JP2022092284A

JP2022092284A - Liquid discharge head and method for manufacturing liquid discharge head

Info

Publication number: JP2022092284A
Application number: JP2020205008A
Authority: JP
Inventors: 修平大宅; Shuhei Otaku; 智伊部; Satoshi Ibe; 洋久藤田; Hirohisa Fujita; 美香小倉; Mika Ogura
Original assignee: Canon Inc
Current assignee: Canon Inc
Priority date: 2020-12-10
Filing date: 2020-12-10
Publication date: 2022-06-22
Anticipated expiration: 2040-12-10
Also published as: JP7570910B2

Abstract

To provide a liquid discharge head that can suppress deformation and breakage of a substrate and form a dust collection filter without complication of processes, and to provide a method for manufacturing a liquid discharge head.SOLUTION: An organic resin layer 9 includes communication ports 10 arranged in a zigzag manner. The organic resin layer 9 between a row of first communication ports 13 and a row of second communication ports 14 is provided with a straight part 20.SELECTED DRAWING: Figure 2

Description

本発明は、フィルタとして機能することが可能な層を備え、液体を吐出する液体吐出ヘッドおよび液体吐出ヘッドの製造方法に関する。 The present invention relates to a liquid discharge head and a method for manufacturing a liquid discharge head, which comprises a layer capable of functioning as a filter and discharges a liquid.

特許文献１には、液体吐出ヘッドにおいて、基板の剛性に応じて部分的に封止材の量を異ならせて塗布することで、封止材の硬化収縮による応力で生じた引っ張り力を、基板の剛性に応じた引っ張り力とすることで、基板の変形を抑制することが開示されている。 In Patent Document 1, in the liquid discharge head, by applying a partially different amount of the encapsulant according to the rigidity of the substrate, the tensile force generated by the stress due to the curing shrinkage of the encapsulant is applied to the substrate. It is disclosed that the deformation of the substrate is suppressed by setting the tensile force according to the rigidity of the above.

また、特許文献２には、先細状構造体からなる突起体と、貫通孔と、を有するゴミを捕集するフィルタを備えた液体吐出ヘッドが開示されている。 Further, Patent Document 2 discloses a liquid discharge head provided with a filter for collecting dust having a protrusion made of a tapered structure and a through hole.

特開２０１５－７７７３２号公報JP-A-2015-77732 特開２０１２－１９６９４４号公報Japanese Unexamined Patent Publication No. 2012-196944

しかし、封止材はロット毎に特性が異なる場合があり、特許文献１の方法では、基板に対して実際に作用する封止材の応力の影響がどの程度であるかは分かりづらく、封止材のロット毎のばらつきによって、基板の変形や破損が生じる虞がある。 However, the characteristics of the encapsulant may differ from lot to lot, and in the method of Patent Document 1, it is difficult to understand how much the stress of the encapsulant actually acts on the substrate, and the encapsulant is sealed. There is a risk that the substrate will be deformed or damaged due to variations from lot to lot of material.

また、特許文献２のようなフィルタを形成するには工程が煩雑となる虞がある。 Further, there is a possibility that the process becomes complicated in order to form the filter as in Patent Document 2.

よって本発明は、基板の変形や破損を抑制し、且つ工程を複雑化することなくフィルタとして機能することが可能な層の形成が可能な液体吐出ヘッドおよび液体吐出ヘッドの製造方法を実現することを目的とする。 Therefore, the present invention realizes a liquid discharge head and a method for manufacturing a liquid discharge head capable of forming a layer capable of suppressing deformation or breakage of the substrate and functioning as a filter without complicating the process. With the goal.

そのため本発明の液体吐出ヘッドは、液体を吐出する複数の吐出口が列を成した吐出口列を有した吐出口プレートと、前記吐出口プレートを支持し、かつ前記吐出口と連通した供給口を有する基板と、前記吐出口プレートと前記基板との間に設けられ、前記吐出口プレートと前記基板との密着性を向上させる樹脂層と、前記基板の周囲に付与された封止材と、を備えた液体吐出ヘッドであって、前記樹脂層は、前記供給口を覆って設けられ、前記供給口から供給された液体を前記吐出口へと導く複数の連通口を有し、前記連通口は、前記吐出口列に近い側の複数の第一連通口からなる第一連通口列と、前記第一連通口列よりも前記吐出口列から離れた複数の第二連通口からなる第二連通口列との列を成しており、前記第一連通口列と前記第二連通口列との間の前記樹脂層は、前記吐出口列の配列方向に、少なくとも、複数の前記第一連通口または複数の前記第二連通口に亘って延在する直線を含む直線部を有し、前記第一連通口と、前記第二連通口とは、千鳥配置になっていることを特徴とする。 Therefore, the liquid discharge head of the present invention has a discharge port plate having a row of discharge ports in which a plurality of discharge ports for discharging liquid are arranged, and a supply port that supports the discharge port plate and communicates with the discharge port. A resin layer provided between the discharge port plate and the substrate to improve the adhesion between the discharge port plate and the substrate, and a sealing material provided around the substrate. The resin layer is provided so as to cover the supply port, and has a plurality of communication ports for guiding the liquid supplied from the supply port to the discharge port. Is from a first series of outlets consisting of a plurality of first series outlets on the side closer to the discharge port row and a plurality of second outlets farther from the discharge port row than the first series outlet row. The resin layer is formed in a row with the second communication port row, and the resin layer between the first series passage port row and the second communication port row is at least a plurality in the arrangement direction of the discharge port row. Has a straight portion including a straight line extending over the first series of passages or a plurality of the second communication ports, and the first series of passages and the second communication port are arranged in a staggered manner. It is characterized by being.

本発明によれば、基板の変形や破損を抑制し、且つ工程を複雑化することなくフィルタとして機能することが可能な層の形成が可能な液体吐出ヘッドおよび液体吐出ヘッドの製造方法を実現することができる。 INDUSTRIAL APPLICABILITY According to the present invention, there is realized a method for manufacturing a liquid discharge head and a liquid discharge head capable of forming a layer capable of suppressing deformation or breakage of a substrate and functioning as a filter without complicating the process. be able to.

ノズルプレートの一部分を省略して示した液体吐出ヘッドの斜視図である。It is a perspective view of the liquid discharge head shown by omitting a part of a nozzle plate. 液体吐出ヘッドを示す図である。It is a figure which shows the liquid discharge head. 記録素子基板の変形と共に変形する有機樹脂層を示した図である。It is a figure which showed the organic resin layer which deforms with the deformation of a recording element substrate. 液体吐出ヘッドの製造方法を工程順に示した図である。It is a figure which showed the manufacturing method of the liquid discharge head in the order of a process. 比較例の有機樹脂層を示した図である。It is a figure which showed the organic resin layer of the comparative example.

以下、図面を参照して本発明の実施形態について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本実施形態を適用可能な液体吐出ヘッド１の内部構造がわかるように、ノズルプレート２の一部分を省略して示す斜視図である。液体吐出ヘッド１は、記録素子５を備えた記録素子基板４と、記録素子基板４に支持されたノズルプレート（吐出口プレート）２と、を備えている。ノズルプレート２は、記録素子基板４の記録素子５が設けられた面と対向する対向面を貫通して設けられた複数の孔を有している。ノズルプレート２は、樹脂材料で構成されており、複数の孔はフォトリソグラフィ技術やエッチング技術を用いて一括して設けられている。 FIG. 1 is a perspective view showing a part of the nozzle plate 2 omitted so that the internal structure of the liquid discharge head 1 to which the present embodiment can be applied can be understood. The liquid discharge head 1 includes a recording element substrate 4 provided with a recording element 5, and a nozzle plate (discharge port plate) 2 supported by the recording element substrate 4. The nozzle plate 2 has a plurality of holes provided so as to penetrate the facing surface of the recording element substrate 4 facing the surface on which the recording element 5 is provided. The nozzle plate 2 is made of a resin material, and a plurality of holes are collectively provided by using a photolithography technique or an etching technique.

ここで、ノズルプレート２に設けられた孔は、記録素子５が設けられた記録素子基板４の面と対向する位置に開口する第１の開口部と、液体を吐出する側に設けられた第２の開口部と、を連通することで設けられている。複数の孔は、記録素子５により発生される熱エネルギを利用して液体を吐出する吐出口３として用いられ、所定のピッチで一列に配列した吐出口列を構成している。 Here, the holes provided in the nozzle plate 2 are a first opening opened at a position facing the surface of the recording element substrate 4 provided with the recording element 5, and a second opening provided on the side for discharging the liquid. It is provided by communicating with the opening of 2. The plurality of holes are used as discharge ports 3 for discharging liquid by utilizing the thermal energy generated by the recording element 5, and form a row of discharge ports arranged in a row at a predetermined pitch.

記録素子基板４に設けられる記録素子５としては、電気熱変換素子（ヒーター）または、圧電素子（ピエゾ素子）等を用いることができる。記録素子基板４における吐出口列に対向する位置には、複数の吐出口３と対応して複数の記録素子５が設けられており、複数の記録素子５は記録素子列を成している。記録素子列は記録素子基板４に２列設けられており、記録素子列の間の位置には、記録素子基板４を貫通して設けられ、記録素子５にインクを供給するためのインク供給口６が設けられている。さらに、ノズルプレート２と記録素子基板４とが接合される事で、ノズルプレート２に凹部として設けられた空間は、液体が通るインク流路７となる。またノズルプレート２と記録素子基板４との間には、ノズルプレート２と記録素子基板４との密着性を高めるための不図示の密着層が設けられている。 As the recording element 5 provided on the recording element substrate 4, an electric heat conversion element (heater), a piezoelectric element (piezo element), or the like can be used. A plurality of recording elements 5 are provided in the recording element substrate 4 at positions facing the discharge port rows, corresponding to the plurality of discharge ports 3, and the plurality of recording elements 5 form a recording element row. Two rows of recording elements are provided on the recording element substrate 4, and ink supply ports for supplying ink to the recording elements 5 are provided at positions between the recording element rows so as to penetrate the recording element substrate 4. 6 is provided. Further, by joining the nozzle plate 2 and the recording element substrate 4, the space provided as the recess in the nozzle plate 2 becomes the ink flow path 7 through which the liquid passes. Further, an adhesion layer (not shown) is provided between the nozzle plate 2 and the recording element substrate 4 in order to improve the adhesion between the nozzle plate 2 and the recording element substrate 4.

記録素子基板４には、記録素子５に電気を供給するのに用いるコンタクトパッド８が設けられている。記録素子基板４のコンタクトパッド８へ電気的な接続を行い、記録素子５に電気が供給されて液体の吐出動作を行う。 The recording element substrate 4 is provided with a contact pad 8 used to supply electricity to the recording element 5. An electric connection is made to the contact pad 8 of the recording element substrate 4, and electricity is supplied to the recording element 5 to perform a liquid ejection operation.

図２は、液体吐出ヘッド１を示す図であり、図２（ａ）は、図１のＩＩ－ＩＩにおける断面図、図２（ｂ）は、図２（ａ）のＩＩｂ－ＩＩｂにおける断面図である。液体吐出ヘッド１では、記録素子５や不図示の電気配線層、不図示の電気絶縁層などを積層する。記録素子基板４上に、電気絶縁層をインクから保護する目的およびノズルプレート２と記録素子基板４との密着性向上を目的として有機樹脂層９が設けられている。有機樹脂層９は、記録素子基板４を貫通して設けられたインク供給口６を覆って設けられ、有機樹脂層９には、インク供給口６上に複数の連通口１０が設けられている。インク供給口６から供給されたインクは、連通口１０を通過してインク流路７に入る。 2A and 2B are views showing a liquid discharge head 1, FIG. 2A is a cross-sectional view taken along the line II-II of FIG. 1, and FIG. 2B is a cross-sectional view taken along the line IIb-IIb of FIG. 2A. Is. In the liquid discharge head 1, a recording element 5, an electric wiring layer (not shown), an electric insulating layer (not shown), and the like are laminated. An organic resin layer 9 is provided on the recording element substrate 4 for the purpose of protecting the electrically insulating layer from ink and for improving the adhesion between the nozzle plate 2 and the recording element substrate 4. The organic resin layer 9 is provided so as to cover the ink supply port 6 provided so as to penetrate the recording element substrate 4, and the organic resin layer 9 is provided with a plurality of communication ports 10 on the ink supply port 6. .. The ink supplied from the ink supply port 6 passes through the communication port 10 and enters the ink flow path 7.

有機樹脂層９には例えば、商品名：ＨＬ－１２００ＣＨ（日立化成株式会社製）およびＨＰＣ-５０２０（日立化成株式会社製）等の熱可塑性樹脂を用いることができる。また、感光性レジストである、商品名：ＰＲ－１０００Ｄ１（日本化薬株式会社製）およびＳＵ－８（日本化薬株式会社）等を用いてもよい。 For the organic resin layer 9, for example, thermoplastic resins such as trade names: HL-1200CH (manufactured by Hitachi Kasei Co., Ltd.) and HPC-5020 (manufactured by Hitachi Kasei Co., Ltd.) can be used. Further, photosensitive resists such as trade names: PR-1000D1 (manufactured by Nippon Kayaku Co., Ltd.) and SU-8 (Nippon Kayaku Co., Ltd.) may be used.

有機樹脂層９は、記録素子基板４上の電気絶縁層をインクから保護するために設けられているが、インク供給口６からインク流路７へのインクの流れにおいては抵抗体となるため、薄く形成されることが好ましい。具体的にはインクへの耐性の観点から厚さ１μｍ以上、インク吐出特性の観点から厚さ３μｍ以下が好ましい。これにより、吐出特性を損なうことなく、記録素子基板４上の配線層をインクから保護することができる。 The organic resin layer 9 is provided to protect the electrical insulating layer on the recording element substrate 4 from ink, but it becomes a resistor in the flow of ink from the ink supply port 6 to the ink flow path 7. It is preferably formed thin. Specifically, a thickness of 1 μm or more is preferable from the viewpoint of ink resistance, and a thickness of 3 μm or less is preferable from the viewpoint of ink ejection characteristics. This makes it possible to protect the wiring layer on the recording element substrate 4 from ink without impairing the ejection characteristics.

また、有機樹脂層９は、インクに含まれたゴミ等のインク流路７への侵入を防ぐフィルタとしての機能を有する。インク供給口６から供給されたインクが有機樹脂層９の連通口１０を通過してインク流路７へ侵入する際に、連通口１０の孔の寸法よりも大きなゴミは有機樹脂層９に捕集される。これによって、インク供給口６から供給されたインク内のゴミ等がインク流路７へ侵入することを防ぐことができる。本実施形態では、有機樹脂層９を形成する際に、フィルタの形状にパターニングすることで、有機樹脂層９にフィルタ機能を付加することができるため、容易にフィルタを形成することができる。 Further, the organic resin layer 9 has a function as a filter for preventing dust and the like contained in the ink from entering the ink flow path 7. When the ink supplied from the ink supply port 6 passes through the communication port 10 of the organic resin layer 9 and enters the ink flow path 7, dust larger than the size of the hole of the communication port 10 is caught by the organic resin layer 9. Be gathered. This makes it possible to prevent dust and the like in the ink supplied from the ink supply port 6 from entering the ink flow path 7. In the present embodiment, when the organic resin layer 9 is formed, the filter function can be added to the organic resin layer 9 by patterning the shape of the filter, so that the filter can be easily formed.

液体吐出ヘッド１は、記録素子基板４が、インクなどの液体を収容する不図示のタンクと接着剤により接合される。また、記録素子基板４と、コンタクトパッド８を介して接合される不図示の電気配線基板と、の電気接合部は、インクが触れることによるショートや腐食、また外部から作用する力による断線等から保護するために、電気接合部を封止材により被覆保護される。 The liquid ejection head 1 has a recording element substrate 4 bonded to a tank (not shown) for accommodating a liquid such as ink by an adhesive. Further, the electrical junction between the recording element substrate 4 and the electrical wiring board (not shown) bonded via the contact pad 8 is caused by short circuit or corrosion due to contact with ink, disconnection due to external force, and the like. To protect, the electrical joint is covered and protected by a sealant.

熱硬化性の樹脂である封止材は、加熱されることで硬化するが、硬化後に冷却することで収縮する。封止材が収縮する際に封止材の内部には応力が発生し、記録素子基板４を封止材側に引っ張る。このような応力による引っ張る力を記録素子基板４の全体に均等にかけるために、記録素子基板４は、電気接合部のみならず記録素子基板４の周囲を封止材により被覆保護される。 The encapsulant, which is a thermosetting resin, cures when heated, but shrinks when cooled after curing. When the encapsulant shrinks, stress is generated inside the encapsulant, and the recording element substrate 4 is pulled toward the encapsulant. In order to evenly apply the pulling force due to such stress to the entire recording element substrate 4, the recording element substrate 4 is protected by covering not only the electrical junction but also the periphery of the recording element substrate 4 with a sealing material.

しかし、封止材の塗布量調整の制御ミス、あるいは封止材の材料ロットのばらつきによって、ごく稀に記録素子基板４の破損に至る場合がある。これは、引っ張られる力に記録素子基板４の剛性が耐えられないことが一因と考えられる。このような記録素子基板４の破損を防ぐには、記録素子基板４が破損しない程度の引っ張り力となるように封止材の量を調整することが求められる。しかし、封止材の応力による引っ張り力が、実際にどの程度だけ記録素子基板４に作用しているかは分かりづらく、封止材のロット毎のばらつきによって記録素子基板４の変形や破損が生じる虞があった。 However, in rare cases, the recording element substrate 4 may be damaged due to a control error in adjusting the coating amount of the encapsulant or a variation in the material lot of the encapsulant. It is considered that this is partly because the rigidity of the recording element substrate 4 cannot withstand the pulling force. In order to prevent such damage to the recording element substrate 4, it is required to adjust the amount of the sealing material so that the tensile force is such that the recording element substrate 4 is not damaged. However, it is difficult to know how much the tensile force due to the stress of the encapsulant actually acts on the recording element substrate 4, and there is a possibility that the recording element substrate 4 may be deformed or damaged due to variations in the encapsulant for each lot. was there.

そこで、本実施形態では、有機樹脂層９を用いて記録素子基板４の変形を目視で確認することで、記録素子基板４にかかる引っ張り力の程度を確認し、封止材の塗布量調整の手間を簡素化する。以下、この方法について詳細に説明する。 Therefore, in the present embodiment, by visually confirming the deformation of the recording element substrate 4 using the organic resin layer 9, the degree of the tensile force applied to the recording element substrate 4 is confirmed, and the coating amount of the sealing material is adjusted. Simplify the effort. Hereinafter, this method will be described in detail.

図２に示すように、本実施形態の有機樹脂層９は、記録素子基板４における１つの吐出口列と対応して、２列の連通口１０の列を備えており、記録素子基板４には２列の吐出口列があることから、有機樹脂層９は、４列の連通口１０の列を備えている。各吐出口列に対応する２列の連通口１０の列は同様であるため、以下では一方の吐出口列に対応する２列の連通口１０の列について説明する。 As shown in FIG. 2, the organic resin layer 9 of the present embodiment includes two rows of communication ports 10 corresponding to one discharge port row in the recording element substrate 4, and is provided on the recording element substrate 4. Since there are two rows of discharge ports, the organic resin layer 9 includes four rows of communication ports 10. Since the rows of the two rows of communication ports 10 corresponding to each discharge port row are the same, the rows of the two rows of communication ports 10 corresponding to one discharge port row will be described below.

ここで、２列の連通口１０の列のうち吐出口列に近い側の列の連通口１０を第一連通口１３、吐出口列から遠い側の列の連通口１０を第二連通口１４とする。第一連通口１３および第二連通口１４のそれぞれは、吐出口列が延在する方向（矢印ｘ方向）に延びる直線状に配置されており、第一連通口１３の列および第二連通口１４の列が隣接して設けられている。第一連通口１３および第二連通口１４は、形状が正方形であり、第一連通口１３の列におけるピッチ（第一ピッチ）と、第二連通口１４の列におけるピッチ（第二ピッチ）とが同一ピッチで設けられている。また、第一連通口１３および第二連通口１４の矢印ｘ方向における位置は、互いに半ピッチ分ずれて設けられている。つまり、第一連通口１３の列と第二連通口１４の列とでは、第一連通口１３と第二連通口１４とが千鳥状に配置されている。また、第一連通口１３の列と第二連通口１４の列との間は、有機樹脂層９が直線状（略直線）となった直線部２０が構成されている。直線部２０は、吐出口列の配列方向に延在しており、直線部２０の幅は、２μｍ以上、８μｍ未満が好ましい。また、第一連通口１３および第二連通口１４における一辺の長さは、３０μｍ以上、５０μｍ未満が好ましい。なお、直線部２０は、吐出口列の配列方向に、少なくとも、複数の第一連通口１３または複数の第二連通口１４に亘って延在していればよい。 Here, of the two rows of communication ports 10, the communication port 10 in the row closer to the discharge port row is the first series communication port 13, and the communication port 10 in the row farther from the discharge port row is the second communication port. It is set to 14. Each of the first communication port 13 and the second communication port 14 is arranged in a straight line extending in the direction in which the discharge port row extends (arrow x direction), and the row of the first communication port 13 and the second communication port 13 are arranged. Rows of communication ports 14 are provided adjacent to each other. The first communication port 13 and the second communication port 14 have a square shape, and the pitch in the row of the first communication port 13 (first pitch) and the pitch in the row of the second communication port 14 (second pitch). ) Are provided at the same pitch. Further, the positions of the first communication port 13 and the second communication port 14 in the arrow x direction are provided so as to be offset from each other by half a pitch. That is, in the row of the first communication port 13 and the row of the second communication port 14, the first communication port 13 and the second communication port 14 are arranged in a staggered manner. Further, between the row of the first series of passages 13 and the row of the second series of passages 14, a straight line portion 20 in which the organic resin layer 9 is a straight line (substantially straight line) is formed. The straight portion 20 extends in the arrangement direction of the discharge port row, and the width of the straight portion 20 is preferably 2 μm or more and less than 8 μm. Further, the length of one side of the first communication port 13 and the second communication port 14 is preferably 30 μm or more and less than 50 μm. The straight portion 20 may extend in the arrangement direction of the discharge port row at least over a plurality of first series passages 13 or a plurality of second communication ports 14.

以下、記録素子基板４と有機樹脂層９との変形について説明する。 Hereinafter, the deformation of the recording element substrate 4 and the organic resin layer 9 will be described.

封止材の硬化によって記録素子基板４に生じる引っ張り力によって記録素子基板４は変形する。記録素子基板４の変形に伴って、記録素子基板４上に設けられた有機樹脂層９も記録素子基板４と同時に変形する。有機樹脂層９の変形では、貫通孔である連通口が設けられている部分が最も変形しやすく変形量も多くなる。 The recording element substrate 4 is deformed by the tensile force generated in the recording element substrate 4 due to the curing of the sealing material. Along with the deformation of the recording element substrate 4, the organic resin layer 9 provided on the recording element substrate 4 is also deformed at the same time as the recording element substrate 4. In the deformation of the organic resin layer 9, the portion provided with the communication port, which is a through hole, is most easily deformed and the amount of deformation is large.

図３は、記録素子基板４の変形と共に変形する有機樹脂層９を示した図である。図３のように有機樹脂層９は、変形することで連通口１０の形状が変わる。本実施形態では、有機樹脂層９の変形前に四角形だった連通口１０の形状は、有機樹脂層９の変形後に五角形に変わっている。つまり、直線状に設けられた第一連通口１３の列（第一連通口列）と第二連通口１４の列（第二連通口列）との間の有機樹脂層９の直線部２０が、有機樹脂層９の変形によって直線状からジグザグ状に変わることで、連通口１０の形状が四角形から五角形に変わる。なお、変形前の連通口１０の形状は、四角形に限定するものではなく、変形後の連通口１０の形状も五角形に限定するものではない。つまり、連通口１０の形状は、直線状に設けられた第一連通口１３の列と第二連通口１４の列との間の有機樹脂層９の直線部２０が直線状から変形（本実施形態ではジグザグ状に変形）するのを認識できる多角形形状であればよい。その際、連通口１０が直線部２０に対して、辺で接するように連通口１０を設けることで、直線部２０の変形がより分かり易くなる。 FIG. 3 is a diagram showing an organic resin layer 9 that deforms with the deformation of the recording element substrate 4. As shown in FIG. 3, the shape of the communication port 10 changes when the organic resin layer 9 is deformed. In the present embodiment, the shape of the communication port 10 which was quadrangular before the deformation of the organic resin layer 9 is changed to a pentagon after the deformation of the organic resin layer 9. That is, the linear portion of the organic resin layer 9 between the row of the first series of passages 13 (first series of passages) and the row of the second series of passages 14 (second series of passages) provided in a straight line. 20 changes from a linear shape to a zigzag shape due to the deformation of the organic resin layer 9, so that the shape of the communication port 10 changes from a quadrangle to a pentagon. The shape of the communication port 10 before deformation is not limited to a quadrangle, and the shape of the communication port 10 after deformation is not limited to a pentagon. That is, in the shape of the communication port 10, the straight portion 20 of the organic resin layer 9 between the row of the first series of passages 13 and the row of the second communication ports 14 provided in a straight line is deformed from the straight line (this). In the embodiment, it may be a polygonal shape that can be recognized to be deformed in a zigzag shape. At that time, by providing the communication port 10 so that the communication port 10 is in contact with the straight line portion 20 at the side, the deformation of the straight line portion 20 becomes easier to understand.

また、本実施形態のように、第一連通口１３の列と第二連通口１４の列との間の有機樹脂層９の直線部２０に対して、隣接する第一連通口１３（又は隣接する第二連通口１４）同士の間の有機樹脂層９が、直交することが好ましい（図２参照）。直線部２０に対して、隣接する第一連通口１３（又は隣接する第二連通口１４）同士の間の有機樹脂層９が直交することで、直線部２０の変形がより分かり易くなる。更には、本実施形態のように、矢印ｘ方向と交差する矢印ｙ方向において、第一連通口１３と第二連通口１４とが部分的にオーバーラップするように配置されていることが好ましい。矢印ｙ方向において、第一連通口１３と第二連通口１４とが部分的にオーバーラップして配置されていると、第一連通口１３の列と第二連通口１４の列との間の有機樹脂層９の変形がより分かり易くなる。 Further, as in the present embodiment, the first series of passages 13 (which are adjacent to the straight portion 20 of the organic resin layer 9 between the row of the first series of passages 13 and the row of the second communication openings 14). Alternatively, it is preferable that the organic resin layers 9 between the adjacent second communication ports 14) are orthogonal to each other (see FIG. 2). Since the organic resin layer 9 between the adjacent first series passages 13 (or the adjacent second communication openings 14) is orthogonal to the straight portion 20, the deformation of the straight portion 20 becomes easier to understand. Further, as in the present embodiment, it is preferable that the first communication port 13 and the second communication port 14 are arranged so as to partially overlap in the arrow y direction intersecting the arrow x direction. .. When the first communication port 13 and the second communication port 14 are arranged so as to partially overlap each other in the direction of the arrow y, the row of the first communication port 13 and the row of the second communication port 14 are arranged. The deformation of the organic resin layer 9 between them becomes easier to understand.

このように、本実施形態では、記録素子基板４と共に有機樹脂層９が変形することによって直線部２０が変形することで、記録素子基板４が破損に至る前兆を目視で確認することができる。直線部２０の変形を目視で判断することで記録素子基板４の変形を認知することができるため、計測器等を用いることなく記録素子基板４の変形を認知することができる。ノズルプレート２は半透明の樹脂であり、光を透過するため、ユーザは、ノズルプレート２を介して有機樹脂層９における直線部２０の変形を目視で確認することができる。 As described above, in the present embodiment, the linear portion 20 is deformed by the deformation of the organic resin layer 9 together with the recording element substrate 4, so that the sign that the recording element substrate 4 is damaged can be visually confirmed. Since the deformation of the recording element substrate 4 can be recognized by visually determining the deformation of the linear portion 20, the deformation of the recording element substrate 4 can be recognized without using a measuring instrument or the like. Since the nozzle plate 2 is a translucent resin and transmits light, the user can visually confirm the deformation of the linear portion 20 in the organic resin layer 9 via the nozzle plate 2.

ユーザは、直線部２０が変形したのを確認した場合には、封止材の塗布量が多く、記録素子基板４に強い引っ張り力が生じており破損の虞があると判断することができる。そこで、次の液体吐出ヘッド１の製造において、記録素子基板４の周囲を被覆保護する封止材の塗布量を減らすことで、記録素子基板４の破損や変形を抑制することができる。このように、直線部２０の形状を目視で確認することで、封止材の塗布量の増減の判断が可能となり、塗布量の調整を容易に行うことができる。 When the user confirms that the straight line portion 20 is deformed, it can be determined that the amount of the sealing material applied is large and a strong tensile force is generated on the recording element substrate 4, so that there is a risk of damage. Therefore, in the next production of the liquid discharge head 1, damage or deformation of the recording element substrate 4 can be suppressed by reducing the amount of the sealing material applied to cover and protect the periphery of the recording element substrate 4. In this way, by visually confirming the shape of the straight portion 20, it is possible to determine whether or not the coating amount of the encapsulant is increased or decreased, and it is possible to easily adjust the coating amount.

なお、直線部２０の変形を、目視ではなく画像認識等の装置で検出して変形の有無を判定してもよい。 The deformation of the straight line portion 20 may be detected by a device such as image recognition instead of visually, and the presence or absence of the deformation may be determined.

また、このようなフィルタの機能を有する有機樹脂層９は、有機樹脂層９のパターニングの際に、フィルタとして機能するようにパターニングすることで形成することができる。そのため、フィルタを形成する工程として新たに工程を追加することなくゴミ捕集フィルタを容易に形成することができる。 Further, the organic resin layer 9 having such a filter function can be formed by patterning the organic resin layer 9 so as to function as a filter when the organic resin layer 9 is patterned. Therefore, the dust collection filter can be easily formed without adding a new step as the step of forming the filter.

図４は、本実施形態における液体吐出ヘッド１の製造方法を工程順に示した図である。以下、図面を参照して液体吐出ヘッド１の製造方法を説明する。 FIG. 4 is a diagram showing the manufacturing method of the liquid discharge head 1 in the present embodiment in the order of processes. Hereinafter, a method of manufacturing the liquid discharge head 1 will be described with reference to the drawings.

図４（ａ）に示すようにＳｉ結晶方位が〈１００〉面のＳｉ基板４０（記録素子基板４）上に、蓄熱層（不図示）として熱酸化によりＳｉＯ₂を０．６μｍの厚さで形成する。その後フォトリソグラフィ法によりレジスト（不図示）をエッチングマスクとし、その後、ＣＦ₄を用いて反応性イオンエッチングを行うことで蓄熱層のパターニングを形成する。続いて、スパッタリング法により、記録素子５としてＴａＳｉＮを厚さ０．０１μｍで成膜する。次に電気配線層（不図示）としてＡｌを、スパッタリング法により蒸着させ、０．６μｍの厚さで成膜する。フォトレジスト法によりレジストをエッチングマスクとし、ＢＣｌ₃、Ｃｌ₂ガスを混合する。反応性イオンエッチングにより所定の形状にエッチングする。 As shown in FIG. 4A, SiO ₂ has a thickness of 0.6 μm by thermal oxidation as a heat storage layer (not shown) on a Si substrate 40 (recording element substrate 4) having a Si crystal orientation of <100> plane. Form. After that, a resist (not shown) is used as an etching mask by a photolithography method, and then reactive ion etching is performed using CF ₄ to form a patterning of the heat storage layer. Subsequently, a film of TaSiN having a thickness of 0.01 μm is formed as the recording element 5 by a sputtering method. Next, Al is deposited as an electrical wiring layer (not shown) by a sputtering method to form a film having a thickness of 0.6 μm. Using the photoresist as an etching mask by the photoresist method, BCl ₃ and Cl ₂ gases are mixed. Etching to a predetermined shape by reactive ion etching.

その後、Ｏ₂プラズマアッシングおよび剥離液によりレジストを除去する。再びフォトリソグラフィ法によりエッチングマスクを形成し、記録素子５上のＡｌをウェットエッチングにより除去し、再びＯ₂プラズマアッシングおよび剥離液によりレジストを除去し、記録素子５および電気配線層（不図示）を形成する。次に、電気絶縁層としてＳｉＮ膜をＣＶＤ法によって０．３μｍの厚さで成膜し、耐キャビテーション層（不図示）としてＴａをスパッタリング法にて０．２μｍの厚さで成膜する。 Then, the resist is removed by O ₂ plasma ashing and a stripping solution. The etching mask is formed again by the photolithography method, Al on the recording element 5 is removed by wet etching, the resist is removed again by O ₂ plasma ashing and a stripping solution, and the recording element 5 and the electrical wiring layer (not shown) are removed. Form. Next, a SiN film is formed as an electrically insulating layer with a thickness of 0.3 μm by a CVD method, and Ta is formed as a cavitation resistant layer (not shown) with a thickness of 0.2 μm by a sputtering method.

続いてフォトリソグラフィ法によりエッチングマスクを形成し、ＣＦ₄を用いた反応性イオンエッチングによって所定の形状にエッチングし、Ｏ₂プラズマアッシングおよび剥離液によりレジストを除去し、電気絶縁層（不図示）を形成する。さらにフォトリソグラフィ法によりエッチングマスクを形成し、ＣＦ₄を用いた反応性イオンエッチングによって所定の形状にエッチングし、Ｏ₂プラズマアッシングおよび剥離液によりレジストを除去し、耐キャビテーション層（不図示）を形成する。この際、インク供給口６の開口部となる耐キャビテーション層は除去されるよう形成する。 Subsequently, an etching mask is formed by a photolithography method, etched into a predetermined shape by reactive ion etching using CF ₄ , resist is removed by O ₂ plasma ashing and a stripping solution, and an electrically insulating layer (not shown) is provided. Form. Furthermore, an etching mask is formed by a photolithography method, etched into a predetermined shape by reactive ion etching using CF ₄ , and resist is removed by O ₂ plasma ashing and a stripping solution to form a cavitation resistant layer (not shown). do. At this time, the cavitation-resistant layer, which is the opening of the ink supply port 6, is formed so as to be removed.

続いて図４（ｂ）に示すように、有機樹脂層９としてポリエーテルアミド樹脂であるＨＬ－１２００ＣＨ（日立化成株式会社製）をスピンコート法にて２．０μｍの厚さで塗布する。さらにフォトリソグラフィ法によりレジスト（不図示）をエッチングマスクとし、その後、ＣＦ₄を用いて反応性イオンエッチングを行うことで有機樹脂層９を形成する。この際、のちに形成するインク供給口６上の位置において有機樹脂層９をパターニングし、本実施形態では、一辺の長さが３５μｍの正方形となるように連通口１０を形成する。 Subsequently, as shown in FIG. 4 (b), HL-1200CH (manufactured by Hitachi Kasei Co., Ltd.), which is a polyether amide resin, is applied as the organic resin layer 9 to a thickness of 2.0 μm by a spin coating method. Further, a resist (not shown) is used as an etching mask by a photolithography method, and then reactive ion etching is performed using CF ₄ to form an organic resin layer 9. At this time, the organic resin layer 9 is patterned at a position on the ink supply port 6 to be formed later, and in the present embodiment, the communication port 10 is formed so as to be a square having a side length of 35 μm.

また、本実施形態では、第一連通口１３と第二連通口１４との間の有機樹脂層９（直線部２０）は、５μｍ幅で長手方向に直線的に延在するように形成する。さらに隣り合う第一連通口１３と第二連通口１４とは、半分のピッチでずれた千鳥配置にて形成する。 Further, in the present embodiment, the organic resin layer 9 (straight line portion 20) between the first communication port 13 and the second communication port 14 is formed so as to extend linearly in the longitudinal direction with a width of 5 μm. .. Further, the adjacent first communication port 13 and the second communication port 14 are formed in a staggered arrangement shifted by half the pitch.

続いて図４（ｃ）では、基板上にポジ型感光性樹脂層１１としてＯＤＵＲ１０１０Ａ（東京応化工業製）を用いスピンコート法にて１５μｍの厚さで塗布し、フォトリソグラフィ工程により、パターニングを行いインク流路７のパターンとなる部分を形成する。次にポジ型感光性樹脂層１１のパターンが形成された上層にノズルプレート２の部材となるネガ型感光性樹脂層をスピンコート法にて１０μｍの厚さで成膜し、パターニングすることで吐出口３のパターンを形成する。ネガ型感光性樹脂層としてはＥＨＰＥ-３１５０（ダイセル化学工業製）のエポキシ樹脂に感光材を加えたものを使用する。 Subsequently, in FIG. 4 (c), ODUR1010A (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was used as the positive photosensitive resin layer 11 on the substrate and applied to a thickness of 15 μm by a spin coating method, and patterning was performed by a photolithography process. A portion that becomes a pattern of the ink flow path 7 is formed. Next, a negative photosensitive resin layer, which is a member of the nozzle plate 2, is formed into a film with a thickness of 10 μm by a spin coating method on the upper layer on which the pattern of the positive photosensitive resin layer 11 is formed, and the film is discharged by patterning. Form the pattern of outlet 3. As the negative photosensitive resin layer, a layer obtained by adding a photosensitive material to an epoxy resin of EHPE-3150 (manufactured by Daicel Chemical Industries, Ltd.) is used.

次に、図４（ｄ）に示すように、記録素子基板４を８３℃のＴＭＡＨ水溶液（濃度２２％）中に所定の時間浸漬して異方性エッチングを施し、インク供給口６を形成する。なお異方性エッチングの際、記録素子基板４の表面側にＴＭＡＨ水溶液が回り込まないように、樹脂レジスト１２により記録素子基板４の表面側を保護する。記録素子基板４の裏面側より、バッファードフッ酸によりウェットエッチングを行い、蓄熱層を除去することでインク供給口６を開口する。 Next, as shown in FIG. 4D, the recording element substrate 4 is immersed in a TMAH aqueous solution (concentration 22%) at 83 ° C. for a predetermined time to perform anisotropic etching to form an ink supply port 6. .. At the time of anisotropic etching, the surface side of the recording element substrate 4 is protected by the resin resist 12 so that the TMAH aqueous solution does not wrap around the surface side of the recording element substrate 4. Wet etching is performed from the back surface side of the recording element substrate 4 with buffered hydrofluoric acid to remove the heat storage layer, thereby opening the ink supply port 6.

その後、図４（ｅ）に示すように記録素子基板４の表面を保護していた樹脂レジスト１２、インク流路７のパターンを形成していたポジ型感光性樹脂層１１、を除去することでノズルプレート２にインク流路７が形成される。 After that, as shown in FIG. 4 (e), the resin resist 12 that protected the surface of the recording element substrate 4 and the positive photosensitive resin layer 11 that formed the pattern of the ink flow path 7 were removed. The ink flow path 7 is formed in the nozzle plate 2.

このようにして形成された記録素子基板４は、ダイシングによりチップ単位に切り出された後、インク供給のためのタンク（不図示）に接続される。さらにコンタクトパッド８を介して記録素子基板４と電気配線基板とが電気的に接合され、記録素子基板４の周囲に封止材を付与し被覆保護した。本実施形態では、上記の方法での塗布量検討の結果、４０ｍｇの封止材を用いて記録素子基板４の周囲の被覆保護を行った。 The recording element substrate 4 thus formed is cut out in chip units by dicing and then connected to a tank (not shown) for ink supply. Further, the recording element substrate 4 and the electric wiring board are electrically bonded via the contact pad 8, and a sealing material is applied around the recording element substrate 4 to protect the coating. In the present embodiment, as a result of examining the coating amount by the above method, the coating around the recording element substrate 4 was protected by using a sealing material of 40 mg.

その後、加熱により封止材を硬化させたのち、インク供給口６上部の連通口１０および直線部２０を確認したところ、直線部２０が変形するほど延伸していなかった。 Then, after the sealing material was cured by heating, the communication port 10 and the straight portion 20 at the upper part of the ink supply port 6 were confirmed, and the straight portion 20 was not stretched to the extent that it was deformed.

このように作製した液体吐出ヘッドにて熱衝撃試験を実施した。試験条件は、０℃→１００℃→０℃の温度変化を１サイクル（１時間）として２００サイクルを繰り返す、現実起こり得る環境変化の想定よりも過酷なものとした。試験後、液体吐出ヘッドの電気特性を測定するとともに、記録媒体に印刷し画像評価を行ったが、何れも異常は見受けられなかった。また、液体吐出ヘッドの外観を、金属顕微鏡を使用して観察したが、記録素子基板の破損等は確認されなかった。 A thermal shock test was carried out with the liquid discharge head thus produced. The test conditions were harsher than the assumption of an environmental change that could actually occur, in which a temperature change of 0 ° C. → 100 ° C. → 0 ° C. was set as one cycle (1 hour) and 200 cycles were repeated. After the test, the electrical characteristics of the liquid discharge head were measured and printed on a recording medium for image evaluation, but no abnormalities were found in any of them. The appearance of the liquid discharge head was observed using a metallurgical microscope, but no damage to the recording element substrate was confirmed.

図５は、比較例として連通口が千鳥配置されていない有機樹脂層５０を示した図である。図５（ａ）は、変形前の有機樹脂層５０であり、図５（ｂ）は、変形後の有機樹脂層５０である。変形前に正方形の形状であった連通口５１は、記録素子基板４の変形と共に変形し、変形後には、長方形に変わっている。しかし、正方形から長方形への形状の変化は、正方形の一部の辺が伸びているか否かで判断することから、目視での見極めが困難である。 FIG. 5 is a diagram showing the organic resin layer 50 in which the communication ports are not staggered as a comparative example. FIG. 5A is the organic resin layer 50 before deformation, and FIG. 5B is the organic resin layer 50 after deformation. The communication port 51, which had a square shape before the deformation, is deformed with the deformation of the recording element substrate 4, and after the deformation, it is changed to a rectangular shape. However, it is difficult to visually determine the change in shape from a square to a rectangle because it is judged by whether or not a part of the sides of the square is extended.

また、第一連通口の列５２と第二連通口の列５３との間の有機樹脂層５０は、変形前も変形後も直線状を維持している。そのため、有機樹脂層５０の変形を第一連通口の列５２と第二連通口の列５３との間の有機樹脂層５０から判断するのは困難である。 Further, the organic resin layer 50 between the row 52 of the first communication port and the row 53 of the second communication port maintains a linear shape before and after the deformation. Therefore, it is difficult to determine the deformation of the organic resin layer 50 from the organic resin layer 50 between the row 52 of the first communication port and the row 53 of the second communication port.

上記のように、連通口５１が千鳥配置されていない有機樹脂層５０の場合、変形を目視で判断するのは困難である。これに対し、本実施形態のように、連通口１０が千鳥配置された有機樹脂層９の場合、第一連通口１３の列と第二連通口１４の列との間の有機樹脂層９の直線部２０を目視することで、変形の有無を容易に判断することができる。更に、有機樹脂層９をフィルタとして用いることから、フィルタの形成を容易に行うことができる。 As described above, in the case of the organic resin layer 50 in which the communication ports 51 are not arranged in a staggered manner, it is difficult to visually judge the deformation. On the other hand, in the case of the organic resin layer 9 in which the communication ports 10 are staggered as in the present embodiment, the organic resin layer 9 between the row of the first communication port 13 and the row of the second communication port 14 By visually observing the straight portion 20 of the above, it is possible to easily determine the presence or absence of deformation. Further, since the organic resin layer 9 is used as a filter, the filter can be easily formed.

このように、有機樹脂層９において、連通口１０を千鳥配置とし、第一連通口１３の列と第二連通口１４の列との間の有機樹脂層９に直線部２０を設ける。これによって、基板の変形や破損を抑制し、且つ工程を複雑化することなくゴミ捕集フィルタの形成が可能な液体吐出ヘッドおよび液体吐出ヘッドの製造方法を実現することができる。 As described above, in the organic resin layer 9, the communication ports 10 are arranged in a staggered manner, and the linear portion 20 is provided in the organic resin layer 9 between the row of the first series of communication ports 13 and the row of the second communication ports 14. This makes it possible to realize a method for manufacturing a liquid discharge head and a liquid discharge head, which can suppress deformation and breakage of the substrate and can form a dust collection filter without complicating the process.

１液体吐出ヘッド
２ノズルプレート
３吐出口
４記録素子基板
６インク供給口
９有機樹脂層
１０連通口
１３第一連通口
１４第二連通口
２０直線部 1 Liquid discharge head 2 Nozzle plate 3 Discharge port 4 Recording element board 6 Ink supply port 9 Organic resin layer 10 Communication port 13 First series communication port 14 Second communication port 20 Straight section

Claims

A discharge port plate having a row of discharge ports in which a plurality of discharge ports for discharging liquid are formed in a row, and a discharge port plate.
A substrate that supports the discharge port plate and has a supply port that communicates with the discharge port.
A resin layer provided between the discharge port plate and the substrate to improve the adhesion between the discharge port plate and the substrate,
A liquid discharge head provided with a sealing material provided around the substrate.
The resin layer is provided so as to cover the supply port, and has a plurality of communication ports for guiding the liquid supplied from the supply port to the discharge port.
The communication port is a first series of outlets composed of a plurality of first series of outlets on the side closer to the discharge port row, and a plurality of second outlets farther from the first series of outlet rows than the first series of outlet rows. It forms a line with the second communication port row consisting of communication ports.
The resin layer between the first series of passages and the second series of passages has at least a plurality of the first series of passages or a plurality of the second communication ports in the arrangement direction of the discharge port rows. Has a straight line portion including a straight line extending over
The liquid discharge head is characterized in that the first communication port and the second communication port are arranged in a staggered manner.

The liquid discharge head according to claim 1, wherein the straight line portion includes a straight line extending over the lengths of the first communication port row and the second communication port row.

The first pitch of the first communication port in the first communication port row and the second pitch of the second communication port in the second communication port row are the same pitch according to claim 1 or 2. Liquid discharge head.

The liquid discharge head according to claim 3, wherein the first communication port and the second communication port are arranged in a staggered manner with a pitch difference between the first pitch and half of the second pitch.

The liquid discharge head according to any one of claims 1 to 4, wherein the first communication port and the second communication port have a polygonal shape.

The liquid discharge head according to claim 5, wherein the first communication port and the second communication port are provided so as to be in contact with the straight line portion at a side.

The liquid discharge head according to claim 5 or 6, wherein the first communication port and the second communication port are square.

The liquid discharge head according to any one of claims 1 to 7, wherein the first communication port and the second communication port partially overlap in a direction intersecting the arrangement direction.

The liquid discharge head according to any one of claims 1 to 8, wherein the resin layer between the first communication port and the second communication port is orthogonal to the straight line portion.

The liquid discharge head according to any one of claims 1 to 9, wherein the discharge port plate is a translucent resin that transmits light.

The liquid discharge head according to any one of claims 1 to 10, wherein the width of the straight line portion is 2 μm or more and less than 8 μm.

The liquid discharge head according to claim 7, wherein the length of one side of the first communication port and the second communication port is 30 μm or more and less than 50 μm.

The process of forming the substrate and
The process of forming a resin layer on the substrate and
A step of forming a discharge port plate on the resin layer and
A step of forming a discharge port row in which a plurality of discharge ports are formed on the discharge port plate, and
A step of forming a supply port penetrating the substrate on the substrate, and
A method for manufacturing a liquid discharge head, comprising a step of applying a sealing material around the substrate on which the supply port is formed.
The resin layer is formed so as to cover the supply port.
A plurality of communication ports for guiding the liquid supplied from the supply port to the resin layer to the discharge port, and a first series of communication ports composed of a plurality of first series of ports on the side close to the discharge port row. And a second communication port row composed of a plurality of second communication ports farther from the discharge port row than the first series communication port row.
In the resin layer between the first series of passages and the second series of outlets, at least a plurality of the first series of passages or a plurality of the second communication ports in the arrangement direction of the discharge port rows. Forming a straight line including a straight line extending over
The first series of passages and the second communication opening are formed in a staggered arrangement.
A method for manufacturing a liquid discharge head, which comprises checking the straight portion and adjusting the coating amount of the sealing material.