JP2008211378A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of radiating heat generated by an imaging device to the outside of a housing. <P>SOLUTION: A hear radiation member 50 is provided abutting a circumferential part of a light transmitting region 4a of the imaging device 1 and an internal surface of a shielding case 20. Furthermore, a heat radiating member 60 is provided abutting against an external surface of the shielding case 20 and an internal surface of a housing 70. The heat generated by the imaging device 1 is conducted to the shielding case 20 via the heat radiation member 50 and further transmitted to the housing 70 via the heat radiating member 60 to be radiated to the outside. The shielding case 20 is provided with a holding portion 24, which clamps and holds the heat radiating member 50 with bent pieces 25 and 26. The housing 70 is provided with a holding portion 77, which clamps and holds the heat radiating member 60 with projection portions 78 and 79. Consequently, the heat radiating members 50 and 60 can be held immovably. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an imaging apparatus including means for radiating heat generated by an imaging element.

  Conventionally, a lot of electronic devices are mounted on a vehicle to perform various processes. However, in an in-vehicle environment, there is a risk that the ambient temperature becomes high. It is essential to do so. Imaging devices that are mounted in the vicinity of a vehicle bumper or in a side mirror or the like and image the periphery of the vehicle are widespread. However, in an image sensor such as a CCD or CMOS provided in the imaging device, noise is generated in an image captured due to a temperature rise. There is a risk that image quality deterioration such as occurrence may occur. In particular, in recent years, it has become possible to integrate a CCD or CMOS, which is a light receiving unit for performing imaging, and a processing circuit for correcting captured images on a single chip, which increases the amount of heat generated by the imaging element itself. Therefore, it is desirable to efficiently dissipate the heat generated by the image sensor.

  Patent Document 1 proposes a semiconductor device such as a CCD image sensor that can efficiently dissipate heat even when a heat dissipation block cannot be attached to the upper surface of the package. In this case, a heat dissipation block is attached to the lower surface side of the package of the semiconductor device, the heat dissipation block is passed through the printed circuit board on which the semiconductor device is mounted, and the fins provided on the heat dissipation block are located on the back side of the printed circuit board. With this configuration, heat can be radiated to the released space on the back side of the printed wiring board.

In Patent Document 2, a printed circuit board on which a heat generating element is mounted is accommodated in the case, a heat dissipating sheet that contacts both the heat generating element and the case is disposed, and a recess that receives the heat dissipating sheet is formed on the inner surface of the case. A heating element mounting structure that can stabilize the contact position of the heat dissipation sheet with a simple configuration has been proposed.
JP-A-7-283349 Japanese Patent Laid-Open No. 2002-280776

  However, the semiconductor device described in Patent Document 1 requires a free space on the back side of a printed wiring board on which a CCD image sensor or the like is mounted. The imaging device mounted on the vehicle is desirably as small as possible so as not to impair the aesthetic appearance of the vehicle, and it is difficult to secure a sufficient space on the back side of the printed wiring board.

  In addition, the mounting structure of the heating element described in Patent Document 2 is not a structure in which an imaging element such as a CCD or CMOS is considered as the heating element. Since the imaging element is configured to enclose an IC chip such as a CCD or CMOS forming a light receiving portion in a package and provide a light transmitting region to the light receiving portion using glass or the like in a part of the package. It is difficult to place both the image sensor and the case in contact with each other. Therefore, there is a problem that the mounting structure according to Patent Document 2 cannot be easily applied to an image sensor. Furthermore, the image pickup device is provided with a circuit board for the purpose of reducing the influence of electromagnetic noise from the outside on the circuit operation and preventing the electromagnetic noise generated by the noise source on the circuit board from being released to the outside. There is a case where a metal shield case is provided so as to cover, and in this case as well, there is a problem that the mounting structure according to Patent Document 2 cannot be applied. Therefore, a structure for heat dissipation suitable for the imaging device is required.

  The present invention has been made in view of such circumstances, and an object of the present invention is to bring the first heat radiating member into contact with the peripheral portion of the light-transmitting region of the image sensor and the shield case, and to shield the shield. The case is provided with a holding portion for holding the first heat radiating member, the second heat radiating member is brought into contact with the shield case and the housing or the lens barrel, and the second heat radiating member is attached to the housing or the lens barrel. An object of the present invention is to provide an imaging apparatus capable of efficiently dissipating heat generated by the imaging element from the housing through the first heat radiating member and the second heat radiating member by providing the holding portion for holding. . Note that the housing may be made of metal or synthetic resin.

  Another object of the present invention is to provide a first bent piece obtained by bending the edge portion of the opening of the shield case formed so as to allow light to pass through the image sensor, and a peripheral portion of the opening of the shield case. And a second bent piece that is bent by forming an incision, and the first bent piece and the second bent piece are configured to hold the first heat radiating member between the first and second imaging pieces. Another object of the present invention is to provide an imaging apparatus capable of securely fixing and holding a first heat radiating member between shield cases.

  Another object of the present invention is to provide an optical filter fixed to the light-transmitting region of the image pickup device, in which a bent piece formed by forming a cut in the shield case, and a side portion of the optical filter, By providing a configuration in which the first heat radiating member is sandwiched between the image pickup device and the shield case, an image pickup apparatus capable of reliably fixing and holding the first heat radiating member with a simple configuration is provided. There is.

  Another object of the present invention is to provide a first heat radiating member having a shape fitted to the optical filter when the optical filter fixed to the light transmitting region of the image sensor is provided. A holding portion that abuts the surrounding portion and the shield case, abuts the second heat radiating member on the shield case and the housing or the barrel, and holds the second heat radiating member on the housing or the barrel By providing the configuration, the present invention is to provide an imaging apparatus capable of efficiently radiating the heat generated by the imaging element to the housing through the first heat radiating member and the second heat radiating member with a simple configuration. .

  Another object of the present invention is to provide a plurality of protrusions on a casing or a lens barrel that comes into contact with the second heat dissipation member, and to hold the plurality of protrusions with the second heat dissipation member interposed therebetween. Accordingly, an object of the present invention is to provide an imaging device capable of reliably fixing and holding the second heat radiating member between the shield case and the casing or the lens barrel.

  Another object of the present invention is that when the housing is made of metal and also serves as a shield case, or when the shield case is unnecessary and not provided, the peripheral portion of the light-transmitting region of the image sensor and the housing or the lens barrel In addition, the heat radiation member is brought into contact with the housing or the lens barrel so that the housing or the lens barrel is provided with a holding portion for holding the heat radiation member, so that the heat generated by the imaging element can be efficiently radiated to the housing via the heat radiation member. An object of the present invention is to provide an imaging apparatus capable of

  Another object of the present invention is to provide an imaging device by providing a plurality of protrusions on a casing or a lens barrel with which a heat dissipation member abuts and holding the plurality of protrusions with the heat dissipation member interposed therebetween. An object of the present invention is to provide an imaging apparatus capable of securely fixing and holding a heat radiating member between a casing and a lens barrel.

  Another object of the present invention is to provide a projecting portion on a case or a lens barrel that comes into contact with a heat dissipation member when an optical filter fixed to a light-transmitting region of an image sensor is provided. And an imaging device that can securely hold the heat dissipation member with a simple configuration between the image pickup element and the housing or the lens barrel by holding the heat dissipation member between the protrusion and the projection. There is to do.

  Another object of the present invention is to provide a heat dissipating member fitted to the optical filter when the optical filter fixed to the light-transmitting region of the image sensor is provided. An object of the present invention is to provide an imaging apparatus capable of efficiently dissipating heat generated by an imaging element to a casing through a heat radiating member with a simple configuration by contacting the casing or the lens barrel.

  An image pickup apparatus according to a first aspect of the present invention includes an image pickup element in which a light receiving portion is enclosed in a package provided with a light-transmitting region, a shield case for shielding electromagnetic noise, and a housing that houses the image pickup element and the shield case. And a lens barrel that collects light to the image sensor and is fixed to the housing, and abuts on a peripheral portion of the light-transmitting region of the image sensor, and the shield A first heat dissipating member provided in contact with the case; a holding part provided in the shield case for holding the first heat dissipating member; abutting on the shield case; and the housing or the lens barrel. A second heat radiating member provided in contact with the housing; and a holding portion provided in the casing or the lens barrel in contact with the second heat radiating member and holding the second heat radiating member. To do.

  In the present invention, the first heat radiating member is brought into contact with the peripheral portion of the light-transmitting region of the image sensor and the shield case, and the second heat radiating member is brought into contact with the shield case and the casing or the lens barrel. Since the heat generated by the image sensor is transmitted to the shield case via the first heat radiating member and further transmitted to the housing via the second heat radiating member, the heat generated by the image sensor can be dissipated outside the housing. By adopting a configuration in which the heat dissipating member is brought into contact with only the peripheral portion of the light-transmitting region of the image sensor, the heat dissipating member does not hinder the image pickup of the image sensor. In addition, a holding part that holds the first heat radiating member is provided in the shield case, and a holding part that holds the second heat radiating member is provided in the casing or the lens barrel. Accordingly, it is possible to prevent the heat dissipation efficiency from deteriorating due to the displacement of the heat dissipating member due to the vibration applied to the imaging device.

  In the imaging device according to a second aspect of the present invention, the shield case is formed with an opening for allowing light to pass to the imaging element, and the holding part of the shield case has an edge portion of the opening of the shield case. A first bent piece bent toward the image pickup device, and a second bent piece formed by cutting a portion around the opening of the shield case and bending a part of the peripheral portion toward the image pickup device. And having the first heat radiating member sandwiched and held between the first bent piece and the second bent piece.

  In the present invention, the first bent piece is provided by bending the edge portion of the opening of the shield case formed to allow light to pass through the image sensor. Further, a U-shaped or semi-circular cut or the like is formed in the peripheral portion of the opening of the shield case, and the second bent piece is provided by bending the inner portion of the cut. A first heat dissipating member disposed between the image sensor and the shield case is sandwiched and fixed between the first and second bent pieces. The first heat dissipating member can be fixed immovably with a simple configuration simply by bending the shield case. In addition, the first heat radiating member can be easily positioned in the manufacturing process of the imaging device.

  An image pickup apparatus according to a third aspect of the present invention includes a plate-like optical filter fixed to a light-transmitting region of the image pickup element, and the holding part of the shield case forms a cut in the shield case. It has a bent piece bent to the image pickup device side, and the first heat radiating member is sandwiched and held between the side portion of the optical filter and the bent piece.

  In the present invention, for example, a U-shaped or semicircular cut is formed in the shield case, and a bent piece is provided by bending the inner portion of the cut. In many cases, it is necessary to mount an optical filter such as an optical low-pass filter or an infrared cut filter on the imaging device, and when the optical filter is bonded and fixed to the light-transmitting region of the imaging device using an adhesive or the like, The first heat radiating member disposed between the imaging element and the shield case is sandwiched and fixed by the bent piece of the shield case and the side portion of the optical filter. The first heat dissipating member can be fixed immovably with a simple configuration simply by bending the shield case. Moreover, by using the side part of an optical filter, the number of the bending pieces of a shield case may be small, and the increase in the manufacturing process of a shield case can be suppressed.

  An image pickup apparatus according to a fourth aspect of the present invention houses an image pickup element in which a light receiving portion is enclosed in a package provided with a light-transmitting region, a shield case for shielding electromagnetic noise, and the image pickup element and the shield case. A plate-like optical filter fixed to a light-transmitting region of the image pickup device in an image pickup apparatus having a case and a lens barrel that holds a lens that collects light to the image pickup device and is fixed to the case And a first heat radiating member provided in contact with the shield case and configured to fit into the optical filter, and in contact with the peripheral portion of the light-transmitting region of the imaging element, and in contact with the shield case And a second heat radiating member provided in contact with the casing or the lens barrel, and the second heat radiating member provided in the case or the lens barrel in contact with the second heat radiating member, and holding the second heat radiating member. Holding part to Characterized in that it comprises.

  In the present invention, when the optical filter is bonded and fixed to the light-transmitting region of the image sensor using an adhesive or the like, the first heat radiating member fitted to the optical filter is disposed around the light-transmitting region of the image sensor. And in contact with the shield case. The second heat radiating member is provided in contact with the shield case and the casing or the lens barrel. Since the heat generated by the image sensor is transmitted to the shield case via the first heat radiating member and further transmitted to the housing via the second heat radiating member, the heat generated by the image sensor can be dissipated outside the housing. By adopting a configuration in which the heat dissipating member is brought into contact with only the peripheral portion of the light-transmitting region of the image sensor, the heat dissipating member does not hinder the image pickup of the image sensor. In addition, since the first heat radiating member has a shape that fits into the optical filter, there is no deviation in the arrangement position. The second heat dissipating member prevents the disposition position from being displaced by forming a holding portion for holding the heat dissipating member in the housing or the lens barrel.

  The imaging device according to a fifth aspect of the present invention is the imaging device according to the fifth aspect, wherein the housing or the holding unit of the lens barrel includes a plurality of projecting portions provided so as to project from the housing or the lens barrel. Is held between a plurality of protrusions.

  In the present invention, a plurality of protrusions are provided on the casing or the lens barrel in contact with the second heat radiating member. The housing and the lens barrel are often formed of a synthetic resin or the like, and the protrusion can be easily provided. A second heat radiating member disposed between the shield case and the casing or the lens barrel is sandwiched and fixed by a plurality of protrusions. The second heat dissipating member can be fixed in a simple configuration. In addition, the second heat radiating member can be easily positioned in the manufacturing process of the imaging device.

  According to a sixth aspect of the present invention, there is provided an image pickup apparatus in which a light receiving unit is enclosed in a package provided with a light-transmitting region, a housing that houses the image pickup element, and the light is condensed on the image pickup element. In an imaging device that includes a lens barrel that holds a lens and is fixed to the casing, heat dissipation is provided in contact with the peripheral portion of the light-transmitting region of the imaging element and in contact with the casing or the barrel. It is provided with the member and the holding | maintenance part which is provided in the said housing | casing or the said lens-barrel which this heat dissipation member contacts, and hold | maintains the said heat dissipation member.

  In the present invention, the heat radiating member is provided in contact with the peripheral portion of the light-transmitting region of the image sensor and the housing or the lens barrel. The heat generated by the image sensor is transmitted to the housing through the heat radiating member, or is transmitted to the lens barrel through the heat radiating member and then transmitted to the housing, so that heat can be radiated outside the housing. In addition, by providing the housing or the lens barrel with the holding portion that holds the heat radiating member, it is possible to prevent the heat radiating member from being displaced due to vibration applied to the imaging device and the heat radiating efficiency from being deteriorated.

  In the imaging device according to a seventh aspect of the invention, the holding part has a plurality of protrusions provided so as to protrude from the housing or the lens barrel, and holds the heat dissipation member sandwiched between the plurality of protrusions. It is characterized by the above.

  In the present invention, a plurality of protrusions are provided on the casing or the lens barrel with which the heat dissipation member abuts. The housing and the lens barrel are often formed of a synthetic resin or the like, and the protrusion can be easily provided. A heat dissipating member disposed between the image sensor and the casing or the lens barrel is sandwiched and fixed by a plurality of protrusions. The heat dissipating member can be fixed in a simple configuration. In addition, the heat radiating member can be easily positioned in the manufacturing process of the imaging device.

  An image pickup apparatus according to an eighth aspect of the present invention includes a plate-like optical filter fixed to a light-transmitting region of the image pickup element, and the holding portion protrudes from the housing or the lens barrel. And the heat radiation member is sandwiched and held by the side portion of the optical filter and the protruding portion.

  In the present invention, when the optical filter is bonded and fixed to the light-transmitting region of the image sensor using an adhesive or the like, a protrusion is formed on the housing or the lens barrel, and the protrusion and the side of the optical filter Thus, the heat dissipating member disposed between the image sensor and the casing or the lens barrel is sandwiched and fixed. By using the side portion of the optical filter, the number of protrusions provided on the housing or the lens barrel may be small.

  According to a ninth aspect of the present invention, there is provided an image pickup apparatus in which a light receiving section is enclosed in a package provided with a light-transmitting region, a housing that houses the image pickup element, and light collected on the image pickup element. In an imaging apparatus that includes a lens barrel and a lens barrel that is fixed to the housing, a plate-like optical filter that is fixed to the light-transmitting region of the image sensor, and a peripheral portion of the light-transmitting region of the image sensor And a heat radiating member provided in contact with the casing or the lens barrel and configured to fit into the optical filter.

  In the present invention, when the optical filter is bonded and fixed to the light-transmitting region of the image pickup device using an adhesive or the like, the heat dissipating member to be fitted to the optical filter is disposed around the light-transmitting region of the image pickup device and the housing Alternatively, it is provided in contact with the lens barrel. The heat generated by the image sensor is transmitted to the housing through the heat radiating member, or is transmitted to the lens barrel through the heat radiating member and then transmitted to the housing, so that heat can be radiated outside the housing. By adopting a configuration in which the heat dissipating member is brought into contact with only the peripheral portion of the light-transmitting region of the image sensor, the heat dissipating member does not hinder the image pickup of the image sensor. Further, since the heat dissipating member has a shape that fits into the optical filter, there is no deviation in the arrangement position.

  In the case of the first invention, the first heat radiating member is brought into contact with the peripheral portion of the light-transmitting region of the image sensor and the shield case, and the holding part for holding the first heat radiating member is provided in the shield case. The second heat radiating member is brought into contact with the shield case and the housing or the lens barrel, and the holding unit for holding the second heat radiating member is provided in the housing or the lens barrel, so that the heat generated by the image sensor. Can be radiated to the outside of the housing through the first heat radiating member, the shield case, and the second heat radiating member, so that it is possible to prevent the image quality of the image picked up by the image sensor from being degraded or the image sensor from malfunctioning. .

  In the case of the second invention, the edge portion of the opening of the shield case is bent to form a first bent piece, and the second bent piece is formed by forming a notch in the peripheral portion of the opening of the shield case. By providing the first bent piece and the second bent piece with the first heat radiating member sandwiched between them, the first heat radiating member is immovable with a simple structure that only bends the shield case. Therefore, the reliability of heat dissipation can be improved, and the first heat dissipation member can be easily positioned, so that the manufacturing process of the imaging device can be prevented from becoming complicated.

  In the case of the third invention, when the optical filter fixed to the light-transmitting region of the image sensor is provided, the bent piece formed by cutting the shield case and bent, and the side of the optical filter are the first. Since the first heat dissipating member can be fixed immovably with a simple structure simply by bending the shield case, the reliability of heat dissipating can be improved. By using the side part of the optical filter, it is possible to reduce the number of bent pieces of the shield case, so it is possible to suppress the complexity of the manufacturing process of the shield case and more reliably suppress the complexity of the manufacturing process of the imaging device. it can.

  In the case of the fourth invention, the first heat radiating member fitted to the optical filter is provided in contact with the peripheral portion of the light-transmitting region of the image sensor and the shield case, and the shield case and the casing or the lens barrel are provided. The second heat radiating member is brought into contact with the housing and the lens barrel is provided with a holding portion for holding the second heat radiating member, so that the heat generated by the imaging element is generated by the first heat radiating member and the shield case. Since the heat can be radiated to the outside of the housing through the second heat radiating member, it is possible to prevent the image quality of the image picked up by the image pickup device from being deteriorated or the image pickup device from malfunctioning. In addition, since the first heat radiating member has a shape that fits into the optical filter, and there is no deviation in the arrangement position or the like, the reliability of heat radiation can be improved.

  According to the fifth aspect of the present invention, a plurality of protrusions are provided on the casing or the lens barrel that comes into contact with the second heat dissipation member, and the plurality of protrusions hold the second heat dissipation member therebetween. Since the second heat radiating member can be fixedly fixed with a simple configuration, the reliability of heat radiating can be improved, and the positioning of the second heat radiating member can be easily performed. The complexity of the manufacturing process can be suppressed.

  Further, in the case of the sixth invention, the heat dissipation member is brought into contact with the peripheral portion of the light-transmitting region of the image sensor and the housing or the lens barrel, and the holding portion for holding the heat dissipation member is provided in the housing or the lens barrel. By doing so, the heat generated by the image sensor can be radiated to the outside of the housing through the heat radiating member, so that it is possible to prevent the image quality of the image captured by the image sensor from deteriorating or the malfunction of the image sensor.

  According to the seventh aspect of the present invention, a plurality of protrusions are provided on the casing or the lens barrel with which the heat dissipation member abuts, and the plurality of protrusions hold the heat dissipation member so as to dissipate heat with a simple configuration. Since the member can be fixed immovably, the reliability of heat dissipation can be increased, and the positioning of the heat dissipation member can be easily performed, so that the complexity of the manufacturing process of the imaging device can be suppressed.

  According to the eighth aspect of the invention, when the optical filter fixed to the light-transmitting region of the image sensor is provided, a protrusion is provided on the casing or the lens barrel that comes into contact with the heat dissipation member, and the side and protrusion of the optical filter are provided. By holding the heat-dissipating member in between, the heat-dissipating member can be fixed immovably with a simple structure in which only a small number of protrusions are provided on the housing or the lens barrel, thus improving the reliability of heat dissipation. Can do.

  According to the ninth aspect of the invention, in the case where the optical filter fixed to the light transmitting region of the image sensor is provided, the heat dissipating member that fits into the optical filter is attached to the peripheral portion of the light transmitting region of the image sensor and the housing. By adopting a configuration in contact with the lens barrel, the heat generated by the image sensor can be dissipated outside the housing via the heat radiating member, so that the image quality of the image captured by the image sensor or the malfunction of the image sensor may be reduced. It can be prevented from occurring, and the heat dissipating member has a shape that fits into the optical filter, and the disposition position or the like is not displaced, so the reliability of heat dissipating can be improved.

(Embodiment 1)
Hereinafter, the present invention will be specifically described with reference to the drawings showing embodiments thereof. FIG. 1 is a schematic side cross-sectional view showing the configuration of the imaging apparatus according to Embodiment 1 of the present invention. In the figure, reference numeral 1 denotes an image pickup device, in which an IC chip 2 in which CCDs or CMOSs forming a light receiving portion are integrated is enclosed in a synthetic resin package 3 having a substantially rectangular plate shape. The imaging device 1 has a substantially rectangular glass plate 4 embedded in the center of one surface of the package 3 (hereinafter referred to as the upper surface), so that the IC chip 2 receives light through the glass plate 4 and performs imaging. It is. That is, the imaging element 1 is provided with a substantially rectangular light-transmitting region 4a at the center of the upper surface of a substantially rectangular shape, and the IC chip 2 in the package 3 performs imaging through the light-transmitting region 4a.

  The image pickup device 1 is mounted on a circuit board 10, and other electronic components (not shown) such as an IC, a resistor, and a capacitor are mounted on the circuit board 10 to constitute an electronic circuit. In order to block the image pickup device 1 and other electronic components mounted on the circuit board 10 from external electromagnetic noise, and to prevent the electromagnetic noise generated by the image pickup device 1 and other electronic components from being released to the outside. The imaging apparatus includes a metal shield case 20. The shield case 20 has a square cylindrical peripheral wall portion 21 and an upper wall portion 22 that closes one end side of the peripheral wall portion 21 (hereinafter, this one end side is referred to as an upper end side and the opposite side is referred to as a lower end side). The lower end side of the peripheral wall portion 21 is released so as to be fitted on the circuit board 10. The shield case 20 is fixed to the circuit board 10 by a method such as screwing or welding while being externally fitted to the circuit board 10. In the upper wall portion 22 of the shield case 20, an opening 23 through which light to the image sensor 1 passes is formed at a position facing the light transmitting region 4 a of the image sensor 1 mounted on the circuit board 10.

  Further, the imaging apparatus according to the present invention includes a heat dissipation member 50 interposed between the imaging element 1 and the shield case 20. 2A and 2B are schematic views showing the configuration of the heat dissipation member 50 of the image pickup apparatus according to Embodiment 1 of the present invention. FIG. 2A is a side sectional view, and FIG. 2B is a plan view. The heat radiating member 50 has a substantially U-shaped plate shape in plan view, and is integrally formed of a material having high heat transfer efficiency. In the imaging apparatus according to Embodiment 1, the two heat radiating members 50 are brought into contact with the upper surface of the imaging element 1 so as to surround the light-transmitting region 4a of the imaging element 1 with the U-shaped recess 51 facing each other. It is arranged. That is, the two heat radiating members 50 are disposed so as to contact the peripheral portion of the light-transmitting region 4 a of the imaging device 1.

  Further, when the shield case 20 is fixed to the circuit board 10, the heat radiating member 50 is in contact with the upper surface of the image pickup device 1 and the upper surface of the heat radiating member 50 is the inner surface (upper wall) of the shield case 20. The thickness is in contact with the lower surface of the portion 22, and is fixed between the imaging element 1 and the shield case 20 so as to be fixed in the vertical direction (up and down direction). On the other hand, in order to fix the heat radiating member 50 immovably in the horizontal direction, the shield case 20 is provided with a holding portion 24 for holding the heat radiating member 50.

  3A and 3B are schematic views showing the configuration of the shield case 20 of the imaging apparatus according to Embodiment 1 of the present invention, where FIG. 3A is a side sectional view, FIG. 3B is a plan view, and FIG. Is a development view. FIG. 4 is a schematic perspective view showing the configuration of the shield case 20 of the imaging apparatus according to Embodiment 1 of the present invention. The shield case 20 is formed by cutting a thin metal plate into the shape shown in FIG. 3 (c) and bending it (in FIG. 3 (c), the cutting line is shown by a solid line, and the folding curve is shown). Is indicated by a broken line). As described above, the shield case 20 has a container shape having the upper wall portion 22 and the peripheral wall portion 21, and a substantially rectangular opening 23 is formed in the upper wall portion 22. The size of the opening 23 is substantially the same as or slightly larger than the light-transmitting region 4a of the image sensor 1. A substantially trapezoidal bent piece 25 is provided on each side of the inner edge portion of the substantially rectangular opening 23, and the bent piece 25 is bent inside the shield case 20 at a substantially right angle.

  In addition, a U-shaped cut 26a is formed inwardly between the four sides of the opening 23 and the four sides of the upper wall portion 22 in the substantially rectangular upper wall portion 22, and is surrounded by the cut 26a. Each portion is a bent piece 26. The bent pieces 26 are bent at substantially right angles inside the shield case 20 so that the four bent pieces 26 face the four bent pieces 25 provided in the opening 23. The holding portion 24 that holds the heat radiating member 50 is configured by bent pieces 25 and 26 bent inward of the shield case 20, and holds the heat radiating member 50 between the opposed bent pieces 25 and 26. Thus, the heat radiating member 50 can be fixed in the horizontal direction of the imaging apparatus.

  In addition, the imaging apparatus includes a housing 70 that holds the circuit board 10 on which the imaging element 1 is mounted and the heat radiating member 50 and accommodates the shield case 20 and the like fixed to the circuit board 10. The housing 70 is made of a synthetic resin and has a substantially rectangular parallelepiped shape. A substantially cylindrical lens barrel 73 projects from one surface. One or a plurality of lenses 74 are coaxially held in the lens barrel portion 73, and pass through the light-transmitting region 4 a to the IC chip 2 that forms the light receiving portion of the image sensor 1 housed in the housing 70. To collect external light.

  The casing 70 is divided into a front casing 71 and a rear casing 72. After the circuit board 10 and the shield case 20 are accommodated, the casing 70 is fixed by a method such as screwing, bonding or welding. It is like that. A substrate fixing part 75 for fixing the circuit board 10 is formed in the rear side casing 72, and the circuit board 10 is fixed to the board fixing part 75 by a method such as screwing, bonding or welding. is there.

  In addition, the imaging apparatus according to the present invention includes a heat radiating member 60 interposed between the shield case 20 accommodated in the housing 70 and the front housing 71. FIGS. 5A and 5B are schematic views showing the configurations of the front-side casing 71 and the heat dissipation member 60 of the image pickup apparatus according to Embodiment 1 of the present invention, in which FIG. 5A shows a side sectional view and FIG. Is shown. The heat radiating member 60 has a substantially rectangular shape in which a substantially rectangular opening 61 is formed at the center of a substantially rectangular plate, and is integrally formed of a material having high heat transfer efficiency. When the shield case 20 fixed to the circuit board 10 is accommodated in the housing 70, the heat radiating member 60 abuts on the upper surface of the shield case 20, and the inner surface (the lens barrel portion 73 of the front side housing 71). The thickness is in contact with the surface opposite to the projecting surface, and is fixed between the shield case 20 and the front casing 71 so as not to be fixed in the vertical direction. On the other hand, in order to fix the heat radiating member 60 in the horizontal direction, a holding portion 77 for holding the heat radiating member 60 is formed on the inner surface of the front case 71.

  A substantially circular opening 73a communicating with the inside of the lens barrel 73 is formed on the inner surface of the front housing 71, and four projecting portions 78 having a substantially rectangular plate shape are formed so as to surround the opening 73a. . Further, four projecting portions 79 each having a substantially rectangular plate shape are formed so as to face each other with a predetermined interval from the four projecting portions 78. The holding portion 77 that holds the heat radiating member 60 is constituted by four projecting portions 78 and four projecting portions 79 formed on the inner surface of the front-side casing 71, and the heat radiating member 60 is interposed between the opposing projecting portions 78 and 79. By sandwiching and holding, the heat radiating member 60 can be fixed in the horizontal direction of the imaging device.

  The heat generated from the IC chip 2 when the image pickup device 1 performs the image pickup process is transferred to the package 3 of the image pickup device 1 and is transferred to the shield case 20 via the heat radiating member 50 in contact with the upper surface of the image pickup device 1. The Furthermore, heat is transmitted to the housing 70 via the heat radiating member 60 that contacts the upper surface of the shield case 20, and can be radiated to the outside of the housing 70.

  In the imaging device having the above configuration, heat is transmitted to the shield case 20 via the heat dissipation member 50 that contacts the periphery of the light-transmitting region 4 a of the image sensor 1, and heat is further applied to the housing 70 via the heat dissipation member 60. By adopting the transmission configuration, it is possible to easily and reliably radiate heat without hindering the imaging of the imaging device 1. Further, by providing the shield case 20 with the holding portion 24 that holds the heat dissipation member 50, the heat dissipation member 50 sandwiched between the imaging element 1 and the shield case 20 can be fixed immovably. Even when an impact or the like is applied to the apparatus, the heat radiating member 50 is not displaced, and the heat radiating member 50 can be easily positioned in the imaging device assembly process. In addition, the holding portion 24 can be easily formed simply by bending the bent pieces 25 and 26 provided in the shield case 20. Further, by providing the holding portion 77 for holding the heat dissipation member 60 on the inner surface of the front case 71, the heat dissipation member 60 sandwiched between the shield case 20 and the front case 71 is fixedly fixed. Therefore, the heat radiating member 60 is not displaced and the heat radiating member 60 can be easily positioned.

  In the imaging device according to the present embodiment, the heat radiating member 50 is substantially U-shaped. However, the shape is not limited to this, and may be another shape. Moreover, although it was set as the structure provided with the two heat radiating members 50, it is not restricted to this, It is good also as a structure provided with 1 or 3 or more heat radiating members. Moreover, although the heat radiating member 60 was made into the substantially square shape, it is not restricted to this, Other shapes may be sufficient. Moreover, although it was set as the structure provided with the one heat radiating member 60, it is not restricted to this, It is good also as a structure provided with two heat radiating members similarly to the heat radiating member 50, and it is good also as a structure provided with three or more heat radiating members. . Further, the shapes of the holding portions 24 and 77 that hold the heat radiating members 50 and 60 are not limited to those shown in the drawings, and may be other shapes. Moreover, you may adhere | attach the heat radiating members 50 and 60 to the shield case 20 and the front side housing | casing 71 using an adhesive agent.

(Modification)
FIG. 6 is a schematic plan view showing the configuration of the heat dissipation member of the imaging device according to the modification of Embodiment 1 of the present invention, and shows three modifications. The heat radiating member 50 shown in FIG. 2 is substantially U-shaped in a plan view. For example, as shown in FIG. It is good also as a structure which contact | abuts to the translucent area | region 4a peripheral part of the package 3 in the 2 sides which the translucent area | region 4a which comprises these. Further, as shown in FIG. 3B, two heat dissipating members 50 b that are substantially L-shaped in a plan view may be provided so as to surround the light-transmitting region 4 a of the image sensor 1. As shown in FIG. 3C, four heat dissipating members 50c having a substantially rectangular shape in plan view are arranged along the four sides of the light transmitting region 4a having a substantially rectangular shape in the image pickup device 1, and the light transmitting region 4a. It is good also as a structure provided so that it may surround. In addition, although illustration is abbreviate | omitted, the shape of the heat radiating member 60 interposed between the shield case 20 and the front side housing | casing 71 can also be made into various shapes, as shown in FIG.

(Embodiment 2)
FIG. 7 is a schematic side cross-sectional view showing the configuration of the imaging apparatus according to Embodiment 2 of the present invention. The imaging device according to the second embodiment is the same as the imaging device according to the first embodiment in the configuration of the imaging device 1, the circuit board 10, the heat radiating member 50, the heat radiating member 60, the housing 70, and the like. The configuration of the shield case 220 that is fixed to is different. The shield case 220 of the present embodiment has four bent pieces 26 as in the shield case 20 of the first embodiment, but does not have the bent pieces 25 at the inner edge portion of the opening 23.

  Further, the imaging apparatus according to Embodiment 2 includes an optical filter 90 that is attached to the light-transmitting region 4 a of the imaging element 1 with an adhesive or the like. The optical filter 90 is a plate body having a substantially rectangular shape in plan view that is substantially the same size as the light-transmitting region 4a, and has a function such as an optical low-pass filter or an infrared cut filter. The holding portion 224 that holds the two substantially U-shaped heat dissipation members 50 interposed between the imaging element 1 and the shield case 20 in the horizontal direction of the imaging device is a bent piece on the outer surface of the heat dissipation member 50. 26, and the side surface of the optical filter 90 is brought into contact with the inner side surface of the heat radiating member 50, thereby holding the heat radiating member 50.

  In the imaging apparatus according to Embodiment 2 having the above-described configuration, the shield case 220 is bent at the inner edge portion of the opening 23 by adopting a configuration in which the inner surface of the heat dissipation member 50 is brought into contact with the side surface of the optical filter 90. Since it is not necessary to provide a piece, there is an advantage that the shield case 220 can be easily manufactured. The shape of the heat radiating member 50 may be other shapes as shown in the modification of the first embodiment.

  Note that other configurations of the imaging apparatus according to the second embodiment are the same as the configurations of the imaging apparatus according to the first embodiment, and accordingly, corresponding portions are denoted by the same reference numerals and description thereof is omitted.

(Embodiment 3)
FIG. 8 is a schematic side sectional view showing the configuration of the imaging apparatus according to Embodiment 3 of the present invention. FIG. 9 is a schematic diagram showing the configuration of the heat dissipation member 350 of the imaging apparatus according to Embodiment 3 of the present invention, in which (a) shows a side sectional view and (b) shows a plan view. . The image pickup apparatus according to the third embodiment is the same as the image pickup apparatus according to the second embodiment in the configuration of the image pickup element 1, the circuit board 10, the optical filter 90, the heat radiating member 60, the housing 70, and the like. The structure of the heat radiating member 350 interposed between the image pickup device 1 and the shield case 320 is different from the shield case 320 fixed to the image sensor. The shield case 320 of the third embodiment is not provided with a bent piece, only the opening 23 is formed, and is not provided with a holding part for holding the heat radiating member 350.

  Further, the heat radiating member 350 has a substantially rectangular plate shape, and an opening 351 that fits into the optical filter 90 having a substantially rectangular plate shape is formed in the center. That is, the heat radiating member 350 has a substantially square shape having an opening 351 at the center. The heat radiating member 350 can be fixed in the horizontal direction of the image pickup device by fitting the heat radiating member 350 to the optical filter 90 attached to the light transmitting region 4a of the image pickup device 1. Further, the heat radiating member 350 is in contact with the periphery of the light-transmitting region 4a of the image sensor 1 and is also in contact with the inner surface of the shield case 320. The heat radiating member 350 is sandwiched between the image sensor 1 and the shield case 320 to It can be fixed immovably in the vertical direction.

  In the imaging apparatus according to Embodiment 3 having the above-described configuration, the holding unit for holding the heat radiating member 350 in the shield case 320 is provided by adopting a configuration in which the heat radiating member 350 is fitted and fixed to the optical filter 90. Since it is not necessary to provide the shield case 320, there is an advantage that the shield case 320 can be manufactured more easily.

  Note that the other configuration of the imaging apparatus according to Embodiment 3 is the same as that of the imaging apparatus according to Embodiment 2, and therefore corresponding parts are denoted by the same reference numerals and description thereof is omitted.

(Embodiment 4)
FIG. 10 is a schematic side view showing the configuration of the imaging apparatus according to Embodiment 4 of the present invention. The imaging device according to the fourth embodiment has a configuration that does not include the shield case included in the imaging device according to the first to third embodiments. For this reason, the two heat radiating members 50 having a substantially U shape in plan view are interposed so as to contact the peripheral portion of the light transmitting region 4a of the image sensor 1 and to contact the inner surface of the front housing 71. ing. Further, a holding portion 77 constituted by projecting portions 78 and 79 is provided on the inner surface of the front-side housing 71, the projecting portion 78 abuts on the inner side surface of the heat radiating member 50, and the projecting portion on the outer side surface. 79 abuts and holds the heat dissipation member 50. Accordingly, the heat radiating member 50 can be fixed in a stationary manner in the vertical direction and the horizontal direction of the imaging apparatus.

  In the imaging apparatus according to the fourth embodiment having the above configuration, the heat generated by the imaging element 1 can be transmitted to the housing 70 via the heat dissipation member 50 and can be radiated to the outside of the housing 70. For example, when the housing 70 is made of metal and also serves as a shield case, or when the imaging apparatus does not include a shield case due to the need for no electromagnetic noise countermeasures, the heat radiating member 50 is directly connected to the imaging element 1 and the housing. By interposing between the bodies 70, heat can be easily radiated. In addition, the shape of the heat radiating member 50 is not limited to a substantially U shape, and may be various other shapes as shown in the modification of the first embodiment.

  Note that the other configuration of the imaging apparatus according to Embodiment 4 is the same as that of the imaging apparatus according to Embodiment 1, and therefore, corresponding portions are denoted by the same reference numerals and description thereof is omitted.

(Embodiment 5)
FIG. 11 is a schematic side cross-sectional view showing a configuration of an imaging apparatus according to Embodiment 5 of the present invention. The imaging device according to the fifth embodiment is the same as the imaging device according to the fourth embodiment in the configuration of the imaging device 1, the circuit board 10, the heat radiation member 50, the rear housing 72, and the like, but the front housing 571. The configuration of is different. The front-side housing 571 of the fourth embodiment has a protruding portion 79 that contacts the outer side surface of the heat dissipation member 50 as in the fourth embodiment, but has a protruding portion 78 that contacts the inner side surface. Not done.

  In addition, the imaging apparatus according to Embodiment 5 includes an optical filter 90 that is attached to the light-transmitting region 4a of the imaging element 1 with an adhesive or the like. The optical filter 90 is a plate body having a substantially rectangular shape in plan view that is substantially the same size as the light-transmitting region 4a, and has a function such as an optical low-pass filter or an infrared cut filter. A holding portion 577 that holds two substantially U-shaped heat dissipating members interposed between the image pickup device 1 and the front-side housing 571 causes the protruding portion 79 to abut on the outer side surface of the heat dissipating member 50. The heat radiating member 50 is held by bringing the side surface of the optical filter 90 into contact with the inner side surface of the heat radiating member 50.

  In the imaging device according to the fifth embodiment having the above configuration, by forming the inner surface of the heat radiating member 50 in contact with the side surface of the optical filter 90, the number of protrusions formed on the front housing 571 is small. Since it is good, there exists an advantage that manufacture of the front side housing | casing 571 can be performed easily.

  Note that the other configuration of the imaging apparatus according to Embodiment 5 is the same as that of the imaging apparatus according to Embodiment 4, and therefore, corresponding portions are denoted by the same reference numerals and description thereof is omitted.

(Embodiment 6)
FIG. 12 is a schematic cross-sectional view showing the configuration of the imaging apparatus according to Embodiment 6 of the present invention. The imaging device according to the sixth embodiment has the same configuration as the imaging device according to the fifth embodiment, except for the configuration of the imaging device 1, the circuit board 10, the optical filter 90, the rear housing 72, and the like. And the structure of the thermal radiation member 350 interposed between the image pick-up element 1 and the front side housing | casing 671 differs. The front housing 671 of the sixth embodiment is not provided with a protrusion on the inner surface and is not provided with a holding part that holds the heat dissipation member 350.

  Further, the heat radiating member 350 is substantially the same as that provided in the imaging apparatus according to the third embodiment, and has a substantially square shape having an opening 351 that fits in the optical filter 90 at the center. The heat radiating member 350 can be fixed in the horizontal direction of the image pickup device by fitting the heat radiating member 350 to the optical filter 90 attached to the light transmitting region 4a of the image pickup device 1. Further, the heat radiating member 350 is in contact with the periphery of the light-transmitting region 4 a of the image sensor 1 and is also in contact with the inner surface of the front case 671. Can be fixed in the vertical direction of the imaging device.

  In the imaging apparatus according to Embodiment 6 having the above configuration, the heat dissipation member 350 is held in the front-side casing 671 by holding the heat dissipation member 350 in the optical filter 90 and fixed. Since there is no need to provide a portion, there is an advantage that the front housing 671 can be manufactured more easily.

  Note that the other configuration of the imaging apparatus according to Embodiment 6 is the same as that of the imaging apparatus according to Embodiment 5, and therefore, corresponding portions are denoted by the same reference numerals and description thereof is omitted.

(Embodiment 7)
FIG. 13 is a schematic side cross-sectional view showing the configuration of the imaging apparatus according to Embodiment 7 of the present invention. The imaging device according to the fourth to sixth embodiments has a configuration in which a heat dissipation member is interposed between the imaging device 1 and the front case, but the imaging device according to the seventh embodiment holds the imaging device 1 and the lens 74. The heat dissipating member 750 is interposed between the lens barrel 780 and the lens barrel 780.

  The lens barrel 780 of the image pickup apparatus according to Embodiment 7 has a substantially cylindrical cylindrical portion 781 that holds a plurality of lenses 74 coaxially, and a thread groove 782 is formed on the outer peripheral surface of the cylindrical portion 781. It is. Further, a substantially circular collar portion 783 is provided on the outer peripheral surface at one end of the cylindrical portion 781. The front side housing 771 of the image pickup apparatus has a substantially cylindrical tube portion 773 formed on the front surface with a screw groove 773a screwed into the screw groove 782 of the lens barrel 780. The lens barrel 780 is fixed to the front housing 771 by screwing the lens barrel 780 into the tube portion 773 from the inside of the side housing 771.

  In addition, the imaging apparatus according to Embodiment 7 includes a heat radiating member 750 that is in contact with the peripheral portion of the light-transmitting region 4 a of the imaging element 1 and that is in contact with the flange portion 783 of the lens barrel 780. 14A and 14B are schematic views showing the configuration of the heat dissipation member 750 of the imaging apparatus according to Embodiment 7 of the present invention, where FIG. 14A is a side sectional view and FIG. 14B is a plan view. The heat dissipating member 750 has an annular configuration in which a circular opening 751 is formed at the center of the disc body, and the diameter of the opening 751 is substantially equal to the length of the diagonal line of the light transmitting region 4 a provided in the image sensor 1. It is. Thereby, the heat radiating member 750 can be brought into contact with the peripheral portion of the light transmitting region 4a without covering the light transmitting region 4a of the imaging element 1.

  In addition, a holding portion 784 that holds the heat dissipation member 750 is provided on the flange portion 783 of the lens barrel 780. FIG. 15 is a schematic rear view showing the configuration of the heat dissipation member 750 and the lens barrel 780 of the imaging apparatus according to Embodiment 7 of the present invention. The collar portion 783 of the lens barrel 780 is substantially circular when viewed from the back, and an opening 783a communicating with the tube portion 781 on which the lens 74 is held is formed at the center. An annular projection 785 is formed on the back surface of the flange portion 783 so as to surround the opening 783a, and an annular projection 786 is formed concentrically at a predetermined interval from the projection 785. The inner protruding portion 785 is fitted into the opening 751 of the heat radiating member 750, the outer protruding portion 786 is fitted to the outer periphery of the heat radiating member 750, and the holding portion 784 includes the protruding portion 785 and the protruding portion 785. The heat dissipation member 750 is sandwiched between 786 and held.

  The heat generated from the IC chip 2 when the image pickup device 1 performs image pickup processing is transferred to the package 3 of the image pickup device 1 and is transferred to the lens barrel 780 via the heat radiating member 750 that contacts the upper surface of the image pickup device 1. The Further, heat is transmitted to the housing 70 to which the lens barrel 780 is screwed, and can be radiated to the outside of the housing 70.

  In the imaging apparatus according to Embodiment 7 having the above configuration, the heat radiating member 750 is interposed between the imaging element 1 and the lens barrel 780 so that heat generated by the imaging element 1 is transmitted to the housing 70. And can dissipate heat. In the present embodiment, the configuration in which the imaging device does not include the shield case is shown, but the same configuration can be applied even when the imaging device includes the shield case. In this case, what is necessary is just to set it as the structure which interposes the heat radiating member 750 shown in FIGS. 13-15 between a shield case and a lens-barrel. In addition, the imaging device may include an optical filter. In this case, the optical filter is attached to the imaging element 1 and the heat dissipation member is fitted to the optical filter, so that the lens barrel 780 holds the optical filter. A configuration in which the portion 784 is not provided can also be employed. Further, the heat radiating member 750 may not be brought into contact with the lens barrel 780 but may be brought into contact with a lens held by the lens barrel.

  In addition, since the other structure of the imaging device which concerns on Embodiment 7 is the same as that of the structure of the imaging device which concerns on Embodiment 4, the same code | symbol is attached | subjected to a corresponding location and description is abbreviate | omitted.

It is a typical sectional side view which shows the structure of the imaging device which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the structure of the thermal radiation member of the imaging device which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the structure of the shield case of the imaging device which concerns on Embodiment 1 of this invention. It is a typical perspective view which shows the structure of the shield case of the imaging device which concerns on Embodiment 1 of this invention. It is a schematic diagram which shows the structure of the front side housing | casing and heat radiating member of the imaging device which concerns on Embodiment 1 of this invention. It is a typical top view which shows the structure of the thermal radiation member of the imaging device which concerns on the modification of Embodiment 1 of this invention. It is a typical sectional side view which shows the structure of the imaging device which concerns on Embodiment 2 of this invention. It is a typical sectional side view which shows the structure of the imaging device which concerns on Embodiment 3 of this invention. It is a schematic diagram which shows the structure of the thermal radiation member of the imaging device which concerns on Embodiment 3 of this invention. It is a typical side view which shows the structure of the imaging device which concerns on Embodiment 4 of this invention. It is a typical sectional side view which shows the structure of the imaging device which concerns on Embodiment 5 of this invention. It is typical sectional drawing which shows the structure of the imaging device which concerns on Embodiment 6 of this invention. It is a typical sectional side view which shows the structure of the imaging device which concerns on Embodiment 7 of this invention. It is a schematic diagram which shows the structure of the thermal radiation member of the imaging device which concerns on Embodiment 7 of this invention. It is a typical back view which shows the structure of the thermal radiation member of the imaging device which concerns on Embodiment 7 of this invention, and a lens-barrel.

Explanation of symbols

1 Image sensor 2 IC chip (light receiving part)
3 Package 4 Glass plate 4a Translucent area 10 Circuit board 20 Shield case 23 Opening 24 Holding part 25 Folded piece (first bent piece)
26 folded piece (second folded piece)
26a cut 50, 50a, 50b, 50c heat radiating member (first heat radiating member)
60 Heat dissipation member (second heat dissipation member)
DESCRIPTION OF SYMBOLS 70 Case 71 Front side case 72 Back side case 73 Lens barrel part 74 Lens 77 Holding part 78, 79 Projection part 90 Optical filter 220 Shield case 224 Holding part 320 Shield case 350 Heat dissipation member 571 Front side case 577 Holding part 671 Front housing 750 Heat dissipation member 771 Front housing 780 Lens barrel 784 Holding section 785, 786 Projection

Claims (9)

An image sensor in which a light receiving portion is enclosed in a package provided with a light-transmitting region, a shield case for shielding electromagnetic noise, a housing that houses the image sensor and the shield case, and a light that collects light to the image sensor. In an imaging device that holds a lens that shines and includes a lens barrel fixed to the housing,
A first heat radiating member provided in contact with the shield case and in contact with a peripheral portion of the light-transmitting region of the imaging element;
A holding portion that is provided in the shield case and holds the first heat dissipation member;
A second heat dissipating member provided in contact with the shield case and in contact with the housing or the lens barrel;
An image pickup apparatus comprising: a holding portion that is provided in the casing or the barrel that is in contact with the second heat radiating member and holds the second heat radiating member. The shield case has an opening through which light passes to the image sensor,
The holding part of the shield case is
A first bent piece obtained by bending an edge portion of the opening of the shield case toward the image sensor;
A notch is formed in a peripheral portion of the opening of the shield case, and a second bent piece obtained by bending a part of the peripheral portion toward the imaging element side,
The imaging apparatus according to claim 1, wherein the first heat radiating member is sandwiched and held by the first bent piece and the second bent piece. A plate-like optical filter fixed to the light-transmitting region of the image sensor;
The holding part of the shield case is
A cut piece is formed by forming a cut in the shield case and partially bending the image pickup device side,
The imaging apparatus according to claim 1, wherein the first heat radiating member is sandwiched and held between a side portion of the optical filter and the bent piece. An image sensor in which a light receiving portion is enclosed in a package provided with a light-transmitting region, a shield case for shielding electromagnetic noise, a housing that houses the image sensor and the shield case, and a light that collects light to the image sensor. In an imaging device that holds a lens that shines and includes a lens barrel fixed to the housing,
A plate-like optical filter fixed to the light-transmitting region of the image sensor;
A first heat dissipating member that is in contact with the peripheral portion of the light-transmitting region of the image sensor and is in contact with the shield case, and has a shape that fits into the optical filter;
A second heat dissipating member provided in contact with the shield case and in contact with the housing or the lens barrel;
An image pickup apparatus comprising: a holding portion that is provided in the casing or the barrel that is in contact with the second heat radiating member and holds the second heat radiating member. The housing or the holder of the lens barrel is
A plurality of protrusions provided protruding from the housing or the lens barrel;
The imaging apparatus according to any one of claims 1 to 4, wherein the second heat radiating member is sandwiched and held by a plurality of protrusions. An image sensor in which a light receiving unit is enclosed in a package provided with a light-transmitting region, a housing that houses the image sensor, and a lens that collects light to the image sensor are held and fixed to the housing In an imaging device comprising a lens barrel,
A heat dissipating member provided in contact with the peripheral portion of the light-transmitting region of the image sensor and in contact with the housing or the lens barrel;
An image pickup apparatus comprising: a holding unit that is provided in the casing or the lens barrel in contact with the heat radiating member and holds the heat radiating member. The holding part is
A plurality of protrusions provided protruding from the housing or the lens barrel;
The imaging apparatus according to claim 6, wherein the heat dissipation member is sandwiched and held by a plurality of protrusions. A plate-like optical filter fixed to the light-transmitting region of the image sensor;
The holding part is
Having a protruding portion provided protruding from the housing or the lens barrel;
The imaging apparatus according to claim 6, wherein the heat radiating member is sandwiched and held by a side portion of the optical filter and the protruding portion. An image sensor in which a light receiving unit is enclosed in a package provided with a light-transmitting region, a housing that houses the image sensor, and a lens that collects light to the image sensor are held and fixed to the housing In an imaging device comprising a lens barrel,
A plate-like optical filter fixed to the light-transmitting region of the image sensor;
An image pickup device comprising: a heat dissipating member that is in contact with a peripheral portion of a light-transmitting region of the image pickup device and is in contact with the casing or the lens barrel and has a shape that fits into the optical filter. apparatus.

Images