JP2869590B2 - Intermediate board for mounting circuit components and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of flip-chip mounting a circuit component such as an IC on a circuit wiring board using a solder bump or the like. The present invention relates to an intermediate substrate for mounting circuit components disposed between the substrate and a method of manufacturing the intermediate substrate.

[0002]

2. Description of the Related Art In recent years, the area of ICs has increased and the number of electrodes has increased.
With the increase in the density, a bump portion is distorted due to a difference in thermal expansion coefficient between a circuit component such as an IC chip and a circuit board.
In order to solve such a problem, it is effective to increase the height of the bumps by means of disposing such a circuit component mounting intermediate board between the circuit component and the circuit board.

Various conventional structures of such an intermediate board with terminals for connecting circuit parts have been proposed. For example, an insulating material as disclosed in Japanese Patent Application Laid-Open No. Sho 60-123093 has a diameter of 0.1 mm. A conductive pin of about 0.2 mm is embedded and formed so as to protrude from the insulating material, or a hole is provided at a predetermined position of an insulating film as disclosed in JP-A-1-72537. A certain amount of paper
There is a type in which a strike-shaped solder is held by printing means. Furthermore,
As disclosed in JP-A-62-18049, a through hole is formed in a ceramic green sheet and fired, and a copper paste or the like which is wettable with solder is inserted into the through hole. Then, a tungsten paste or the like having no wettability is inserted on the copper layer and fired. Then, a copper paste or the like having a wettability is inserted on the tungsten layer and fired. In addition, there is a method of melting and joining a solder ball to a copper portion on the upper surface.

[0004]

In such an intermediate board for mounting circuit components, when the wiring density of the IC chip is further increased and the diameter of the solder bump is correspondingly reduced, a high-definition connection terminal is formed. It becomes difficult to manufacture an intermediate board for mounting circuit components. In addition, the alignment of the electrodes of the IC chip with the connection terminals of the circuit component mounting intermediate substrate also increases the difficulty.

On the other hand, in the conventional method, since the distortion due to the difference in the thermal expansion coefficient between the circuit component and the wiring board is reduced by means for increasing the connection terminals, the circuit component will be further increased in density and size in the future. There is a risk that reliable mounting will be difficult.

[0006]

SUMMARY OF THE INVENTION According to the present invention, when mounting a circuit component such as an IC chip on a circuit board, the connecting terminals of this kind of intermediate board for mounting the circuit component, which are disposed therebetween, are high. It is an object of the present invention to provide an intermediate board for mounting circuit components, which can be formed at a high density, and which can appropriately absorb a strain caused by a difference in thermal expansion coefficient to enable high-density and highly reliable flip-chip mounting, and a method of manufacturing the same. .

Therefore, in the circuit component mounting intermediate board of the present invention, the above-mentioned circuit is used to electrically connect the electrodes of the circuit components such as ICs and the electrodes of the circuit wiring board arranged opposite to the electrodes. In a circuit component mounting intermediate board provided with connection terminals protruding through an insulating base material and disposed between the circuit board and the circuit wiring board, a peripheral portion of the connection terminals is provided. And a groove formed on one surface of the insulating base material.

Here, a part of the groove is formed by the insulating base.
The groove may be formed so as to penetrate through the connection material, and such a groove may be provided in a plurality of lines around the connection terminal.

As a method for manufacturing such an intermediate substrate for mounting circuit components, a metal mask having holes and grooves formed at required positions is formed on one surface of an insulating base material. A conductive layer having a corrosion-resistant metal layer formed on the other surface of the insulating base material at a portion corresponding to the hole and a resist layer on a surface other than the surface where the corrosion-resistant metal layer is formed; A step of forming a metal layer, a step of removing a part of the insulating base material located in the hole and the groove from the metal mask side, and a step of removing all of the insulating base material located in the hole. Removing and partially exposing the conductive metal layer; etching and removing the metal mask; and forming one end of the conductive metal layer in the hole partially exposing the conductive metal layer. Electrically connected to the layer and the other end is covered with the insulating base material. Forming a circuit component mounting terminal protruding to the outside through the conductive metal layer, removing the resist layer on the surface of the conductive metal layer, and removing the other portion except for the portion where the corrosion resistant metal layer is formed. A step of etching and removing the conductive metal layer region can be employed.

In the above-mentioned step, the corrosion-resistant metal layer formed at a corresponding portion of the conductive metal layer is formed on the entire surface of the conductive metal layer after the step of forming the circuit component mounting terminal. It is also possible to form a hole in a corresponding portion of the resist layer formed above and then form the corrosion-resistant metal layer.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be further described with reference to the illustrated embodiment. Referring to FIGS. 1 and 2, a required position on one surface of an insulating base material 1 such as polyimide is made of gold or the like. An island-shaped electrode 11 made of a conductive metal such as a copper foil covered with a metal layer 6 having high corrosion resistance and good solder wettability is formed. A hole 3c is formed in a corresponding portion of the insulating base material 1 where the island-shaped electrode 11 is formed. One end of the hole 3c is electrically connected to the island-shaped electrode 11, A circuit component mounting terminal 9 having an end penetrating the insulating base material 1 and protruding to the outside is formed. The surface of the circuit component mounting terminal 9 is coated with a metal layer 10 such as gold, which is highly resistant to corrosion and has good solder wettability. 9 and the metal layer 10,
Although not shown, a connection terminal 12 for electrically connecting the electrode of the circuit component and the electrode of the circuit wiring board is formed. 4a is an annular groove formed on one side of the insulating base material 1 near the periphery of the connection terminal 12, and this groove 4a is formed when a circuit component such as an IC is mounted on a circuit wiring board. It works so as to appropriately absorb the distortion caused by the difference in thermal expansion coefficient between the circuit component and the wiring board.

As shown in FIG. 3, the structure of the groove for absorbing the strain due to the difference in the coefficient of thermal expansion is constituted by a through groove 4c which penetrates the insulating base material 1 discontinuously and partially. Further, as shown in FIG. 4, it is also possible to form a plurality of grooves so as to include a groove 4b near the outer periphery of the groove 4a and further formed from the other surface of the insulating base material 1. is there.

FIGS. 5A to 5C show FIGS. 1 and 2 respectively.
2 is a manufacturing process diagram of the circuit component mounting intermediate substrate shown in FIG.
First, as shown in FIG. 1A, a metal mask 2 such as a copper foil having holes 3 and an annular groove 4 formed at required positions is formed on one surface of an insulating base material 1 such as polyimide. , Insulation base
On the other surface of the metal material 1, a conductive metal layer 5 such as a copper foil is formed. For the insulating base material 1, metal mask 2, and conductive metal layer 5, for example, a double-sided copper-clad laminate having an adhesive layer or a non-adhesive type is prepared, and one surface of the copper foil is prepared. The metal mask 2 having the holes 3 and the grooves 4 can be formed by subjecting the metal mask 2 to an etching process. Then, a resist layer 7 is formed on the surface side of the conductive metal layer 5 except for a portion corresponding to the hole 3, and a corrosion-resistant metal layer 6 such as gold is formed on a portion where the resist layer 7 is not formed. Is formed by plating or other means.

Next, as shown in FIG. 2B, an excimer laser beam A1 is irradiated from the side of the metal mask 2 and a part of the insulating base material 1 located in the holes 3 and the grooves 4 is formed. The hole 3a and the groove 4a having a required depth are formed by removing the abrasion so as not to penetrate through the hole. Therefore, as shown in FIG. 3 (3), the metal mask 2 is formed so as to cover other regions except for the hole 3a.
When the excimer laser light A2 is irradiated with the light-shielding metal mask 8 disposed thereon, the insulating base remaining in the hole 3a is exposed.
Since the entire portion of the metal material 1 can be removed, a hole 3c that partially exposes the conductive metal layer 5 can be formed in this portion.

Further, as shown in FIG. 4 (4), the metal mask 2 is removed by etching when the light shielding metal mask 8 is removed, and further, as shown in FIG. 5 (5), a corrosion-resistant metal layer 6 is first formed. When plating treatment or the like is performed on the hole 3c with the plating resist layer 13 provided on the side where the plating resist layer 13 is provided, one end is electrically connected to the conductive metal layer 5 and the other end penetrates the insulating base material 1. Therefore, a metal layer 10 having high corrosion resistance and good solder wettability can be formed on the surface of the terminal 9 by means of gold plating or the like. it can. Therefore, at the stage where both the resist layers 7 and 13 are removed as shown in FIG.
Is etched to remove the other region of the conductive metal layer 5 except for the portion where the corrosion-resistant metal layer 6 is provided, thereby forming the island-like electrode 11 and forming the connection terminal 1.
2, whereby it is possible to manufacture an intermediate board for mounting circuit components as shown in FIGS.

In the above, as shown in FIG.
In order to provide the through groove 4c near the periphery of the hole 3c, excimer laser light A2 is irradiated from the metal mask 2 side without disposing the light shielding metal mask 8 in the step (3) of FIG. In the vicinity of the periphery, a groove which discontinuously penetrates the insulating base material 1 may be formed, and in the step of FIG. 5 (5), the through groove may be changed so as not to be plated. Further, as shown in FIG.
To provide a and b, an annular groove having a size larger than the diameter of the annular groove 4 is formed by etching on the side of the conductive metal layer 5 shown in FIG. 5A, and as shown in FIG. Excimer laser light may be irradiated from the conductive metal layer 5 side to form a similar groove from the other surface of the insulating base material 1 in the same manner as the method of forming the hole 3a and the groove 4a. The grooves 4a, 4b, the through-grooves 4c, and the like are formed concentrically around the connection terminal 12 and also in a part of a spiral shape around the connection terminal 12. Can be.
The corrosion-resistant metal layer 6 can be formed at a predetermined position of the conductive metal layer 5 after the formation of the circuit component mounting terminal 9 shown in FIG. Further, instead of the above-described method of forming the grooves by the abrasion processing using excimer laser light, a wet removal processing method using, for example, a hydrazine-based etchant can be adopted.

[0017]

According to the circuit component mounting intermediate substrate and the method of manufacturing the same according to the present invention, it is possible to form a groove in the insulating base material near the periphery of the connection terminal.
The distortion caused by the difference in thermal expansion coefficient between the circuit component such as C and the circuit wiring board can be suitably absorbed.

Further, according to the manufacturing method of the present invention, in a case where a circuit component such as an IC having a large area and a high density electrode arrangement is mounted on a circuit wiring board, connection reliability is extremely high. A high-precision intermediate board for mounting circuit components can be stably provided.

[Brief description of the drawings]

FIG. 1 is a conceptual partial cross-sectional configuration diagram of a circuit component mounting intermediate substrate configured according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective cross-sectional configuration diagram of a principal part of a circuit component mounting intermediate substrate of FIG. 1;

FIG. 3 is a similar main part enlarged perspective cross-sectional configuration view of a circuit component mounting intermediate substrate configured to have a through groove near the periphery of a connection terminal according to another embodiment of the present invention.

FIG. 4 is an enlarged perspective cross-sectional configuration view of a main part of a circuit component mounting intermediate substrate configured to have a plurality of grooves near the periphery of a connection terminal according to still another embodiment of the present invention.

FIGS. 5 (1) to (6) are manufacturing process diagrams of a circuit component mounting intermediate substrate according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulation base material 2 Metal mask 3 Hole 3a Hole 3c Hole 4 Groove 4a Groove 4b Groove 4c Through groove 5 Conductive metal layer 6 Metal layer 7 Resist layer 8 Light-shielding metal mask 9 Circuit component mounting terminal 10 Metal layer 11 Island electrode 12 Connection terminal 13 Plating resist layer

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-293730 (JP, A) JP-A-1-243534 (JP, A) JP-A-2-252250 (JP, A) JP-A-4- 29336 (JP, A) JP-A-4-269475 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 21/60 311 H05K 1/18

Claims (5)

(57) [Claims] 1. An electrode for a circuit component such as an IC, which is provided between the circuit board and the circuit board to electrically connect the electrode of the circuit board to the electrode. In addition, in the circuit component mounting intermediate substrate having connection terminals formed so as to protrude through the insulating base material, a peripheral portion of the connection terminals and one surface of the insulating base material An intermediate substrate for mounting circuit components, comprising: a formed groove. 2. The circuit component mounting intermediate substrate according to claim 1, wherein said groove is formed so that a part thereof penetrates said insulating base material. 3. The circuit component mounting intermediate board according to claim 1, wherein another groove is provided near the groove. 4. A metal mask having holes and grooves formed at required positions on one surface of the insulating base material.
A conductive metal having a corrosion-resistant metal layer formed on the other surface of the insulating base material at a location corresponding to the hole and having a resist layer on a surface other than the surface where the corrosion-resistant metal layer is formed; Forming a layer; and removing a portion of the insulating base material located in the holes and grooves from the metal mask side.
Removing all portions of the insulating base material located in the holes to partially expose the conductive metal layer; etching and removing the metal mask; and partially removing the conductive metal layer. Forming a circuit component mounting terminal having one end electrically connected to the conductive metal layer and the other end penetrating through the insulating base material and projecting to the outside in the hole exposed to the outside; An intermediate substrate for mounting a circuit component, comprising a step of removing the resist layer on the surface of the conductive metal layer and etching away other corrosion-resistant metal layer regions except for a portion where the corrosion-resistant metal layer is formed. Manufacturing method. 5. The resist layer formed on the entire surface of the conductive metal layer after the step of forming the circuit component mounting terminal after the step of forming the circuit component mounting terminal. 5. The method according to claim 4, wherein the corrosion-resistant metal layer is formed after forming a hole in the corresponding portion.