JP2008276999A - Heat radiator of led lamp - Google Patents

Heat radiator of led lamp Download PDF

Info

Publication number
JP2008276999A
JP2008276999A JP2007116406A JP2007116406A JP2008276999A JP 2008276999 A JP2008276999 A JP 2008276999A JP 2007116406 A JP2007116406 A JP 2007116406A JP 2007116406 A JP2007116406 A JP 2007116406A JP 2008276999 A JP2008276999 A JP 2008276999A
Authority
JP
Japan
Prior art keywords
hollow
led lamp
heat
aluminum substrate
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007116406A
Other languages
Japanese (ja)
Inventor
Kuo-Chun Lin
國俊 林
Ching-Yuan Juan
慶源 阮
Kun-Jung Chang
昆榮 張
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2007116406A priority Critical patent/JP2008276999A/en
Publication of JP2008276999A publication Critical patent/JP2008276999A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiator used for the heat radiation of an LED lamp in particular. <P>SOLUTION: This heat radiator of the LED lamp is composed of a hollow heat radiating pedestal, an aluminum substrate, and a plurality of LED lamps. The hollow heat radiating pedestal is composed of a fin and a hollow housing, and a plurality of heat radiating bars are installed in the hollow housing. The LED lamp is soldered to the aluminum substrate, then pasted to one side of the hollow heat radiating pedestal, and liquid is filled into the hollow housing of the hollow heat radiating pedestal. When the LED lamp is lighted, since the LED lamp is soldered to the aluminum substrate, heat is transmitted to the aluminum substrate, and since the aluminum substrate is pasted to the hollow heat radiating pedestal, heat is transmitted to the liquid in the hollow housing of the hollow heat radiating pedestal. In addition, heat is radiated from the fin of the hollow heat radiating pedestal to quickly attain a heat radiation effect. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明はLEDランプの放熱装置であって、特にLEDランプに使用される照明器具の放熱に一層便利な装置に関する。 The present invention relates to a heat dissipation device for an LED lamp, and more particularly to a device more convenient for heat dissipation of a lighting fixture used in an LED lamp.

図１で示すように、従来のLEDランプＡ１０とアルミニウム基板Ａ２０とを結合し、LEDランプＡ１０を直接アルミニウム基板Ａ２０に半田付けして、アルミニウム基板
Ａ２０本体の素早い吸熱と放熱の特性を利用して放熱を行う方法を実際に行なうと以下の弊害がある。アルミニウム基板Ａ２０に半田付けされたLEDランプＡ１０の数量が多いと、アルミニウム基板Ａ２０本体が熱量を吸収したり放出したりする負担に耐えられないため、アルミニウム基板Ａ２０本体が過熱現象を起こし、またアルミニウム基板Ａ２０本体の放熱面積が固定されている関係上、LEDランプＡ１０の数量に従って面積を増減させて放熱速度を加速させることができない。 As shown in FIG. 1, a conventional LED lamp A10 and an aluminum substrate A20 are coupled, and the LED lamp A10 is directly soldered to the aluminum substrate A20, and the rapid heat absorption and heat dissipation characteristics of the aluminum substrate A20 main body are utilized. If the method of performing heat dissipation is actually performed, there are the following problems. If the number of LED lamps A10 soldered to the aluminum substrate A20 is large, the aluminum substrate A20 main body cannot withstand the burden of absorbing and releasing heat, so that the aluminum substrate A20 main body causes an overheating phenomenon, and aluminum Since the heat radiation area of the main body of the substrate A20 is fixed, the heat radiation speed cannot be increased by increasing or decreasing the area according to the number of LED lamps A10.

上記の放熱問題を改善するために、LEDランプＡ１０を半田付けしたアルミニウム基板Ａ２０を、図２で示すように、片面にニッケルメッキを施す方法で従来の放熱ヒレＡ３０と結合させる方法では、実際に行なうと下記の弊害がある。従来の放熱ヒレ
Ａ３０の放熱能力はアルミニウム基板Ａ２０で発生する熱量を素早く伝導することができないので、従来の放熱ヒレＡ３０のサイズを大きくすることで放熱効果が高められるが、容積が過大となるデメリットがあり、また、アルミニウム基板Ａ２０と従来の放熱ヒレＡ３０間はニッケルメッキで結合させていることから相当なコストの増大を招くのである。 In order to improve the above heat dissipation problem, the aluminum substrate A20 to which the LED lamp A10 is soldered is actually bonded to the conventional heat dissipation fin A30 by nickel plating on one side as shown in FIG. Doing so has the following adverse effects. The heat dissipating capacity of the conventional heat dissipating fin A30 cannot quickly conduct the amount of heat generated in the aluminum substrate A20, so the heat dissipating effect can be improved by increasing the size of the conventional heat dissipating fin A30, but the disadvantage is that the volume is excessive. In addition, since the aluminum substrate A20 and the conventional heat dissipation fin A30 are bonded by nickel plating, a considerable increase in cost is caused.

本発明は「LEDランプの放熱装置」を提供し、当該設計により従来のLEDランプのアルミニウム基板上での放熱が思わしくない問題を改善し、中空状の放熱台座とアルミニウム基板を結合させて、中空状の放熱台座内の中空状収納部内に液体を注入することで、素早く放熱することを主な発明目的とする。 The present invention provides a “LED lamp heat dissipation device”, which improves the problem of heat radiation on the aluminum substrate of a conventional LED lamp, and combines a hollow heat dissipation pedestal and an aluminum substrate to form a hollow space. The main purpose of the invention is to quickly dissipate heat by injecting liquid into the hollow housing portion in the heat radiation base.

本発明が用いる技術方式はLEDランプの放熱装置を提供することであり、当該部品はLEDランプ、アルミニウム基板及び中空状の放熱台座からなり、その内前記中空状の放熱台座の片方にはヒレ部を設け、もう片方には中空状収納部を設け、中空状収納部には複数の放熱バーを設ける。LEDランプをアルミニウム基板に半田付けし、中空状の放熱台座の片方の中空状収納部の表面に貼り付けて中空状収納部に液体を注入する。LEDランプが点灯すると、LEDランプがアルミニウム基板に半田付けされているので、熱エネルギーをアルミニウム基板に伝導し、またアルミニウム基板は中空状の放熱台座の片方の中空状収納部の表面に貼り付けてあるので、熱エネルギーを中空状の放熱台座の中空状収納部内にある液体の中に伝導することができ、さらに中空状の放熱台座のヒレ部から発散させて、速やかに放熱効果を図ることができる。 The technical method used by the present invention is to provide an LED lamp heat dissipating device, and the component consists of an LED lamp, an aluminum substrate and a hollow heat dissipating pedestal, in which one of the hollow heat dissipating pedestals has a fin portion. The other side is provided with a hollow storage part, and the hollow storage part is provided with a plurality of heat radiation bars. The LED lamp is soldered to an aluminum substrate, and affixed to the surface of one hollow storage portion of the hollow heat dissipation pedestal to inject liquid into the hollow storage portion. When the LED lamp is lit, the LED lamp is soldered to the aluminum substrate, so heat energy is transferred to the aluminum substrate, and the aluminum substrate is attached to the surface of one hollow storage part of the hollow heat dissipation base. Therefore, heat energy can be conducted into the liquid in the hollow storage part of the hollow heat dissipation pedestal, and can be diffused from the fin part of the hollow heat dissipation pedestal to promptly dissipate heat. it can.

前述の本発明に係るLEDランプの放熱装置は主に下記の効果を達成することができる。 The above-described LED lamp heat dissipation device according to the present invention can mainly achieve the following effects.

１、放熱効率を高める。前記中空状の放熱台座の片方にのヒレ部を設けると放熱に便利であり、もう片方には中空状収納部を設けて一体成形の連続スペースとして素早く熱エネルギーを伝導するのに便利なように液体を入れるのに用い、また中空状収納部内には複数の放熱バーを設けると、中空状収納部と液体との接触面積を増やして素早い吸熱と放熱をするという目的を達成するのに有利である。 1. Increase heat dissipation efficiency. Providing a fin on one side of the hollow heat dissipating pedestal is convenient for heat dissipation, and the other is provided with a hollow storage part so that heat energy can be conducted quickly as a single-piece continuous space. It is advantageous to achieve the purpose of quick heat absorption and heat dissipation by increasing the contact area between the hollow storage part and the liquid. is there.

２、製造コストを下げる。従来の放熱ヒレ部とアルミニウム基板はニッケルメッキでなければ結合することができなかったが、前記中空状の放熱台座とアルミニウム基板の間は貼り付けさえすればよく、製造コストを効率的に抑えることが出来る。 2. Reduce manufacturing costs. The conventional heat sink and aluminum substrate could not be joined unless they were nickel-plated. However, it is only necessary to attach the space between the hollow heat dissipation base and the aluminum substrate, thereby efficiently reducing the manufacturing cost. I can do it.

本発明の更なる詳細な外観と特徴を提示するために、図面とセットにしながら下記に説明する。 In order to present further detailed appearance and features of the present invention, it will be described below in combination with the drawings.

図３Ａ、３Ｂ、５で示すように、本発明によるLEDランプの放熱装置４０は、LEDランプ１０、アルミニウム基板２０及び中空状の放熱台座３０からなり、その内、前記中空状の放熱台座３０の片側には放熱に便利なようにヒレ部３２を設け、もう片方には中空状収納部３１を設けて一体成形の連続スペースとして素早く熱エネルギーを伝導するのに便利なように液体を入れるのに用い、また中空状収納部内３１に複数の放熱バー３１２を設けると、中空状収納部３１と液体との接触面積を増やして素早い吸熱と放熱をするという目的を達成するのに有利である。中空状の放熱台座３０は必要に応じて各種の幾何形状にすることができる。 As shown in FIGS. 3A, 3B, and 5, an LED lamp heat dissipation device 40 according to the present invention includes an LED lamp 10, an aluminum substrate 20, and a hollow heat dissipation pedestal 30. A fin portion 32 is provided on one side for convenient heat dissipation, and a hollow storage portion 31 is provided on the other side so that a liquid can be placed in a convenient manner for conducting heat energy quickly as an integral molding continuous space. In addition, providing a plurality of heat radiation bars 312 in the hollow housing portion 31 is advantageous in achieving the purpose of increasing the contact area between the hollow housing portion 31 and the liquid and quickly absorbing and releasing heat. The hollow heat dissipation pedestal 30 can have various geometric shapes as required.

図４、５で示すように、本発明を実行する際、LEDランプ１０をアルミニウム基板
２０に半田付けし、LEDランプ１０を半田付けしたアルミニウム基板２０を中空状の放熱台座３０の片側にある中空状収納部３１の表面３１１に貼り付けて中空状収納部
３１に液体を注入する。LEDランプ１０がアルミニウム基板２０に半田付けされ、LEDランプ１０の片側の熱源１１がアルミニウム基板２０に貼り付いているので、LEDランプ１０を点灯させると、その熱量は直接アルミニウム基板２０に伝わり、アルミニウム基板２０は中空状の放熱台座３０の片側にある中空状収納部３１の表面３１１に貼り付いているので、中空状収納部３１内に液体をいっぱいに注入すると、アルミニウム基板２０の熱量を液体を通して中空状の放熱台座３０の片側のヒレ部３２へ伝導させ、さらにヒレ部３２のヒレ３２１から熱量を発散させる。その内、中空状収納部
３１内に設けた複数の放熱バー３１２は中空状収納部３１と液体とが接触する面積を増やすと共に、伝熱効果をも高めることができる。 As shown in FIGS. 4 and 5, when carrying out the present invention, the LED lamp 10 is soldered to the aluminum substrate 20, and the aluminum substrate 20 to which the LED lamp 10 is soldered is hollow on one side of the hollow heat radiation base 30. The liquid is injected into the hollow storage portion 31 by being attached to the surface 311 of the shape storage portion 31. Since the LED lamp 10 is soldered to the aluminum substrate 20 and the heat source 11 on one side of the LED lamp 10 is attached to the aluminum substrate 20, when the LED lamp 10 is turned on, the amount of heat is transferred directly to the aluminum substrate 20, and aluminum Since the substrate 20 is affixed to the surface 311 of the hollow storage portion 31 on one side of the hollow heat dissipation pedestal 30, when the liquid is fully injected into the hollow storage portion 31, the amount of heat of the aluminum substrate 20 passes through the liquid. Conduction is conducted to the fin portion 32 on one side of the hollow heat radiation pedestal 30, and the amount of heat is dissipated from the fin 321 of the fin portion 32. Among them, the plurality of heat radiation bars 312 provided in the hollow housing portion 31 can increase the area where the hollow housing portion 31 and the liquid are in contact with each other, and can also enhance the heat transfer effect.

図６、７、８、９で示すように、本発明の別の実施例では中空状の放熱台座３０aの底に位置決め部３３を設けることで、LEDランプの放熱装置４０aは速やかに位置決めされて壁５０に固着し、また中空状収納部３１aとヒレ部３２aを幾何弧状面とすると、液体接触面積及び放熱面積が増加する。その内、アルミニウム基板２０aは中空状の放熱台座３０aと組み合わせて各種の幾何形状とすることができ、さらにLEDランプ１０の数量及び配置はアルミニウム基板２０aのサイズや外形によって増減させたり変化をさせたりできる。 As shown in FIGS. 6, 7, 8, and 9, in another embodiment of the present invention, the positioning unit 33 is provided on the bottom of the hollow heat radiation base 30 a, so that the LED lamp heat radiation device 40 a is quickly positioned. If it adheres to the wall 50 and the hollow storage part 31a and the fin part 32a are geometric arc surfaces, the liquid contact area and the heat radiation area increase. Among them, the aluminum substrate 20a can be combined with the hollow heat dissipation pedestal 30a to have various geometric shapes, and the number and arrangement of the LED lamps 10 can be increased or decreased or changed depending on the size and outer shape of the aluminum substrate 20a. it can.

図１０、１１で示すように、本発明のまた別の実施例では、中空状の放熱台座３０bはアルミニウム成型で製作しているので、中空状の放熱台座３０bの中空状収納部
３１bとヒレ部３２bの間の熱伝導を一層確実なものとし、中空状の放熱台座３０b左右両側に長状溝３４を設置して笠６０嵌め込むのに使用する。 As shown in FIGS. 10 and 11, in another embodiment of the present invention, since the hollow heat radiation base 30b is made of aluminum, the hollow housing portion 31b and the fin portion of the hollow heat radiation base 30b are formed. The heat conduction between 32b is further ensured, and the long grooves 34 are provided on both the left and right sides of the hollow heat radiation pedestal 30b and used to fit the shade 60.

従来のＬＥＤランプとアルミニウム基板の外観立体図である。It is a three-dimensional external view of a conventional LED lamp and an aluminum substrate. 従来のＬＥＤランプを半田付けしたアルミニウム基板と従来の放熱ヒレの外観立体図である。It is the external appearance three-dimensional view of the aluminum substrate which soldered the conventional LED lamp, and the conventional heat sink fin. 本発明の立体分解図である。It is a three-dimensional exploded view of the present invention. 本発明の部分拡大図である。It is the elements on larger scale of this invention. 本発明の立体構成図である。It is a three-dimensional block diagram of the present invention. 本発明の断面図である。It is sectional drawing of this invention. 本発明における実施例の立体構成図（一）である。It is a three-dimensional block diagram (1) of the Example in this invention. 本発明における実施例の断面図である。It is sectional drawing of the Example in this invention. 本発明における実施例の立体透視図である。It is a three-dimensional perspective view of the Example in this invention. 本発明における実施例の立体構成図（二）である。It is a three-dimensional block diagram (2) of the Example in this invention. 本発明における別の実施例の立体構成図である。It is a three-dimensional block diagram of another Example in this invention. 本発明における別の実施例の断面図である。It is sectional drawing of another Example in this invention.

符号の説明Explanation of symbols

１０ LEDランプ
１１ 熱源
２０ アルミニアウム基板
３０ 中空状の放熱台座
３１ 中空状収納部
３２ ヒレ部
３３ 位置決め部
３１１ 中空状収納部の表面
３１２ 放熱バー
３２１ ヒレ
３４ 長状溝
４０ LEDランプの放熱装置
５０ 壁
６０ 笠 DESCRIPTION OF SYMBOLS 10 LED lamp 11 Heat source 20 Aluminum substrate 30 Hollow heat radiation base 31 Hollow storage part 32 Fin part 33 Positioning part 311 Surface 312 of hollow storage part Heat radiation bar 321 Fin 34 Long groove 40 LED lamp heat radiation device 50 Wall 60 Shade

Claims (2)

LEDランプ とアルミニアウム基板と中空状の放熱台座を少なくとも有するLEDランプの放熱装置であって、
前記中空状の放熱台座の片側にヒレ部を設置し、他方に液体をいっぱいに注入させて一体成形とした連続スペースのための中空状収納部を設置すると共に、中空状収納部内部に伝熱効果を高める放熱バーを複数設置することであって、LEDランプを半田付けしたアルミニアウム基板を中空状の放熱台座の片側にある中空状収納部の表面に貼り付け、中空状の放熱台座は必要に応じて各種の幾何形状になり、且つその底部に位置決め部を設置し、LEDランプの放熱装置を素早く位置決めし壁に固着することを特徴とするLEDランプの放熱装置。 An LED lamp heat dissipation device having at least an LED lamp, an aluminum substrate, and a hollow heat dissipation base,
A fin portion is installed on one side of the hollow heat dissipating pedestal, and a hollow housing portion for a continuous space is formed on the other side by injecting a full liquid, and heat is transferred inside the hollow housing portion. It is to install multiple heat-dissipating bars that enhance the effect, and the aluminum substrate with the LED lamp soldered is attached to the surface of the hollow housing part on one side of the hollow heat dissipating base, and the hollow heat dissipating base is required The LED lamp heat dissipating device is characterized in that it has various geometries and has a positioning part at the bottom to quickly position the LED lamp heat dissipating device and fix it to the wall. 前記アルミニアウム基板は中空状の放熱台座と組み合せることによって各種の幾何形状に設置可能で、LEDランプの数と配置はアルミニアウム基板のサイズと外形によって増減させたり変化をさせたりできることを特徴とする請求項１に記載するLEDランプの放熱装置。 The aluminum substrate can be installed in various geometric shapes by combining with a hollow heat dissipation pedestal, and the number and arrangement of LED lamps can be increased or decreased or changed depending on the size and outer shape of the aluminum substrate. Item 1. A heat dissipation device for an LED lamp according to item 1.
JP2007116406A 2007-04-26 2007-04-26 Heat radiator of led lamp Pending JP2008276999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007116406A JP2008276999A (en) 2007-04-26 2007-04-26 Heat radiator of led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007116406A JP2008276999A (en) 2007-04-26 2007-04-26 Heat radiator of led lamp

Publications (1)

Publication Number Publication Date
JP2008276999A true JP2008276999A (en) 2008-11-13

Family

ID=40054736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007116406A Pending JP2008276999A (en) 2007-04-26 2007-04-26 Heat radiator of led lamp

Country Status (1)

Country Link
JP (1) JP2008276999A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141290A (en) * 2008-12-11 2010-06-24 Advance Connectek Inc Light emitting diode light source module
JPWO2011055659A1 (en) * 2009-11-05 2013-03-28 株式会社エルム Large LED lighting device
JP2013211251A (en) * 2012-02-27 2013-10-10 Iwasaki Electric Co Ltd Light source unit
CN108488760A (en) * 2018-05-07 2018-09-04 张家港润盛科技材料有限公司 A kind of LED illumination lamp aluminium casing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126628U (en) * 1990-04-04 1991-12-20
JP2005229095A (en) * 2004-01-13 2005-08-25 Seiko Epson Corp Light source device and projection-type display device
JP2006293182A (en) * 2005-04-14 2006-10-26 Showa Denko Kk Backlight unit and liquid crystal display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126628U (en) * 1990-04-04 1991-12-20
JP2005229095A (en) * 2004-01-13 2005-08-25 Seiko Epson Corp Light source device and projection-type display device
JP2006293182A (en) * 2005-04-14 2006-10-26 Showa Denko Kk Backlight unit and liquid crystal display device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010141290A (en) * 2008-12-11 2010-06-24 Advance Connectek Inc Light emitting diode light source module
JPWO2011055659A1 (en) * 2009-11-05 2013-03-28 株式会社エルム Large LED lighting device
JP2013211251A (en) * 2012-02-27 2013-10-10 Iwasaki Electric Co Ltd Light source unit
CN108488760A (en) * 2018-05-07 2018-09-04 张家港润盛科技材料有限公司 A kind of LED illumination lamp aluminium casing

Similar Documents

Publication Publication Date Title
JP6098849B2 (en) Light bulb type LED lighting fixture
US20170016609A1 (en) Led luminaire
JP4668292B2 (en) LED lighting device and heat dissipation member of LED lighting device
TWI570356B (en) LED radiating lamp holder and its heat dissipation module
TWM321582U (en) Heat sink structure for light source device
US20120186798A1 (en) Cooling module for led lamp
JP5769307B2 (en) Lighting device
JP2008276999A (en) Heat radiator of led lamp
JP2014135350A (en) Heat sink
WO2019169938A1 (en) Vehicle lamp and vehicle
RU2619912C2 (en) Led lighting device
KR101410517B1 (en) Body radiant heat using a refrigerant with a removable high-power LED luminaire
JP5070272B2 (en) High power LED street light heat sink device
TW200907233A (en) LED lamp with a heat sink
CN202813286U (en) Radiator and illumination module group
CN205669721U (en) A kind of heat sinking formula LED street lamp light fixture
CA2897344C (en) Led lighting apparatus
JP6349798B2 (en) Vehicle lighting
CN104110661B (en) For cross-ventilation heat-dissipating LED lamp radiator structure
TWI315179B (en) Light emitting diode module
TWI524034B (en) Heat dissipating structure for led
TWI360620B (en) Led lamp
TWM421454U (en) Heat dissipation structure capable of facilitating thermal convection effect
TWI331199B (en) Led lamp having heat dissipation structure
KR100938290B1 (en) Heat sink for lighting apparatus

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20091215

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100519