JP2012209511A - Manufacturing method of light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that it is difficult to improve the bondability of a resin substrate, an electrode, and a reflection layer that form a light emitting device when these members are separately formed.SOLUTION: A manufacturing method of a light emitting device according to an embodiment of this invention includes: a process where a mold having a protruding part corresponding to a shape of a hole of a resin substrate is prepared; a process where metal members that will serve as an electrode and a reflection layer are disposed along a surface of the protruding part in the mold; a process where a resin substrate having a hole corresponding to the protruding part on upper surface is formed by filling a recessed part of the mold with a resin member; a process where the metal members and the resin substrate are removed from the mold; and a process where a light emitting element is disposed in the hole so as to connect with the electrode.

Description

  The present invention relates to a method for manufacturing a light emitting device including a light emitting element. The light-emitting device can be used for a lighting device. The lighting device can be suitably used as a light source for various lighting devices such as a backlight power source for an electronic display, a fluorescent lamp type, and a downlight.

  As a light-emitting device provided with a light-emitting element, for example, there is a light-emitting device described in Patent Document 1. The light emitting device described in Patent Document 1 is disposed on the surface of a resin substrate having a tapered through hole, a copper foil attached to the bottom surface of the through hole, and a horn portion formed by the through hole and the copper foil. And a LED element mounted on the conductive portion. In such a light emitting device, first, a tapered through hole is formed in a resin substrate by drilling. Next, a copper foil is adhered to the bottom surface of the through hole, and a conductive portion is formed on the surface of the horn portion by resin plating. A light emitting device is manufactured by mounting an LED element on the conductive portion.

JP-A-11-284233

  2. Description of the Related Art In recent years, with the improvement of luminous efficiency of light emitting devices, more heat than conventional has been generated from light emitting elements (LED elements). In order to efficiently release this heat to the outside, a metal layer formed by metal plating is used as a conductive portion disposed on the inner peripheral surface of the through hole of the resin substrate. This metal layer and copper foil (electrode member) It is required to increase the thickness.

  On the other hand, when a metal layer by metal plating is used, it is difficult to increase the thickness while maintaining the flatness of the surface. By using separately formed metal layers and electrode members, these thicknesses can be increased. However, when the metal layer and the electrode member separately formed as described above are attached to the resin substrate, an additional adhesive is required. In addition, since inevitable variation occurs in the dimensions between the surface shape of the resin substrate, the metal layer, and the electrode member, there arises a problem that it is difficult to improve the bonding property of these members.

  The present invention has been made in view of such a conventional technique, and is capable of improving the bondability between the metal layer and the electrode member and the resin substrate while increasing the thickness of the metal layer and the electrode member. An object is to provide a method for manufacturing a device.

  A method for manufacturing a light-emitting device according to one embodiment of the present invention includes a resin substrate having a hole portion formed of a depression or a through hole on an upper surface, an electrode and a reflective layer provided on an inner surface of the hole portion, and the electrode connected to the electrode. A method of manufacturing a light emitting device including a light emitting element disposed in the hole portion, and a step of preparing a mold having a concave portion and a convex portion corresponding to the shape of the hole portion inside the concave portion; A step of disposing the metal member to be the electrode and the reflective layer in the mold along the surface of the convex portion, and filling the concave portion of the mold with a resin member, thereby forming the convex portion on the upper surface. Forming the resin substrate having the corresponding hole, removing the metal member and the resin substrate from the mold, and disposing the light emitting element in the hole so as to be connected to the electrode. Specially provided It is set to.

  In the method for manufacturing a light emitting device based on the above aspect, the electrodes and the reflective layer are not formed by being attached to a resin substrate by metal plating, but are separately formed. The thickness can be increased. In addition, a metal member to be an electrode and a reflection layer is disposed in the mold along the surface of the convex portion, and a hole corresponding to the convex portion is formed on the upper surface by filling the concave portion of the mold with a resin member. Since the step of forming the resin substrate is provided, the bondability between the metal member and the resin substrate can be improved.

It is a perspective sectional view showing the light emitting device of a 1st embodiment. (A) is sectional drawing which shows process (1) in the manufacturing method of the light-emitting device of 1st Embodiment. FIG. 2B is a plan view of the step shown in FIG. 2A (a). (A) is sectional drawing which shows the process (2) in the manufacturing method of the light-emitting device of 1st Embodiment. FIG. 2B is a plan view of the process shown in FIG. (A) is sectional drawing which shows the process (3) in the manufacturing method of the light-emitting device of 1st Embodiment. FIG. 2B is a plan view of the step shown in FIG. 2C (a). (A) is sectional drawing which shows the process (4) in the manufacturing method of the light-emitting device of 1st Embodiment. FIG. 2B is a plan view of the process shown in FIG. 2D (a). (A) is sectional drawing which shows the process (5) in the manufacturing method of the light-emitting device of 1st Embodiment. FIG. 2B is a plan view of the step shown in FIG. It is sectional drawing which shows 1 process in the manufacturing method of the light-emitting device of 1st Embodiment. It is a perspective sectional view showing the modification of the light emitting device of the first embodiment. It is a perspective sectional view showing a light emitting device of a second embodiment. (A) is sectional drawing which shows the process (2) in the manufacturing method of the light-emitting device of 2nd Embodiment. FIG. 5B is a plan view of the process shown in FIG. 5A (a). (A) is sectional drawing which shows the process (3) in the manufacturing method of the light-emitting device of 2nd Embodiment. FIG. 5B is a plan view of the step shown in FIG. (A) is sectional drawing which shows the process (2) in the modification of the manufacturing method of the light-emitting device of 2nd Embodiment. FIG. 6B is a plan view of the step shown in FIG. (A) is sectional drawing which shows the process (3) in the modification of the manufacturing method of the light-emitting device of 2nd Embodiment. FIG. 6B is a plan view of the step shown in FIG. (A) is sectional drawing which shows the process (4) in the modification of the manufacturing method of the light-emitting device of 2nd Embodiment. FIG. 6B is a plan view of the step shown in FIG.

  Hereinafter, the light emitting device of each embodiment and the manufacturing method thereof will be described in detail with reference to the drawings. However, in the drawings referred to below, for the convenience of explanation, among the members constituting the following embodiments, only the main members necessary for explaining the characteristic configuration are shown in a simplified manner. Therefore, the light emitting device of each embodiment may include an arbitrary constituent member that is not shown in each drawing referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

As shown in FIG. 1, the light emitting device 1 according to the first embodiment includes a resin substrate 5 having a hole 3 made of a depression or a through hole on the upper surface, an electrode 7 disposed on the inner surface of the hole 3, and a reflective layer. 9 and a light emitting element 11 disposed in the hole 3 so as to be connected to the electrode 7. And the manufacturing method of the light-emitting device 1 concerning this embodiment is equipped with the following process. That is, as shown in FIGS.
(1) preparing a mold 13 having a recess 13a and a protrusion 13b corresponding to the shape of the hole 3 inside the recess 13a;
(2) a step of disposing the metal member 15 to be the electrode 7 and the reflective layer 9 in the mold 13 along the surface of the convex portion 13b;
(3) Forming the resin substrate 5 having the hole 3 corresponding to the protrusion 13b on the upper surface by filling the resin member 17 in the mold 13;
(4) a step of removing the metal member 15 and the resin member 17 from the mold 13;
(5) A step of disposing the light emitting element 11 in the hole 3 so as to be connected to the electrode 7.

  Thus, according to the manufacturing method of the light emitting device 1 of the first embodiment, the electrode 7 and the reflective layer 9 are not attached and formed on the resin substrate 5 by metal plating, but as the electrode 7 and the reflective layer 9. Since a separately formed material is used, the thickness of the electrode 7 and the reflective layer 9 can be increased. Further, the metal member 15 to be the electrode 7 and the reflective layer 9 is disposed in the mold 13 along the surface of the convex portion 13b, and the concave portion 13a of the mold 13 is filled with the resin member 17, thereby projecting to the upper surface. Since the step of forming the resin substrate 5 having the hole portion 3 corresponding to the portion 13b is provided, the bondability between the metal member 15 and the resin substrate 5 can be improved.

  This is because when the resin substrate 5, the reflective layer 9 and the electrode 7 are separately produced, dimensional variations unavoidable in the manufacturing process occur between the resin substrate 5, the reflective layer 9 and the electrode 7. Due to the above-described variation, when these members are separately manufactured and then joined using, for example, an adhesive, a gap is likely to be generated between these members. Therefore, when the light emitting element 11 generates more heat than the conventional light emitting element 11, it becomes difficult to improve the bondability between the metal member 15 and the resin substrate 5.

  On the other hand, in the method for manufacturing the light emitting device 1 of the present embodiment, the resin substrate 5, the reflective layer 9, and the electrode 7 are not separately prepared, but (2) the metal member 15 that becomes the electrode 7 and the reflective layer 9 is convex. A step of disposing in the mold 13 along the surface of the portion 13b, and (3) filling the concave portion 13a of the mold 13 with the resin member 17 so that the upper surface has the hole 3 corresponding to the convex portion 13b. The resin substrate 5 is produced by the process of forming 5. Therefore, it is possible to reduce the possibility that a gap is generated between the metal member 15 serving as the electrode 7 and the reflective layer 9 and the resin substrate 5 and to improve the adhesion between these members. Therefore, the bondability between the metal member 15 and the resin substrate 5 can be improved.

  Further, by filling the concave portion 13a of the mold 13 with the resin member 17, the resin substrate 5 having the hole 3 corresponding to the convex portion 13b is formed on the upper surface, and this resin substrate 5 is used as the electrode 7 and the reflective layer 9. Since it is directly bonded, it is not necessary to use a separate adhesive. Therefore, the cost required for manufacturing the light emitting device 1 can be suppressed and the manufacturing process can be simplified.

  Hereinafter, each process is demonstrated in detail about the manufacturing method of the light-emitting device 1 of this embodiment.

(1) Step of Preparing Mold 13 Having Protrusions 13b Corresponding to the Shape of Hole 3 The resin substrate 5 in the light emitting device 1 of the present embodiment has an inner peripheral surface as a light reflecting surface and a light emitting device inside. 1 has a hole 3 in which 1 is disposed. As shown in FIG. 1, the hole portion 3 may be a recess opened on the upper surface of the resin substrate 5, and as shown in FIG. There may be.

Therefore, first, a mold 13 having a convex portion 13b corresponding to the shape of the hole 3 formed in the resin substrate 5 is prepared. As shown in FIG. 2A, the mold 13 in the method for manufacturing the light emitting device 1 of the present embodiment has a recess 13 a that is filled with a resin member 17 for forming the resin substrate 5. A convex portion 13b having a shape corresponding to the shape of the hole 3 is formed on the bottom surface of the concave portion 13a. The convex portion 13 b is for forming the hole portion 3 in the resin substrate 5 and has a shape corresponding to the shape of the hole portion 3.

  As the mold 13, a mold using the metal member 15 may be prepared. In addition, the process which arrange | positions the metal member 15 used as the electrode 7 and the reflection layer 9 mentioned later in the type | mold 13 along the surface of the convex part 13b, and the resin member 17 is filled into the recessed part 13a of the type | mold 13; What is limited to the metal member 15 in particular is that the mold 13 should be durable enough to perform the process of forming the resin substrate 5 having the hole 3 corresponding to the convex portion 13b on the upper surface. is not. That is, for example, the resin member 17 may be used as the mold 13 without any problem.

  In the method for manufacturing the light emitting device 1 according to the present embodiment, as will be described later, the resin substrate 5 formed by filling the mold 13 is turned upside down after being taken out of the mold 13 to thereby turn the light emitting device 1. Used for. Therefore, the vertical direction of the upper surface and the lower surface of the resin substrate 5 and the vertical direction of the mold 13 are reversed.

  What is necessary is just to set the magnitude | size of the type | mold 13 according to the magnitude | size of the light-emitting device 1 to produce. For example, when the size of the resin substrate 5 is 5 mm × 5 mm × 3 mm, the concave portion 13a having a size of the concave portion 13a of the mold 13 when viewed in plan is 5 mm square and 3 mm deep is formed. That's fine. At this time, when a through-hole is formed as the hole portion 3, the height of the convex portion 13b is set to 3 mm or more larger than the depth of the concave portion 13a so that the convex portion 13b protrudes from the concave portion 13a of the mold 13. do it.

(2) Step of disposing the metal member 15 to be the electrode 7 and the reflective layer 9 in the mold 13 along the surface of the convex portion 13b Next, as shown in FIG. 2B, the metal to be the electrode 7 and the reflective layer 9 The member 15 is disposed in the mold 13 along the surface of the convex portion 13b. As a method of disposing the metal member 15 in the mold 13, the metal member 15 that has been formed in advance along the surface of the convex portion 13 b may be disposed in the mold 13. Further, the metal member 15 may be disposed along the surface of the convex portion 13b by disposing the flat metal member 15 on the mold 13 and pressing it into the mold 13 using a press. .

  In the method for manufacturing the light emitting device 1 of the present embodiment, the electrode 7 and the reflective layer 9 are used as the metal member 15. The electrode 7 is electrically connected to the light emitting element 11. The light emitting element 11 is energized from an external power source (not shown) through the electrode 7. The reflective layer 9 constituting the metal member 15 is disposed at least on the inner peripheral surface of the hole 3 of the resin substrate 5 as the light emitting device 1, and plays a role of radiating outside by reflecting the radiated light from the light emitting element 11. have. Such a reflective layer 9 can be disposed on the inner peripheral surface of the hole 3 as the light emitting device 1 by being disposed in the mold 13 along the surface of the convex portion 13b.

  Further, in the method for manufacturing the light emitting device 1 according to the present embodiment, since the metal member 15 may be disposed in the mold 13 along the surface of the convex portion 13b, both the electrode 7 and the reflective layer 9 are not necessarily convex. It does not mean that it is disposed in the mold 13 along the surface of the portion 13b. For example, the metal member 15 to be the reflective layer 9 is disposed in the mold 13 along the surface of the convex portion 13 b, while the metal member 15 to be the electrode 7 is a portion excluding the surface of the convex portion 13 b on the surface of the mold 13. It may be arranged.

  In the method for manufacturing the light emitting device 1 according to the present embodiment, the metal member 15 disposed along the surface of the convex portion 13b in the mold 13 is electrically connected to the light emitting element 11 as the electrode 7. Among the metal members 15 disposed along the surface of the convex portion 13 b in the mold 13, the metal layer 15 that is not electrically connected to the light emitting element 11 is used as the reflective layer 9. Therefore, there is no problem even if the electrode 7 is a member that can favorably reflect light from the light emitting element 11.

  As the metal member 15, for example, a metal material such as W, Mo, Ni, Al, Ag, Au, Pt, Ti, Cr, or Cu can be used. In particular, it is preferable to use W, Mo, Ni, Ag, Au or Cu having good conductivity as the metal member 15 to be the electrode 7. Further, as the metal member 15 to be the reflective layer 9, it is preferable to use a metal material such as Al, Ag, Au, Pt, Ti, Cr or Cu having high reflectivity.

  It is preferable that the metal member 15 has a larger surface roughness on the surface facing the resin member 17 filled in the process described later than the surface roughness on the surface facing the convex portion 13 b of the mold 13. Since the surface facing the convex portion 13b of the mold 13 is a reflective surface that reflects the light emitted from the light emitting element 11, it is preferable that the surface roughness is small. On the contrary, the surface facing the resin member 17 can have a large joint surface with the resin due to the large surface roughness, and the unevenness of the surface of the metal member 15 acts as a wedge with respect to the resin member 17. This is because the bonding strength between the resin substrate 5 and the metal member 15 can be increased mechanically.

  As the metal member 15 to be the electrode 7 and the metal member 15 to be the reflective layer 9, separate metal members 15 are prepared, and the respective metal members 15 are arranged in the mold 13 along the surface of the convex portion 13b. However, as shown in FIG. 2B, the electrode 7 and the reflective layer 9 are integrally formed via the lead frame 19, and the integrally formed metal member 15 is formed on the protrusion 13b. It is preferable to arrange in the mold 13 along the surface.

  By using the metal member 15 in which the electrode 7 and the reflective layer 9 are integrally formed, when the electrode 7 and the reflective layer 9 are disposed in the mold 13, the relative relationship between the electrode 7 and the reflective layer 9 is This is because it is possible to reduce the possibility that a general positional deviation will occur. Therefore, the possibility that the electrode 7 and the reflective layer 9 are in contact with each other to cause an electrical short circuit can be reduced. When the metal member 15 in which the electrode 7 and the reflective layer 9 are integrally formed is used, the metal member 15 is a metal material such as Ag, Au, or Cu having good conductivity and good light reflectivity. Is preferably used.

  Further, in order to reflect light from the light emitting element 11 well and increase the amount of radiation to the outside, a metal material such as Ag, Au or Cu may be used as the metal member 15 as described above. Alternatively, a layer made of a metal material such as Ag, Au, or Cu may be separately formed on the surface of the metal member 15. Such a layer can be produced by printing a metal paste made of the above-mentioned metal material on the surface of the metal member 15 or forming a plating made of the above-mentioned metal material.

(3) Step of Forming Resin Substrate 5 Having Hole 3 Corresponding to Protrusion 13b on the Top Surface by Filling Resin 17 in Recess 13a of Mold 13 Next, as shown in FIG. By filling the recess 13a with the resin member 17, the resin substrate 5 having the hole 3 corresponding to the protrusion 13b on the upper surface is formed. As the resin member 17 constituting the resin substrate 5, for example, an epoxy resin or a silicone resin can be used. The resin substrate 5 can be manufactured by filling the recess 13a of the mold 13 with the uncured resin member 17 and curing the filled resin member 17.

  In the case where a recess opening on the upper surface of the resin substrate 5 is formed as the hole portion 3 of the resin substrate 5, the resin member 17 may be filled up to a position higher than the upper end surface of the convex portion 13b. As a result, a recess opening on the upper surface can be formed in the resin substrate 5. Moreover, when forming the through-hole which opens to the upper surface and lower surface of the resin substrate 5 as the hole part 3 which the resin substrate 5 has, the resin member 17 should just be filled to a position lower than the upper end surface of the convex part 13b. . As a result, through holes that open to the upper surface and the lower surface can be formed in the resin substrate 5.

In the method for manufacturing the light emitting device 1 of the present embodiment, the resin substrate 5 separately formed is not bonded to the metal member 15, but the uncured resin member 17 is filled in the mold 13, and the filled resin member The resin member 17 is bonded to the metal member 15 when the 17 is cured. When the separately formed resin substrate 5 is bonded to the metal member 15, a gap is likely to be generated between the resin substrate 5 and the metal member 15 as described above.

  However, in the method for manufacturing the light emitting device 1 according to the present embodiment, the resin member 17 is uncured when the resin member 17 is filled in the recess 13 a of the mold 13, so that it follows the surface shape of the metal member 15. The resin member 17 is filled. Therefore, the possibility that a gap is generated between the resin substrate 5 and the metal member 15 can be reduced. Accordingly, it is possible to improve the bondability between the metal member 15 and the resin substrate 5.

(4) Step of Removing Metal Member 15 and Resin Substrate 5 from Mold 13 As shown in FIG. 2D, the metal member 15 and resin substrate 5 formed by the above-described steps are removed from the die 13. By turning up and down the metal member 15 and the resin substrate 5 taken out, it is possible to obtain a light emitting element storage package used in the light emitting device 1.

  At this time, as for the convex part 13b of the type | mold 13, when the cross section is seen, it is preferable that the width | variety L1 in an upper end is smaller than the width | variety L2 in a lower end. This is because the metal member 15 and the resin substrate 5 can be easily taken out from the mold 13. Further, in the case where the convex portion 13b of the frame body has the above shape, the inner peripheral surface of the hole portion 3 of the frame body is such that the inner peripheral diameter on the upper end side is larger than the inner peripheral diameter on the lower end side. Can be in an inclined shape. As a result, light emitted from the light emitting element 11 can be easily emitted from the upper surface side of the resin substrate 5 to the outside, so that the light emission amount of the light emitting device 1 can be increased.

  When the electrode 7 and the reflective layer 9 are formed integrally with the lead frame 19, the lead frame 19 is broken after the metal member 15 and the resin substrate 5 are taken out from the mold 13. Thus, the electrode 7 and the reflective layer 9 may be electrically separated.

(5) Step of disposing the light emitting element 11 in the hole 3 so as to be connected to the electrode 7 As shown in FIG. 2E, in the hole 3 of the resin substrate 5 taken out from the mold 13 by the above steps. The light emitting element 11 is disposed so as to be connected to the electrode 7. Specifically, for example, when the electrode 7 is disposed on the bottom surface of the hole portion 3, the light emitting element 11 and the electrode 7 are electrically connected by flip-chip mounting the light emitting element 11 on the electrode 7. Can be connected. In addition, the electrical connection between the light emitting element 11 and the electrode 7 is not limited to flip chip mounting, and for example, the light emitting element 11 and the electrode 7 may be connected by wire bonding via a metal wire. In addition, when connecting the light emitting element 11 and the electrode 7 by wire bonding connection, in order to suppress an electrical short circuit between the light emitting element 11 and the reflective layer 9, an insulating plate is provided between the light emitting element 11 and the reflective layer 9. Is preferably disposed.

  When a through hole is formed as the hole 3, the electrode 7 is disposed in the opening on the lower surface side of the through hole, and light is emitted on the electrode 7 disposed in the opening on the lower surface side. The element 11 may be provided. Alternatively, when a through hole is formed as the hole 3, a mounting substrate is separately disposed on the lower surface of the resin substrate 5 so as to close the opening on the lower surface side of the through hole, and light is emitted on the mounting substrate. The element 11 may be mounted.

  As the light-emitting element 11, an element that can generate light with driving power may be used. For example, a light emitting diode made of a semiconductor material can be used. Specifically, a light emitting diode mainly composed of GaAs, GaN, or AlN can be used.

  Through the above steps, the light emitting device 1 based on the method for manufacturing the light emitting device 1 of the present embodiment can be manufactured.

  The light emitting device 1 according to the present embodiment further includes a translucent sealing resin 21 that is positioned in the hole 3 of the resin substrate 5 and covers the light emitting element 11. Such a sealing resin 21 has a function of suppressing the light emitting element 11 from being deteriorated by touching the outside air, and absorbing the heat caused by the light emitted from the light emitting element 11 and diffusing the heat in the sealing resin 21. ing.

  As the sealing resin 21, for example, a translucent insulating resin such as a silicone resin, an acrylic resin, and an epoxy resin is used. The thermal conductivity of the sealing resin 21 is set to, for example, 0.14 W / (m · K) or more and 0.21 W / (m · K) or less. The sealing resin 21 in the present embodiment has a flat top surface, but is not limited to this. For example, the upper surface may be a spherical curved surface.

  In the case where the electrode 7 and the reflective layer 9 are integrally formed through the lead frame 19, the electrode 7, the reflective layer 9 and the light emitting element 11 are covered with the sealing resin 21, It is preferable to electrically separate the electrode 7 and the reflective layer 9 by breaking the lead frame 19. When the lead frame 19 is broken, a force is applied to the electrode 7 and the reflective layer 9, so that the electrode 7 or the reflective layer 9 may be peeled off from the resin substrate 5. However, if the electrode 7, the reflective layer 9, and the light emitting element 11 are covered with the sealing resin 21, these members are sandwiched between the resin substrate 5 and the sealing resin 21. This is because the possibility of peeling from the resin substrate 5 can be further reduced.

  The light emitting device 1 of the present embodiment further includes a wavelength conversion member 23 disposed on the sealing resin 21 and disposed so as to cover the sealing resin 21. The wavelength conversion member 23 emits light when the light emitted from the light emitting element 11 enters the inside and the phosphor contained therein is excited.

  The wavelength conversion member 23 is made of, for example, a silicone resin, an acrylic resin, or an epoxy resin. In the resin, for example, a blue phosphor that emits fluorescence of 430 nm to 490 nm, for example, a green phosphor that emits fluorescence of 500 nm to 560 nm, for example, A yellow phosphor that emits fluorescence of 540 to 600 nm, for example, a red phosphor that emits fluorescence of 590 to 700 nm is contained.

  The phosphor is uniformly dispersed in the wavelength conversion member 23. The thermal conductivity of the wavelength conversion member 23 is set to, for example, 0.10 W / (m · K) or more and 0.30 W / (m · K) or less. Further, the thickness of the wavelength conversion member 23 is set, for example, such that the thickest portion is 5 mm or less and the thinnest portion is 0.1 mm or more.

  The wavelength conversion member 23 can be obtained by mixing a phosphor with an uncured resin, filling the mold 13 with the uncured wavelength conversion member 23, curing it, and taking it out. The wavelength conversion member 23 produced by the above method is bonded onto the sealing resin 21 with an adhesive. Then, the wavelength conversion member 23 can be adhere | attached on the sealing resin 21 or the resin substrate 5 via an adhesive agent by hardening an adhesive agent.

  Note that the light emitting device 1 of the present embodiment is located on the hole 3 of the resin substrate 5 and covers the light emitting element 11 and is placed on the sealing resin 21 and sealed. Although the wavelength conversion member 23 arrange | positioned so that the resin 21 may be coat | covered is further provided, it is not restricted to this. For example, the sealing resin 21 may be used as the wavelength conversion member by including the phosphor contained in the wavelength conversion member 23 in the sealing resin 21. Moreover, even if the light emitting element 11 is sealed without using the sealing resin 21, a sealed space is formed between the resin substrate 5 and the wavelength converting member 23 by bonding the wavelength converting member 23 to the resin substrate 5. Good.

  Further, the light emitting device 1 of the present embodiment includes a heat radiating member (first heat radiating member 25) bonded to the lower surface of the resin substrate 5. The first heat radiating member 25 is located below the resin substrate 5. The first heat radiating member 25 includes a flat plate-shaped portion 25 a that is in contact with the lower surface of the resin substrate 5 and a plurality of fins 25 b located on the lower surface side of the portion 25 a. After the plate-shaped portion 25a and the plurality of fins 25b are separately manufactured, the fins 25b may be joined to the lower surface of the plate-shaped portion 25a. Further, the flat plate-shaped portion 25a and the plurality of fins 25b may be integrally formed.

  The thickness of the plate-shaped portion 25a can be set to 1 mm to 5 mm, for example. Further, the length of the plurality of fins 25b in the direction perpendicular to the upper surface of the resin substrate 5 can be set to 3 mm to 50 mm, for example. By providing the first heat radiating member 25 as described above, the heat generated from the light emitting element 11 can be efficiently radiated to the outside through the first heat radiating member 25.

  In addition, such a first heat radiating member 25 may be joined to the lower surface of the resin substrate 5 after the above-described (4) step of taking out the metal member 15 and the resin member 17 from the mold 13, but (3) In the step of forming the resin substrate 5 having the hole 3 corresponding to the convex portion 13b on the upper surface by filling the concave portion 13a of the mold 13 with the resin member 17, after filling the concave portion 13a of the mold 13 with the resin member 17 The first heat radiating member 25 is preferably bonded to the resin substrate 5 by disposing the first heat radiating member 25 on the resin member 17 that is the lower surface of the resin substrate 5. This is because the first heat radiating member 25 can be satisfactorily bonded to the resin substrate 5 without using an adhesive separately.

  Next, the light emitting device 1 of the second embodiment and the manufacturing method thereof will be described in detail with reference to the drawings. In addition, in each structure concerning this embodiment, about the structure which has the same function as 1st Embodiment, the same referential mark is attached and the detailed description is abbreviate | omitted.

  In the light emitting device 1 of the present embodiment, as shown in FIG. 4, the second heat radiating member made of metal joined to the lower surface of the metal member 15 and overlapped with the light emitting element 11 when seen in a plan view. 27 is further provided. The second heat radiating member 27 made of metal and having good thermal conductivity is joined to the lower surface of the metal member 15 at the above-described position, so that heat generated from the light emitting element 11 is transferred to the lower surface of the light emitting device 1. The heat can be efficiently radiated to the side.

  Such a second heat dissipating member 27 is arranged along the surface of the convex portion 13b with the electrode 7 and the metal member 15 to be the reflective layer 9 in the step (2) shown in the method for manufacturing the light emitting device 1 of the first embodiment. Instead of the step of placing in the mold 13, this step (2) may be joined to the lower surface of the metal member 15 (the upper surface of the metal member 15 in FIG. 5A).

  The second heat dissipation member 27 is preferably exposed on the lower surface of the resin substrate 5 in order to efficiently dissipate the heat generated from the light emitting element 11 to the lower surface side of the light emitting device 1. Thus, in order to form the 2nd heat radiating member 27, it fills the resin member 17 in the recessed part 13a of the type | mold 13 which is the process (3) shown to the manufacturing method of the light-emitting device 1 of 1st Embodiment. Thus, instead of the step of forming the resin substrate 5 having the hole 3 corresponding to the convex portion 13b on the upper surface, the lower surface (the upper surface in FIG. 5B) of the second heat radiating member 27 is exposed as this step (3). The amount of the resin member 17 is adjusted so that the resin member 17 is filled in the mold 13.

Specifically, when the second heat radiating member 27 is disposed in the mold 13, up to a position that becomes the height position of the second heat radiating member 27 (the lower surface of the second heat radiating member 27 in FIG. 5B). The mold 13 may be filled with the resin member 17 and the resin member 17 may be cured. Thereby, the second heat radiating member 27 can be exposed on the lower surface of the resin substrate 5. Then, the light-emitting device 1 of this embodiment can be produced by passing through the process similar to process (4) and (5) shown to the manufacturing method of the light-emitting device 1 of 1st Embodiment.

  Moreover, the 2nd heat radiating member 27 can be joined to the lower surface of the metal member 15 also by the process shown to FIG. Specifically, instead of the step (2) shown in the method for manufacturing the light emitting device 1 of the first embodiment, as the step (2), as shown in FIG. It joins to the lower surface (in FIG. 6A, the upper surface of the metal member 15 where the metal member 15 is disposed). Then, as shown in FIG. 6B, instead of the step (3) shown in the method for manufacturing the light emitting device 1 of the first embodiment, the resin member 17 is filled in the mold 13 as this step (3). The resin substrate 5 having the hole 3 corresponding to the convex portion 13b is formed on the upper surface.

  Further, instead of the step (4) shown in the method for manufacturing the light emitting device 1 of the first embodiment, the metal member 15 and the resin member 17 are taken out from the mold 13 as this step (4). At this time, as shown in FIG. 6C, the second mold 29 is removed from the lower surface of the metal member 15. Then, the second heat radiating member 27 is disposed in the cavity formed by removing the second mold 29. Also by the above steps, the second heat radiating member 27 can be joined to the lower surface of the metal member 15 at a position overlapping the light emitting element 11 when viewed in plan.

  As described above, the light emitting device and the manufacturing method thereof according to each embodiment have been described, but the present invention is not limited to the above embodiment. In other words, various modifications and combinations of embodiments can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Light-emitting device 3 ... Hole part 5 ... Resin substrate 7 ... Electrode 9 ... Reflective layer 11 ... Light emitting element 13 ... Mold 13a ... Concave part 13b ... Convex Part 15 ... Metal member 17 ... Resin member 19 ... Lead frame 21 ... Sealing resin 23 ... Wavelength conversion member 25 ... First heat radiation member 25a ... Flat plate shape Part 25b ... Fin 27 ... Second heat dissipation member 29 ... Second mold

Claims (5)

A resin substrate having a hole portion formed of a depression or a through hole on the upper surface, an electrode and a reflective layer disposed on the inner surface of the hole portion, and a light emitting element disposed in the hole portion so as to be connected to the electrode A method for manufacturing a light emitting device comprising:
A step of preparing a mold having a concave portion and a convex portion corresponding to the shape of the hole portion inside the concave portion, and arranging a metal member to be the electrode and the reflective layer in the mold along the surface of the convex portion. A process of installing,
Forming the resin substrate having the hole portion corresponding to the convex portion on an upper surface by filling the concave portion of the mold with a resin member;
Removing the metal member and the resin substrate from the mold;
And a step of disposing a light emitting element in the hole so as to be connected to the electrode.   The method for manufacturing a light emitting device according to claim 1, wherein the surface roughness of the surface facing the resin member is made larger than the surface roughness of the surface facing the convex portion of the metal member.   The method for manufacturing a light emitting device according to claim 1, wherein the metal member has a shape in which the electrode and the reflective layer are integrally formed via a lead frame.   The method of manufacturing a light emitting device according to claim 3, wherein the electrode and the reflective layer are electrically separated by breaking the lead frame after the step of forming the resin substrate. In the step of forming the resin substrate, a heat radiating member made of metal is disposed on the resin member serving as a lower surface of the resin substrate after the recess is filled with the resin member. Item 2. A method for manufacturing a light emitting device according to Item 1.

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