JP2008210814A - Modulator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve lighting of high performance and energy saving, by using a plurality of light sources in which light emitting energy per one light source such as a semiconductor laser is small, so as to efficiently and uniformly radiate a radiated material. <P>SOLUTION: In the case of the coherent light source 11 such as a semiconductor laser, the light entering or outgoing into/from an optical integrator is radially processed so that cross section is roughly changed in height of sine waves, and passed through a rotated modulator 16. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an illumination method for irradiating a region to be illuminated with uniform and efficient illumination light, an exposure method using the illumination method, and an exposure apparatus for exposing a pattern using the exposure method. In particular, the present invention relates to an illumination method, an exposure method, and an exposure apparatus that use a large number of semiconductor lasers.

  Conventionally, a mercury lamp is used as a light source or an excimer laser is used for illuminating an object to be illuminated, or for exposing the object to be exposed. These light sources were very inefficient light sources because most of the energy input to drive them changed to heat.

  In recent years, the wavelength of semiconductor lasers (LDs) has been shortened, and LDs having an emission wavelength close to 400 nm have appeared. Therefore, they may be used for exposure as light sources instead of mercury lamps. However, there is a limit to the output of one LD, and a plurality of LDs must be used. Even if a large number of LDs are arranged to irradiate the object to be illuminated uniformly with the light emitted from each light source, the directivity of the light emitted from each light source is close to a Gaussian distribution, and the vicinity of the center of the irradiation region is strong and the periphery is strong. become weak. Of the directions perpendicular to the outgoing principal ray of the LD, the divergence angle in one direction is small, but the direction perpendicular thereto is large, and the ratio of the divergence angles is about 1: 3 to 1: 4. It has been impossible to uniformly and efficiently irradiate the desired illuminated area with light from each LD. That is, when attempting to illuminate uniformly, there is a conflicting phenomenon in which the efficiency decreases, and when the efficiency is increased, the uniformity deteriorates.

  In order to solve the above problems, the object of the present invention is to use a plurality of light sources with low emission energy per one, such as a semiconductor laser, so that an object can be irradiated efficiently and uniformly. Another object of the present invention is to provide an illumination method and apparatus for realizing energy-saving and high-performance illumination.

  Another object of the present invention is to provide an exposure method and apparatus capable of realizing good pattern exposure with high throughput when a pattern is exposed on a substrate or the like.

  In order to achieve the above object, the present invention emits light from each of a plurality of light sources such as LDs that are separated and arranged one-dimensionally or two-dimensionally, and outputs the light emitted from each of the plurality of light sources. Spatial decomposition by an optical integrator to generate a large number of pseudo secondary light sources, and light from the generated large number of pseudo secondary light sources is superimposed on a condenser lens to illuminate an illuminated area . As the light source array, a large number of light sources or secondary light sources obtained from the light sources are arranged in a substantially uniform distribution in a region that is substantially similar to the shape of the illuminated region. With this configuration, uniform and highly efficient illumination is realized.

  Further, the present invention is such that the optical integrator is composed of an array of a plurality of rod lenses, and the aspect ratio of the cross-sectional shape of each rod lens is made substantially equal to the aspect ratio of the illuminated area, so that they are arranged on a two-dimensional plane. The light emitted from the light source or the secondary light source can be illuminated most efficiently and uniformly on the illuminated area, and the illumination optical system can be made relatively small.

  According to the configuration described above, it is possible to eliminate unevenness having a low spatial frequency on the irradiated object.

  However, when an LD is used as the light source and the light emitted from each LD passes through an optical integrator composed of a plurality of rod lenses, the light emitted from one LD and the light transmitted through each rod lens interferes on the irradiated object, causing interference. Form stripes. For this reason, unevenness of high spatial frequency occurs in the illumination light. If the number of LDs becomes very large, the unevenness of the spatial frequency is reduced, but it is not completely eliminated.

  Therefore, the present invention changes the unevenness of the high spatial frequency by inserting a modulator that changes the wavefront in the optical path immediately before entering the optical integrator or in the optical path immediately after exiting the optical integrator. The average illumination light can be made almost completely uniform regardless of the spatial frequency.

  In the present invention, the divergence angle of light emitted from the plurality of light sources or the secondary light source obtained from the light sources is 1: 1 with respect to any two directions in the plane toward a plane perpendicular to the optical axis of the emitted light. By adjusting the beam divergence angle so as to be within the ratio of 0.5, it becomes possible to effectively use the light emitted from the light source as the illumination light on the incident surface of the optical integrator having a generally circular effective diameter. That is, the adjustment of the beam divergence angle is performed using a cylindrical lens. Specifically, the adjustment of the beam divergence angle is performed by arranging two types of cylindrical lenses having different focal lengths according to the divergence angles of two axes perpendicular to the LD along the optical path.

  The present invention further controls the energy of each light source so that the energy of each light emitted from the plurality of light sources is within a desired constant value. By doing so, the uniformity of the illumination light can be obtained and the illumination light intensity can be kept constant. In addition, the present invention provides an illumination place by causing each of the emitted light emitted from the plurality of light sources or the secondary light source obtained from the light sources to enter a corresponding position on the optical integrator by a condensing optical system. It is possible to achieve uniform and directional illumination that is independent of dependence.

  According to the illumination method described above, uniform illumination light can be obtained from a large number of separated light sources, and the illuminance unevenness in the illuminated area such as a mask or a two-dimensional light modulator is within ± 10%. For the first time, 30% or more of the energy of light emitted from a plurality of light sources can reach the illuminated area.

  Further, the present invention uses the illumination method or the illumination device described above, and uses light emitted from a plurality of separated light sources, particularly a light source in which a plurality of semiconductor lasers are arranged, for a mask, reticle, or maskless exposure that is an object to be illuminated. A two-dimensional light modulator, that is, a liquid crystal type two-dimensional light modulator or a digital mirror device is irradiated and exposed. In this way, good exposure illumination light having a uniform intensity distribution and desired directivity can be obtained.

  In particular, a plurality of light sources are arranged in a shape similar to, for example, a rectangular illuminated area, light obtained from these light sources is incident on a light integrator at a desired incident angle, and emitted light is irradiated onto the illuminated area. By using this, uniform illumination with high efficiency is realized. When a semiconductor laser is used as the light source, if a modulator that changes the wave front is used before or after the optical integrator, the interference fringe unevenness of the laser light can be removed and uniform illumination can be obtained. By using this illumination for substrate exposure, a high pattern can be exposed and a good pattern can be exposed.

  According to the present invention, it is possible to irradiate an irradiated object with high efficiency and uniformity by using a plurality of light sources each having a small emission energy, such as a semiconductor laser, so that energy-saving and high-performance illumination is achieved. Has the effect of realizing.

  Further, according to the present invention, by realizing energy-saving and high-performance illumination, there is an effect that it is possible to realize good pattern exposure with high throughput when a pattern is exposed on a substrate or the like.

  Embodiments of an illumination method, an exposure method, and an apparatus therefor according to the present invention will be described with reference to the drawings.

  First, an exposure apparatus according to a first embodiment of the present invention will be described with reference to FIG. The LD array 1, which is a light source array in which a plurality of separated light sources are arranged one-dimensionally or two-dimensionally, is a blue (violet) semiconductor laser that emits light having a wavelength of around 405 nm (380 to 420 nm) with an output of about 30 mW. 11 is arranged two-dimensionally on a substrate. Light emitted from each semiconductor laser 11 is incident on an optical integrator 13, which will be described in detail later with reference to FIGS. 5 and 6, by a condenser lens (condenser optical system) 12. The light transmitted through the optical integrator 13 passes through a condenser lens (collimating lens) 14 that is an irradiation optical means, is reflected by a mirror 15, and is irradiated onto the mask 2. The mask 2 may be a normal chromium or chromium oxide mask 2a, or may be a two-dimensional light modulator 2b having a mask function, such as a liquid crystal or a digital mirror device. The optical integrator 13 spatially decomposes the emitted light beams from the two-dimensionally arranged semiconductor lasers 11 collected by the condenser lens (condensing optical system) 12 to generate a plurality of pseudo secondary light sources. Thus, an optical system that superimposes and illuminates.

  The light transmitted through or reflected by the pattern display unit 21 (for example, formed in a square shape) of the mask 2a or the two-dimensional light modulator 2b is projected onto the exposure area 51 on the substrate 5 to be exposed by the projection lens 3. Is exposed to projection. When the substrate 5 is moved by the substrate moving mechanism 4 including the substrate chuck and the xy stage, the pattern is successively exposed over a desired area on the substrate 5. When the normal mask 2a is used, the pattern drawn on the mask is repeatedly exposed. When the two-dimensional light modulator 2b is used, one set or several sets of desired patterns are exposed on almost the entire substrate 5.

  The control circuit 6 controls the semiconductor laser 11 to turn on at every exposure timing and to disappear when a desired exposure amount is applied to the substrate 5. That is, about 1% of the light incident on the beam splitter 171 provided in the optical path is taken into the photodetector 17. The light intensity detected by the photodetector 17 is integrated by the control circuit 6. Since this integrated value becomes the integrated exposure amount of the exposure illumination light to be exposed on the substrate 5, the semiconductor laser 11 is reached when this value reaches a desired set value (optimum exposure amount) stored in the control circuit 6 in advance. To turn off the exposure.

  Further, the control circuit 6 sends a signal for driving and controlling the two-dimensional light modulator 2b based on the display two-dimensional pattern information of the two-dimensional light modulator 2b. Further, the control circuit 6 drives the substrate moving mechanism 4 to move the substrate 5 while synchronizing with the display information of the two-dimensional light modulator 2b so that a desired pattern is exposed on the entire substrate.

  When the stage 4 is continuously moved and the substrate 5 is scanned and exposed, the control circuit 6 controls the scanning speed of the stage based on the signal intensity of the photodetector 17 monitored for exposure. When the two-dimensional optical modulator 2b is used, the control circuit 6 performs total control of this drive, the signal of the photodetector 17, and the drive signal of the stage.

  Since the plurality of semiconductor lasers 11 can be individually turned on and off, the individual laser outputs can be sequentially monitored using the photodetector 17 shown in FIG. Therefore, the control circuit 6 sequentially sends a blinking signal to the individual LDs 11 and detects the signal intensity of the photodetector 17 in synchronism with this, whereby the output drop accompanying the degradation of the LDs 11 can be found. Therefore, the control circuit 6 controls the energy of each light source by increasing the current value to a certain value so that the output falls within a desired constant value when the output decreases. That is, the control circuit 6 controls the energy of each light source 11 so that the energy of each light emitted from the multiple light sources 11 falls within a desired constant value. By doing so, the uniformity of the illumination light can be obtained, and the illumination light intensity can be kept constant.

  The plurality of semiconductor lasers 11 shown in FIG. 1 are arranged in a uniform density distribution with an equal pitch. The area where the light sources 11 are arranged is an area similar to the shape of the illuminated area 21 which is the pattern display portion of the mask 2a or the two-dimensional light modulator 2b. Naturally, when the illuminated area 21 is rectangular, the arrangement area of the light sources 11 is also a similar rectangular area.

  In the semiconductor laser 11, the spread angle of the emitted light usually differs in the direction (x direction) in the plane of FIG. 2 and in the direction perpendicular to the plane (y direction). The spread angle of the emitted light of the semiconductor laser 11 is, for example, about 28 degrees from the optical axis in the direction in the paper plane (x direction) in FIG. ) Is about 8 degrees. For this reason, it is necessary to make the spread angles in both directions (x direction and y direction) substantially equal or within 1.5 times as a maximum value without any trouble. In this way, as will be described later, the intensity distribution of light from each semiconductor laser incident on the optical integrator 13 becomes substantially equal in rotational symmetry.

  As will be described later, the intensity distribution of the light incident on the optical integrator is equal to the intensity distribution of the light emitted from the optical integrator. Further, the light integrator emission position has an imaging relationship with the entrance pupil of the projection exposure lens 3. For this reason, exposure illumination is realized so as to obtain a rotationally symmetric intensity distribution on the pupil of the projection exposure lens 3. By making the intensity distribution rotationally symmetric on the pupil of the projection exposure lens 3 in this way, substantially the same directivity of illumination can be obtained regardless of the pattern direction of the mask 2a or the two-dimensional light modulator 2b. As a result, resolution characteristics that do not depend on the direction of the pattern are obtained, and the substrate is accurately exposed without distortion. Reference numeral 103 denotes a field stop provided at the light integrator emission position.

  As described above, the cylindrical lens 112 shown in FIG. 2 forms a virtual image of the light source of the semiconductor laser (LD) at the position 11 'so that it is emitted from the point light source 11'. A laser beam having a spread angle of about 28 degrees from the optical axis in the (x direction) has a spread angle of about 1 degree. Similarly, the cylindrical lenses 113 arranged in the direction perpendicular to the paper surface form a virtual image of the LD light source at a position approximately 11 'so that it is emitted from the 11' point light source. A laser beam having a divergence angle of about 8 degrees from the optical axis in the (y direction) has a divergence angle of about 1 degree. In this way, the laser beam emitted from any LD 11 realizes a substantially rotationally symmetric intensity distribution by the cylindrical lenses 112 and 113. That is, the divergence angle of the light emitted from the secondary light source 11 ′ in the cylindrical lens system 100 is in any two directions in the plane (for example, the x direction and the y direction) toward the surface perpendicular to the optical axis of the emitted light. By adjusting the beam divergence angle to be within a ratio of 1: 1.5, the light emitted from the light source 11 can be effectively used as illumination light on the entrance surface of the optical integrator 13 having a generally circular effective diameter. It becomes possible. As a result, as described above, a rotationally symmetric intensity distribution is realized on the pupil of the projection exposure lens 3, and the pattern displayed by the mask 2a or the two-dimensional light modulator 2b can be accurately exposed.

  As shown in FIG. 3, the beam divergence angle is adjusted by arranging two types of cylindrical lenses 112 and 113 having different focal lengths along the optical path according to the divergence angle of two orthogonal axes of the LD. It becomes possible to do.

  2 is an optical integrator, and FIG. 5 is a view of the optical integrator 13 viewed from the optical axis direction. The optical integrator 13 can be broadly classified into a glass rod system and a lens array system. When the optical integrator 13 is a glass rod type, it is composed of a plurality of rod lenses 131. Each rod lens 131 has the structure shown in FIG. The incident-side end surface 1311 is a spherical convex surface, and the output-side end surface 1312 is also a spherical convex surface. When the radius of curvature of both convex surfaces is R and the refractive index of the rod lens glass is n, the length L of the rod lens is nR / (n−1). As shown in FIG. 6A, the beam component Bxy ′ incident on the rod lens 131 at an angle θx ′ is narrowed down to the exit end surface by the effect of the spherical convex lens on the incident surface 1311. The beam Bxy emitted from the exit end 1312 after being further narrowed down does not depend on the incident angle θx ′ of incident light due to the effect of the spherical convex lens on the exit surface, and is all on the optical axis (parallel to the axis of the rod lens). The output light has parallel principal rays.

As described above, the laser beams emitted from the 11 ′ virtual image position and having a divergence angle of about 1 degree are incident on the condenser lens 12 by the cylindrical lenses 112 and 113. The front focal point of the condenser lens 12 is at the virtual image position 11 ′, and the rear focal point is at the incident end of the optical integrator 13. Therefore, the laser light emitted from each LD 11 that has passed through the condenser lens 12 becomes a parallel beam, enters the optical integrator 13, and enters the optical integrator 13 of the beam component Bxy ′ that enters the incident end of the rod lens 131. The incident angles (θx ′, θy ′) correspond to the arrangement positions (x, y) of the semiconductor lasers 11 shown in FIGS. That is, in the LD array 1, for example, LDs 11 are arranged as shown in FIG. This sequence is one of the LD in the x direction of diameter _{D LDx,} the diameter of the y-direction _{D LDy,} x-direction pitch _{P LDx,} y-direction pitch _{P LDy,} x-direction number _m x, the number of y direction n when the _y, can be represented by x-direction length _{W LDAx,} and following the y direction length _{H LDAy} (1) and equation (2) below.

W _LDAx = (m _x −1) P _LDx (1)
_{H LDAy = (n y -1)} P LDy (2)
As described above, the condenser lens (collimator lens) 12 associates the pitch of the _{LD 11} (P _LDx , P _LDy ) with the pitch (Wx, Hy) of the rod lens 131 constituting the optical integrator 13 to obtain a secondary light source. By making each outgoing light emitted from 11 'enter the same position on the optical integrator 13, it becomes possible to realize uniform and uniform illumination regardless of the illumination location.

  In this way, the beam B ′ radiated from each LD 11 to the optical integrator 13 is a Gaussian distribution having a parallel beam that is close to rotational symmetry and has a center at the center (optical axis) of the incident surface of the optical integrator 13. Since the optical integrator 13 is a collection of a large number of rod lenses 131, the light incident on one rod lens 131 becomes a small part of a Gaussian distribution. For this reason, the intensity is substantially uniform within one rod lens 131. Further, the position of the incident light on the incident end surface 1311 of the rod lens incident light corresponds to the emission direction of the emitted light. As a result, the emitted light has almost the same light intensity at any divergence angle around the optical axis, and this divergence angle corresponds to the location of the mask 2a surface or the modulation surface of the two-dimensional optical modulator 2b by the collimator lens 14. Therefore, the surface of the mask 2a or the modulation surface of the two-dimensional light modulator 2b is illuminated uniformly regardless of the location.

  Further, the cross-sectional shape of each rod lens has a width of Wx and Hy in the x and y directions as shown in FIG. As described above, since the position of the incident light at the rod lens end 1311 and the outgoing angle (θx, θy) of the outgoing light correspond, that is, are proportional, the maximum spread angles θxm, θym of the outgoing light (angles from the optical axis of the outgoing light) (Range) is proportional to the dimensions (Wx, Hy) of the cross section of the rod lens. That is, when expressed strictly, the relationship is expressed by the following expressions (3) and (4). Here, n is the refractive index of the rod lens glass, and L is the length of the rod lens.

θxm = nWx / 2L (3)
θym = nHy / 2L (4)
Since the light integrator exit surface 1312 and the mask 2a or the two-dimensional light modulator 2b are respectively the front focal plane and the rear focal plane of the collimating lens 14 having the focal length fc, the mask 2a or the two-dimensional light modulator 2b is irradiated. The (x, y) coordinate ranges Wmx and Hmy of the beam are given by the following equations (5) and (6).

Wmx = fc · θxm = Wx · nfc / 2L (5)
Hmy = fc · θym = Hy · nfc / 2L (6)
That is, the ratio r ₁ / r ₀ of the aspect ratio r ₁ (= Wx / Hy) of the cross-sectional shape perpendicular to the optical axis of each rod lens and the aspect ratio r ₀ (= Wmx / Hmy) of the illuminated region (21). By setting 1 to 1, it is possible to expose only a necessary portion of the mask 2a or the two-dimensional optical modulator 2b with uniform light. If the ratio r ₁ / r ₀ is not less than 0.8 and not more than 1.2, a sufficiently effective light utilization efficiency is realized as compared with the conventional exposure illumination method.

  When the optical integrator 13 is of a lens array type, the lens array system is composed of two lens arrays including a first lens array closer to the light source and a second lens array farther away. On the first lens array, the lens cells are two-dimensionally arranged to spatially divide the light beam obtained from the LD array 1. Each lens cell of the first lens array condenses the light beam on the second lens array corresponding to each cell, and the same number of secondary light sources as the number of divisions are formed on the second lens array. An image is formed. Each lens cell on the second lens array forms an image of each lens cell opening of the corresponding first lens array on the surface of the illuminated region 21. The condenser lens 14 is configured such that the center of each lens cell coincides with the center of the illuminated region 21 and each lens cell of the first lens array overlaps with the illuminated region 21. As a result, as in the case of the glass rod system, the intensity of the illumination light beam distributed almost rotationally symmetric is integrated, and the intensity difference is canceled out to obtain a uniform intensity distribution.

  Next, a second embodiment of the exposure apparatus according to the present invention will be described with reference to FIG. Parts having the same part number shown in FIG. 7 and the part number shown in FIG. 1 represent the same thing. The second embodiment is different from the first embodiment in that the wavefront is used to prevent the generation of interference fringes by making the illumination light almost completely uniform regardless of the spatial frequency. This is because a diffuser 16 which is a modulator to be changed is installed. With this configuration, the light emitted from each LD light source 11 passes through the cylindrical lens system 100 including the cylindrical lenses 112 and 113 and the condensing lens 12, and forms an optical integrator 13 as a parallel beam B ′ having an intensity distribution close to rotational symmetry. Passes through the diffuser 16 before entering the beam.

  The diffuser 16 is a modulator that changes the wavefront. For example, as shown in FIG. 8, the diffuser 16 is configured by rotating and driving a directly connected motor 161 to rotate a glass disk 16. The glass disk 16 is optically polished radially, and the shape of the glass surface of the CC cross section of FIG. 9A changes substantially sinusoidally as shown in FIG. 9B. The amount of change in height (roughness) is several μm. Incidentally, reference numeral 163 denotes a beam beam incident on the diffuser 16, and 162 denotes a rotation locus on the diffuser 16 at the center of the beam beam 163.

  The length of one cycle is determined by the number of rotations of the disk 16 and the exposure time, and is changed by about one cycle on the exposure optical axis during approximately one-step exposure. Further, when performing scanning exposure, it is changed about one to several cycles while moving by one picture element. These rotation speeds are controlled by the control circuit 6 in synchronism with the display control of the two-dimensional optical modulator 2b and the movement control of the stage 4, but once the rotation is started, the rotation is made constant at the above speed. As a result, in the illumination light with respect to the mask 2a or the two-dimensional optical modulator 2b, interference fringes are generated almost uniformly regardless of the spatial frequency by varying the high spatial frequency unevenness and time averaging. Can be prevented. Although the modulator 16 for changing the wavefront shown in FIG. 7 is installed immediately before the optical integrator 13, the same effect can be obtained even if it is installed immediately after the optical integrator 13.

  Next, a third embodiment according to the present invention will be described with reference to FIG. The third embodiment is different from the first and second embodiments in that a plurality of LD arrays are provided to increase the amount of exposure light. Since the emitted light of the semiconductor laser 11 is linearly polarized light, for example, the LDs 11 are installed with their directions aligned so that the emitted light from all N LD arrays 1a is linearly polarized light in the x direction. On the other hand, the LD array 1b is provided with all N LDs 11 so that the y direction is linearly polarized light. Almost 100% of the linearly polarized light in the x direction emitted from the LD array 1a is transmitted through the polarization beam splitter 114 to become P-polarized light. On the other hand, almost 100% of the linearly polarized light in the y direction emitted from the LD array 1b is reflected by the polarization beam splitter 114 to become S-polarized light. As a result, all the laser beams from the 2N LDs 11 are guided to the exposure optical system without loss.

  In the above description, the LD array 1b is installed so that the y direction is linearly polarized light. However, similarly to the LD array 1a, the LD array 1b can be installed so that the x direction is linearly polarized light. In this case, a quarter wavelength plate is installed in the optical path from the LD array 1b until it enters the polarization beam splitter 114, and the light transmitted through the quarter wavelength plate is linearly polarized in the y direction. It may be made to become.

  Semiconductor lasers and LDs are usually sealed in a small tube having a transparent window. Since the tube has a diameter of about 6 mm, the number of two-dimensional arrays is limited. Therefore, according to the third embodiment, by providing a plurality of LD arrays, the effect of doubling the limit of the number can be obtained.

  The laser beam that has passed through the polarization beam splitter 114 includes two orthogonal polarization components, passes through the condenser lens 12, the optical integrator 13, the collimator lens 14, the mask 2 or the two-dimensional light modulator 2, and the projection exposure lens 3, To the board. These parts along the optical path allow the laser light to pass through regardless of the polarization, so that a double exposure amount can be irradiated onto the substrate. As a result, the exposure time can be reduced by half, and the throughput can be increased.

  The two-dimensional optical modulator 2b is driven based on the pattern information to be exposed from the control circuit 6, and the stage 2 and the LD arrays 1a and 1b are driven in synchronization with this drive information. When the LD 11 is driven from the control circuit 6, the lighting time is controlled so that the exposure light becomes optimal with respect to the sensitivity of the substrate 5, and the LD disappears at the timing when the exposure is not performed.

  Next, a fourth embodiment of the exposure apparatus according to the present invention will be described with reference to FIG. The fourth embodiment is different from the first to third embodiments in that a reflection type is used as a two-dimensional optical modulator 2b as a mask 2 whereas a transmission type is used. is there. In short, the two-dimensional optical modulator 2b may be transmissive or reflective. In the fourth embodiment, a reflective two-dimensional light modulator 2bb such as a reflective liquid crystal two-dimensional light modulator is used. The laser beam emitted from the LD light source 1 is divided into two by a beam splitter 145 and guided to two exposure optical systems. 144 is a field stop having a positional relationship conjugate with the display unit of the two-dimensional optical modulator. The image of the field stop is formed on the display part of the two-dimensional optical modulators 2bba and 2bbb by the lenses 142a, 143a and 142b, 143b, and this display part is exposed to the exposure area on the substrate 5 by the projection exposure lenses 3a and 3b. Images are formed on 151a and 151b.

  The light emitted from the semiconductor laser 11 is linearly polarized light parallel to the substrate surface in FIG. Therefore, after passing through the optical integrator 13, it is made circularly polarized by the quarter wavelength plate 105. Since the beam splitter 145 is a polarization beam splitter, the P polarization component which is a horizontal polarization component of the circularly polarized light incident on the beam splitter 145 passes through the polarization beam splitter 145, and the S polarization component is reflected by the polarization beam splitter 145. The reflected S-polarized light component is vertical linearly polarized light and is reflected by the mirrors 151b and 152b to become horizontal linearly polarized light.

The two exposure beams branched by the polarization beam splitter 145 in this way become horizontal linearly polarized light and enter the polarization beam splitters 153a and 153b. For these polarization beam splitters 153a and 153b, since the incident light is S-polarized light, it is reflected by 100% and enters perpendicularly to the two-dimensional light modulators 2bba and 2bbb made of reflective liquid crystal. When voltage application is turned on and off in accordance with display information on the display picture elements of the reflective liquid crystal two-dimensional light modulators 2bba and 2bbb, the polarization of the reflected light changes as it is or at a right angle. Therefore, when the reflected light again passes through the polarizing beam splitters 153a and 153b, only the picture elements whose polarization has changed to a right angle pass through the beam splitters 153a and 153b.
The two-dimensional light information obtained in this way is imaged and projected as exposure patterns on 151a and 151b on the substrate 5 by the projection exposure lenses 3a and 3b.

  Next, a fifth embodiment of the exposure apparatus according to the present invention will be described with reference to FIG. In the fifth embodiment, a digital mirror device (Digital Mirror Device) 2bbc is used as a reflective two-dimensional optical modulator. The digital mirror device 2bbc is configured by providing each picture element with a membrane mirror that is driven by an electric signal. The exposure light applied to each mirror is tilted by θ when the signal is ON, and the mirror is not tilted when the signal is OFF. For example, the exposure light is reflected by the mirror 154 and irradiated, and the light reflected by the tilted mirror is incident on the projection exposure lens 3 and passes through the lens 3. The lens 3 deviates from the pupil of the lens 3 and does not pass through the lens 3. As a result, the pattern displayed by the digital mirror device drive signal in the digital mirror device 2bbc is projected and exposed on the substrate 5 by the projection exposure lens 3.

  Next, a sixth embodiment of the exposure apparatus according to the present invention will be described with reference to FIG. In the sixth embodiment, as a light source array 1, light emitted from a plurality of semiconductor lasers 11 is received by a light guide optical system such as a lens (not shown) and emitted from an emission end 1102 that is guided by an optical fiber 1101 and becomes a secondary light source. It is comprised so that it may do. The light emitted from each fiber end of the optical fiber 1101 is emitted with a desired spread angle by the beam shaping optical system 1103. The emission end 1102 serving as a secondary light source has a light emitting region that is substantially similar to the display region 21 of the two-dimensional light modulator 2b. As described above, the light emitted from the secondary light source efficiently and uniformly illuminates the two-dimensional light modulator 2b as described above.

Next, an embodiment of an LD array which is a light source array according to the present invention will be specifically described with reference to FIG. In these LD array embodiments, the LD array 1A shown in FIG. 14A has been described so far, and the LD arrays are arranged at equal pitches in the xy direction. On the other hand, the LD array 1B shown in FIG. That is, the LDs 11 are arranged at the vertices of the equilateral triangle. In the case of this embodiment, when the arrangement pitch is P with respect to the outer diameter D of the circle of the LD package, P can be, for example, about 1.07 to 1.1D. Reference numerals 112 in FIGS. 14A and 14B are congruent rectangles depicting the LD mounting region. The densest mounting (B) has a higher mounting density. When a specific numerical evaluation is performed, the LD mounting density of the LD array 1A is 1 / P ² whereas the LD array 1B is 1.154 / P ² , and the mounting density is high, that is, the output of the light source is 15 % Can be increased.

  Reference numeral 111 shown in FIG. 14 denotes a cooler for preventing the LD from becoming high temperature due to heat generated from the array of LDs and shortening its life. Specifically, the cooler 111 is made of copper or the like, which is a material having good heat conduction, and can be driven at 25 ° C. or less by passing through a hole and allowing cooling water to pass therethrough. Further, even if a Peltier element is used, it can be similarly cooled to 25 ° C. or lower, and a long life can be realized.

  The present invention is not limited to the embodiments of the LD array described above. That is, as a light source to be used, the present invention can be realized even if a light source having relatively high directivity, for example, a light emitting diode (LED) or a lamp having a small light emitting area is used. It can also be realized by using a plurality of laser light sources other than the semiconductor laser.

  Next, another embodiment of the light source array according to the present invention will be described with reference to FIG. The light source array 1 uses a normal gas laser light source or a solid laser light source having a relatively small divergence angle, but the laser light sources themselves are not two-dimensionally arranged. That is, it is not necessary to emit laser light in the same direction from any laser. When the laser cross-sectional area in the optical axis direction is large, it is possible to make the density of a plurality of beams higher than the laser mounting density by folding the optical path using mirrors 115p and 115q as shown in FIG.

  A solid line portion (1P) in FIG. 15 is an array of laser light sources 11p in a cross section in the paper surface, and a dotted line (1Q) is an array of laser light sources 11q in a cross section parallel to the paper surface and at a constant interval. There are actually three or more such surfaces. The beams returned by the mirrors 115p and 115q etc. travel to the left side of the figure and are two-dimensionally distributed. Reference numeral 1106 denotes a microlens, and the optical axis of each microlens is made to coincide with the center of each beam. Each light beam that has passed through the microlens 1106 is condensed on the secondary light source surface 1105. The secondary light source surface 1105 is disposed so as to coincide with the front focal plane of the condenser lens 12 shown in FIGS. 1, 2, 7, and 10 to 12.

  Moreover, it is possible to obtain illumination including various wavelengths by arranging a plurality of types of light sources at the same time. It is also possible to use illumination composed of light having various wavelengths as described above for illumination other than exposure. Even in this case, uniform illumination with high light use efficiency can be realized. As such an application, for example, there is illumination used for observation and inspection of a fine pattern using a microscope.

  When an LED or LD having a plurality of wavelengths is used as the light source array 1A, the light source array 1A is configured as shown in FIG. As shown in FIG. 16, the plurality of light sources 11 includes, for example, a plurality of types of light sources 11A, 11B, 11C, and 11D having different wavelengths. As described above, when a plurality of types of light sources are used for each type, it is desirable to arrange them so that each type is distributed without deviation as shown in FIG.

  In the light source array described above, a plurality of separated light sources are arranged two-dimensionally. However, it is obvious that the light source array may be arranged one-dimensionally when the illumination area is long and thin.

  In addition, according to the embodiment described above, it becomes possible to arrange a large number of semiconductor lasers and use the emitted light efficiently as illumination light, and the input electric energy can be reduced as compared with the case where a conventional mercury lamp is used as the light source. It can be effectively used for substrate exposure, and can contribute to energy saving. Also, it became possible to use a solid light source, realizing a long life of the light source and facilitating maintenance.

1 is a configuration perspective view showing a first embodiment of an exposure apparatus according to the present invention. It is a figure which shows the relationship between a semiconductor laser light source, its beam shaping, and an optical integrator part. It is a perspective view which shows beam shaping | molding by a cylindrical lens. It is a figure for demonstrating the arrangement | sequence of a semiconductor laser. It is a figure which shows the arrangement | sequence state of the lot lens in an optical integrator. It is a figure for demonstrating the relationship between the incident light and the emitted light to the rod lens which comprises an optical integrator. It is a structure perspective view which shows 2nd Embodiment of the exposure apparatus which concerns on this invention. It is a figure for demonstrating the relationship between the modulator and optical integrator which change a wave front. The detailed explanatory view of the modulator which changes a wave front. It is a structure perspective view which shows 3rd Embodiment of the exposure apparatus which concerns on this invention. It is a structure perspective view which shows 4th Embodiment of the exposure apparatus which concerns on this invention. It is a structure perspective view which shows 5th Embodiment of the exposure apparatus which concerns on this invention. It is a structure perspective view which shows 6th Embodiment of the exposure apparatus which concerns on this invention. It is a figure for demonstrating the Example which arranges a several light source. It is the figure which showed the case where a several laser light source is used as a light source array. It is a figure which shows the arrangement | sequence in the case of using a several kind of light source.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a, 1b, 1A ... Light source array (LD array), 2 ... Mask, 2a ... Chrome mask, 2b ... Two-dimensional optical modulator, 2ba ... Transmission type two-dimensional optical modulator, 2bb, 2bba, 2bbb ... Reflective type 2D optical modulator, 2bbc ... DMD, 3, 3a, 3b ... projection exposure lens, 4 ... stage (substrate moving mechanism), 5 ... substrate, 6 ... control circuit, 11 ... light source (LD), 11 '... secondary Light source (virtual image of light source), 11p, 11q ... laser light source, 12 ... condensing lens (condensing optical system), 13 ... optical integrator, 14 ... condenser lens (collimating lens), 15 ... mirror, 16 ... change wave front Modulator, 17 ... photodetector, 21 ... pattern area, 51 ... exposure area, 100 ... cylindrical lens system, 103 ... field stop, 105 ... quarter wave plate, 112, 113 ... cylindrical 114, 145 ... Polarizing beam splitter, 115p, 115q ... Mirror, 131 ... Rod lens, 144 ... Field stop, 153a, 153b ... Polarizing beam splitter, 154 ... Mirror, 171 ... Beam splitter, 1101 ... Optical fiber, 1103 ... Beam Molding optical system, 1105, secondary light source surface, 1106, microlens.

Claims (1)

A modulator that changes the wavefront of incident light,
A modulator characterized in that a cross section is processed radially so that the height of the cross section changes substantially sinusoidally and is rotationally driven.

Images