JP2021059668A - Primer composition for silicone adhesive - Google Patents
Primer composition for silicone adhesive Download PDFInfo
- Publication number
- JP2021059668A JP2021059668A JP2019184908A JP2019184908A JP2021059668A JP 2021059668 A JP2021059668 A JP 2021059668A JP 2019184908 A JP2019184908 A JP 2019184908A JP 2019184908 A JP2019184908 A JP 2019184908A JP 2021059668 A JP2021059668 A JP 2021059668A
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- JP
- Japan
- Prior art keywords
- group
- mass
- component
- sensitive adhesive
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 title claims abstract description 86
- 239000013464 silicone adhesive Substances 0.000 title claims abstract description 17
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 77
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 32
- 125000000962 organic group Chemical group 0.000 claims abstract description 15
- 150000003377 silicon compounds Chemical class 0.000 claims abstract description 15
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 12
- 239000011968 lewis acid catalyst Substances 0.000 claims abstract description 6
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 6
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 71
- 239000000463 material Substances 0.000 claims description 37
- 125000004432 carbon atom Chemical group C* 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000000853 adhesive Substances 0.000 claims description 24
- 239000003054 catalyst Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 abstract description 9
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 41
- 239000002585 base Substances 0.000 description 31
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 27
- -1 but among these Substances 0.000 description 22
- 150000002430 hydrocarbons Chemical group 0.000 description 19
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 18
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 14
- 238000001723 curing Methods 0.000 description 12
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 12
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000000123 paper Substances 0.000 description 10
- 125000003118 aryl group Chemical group 0.000 description 9
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 239000007795 chemical reaction product Substances 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 239000002985 plastic film Substances 0.000 description 6
- 229920006255 plastic film Polymers 0.000 description 6
- 229910052697 platinum Inorganic materials 0.000 description 6
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 5
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 238000007259 addition reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 125000000753 cycloalkyl group Chemical group 0.000 description 4
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 4
- 125000005843 halogen group Chemical group 0.000 description 4
- 125000006038 hexenyl group Chemical group 0.000 description 4
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 4
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 4
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 150000003606 tin compounds Chemical class 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- GETTZEONDQJALK-UHFFFAOYSA-N (trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=CC=C1 GETTZEONDQJALK-UHFFFAOYSA-N 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical group COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- CQQXCSFSYHAZOO-UHFFFAOYSA-L [acetyloxy(dioctyl)stannyl] acetate Chemical compound CCCCCCCC[Sn](OC(C)=O)(OC(C)=O)CCCCCCCC CQQXCSFSYHAZOO-UHFFFAOYSA-L 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- XNLICIUVMPYHGG-UHFFFAOYSA-N pentan-2-one Chemical compound CCCC(C)=O XNLICIUVMPYHGG-UHFFFAOYSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000003609 titanium compounds Chemical class 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 239000000341 volatile oil Substances 0.000 description 2
- KJDMMCYMVUTZSN-UHFFFAOYSA-N (1-ethynylcyclohexyl)oxy-trimethylsilane Chemical compound C[Si](C)(C)OC1(C#C)CCCCC1 KJDMMCYMVUTZSN-UHFFFAOYSA-N 0.000 description 1
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 description 1
- XXZOEDQFGXTEAD-UHFFFAOYSA-N 1,2-bis(trifluoromethyl)benzene Chemical group FC(F)(F)C1=CC=CC=C1C(F)(F)F XXZOEDQFGXTEAD-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- FNUBKINEQIEODM-UHFFFAOYSA-N 3,3,4,4,5,5,5-heptafluoropentanal Chemical compound FC(F)(F)C(F)(F)C(F)(F)CC=O FNUBKINEQIEODM-UHFFFAOYSA-N 0.000 description 1
- DEVXQDKRGJCZMV-UHFFFAOYSA-K Aluminum acetoacetate Chemical compound [Al+3].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O.CC(=O)CC([O-])=O DEVXQDKRGJCZMV-UHFFFAOYSA-K 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- XMSXQFUHVRWGNA-UHFFFAOYSA-N Decamethylcyclopentasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 XMSXQFUHVRWGNA-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- RGMZNZABJYWAEC-UHFFFAOYSA-N Methyltris(trimethylsiloxy)silane Chemical compound C[Si](C)(C)O[Si](C)(O[Si](C)(C)C)O[Si](C)(C)C RGMZNZABJYWAEC-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000013006 addition curing Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000005452 alkenyloxyalkyl group Chemical group 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- NFCHUEIPYPEHNE-UHFFFAOYSA-N bis(2,2-dimethylbut-3-ynoxy)-dimethylsilane Chemical compound C#CC(C)(C)CO[Si](C)(C)OCC(C)(C)C#C NFCHUEIPYPEHNE-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000003842 bromide salts Chemical class 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001785 cerium compounds Chemical class 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 150000001869 cobalt compounds Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- XGZNHFPFJRZBBT-UHFFFAOYSA-N ethanol;titanium Chemical compound [Ti].CCO.CCO.CCO.CCO XGZNHFPFJRZBBT-UHFFFAOYSA-N 0.000 description 1
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 1
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 125000005816 fluoropropyl group Chemical group [H]C([H])(F)C([H])([H])C([H])([H])* 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-N hexanedioic acid Natural products OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 150000002506 iron compounds Chemical class 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 150000002604 lanthanum compounds Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 1
- JPQBRSQJGWOTGC-UHFFFAOYSA-N methyl(silyloxysilyloxy)silane Chemical compound C[SiH2]O[SiH2]O[SiH3] JPQBRSQJGWOTGC-UHFFFAOYSA-N 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 230000004899 motility Effects 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 description 1
- IALUUOKJPBOFJL-UHFFFAOYSA-N potassium oxidosilane Chemical compound [K+].[SiH3][O-] IALUUOKJPBOFJL-UHFFFAOYSA-N 0.000 description 1
- CUQOHAYJWVTKDE-UHFFFAOYSA-N potassium;butan-1-olate Chemical compound [K+].CCCC[O-] CUQOHAYJWVTKDE-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003326 scandium compounds Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000001273 sulfonato group Chemical class [O-]S(*)(=O)=O 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- VNRWTCZXQWOWIG-UHFFFAOYSA-N tetrakis(trimethylsilyl) silicate Chemical compound C[Si](C)(C)O[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)C VNRWTCZXQWOWIG-UHFFFAOYSA-N 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000002827 triflate group Chemical class FC(S(=O)(=O)O*)(F)F 0.000 description 1
- JNRUXZIXAXHXTN-UHFFFAOYSA-N trimethyl(2-methylbut-3-yn-2-yloxy)silane Chemical compound C#CC(C)(C)O[Si](C)(C)C JNRUXZIXAXHXTN-UHFFFAOYSA-N 0.000 description 1
- NWMVPLQDJXJDEW-UHFFFAOYSA-N trimethyl(3-methylpent-1-yn-3-yloxy)silane Chemical compound CCC(C)(C#C)O[Si](C)(C)C NWMVPLQDJXJDEW-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 150000003682 vanadium compounds Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/003—Presence of polysiloxane in the primer coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paints Or Removers (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本発明は、シリコーン粘着剤用のプライマー組成物に関する。 The present invention relates to a primer composition for a silicone pressure-sensitive adhesive.
粘着ラベルや粘着テープは、基材に粘着剤を塗工させた後に硬化させて使用するものであり、産業上の様々な場面で使用されている。基材としては、紙やプラスチックフィルムなどが用いられており、紙基材の粘着ラベルなどは、店頭の商品の識別などには必要不可欠であり、日常生活のあらゆる場面で見ることができる。 Adhesive labels and adhesive tapes are used by applying an adhesive to a base material and then curing the adhesive, and are used in various industrial situations. Paper, plastic film, and the like are used as the base material, and adhesive labels and the like on the paper base material are indispensable for identifying products in stores and can be seen in every scene of daily life.
一方、プラスチックフィルムを基材として用いるものとしては、セロハンテープなどの汎用的なものも存在するが、高耐熱フィルムを基材とする耐熱性テープなど、より条件の厳しい環境で使用される高機能なテープ類なども例として挙げられる。 On the other hand, there are general-purpose tapes such as cellophane tape that use a plastic film as a base material, but high-performance tapes that use a highly heat-resistant film as a base material and are used in more severe environments. Tapes are also given as an example.
粘着剤の素材についてみると、ゴム系、アクリル系、シリコーン系などがあるが、これらの中ではシリコーン系のものが最も耐久性が優れていると考えられている。具体的には、耐熱性、耐寒性、耐候性、耐薬品性及び電気絶縁性などが良好であり、これらの特性が必要なケースではシリコーン粘着剤を用いる。他の有機系粘着剤と比較すると高価であるが、それらの性能では対応できない産業用の高機能粘着製品の材料として使用される。 Looking at the adhesive materials, there are rubber-based, acrylic-based, and silicone-based materials, but among these, silicone-based materials are considered to have the best durability. Specifically, heat resistance, cold resistance, weather resistance, chemical resistance, electrical insulation, and the like are good, and a silicone adhesive is used in cases where these characteristics are required. Although it is expensive compared to other organic adhesives, it is used as a material for industrial high-performance adhesive products that cannot be handled by their performance.
また、シリコーンは、その素材の構造上、表面への濡れ性に非常に優れており、貼り付けた際に気泡を巻き込みにくいという特長も有する。この特長を活かし、最近では携帯電話などのディスプレイを保護する粘着フィルム用の粘着剤として使用されている。また、タッチパネル構造のスマートフォンやタブレット端末などは、指が直接画面に接触することで汚れやすいということがあるため、防汚性コーティングされたフィルムを画面に貼り付けることが普及しており、使用量は増加している。 In addition, due to the structure of the material, silicone is extremely excellent in wettability to the surface, and has a feature that it is difficult for air bubbles to get caught when it is attached. Taking advantage of this feature, it has recently been used as an adhesive for adhesive films that protect displays such as mobile phones. In addition, since smartphones and tablet terminals with a touch panel structure are liable to get dirty when a finger comes into direct contact with the screen, it is widely used to attach an antifouling coated film to the screen. Is increasing.
このような理由から、シリコーン粘着剤は、プラスチックフィルムを基材として使用されることが多い。しかし、プラスチックフィルムは紙基材と比較して、塗工する樹脂との密着性が悪いことが指摘されている。密着性が悪いと、ロールで巻き取った際に裏移りしたり、被着体に貼り付けて時間が経過してから剥がす際に被着体に粘着層が移行してしまうなどの問題が発生することがある。 For this reason, silicone adhesives are often used using a plastic film as a base material. However, it has been pointed out that the plastic film has poorer adhesion to the resin to be coated than the paper base material. Poor adhesion causes problems such as set-off when wound with a roll, and the adhesive layer is transferred to the adherend when it is attached to the adherend and then peeled off after a lapse of time. I have something to do.
以前より、この密着性の改善のために様々な対策がとられており、接着性の良い基材を使用する、基材をコロナ処理するなどの方法がある。また、プライマー処理も広く行われている方法であり、シリコーン粘着剤用のプライマー組成物についても開発が進められている。 Various measures have been taken to improve this adhesiveness from before, and there are methods such as using a base material having good adhesiveness and corona-treating the base material. In addition, primer treatment is also a widely used method, and a primer composition for a silicone pressure-sensitive adhesive is also being developed.
プライマー組成物については、シリコーンをベースとし、加熱により硬化膜を形成するタイプの材料が以前から提案されており、シラノール基を有するベース材料を用いた縮合型のタイプや、アルケニル基を有するベースとヒドロシリル基含有シロキサンとのヒドロシリル化で硬化させるタイプが提案されている(特許文献１〜４)。 As for the primer composition, a material based on silicone and forming a cured film by heating has been proposed for a long time, and a condensed type using a base material having a silanol group or a base having an alkenyl group has been proposed. A type that cures by hydrosilylation with a hydrosilyl group-containing siloxane has been proposed (Patent Documents 1 to 4).
しかし、縮合型のプライマーはシリコーン粘着剤が付加型の場合、一部の組成においてプライマー効果を十分に発揮できないケースがあることが課題のひとつとなっている。一方、付加型のプライマーは硬化性が悪いため、プライマー処理した基材を巻き取ると背面にシリコーンが移行するという問題があり、いずれのタイプにしても改良の余地が多分にある。 However, one of the problems with the condensation type primer is that when the silicone pressure-sensitive adhesive is an addition type, the primer effect may not be sufficiently exhibited in some compositions. On the other hand, since the addition type primer has poor curability, there is a problem that silicone is transferred to the back surface when the primer-treated base material is wound up, and there is much room for improvement in any type.
本発明は、上記問題を解決するためになされたものであり、シリコーン粘着剤と基材との密着性を向上させることができるプライマー組成物を提供することを目的とする。 The present invention has been made to solve the above problems, and an object of the present invention is to provide a primer composition capable of improving the adhesion between a silicone pressure-sensitive adhesive and a substrate.
上記課題を解決するために、本発明では、
（Ａ）下記平均組成式（１）で表されるオルガノポリシロキサンを１００質量部、
（Ｂ）１分子中に少なくとも３個のＳｉ−Ｈ基を有するオルガノハイドロジェンポリシロキサンを１〜２０質量部、
（Ｃ）アルケニル基含有有機基を含むケイ素化合物を５０〜３００質量部、及び
（Ｄ）ルイス酸触媒を０．１〜１０質量部
を含むものであることを特徴とするシリコーン粘着剤用プライマー組成物を提供する。
In order to solve the above problems, in the present invention,
(A) 100 parts by mass of an organopolysiloxane represented by the following average composition formula (1).
(B) 1 to 20 parts by mass of an organohydrogenpolysiloxane having at least 3 Si—H groups in one molecule.
A primer composition for a silicone pressure-sensitive adhesive, which comprises (C) 50 to 300 parts by mass of a silicon compound containing an alkenyl group-containing organic group, and (D) 0.1 to 10 parts by mass of a Lewis acid catalyst. provide.
このような本発明のシリコーン粘着剤用プライマー組成物であれば、シリコーン粘着剤と基材との密着性を向上させることができる。 With such a primer composition for a silicone pressure-sensitive adhesive of the present invention, the adhesion between the silicone pressure-sensitive adhesive and the base material can be improved.
上記シリコーン粘着剤用プライマー組成物は、さらに（Ｅ）有機溶剤を前記（Ａ）成分１００質量部に対し、０〜１０，０００質量部含むものであることができる。 The primer composition for a silicone pressure-sensitive adhesive may further contain (E) an organic solvent in an amount of 0 to 10,000 parts by mass with respect to 100 parts by mass of the component (A).
このようなシリコーン粘着剤用プライマー組成物であれば、作業性を向上させる、あるいは基材へ塗工したときの濡れ性を改善することができる。 With such a primer composition for a silicone pressure-sensitive adhesive, workability can be improved or wettability when applied to a base material can be improved.
また、上記シリコーン粘着剤用プライマー組成物は、前記（Ｃ）成分が下記一般式（２）で表されるケイ素化合物であることが好ましい。
Ｒ２ ｂ−Ｓｉ−（ＯＲ３）４−ｂ （２）
（式中、Ｒ２は独立にアルケニル基含有有機基であり、Ｒ３は独立に炭素数１〜５のアルキル基であり、ｂは１，２又は３である。）
Further, in the primer composition for a silicone pressure-sensitive adhesive, it is preferable that the component (C) is a silicon compound represented by the following general formula (2).
R 2 b- Si- (OR 3 ) 4-b (2)
(In the formula, R 2 is an alkenyl group-containing organic group independently, R 3 is an alkyl group having 1 to 5 carbon atoms independently, and b is 1, 2 or 3).
このようなシリコーン粘着剤用プライマー組成物であれば、シリコーン粘着剤と基材との密着性を更に向上させることができる。 With such a primer composition for a silicone pressure-sensitive adhesive, the adhesion between the silicone pressure-sensitive adhesive and the base material can be further improved.
また、上記シリコーン粘着剤用プライマー組成物は、前記（Ｄ）成分が金属触媒であることができる。 Further, in the primer composition for a silicone pressure-sensitive adhesive, the component (D) can be a metal catalyst.
このような（Ｄ）成分であれば、シリコーン粘着剤用プライマー組成物を良好に硬化させることができる。 With such a component (D), the primer composition for a silicone pressure-sensitive adhesive can be satisfactorily cured.
また、本発明は、上記シリコーン粘着剤用プライマー組成物の硬化物を基材の少なくとも片面に有する物品を提供する。 The present invention also provides an article having a cured product of the above-mentioned primer composition for a silicone pressure-sensitive adhesive on at least one side of a base material.
このような物品であれば、シリコーン粘着剤と基材との密着性が向上したものとなる。 In such an article, the adhesion between the silicone pressure-sensitive adhesive and the base material is improved.
また、本発明は、上記物品の前記硬化物を有する面（プライマー処理面）上にシリコーン粘着剤の硬化物を有する粘着性物品を提供する。 The present invention also provides an adhesive article having a cured product of a silicone adhesive on a surface (primer-treated surface) of the article having the cured product.
このような粘着性物品であれば、シリコーン粘着剤と基材との密着性が向上したものとなる。 With such an adhesive article, the adhesiveness between the silicone adhesive and the base material is improved.
この場合、前記シリコーン粘着剤がヒドロシリル化硬化型粘着剤であることが好ましい。 In this case, it is preferable that the silicone pressure-sensitive adhesive is a hydrosilylation-curable pressure-sensitive adhesive.
このようなシリコーン粘着剤は、シリコーン粘着剤と基材との密着性がより好ましいものとなる。 Such a silicone pressure-sensitive adhesive has more preferable adhesion between the silicone pressure-sensitive adhesive and the base material.
以上のように、本発明のシリコーン粘着剤用プライマー組成物を用いることによって、基材との密着性が良好なシリコーン粘着剤を用いた粘着性物品を提供することが可能となる。 As described above, by using the primer composition for a silicone pressure-sensitive adhesive of the present invention, it is possible to provide an adhesive article using a silicone pressure-sensitive adhesive having good adhesion to a base material.
本発明者は、上記目的を達成するため鋭意検討を重ねた結果、縮合型のプライマー組成物中にアルケニル基を有するケイ素材料を添加することにより、これまでの縮合型のプライマー組成物では困難であった付加型のシリコーン粘着剤の一部組成において、基材密着性を大幅に改善できることを見出し、本発明をなすに至った。 As a result of diligent studies to achieve the above object, the present inventor has made it difficult with the conventional condensation type primer composition by adding a silicon material having an alkenyl group to the condensation type primer composition. It has been found that the adhesion to the substrate can be significantly improved in a part of the composition of the additional type silicone pressure-sensitive adhesive, and the present invention has been made.
即ち、本発明は、（Ａ）下記平均組成式（１）で表されるオルガノポリシロキサンを１００質量部、（Ｂ）１分子中に少なくとも３個のＳｉ−Ｈ基を有するオルガノハイドロジェンポリシロキサンを１〜２０質量部、（Ｃ）アルケニル基含有有機基を含むケイ素化合物を５０〜３００質量部、及び（Ｄ）ルイス酸触媒を０．１〜１０質量部を含むものであることを特徴とするシリコーン粘着剤用プライマー組成物である。
以下、本発明について詳細に説明するが、本発明はこれらに限定されるものではない。 Hereinafter, the present invention will be described in detail, but the present invention is not limited thereto.
［シリコーン粘着剤用プライマー組成物］
本発明のシリコーン粘着剤用プライマー組成物は、（Ａ）特定のオルガノポリシロキサンを１００質量部、（Ｂ）１分子中に少なくとも３個のＳｉ−Ｈ基を有するオルガノハイドロジェンポリシロキサンを１〜２０質量部、（Ｃ）アルケニル基含有有機基を含むケイ素化合物を５０〜３００質量部、及び（Ｄ）ルイス酸触媒を０．１〜１０質量部を含む縮合型プライマー組成物である。上記シリコーン粘着剤用プライマー組成物は、必要に応じて、更に（Ｅ）有機溶剤等の他の成分を含むことができる。
本発明のプライマー組成物は、基材にこれを塗工し、その上にシリコーン粘着剤を塗工することによって基材密着性を向上させるものである。特に、これまでは困難だった付加型のシリコーン粘着剤への密着性の改善を縮合型のプライマーで行うことができる。
以下、本発明の組成物を構成する各成分について説明する。
[Primer composition for silicone adhesive]
The primer composition for a silicone pressure-sensitive adhesive of the present invention contains 1 to 100 parts by mass of (A) a specific organopolysiloxane and (B) an organohydrogenpolysiloxane having at least 3 Si—H groups in one molecule. A condensed primer composition containing 20 parts by mass, (C) 50 to 300 parts by mass of a silicon compound containing an alkenyl group-containing organic group, and (D) 0.1 to 10 parts by mass of a Lewis acid catalyst. The primer composition for a silicone pressure-sensitive adhesive may further contain other components such as (E) an organic solvent, if necessary.
The primer composition of the present invention is intended to improve the adhesion to a base material by applying it to a base material and then applying a silicone pressure-sensitive adhesive on the base material. In particular, it is possible to improve the adhesion to the addition type silicone pressure-sensitive adhesive, which has been difficult until now, with the condensation type primer.
Hereinafter, each component constituting the composition of the present invention will be described.
［（Ａ）成分］
（Ａ）成分は下記平均組成式（１）で表されるオルガノポリシロキサンである。
The component (A) is an organopolysiloxane represented by the following average composition formula (1).
Ｒ１は炭素数１〜１０の脂肪族不飽和結合を有さない１価炭化水素基であり、具体的には例えばメチル基、エチル基、プロピル基、ブチル基等のアルキル基、シクロヘキシル基等のシクロアルキル基、フェニル基等のアリール基などであり、更に、これらの基の炭素原子に結合した水素原子の一部又は全部がハロゲン原子又はその他の基で置換されていてもよい。中でも飽和の脂肪族基あるいは芳香族基が好ましく、特にメチル基、フェニル基が好ましい。 R 1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms and does not have an aliphatic unsaturated bond. Specifically, for example, an alkyl group such as a methyl group, an ethyl group, a propyl group or a butyl group, a cyclohexyl group or the like. A cycloalkyl group, an aryl group such as a phenyl group, or the like, and a part or all of the hydrogen atom bonded to the carbon atom of these groups may be substituted with a halogen atom or another group. Of these, a saturated aliphatic group or aromatic group is preferable, and a methyl group and a phenyl group are particularly preferable.
式（１）中のａについて、１００＜ａ＜１０，０００であり、好ましくは２００＜ａ＜８，０００、より好ましくは５００＜ａ＜６，０００である。ａが１００以下だと、硬化した被膜が固くなりすぎて十分なプライマー効果を発揮できない可能性があり、１０，０００以上だと、分子の運動性低下により反応性が悪くなることで十分に硬化が進行せずにうまく被膜を形成できないことが懸念される。 Regarding a in the formula (1), 100 <a <10,000, preferably 200 <a <8,000, and more preferably 500 <a <6,000. If a is 100 or less, the cured film may become too hard to exert a sufficient primer effect, and if it is 10,000 or more, the reactivity deteriorates due to a decrease in molecular motility, and the film is sufficiently cured. There is a concern that the film cannot be formed well without progressing.
（Ａ）は通常、オクタメチルシクロテトラシロキサンなどの環状低分子シロキサンを、末端シラノール基の形成のために少量の水と触媒を用いて開環重合させて製造するが、重合後は原料である環状低分子シロキサンを含有しているため、これを加熱および減圧下で、反応生成物中に不活性気体を通気させながら、留去したものを用いることが好ましい。 (A) is usually produced by ring-opening polymerization of a cyclic low-molecular-weight siloxane such as octamethylcyclotetrasiloxane using a small amount of water and a catalyst to form a terminal silanol group, but after the polymerization, it is a raw material. Since it contains cyclic low-molecular-weight siloxane, it is preferable to use the one obtained by distilling off the cyclic low-molecular-weight siloxane while aerating the inert gas through the reaction product under heating and reduced pressure.
（Ａ）の具体的な構造を表したものとしては以下に示すようなものなどが挙げられるが、これらに限定されない。なお、下記式中のＭｅ，Ｐｈはそれぞれメチル基、フェニル基を示す。
［（Ｂ）成分］
（Ｂ）成分は１分子中に少なくとも３個のＳｉ−Ｈ基を有するオルガノハイドロジェンポリシロキサンであり、特に限定されないが、例えば以下の平均組成式（３）で示すことができる。
Ｒ４ ｆＨｇＳｉＯ（４−ｆ−ｇ）／２ （３）
（式中、Ｒ４は独立に非置換又は置換の炭素数１〜１０の１価炭化水素基を示し、ｆ＞０、ｇ＞０であり、さらに０＜ｆ＋ｇ≦３である。）
[(B) component]
The component (B) is an organohydrogenpolysiloxane having at least 3 Si—H groups in one molecule, and is not particularly limited, but can be represented by, for example, the following average composition formula (3).
R 4 f H g SiO (4-f−g) / 2 (3)
(In the formula, R 4 independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms, f> 0, g> 0, and 0 <f + g ≦ 3).
Ｒ４の炭素数１〜１０の１価炭化水素基としては、例えば、メチル基、エチル基、プロピル基、ブチル基等のアルキル基、シクロヘキシル基等のシクロアルキル基、ビニル基、アリル基、ヘキセニル基、オクテニル基等のアルケニル基、フェニル基等のアリール基等が挙げられる。さらに、これらの基の炭素原子に結合した水素原子の一部又は全部がハロゲン原子又はその他の基で置換されていてもよく、トリフルオロメチル基、３，３，３−トリフルオロプロピル基等が例示される。中でも、飽和の脂肪族基又は芳香族基が好ましく、メチル基、フェニル基がより好ましい。上記平均組成式（３）中、ｆ＞０、ｇ＞０であり、０＜ｆ＋ｇ≦３である。 The monovalent hydrocarbon group having 1 to 10 carbon atoms R 4, for example, a methyl group, an ethyl group, a propyl group, an alkyl group such as butyl group, cycloalkyl groups such as cyclohexyl group, a vinyl group, an allyl group, hexenyl Examples thereof include an alkenyl group such as a group and an octenyl group, and an aryl group such as a phenyl group. Further, a part or all of the hydrogen atoms bonded to the carbon atoms of these groups may be substituted with halogen atoms or other groups, and trifluoromethyl groups, 3,3,3-trifluoropropyl groups and the like may be substituted. Illustrated. Of these, a saturated aliphatic group or aromatic group is preferable, and a methyl group and a phenyl group are more preferable. In the above average composition formula (3), f> 0, g> 0, and 0 <f + g ≦ 3.
また、（Ｂ）成分としては、下記一般式（４）のものを例示することができるが、これに限定されるものではない。
Ｒ５ ３Ｓｉ−Ｏ−（Ｒ６ ２Ｓｉ−Ｏ）ｈ−（Ｒ７ＨＳｉ−Ｏ）ｉ−ＳｉＲ８ ３ （４）
（式中、Ｒ５，Ｒ８は炭素数１〜１０の１価炭化水素基又は水素原子を示し、Ｒ６，Ｒ７は炭素数１〜１０の１価炭化水素基を示し、ｈは０≦ｈ≦１００であり、ｉは３≦ｉ≦８０である。）
Further, as the component (B), the component of the following general formula (4) can be exemplified, but the component (B) is not limited to this.
R 5 3 Si-O- (R 6 2 Si-O) h- (R 7 HSi-O) i -SiR 8 3 (4)
(In the formula, R 5 and R 8 represent monovalent hydrocarbon groups or hydrogen atoms having 1 to 10 carbon atoms, R 6 and R 7 represent monovalent hydrocarbon groups having 1 to 10 carbon atoms, and h is 0. ≦ h ≦ 100, and i is 3 ≦ i ≦ 80)
Ｒ６，Ｒ７の炭素数１〜１０の１価炭化水素基としては、例えば、メチル基、エチル基、プロピル基、ブチル基等のアルキル基、シクロヘキシル基等のシクロアルキル基、ビニル基、アリル基、ヘキセニル基、オクテニル基等のアルケニル基、フェニル基等のアリール基等が挙げられる。さらに、これらの基の炭素原子に結合した水素原子の一部又は全部がハロゲン原子又はその他の基で置換されていてもよく、置換基としては、トリフルオロメチル基、３，３，３−トリフルオロプロピル基等が挙げられる。Ｒ６，Ｒ７としては、飽和の脂肪族基又は芳香族基が好ましく、メチル基、フェニル基がより好ましい。Ｒ５，Ｒ８は炭素数１〜１０の１価炭化水素基又は水素原子である。Ｒ５，Ｒ８の炭素数１〜１０の１価炭化水素基としては、上記と同様のものが例示される。ｈは０≦ｈ≦１００であり、０≦ｈ≦８０又は０＜ｈ≦８０が好ましく、ｉは３≦ｉ≦８０であり、５≦ｉ≦７０が好ましい。 Examples of the monovalent hydrocarbon group having 1 to 10 carbon atoms of R 6 and R 7 include an alkyl group such as a methyl group, an ethyl group, a propyl group and a butyl group, a cycloalkyl group such as a cyclohexyl group, a vinyl group and an allyl. Examples thereof include an alkenyl group such as a group, a hexenyl group and an octenyl group, and an aryl group such as a phenyl group. Further, a part or all of the hydrogen atom bonded to the carbon atom of these groups may be substituted with a halogen atom or another group, and the substituents include a trifluoromethyl group and 3,3,3-tri. Fluoropropyl group and the like can be mentioned. As R 6 and R 7 , saturated aliphatic groups or aromatic groups are preferable, and methyl groups and phenyl groups are more preferable. R 5 and R 8 are monovalent hydrocarbon groups or hydrogen atoms having 1 to 10 carbon atoms. Examples of the monovalent hydrocarbon group having 1 to 10 carbon atoms of R 5 and R 8 are the same as those described above. h is 0 ≦ h ≦ 100, preferably 0 ≦ h ≦ 80 or 0 <h ≦ 80, i is 3 ≦ i ≦ 80, and 5 ≦ i ≦ 70 is preferable.
（Ｂ）成分は、通常、オクタメチルシクロテトラシロキサン等の環状低分子シロキサンとテトラメチルシクロテトラシロキサン等のＳｉ−Ｈを含有するシロキサンを、酸触媒を用いて開環重合させて製造するが、重合後は原料である環状低分子シロキサンを含有しているため、これを加熱及び減圧下で、反応生成物中に不活性気体を通気させながら、留去したものを用いることが好ましい。 The component (B) is usually produced by ring-opening polymerization of a cyclic low molecular weight siloxane such as octamethylcyclotetrasiloxane and a Si—H-containing siloxane such as tetramethylcyclotetrasiloxane by ring-opening polymerization using an acid catalyst. Since it contains cyclic low-molecular-weight siloxane as a raw material after polymerization, it is preferable to use the one obtained by distilling it under heating and reduced pressure while allowing an inert gas to be aerated in the reaction product.
（Ｂ）成分の具体的な構造を表したものとしては以下に示すようなもの等が挙げられるが、これらに限定されない。なお、下記式中のＭｅはそれぞれメチル基を示す。
（Ｂ）の成分の配合量は、（Ａ）成分１００質量部に対し１〜２０質量部である。１質量部よりも少ない場合は、組成物が十分に硬化しない可能性があり、２０質量部よりも多い場合は、プライマーの硬化皮膜上に塗工して硬化させる粘着剤層との反応点が多すぎることにより粘着剤の硬化性が悪化する可能性がある。 The blending amount of the component (B) is 1 to 20 parts by mass with respect to 100 parts by mass of the component (A). If it is less than 1 part by mass, the composition may not be sufficiently cured, and if it is more than 20 parts by mass, the reaction point with the pressure-sensitive adhesive layer that is applied and cured on the cured film of the primer is If it is too much, the curability of the adhesive may be deteriorated.
［（Ｃ）成分］
（Ｃ）成分はアルケニル基含有有機基を含むケイ素化合物であり、特に限定されないが、好ましくは下記一般式（２）で表されるものを挙げることができる。
Ｒ２ ｂ−Ｓｉ−（ＯＲ３）４−ｂ （２）
（式中、Ｒ２は独立にアルケニル基含有有機基であり、Ｒ３は独立に炭素数１〜５のアルキル基であり、ｂは１，２又は３である。）
[Component (C)]
The component (C) is a silicon compound containing an alkenyl group-containing organic group, and is not particularly limited, but preferably, a compound represented by the following general formula (2) can be mentioned.
R 2 b- Si- (OR 3 ) 4-b (2)
(In the formula, R 2 is an alkenyl group-containing organic group independently, R 3 is an alkyl group having 1 to 5 carbon atoms independently, and b is 1, 2 or 3).
Ｒ２はアルケニル基含有有機基であり、アルケニル基含有有機基としては炭素数２〜１０のものが好ましく、例として、ビニル基、アリル基、ヘキセニル基、オクテニル基等のアルケニル基などが挙げられる。 R 2 is an alkenyl group-containing organic group, and the alkenyl group-containing organic group preferably has 2 to 10 carbon atoms, and examples thereof include an alkenyl group such as a vinyl group, an allyl group, a hexenyl group, and an octenyl group. ..
Ｒ３は独立に炭素数１〜５のアルキル基であり、例えばメチル基、エチル基、プロピル基、ブチル基、ペンチル基などが挙げられ、メチル基とエチル基が好ましく、特にメチル基が好ましい。 R 3 is an alkyl group having 1 to 5 carbon atoms independently, and examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, and a pentyl group. A methyl group and an ethyl group are preferable, and a methyl group is particularly preferable.
（Ｃ）成分は（Ａ）成分１００質量部に対し５０〜３００質量部であり、好ましくは７０〜２８０質量部、より好ましくは８０〜２５０質量部である。５０質量部より少ない場合は、十分にプライマー効果が発揮できず粘着剤の基材密着性が向上しないことがあり、３００質量部より多い場合は、プライマーの硬化皮膜上に塗工して硬化させる粘着剤層との反応点が多すぎることにより粘着剤の硬化性が悪化する可能性がある。 The component (C) is 50 to 300 parts by mass, preferably 70 to 280 parts by mass, and more preferably 80 to 250 parts by mass with respect to 100 parts by mass of the component (A). If it is less than 50 parts by mass, the primer effect may not be sufficiently exhibited and the adhesion of the adhesive to the substrate may not be improved. If it is more than 300 parts by mass, it is applied onto the cured film of the primer and cured. If there are too many reaction points with the pressure-sensitive adhesive layer, the curability of the pressure-sensitive adhesive may deteriorate.
（Ｃ）成分の具体的な構造を表したものとしては以下に示すようなもの等が挙げられるが、これらに限定されない。なお、下記式中のＭｅ、Ｅｔはそれぞれメチル基、エチル基を示す。
［（Ｄ）成分］
（Ｄ）成分はルイス酸触媒であり、硬化触媒として機能する。（Ｄ）成分は金属触媒であることができる。例として様々のものが挙げられ、錫化合物、アルミニウム化合物、チタン化合物、ジルコニウム化合物、スカンジウム化合物、バナジウム化合物、鉄化合物、コバルト化合物、ニッケル化合物、銅化合物、亜鉛化合物、ランタン化合物、セリウム化合物などがあり、金属化合物を含むものが好ましく、特に錫化合物、アルミニウム化合物、チタン化合物を用いたものが好まく、錫化合物がより好ましい。
化合物としては、塩化物、臭化物、ヨウ化物などのハロゲン化化合物、硝酸塩、硫酸塩、炭酸塩、スルホン酸塩、トリフルオロメタンスルホン酸塩、カルボン酸塩などが好適に用いられる。
[(D) component]
The component (D) is a Lewis acid catalyst and functions as a curing catalyst. The component (D) can be a metal catalyst. Various examples include tin compounds, aluminum compounds, titanium compounds, zirconium compounds, scandium compounds, vanadium compounds, iron compounds, cobalt compounds, nickel compounds, copper compounds, zinc compounds, lanthanum compounds, cerium compounds, etc. , A metal compound is preferable, a tin compound, an aluminum compound, and a titanium compound are particularly preferable, and a tin compound is more preferable.
As the compound, halogenated compounds such as chlorides, bromides and iodides, nitrates, sulfates, carbonates, sulfonates, trifluoromethanesulfonates, carboxylates and the like are preferably used.
（Ｄ）成分は（Ａ）成分１００質量部に対し０．１〜１０質量部であり、０．１質量部よりも少ない場合、組成物が十分に硬化しない可能性があり、１０質量部よりも多い場合、（Ａ）成分と（Ｂ）成分が過剰に反応することで粘着剤と化学結合を形成する反応部位が少なくなってしまい十分なプライマー効果を得られない可能性がある。
（Ｄ）成分の具体例としては、ジブチル錫ジアセテート、ジブチル錫ジオクトエート、ジブチル錫ジラウレート、ジオクチル錫ジアセテート、錫オクトエート、塩化アルミニウム、アルミニウムアセチルアセトナート、チタニウムアセチルアセトナート、テトラエトキシチタンなどが挙げられるが、これらに限定されない。
The component (D) is 0.1 to 10 parts by mass with respect to 100 parts by mass of the component (A), and if it is less than 0.1 parts by mass, the composition may not be sufficiently cured, and the composition may not be sufficiently cured. If there are too many, the reaction site where the component (A) and the component (B) react excessively to form a chemical bond with the pressure-sensitive adhesive may be reduced, and a sufficient primer effect may not be obtained.
Specific examples of the component (D) include dibutyltin diacetate, dibutyltin dioctate, dibutyltin dilaurate, dioctyltin diacetate, tin octoate, aluminum chloride, aluminum acetylacetate, titanium acetylacetonate, tetraethoxytitanium and the like. However, it is not limited to these.
［（Ｅ）成分］
本発明のプライマー組成物は、粘度を低くして作業性を向上させる、あるいは基材へ塗工したときの濡れ性を改善するためなどに、成分（Ｅ）として有機溶剤を使用してもよい。有機溶剤としては、トルエン、キシレンなどの芳香族炭化水素系溶剤、ヘキサン、ヘプタン、オクタン、イソオクタン、デカン、シクロヘキサン、メチルシクロヘキサン、イソパラフィンなどの脂肪族炭化水素系溶剤、工業用ガソリン（ゴム揮発油等）、石油ベンジン、ソルベントナフサなどの炭化水素系溶剤、アセトン、メチルエチルケトン、２−ペンタノン、３−ペンタノン、２−ヘキサノン、２−ヘプタノン、４−ヘプタノン、メチルイソブチルケトン、ジイソブチルケトン、アセトニルアセトン、シクロヘキサノンなどのケトン系溶剤、酢酸エチル、酢酸プロピル、酢酸イソプロピル、酢酸ブチル、酢酸イソブチルなどのエステル系溶剤、ジエチルエーテル、ジプロピルエーテル、ジイソプロピルエーテル、ジブチルエーテル、１，２−ジメトキシエタン、１，４−ジオキサンなどのエーテル系溶剤、２−メトキシエチルアセタート、２−エトキシエチルアセタート、プロピレングリコールモノメチルエーテルアセタート、２−ブトキシエチルアセタートなどのエステルとエーテル部分を有する溶剤、ヘキサメチルジシロキサン、オクタメチルトリシロキサン、オクタメチルシクロテトラシロキサン、デカメチルシクロペンタシロキサン、トリス（トリメチルシロキシ）メチルシラン、テトラキス（トリメチルシロキシ）シランなどのシロキサン系溶剤、トリフルオロトルエン、ヘキサフルオロキシレン、メチルノナフルオロブチルエーテル、エチルノナフルオロブチルエーテルなどのフッ素系溶剤、又はこれらの混合溶剤などが挙げられ、使用するのに好ましいのは工業用ガソリン（ゴム揮発油等）やイソパラフィンである。
[(E) component]
In the primer composition of the present invention, an organic solvent may be used as the component (E) in order to lower the viscosity to improve workability or to improve the wettability when applied to a substrate. .. Examples of the organic solvent include aromatic hydrocarbon solvents such as toluene and xylene, aliphatic hydrocarbon solvents such as hexane, heptane, octane, isooctane, decane, cyclohexane, methylcyclohexane and isoparaffin, and industrial gasoline (rubber volatile oil, etc.). ), Petroleum benzine, hydrocarbon solvents such as solvent naphtha, acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, 2-heptanone, 4-heptanone, methylisobutylketone, diisobutylketone, acetonylacetone, cyclohexanone. Ketone solvents such as ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate and other ester solvents, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, 1,2-dimethoxyethane, 1,4- Ether-based solvents such as dioxane, solvents having ester and ether moieties such as 2-methoxyethyl acetate, 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, 2-butoxyethyl acetate, hexamethyldisiloxane, octa Siloxane-based solvents such as methyltrisiloxane, octamethylcyclotetrasiloxane, decamethylcyclopentasiloxane, tris (trimethylsiloxy) methylsilane, tetrakis (trimethylsiloxy) silane, trifluorotoluene, hexafluoroxylene, methylnonafluorobutyl ether, ethylnona Fluorosolvents such as fluorobutyl ether, mixed solvents thereof, and the like can be mentioned, and industrial gasoline (rubber volatile oil, etc.) and isoparaffin are preferable for use.
（Ｅ）成分の添加量は、（Ａ）成分の１００質量部に対し、０〜１０，０００質量部であり、好ましくは０〜５，０００質量部、より好ましくは０〜３，０００質量部である。１０，０００質量部以下であれば、塗工性が悪くなるおそれがない。 The amount of the component (E) added is 0 to 10,000 parts by mass, preferably 0 to 5,000 parts by mass, and more preferably 0 to 3,000 parts by mass with respect to 100 parts by mass of the component (A). Is. If it is 10,000 parts by mass or less, there is no possibility that the coatability is deteriorated.
［シリコーン粘着剤］
次に、本発明のプライマー組成物とともに使用されるシリコーン粘着剤について説明する。シリコーン粘着剤は、特に限定されないが、例えば以下に説明する成分を含んでいるものを挙げることができる。好ましくは、ヒドロシリル化により硬化する粘着剤（ヒドロシリル化硬化型粘着剤）である。なお、以下では、シリコーン粘着剤を「シリコーン粘着剤組成物」という場合がある。
[Silicone adhesive]
Next, the silicone pressure-sensitive adhesive used together with the primer composition of the present invention will be described. The silicone pressure-sensitive adhesive is not particularly limited, and examples thereof include those containing the components described below. A pressure-sensitive adhesive that cures by hydrosilylation (hydrosilylation-curable pressure-sensitive adhesive) is preferable. In the following, the silicone pressure-sensitive adhesive may be referred to as a "silicone pressure-sensitive adhesive composition".
［（Ｆ）成分］
（Ｆ）成分は１分子中に少なくとも２つのアルケニル基含有有機基を有するオルガノポリシロキサンである。具体的な構造としては下記平均組成式（５）で表されるものが挙げられる。
The component (F) is an organopolysiloxane having at least two alkenyl group-containing organic groups in one molecule. As a specific structure, the one represented by the following average composition formula (5) can be mentioned.
Ｒ９は炭素数１〜１０の１価炭化水素基であり、そのうち２個以上がアルケニル基含有有機基である。 R 9 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, and two or more of them are alkenyl group-containing organic groups.
１価の炭化水素基としては、具体的には、例えばメチル基、エチル基、プロピル基、ブチル基等のアルキル基、シクロヘキシル基等のシクロアルキル基、フェニル基等のアリール基などであり、更に、これらの基の炭素原子に結合した水素原子の一部又は全部がハロゲン原子又はその他の基で置換されていてもよく、トリフルオロメチル基、３，３，３−トリフルオロプロピル基等が例示される。飽和の脂肪族基あるいは芳香族基が好ましく、特にメチル基、フェニル基が好ましい。 Specific examples of the monovalent hydrocarbon group include an alkyl group such as a methyl group, an ethyl group, a propyl group and a butyl group, a cycloalkyl group such as a cyclohexyl group, an aryl group such as a phenyl group, and the like. , A part or all of the hydrogen atom bonded to the carbon atom of these groups may be substituted with a halogen atom or another group, and examples thereof include a trifluoromethyl group, a 3,3,3-trifluoropropyl group and the like. Will be done. Saturated aliphatic groups or aromatic groups are preferable, and methyl groups and phenyl groups are particularly preferable.
また、アルケニル基含有有機基としては炭素数２〜１０のものが好ましく、例として、ビニル基、アリル基、ヘキセニル基、オクテニル基等のアルケニル基、アクリロイルプロピル基、アクリロイルメチル基、メタクリロイルプロピル基等のアクリロイルアルキル基及びメタクリロイルアルキル基、シクロヘキセニルエチル基等のシクロアルケニルアルキル基、ビニルオキシプロピル基等のアルケニルオキシアルキル基などが挙げられる。使用する場合には、特にビニル基が好ましい。 The alkenyl group-containing organic group preferably has 2 to 10 carbon atoms, and examples thereof include an alkenyl group such as a vinyl group, an allyl group, a hexenyl group and an octenyl group, an acryloylpropyl group, an acryloylmethyl group and a methacryloylpropyl group. Examples thereof include a cycloalkenylalkyl group such as an acryloylalkyl group and a methacryloylalkyl group, a cyclohexenylethyl group, and an alkenyloxyalkyl group such as a vinyloxypropyl group. When used, vinyl groups are particularly preferred.
（Ｆ）に含まれるアルケニル基の量は、オルガノポリシロキサン１００ｇあたり０．０００５〜０．０５モルであり、０．０００６〜０．０４モルであるものが好ましく、０．０００７〜０．０３モルがより好ましい。０．０００５モル以上であれば架橋密度が小さくなって粘着層の凝集破壊が生じることがなく、０．０５モル以下であれば粘着層が硬くなり過ぎることなく、適切な粘着力やタックを得られる。 The amount of the alkenyl group contained in (F) is 0.0005 to 0.05 mol, preferably 0.0006 to 0.04 mol, and 0.0007 to 0.03 mol per 100 g of the organopolysiloxane. Is more preferable. If it is 0.0005 mol or more, the crosslink density becomes small and the adhesive layer does not coagulate and break, and if it is 0.05 mol or less, the adhesive layer does not become too hard and appropriate adhesive strength and tack are obtained. Be done.
平均組成式（５）におけるｌ〜ｏについて、ｌは２以上の整数、ｍは１以上の整数、ｎおよびｏは０以上の整数で、５０≦ｌ＋ｍ＋ｎ＋ｏ≦１２，０００であることができ、好ましくは１００≦ｌ＋ｍ＋ｎ＋ｏ≦１０，０００である。ｌ＋ｍ＋ｎ＋ｏが５０以上であれば、架橋点が多くなりすぎて反応性が低下するおそれがなく、１２，０００以下であれば、組成物の粘度が高くなって撹拌混合しにくくなる等がなく、作業性が良好になる。 Regarding l to o in the average composition formula (5), l is an integer of 2 or more, m is an integer of 1 or more, n and o are integers of 0 or more, and 50 ≦ l + m + n + o ≦ 12,000, which is preferable. Is 100 ≦ l + m + n + o ≦ 10,000. If l + m + n + o is 50 or more, there is no risk that the number of cross-linking points will increase too much and the reactivity will decrease, and if it is 12,000 or less, the viscosity of the composition will not increase and it will not be difficult to stir and mix. The sex becomes good.
（Ｆ）成分は通常、オクタメチルシクロテトラシロキサンなどの環状低分子シロキサンを、触媒を用いて開環重合させて製造するが、重合後は原料である環状低分子シロキサンを含有しているため、これを加熱および減圧下で、反応生成物中に不活性気体を通気させながら、留去したものを用いることが好ましい。 The component (F) is usually produced by ring-opening polymerization of cyclic low-molecular-weight siloxane such as octamethylcyclotetrasiloxane using a catalyst, but after polymerization, it contains cyclic low-molecular-weight siloxane as a raw material. It is preferable to use the one obtained by distilling off the inert gas under heating and reduced pressure while aerating the inert gas through the reaction product.
（Ｆ）成分としては、例えば下記一般式で表されるものが挙げられるが、これらに限定されない。
Ｒ９−１Ｒ９−２ ２ＳｉＯ（Ｒ９−２ ２ＳｉＯ）ｐＳｉＲ９−２ ２Ｒ９−１
Ｒ９−１Ｒ９−２ ２ＳｉＯ（Ｒ９−２ ２ＳｉＯ）ｐ（Ｒ９−１Ｒ９−２ＳｉＯ）ｑＳｉＲ９−２ ２Ｒ９−１
Ｒ９−１ ３ＳｉＯ（Ｒ９−２ ２ＳｉＯ）ｐ（Ｒ９−１Ｒ９−２ＳｉＯ）ｑＳｉＲ９−２ ２Ｒ９−１
Ｒ９−２ ３ＳｉＯ（Ｒ９−２ ２ＳｉＯ）ｐ（Ｒ９−１Ｒ９−２ＳｉＯ）ｑＳｉＲ９−２ ２Ｒ９−１
（式中、Ｒ９−１は同一又は異種のアルケニル基含有有機基であり、Ｒ９−２は同一又は異種の炭素数１〜１０の１価炭化水素基であり、ｐ≧４８、ｑ≧１である（但し、分子中に（Ｒ９−１Ｒ９−２ＳｉＯ）ｑ以外にＲ９−１を有しない場合はｑ≧２である。）
Examples of the component (F) include, but are not limited to, those represented by the following general formula.
R 9-1 R 9-2 2 SiO (R 9-2 2 SiO) p SiR 9-2 2 R 9-1
R 9-1 R 9-2 2 SiO (R 9-2 2 SiO) p (R 9-1 R 9-2 SiO) q SiR 9-2 2 R 9-1
R 9-1 3 SiO (R 9-2 2 SiO) p (R 9-1 R 9-2 SiO) q SiR 9-2 2 R 9-1
R 9-2 3 SiO (R 9-2 2 SiO) p (R 9-1 R 9-2 SiO) q SiR 9-2 2 R 9-1
(In the formula, R 9-1 is the same or different alkenyl group-containing organic group, and R 9-2 is the same or different monovalent hydrocarbon group having 1 to 10 carbon atoms, p ≧ 48, q ≧. 1 (However, if the molecule does not have R 9-1 other than (R 9-1 R 9-2 SiO) q , q ≧ 2).
Ｒ９−１，Ｒ９−２としては、上記Ｒ９で例示されたものが挙げられる。なお、４８≦ｐ≦１１，９９８が好ましく、１≦ｑ≦１，０００が好ましく、２≦ｑ≦８００がより好ましい。 Examples of R 9-1 and R 9-2 include those exemplified in R 9 above. It should be noted that 48 ≦ p ≦ 11,998 is preferable, 1 ≦ q ≦ 1,000 is preferable, and 2 ≦ q ≦ 800 is more preferable.
より具体的な（Ｆ）成分としては、下記一般式で表されるものが挙げられるが、これらに限定されない。なお、下記式中のＭｅ，Ｖｉ，Ｐｈはそれぞれメチル基、ビニル基、フェニル基を示す。
［（Ｇ）成分］
（Ｇ）成分はＲ１０ ３ＳｉＯ１／２単位（式中、Ｒ１０は独立に脂肪族不飽和結合を有さない炭素数１〜１０の1価炭化水素基又は炭素数２〜６のアルケニル基を示す。）及びＳｉＯ４／２単位を含有し、（Ｒ１０ ３ＳｉＯ１／２単位）／（ＳｉＯ４／２単位）で表されるモル比が、０．５〜１．０であるポリオルガノシロキサンである。このモル比が０．５以上であれば、粘着力やタックが低下するおそれがなく、１．０以下であれば、粘着力や保持力が低下するおそれもない。なお、上記モル比は０．６〜０．９が好ましい。
[(G) component]
The component (G) is R 10 3 SiO 1/2 unit (in the formula, R 10 is a monovalent hydrocarbon group having 1 to 10 carbon atoms or an alkenyl having 2 to 6 carbon atoms which does not independently have an aliphatic unsaturated bond. The molar ratio is 0.5 to 1.0, which contains 4/2 units of (R) and SiO 4/2 units and is represented by (R 10 3 SiO 1/2 units) / (SiO 4/2 units). It is a polyorganosiloxane. If the molar ratio is 0.5 or more, the adhesive strength and tack are not likely to decrease, and if it is 1.0 or less, the adhesive strength and holding power are not likely to decrease. The molar ratio is preferably 0.6 to 0.9.
Ｒ１０は独立に脂肪族不飽和結合を有さない炭素数１〜１０の１価炭化水素基又は炭素数２〜６のアルケニル基を示し、炭素数１〜１０の１価炭化水素基としては、メチル基、エチル基、プロピル基、ブチル基等の炭素数２〜６のアルキル基、フェニル基、トリル基等の炭素数６〜１０のアリール基が好ましい。炭素数２〜６のアルケニル基としては、ビニル基、アリル基、ブテニル基等が好ましい。 R 10 independently represents a monovalent hydrocarbon group having 1 to 10 carbon atoms or an alkenyl group having 2 to 6 carbon atoms, which does not independently have an aliphatic unsaturated bond, and is used as a monovalent hydrocarbon group having 1 to 10 carbon atoms. , An alkyl group having 2 to 6 carbon atoms such as a methyl group, an ethyl group, a propyl group and a butyl group, and an aryl group having 6 to 10 carbon atoms such as a phenyl group and a tolyl group are preferable. As the alkenyl group having 2 to 6 carbon atoms, a vinyl group, an allyl group, a butenyl group and the like are preferable.
（Ｇ）成分はＲ１０以外にシラノール基や加水分解性のアルコキシ基を含んでいてもよく、その含有量は（Ｇ）成分の総質量の０．０１〜４．０質量％となるのが好ましく、０．０５〜３．５質量％となるのがより好ましい。上記含有量が０．０１質量％以上であれば、粘着剤の凝集力が低くなるおそれがなく、４．０質量％以下であれば、粘着剤のタックが低下するおそれもない。アルコキシ基としては、メトキシ基、エトキシ基、イソプロポキシ基、ブトキシ基、フェノキシ基等を挙げることができ、使用する場合にはメトキシ基が好ましい。 Component (G) may contain a silanol group or a hydrolyzable alkoxy group other than R 10, the content that becomes 0.01 to 4.0% by weight of the total weight of component (G) It is preferably 0.05 to 3.5% by mass, more preferably 0.05 to 3.5% by mass. If the content is 0.01% by mass or more, the cohesive force of the pressure-sensitive adhesive is not likely to decrease, and if it is 4.0% by mass or less, the tack of the pressure-sensitive adhesive is not likely to decrease. Examples of the alkoxy group include a methoxy group, an ethoxy group, an isopropoxy group, a butoxy group, a phenoxy group and the like, and a methoxy group is preferable when used.
（Ｇ）成分は２種以上を併用してもよい。また、必要に応じて、Ｒ１０ ２ＳｉＯ２／２単位、Ｒ１０ＳｉＯ３／２単位を含有させることも可能である。 Two or more kinds of the component (G) may be used in combination. Further, if necessary, it is possible to contain R 10 2 SiO 2/2 unit and R 10 SiO 3/2 unit.
（Ｇ）成分は、触媒存在下において縮合反応させて得てもよい。これは、表面に存在する加水分解性基同士を反応させるものであり、粘着力の向上等の効果が見込める。アルカリ性触媒を用い、室温〜還流下で反応させ、必要に応じて中和すればよい。また、この反応は（Ｆ）成分共存下で行ってもよい。 The component (G) may be obtained by a condensation reaction in the presence of a catalyst. This is to react the hydrolyzable groups existing on the surface with each other, and is expected to have effects such as improvement of adhesive strength. It may be reacted at room temperature to reflux using an alkaline catalyst and neutralized if necessary. Further, this reaction may be carried out in the coexistence of the component (F).
アルカリ性触媒としては、水酸化リチウム、水酸化ナトリウム、水酸化カリウム、水酸化カルシウム等の金属水酸化物；炭酸ナトリウム、炭酸カリウム等の炭酸塩；炭酸水素ナトリウム、炭酸水素カリウム等の炭酸水素塩；ナトリウムメトキシド、カリウムブトキシド等の金属アルコキシド；ブチルリチウム等の有機金属；カリウムシラノレート；アンモニアガス、アンモニア水、メチルアミン、トリメチルアミン、トリエチルアミン等の窒素化合物等が挙げられるが、アンモニアガス又はアンモニア水が好ましい。縮合反応の温度は、室温から有機溶剤の還流温度で行えばよい。反応時間は、特に限定されないが、０．５〜２０時間、好ましくは１〜１６時間とすればよい。さらに、反応終了後、必要に応じて、アルカリ性触媒を中和する中和剤を添加してもよい。中和剤としては、塩化水素、二酸化炭素等の酸性ガス；酢酸、オクチル酸、クエン酸等の有機酸；塩酸、硫酸、リン酸等の鉱酸等が挙げられる。アルカリ性触媒としてアンモニアガス又はアンモニア水、低沸点のアミン化合物を用いた場合は、窒素等の不活性ガスを通気し留去してもよい。 Examples of the alkaline catalyst include metal hydroxides such as lithium hydroxide, sodium hydroxide, potassium hydroxide and calcium hydroxide; carbonates such as sodium carbonate and potassium carbonate; hydrogen carbonates such as sodium hydrogen carbonate and potassium hydrogen carbonate; Metal alkoxides such as sodium methoxydo and potassium butoxide; Organic metals such as butyl lithium; Potassium silanolate; Ammonia gas, aqueous ammonia, nitrogen compounds such as methylamine, trimethylamine and triethylamine, etc., but ammonia gas or aqueous ammonia preferable. The temperature of the condensation reaction may be from room temperature to the reflux temperature of the organic solvent. The reaction time is not particularly limited, but may be 0.5 to 20 hours, preferably 1 to 16 hours. Further, after the reaction is completed, a neutralizing agent that neutralizes the alkaline catalyst may be added, if necessary. Examples of the neutralizing agent include acid gases such as hydrogen chloride and carbon dioxide; organic acids such as acetic acid, octyl acid and citric acid; and mineral acids such as hydrochloric acid, sulfuric acid and phosphoric acid. When ammonia gas or aqueous ammonia or an amine compound having a low boiling point is used as the alkaline catalyst, an inert gas such as nitrogen may be aerated and distilled off.
（Ｆ）成分の配合量は１００〜３０質量部、（Ｇ）成分の配合量は７０〜０質量部であってよく、（Ｇ）成分が含まれない場合もある。（Ｆ）、（Ｇ）成分の配合質量比は、（Ｆ）／（Ｇ）＝１００／０〜３０／７０であり、１００／０〜３５／６５が好ましい。 The blending amount of the component (F) may be 100 to 30 parts by mass, the blending amount of the component (G) may be 70 to 0 parts by mass, and the component (G) may not be contained. The compounding mass ratio of the components (F) and (G) is (F) / (G) = 100/0 to 30/70, preferably 100/0 to 35/65.
［（Ｂ’）成分］
シリコーン粘着剤組成物には、前述の（Ｂ）成分と同様の化合物も含まれる。シリコーン粘着剤組成物に用いる（Ｂ’）成分（Ｓｉ−Ｈ基を１分子中に３個以上有するポリオルガノハイドロジェンシロキサン）の配合量は、（Ｆ）成分中のアルケニル基に対する（Ｂ’）成分中のＳｉ−Ｈ基のモル比（Ｓｉ−Ｈ基／アルケニル基）が０．５〜３０となる量であってよく、１〜２５の範囲となるように配合することが好ましい。０．５以上では架橋密度が十分で、粘着特性が十分に得られ、３０以下であれば粘着力やタックが十分で、処理浴の可使時間が短くなることもない。
[(B') component]
The silicone pressure-sensitive adhesive composition also contains a compound similar to the above-mentioned component (B). The amount of the (B') component (polyorganohydrogensiloxane having three or more Si—H groups in one molecule) used in the silicone pressure-sensitive adhesive composition is (B') with respect to the alkenyl group in the (F) component. The molar ratio of Si—H groups (Si—H group / alkenyl group) in the component may be 0.5 to 30, and it is preferable to mix in the range of 1 to 25. If it is 0.5 or more, the crosslink density is sufficient and the adhesive properties are sufficiently obtained, and if it is 30 or less, the adhesive strength and tack are sufficient, and the pot life of the treatment bath is not shortened.
［（Ｈ）成分］
（Ｈ）成分は、（Ｆ）成分中のアルケニル基と（Ｂ’）成分中のＳｉ−Ｈ基をヒドロシリル化付加して硬化させるための白金族金属系触媒であり、中心金属としては白金、パラジウム、イリジウム、ロジウム、オスミウム、ルテニウムなどが例として挙げられ、中でも白金が好適である。白金触媒としては、塩化白金酸、塩化白金酸のアルコール溶液、塩化白金酸とアルコールとの反応物、塩化白金酸とオレフィン化合物との反応物、塩化白金酸とビニル基含有シロキサンとの反応物、白金とビニル基含有シロキサンの錯体などが挙げられる。
[(H) component]
The component (H) is a platinum group metal-based catalyst for hydrosilylating and adding the alkenyl group in the component (F) and the Si—H group in the component (B') to cure them, and the central metal is platinum. Examples include palladium, iridium, rhodium, osmium, ruthenium and the like, with platinum being preferred. Examples of the platinum catalyst include platinum chloride acid, an alcohol solution of platinum chloride acid, a reaction product of platinum chloride acid and alcohol, a reaction product of platinum chloride acid and an olefin compound, and a reaction product of platinum chloride acid and a vinyl group-containing siloxane. Examples thereof include a complex of platinum and a vinyl group-containing siloxane.
（Ｈ）成分の含有量としては、（Ｆ），（Ｇ），（Ｂ’）成分の総量に対し、金属量が１〜５００ｐｐｍとなるような量が好ましく、２〜４５０ｐｐｍがより好ましい。１ｐｐｍ以上であれば、反応が十分速く、硬化も十分となり、粘着力や保持力などの各種特性が十分発揮される。５００ｐｐｍ以下であれば、硬化物の柔軟性が乏しくなることがない。 The content of the component (H) is preferably such that the amount of metal is 1 to 500 ppm, more preferably 2 to 450 ppm, based on the total amount of the components (F), (G), and (B'). If it is 1 ppm or more, the reaction is sufficiently fast, the curing is sufficient, and various characteristics such as adhesive strength and holding power are sufficiently exhibited. If it is 500 ppm or less, the flexibility of the cured product will not be reduced.
［（Ｉ）成分］
（Ｉ）成分は制御剤であり、制御剤はシリコーン粘着剤組成物を調合ないし基材に塗工する際に加熱硬化の以前に付加反応が開始して処理液が増粘やゲル化を起こさないようにするために添加するものである。反応制御剤は付加反応触媒である白金族金属に配位して付加反応を抑制し、加熱硬化させるときには配位がはずれて触媒活性が発現する。付加反応硬化型シリコーン組成物に従来使用されている反応制御剤はいずれも使用することができる。具体例としては、３−メチル−１−ブチン−３−オール、３−メチル−１−ペンチン−３−オール、３，５−ジメチル−１−ヘキシン−３−オール、１−エチニルシクロヘキサノール、３−メチル−３−トリメチルシロキシ−１−ブチン、３−メチル−３−トリメチルシロキシ−１−ペンチン、３，５−ジメチル−３−トリメチルシロキシ−１−ヘキシン、１−エチニル−１−トリメチルシロキシシクロヘキサン、ビス（２，２−ジメチル−３−ブチノキシ）ジメチルシラン、１，３，５，７−テトラメチル−１，３，５，７−テトラビニルシクロテトラシロキサン、１，１，３，３−テトラメチル−１，３−ジビニルジシロキサン、マレイン酸エステル、アジピン酸エステル等が挙げられる。（Ｉ）成分の配合量は、（Ｆ）成分と（Ｇ）成分と（Ｂ’）成分の合計１００質量部に対して０．０１〜５質量部が好ましく、０．０５〜２質量部がより好ましい。０．０１質量部以上であれば反応を十分抑制でき、作業前に組成物が硬化してしまうこともなく、５質量部以下であれば反応が十分速く、硬化も十分になる。
[(I) component]
The component (I) is a control agent, which causes an addition reaction to start before heat curing when the silicone pressure-sensitive adhesive composition is prepared or applied to a base material, causing the treatment liquid to thicken or gel. It is added to prevent it from occurring. The reaction control agent is coordinated with a platinum group metal which is an addition reaction catalyst to suppress the addition reaction, and when it is heat-cured, the coordination is deviated and catalytic activity is exhibited. Any reaction control agent conventionally used in the addition reaction curable silicone composition can be used. Specific examples include 3-methyl-1-butyne-3-ol, 3-methyl-1-pentyne-3-ol, 3,5-dimethyl-1-hexin-3-ol, 1-ethynylcyclohexanol, 3 −Methyl-3-trimethylsiloxy-1-butyne, 3-methyl-3-trimethylsiloxy-1-pentyne, 3,5-dimethyl-3-trimethylsiloxy-1-hexin, 1-ethynyl-1-trimethylsiloxycyclohexane, Bis (2,2-dimethyl-3-butynoxy) dimethylsilane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,1,3,3-tetramethyl -1,3-Divinyldisiloxane, maleic acid ester, adipic acid ester and the like can be mentioned. The blending amount of the component (I) is preferably 0.01 to 5 parts by mass, preferably 0.05 to 2 parts by mass, based on 100 parts by mass of the total of the components (F), (G) and (B'). More preferred. If it is 0.01 part by mass or more, the reaction can be sufficiently suppressed, the composition is not cured before the work, and if it is 5 parts by mass or less, the reaction is sufficiently fast and the curing is sufficient.
［（Ｅ’）成分］
上記を配合したシリコーン粘着剤の粘度が高くハンドリングが困難である場合には適当な有機溶剤を（Ｅ’）成分として用い希釈することができる。この（Ｅ’）有機溶剤は前述の（Ｅ）成分と同様のものを使用することができる。配合量は、（Ｆ）成分の１００質量部に対し、０〜２，０００質量部であり、好ましくは０〜１，５００質量部、より好ましくは０〜１，０００質量部である。２，０００質量部以下であれば、塗工性が悪くなることがない。
[(E') component]
When the silicone pressure-sensitive adhesive containing the above is highly viscous and difficult to handle, it can be diluted by using an appropriate organic solvent as the (E') component. As the (E') organic solvent, the same solvent as the above-mentioned component (E) can be used. The blending amount is 0 to 2,000 parts by mass, preferably 0 to 1,500 parts by mass, and more preferably 0 to 1,000 parts by mass with respect to 100 parts by mass of the component (F). If it is 2,000 parts by mass or less, the coatability does not deteriorate.
［シリコーン粘着剤の調製等］
シリコーン粘着剤組成物は、上記各成分を均一に混合することにより調製できる。一般的に、シリコーン粘着剤組成物は、使用する直前に触媒を均一に混合して使用する。
[Preparation of silicone adhesive, etc.]
The silicone pressure-sensitive adhesive composition can be prepared by uniformly mixing each of the above components. Generally, the silicone pressure-sensitive adhesive composition is used by uniformly mixing the catalyst immediately before use.
シリコーン粘着剤組成物の基材への塗工方法は、公知の塗工方式を用いて塗工すればよく、例えば、ワイヤーバー、コンマコーター、リップコーター、ロールコーター、ダイコーター、ナイフコーター、ブレードコーター、ロッドコーター、キスコーター、グラビアコーター、スクリーン塗工、浸漬塗工、キャスト塗工等が挙げられる。 The silicone pressure-sensitive adhesive composition may be applied to the substrate by using a known coating method, for example, a wire bar, a comma coater, a lip coater, a roll coater, a die coater, a knife coater, and a blade. Examples include coaters, rod coaters, kiss coaters, gravure coaters, screen coatings, immersion coatings, cast coatings and the like.
硬化後の粘着層の厚みは１〜５００μｍとすることができるが、この限りではない。硬化条件としては８０〜１８０℃、特に１００〜１６０℃で１０秒〜１０分、特に３０秒〜８分加熱すればよいが、この限りではない。 The thickness of the adhesive layer after curing can be 1 to 500 μm, but this is not the case. As the curing conditions, heating may be performed at 80 to 180 ° C., particularly 100 to 160 ° C. for 10 seconds to 10 minutes, particularly 30 seconds to 8 minutes, but this is not the case.
［プライマー処理物品］
本発明のシリコーン粘着剤用プライマー組成物は、該シリコーン粘着剤用プライマー組成物を基材の少なくとも片面に塗工し、硬化させることによって、前記シリコーン粘着剤用プライマー組成物の硬化物を基材の少なくとも片面に有する物品を得ることができる。
そして、物品の硬化物を有する面（プライマー処理面）上にシリコーン粘着剤を塗工、硬化させることによって、前記粘着剤の硬化物を有する粘着性物品を得ることができる。この場合、シリコーン粘着剤がヒドロシリル化硬化型粘着剤であることが好ましい。
[Primer-treated article]
The primer composition for a silicone pressure-sensitive adhesive of the present invention is obtained by applying the primer composition for a silicone pressure-sensitive adhesive to at least one surface of a base material and curing the cured product of the primer composition for a silicone pressure-sensitive adhesive. It is possible to obtain an article having at least one side of the above.
Then, by applying and curing the silicone adhesive on the surface (primer-treated surface) of the article having the cured product, the adhesive article having the cured product of the adhesive can be obtained. In this case, the silicone pressure-sensitive adhesive is preferably a hydrosilylation-curable pressure-sensitive adhesive.
このように、本発明のシリコーン粘着剤用プライマー組成物は、該組成物を基材に塗工、硬化することでシリコーン粘着剤との密着性を向上させることのできる表面処理基材などの物品を提供することができる。 As described above, the primer composition for a silicone pressure-sensitive adhesive of the present invention is an article such as a surface-treated base material capable of improving the adhesion to the silicone pressure-sensitive adhesive by coating and curing the composition on the base material. Can be provided.
上記組成物を塗工する基材としては、紙やプラスチックフィルム、ガラス、金属が選択される。紙としては、上質紙、コート紙、アート紙、グラシン紙、ポリエチレンラミネート紙、クラフト紙などが挙げられる。プラスチックフィルムとしては、ポリエチレンフィルム、ポリプロピレンフィルム、ポリエステルフィルム、ポリイミドフィルム、ポリ塩化ビニルフィルム、ポリ塩化ビニリデンフィルム、ポリビニルアルコールフィルム、ポリカーボネートフィルム、ポリテトラフルオロエチレンフィルム、ポリスチレンフィルム、エチレン−酢酸ビニル共重合体フィルム、エチレン−ビニルアルコール共重合体フィルム、トリアセチルセルロースフィルム、ポリエーテルエーテルケトンフィルム、ポリフェニレンサルファイドフィルムなどが挙げられる。ガラスとしては、厚みや種類などについて特に制限はなく、化学強化処理などをしたものでもよい。また、ガラス繊維も適用でき、ガラス繊維は単体でも他の樹脂と複合したものを使用してもよい。金属としては、アルミニウム箔、銅箔、金箔、銀箔、ニッケル箔などが例示される。上記組成物を塗工、硬化させた後にシリコーン粘着剤を塗工して使用する場合にはポリエステルフィルムやポリイミドフィルムが好ましい。 Paper, plastic film, glass, and metal are selected as the base material on which the above composition is applied. Examples of the paper include high-quality paper, coated paper, art paper, glassin paper, polyethylene laminated paper, kraft paper and the like. Plastic films include polyethylene film, polypropylene film, polyester film, polyimide film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, polycarbonate film, polytetrafluoroethylene film, polystyrene film, ethylene-vinyl acetate copolymer. Examples thereof include films, ethylene-vinyl alcohol copolymer films, triacetyl cellulose films, polyether ether ketone films, and polyphenylene sulfide films. The glass is not particularly limited in thickness and type, and may be chemically strengthened. Further, glass fiber can also be applied, and the glass fiber may be used alone or in combination with another resin. Examples of the metal include aluminum foil, copper foil, gold foil, silver foil, nickel foil and the like. When the above composition is coated and cured, and then a silicone adhesive is applied and used, a polyester film or a polyimide film is preferable.
上記組成物の基材への塗工方法は、公知の塗工方式を用いて塗工すればよく、例えば、ワイヤーバー、コンマコーター、リップコーター、ロールコーター、ダイコーター、ナイフコーター、ブレードコーター、ロッドコーター、キスコーター、グラビアコーター、スクリーン塗工、浸漬塗工、キャスト塗工等が挙げられる。 The coating method for the substrate of the composition may be a known coating method, for example, a wire bar, a comma coater, a lip coater, a roll coater, a die coater, a knife coater, a blade coater, and the like. Examples include rod coater, knife coater, gravure coater, screen coating, immersion coating, cast coating and the like.
上記組成物の基材への塗工量は、固形分で０．１〜２ｇ／ｍ２の範囲、特に０．２〜１．８ｇ／ｍ２の範囲が好ましく、硬化条件としては８０〜１８０℃、特に１００〜１６０℃で１０秒〜１０分、特に３０秒〜８分加熱すればよいが、この限りではない。 The amount of the composition applied to the substrate is preferably in the range of 0.1 to 2 g / m 2 in terms of solid content, particularly preferably in the range of 0.2 to 1.8 g / m 2 , and the curing conditions are 80 to 180. It may be heated at ° C., particularly 100 to 160 ° C. for 10 seconds to 10 minutes, particularly 30 seconds to 8 minutes, but this is not the case.
上記組成物により処理された表面上にシリコーン粘着剤を塗工、硬化することで基材との密着性が良好な粘着性物品を得ることができる。シリコーン粘着剤組成物としては、白金系触媒によって硬化させる付加硬化型のオルガノポリシロキサン組成物が好ましく、具体的には上述の各種成分を含有してなる組成物を用いることが好ましい。 By applying a silicone adhesive on the surface treated with the above composition and curing it, an adhesive article having good adhesion to a base material can be obtained. As the silicone pressure-sensitive adhesive composition, an addition-curing type organopolysiloxane composition that is cured by a platinum-based catalyst is preferable, and specifically, a composition containing the above-mentioned various components is preferably used.
以下、実施例及び比較例を示し、本発明を具体的に説明するが、本発明は下記の実施例に制限されるものではない。また、下記例において、Ｍｅはメチル基、Ｖｉはビニル基、Ｅｔはエチル基を表す。 Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples. Further, in the following example, Me represents a methyl group, Vi represents a vinyl group, and Et represents an ethyl group.
［実施例１］
（プライマー組成物）
（Ａ）成分として、３０質量％の濃度となるようにトルエンに溶解したときの粘度が１，４００ｍＰａ・ｓであり、分子末端がＯＨ基で封鎖された下記式（ａ−１）で表されるジメチルポリシロキサンの１００質量部、
（Ｂ）成分として、下記平均組成式（ｂ−１）で表されるポリオルガノハイドロジェンシロキサンの１質量部、
（Ｅ）成分としてトルエンを１，９００質量部加えてシリコーン溶液を作製し、
（Ｃ）成分として、下記式（ｃ−１）で表されるケイ素化合物の１００質量部、
（Ｄ）成分として、ジオクチル錫ジアセテートの５質量部を混合することでシリコーン粘着剤用プライマー組成物を作製した。
[Example 1]
(Primer composition)
The component (A) has a viscosity of 1,400 mPa · s when dissolved in toluene so as to have a concentration of 30% by mass, and is represented by the following formula (a-1) in which the molecular end is sealed with an OH group. 100 parts by mass of dimethylpolysiloxane,
As a component (B), 1 part by mass of polyorganohydrogensiloxane represented by the following average composition formula (b-1).
Toluene was added as a component (E) in an amount of 1,900 parts by mass to prepare a silicone solution.
As a component (C), 100 parts by mass of a silicon compound represented by the following formula (c-1),
A primer composition for a silicone pressure-sensitive adhesive was prepared by mixing 5 parts by mass of dioctyltin diacetate as a component (D).
（シリコーン粘着剤組成物）
続いて、（Ｆ）成分として下記平均組成式（ｆ−１）で表されるポリシロキサンを３５質量部、
（Ｇ）成分として、Ｍｅ３ＳｉＯ１／２単位及びＳｉＯ２単位を含有し、（Ｍｅ３ＳｉＯ１／２単位）／（ＳｉＯ２単位）のモル比が０．８５であるメチルポリシロキサン（ｇ−１）の６０質量％トルエン溶液を不揮発分として６５質量部、
（Ｂ’）成分として上記平均組成式（ｂ−１）で表されるメチルハイドロジェンポリシロキサン０．３５質量部、
（Ｉ）成分としてエチニルシクロヘキサノールの０．２５質量部、
（Ｈ）成分として１，３−ジビニル−１，１，３，３−テトラメチルジシロキサン白金（０）錯体の白金分を０．５質量％含むトルエン溶液の０．５質量部、
を添加し、シリコーン粘着剤組成物を作製した（（Ｂ’）成分中のＳｉ−Ｈ基は、（Ｆ）成分中のビニル基に対し、モル比で１０．５倍）。
これらの組成物を用い、プライマー硬化性、密着性、伸びを評価した。
Subsequently, as the component (F), 35 parts by mass of polysiloxane represented by the following average composition formula (f-1) was added.
As component (G), Me 3 containing SiO 1/2 units and SiO 2 units, (Me 3 SiO 1/2 units) / methylpolysiloxane (g mole ratio of (SiO 2 units) of 0.85 -1) 65 parts by mass of the 60% by mass toluene solution as the non-volatile content,
As a component (B'), 0.35 parts by mass of methylhydrogenpolysiloxane represented by the above average composition formula (b-1),
(I) 0.25 parts by mass of ethynylcyclohexanol as a component,
0.5 parts by mass of a toluene solution containing 0.5% by mass of the platinum content of the 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum (0) complex as the component (H).
Was added to prepare a silicone pressure-sensitive adhesive composition (the Si—H group in the component (B') was 10.5 times the molar ratio of the vinyl group in the component (F)).
Using these compositions, primer curability, adhesion, and elongation were evaluated.
［実施例２］
（Ｃ）成分である（ｃ−１）を８０質量部とした以外は、実施例１と同様にした。
[Example 2]
The same procedure as in Example 1 was carried out except that the component (c-1) (C-1) was 80 parts by mass.
［実施例３］
（Ｃ）成分である（ｃ−１）を２００質量部とした以外は、実施例１と同様にした。
[Example 3]
The procedure was the same as in Example 1 except that the component (c-1) (C-1) was 200 parts by mass.
［実施例４］
（Ａ）成分である（ａ−１）の代わりに、３０質量％の濃度となるようにトルエンに溶解したときの粘度が３５０ｍＰａ・ｓであり、分子末端がＯＨ基で封鎖された下記式で表されるジメチルポリシロキサン（ａ−２）を使用したこと以外は、実施例１と同様にした。
Instead of the component (A-1), the viscosity when dissolved in toluene so as to have a concentration of 30% by mass is 350 mPa · s, and the molecular end is sealed with an OH group according to the following formula. This was the same as in Example 1 except that the represented dimethylpolysiloxane (a-2) was used.
［実施例５］
（Ａ）成分である（ａ−１）の代わりに、３０質量％の濃度となるようにトルエンに溶解したときの粘度が５，０００ｍＰａ・ｓであり、分子末端がＯＨ基で封鎖された下記式で表されるジメチルポリシロキサン（ａ−３）を使用したこと以外は、実施例１と同様にした。
Instead of the component (a-1) (a-1), the viscosity when dissolved in toluene so as to have a concentration of 30% by mass is 5,000 mPa · s, and the molecular end is sealed with an OH group as follows. The procedure was the same as in Example 1 except that the dimethylpolysiloxane (a-3) represented by the formula was used.
［実施例６］
（Ｃ）成分である（ｃ−１）の代わりに下記式（ｃ−２）で表されるケイ素化合物を使用したこと以外は、実施例１と同様にした。
The same procedure as in Example 1 was carried out except that the silicon compound represented by the following formula (c-2) was used instead of the component (c-1) (C-1).
［実施例７］
（Ｃ）成分である（ｃ−１）の代わりに下記式（ｃ−３）で表されるケイ素化合物を使用したこと以外は、実施例１と同様にした。
The same procedure as in Example 1 was carried out except that the silicon compound represented by the following formula (c-3) was used instead of the component (c-1).
［実施例８］
シリコーン粘着剤組成物中の（Ｆ）成分である（ｆ−１）を４０質量部、（Ｇ）成分である（ｇ−１）を６０質量部、（Ｂ’）成分である（ｂ−１）を０．４０質量部としたこと以外は、実施例１と同様にした。
[Example 8]
The component (F-1) in the silicone pressure-sensitive adhesive composition is 40 parts by mass, the component (G-1) is 60 parts by mass, and the component (B') is (b-1). ) Was 0.40 parts by mass in the same manner as in Example 1.
［実施例９］
シリコーン粘着剤組成物中の（Ｆ）成分である（ｆ−１）を４５質量部、（Ｇ）成分である（ｇ−１）を５５質量部、（Ｂ’）成分である（ｂ−１）を０．４５質量部としたこと以外は、実施例１と同様にした。
[Example 9]
The component (F-1) in the silicone pressure-sensitive adhesive composition is 45 parts by mass, the component (G-1) is 55 parts by mass, and the component (B') is (b-1). ) Was 0.45 parts by mass in the same manner as in Example 1.
［実施例１０］
シリコーン粘着剤組成物中の（Ｆ）成分である（ｆ−１）の代わりに、下記平均組成式（ｆ−２）で表されるポリシロキサンを３５質量部、（Ｇ）成分である（ｇ−１）の６０質量％トルエン溶液を不揮発分として６５質量部、（Ｂ’）成分である（ｂ−１）を０．２６質量部としたこと以外は、実施例１と同様にした（（Ｂ’）成分中のＳｉ−Ｈ基は、（Ｆ）成分中のビニル基に対し、モル比で５．６倍)。
Instead of component (f-1) in the silicone pressure-sensitive adhesive composition, 35 parts by mass of polysiloxane represented by the following average composition formula (f-2) is component (G). The procedure was the same as in Example 1 except that the 60% by mass toluene solution of -1) was used as the non-volatile content and 65 parts by mass was used as the non-volatile content, and 0.26 parts by mass of (b-1), which is the component (B'), was used. The Si—H group in the B ′) component is 5.6 times the molar ratio of the vinyl group in the (F) component).
［実施例１１］
シリコーン粘着剤組成物中の（Ｇ）成分である（ｇ−１）の代わりに、Ｍｅ３ＳｉＯ１／２単位及びＳｉＯ２単位を含有し、（Ｍｅ３ＳｉＯ１／２単位)／（ＳｉＯ２単位)のモル比が０．７６であるメチルポリシロキサン（ｇ−２）の６０質量％トルエン溶液を不揮発分として６５質量部としたこと以外は、実施例１と同様にした。
[Example 11]
It is a (G) component of the silicone pressure-sensitive adhesive composition (g-1) in place of, containing Me 3 SiO 1/2 units and SiO 2 units, (Me 3 SiO 1/2 units) / (SiO 2 The same as in Example 1 except that a 60 mass% toluene solution of methyl polysiloxane (g-2) having a molar ratio of (unit) of 0.76 was used as a non-volatile content in an amount of 65 parts by mass.
［比較例１］
（Ｃ）成分である（ｃ−１）を配合しないこと以外は実施例１と同様にした。
[Comparative Example 1]
The same procedure as in Example 1 was carried out except that the component (c-1) (C) was not blended.
［比較例２］
（Ｃ）成分である（ｃ−１）の代わりに、下記式（ｃ−４）で表されるケイ素化合物１００質量部を使用したこと以外は実施例１と同様にした。
The same procedure as in Example 1 was carried out except that 100 parts by mass of the silicon compound represented by the following formula (c-4) was used instead of the component (c-1) (C-1).
［比較例３］
（Ｃ）成分である（ｃ−１）の代わりに、下記式（ｃ−５）で表されるケイ素化合物１００質量部を使用したこと以外は実施例１と同様にした。
The same procedure as in Example 1 was carried out except that 100 parts by mass of the silicon compound represented by the following formula (c-5) was used instead of the component (c-1) (C-1).
［評価］
＜密着性＞
シリコーン粘着剤用プライマー組成物を厚み２５μｍ、幅２５ｍｍのポリエチレンテレフタラート（ＰＥＴ）に硬化後の固形分が０．５ｇ／ｍ２となるようにワイヤーバーを用いて塗工して１２０℃／３０秒で風乾させた。この基材のプライマー処理面上に、シリコーン粘着剤組成物を、アプリケーターを用いて塗工し１３０℃／１分で硬化させて得られたテープの側方２ｍｍを切断した。その後引き裂き、両側より引っ張り、粘着層が基材から浮き上がるかどうかを目視で確認し、下記のように評価した。
〇:浮き上がらない
×:浮き上がる
[Evaluation]
<Adhesion>
The primer composition for silicone adhesive is coated on polyethylene terephthalate (PET) having a thickness of 25 μm and a width of 25 mm so that the solid content after curing is 0.5 g / m 2 using a wire bar at 120 ° C./30. Air dried in seconds. The silicone pressure-sensitive adhesive composition was applied onto the primer-treated surface of this base material using an applicator and cured at 130 ° C./1 minute, and 2 mm of the side of the obtained tape was cut. After that, it was torn and pulled from both sides, and it was visually confirmed whether or not the adhesive layer was lifted from the base material, and evaluated as follows.
〇: Does not rise ×: Lifts
＜伸び＞
密着性評価の項目において、テープを引き裂いていき、基材が分離した状態からさらに引っ張り、その際に生じた粘着層が伸びた量（ｍｍ）を測定した。この値は、小さいほど密着性が良好であることを示す。
評価結果を表１に示す。
<Growth>
In the item of adhesion evaluation, the tape was torn, the base material was further pulled from the separated state, and the amount (mm) of the adhesive layer formed at that time was measured. This value indicates that the smaller the value, the better the adhesion.
The evaluation results are shown in Table 1.
表１に示すように、実施例１〜１１では、プライマー硬化性は十分であり、プライマー効果が十分に発揮され、シリコーン粘着剤と基材フィルムの密着性は良好であった。（Ｃ）成分としてアルケニル基を有するケイ素化合物の添加が効果的であることが確認でき、これはプライマーにアルケニル基が導入され、それがシリコーン粘着剤中のＳｉ−Ｈ基と反応することにより、良好な基材密着性が実現できたものと推察される。 As shown in Table 1, in Examples 1 to 11, the primer curability was sufficient, the primer effect was sufficiently exhibited, and the adhesion between the silicone adhesive and the base film was good. It was confirmed that the addition of the silicon compound having an alkenyl group as the component (C) was effective, because the alkenyl group was introduced into the primer and it reacted with the Si—H group in the silicone pressure-sensitive adhesive. It is presumed that good substrate adhesion was achieved.
一方、比較例として（Ｃ）成分未添加（比較例１）、およびアルケニル基を有さないケイ素化合物の添加（比較例２，３）を実施したが、前述の実施例と異なり、十分な基材密着性が確保できなかった。これは、プライマー中にシリコーン粘着剤の成分と反応できる官能基が不足していたためと予想される。 On the other hand, as a comparative example, (C) component was not added (Comparative Example 1) and a silicon compound having no alkenyl group was added (Comparative Examples 2 and 3), but unlike the above-mentioned Examples, sufficient groups were used. Material adhesion could not be ensured. It is presumed that this is because the primer lacked a functional group capable of reacting with the components of the silicone pressure-sensitive adhesive.
なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 The present invention is not limited to the above embodiment. The above-described embodiment is an example, and any object having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect and effect is the present invention. Is included in the technical scope of.
Claims (7)
（Ｂ）１分子中に少なくとも３個のＳｉ−Ｈ基を有するオルガノハイドロジェンポリシロキサンを１〜２０質量部、
（Ｃ）アルケニル基含有有機基を含むケイ素化合物を５０〜３００質量部、及び
（Ｄ）ルイス酸触媒を０．１〜１０質量部
を含むものであることを特徴とするシリコーン粘着剤用プライマー組成物。 (A) 100 parts by mass of an organopolysiloxane represented by the following average composition formula (1).
(B) 1 to 20 parts by mass of an organohydrogenpolysiloxane having at least 3 Si—H groups in one molecule.
A primer composition for a silicone pressure-sensitive adhesive, which comprises (C) 50 to 300 parts by mass of a silicon compound containing an alkenyl group-containing organic group, and (D) 0.1 to 10 parts by mass of a Lewis acid catalyst.
Ｒ２ ｂ−Ｓｉ−（ＯＲ３）４−ｂ （２）
（式中、Ｒ２は独立にアルケニル基含有有機基であり、Ｒ３は独立に炭素数１〜５のアルキル基であり、ｂは１，２又は３である。）
で表されるケイ素化合物であることを特徴とする請求項１又は請求項２に記載のシリコーン粘着剤用プライマー組成物。 The component (C) is the following general formula (2)
R 2 b- Si- (OR 3 ) 4-b (2)
(In the formula, R 2 is an alkenyl group-containing organic group independently, R 3 is an alkyl group having 1 to 5 carbon atoms independently, and b is 1, 2 or 3).
The primer composition for a silicone pressure-sensitive adhesive according to claim 1 or 2, which is a silicon compound represented by.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229831A (en) * | 1975-09-01 | 1977-03-07 | Toray Silicone Co Ltd | Adhesive tape |
| JPS60115661A (en) * | 1983-11-28 | 1985-06-22 | Shin Etsu Chem Co Ltd | Primer composition |
| JPH0138149B2 (en) * | 1981-03-27 | 1989-08-11 | Toray Silicone Co | |
| JPH0328283A (en) * | 1989-06-26 | 1991-02-06 | Shin Etsu Chem Co Ltd | Self-adhesive tape |
| JPH073215A (en) * | 1993-06-18 | 1995-01-06 | Toray Dow Corning Silicone Co Ltd | Primer composition |
| JPH09208923A (en) * | 1995-11-28 | 1997-08-12 | Toray Dow Corning Silicone Co Ltd | Primer composition and bonding |
| JP2006506497A (en) * | 2002-11-20 | 2006-02-23 | ダウ・コ−ニング・コ−ポレ−ション | Silicone release coating |
| JP2012149240A (en) * | 2010-12-31 | 2012-08-09 | Dow Corning Toray Co Ltd | Primer composition for silicone adhesive, laminate, and silicone adhesive tape |
| JP2013112686A (en) * | 2011-11-25 | 2013-06-10 | Shin-Etsu Chemical Co Ltd | Condensation reaction curing type primer composition for silicone adhesive |
| JP2013139509A (en) * | 2011-12-29 | 2013-07-18 | Dow Corning Toray Co Ltd | Primer composition for silicone pressure-sensitive adhesive, laminate, and silicone pressure-sensitive adhesive tape |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5117713B1 (en) | 1970-12-14 | 1976-06-04 | ||
| JPS5444017A (en) | 1977-09-10 | 1979-04-07 | Nippon Paint Co Ltd | Repellent for aquatic adhesive life |
| JPS6011950A (en) | 1983-06-30 | 1985-01-22 | Fujitsu Ltd | Memory system of double structure |
| JP3189133B2 (en) | 1992-07-03 | 2001-07-16 | ニホンハンダ株式会社 | Cream solder |
-
2019
- 2019-10-08 JP JP2019184908A patent/JP7358174B2/en active Active
-
2020
- 2020-09-08 WO PCT/JP2020/033852 patent/WO2021070534A1/en active Application Filing
- 2020-09-08 CN CN202080069733.4A patent/CN114466911B/en active Active
- 2020-09-08 KR KR1020227010531A patent/KR20220076461A/en unknown
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5229831A (en) * | 1975-09-01 | 1977-03-07 | Toray Silicone Co Ltd | Adhesive tape |
| JPH0138149B2 (en) * | 1981-03-27 | 1989-08-11 | Toray Silicone Co | |
| JPS60115661A (en) * | 1983-11-28 | 1985-06-22 | Shin Etsu Chem Co Ltd | Primer composition |
| JPH0328283A (en) * | 1989-06-26 | 1991-02-06 | Shin Etsu Chem Co Ltd | Self-adhesive tape |
| JPH073215A (en) * | 1993-06-18 | 1995-01-06 | Toray Dow Corning Silicone Co Ltd | Primer composition |
| JPH09208923A (en) * | 1995-11-28 | 1997-08-12 | Toray Dow Corning Silicone Co Ltd | Primer composition and bonding |
| JP2006506497A (en) * | 2002-11-20 | 2006-02-23 | ダウ・コ−ニング・コ−ポレ−ション | Silicone release coating |
| JP2012149240A (en) * | 2010-12-31 | 2012-08-09 | Dow Corning Toray Co Ltd | Primer composition for silicone adhesive, laminate, and silicone adhesive tape |
| JP2013112686A (en) * | 2011-11-25 | 2013-06-10 | Shin-Etsu Chemical Co Ltd | Condensation reaction curing type primer composition for silicone adhesive |
| JP2013139509A (en) * | 2011-12-29 | 2013-07-18 | Dow Corning Toray Co Ltd | Primer composition for silicone pressure-sensitive adhesive, laminate, and silicone pressure-sensitive adhesive tape |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114466911B (en) | 2024-07-02 |
| CN114466911A (en) | 2022-05-10 |
| JP7358174B2 (en) | 2023-10-10 |
| WO2021070534A1 (en) | 2021-04-15 |
| TW202122531A (en) | 2021-06-16 |
| KR20220076461A (en) | 2022-06-08 |
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