JP3264742B2 - Component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for automatically mounting components such as electronic components on a substrate.

[0002]

2. Description of the Related Art FIG. 6 shows a conventional component mounting apparatus 1 of this kind.
Is schematically shown from the top. Here, a board transfer path 3 is provided on the base 2 so as to extend in the left-right direction, and a board backup unit (not shown) for stopping the board 4 and enabling component mounting work is provided at the center thereof. On the base 2, along the substrate transport path 3, there is provided a component supply unit 6 including a plurality of tape feeders 5 (only two are shown) for each component type. Between the supply unit 6, a CCD camera 7 is provided at the center. Although not shown, a mounting head that is freely moved above the base 2 by an XY transfer mechanism is provided.

Each of the above mechanisms is controlled by a control device (not shown), whereby the mounting head acquires a component from a predetermined tape feeder 5 by suction, transports the component to the substrate 4 on the substrate backup unit, and transfers the component to the substrate. The operation of mounting at a predetermined component mounting position is repeated. At this time,
During the transfer of parts, the mounting head is a CCD camera 7
Is temporarily stopped above, and the component suction state of the mounting head is photographed. The positional deviation amount is detected based on the image information, and the position is corrected at the time of mounting the component on the board 4 to achieve high precision. The mounting work is performed.

[0004]

When the tape feeder 5 is located near (in the center of) the substrate 4 (substrate backup portion), the moving time of the mounting head required for mounting the component is short. If the tape feeder 5 is located at a position away from the substrate 4 (for example, at the left end), the moving distance of the mounting head and, consequently, the moving time required for the mounting operation become longer. For this reason, conventionally, before performing the mounting work,
The arrangement of the tape feeders 5 in the component supply unit 6 is rearranged so that the moving distance of the mounting head is as short as possible, thereby shortening the working time.

[0005] However, when there are many types of parts, the tape feeder 5 must be arranged at a position away from the center.
However, there is a limit to shortening the time for mounting components by simply rearranging the components. In addition, since the mounting head has to pass through the CCD camera 7 once, it cannot move the shortest distance for component transfer and moves in a detour, which also shortens the working time. Had been an obstacle to the transformation.

The present invention has been made in view of the above circumstances, and has as its object to perform high-precision component mounting work,
It is an object of the present invention to provide a component mounting apparatus capable of effectively reducing the working time.

[0007]

According to a first aspect of the present invention, there is provided a component supply unit having a substrate transport path through which a substrate is transported from a loading position to an unloading position, and a plurality of component supply positions along the substrate transport path. And a substrate backup unit provided in the substrate transport path and supporting the substrate, and a component that is freely moved by a transfer mechanism and is supplied from the component supply unit, and the component is supported by the substrate backup unit. A component mounting apparatus comprising: a mounting head mounted on a predetermined component mounting position on the substrate; and an imaging unit configured to capture an image of the component in order to detect a displacement of the component held by the mounting head. The substrate backup unit and the imaging unit are each configured to be movable along the substrate transport path.

According to a second aspect of the present invention, there is provided a substrate transport path through which a substrate is transported from a loading position to an unloading position, a component supply unit having a plurality of component supply positions along the substrate transport path,
A substrate backup unit provided in the substrate transport path and supporting the substrate, and the substrate supported by the substrate backup unit that holds a component freely moved by a transfer mechanism and supplied from the component supply unit and supported by the substrate backup unit A mounting head to be mounted to a predetermined component mounting position, and an imaging unit that captures an image of the component in order to detect a positional shift of the component held by the mounting head.
A plurality of the substrate backup units are provided along the substrate transport path, and the imaging unit is configured to be movable along the substrate transport path.

[0009]

According to the first aspect of the present invention, since the board backup unit is configured to be movable along the board transport path, it is difficult to mount the component at the component mounting position on the board.
By moving the substrate backup unit along the substrate transport path,
The board can be moved to a position corresponding to the component supply position where the current component is supplied in the component supply unit.

Further, at this time, the imaging means is moved along the board transport path in accordance with the component supply position where the component is supplied this time and the component mounting position of the board on which the component is mounted, so that the component supply unit The moving distance of the mounting head between the component supply position where the component is supplied this time and the component mounting position of the board on which the component is mounted can be shortened, and the working time can be effectively reduced. it can.

According to the second aspect of the present invention, since a plurality of substrate backup portions are provided along the substrate transport path, a plurality of substrate backup portions are provided for mounting components at the component mounting positions on the substrate. Of the board backup units, the board can be supported by the board backup unit corresponding to the component supply position where the current component is supplied in the component supply unit.

Further, at this time, the imaging means is moved along the board transport path in accordance with the component supply position where the component is supplied this time and the component mounting position of the board on which the component is mounted, so that the component supply unit The moving distance of the mounting head between the component supply position where the component is supplied this time and the component mounting position of the board on which the component is mounted can be shortened, and the working time can be effectively reduced. it can.

[0013]

[0014]

FIG. 1 shows a first embodiment of the present invention.
This will be described with reference to FIGS. First, FIG. 3 shows an appearance of a component mounting apparatus 11 according to the present embodiment. The component mounting apparatus 11 has a board transport path 14 for transporting a board 13 on a base 12 and an electronic component 15 (see FIG. (Only shown in 2)
And a component mounting mechanism 17 for mounting the component 15 on the board 13 and a microcomputer (not shown) for controlling the mechanisms. Have.

As shown in FIG. 1, the substrate transport path 14 is provided so as to extend over the entire base 12 in the left-right direction (X-axis direction), and is provided by a belt conveyor mechanism (not shown) and a substrate backup unit described later. The board 13 is configured to be transported from a carry-in position at the right end to a carry-out position at the left end. In addition, as shown in FIG.
A standby stopper 18 is provided at a right end portion (a carry-in position portion) of the substrate 13, and the substrate 13 before the mounting operation is stopped at the standby position by the standby stopper 18.

Further, in the middle of the substrate transport path 14,
A board backup unit 19 is provided. As shown in FIG. 2, the board backup unit 19 is configured to support the board 13 from below with a plurality of backup pins 20 and the like. It is becoming. In this case, a stopper 21 is provided at an intermediate portion of the substrate transport path 14,
The substrate 13 sent from the loading position is stopped by the stopper 21 and is supported by the substrate backup unit 19 at this position.

In this embodiment, the board backup unit 19 is moved along the direction of feeding the board 13 (left and right direction) of the board transport path 14 by a pair of slide rails 22 provided on the base 12. In addition to being made possible, the ball screw 23 and a servomotor 24 with an encoder for rotating the ball screw 23 are moved to an arbitrary position.

The component supply section 16 is provided on the substrate transport path 1.
1, a plurality of different component types (2 in FIG. 1)
Component supply device, for example, a tape feeder 26)
Are replaceably provided. As we all know,
The tape feeder 26 includes a plurality of chip-type electronic components 1.
5 is held on a tape, and the electronic components 15 are supplied one by one to a supply position at a leading end (substrate transport path 14 side). Therefore, the component supply positions Q are arranged in the X-axis direction near both sides of the board transfer path 14.

The component mounting mechanism 17 includes a mounting head 27 having a suction nozzle 27a at a tip thereof and a well-known mechanism for moving the mounting head 27 to an arbitrary position above the base 12 based on a unique XY coordinate system. XY transfer mechanism 28
And so on. Thus, the work of acquiring the predetermined component 15 of the component supply unit 16 by suction by the mounting head 27, transporting this to the board 13 on the board backup unit 19, and mounting the component 15 at the predetermined component mounting position P is performed. It is to be executed repeatedly.

Further, as shown in FIG.
2, a concave portion 12a is provided between the substrate transport path 14 and the component supply section 16 (on both front and rear sides of the substrate transport path 14) and extends in the left-right direction (X-axis direction). In addition, a line sensor 29 as an image pickup means is provided upward. This line sensor 29 is
The bottom of 2a is movable along a slide rail 30 extending in the X-axis direction, and is moved to an arbitrary position by a ball screw 31, a servomotor 32 with an encoder for rotating the screw, and the like (see FIG. 1). It has become.

In the line sensor 29, the mounting head 27 acquires the component 15 of the component supply unit 16 and
The image of the component 15 is transferred in the Y-axis direction by a certain trigger during the transfer to the component 3. The image data is sent to an image processing device (not shown), and X, Y, θ relative to the normal position of the suction position of the component 15 by the mounting head 27.
The amount of deviation in the direction is determined.

The control device controls the belt conveyor mechanism, the standby stopper 18 and the stopper 21, the servomotor 24, the XY transfer mechanism 28, the line sensor 29, the servomotor 32, and the like. At this time, the coordinates of the component supply position Q in the component supply unit 16 (each tape feeder 26) and its component type, the relative position coordinates of the component mounting position P on the board 13, and the component type are stored in the memory of the control device. Is input and stored in advance.

Then, the control device executes a component mounting operation on the substrate 13 by the mounting head 27 according to a predetermined mounting program. At this time, as will be described later, the component mounting operation on the substrate 13 is performed. Position P
The board backup unit 19, that is, the board 13 is moved to a position where the X coordinate of the component supply position Q of the component 15 to be mounted at that position coincides with the component supply position Q.
The line sensor 29 is moved so as to be on a straight line connecting the position and the position Q, that is, to have the same X coordinate.

At the same time, each component mounting position P is such that the component mounting operation is performed while the substrate 13 (substrate backup unit 19) is sequentially moved from right to left.
In the component mounting order. still,
The mounting of the component 15 at the component mounting position P is performed while correcting the shift amount of the suction position detected by the line sensor 29.

Next, the operation of the above configuration will be described. When performing the component mounting work on the new board 13, first, the board 13 waiting at the carry-in position is sent to the left on the board transport path 14 by the belt conveyor mechanism,
It is stopped by the stopper 21 and is supported by the substrate backup unit 19 at that position. During the subsequent component mounting operation, the board 13 is moved in the X-axis direction (leftward) on the board transfer path 14 integrally with the board backup unit 19.

Then, the mounting head 27 causes the substrate 13
The mounting operation of the predetermined type of component 15 is sequentially performed on the plurality of component mounting positions P above.
Each time the individual components 15 are mounted, the board backup unit 19, that is, the board 13 is moved so that the X coordinate of the component mounting position P and the component supply position Q of the component 15 mounted at that position match. As a result, the distance between the component mounting position P and the component supply position Q becomes the shortest for all the component mounting positions P, and the mounting head 27 only needs to move the shortest distance, and the time required for the mounting head 27 to move. That is, the component mounting work time is minimized.

At this time, while the mounting head 27 picks up the component 15 at the component supply position Q and transfers the component 15 to the substrate 13, the pick-up state of the component 15 by the line sensor 29 is photographed in the Y-axis direction. Is performed by taking a predetermined number of images with a trigger at regular intervals, but since the line sensor 29 is moved so as to be on a straight line connecting the position P and the position Q, the mounting head 27 is always The image is captured during the shortest linear movement from the component supply position Q to the component mounting position P.

Since the mounting of the component 15 to the component mounting position P is performed while correcting the shift amount of the suction position detected by the line sensor 29 and the image processing device, a highly accurate component mounting operation is performed. It is. When the mounting operation to all the component mounting positions P is completed, the substrate 13 is transported to the unloading position at the left end of the substrate transfer path 14, detaches from the substrate backup unit 19, and is unloaded by the belt conveyor mechanism on the unloading position side. At the same time, the board backup unit 19
Is the position of the origin (the substrate 13 stopped by the stopper 21)
, And the next board 13 is carried in, and the same component mounting operation is repeated.

As described above, according to the present embodiment, since the board backup unit 19 is provided so as to be movable, the component supply position Q of the component supply unit 16 corresponding to the component mounting position P of the board 13 is provided.
The mounting work of the component 15 can be performed while always keeping the distance between the components 15 to the minimum. Therefore, unlike the conventional case where the moving distance of the mounting head is long and the mounting work time is long depending on the type of components, the mounting head 27 only has to move a short distance at all times. Can be achieved very effectively. In addition, since it is not necessary to rearrange the tape feeders 26, no time is required for changing the arrangement.

Then, a line sensor 2 as an image pickup means
9 allows not only high-precision component mounting work to be performed, but also the line sensor 29 to be movable and image capture to be performed in the movement path of the mounting head 27 (component 15). 27 eliminates the need to move in a circuitous manner as in the prior art. Further, in this embodiment, in particular, the line sensor 29 is used as the image pickup means, and the image is captured while the mounting head 27 (the component 15) is moving without being stopped. The mounting work time can be further shortened as compared with the case of temporarily stopping.

In the first embodiment, if the line sensor 29 is configured to move in synchronization with the movement of the mounting head 27 in the X-axis direction, the components 15 acquired by the mounting head 27 are surely obtained. Can be imaged, and it is not necessary to independently control the movement of the line sensor 29. Also, one component 15
Each time the substrate backup unit 19 (substrate 13) is not strictly moved every time the substrate
It is also possible to shorten the mounting work time by performing the mounting work of the component 15 from the component supply position Q located in the vicinity thereof while stopping at several places.

Next, FIGS. 4 and 5 show a component mounting apparatus 41 according to a second embodiment of the present invention. Hereinafter, differences from the above-described first embodiment will be described. In the present embodiment, a plurality of substrate backup portions 42 and 43 are fixedly provided in the substrate transport path 14 at, for example, two right and left positions. Further, the substrate transport path 14 is provided with stoppers 44, 45 corresponding to the respective substrate backup units 42, 43.

Also in this case, the line sensor 29 serving as the imaging means is movable along the slide rail 30 extending in the X-axis direction at the bottom of the recess 12a, and rotates the ball screw 31 and the ball screw 31. The servomotor 32 with the encoder and the like is moved so as to be on a straight line connecting the component mounting position P on the substrate 13 and the component supply position Q of the component 15 mounted at that position.

In this embodiment, the board 13 is first stopped on the board backup section 42 on the right side, and at this position, the component 15 of the tape feeder 26 located at the right half of the component supply section 16 is placed. A mounting operation is performed. When this is completed, the board 13 is then transferred to the board backup section 43 on the left side, where the remaining component supply section 1 is located.
The mounting work of the component 15 of the tape feeder 26 located in the left half of the section 6 is performed.

At this time, when the image is captured by the line sensor 29, the path of the mounting head 27 (the component 15) is almost oblique to the line sensor 29 in most cases. By correcting the image data based on the inclination of the straight line connecting the component supply position Q with respect to the Y axis, as in the first embodiment,
It is possible to determine the amount of deviation in the X, Y, and θ directions of the suction position of the component 15 by the mounting head 27 from the normal position.

According to this configuration, it is possible to prevent the distance between the component mounting position P of the board 13 and the corresponding component supply position Q of the component supply unit 16 from becoming longer than a predetermined distance. Since the head 27 only needs to move a relatively short distance, the mounting operation time can be effectively reduced. Since there is no need to rearrange the tape feeders 26, no time is required for changing the arrangement.

Also in this case, the line sensor 29
Is movable, and the image of the component 15 is taken in the movement path of the mounting head 27. Therefore, the mounting head 27 does not need to make a circuitous movement, and furthermore, the image of the mounting head 27 moves while the mounting head 27 is moving. Since the taking-in is performed, it is possible to shorten the mounting work time while performing the component mounting work with high accuracy.

In the second embodiment, the substrate backup portions 42 and 43 are provided at two locations, but may be provided at three or more locations. Further, if the line sensor 29 is configured to move (moves so as to be located at the same X coordinate) in synchronization with the movement of the mounting head 27 in the X-axis direction, the component mounting position P and the component The amount of deviation in the X, Y, and θ directions can be obtained without correcting the image data based on the inclination of the straight line connecting the supply position Q with respect to the Y axis.

In addition, the present invention is not limited to the above-described embodiments. For example, a two-dimensional camera or the like may be used as the imaging means. For example, a tray or the like may be used.

[0040]

According to the present invention, it is possible to effectively reduce the operation time while performing the component mounting operation with high accuracy.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of the present invention, and is a top view of a component mounting apparatus excluding a component mounting mechanism portion.

FIG. 2 is a schematic vertical sectional side view of a component mounting apparatus.

FIG. 3 is an overall perspective view.

FIG. 4 is a view corresponding to FIG. 1, showing a second embodiment of the present invention;

FIG. 5 is a diagram corresponding to FIG. 2;

FIG. 6 is a diagram corresponding to FIG. 1 showing a conventional example.

[Explanation of symbols]

In the drawings, 11 and 41 are component mounting apparatuses, 12 is a base, 1
3 is a board, 14 is a board transfer path, 15 is a component, 16 is a component supply unit, 17 is a component mounting mechanism, 19, 42, and 43 are board backup units, 26 is a tape feeder, 27 is a mounting head, and 28 is XY transfer. A mechanism 29 indicates a line sensor (imaging means).

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/00 H05K 13/04

Claims (3)

(57) [Claims] 1. A substrate transport path through which a substrate is transported from a loading position to an unloading position, a component supply unit having a plurality of component supply positions along the substrate transport path, and a support provided on the substrate transport path to support the substrate. And a mounting head for holding a component supplied from the component supply unit that is freely moved by a transfer mechanism and mounting the component to a predetermined component mounting position of the substrate supported by the substrate backup unit. A component mounting apparatus comprising: an imaging unit that captures an image of the component in order to detect a displacement of the component held by the mounting head; and wherein the substrate backup unit and the imaging unit each include the substrate A component mounting device configured to be movable along a transport path. 2. A substrate transport path through which a substrate is transported from a carry-in position to an unloading position; a component supply unit having a plurality of component supply positions along the substrate transport path; And a mounting head for holding a component supplied from the component supply unit that is freely moved by a transfer mechanism and mounting the component to a predetermined component mounting position of the substrate supported by the substrate backup unit. And an imaging unit that captures an image of the component in order to detect a displacement of the component held by the mounting head. In the component mounting apparatus, the board backup unit includes a plurality of And a component mounting apparatus, wherein the imaging unit is configured to be movable along the substrate transport path. 3. The component mounting apparatus according to claim 1, wherein the imaging unit is configured to be moved in synchronization with the movement of the mounting head along the substrate transport path.