JP2010098052A - Laminated feedthrough capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated feedthrough capacitor having excellent frequency characteristics at a high frequency. <P>SOLUTION: The laminated feedthrough capacitor 1 is provided with a capacitor element body 2, a pair of signal terminals 3, and a pair of ground terminals 4. The capacitor element body 2 includes a plurality of dielectric layers 9, a plurality of first electrode layers X consecutively laminated while holding the dielectric layer 9 in-between, and a second electrode layer Y laminated while holding the dielectric layer 9 in-between with the plurality of first electrode layers X. The first electrode layer X includes a signal electrode 6 which penetrates the capacitor element body 2 and is connected with a pair of signal terminals 3 and an auxiliary electrode 8 which is disposed separately from the signal electrode 6 in the first electrode X and connected with one of a pair of ground terminals 4. The second electrode layer Y includes a ground electrode 7 which penetrates the capacitor element body 2, is connected with the pair of ground terminals 4 and faces the signal electrode 6 across the dielectric layer 9. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a multilayer feedthrough capacitor.

Patent Document 1 below discloses a multilayer feedthrough capacitor. The multilayer feedthrough capacitor includes first and second feedthrough electrodes that are alternately laminated with a dielectric layer in between in a capacitor body. Each of the first and second through electrodes penetrates from one of the pair of side surfaces facing each other in the capacitor body to the other. The terminal electrode is formed on the side surface of the capacitor body and is electrically connected to the first or second through electrode exposed on the side surface.
Japanese Patent Laid-Open No. 01-206615

  The multilayer feedthrough capacitor described in Patent Document 1 has a frequency characteristic that decreases on the high frequency side.

  Therefore, an object of the present invention is to provide a multilayer feedthrough capacitor having better frequency characteristics at high frequencies.

  The multilayer feedthrough capacitor of the present invention includes a capacitor body, a pair of first terminal electrodes and a pair of second terminal electrodes formed on the surface of the capacitor body, and the capacitor body includes a plurality of dielectrics. A body layer, a plurality of first electrode layers stacked sequentially with a dielectric layer in between, and an outermost first electrode layer and a dielectric layer sandwiched between the plurality of first electrode layers A first electrode layer penetrating the capacitor element body and connected to the pair of first terminal electrodes, and the first electrode layer, And an auxiliary electrode that is disposed apart from the first through electrode and connected to one of the pair of second terminal electrodes. The second electrode layer is a capacitor element body. And a second through electrode connected to the pair of second terminal electrodes and facing the first through electrode with the dielectric layer interposed therebetween. It characterized in that it has an electrode.

  In the multilayer feedthrough capacitor of the present invention, a capacitance is generated between the first through electrode and the second through electrode. Further, the first through electrode electrically connected to the first terminal electrode and the auxiliary electrode electrically connected to the second terminal electrode are formed in the same layer, and this layer is a dielectric layer. It is laminated continuously. For this reason, the end portions of the plurality of first through electrodes and the end portions of the plurality of auxiliary electrodes face each other, and capacitance is generated. Therefore, the capacitance formed by the first through electrode and the second through electrode and the capacitance formed by the plurality of first through electrodes and the plurality of auxiliary electrodes are combined, The frequency characteristics at high frequency can be improved.

  Preferably, the capacitor element body has a first pair of surfaces opposed to each other and a second pair of surfaces perpendicular to the first pair of surfaces and opposed to each other, The first through hole extends from one of the pair of surfaces to the other, the second through electrode extends from one of the second pair of surfaces to the other, and the auxiliary electrode is formed in each first electrode layer. Including one auxiliary electrode disposed on one surface side of the second pair of surfaces and the other auxiliary electrode disposed on the other surface side with the one through electrode interposed therebetween, the second through electrode And the one auxiliary electrode are exposed to one surface of the second pair of surfaces and the first region on one surface side of the second pair of surfaces of the first pair of surfaces, respectively. The through electrode and the other auxiliary electrode are the other surface of the second pair of surfaces of the second pair of surfaces and the first pair of surfaces, respectively. One of the pair of second terminal electrodes exposed to the second region is formed to cover one surface of the second pair of surfaces and the first region, and the pair of second terminal electrodes Is formed so as to cover the other surface of the second pair of surfaces and the second region.

  In this case, more of the second through electrode and the auxiliary electrode can be exposed in the region where the second terminal electrode is formed on the surface of the capacitor body. Further, the second terminal electrode has higher adhesion to the second through electrode and the auxiliary electrode than the dielectric layer constituting the capacitor body. For this reason, the adhesion between the capacitor element body and the second terminal electrode can be improved. Furthermore, in this case, since the first through electrode is a signal electrode and the second through electrode is a ground electrode, a connection portion between the second through electrode and the second terminal electrode becomes wide. ESL can be lowered.

  It is also preferable that the dimension in the facing direction of the first pair of surfaces of the second terminal electrode is larger than the dimension in the facing direction of the second pair of surfaces of the first terminal electrode.

  In this case, the width in the facing direction of the first pair of surfaces of the auxiliary electrode connected to the second terminal electrode can be set wider. For this reason, the end surface of the auxiliary electrode facing the end surface of the first through electrode can be set wide, and the capacitance generated by the first through electrode and the auxiliary electrode can be further increased. . Furthermore, in this case, the connection portion between the second through electrode and the second terminal electrode can be set wide. Therefore, ESL can be lowered by using the first through electrode as a signal electrode and the second through electrode as a ground electrode.

  The opposing dimension of the second pair of surfaces of the first terminal electrode is larger than the opposing dimension of the first pair of surfaces of the second terminal electrode, and the first through electrode is a ground electrode, It is also preferable that the second through electrode is a signal electrode. In this case, the connection portion between the first through electrode and the first terminal electrode can be set wide, and the first through electrode is used as the ground electrode, so that the ESL can be lowered.

  The multilayer feedthrough capacitor of the present invention can exhibit better frequency characteristics at high frequencies.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and duplicate descriptions are omitted.

(First embodiment)
FIG. 1 is a schematic perspective view of the multilayer feedthrough capacitor according to the first embodiment. The multilayer feedthrough capacitor 1 according to the first embodiment includes a capacitor element body 2, a pair of signal terminals (first terminal electrodes) 3 and 3 formed on the surface of the capacitor element body 2, and a pair of ground terminals (first elements). 2 terminal electrodes) 4 and 4. Capacitor body 2 has a substantially rectangular parallelepiped shape, and faces short side surfaces (second pair of surfaces) 2a and 2a facing each other and long side surfaces (first pair of surfaces) 2b and 2b facing each other. It has main surfaces 2c and 2c. The short side surface 2 a is a surface perpendicular to the longitudinal direction of the capacitor body 2.

  The signal terminals 3 and 3 and the ground terminals 4 and 4 are insulated from each other on the surface of the capacitor body 2. The signal terminal 3 and the ground terminal 4 are made of a material such as Cu, Ni, or Ag—Pd, and plated with Ni—Sn or the like. The signal terminals 3 and 3 are each formed in a strip shape so as to extend from one main surface 2c to the other main surface 2c at substantially the center of the long side surfaces 2b and 2b.

  The ground terminals 4 and 4 are formed so as to cover the short side surfaces 2a and 2a of the capacitor body 2 facing each other. One ground terminal 4 is formed over the region on the short side surface 2a side of the long side surfaces 2b, 2b and the main surfaces 2c, 2c of the capacitor body 2. The other ground terminal 4 is formed over the region on the other short side surface 2a side of the long side surfaces 2b, 2b and the main surfaces 2c, 2c of the capacitor body 2.

  FIG. 2 is a schematic diagram showing a cross-sectional structure of the multilayer feedthrough capacitor. FIG. 2 shows a cross section passing through the center of the multilayer feedthrough capacitor 1 and parallel to the long side surface 2b. The capacitor body 2 includes a plurality of dielectric layers 9, a plurality of (four in this embodiment) first electrode layers X that are continuously stacked with the dielectric layer 9 interposed therebetween, and a plurality of first layers Among the electrode layers X, the outermost first electrode layer X and the second electrode layer Y facing each other with the dielectric layer 9 interposed therebetween are provided. The main surface 2c of the capacitor body 2 is a surface parallel to each layer.

In the capacitor body 2, the dielectric layers 9 adjacent in the stacking direction are integrated to such an extent that the boundary cannot be visually recognized. The dielectric layer 9 is made of a dielectric material such as BaTiO ₃ , Ba (Ti, Zr) O ₃ , or (Ba, Ca) TiO _3, for example.

  Each first electrode layer X includes a signal electrode 6 and a pair of auxiliary electrodes 8. The second electrode layer Y has a ground electrode 7. The signal electrode 6, the ground electrode 7, and the auxiliary electrode 8 are formed of a material such as Ni, for example.

  FIG. 3 is a schematic diagram showing the first electrode layer. The signal electrode 6 penetrates from one long side surface 2b to the other long side surface 2b. The signal electrode 6 includes a main portion 6a and two lead portions 6b that are integrally formed. The main portion 6 a has a rectangular shape and is disposed at the center with respect to the dielectric layer 9. The two lead portions 6b are portions that are led out from the main portion 6a to one long side surface 2b and the other long side surface 2b.

  The end surface of the lead portion 6b is exposed at the center in the longitudinal direction of the long side surface 2b and is covered with the signal terminal 3 formed on the long side surface 2b. For this reason, the signal electrode 6 and the signal terminal 3 are in physical contact and are electrically connected.

  The pair of auxiliary electrodes 8 are located on both sides of the signal electrode 6. One auxiliary electrode 8 is located on one short side surface 2a side, and the other auxiliary electrode 8 is located on the other short side surface 2a side. The auxiliary electrode 8 has a rectangular shape, and one end surface extending in the longitudinal direction is exposed on the short side surface 2a. For this reason, the auxiliary electrode 8 is in physical contact with and electrically connected to the ground terminal 4 formed so as to cover the short side surface 2a.

  The pair of auxiliary electrodes 8 are spaced apart from the signal electrode 6 and insulated from the signal electrode 6. The dimensions in the opposing direction of the long side surface 2b between the auxiliary electrode 8 and the main portion 6a of the signal electrode 6 are approximately the same. The end portion 8a on the signal electrode 6 side extending in the facing direction of the long side surface 2b of the auxiliary electrode 8 faces the end portion 6c extending in the facing direction of the long side surface 2b of the signal electrode 6. For this reason, a capacitance can be generated between the auxiliary electrode 8 and the signal electrode 6.

  FIG. 4 is a schematic diagram showing the second electrode layer Y. As shown in FIG. The ground electrode 7 has a rectangular shape and extends along the longitudinal direction of the capacitor body 2 and penetrates from one short side surface 2a to the other short side surface 2a. That is, both end portions of the ground electrode 7 are exposed to the short side surface 2 a and are in physical contact with the ground terminal 4 formed so as to cover the short side surface 2 a, and the ground electrode 7 is electrically connected to the ground terminal 4. Has been. The ground electrode 7 is opposed to the main portion 6a of the signal electrode 6 disposed on the outermost side. For this reason, a capacitance is generated between the ground electrode 7 and the signal electrode 6.

  The multilayer feedthrough capacitor 1 described above is mounted such that either one of the main surfaces 2c faces another component (for example, a circuit board or an electronic component). The pair of signal terminals 3 and 3 are connected to the signal line on the circuit board, and the pair of ground terminals 4 and 4 are connected to the ground line on the circuit board.

  FIG. 5 is an equivalent circuit diagram of the multilayer feedthrough capacitor. In the multilayer feedthrough capacitor 1, the main portion 6 a of the signal electrode 6 connected to the signal terminal 3 and the ground electrode 7 connected to the ground terminal 4 are opposed to each other, so that a capacitance C <b> 1 is formed. The four auxiliary electrodes 8 connected to one ground terminal 4 and the four signal electrodes 6 connected to the signal terminal 3 form a capacitance C2. The four auxiliary electrodes 8 connected to the other ground terminal 4 and the four signal electrodes 6 connected to the signal terminal 3 form a capacitance C2. For this reason, in the multilayer feedthrough capacitor 1, a combined capacitance {C1 + (2 × C2)} is formed.

Then, the manufacturing method of the multilayer feedthrough capacitor 1 is demonstrated. First, a plurality of green sheets to be the dielectric layer 9 are prepared. First, a ceramic paste is obtained by mixing and kneading an organic vehicle or the like with a BaTiO ₃ based, Ba (Ti, Zr) O ₃ based, or (Ba, Ca) TiO ₃ based dielectric material. This ceramic paste is applied onto a PET film by a doctor blade method or the like to form a green sheet.

  A plurality of electrode patterns to be the signal electrode 6, the ground electrode 7 and the auxiliary electrode 8 are formed on the green sheet. The electrode pattern is formed by screen printing an electrode paste on a green sheet. Thereafter, a plurality of green sheets on which electrode patterns are formed and a plurality of green sheets on which electrode patterns are not formed are stacked in a predetermined order, and pressed from the stacking direction to form a stacked body.

  The laminated body is cut to form a plurality of substantially rectangular parallelepiped green chips, which are subjected to binder removal processing and firing. By firing, the green sheet becomes the dielectric layer 9, the electrode pattern becomes the signal electrode 6, the ground electrode 7 and the auxiliary electrode 8, and the capacitor element body 2 is obtained. A conductive paste is applied to the short side surface 2a of the capacitor body 2 so as to cover the entire surface, and a conductive paste is applied to the long side surface 2b in a strip shape at the center in the longitudinal direction. Thereafter, the applied conductive paste is baked, and further plated to form the signal terminal 3 and the ground terminal 4. Thus, the multilayer feedthrough capacitor 1 is completed.

  In the multilayer feedthrough capacitor of the present invention, a capacitance C1 is generated between the signal electrode 6 and the ground electrode 7. Further, the signal electrode 6 connected to the signal terminal 3 and the auxiliary electrode 8 connected to the ground terminal 4 are formed in the same layer, and this layer (first layer X) is continuous with the dielectric layer 9 in between. Therefore, the end portions 6c of the plurality of signal electrodes 6 and the end portions 8a of the plurality of auxiliary electrodes 8 face each other, and a capacitance (C2 × 2) is generated. Therefore, the capacitance C1 formed by the signal electrode 6 and the ground electrode 7 and the capacitance (C2 × 2) formed by the plurality of signal electrodes 6 and the plurality of auxiliary electrodes 8 are combined. The frequency characteristics at high frequencies can be improved.

  FIG. 6 is a graph showing frequency characteristics of the multilayer feedthrough capacitor according to the present embodiment. A curve L1 indicated by a solid line indicates the frequency characteristics of the multilayer feedthrough capacitor 1 according to the present embodiment. A curve L2 indicated by a broken line indicates the frequency characteristic of the multilayer feedthrough capacitor according to the comparative example. The multilayer feedthrough capacitor according to this comparative example has a pair of signal electrodes and a ground electrode facing each other in the capacitor body, and does not have an auxiliary electrode and a plurality of signal electrodes.

  As shown in FIG. 6, the frequency characteristics of the multilayer feedthrough capacitor according to the comparative example are simply lowered on the high frequency side, whereas the multilayer feedthrough capacitor 1 according to the present embodiment has a high frequency. The side characteristics have improved. This is the effect of the capacitance (C2 × 2) formed by the plurality of signal electrodes 6 and the plurality of auxiliary electrodes 8.

  In the present embodiment, the dimension in the facing direction of the long side surface 2 b of the ground terminal 4 is larger than the dimension in the facing direction of the short side surface 2 a of the signal terminal 3. For this reason, about the auxiliary electrode 8 connected to the ground terminal 4, the dimension of the opposing direction of the long side surface 2b can be made comparatively large. Therefore, the facing area between the end 8a of the auxiliary electrode 8 and the end 6c of the signal electrode 6 can be made relatively large, and the capacitance between the auxiliary electrode 8 and the signal electrode 6 can be made larger. it can. Further, with respect to the ground electrode 7 connected to the ground terminal 4, the dimension of the long side surface 2b in the facing direction can be made relatively large. For this reason, ESL can be reduced.

  Subsequently, a modification of the above embodiment and the second embodiment will be described. In the following description, a configuration different from the above embodiment will be mainly described.

(First modification of the first embodiment)
With reference to FIGS. 7-10, the multilayer feedthrough capacitor 1A which concerns on a 1st modification is demonstrated. FIG. 7 is a diagram showing a cross-sectional structure of the multilayer feedthrough capacitor according to the first modification. FIG. 7 is a view showing a cross section passing through the center of the multilayer feedthrough capacitor 1A according to the first modification and parallel to the short side surface 2a. FIG. 8 is a diagram showing the first electrode layer. FIG. 9 is a diagram illustrating the second electrode layer. FIG. 10 is an equivalent circuit diagram of the multilayer feedthrough capacitor according to the first modification.

  The multilayer feedthrough capacitor 1A includes an auxiliary electrode 18 arranged in the same layer as the ground electrode 7 instead of the auxiliary electrode 8 arranged in the same layer as the signal electrode 6 in the multilayer feedthrough capacitor 1 described above. The capacitor body 2A included in the multilayer feedthrough capacitor 1A includes a plurality (four in this modification) of the first electrode layer X and the second electrode layer Y. The first electrode layer X includes a ground electrode (first through electrode) 7 and a pair of auxiliary electrodes 18. The second electrode layer Y has a signal electrode (second through electrode) 6.

  A pair of signal terminals (second terminal electrodes) 3 are formed on a pair of long side surfaces (second pair of surfaces) 2b, respectively, and a pair of ground terminals (first terminal electrodes) 4 are a pair of short side surfaces. (First pair of surfaces) 2a is formed to cover each.

  The pair of auxiliary electrodes 18 are located on both sides of the first electrode layer X with the ground electrode 7 interposed therebetween. One auxiliary electrode 18 is located on one long side surface 2b side, and the other auxiliary electrode 18 is located on the other long side surface 2b side. The auxiliary electrode 18 has a rectangular shape, and an end surface of one side is exposed at the center of the long side surface 2b. For this reason, the auxiliary electrode 18 is in contact with and electrically connected to the signal terminal 3 formed at the center of the long side surface 2b.

  The pair of auxiliary electrodes 18 are spaced apart from the ground electrode 7 and insulated from the ground electrode 7. The end 18 a of the auxiliary electrode 18 on the side of the ground electrode 7 faces the end 7 a of the ground electrode 7 on the side of the auxiliary electrode 18. For this reason, a capacitance can be generated between the auxiliary electrode 18 and the ground electrode 7.

  As shown in FIG. 10, the capacitance C <b> 2 a is formed by the four auxiliary electrodes 18 connected to one signal terminal 3 and the four ground electrodes 7 connected to the ground terminal 4. The four auxiliary electrodes 18 connected to the other signal terminal 3 and the four ground electrodes 7 connected to the ground terminal 4 form a capacitance C2a. For this reason, since the capacitance (2 × C2a) is formed together with the capacitance C1 formed between the signal electrode 6 and the ground electrode 7, the multilayer feedthrough capacitor 1A has a combined capacitance {C1 + ( 2 × C2a)}. Therefore, frequency characteristics at high frequency can be improved.

(Second modification of the first embodiment)
With reference to FIGS. 11-13, the multilayer feedthrough capacitor 1B which concerns on a 2nd modification is demonstrated. FIG. 11 is a diagram showing a cross-sectional structure of the multilayer feedthrough capacitor according to the second modification. FIG. 11 is a view showing a cross section passing through the center of the multilayer feedthrough capacitor 1B according to the second modification and parallel to the long side surface 2b. FIG. 12 is a diagram illustrating the first electrode layer. FIG. 13 is a diagram illustrating the second electrode layer.

  The multilayer feedthrough capacitor 1B includes an auxiliary electrode 28 having a shape different from that of the auxiliary electrode 8 instead of the auxiliary electrode 8 included in the multilayer feedthrough capacitor 1, and a ground having a shape different from that of the ground electrode 7 instead of the ground electrode 7. An electrode 27 is provided. A pair of signal terminals (first terminal electrodes) 3 are respectively formed on a pair of long side surfaces (first pair of surfaces) 2b, and a pair of ground terminals (second terminal electrodes) 4 are a pair of short side surfaces. (Second pair of surfaces) 2a is formed so as to cover each.

  The capacitor element body 2B provided in the multilayer feedthrough capacitor 1B includes a plurality (four in this modification) of the first electrode layer X and the second electrode layer Y. Each first electrode layer X includes a signal electrode (first through electrode) 6 and a pair of auxiliary electrodes 28. The second electrode layer Y includes a ground electrode 27.

  In the first electrode layer X, the pair of auxiliary electrodes 28 are located on both sides of the signal electrode 6. The pair of auxiliary electrodes 28 are each formed in a rectangular shape and arranged along the short side surface 2a.

  One auxiliary electrode 28 is located on one short side surface 2a side. The one auxiliary electrode 28 is exposed to one short side surface 2a and a region (first region) 21 on one short side surface 2a side of the pair of long side surfaces 2b. For this reason, one auxiliary electrode 28 is electrically connected to one ground terminal 4 formed so as to cover one short side surface 2a and one short side surface 2a of the pair of long side surfaces 2b. Yes.

  The other auxiliary electrode 28 is located on the other short side surface 2a side. The other auxiliary electrode 28 is exposed to the other short side surface 2a and a region (second region) 22 on the other short side surface 2a side of the pair of long side surfaces 2b. For this reason, the other auxiliary electrode 28 is electrically connected to the other ground terminal 4 formed so as to cover the region 22 on the other short side surface 2a side of the other short side surface 2a and the pair of long side surfaces 2b. Yes.

  The end portion 28a on the signal electrode 6 side extending in the facing direction of the long side surface 2b of the auxiliary electrode 28 faces the end portion 6c extending in the facing direction of the long side surface 2b of the signal electrode 6. For this reason, a capacitance C2b is generated between the auxiliary electrode 28 and the signal electrode 6. Therefore, in the multilayer feedthrough capacitor 1B, as in the above embodiment, the capacitance C1 and the capacitance (2 × C2b) are combined, and the frequency characteristics at high frequency can be improved.

  In the second electrode layer Y, the ground electrode 27 is such that both end portions exposed to the short side surface 2a of the ground electrode 7 are drawn out to the long side surface 2b on both sides. Both end portions 27a of the ground electrode 27 are exposed in the region 21 on the one short side surface 2a side and the region 22 on the other short side surface 2a side in the pair of long side surfaces 2b. Both end portions 27a have the same shape as the auxiliary electrode 28 and overlap each other in the stacking direction.

  As described above, the auxiliary electrode 28 and the end portion 27a of the ground electrode 27 extend along the short side surface 2a and are exposed in the regions 21 and 22 of the short side surface 2a and the pair of long side surfaces 2b. For this reason, the contact area between the auxiliary electrode 28 and the ground electrode 27 and the ground terminal 4 becomes larger. Therefore, the reliability of electrical connection between the auxiliary electrode 28 and the ground electrode 27 and the ground terminal 4 is improved. In addition, the ground terminal 4 has higher adhesion to the auxiliary electrode 28 and the ground electrode 27 than the dielectric layer 9 from the viewpoint of material. Therefore, the adhesion between the capacitor body 2 and the ground terminal 4 can be enhanced. Further, the connection area between the ground electrode 27 and the ground terminal 4 increases, and the ESL can be reduced.

(Third Modification of Second Embodiment)
With reference to FIGS. 14-16, the multilayer feedthrough capacitor 1C which concerns on a 3rd modification is demonstrated. FIG. 14 is a diagram showing a cross-sectional structure of the multilayer feedthrough capacitor according to the third modification. FIG. 14 is a view showing a cross section passing through the center of the multilayer feedthrough capacitor 1C according to the third modification and parallel to the long side surface 2b. FIG. 15 is a diagram illustrating the first electrode layer. FIG. 16 is a diagram illustrating the second electrode layer.

  The multilayer feedthrough capacitor 1C is a modification of the multilayer feedthrough capacitor 1B. The multilayer feedthrough capacitor 1C includes a signal electrode 36 and an auxiliary electrode 38 having different shapes instead of the signal electrode 6 and the auxiliary electrode 28 included in the multilayer feedthrough capacitor 1B.

  In the first electrode layer X provided in the capacitor element body 2C, the signal electrode 36 is formed in a band shape and penetrates from the central portion of one long side surface 2b to the central portion of the other long end surface 2b. Each of the pair of auxiliary electrodes 38 has a protruding portion 38a protruding from the auxiliary electrode 28 described above toward the center.

  That is, even if the dimension in the opposing direction of the short side surface 2a of the signal electrode 36 is reduced, the auxiliary electrode 38 protrudes toward the signal electrode 36, whereby the end portion 36a of the signal electrode 36 and the signal electrode of the auxiliary electrode 38 are The distance from the end portion 38b on the 36 side can be maintained. Therefore, the capacitance C2c formed between the end portion 36a of the signal electrode 36 and the end portion 38b of the auxiliary electrode can be secured.

  Similar to the above embodiment, in the multilayer feedthrough capacitor 1C, the capacitance C1 and the capacitance (2 × C2c) are combined, and the frequency characteristics at a high frequency can be improved.

(Second Embodiment)
FIG. 17 is a schematic perspective view of the multilayer feedthrough capacitor according to the second embodiment. The multilayer feedthrough capacitor 41 according to the second embodiment includes a capacitor body 42, a pair of signal terminals (second terminal electrodes) 43 and 43 formed on the surface of the capacitor body 42, and a pair of ground terminals (first terminals). 1 terminal electrode) 44, 44. Capacitor body 42 has a substantially rectangular parallelepiped shape, and faces short side surfaces (second pair of surfaces) 42a and 42a facing each other and long side surfaces (first pair of surfaces) 42b and 42b facing each other. Main surfaces 42c and 42c.

  The signal terminals 43 and 43 are each formed in a strip shape on the pair of short side surfaces 42a and 42a so as to extend from one main surface 42c to the other main surface 42c. The ground terminals 44 and 44 are each formed in a wide band shape on the pair of long side surfaces 42b and 42b so as to extend from one main surface 42c to the other main surface 42c. The width dimension of the ground terminal 44 (dimension in the facing direction of the short side face 42a) is larger than the width dimension of the signal terminal 43 (dimension in the facing direction of the long side face 42b).

  FIG. 18 is a schematic diagram showing a cross-sectional structure of the multilayer feedthrough capacitor. FIG. 18 shows a cross section passing through the center of the multilayer feedthrough capacitor 41 and parallel to the long side surface 42b. The capacitor body 42 includes a plurality of dielectric layers 49, a plurality of (four in the present embodiment) first electrode layers X that are continuously stacked with the dielectric layer 49 interposed therebetween, and a first electrode layer. X and a second electrode layer Y opposed to each other with the dielectric layer 49 interposed therebetween.

  FIG. 19 is a schematic diagram showing the first electrode layer. Each first electrode layer X includes a ground electrode 46 and a pair of auxiliary electrodes 48. The ground electrode 46 penetrates from one long side 42b to the other long side 42b. The ground electrode 46 includes a main portion 46a and two lead portions 46b that are integrally formed. The main portion 46 a has a rectangular shape and is disposed at the center with respect to the dielectric layer 49. The two lead portions 46b are portions that are drawn from the main portion 46a to one long side surface 42b and the other long side surface 42b.

  The end surface of the lead portion 46b is exposed at the center in the longitudinal direction of the long side surface 42b and is covered with the ground terminal 44 formed on the long side surface 42b. For this reason, the ground electrode 46 and the ground terminal 44 are in physical contact and are electrically connected.

  The pair of auxiliary electrodes 48 are located on both sides of the ground electrode 46. One auxiliary electrode 48 is located on one short side surface 42a side, and the other auxiliary electrode 48 is located on the other short side surface 42a side. The auxiliary electrode 48 has a rectangular shape, and one end surface is exposed at the center of the short side surface 42a. For this reason, the auxiliary electrode 48 is in physical contact with and electrically connected to the signal terminal 43 formed at the center of the short side surface 42a.

  The pair of auxiliary electrodes 48 are spaced apart from the ground electrode 46 and insulated from the ground electrode 46. An end portion 48 a on the ground electrode 46 side of the auxiliary electrode 48 faces the end portion 46 c of the ground electrode 46. For this reason, an electrostatic capacity can be generated between the auxiliary electrode 48 and the ground electrode 46.

  FIG. 20 is a schematic diagram showing the second electrode layer Y. As shown in FIG. The second electrode layer Y has a signal electrode 47. The signal electrode 47 penetrates from one short side surface 42a to the other short side surface 42a. The signal electrode 47 includes a main portion 47a and two lead portions 47b that are integrally formed. The main portion 47 a has a rectangular shape and is disposed at the center with respect to the dielectric layer 49. The two lead portions 47b are portions that are drawn from the main portion 47a to one short side surface 42a and the other short side surface 42a.

  The end surface of the lead-out portion 47b is exposed at the longitudinal center portion of the short side surface 42a and is covered with a signal terminal 43 formed at the central portion of the short side surface 42a. For this reason, the signal electrode 47 and the signal terminal 43 are in physical contact and are electrically connected. The signal electrode 47 faces the ground electrode 46 disposed on the outermost side. For this reason, a capacitance C1d is generated between the ground electrode 46 and the signal electrode 47.

  The multilayer feedthrough capacitor 41 described above is mounted such that any one of the main surfaces 42c faces another component (for example, a circuit board or an electronic component). A pair of signal terminals 43 and 43 are connected to the signal line on the circuit board, and a pair of ground terminals 44 and 44 are connected to the ground line on the circuit board.

  FIG. 21 is an equivalent circuit diagram of the multilayer feedthrough capacitor according to the second embodiment. In the multilayer feedthrough capacitor 41, since the signal electrode 47 connected to the signal terminal 43 and the ground electrode 46 connected to the ground terminal 44 face each other, a capacitance C1d is formed. The four auxiliary electrodes 48 connected to one signal terminal 43 and the four ground electrodes 46 connected to the ground terminal 44 form a capacitance C2d. The four auxiliary electrodes 48 connected to the other signal terminal 43 and the four ground electrodes 46 connected to the ground terminal 44 form a capacitance C2d. For this reason, in the multilayer feedthrough capacitor 41, a combined capacitance {C1d + (2 × C2d)} can be formed. For this reason, the frequency characteristic in a high frequency can be improved.

  In the present embodiment, the width dimension of the ground terminal 44 is larger than the width dimension of the signal terminal 43. In addition, since the ground electrode 46 penetrates in the short direction of the dielectric layer 9 in the first electrode layer X, it extends in the longitudinal direction of the dielectric layer 9 and has a cross section perpendicular to the direction in which the current flows. The area can be made relatively large. For this reason, ESL can be reduced.

(First Modification of Second Embodiment)
As shown in FIG. 22, in the multilayer feedthrough capacitor according to the first modification of the second embodiment, the second electrode layer Y has a pair of auxiliary electrodes 58 in addition to the signal electrode 47 described above. . The pair of auxiliary electrodes 58 are arranged with the signal electrode 47 interposed therebetween.

  One auxiliary electrode 58 is located on one long side 42b side. The end surface of the one auxiliary electrode 58 is exposed at the long side surface 42b, and the auxiliary electrode 58 and the ground terminal 44 are electrically connected. The other auxiliary electrode 58 is located on the other long side surface 42b side. The end surface of the other auxiliary electrode 58 is exposed at the long side surface 42b, and the auxiliary electrode 58 and the ground terminal 44 are electrically connected.

  The end of the auxiliary electrode 58 on the signal electrode 47 side faces the end of the signal electrode 47. For this reason, a capacitance is generated between the auxiliary electrode 58 and the signal electrode 47. Thereby, the frequency characteristic in a high frequency can be improved further.

  The present invention is not limited to the above embodiment, and various modifications can be made. For example, in the above-described embodiment, the capacitor element body includes a first electrode layer that is continuously stacked with a dielectric layer interposed therebetween, and a second electrode that is stacked with the dielectric layer sandwiched between the first electrode layers. Although the case where it has one unit comprised with the layer was demonstrated, the capacitor | condenser element | base_body may have multiple this unit.

1 is a schematic perspective view of a multilayer feedthrough capacitor according to a first embodiment. It is a figure which shows the cross-section of the multilayer feedthrough capacitor which concerns on 1st Embodiment. It is a figure which shows the 1st electrode layer with which the multilayer feedthrough capacitor which concerns on 1st Embodiment is provided. It is a figure which shows the 2nd electrode layer with which the multilayer feedthrough capacitor which concerns on 1st Embodiment is provided. It is an equivalent circuit diagram of the multilayer feedthrough capacitor according to the first embodiment. It is a graph which shows the frequency characteristic of the multilayer feedthrough capacitor concerning a 1st embodiment. It is a figure which shows the cross-section of the multilayer feedthrough capacitor which concerns on the 1st modification of 1st Embodiment. It is a figure showing the 1st electrode layer with which the multilayer penetration capacitor concerning the 1st modification of a 1st embodiment is provided. It is a figure which shows the 2nd electrode layer with which the multilayer feedthrough capacitor which concerns on the 1st modification of 1st Embodiment is provided. It is an equivalent circuit schematic of the multilayer feedthrough capacitor concerning the 1st modification of a 1st embodiment. It is a figure showing the section structure of the multilayer penetration capacitor concerning the 2nd modification of a 1st embodiment. It is a figure showing the 1st electrode layer with which the multilayer penetration capacitor concerning the 2nd modification of a 1st embodiment is provided. It is a figure which shows the 2nd electrode layer with which the multilayer feedthrough capacitor which concerns on the 2nd modification of 1st Embodiment is provided. It is a figure which shows the cross-section of the multilayer feedthrough capacitor which concerns on the 3rd modification of 1st Embodiment. It is a figure showing the 1st electrode layer with which the multilayer penetration capacitor concerning the 3rd modification of a 1st embodiment is provided. It is a figure showing the 2nd electrode layer with which the multilayer penetration capacitor concerning the 3rd modification of a 1st embodiment is provided. It is a schematic perspective view of the multilayer feedthrough capacitor according to the second embodiment. It is a figure which shows the cross-section of the multilayer feedthrough capacitor which concerns on 2nd Embodiment. It is a figure which shows the 1st electrode layer with which the multilayer feedthrough capacitor which concerns on 2nd Embodiment is provided. It is a figure which shows the 2nd electrode layer with which the multilayer feedthrough capacitor which concerns on 2nd Embodiment is provided. It is an equivalent circuit diagram of the multilayer feedthrough capacitor according to the second embodiment. It is a figure which shows the 2nd electrode layer with which the multilayer feedthrough capacitor which concerns on the 1st modification of 2nd Embodiment is provided.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,1A-1C, 41 ... Multilayer feedthrough capacitor, 2, 2A-2C, 42 ... Capacitor body, 2a ... Short side surface, 2b ... Long side surface, 3 ... Signal terminal, 4 ... Ground terminal, 6 ... Signal electrode, 7 ... ground electrode, 8, 18 ... auxiliary electrode, 9 ... dielectric layer, X ... first electrode layer, Y ... second electrode layer.

Claims (5)

A capacitor body, and a pair of first terminal electrodes and a pair of second terminal electrodes formed on the surface of the capacitor body,
The capacitor body is
A plurality of dielectric layers;
A plurality of first electrode layers sequentially stacked with the dielectric layer interposed therebetween,
An outermost first electrode layer among the plurality of first electrode layers and a second electrode layer laminated with the dielectric layer interposed therebetween,
The first electrode layer includes
A first through electrode penetrating the capacitor body and connected to the pair of first terminal electrodes;
In the first electrode layer, the auxiliary electrode is disposed apart from the first through electrode and connected to one of the pair of second terminal electrodes,
The second electrode layer penetrates the capacitor body, is connected to the pair of second terminal electrodes, and has a second through electrode opposed to the first through electrode with the dielectric layer interposed therebetween. A multilayer feedthrough capacitor comprising: The capacitor body has a first pair of surfaces facing each other and a second pair of surfaces facing each other perpendicular to the first pair of surfaces,
The first through electrode penetrates from one of the first pair of surfaces to the other,
The second through electrode penetrates from one of the second pair of surfaces to the other,
The auxiliary electrode includes one auxiliary electrode disposed on one surface side of the second pair of surfaces and the other surface side of the first electrode layer with the first through electrode interposed therebetween. Including the other auxiliary electrode disposed,
The second through electrode and the one auxiliary electrode are respectively disposed on one surface side of the second pair of surfaces of the first pair of surfaces and the first pair of surfaces. Exposed to the first region,
The second through electrode and the other auxiliary electrode are disposed on the other surface side of the second pair of surfaces in the other surface of the second pair of surfaces and the first pair of surfaces, respectively. Exposed to the second region,
One of the pair of second terminal electrodes is formed so as to cover the one surface of the second pair of surfaces and the first region,
2. The multilayer penetration according to claim 1, wherein the other of the pair of second terminal electrodes is formed so as to cover the other surface of the second pair of surfaces and the second region. Capacitor.   2. The dimension in the facing direction of the first pair of surfaces of the second terminal electrode is larger than the dimension in the facing direction of the second pair of surfaces of the first terminal electrode. Or the multilayer feedthrough capacitor of 2. The first through electrode is a signal electrode;
4. The multilayer feedthrough capacitor according to claim 2, wherein the second through electrode is a ground electrode. The opposing dimension of the second pair of surfaces of the first terminal electrode is larger than the opposing dimension of the first pair of surfaces of the second terminal electrode,
The first through electrode is a ground electrode;
The multilayer feedthrough capacitor according to claim 1, wherein the second through electrode is a signal electrode.

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