JP2007127546A - Rotation sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To further improve the adhesive strength between a surface-mounted component and a terminal disposed on the surface of a substrate section, in a rotation sensor having a mount structure wherein the surface-mounted component is mounted on the substrate section. <P>SOLUTION: In the rotation sensor 1, which includes the substrate section, the terminal 4 disposed on the surface of the substrate section, and the surface-mounted component 5 mounted on the terminal 4, a recessed section 4a is formed on the terminal 4, and the surface-mounted component 5 is mounted in the recessed section 4a via a conductive adhesive 13, thereby further improving the adhesive strength. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a rotation sensor.

  Conventionally, as a rotation sensor having a mounting structure in which a surface mounting component is mounted on a substrate part, one disclosed in Patent Document 1 is known.

  In the rotation sensor in Patent Document 1, solder is applied to a terminal provided on the surface of the board portion, and a surface mount component is mounted thereon and reflowed to bond the substrate portion and the surface mount component. Yes.

In recent years, the use of conductive adhesives instead of solder is increasing due to lead-free and the like.
JP-A-7-198736

  In the rotation sensor in which the surface mounting component is mounted using the conductive adhesive, the surface mounting component is in contact with the conductive adhesive only on the lower surface. Even with such a structure, there is no problem in a normal use situation, but from the viewpoint of improving the reliability, it is desirable that the adhesive strength between the surface mount component and the conductive adhesive is higher.

  That is, an object of the present invention is to further improve the adhesive strength between a surface mount component and a terminal provided on the surface of the substrate portion in a rotation sensor having a mounting structure in which the surface mount component is mounted on the substrate portion. .

  In the invention of claim 1, in the rotation sensor including the substrate portion, the terminal provided on the surface of the substrate portion, and the surface mount component mounted on the terminal, a recess is formed in the terminal. The surface mount component is mounted in the recess through a conductive adhesive.

  According to a second aspect of the present invention, in the rotation sensor according to the first aspect, the concave portion is formed in each of the two terminals, and the surface mount component is inserted into each of the concave portions via a conductive adhesive. Different electrodes are attached, and the surface mount component is constructed between the two terminals.

  According to a third aspect of the present invention, in the rotation sensor according to the second aspect, a second concave portion is formed in a region between the concave portions provided in each of the terminals on the surface of the substrate portion. It is characterized by that.

  According to the first aspect of the present invention, the conductive adhesive wraps around the side surface portion of the surface mount component by forming the recess in the terminal and mounting the surface mount component in the recess via the conductive adhesive. Since the contact area between the conductive adhesive and the surface mounting component increases, the adhesive strength of the surface mounting component can be improved.

  According to the second aspect of the present invention, when a surface mount component is installed between two terminals, the adhesion strength of the surface mount component to each terminal can be improved.

  According to the invention of claim 3, the conductive adhesive protruding to the other terminal side is formed in a second recess formed in a region between the recesses provided on each of the terminals on the surface of the substrate portion. It is possible to prevent the terminals from being electrically connected via the conductive adhesive and short-circuiting between the two terminals.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, the rotation sensor mounted in the internal combustion engine etc. of a motor vehicle is illustrated.

  (First Embodiment) FIG. 1 is a sectional view of a rotation sensor according to the present embodiment, FIG. 2 is a plan view showing a mounting structure included in the rotation sensor according to the present embodiment, and FIG. It is -A sectional drawing.

  The rotation sensor 1 in this embodiment includes a casing 2 made of a resin (for example, a thermoplastic resin; polyamide or the like).

  The casing 2 includes a mounting flange portion 2a having a through hole 2f through which a fastening member such as a bolt is inserted, a substantially cylindrical insertion portion 2b to be inserted into a through hole (not shown) provided in the internal combustion engine or the like, A main body portion 2c having a substantially rectangular column shape on which the signal processing circuit 3 is formed, and a connector portion 2d projecting outward are provided.

  An annular groove 2g is formed on the outer peripheral wall of the insertion portion 2b, and the outer wall of the insertion portion 2b and the inner wall of the through hole into which the insertion portion 2b is inserted by the O-ring 10 attached to the groove 2g. A seal is secured between the two.

  The main body 2c is formed with a flat surface 2e extending along the mounting direction (insertion direction) of the rotation sensor, and the surface mount component 5 is mounted on the flat surface 2e to form the signal processing circuit 3. . That is, in the present embodiment, the main body 2c corresponds to the substrate, and the flat surface 2e corresponds to the surface of the substrate.

  A magnetic detection element (for example, a hall element) 8 and a magnet (permanent magnet) 9 are attached to the tip of the main body 2c. The magnetic detection element 8 is disposed on the tip side of the magnet 9 so as to face the teeth 12 of the rotating plate 11, and is rotated between the magnet 9 and the rotating plate 11 by the rotation of the rotating plate 11 configured as a magnetic body. Changes in the magnetic field (magnetic flux density) are detected. The magnetic detection element 8 is electrically connected to the signal processing circuit 3 by a wiring (not shown), and the signal processing circuit 3 performs predetermined processing (amplification or the like) on the detection signal of the magnetic detection element 8.

  Further, the signal processing circuit 3 is electrically connected to a terminal (not shown) in the connector portion 2d via a terminal 6 insert-molded in the casing 2, and the processing result in the signal processing circuit 3 is obtained. Is output to an external microcomputer (not shown) or the like via a harness (not shown) connected to the connector portion 2d.

  In the rotation sensor 1, after a plurality of surface mount components 5 are mounted on the flat surface 2 e and the signal processing circuit 3 is constructed, the flat surface 2 e is a resin (for example, thermosetting resin; epoxy resin or the like) 7. It is covered and sealed. The coating of the resin 7 ensures the seal of the signal processing circuit 3.

  Here, a more detailed configuration of the signal processing circuit 3 will be described with reference to FIGS. 2 and 3.

  On the flat surface 2e, a terminal 4 made of a conductor such as copper is provided as a wiring for the signal processing circuit 3 so as to be embedded in the main body 2c by insert molding. In the present embodiment, as shown in FIG. 3, the flat surface 2e and the surface of the terminal 4 are formed so as to have substantially the same height.

  The surface-mounted component 5 is an electrical component such as a capacitor or a resistor, and is formed in a substantially rectangular parallelepiped shape in the present embodiment. Positive and negative electrodes 5a are formed at both ends in the longitudinal direction.

  These surface mount components 5 are surface mounted on the flat surface 2e of the main body 2c. Surface mounting refers to mounting electrodes formed on the surface of a component directly on a substrate or the like using solder, conductive adhesive, or the like without using the lead wires of the component.

  Further, these surface mount components 5 are mounted via a conductive adhesive 13. More specifically, the electrodes 5a at both ends in the longitudinal direction of the surface-mounted component 5 are bonded to the two terminals 4 extending substantially parallel to each other via the conductive adhesive 13, so that the surface A mounting component 5 is installed between the two terminals 4.

  Here, in this embodiment, the recess 4a is formed in the terminal 4, and the surface mount component 5 is mounted in the recess 4a. Specifically, a recess 4a having a rectangular cross section is formed in a rectangular notch shape in plan view at the other terminal 4 side edge of each of the two terminals 4 on which the surface mount component 5 is installed. And when this recessed part 4a is formed so that it may become one size larger than the bottom face part of the electrode 5a, when the electrode 5a is accommodated in the recessed part 4a and the surface mount component 5 is installed between the two terminals 4, the electrode 5a A substantially U-shaped gap is formed between the side surface and the side wall of the recess 4a in plan view.

  Furthermore, in this embodiment, the 2nd recessed part 2h is formed in the area | region between each recessed part 4a of the flat surface 2e. The length (width) in the short direction of the surface-mounted component 5 of the second recess 2h is formed so as to be wider than the length (width) in the same direction of the recess 4a as shown in FIG. Has been. Moreover, as shown in FIG. 3, the depth from the flat surface 2e of the 2nd recessed part 2h is formed so that it may become deeper than the depth from the flat surface 2e of the recessed part 4a. Therefore, when the surface mount component 5 is installed between the two terminals 4 so that the electrode 5a is accommodated in the recess 4a, a gap is formed between the lower surface of the surface mount component 5 and the bottom surface of the second recess 2h. The

  In the present embodiment having the above-described configuration, when the conductive adhesive 13 is applied to the bottom surfaces of the two recesses 4a and the surface-mounted component 5 is installed between the two recesses 4a, the conductivity pushed by the bottom surface portion of the electrode 5a. Since the conductive adhesive 13 wraps around the gap between the side surface portion of the electrode 5a and the side wall portion of the recess 4a, the contact area between the conductive adhesive 13 and the electrode 5a is increased and the adhesive strength of the surface mount component 5 is improved. Can be made.

  In addition, according to the present embodiment, the recess 4a is formed on each terminal 4, and the electrode 5a of the surface mount component 5 is mounted on the recess 4a. Therefore, compared to the case where the recess 4a is not provided, The positioning accuracy when mounting the surface mounting component 5 can be improved.

  Moreover, according to this embodiment, since the 2nd recessed part 2h was formed in the area | region between the recessed parts 4a provided in each of the terminal 4 of the flat surface 2e, the conductive adhesive 13 makes a pair. Even when each of the two terminals 4 protrudes to the other terminal 4 side, the terminals 4 are accommodated in the second recess 2h, and the terminals 4 are electrically connected to each other through the conductive adhesive 13, and both terminals 4 are short-circuited. Can be suppressed.

  (Second Embodiment) FIG. 4 is a plan view showing a mounting structure included in a rotation sensor according to this embodiment, and FIG. 5 is a cross-sectional view taken along line BB in FIG. In addition, the rotation sensor concerning this embodiment is provided with the component similar to the rotation sensor concerning the said 1st Embodiment. Therefore, the same constituent elements are denoted by common reference numerals, and redundant description is omitted.

  The signal processing circuit 3A according to the present embodiment is provided in place of the signal processing circuit 3 of the first embodiment. In the signal processing circuit 3A, the two electrodes 5a and 5a of the surface mount component 5 are provided. A partition wall portion 2i is provided between two corresponding recesses 4a, 4a, and the partition wall portion 2i allows the conductive adhesives 13, 13 applied to the two recesses 4a, 4a to contact each other. Suppressed.

  Specifically, as shown in FIG. 4, the partition wall portion 2 i is formed at a substantially central portion of the second recess 2 h between the two terminals 4 and 4 forming a pair on which the surface mount component 5 is installed. The second recessed portion 2h is attached to the second recessed portion 2hL on the side where the one electrode 5aL of the surface mounting component 5 is attached and the other electrode 5aR is attached to the second recessed portion 2h. And the second concave portion 2hR on the side to be formed. In addition, as shown in FIG. 5, it is suitable for the partition part 2i to set it as the height which does not contact the mounted surface mount component 5. FIG.

  According to the present embodiment having the above-described configuration, when the conductive adhesive 13 is applied to the bottom surfaces of the two recesses 4a and the surface mount component 5 is installed between the two recesses 4a and mounted, the conductivity is increased. Even if the adhesive 13 protrudes to the second recess 2h side, the conductive adhesive 13 on the electrode 5aL side is in the second recess 2hL, and the conductive adhesive 13 on the electrode 5aR side is in the second recess 2hR. Each of them will be housed inside. Therefore, according to the present embodiment, it is possible to more reliably suppress the terminals 4 from being electrically connected to each other via the conductive adhesive 13 by the partition wall portion 2i.

  The present invention can be embodied in another embodiment as follows. In other embodiments described below, the same operations and effects as those of the above-described embodiment can be obtained.

  (1) In the above embodiment, the substrate portion is formed on the main body portion of the rotation sensor and the surface mount component is mounted on the substrate portion. However, the substrate on which the surface mount component is mounted is fixed to the main body portion. May be.

  (2) Moreover, a recessed part and a 2nd recessed part can be made into various shapes and various magnitude | sizes.

  Further, technical ideas other than the claims that can be grasped from the above embodiment will be described together with the effects thereof.

  (A) In the rotation sensor according to claim 1 or 2, a gap is formed between the side surface of the surface mount component and the side wall surface of the recess, and the conductive adhesive is allowed to enter the gap. Is preferred.

  If it carries out like this, it will become easy for a conductive adhesive to wrap around to the side part of a surface mounting component, and can improve adhesive strength more certainly.

  (B) In the rotation sensor according to claim 2, it is preferable that a partition wall is provided between the two recesses provided corresponding to different electrodes of the surface mount component.

  If it carries out like this, it can suppress more reliably that a terminal part conduct | electrically_connects through a conductive adhesive and a both terminals short-circuit by a partition part.

  (C) In the rotation sensor according to claim 3, in the second recess, a side to which one electrode of two electrodes of the surface mount component is attached and the other electrode are attached to the second recess. It is preferable to provide a partition wall partitioning to the side.

  In this way, when the conductive adhesive is applied to the recesses formed in each terminal and the surface mount component is installed, even if the conductive adhesive protrudes from the recesses to the second recess side, In the recess, the conductive adhesive can be accommodated separately in one electrode side region and the other electrode side region partitioned by the partition wall, so that the terminals are electrically connected by the conductive adhesive. , It is possible to further reliably prevent the two terminals from being short-circuited.

  (D) In the rotation sensor according to claim 3 or (c), the length of the second recess in the same direction is longer than the length of the recess provided in the terminal in the direction along the second recess. It is preferable to form the second recess.

  By doing so, the gap between the lower surface of the surface mount component and the surface of the board portion increases, so that it is possible to suppress the conductive adhesive from advancing to the other terminal side through the gap, and the terminals are made conductive. Can be prevented from being short-circuited through the adhesive.

Sectional drawing of the rotation sensor concerning 1st Embodiment of this invention. The top view which shows the mounting structure contained in the rotation sensor concerning 1st Embodiment of this invention. AA sectional drawing of FIG. The top view which shows the mounting structure contained in the rotation sensor concerning 2nd Embodiment of this invention. BB sectional drawing of FIG.

Explanation of symbols

1 Rotation sensor 2c Body part (board part)
2e Flat surface (surface)
2h Second recessed portion 4 Terminal 4a Recessed portion 5 Surface mount component 5a Electrode 13 Conductive adhesive

Claims (3)

In a rotation sensor including a substrate part, a terminal provided on the surface of the substrate part, and a surface-mounted component mounted on the terminal,
A rotation sensor, wherein a concave portion is formed in the terminal, and the surface-mounted component is mounted in the concave portion via a conductive adhesive.   The recesses are formed in each of the two terminals, different electrodes of the surface mount component are attached to each of the recesses via a conductive adhesive, and the surface mount component is installed between the two terminals. The rotation sensor according to claim 1.   The rotation sensor according to claim 2, wherein a second recess is formed in a region between the recesses provided in each of the terminals on the surface of the substrate portion.

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