinguish it from the electronic circuit component mounting machine 14) has a plurality of mounting heads making one turn. A rotary head type mounting machine having a component mounting device that can be swung around an axis, and the downstream electronic circuit component mounting machine 14 (component mounting machine 14, "second mounting machine 14") has an XY robot as the mounting head. XY robot type mounting machine having a component mounting apparatus that can be moved by, for example, the first mounting machine 12 mounts relatively small parts and the second mounting machine 14 mounts relatively large or irregular parts. The component mounting operation for one circuit board is performed with the task sharing. In the present embodiment, unique information associated with the board ID is used between these two mounting machines 12 and 14.
[0022]
FIG. 2 is a plan view of the first mounting machine 12, and FIG. 3 is a partial cross-sectional side view centering on the component mounting apparatus of the first mounting machine 12. The first mounting machine 12 mainly includes a work machine main body 50, a board fixing device 54 arranged on the work machine main body 50 and fixing the circuit board 52, and a board fixing device 54 arranged on the work machine main body 50. An XY table device 56 that is moved in the axial direction and the Y-axis direction, a component supply device 58 that is disposed in the back of the XY table device 56 of the work machine body 50 (upward in FIG. 2), and a substrate fixing of the work machine body 50 A component mounting device 60 that is disposed above the device 54 and the component supply device 58 and mounts components, and a CCD camera that is disposed in front of the component mounting device 60 so as to be able to image the surface (mounting surface) of the circuit board 52. It is comprised from the board | substrate imaging device 62 used as an imaging device, and the 1st mounting machine control apparatus 64 (refer FIG. 4) which controls these apparatuses. The mounting machine is configured in substantially the same manner as that described in Japanese Patent Application No. 2001-172915 unpublished by the applicant, and the component mounting apparatus 60 is disclosed in JP-A-6-342998. The components described in the gazette and the application specification related to Japanese Patent Application No. 2000-164958 by the applicant and the parts supply device 58 are configured in substantially the same manner as described in Japanese Patent Publication No. 8-21791. This is a simple explanation.
[0023]
The board fixing device 54 holds and fixes the circuit board 52 at a position that is approximately scheduled in the mounting operation, and each of the carry-in and carry-out conveyors (not shown) connected to the respective upstream and downstream board transfer machines 18. (Omitted) can be connected. The XY table device 56 supports the substrate fixing device 54 and moves the substrate fixing device 54 in the Y-axis direction, and supports the Y table device 72 and moves the Y table device 72 in the X-axis direction. And an X table device 74. The Y table device 72 and the X table device 74 have a servo motor as a drive source, a ball screw mechanism, and the like. The component supply device 58 mainly includes two component supply tables 78, a component supply table moving device 80 that moves the component supply tables 78 in the X-axis direction independently of each other, and the component supply table 78. A plurality of tape feeders 82 (the illustration of tape feeders arranged side by side on one of the component supply tables 78 is omitted) capable of sequentially feeding the components held on the tape at a predetermined component supply position The predetermined parts can be taken out according to the mounting order.
[0024]
The component mounting apparatus 60 mainly includes an index table 86 and a plurality of mounting heads 88 held at right angles to the circuit board 52 around the index table 86. Each of the mounting heads 88 has a suction nozzle 92 that holds the component 90 at the tip, and the suction nozzle 92 is connected to a negative pressure source (not shown) and sucks the component 90 by negative pressure. The mounting heads 88 are held on the index table 86 at equal angular intervals, and the index table 86 is intermittently rotated by a constant angle by the table intermittent rotation device 94, whereby each mounting head 88 supplies the components shown in FIG. The moving path including the station C and the component mounting station D can be moved sequentially. The component mounting device 60 includes a mounting head lifting device (not shown) and a mounting head rotating device 98 shown in FIG. 4, and each mounting head 88 is lifted and lowered at the component supply station C and the component mounting station D. Also, if necessary, it is rotated around its own axis about the axis.
[0025]
A component imaging station S exists in the movement path of the mounting head 88, and a component imaging device 102 (the imaging device is a CCD camera) for imaging the component 90 sucked and held from below the suction nozzle 92 is disposed. The image data obtained by the imaging is processed by the component image processing unit 104 (see FIG. 4, included in the first mounting machine control device 64), which is an image processing device, and the holding position error information of the component 90 is obtained. It is supposed to be acquired. The holding position error includes a position error in the X-axis and Y-axis directions with respect to a predetermined reference point of the component, for example, the center point, with respect to the mounting head 88, and a rotational position error around the rotational axis of the mounting head 88. Further, there is a head rotation station T in the movement path of the mounting head 88, where the mounting head 88 is rotated by the mounting head rotating device 98 based on the rotational position error information in the holding position error information, The rotational position error is corrected.
[0026]
The position of the board imaging device 62 is fixed, and by moving the circuit board 52 by the XY table device 56, imaging at an arbitrary position on the surface of the circuit board 52 is possible. Image data obtained by the board imaging device 62 is processed by a board image processing unit 106 (see FIG. 4, included in the first mounting machine control device 64), which is an image processing device, and board fixing position information of the circuit board 52. Is acquired. The board fixing position information includes a position error in the X-axis and Y-axis directions with respect to the reference coordinates of the first mounting machine 12 of a reference point set in advance on the circuit board 52, and a rotational position error around the reference point (circuit board). 52 slope).
[0027]
FIG. 4 shows a block diagram of the first placement machine control device 64 for controlling the first placement machine 12 with a focus on the portion deeply related to the present invention. The first mounting machine controller 64 is mainly composed of a computer 130 having a CPU 120, a ROM 122, a RAM 124, an input / output interface 126, and a bus 128 for connecting them. The input / output interface 126 is connected to the substrate fixing device 54, the XY table device 56, the component supply device 58, the intermittent table rotating device 94, and the mounting head rotation via the respective drive circuits 132 in the first mounting machine control device 64. A device 98 or the like is connected. The mounting head lifting device is driven in synchronization with the intermittent rotation of the index table 86 by the drive source of the table intermittent rotation device 94. The component imaging device 102 is connected to the input / output interface 126 via the component image processing unit 104, and the board imaging device 62 is connected via the board image processing unit 106. The holding posture information and the board fixing position information of the circuit board 52 are acquired. Further, an input device 134 mainly composed of a keyboard for operating the first mounting machine 12 is connected, and is also connected to a system control device 24 that controls the entire system. The ROM 122 stores a basic operation program of the first mounting machine 12 and the like, and the RAM 124 includes a component mounting work program corresponding to the circuit board to be worked, the holding posture information, the board number. Fixed position information and the like are stored. The operation of the mounting machine 12 in the mounting operation is substantially the same as that described in the above Japanese Patent Publication No. 8-21791, and the description thereof is omitted here.
[0028]
FIG. 5 shows a plan view of the second mounting machine 14, FIG. 6 shows a side view, and FIG. 7 shows a component mounting apparatus and its periphery. The second mounting machine 14 is mainly disposed in the work machine main body 150, the work machine main body 150, the board fixing device 152 that fixes the circuit board 52, and the front side of the board fixing device 152 (downward in FIG. 5). A feeder-type component supply device 154 disposed on the rear side, a tray-type component supply device 156 disposed on the back side (upper side in FIG. 5) of the substrate fixing device 152, a mounting unit 158 for mounting the components, and a work machine An XY robot device 160 provided on the main body 150 for moving the mounting unit 158 along a plane parallel to the circuit board 52 in the space above the two component supply devices 154 and 156 and the substrate fixing device 152, and the mounting unit 158 together with the XY Board imaging using a CCD camera that is moved by the robot device 160 and can image the surface (mounting surface) of the circuit board 52 as an imaging device. A device 162, and a second mounting device controller 164 for controlling these devices (see Fig. 8). The mounting unit 158 and the XY robot device 160 constitute a component mounting device 166. The mounting machine is configured in substantially the same manner as that described in Japanese Patent No. 2824378, and the tray-type component supply device 156 is substantially the same as that described in Japanese Patent Publication No. 2-57719. The mounting unit 158 is configured in substantially the same manner as that described in Japanese Patent No. 3093339, and only a brief description will be given here.
[0029]
The board fixing device 152 is a device that fixes the circuit board 52 conveyed by the board conveyor 170 at a substantially scheduled position for mounting work. The feeder-type component supply device 154 includes a plurality of tape feeders 172 arranged side by side in the X-axis direction (left-right direction in FIG. 5) on a component supply table, and each tape feeder 172 is held on a tape. The delivered parts are sent out and supplied one after another. A plurality of trays 174 that store a plurality of components are stacked in the tray-type component supply device 156, and these trays 174 are sequentially moved so that the mounting unit 158 can take out the components from each tray 174. To supply parts.
[0030]
As shown in FIG. 7, the mounting unit 158 mainly holds the mounting unit main body 180 and a suction nozzle 182 capable of sucking and holding the component 90 at the tip, and holds the mounting unit main body 180 so as to be rotatable and movable up and down. The mounting head 184, the mounting head lifting / lowering device 188 that lifts and lowers the mounting head 184 using the electric motor 186 as a driving source, and the mounting head rotating device that rotates the mounting head 184 around its axis using the electric motor (not shown) as the driving source. 190. The mounting head 184 is moved up and down by the mounting head lifting / lowering device 188 at the component supply position and the component mounting position, and the component 90 is sucked and held or mounted on the surface of the circuit board 52. Further, the mounting head 184 is rotated around its own axis by the head rotating device 190 in order to correct the posture in accordance with the holding posture of the held component 90. The suction nozzle 182 is connected to a negative pressure source (not shown) and sucks the component 90 by the negative pressure.
[0031]
The XY robot device 160 includes an X slide 204 that can move in the X axis direction on the work machine main body 150, an X slide moving device 206 that moves the X slide 204 in the X axis direction, and a Y that can move in the Y axis direction on the X slide 204. A slide 208 and a Y slide moving device 210 that moves the slide 208 in the Y-axis direction are provided. The X slide moving device 206 and the Y slide moving device 210 are both driven by a servo motor and have a ball screw mechanism. The mounting unit 158 is provided on the Y slide 208.
[0032]
The X slide 204 is provided with a component imaging device 220 (see FIG. 8; only the reflecting mirror 222 constituting the light guide device is shown in FIG. 5) using a CCD camera as an imaging device. The component imaging device 220 images the component 90 held by the mounting head 184 when the mounting head 184 passes above the reflecting mirror 222. The obtained image data is processed by a component image processing unit 224 (see FIG. 8, included in the second mounting machine control device 164), which is an image processing device, and the holding position error information of the component 90 is acquired. ing. The board imaging device 162 is provided on the Y slide 208 and is moved by the XY robot device 160 so that an arbitrary position on the surface of the circuit board 52 can be taken. The image data obtained by the board imaging device 162 is processed by a board image processing unit 226 (see FIG. 8, included in the second mounting machine control device 164), which is an image processing device, and the board position of the circuit board 52 is fixed. Information is acquired.
[0033]
FIG. 8 shows a block diagram of the second mounting machine control device 164 for controlling the second mounting machine 14 with a focus on the portion deeply related to the present invention. The second mounting machine control device 164 is mainly composed of a CPU 230, a ROM 232, a RAM 234, an input / output interface 236, and a computer 240 having a bus 238 for connecting them. The input / output interface 236 has a substrate fixing device 152, an XY robot device 160, a feeder-type component supply device 154, a tray-type component supply device 156, via respective drive circuits 242 in the second mounting machine control device 164. A mounting head lifting device 188 and a mounting head rotating device 190 are connected. Further, the component imaging device 220 is connected to the input / output interface 236 via the component image processing unit 224, and the board imaging device 162 is connected via the board image processing unit 226. Position error information and board individual position information are acquired. Further, an input device 244 mainly composed of a keyboard for operating the second mounting machine 14 and a system control device 24 for controlling the entire system are connected. The ROM 232 stores a basic operation program of the second mounting machine 14 and the like, and the RAM 234 includes a component mounting work program corresponding to the circuit board 52 as a work target, the holding position error information, Substrate individual position information and the like are stored. Note that the operation of the mounting machine 14 in the mounting operation is substantially the same as that described in the above-mentioned Japanese Patent No. 2824378 and the application specification related to Japanese Patent Application No. 2000-343441 by the present applicant. Omitted.
[0034]
FIG. 9 shows an example of a circuit board to be worked in this embodiment. This circuit board 52 is a so-called multi-board in which four sub-boards are provided side by side, and is also a circuit board called a multi-sided board. After the production of the electronic circuit by the present electronic circuit production system is completed, it is separated into four child boards. Therefore, the circuit board 52 is formed with four child board portions 260 as shown in the figure. Incidentally, although the four sub-board portions 260 are omitted in the drawing, their circuit patterns (wiring patterns) are the same, and both the mounting work in the first mounting machine 12 and the mounting work in the second mounting machine 14 are one. The component 90 of the four sub-board units 260 can be mounted by the mounting program for the sub-board unit 260.
[0035]
The circuit board 52 is provided with a board position reference mark 262 at each of the two corners positioned diagonally, and a portion of the circuit board 52 to which the board position reference mark 262 is attached serves as a board reference display unit. . When the circuit board 52 is fixed by the board fixing devices 54 and 152 in the first and second mounting machines 12 and 14, the board position reference mark 262 is used to acquire board fixing position information that is information relating to the fixing position. Used for That is, two substrate position reference marks 262 are imaged by the substrate imaging devices 62 and 162, and the obtained image data is processed by the substrate image processing units 106 and 226 which are image processing devices, thereby fixing a fixed circuit. Detects displacement amounts in two directions (X-axis direction and Y-axis direction) orthogonal to each other in a plane parallel to the surface of the circuit board of the substrate 52 and in the rotation direction (hereinafter referred to as “θ-axis direction”) in the plane. It is done. In the mounting operation, the positional shift is corrected based on the positional shift amount, and the individual components 90 are mounted.
[0036]
Further, the circuit board 52 is provided with a child board position reference mark 266 that is an area position reference mark at each of the two corner parts located diagonally to each child board part 260. Each sub-board position reference mark 266 has an accurate relative position to the circuit pattern of the sub-board portion 260 to which the sub-board position reference mark 266 is attached. By grasping the positional relationship between the substrate position reference mark 262 and the child substrate position reference mark 266, the relative position of each child substrate portion 260 with respect to the circuit board 52 with respect to the substrate position reference mark 262 is grasped. . That is, it can be said that the sub board position defining information, which is the relative positional relationship information between the two types of marks 262 and 266, relates the position of the sub board portion 260 to the position of the board position reference mark 262. Similar to the substrate position reference mark 262, the child substrate position reference mark 266 is imaged by the substrate imaging devices 62 and 162, and the obtained image data is processed by the substrate image processing units 106 and 226 which are image processing devices. As a result, the area position defining information of each of the sub board portions 260 in the X axis direction, the Y axis direction, and the θ axis direction, that is, the sub board position defining information is acquired.
[0037]
The circuit board 52 is also provided with pads 290 for fixing the tag chip 300 by soldering. The pad 290 is formed by a conductor layer formed by electrochemical plating simultaneously with the formation of the substrate position reference mark 262 and the circuit pattern. On the other hand, a similar conductor layer is also formed on the back surface of the tag chip 300. The tag chip 300 is formed in a chip shape, and the component 90 and the tag chip 300 are mounted on the circuit board 52 by the common component mounting device 60 in the first mounting machine 12 described above. As shown in FIG. 11, the tag chip 300 is composed mainly of a memory 302, a communication circuit 304 for wireless communication, and a logic circuit 306 for connecting them, and is attached to the circuit board 52 in a reader / writer described later. Information stored in the memory 302 can be transmitted to the writer by wireless communication, or received information can be stored in the memory 302. Various kinds of information can be stored in the memory 302. In this embodiment, an identification code including a board ID for identifying each circuit board is stored.
[0038]
The first mounting machine 12 is provided with a tag chip feeder 312 which is a tag chip supply device for supplying the tag chip 300. The tag chip feeder 312 is configured in the same manner as the tape feeder 82 described above. As shown in FIG. 12, the tag chip feeder 312 holds a tag chip 300 on a carrier tape 314 and stores it in a taped tag chip 316, and a tape forming device. A feed device that feeds the tag chips 316 in the longitudinal direction and positions the tag chips 300 in the supply unit one by one. As shown in FIG. 2, the tag chip feeder 312 is arranged on the component supply table 78 of the first mounting machine 12 so that the supply unit thereof is aligned with the supply unit of the tape feeder 82 along a straight line. .
[0039]
The first and second mounting machines 12 and 14 are respectively provided with reader / writers 310 and 311 as information reading / writing devices for the tag chip 300. In the first mounting machine 12, as shown in FIGS. 2 and 10, the reader / writer 310 is fixedly supported by a frame (not shown) at a position where it does not interfere with the component mounting apparatus 60. The reader / writer 310 is provided so as to be communicable when the tag chip 300 is positioned below the reader / writer 310. The tag chip 300 is mounted on the circuit board 52 and can communicate below the reader / writer 310. Information can be read and written when positioned within the region. As shown in FIG. 4, the reader / writer 310 is connected to the input / output interface 126 of the first placement machine control device 64, and the identification code of the circuit board 52 is assigned to the tag chip 300 according to the instruction of the first placement machine control device 64. Write to.
[0040]
In the second mounting machine 14, as shown in FIG. 7, a reader / writer 311 is provided on the Y slide 208, and can be moved together with the mounting unit 158 to an arbitrary position in the horizontal plane. Also in the second mounting machine 14, communication is possible in a state where the tag chip 300 is located below the reader / writer 311, and the identification code stored in the memory 302 is read.
[0041]
Next, the mounting operation of the component 90 in the electronic circuit production system will be described. It should be noted that the cream solder application operation by the solder application machine 10 and the soldering operation in the reflow furnace 16 are not directly related to the present invention, so the description thereof will be omitted, and only the portions closely related to the present invention will be described in detail. Explained.
[0042]
When the circuit board 52 is carried into the first mounting machine 12, the board position reference mark 262 and the child board position reference mark 266 are imaged by the board imaging device 62. Based on the positions of the reference marks 262 and 266, the board fixing position information of the circuit board 52 and the child board position defining information are acquired, and the RAM 124 of the first mounting machine control device 64 is unique information unique to the circuit board 52. Is remembered. Next, the tag chip 300 is attached to the circuit board 52. In the present embodiment, a chip mounting position for mounting the tag chip 300 is set in the vicinity of the substrate position reference mark 262, and cream solder is applied in advance by a solder application machine. The tag chip 300 is taken out from the tag chip feeder 312 by the suction nozzle 92 and mounted on the circuit board 52. After that, the circuit board 52 is positioned in the communicable area of the reader / writer 310 by the XY table device 56. Are positioned as follows. In this state, the identification code of the circuit board 52 is written to the tag chip 300, and the identification code is transmitted to the system control device 24 and stored in association with the above-described unique information.
[0043]
Next, the components 90 are mounted on the circuit board 52 according to a predetermined order. At that time, from which tape feeder 82 each component 90 is supplied, which mounting head 88 or suction nozzle 92 is used, who is the operator, and the magnitude of the holding position error of the component 90 by the suction nozzle 92 is as follows. The production history, such as how much it was and whether there was an unusual situation such as the occurrence of a suction error of the component 90 by the suction nozzle 92, is stored in the RAM 124 of the first mounting machine control device 64 in association with the identification code of the circuit board 52. Further, the data is supplied to the system control device 24 and stored therein. When the mounting operation of the component 90 is completed in the first mounting machine 12, the circuit board 52 is transferred to the second mounting machine 14 by the board transfer machine 18. If the circuit board 52 is positioned and supported in the second mounting machine 14, first, the board position reference mark 262 is imaged by the board imaging device 162, and the board fixing position in the second mounting machine 14 is acquired. Next, the identification code recorded on the tag chip 300 is read by the reader / writer 311 and transmitted to the system controller 24 through the second mounting machine controller 164.
[0044]
Here, the system control device 24 stores various information including the unique information of the circuit board 52 described above, and the unique information associated with the identification code acquired this time is called out. In the unique information, the board fixing position information of the circuit board 52 and the child board position defining information are stored, and the child board position defining information which is information on the relative positions of the two reference marks 262 and 266 among them is stored. And the position of the child board position reference mark 266 in the second mounting machine 14 is acquired based on the board position reference mark 262 imaged in the second mounting machine 14 described above. It is not necessary to image the substrate position reference mark 266. The mounting position of the component 90 is corrected and mounted in accordance with the positions of the circuit board 52 and the sub board 260 obtained as described above. Also at this time, the production history is supplied to the system control device 24 via the second mounting device control device 164 and stored in association with the identification information of the circuit board 52 in the same manner as in the first mounting device 12. The When the component mounting operation is completed in the second mounting machine 14, the circuit board 52 is transferred to the reflow furnace 16, and soldering is performed. Thus, the electronic circuit component mounting work by this system is completed.
[0045]
As is apparent from the above description, in the electronic circuit production system, the component mounting device 60 constitutes a “tag chip mounting device”, and the reader / writers 310 and 311 constitute an “information reading device”.
[0046]
According to the present embodiment, once the unique information of the circuit board 52 is acquired and associated with the identification code of each circuit board 52, the position of the slave board unit 260 can be easily acquired in the work machine on the downstream side. it can. Further, by using the tag chip 300, a space to be used on the circuit board can be reduced as compared with the case where a bar code or a two-dimensional code is provided on each circuit board as an indicator representing the identification code. Furthermore, the tag chip 300 can be mounted by a mounting machine that is common to the mounting machine that mounts the component 90 on the circuit board 52. Therefore, as in the case of using a bar code or a two-dimensional code, There is no need to provide a printing device. Further, since production history information is recorded in association with the identification code of the circuit board 52, by combining the result of the subsequent electronic circuit inspection and the information of the tape feeder 82, the suction nozzle 92, the worker, etc., Appropriate management of the first and second mounting machines and workers can be performed.
[0047]
In the above embodiment, for simplification of explanation, only the first and second mounting machines are used. However, when the electronic circuit production system includes a larger number of mounting machines, these mounting machines are used. The identification code of the tag chip 300 can also be used in the mounting machine. Also, at least one work machine is provided with an inspection device for inspecting the result of work by the work machine, or at least one work machine is provided with an inspection machine on the downstream side, and the inspection results are stored in the production history information. It is also possible to record as a kind. For example, when it is recorded that any of the sub-board units 260 is defective, the work machine on the sub-board unit 260 is prevented from being performed in the work machine on the downstream side.
[0048]
Further, the tag chip 300 is temporarily fixed to the circuit board 52 by cream solder, and then soldered in the reflow furnace 16 so that it is fixed to the circuit board 52 in earnest. If it is only necessary to be able to be used in a working machine installed before the reflow furnace 16 such as a mounting machine, a conductor layer is not formed on the circuit board 52 or the tag chip 300, and soldering is performed in the reflow furnace 16. It is also possible not to break. Further, when the electronic circuit production system includes an adhesive applicator, the tag chip 300 can be attached to the circuit board 52 by the adhesive applicator. The tag chip 300 can be fixed to the circuit board 52 without forming a conductor layer.
[0049]
In the embodiment, the identification code is stored in the memory 302 of the tag chip 300 after the tag chip 300 is mounted on the circuit board 52. However, the identification code and other information are stored in the tag chip 300 in advance. Also good. In the latter case, for example, in the first mounting machine 12, the unique information of the circuit board 52 is acquired, and after the identification code stored in the tag chip 300 in advance is read by the reader / writer 310, the unique information is read. Are associated with the identification code and transmitted to the system controller 24 for storage.
[0050]
In the embodiment, since the tag chip 300 is attached to a portion other than the child board portion 260 of the circuit board 52, the tag chip 300 is not attached to the separated child board. Tag chip 300 may be attached to each, and each sub-board after separation may be provided with tag chip 300. By doing so, it is possible to use the information of the tag chip 300 for inspection after completion of the sub-board and further use, inspection, maintenance, and the like. When the circuit board is not a multi-board, if one tag chip 300 is attached, it can be used in the same manner.
[0051]
An identification code is stored in the tag chip 300, and production history information is stored in association with the identification code in the system control device 24, the mounting machine control devices 64 and 164, etc. Information generated in the electronic circuit production system can also be stored in the tag chip 300. In this case, the use of production history information is often facilitated.
[0052]
Furthermore, the writing operation and the reading operation by the reader / writers 310 and 311 may be performed in parallel with other operations. For example, it may be performed while the component 90 is mounted. Specifically, the mounting position of the circuit board 52 corresponds to the component mounting position of the component mounting device 56, and the tag chip 300 can communicate. A writing operation can be performed when it is located within the area, and the reading operation can be performed in parallel with the imaging operation by the board imaging device 162 in the second mounting machine 14.
[0053]
In the embodiment, the tag chip 300 is supplied by the tag chip feeder 316. However, the tag chip 300 may be supplied in another manner. For example, it may be supplied by a tray type supply device, or may be supplied by a bulk feeder that holds the tag chips 300 in a bulk shape and supplies them one by one.
[0054]
As mentioned above, although some embodiment of this invention was described in detail, these are only illustrations and this invention was described in the above-mentioned section of [the subject which invention intends to solve, a problem-solving means, and an effect]. The present invention can be implemented in various forms including various modifications and improvements based on the knowledge of those skilled in the art.
[Brief description of the drawings]
FIG. 1 is a front view showing an electronic circuit production system according to an embodiment of the present invention.
FIG. 2 is a plan view showing a first mounting machine of the system.
FIG. 3 is an enlarged partial side sectional view showing a component mounting apparatus of the first mounting machine.
FIG. 4 is a block diagram showing a control device of the first mounting machine.
FIG. 5 is a plan view showing a second mounting machine of the system.
FIG. 6 is a side view showing the second mounting machine.
FIG. 7 is an enlarged front view showing a main part of the second mounting machine.
FIG. 8 is a block diagram showing a control device of the second mounting machine.
FIG. 9 is a plan view showing an example of a circuit board which is an electronic circuit in the system.
FIG. 10 is an enlarged perspective view showing a reader / writer and its peripheral part of the first mounting machine.
FIG. 11 is a block diagram conceptually showing a tag chip.
FIG. 12 is a perspective view showing a tag chip feeder.
[Explanation of symbols]
10: Solder coating machine 12: Electronic circuit component mounting machine (component mounting machine, first mounting machine) 14: Electronic circuit component mounting machine (component mounting machine, second mounting machine) 16: Reflow furnace 18: Substrate transfer machine 20: Substrate loader 22: Substrate unloader 24: System controller 52: Circuit board 60: Component mounting device 64: First mounting machine controller 90: Electronic circuit component (component) 158: Mounting unit 260: Sub board unit 262: Substrate position reference Mark 266: Sub board position reference mark 300: Tag chip 302: Memory 304: Communication circuit 306: Logic circuit 310, 311: Reader / writer 312: Tag chip feeder

Claims (10)

In an electronic circuit production system for producing an electronic circuit, including a plurality of machines including an electronic circuit component mounting machine for mounting electronic circuit components on a circuit board, and a computer connected to the plurality of machines, the plurality of units Causing the computer to store production history information , which is information related to work performed on the circuit board by at least a part of the machine, and causing the electronic circuit component mounting machine to mount the memory on the circuit board. A circuit board management method , wherein production history information stored in the computer before the memory is installed is stored in the memory after the memory is installed .   The circuit board management method according to claim 1, wherein the production history information is stored in the computer in association with an identification code of the circuit board. In addition to the production history information, the memory includes common information that is information common to a plurality of circuit boards including the type, manufacturer, lot number, and specifications of the circuit boards, and an identification code unique to each circuit board. circuit board management method according to claim 1 or 2 in each circuit board to store the at least one of the specific information is specific information. Circuit board management method according to any one of claims 1 to 3 utilizes the information stored in the memory to at least one control of the plurality of machines. The information stored in the memory, the circuit board management method according to any one of claims 1 to 4 utilized after the circuit board is fed out from said electronic circuit production system. A plurality of machines including an electronic circuit component mounting machine for mounting an electronic circuit component supplied from a component supply device on a circuit board by a mounting device, and a computer connected to the plurality of machines to produce an electronic circuit Electronic circuit production system
Wherein a plurality of machine acquires production history information which is information related to work done to the circuit board by at least part of what, production history information acquisition means for storing prior loggers computer,
Tag chip mounting means for mounting a tag chip having a memory on the circuit board;
Production history information writing means for writing production history information acquired by the production history information acquisition means and stored in the computer into the memory of the tag chip by wireless communication with the tag chip attached by the tag chip attachment means; only it contains, and the tag chip mounting means, said with the tag chip to the electronic circuit component mounting machine is intended to be mounted on the circuit board, the production history information writing means, the tag chip circuit by the tag chip mounting means An electronic circuit production system , wherein the production history information stored in the computer before being mounted on a substrate is written into the tag chip after the tag chip is mounted . The component supply device of the electronic circuit component mounting machine includes at least one of a feeder including a supply unit that sequentially supplies the tag chips and a tray that holds the tag chips arranged in a plane, and electronics production system of claim 6, wherein the tag chip mounting means is configured and mounting device, by a control unit for mounting the tag chip by controlling the mounting device to a circuit board. The electronic circuit production system according to claim 6 or 7 , wherein the production history information acquisition unit stores the production history information in the computer in association with an identification code of the circuit board. In addition to the production history information, the memory includes common information that is information common to a plurality of circuit boards including the type, manufacturer, lot number, and specifications of the circuit boards, and an identification code unique to each circuit board. A reading device in which at least one of unique information that is unique to each circuit board is stored, and the electronic circuit production system reads at least one of the common information and unique information and the production history information by wireless communication An electronic circuit production system according to claim 6 , comprising: The electronic circuit production system according to claim 9 , further comprising means for using information read by the reader to control at least one of the plurality of machines.

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