JP2006188573A - Liquid epoxy resin composition, electronic component device using the composition and method for producing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding compound with no defects such as voids, excellent in solder jointability, and having good reliability such as reflow resistance, temperature cycle resistance and humidity resistance, and to provide a semiconductor device comprising an element sealed with the epoxy resin molding compound for sealing. <P>SOLUTION: A solvent-free liquid epoxy resin composition comprises an epoxy resin (A), a curing agent (B), and an accelerator (C) composed of at least one compound selected from DBU, a salt of DBU, DBN and a salt of DBN, wherein the curing agent (B) is an aromatic amine, and the weight ratio of the sum of DBU and DBN to the total amount of the epoxy resin (A) and the accelerator (C) is 0.02-0.10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a liquid epoxy resin composition, an electronic component device such as a semiconductor device using the same, and a method for manufacturing the same.

  A semiconductor needs a package in order to protect the element from the external environment and ensure various reliability, and at the same time facilitate mounting on a substrate. There are various types of packages, but in general, an element is fixed to a tab formed on a metal lead frame, and an electrode on the element surface and an inner lead are electrically connected by a gold wire, and the element, gold A package in which a part of a wire and a lead frame is sealed by a low-pressure transfer molding method using an epoxy resin composition is widely used. Such a resin-encapsulated semiconductor device has a considerably larger package outer shape than the element size, and is extremely inefficient from the viewpoint of high-density mounting. For this reason, the package form has shifted from the pin insertion type to the surface mount type, and has been actively reduced in size and thickness. However, as long as a structure in which an element is mounted on a metal lead frame and a wire-bonded structure is resin-sealed is adopted, there is a limit to increasing the mounting efficiency. Therefore, in the fields of COB (Chip on Board), hybrid ICs, modules, cards, etc., so-called flip chip mounting has been adopted in which a bare chip is mounted face-down on a substrate via bumps in order to mount some elements at high density. It was. Recently, various small packages called CSP (Chip Size / Scale Package) have been developed to cope with high integration, high functionality, high pin count, systemization, high speed, and low cost of devices. As a method for mounting an element on a substrate, flip chip mounting which is excellent in mounting efficiency, electrical characteristics, and high pin count is increasing. Also, many recent surface mount packages and CSPs have terminals arranged in an area array, and the mounting form of this type of package is the same as flip chip mounting.

By the way, when flip chip mounting is performed, the thermal expansion coefficient is different between the element and the substrate or the CSP, so that thermal stress is generated at the joint and it is important to ensure connection reliability. In addition, since the circuit forming surface of the bare chip is not sufficiently protected, moisture and ionic impurities are liable to enter, and ensuring moisture resistance reliability is also an important issue. As a countermeasure, an epoxy resin composition called an underfill material is usually interposed between the element and the substrate to reinforce the joint and protect the element. As a method of interposing the resin composition, generally, a method is adopted in which a liquid epoxy resin composition is dropped around the element and soaked into the gap between the element and the substrate by a capillary phenomenon. However, this method requires a long time and process such as a flux coating process, a package assembly process, a flux residue cleaning process, an underfill material injection process, and an underfill material curing process for removing the solder oxide film on the flip chip and the substrate. There was a drawback.
In order to solve this problem, a method has been proposed in which a resin is first applied to a circuit board, a chip having solder bumps is mounted thereon, and bump bonding and resin sealing are simultaneously performed (Patent Document 1). reference.). In this case, since the resin needs to have a function of removing the oxide film of the solder, a carboxylic acid compound having a strong acidity is generally added to the resin.
However, carboxylic acid compounds may deteriorate the ionic impurities and electrical conductivity of the resin, leading to poor insulation, and may deteriorate the moisture resistance reliability due to a decrease in adhesive strength during moisture absorption by PCT or HAST treatment. there were.
Japanese Patent Laid-Open No. 4-80443 (Patent No. 2589239)

  The present invention is intended to provide a liquid epoxy resin composition and an electronic component device that can perform bonding and sealing of a flip chip package at the same time without containing a highly acidic additive, and have high reliability. It is.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have determined that, in a liquid epoxy resin composition containing an epoxy resin, a curing agent, and a curing accelerator, a strong base compound and / or a salt thereof as a curing accelerator As a result, it has been found that the solder oxide film can be removed and the reliability of the moisture absorption treatment is not lowered, and the present invention has been completed through further studies.

The present invention
(1) (A) epoxy resin, (B) curing agent, (C) DBU, DBU salt, DBN and DBN salt, a solvent-free liquid epoxy resin composition containing at least one curing accelerator (B) the curing agent is an aromatic amine, and the weight ratio of the sum of DBU and DBN in the total amount of (A) epoxy resin and (C) curing accelerator is in the range of 0.02 to 0.10. A liquid epoxy resin composition characterized by
(2) (A) The epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol A / D type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, naphthalenediol type epoxy resin, The liquid epoxy resin composition according to (1), comprising at least one liquid epoxy resin selected from aminoglycidyl ether type epoxy resins;
(3) After applying the liquid epoxy resin composition of (1) or (2) above to the position where the element is mounted on the circuit forming surface of the inorganic or organic substrate, the electrode of the element and the circuit of the substrate are bonded via bumps. And simultaneously curing the epoxy resin composition or curing the epoxy resin composition by a subsequent heat treatment,
(4) The present invention relates to an electronic component device comprising an element sealed with a liquid epoxy resin composition as described in (1) or (2) above on an inorganic or organic circuit.

  The liquid epoxy resin composition of the present invention has no defects such as voids, is excellent in solder jointability, and has good reliability.

The (A) liquid epoxy resin used in the present invention is not particularly limited. For example, glycidyl ether type epoxy obtained by reaction of bisphenol A, bisphenol F, bisphenol AD, bisphenol S, naphthalene diol, hydrogenated bisphenol A and the like with epichlorohydrin. Resin, epoxidized novolak resin obtained by condensation or cocondensation of phenols and aldehydes, including orthocresol novolac type epoxy resin, by reaction of polybasic acids such as phthalic acid and dimer acid with epichlorohydrin Obtained glycidyl ester type epoxy resin, aminoglycidyl ether type epoxy resin obtained by reaction of polyamine such as diaminodiphenylmethane, isocyanuric acid and epichlorohydrin, olefin bond with peracetic acid, etc. Linear aliphatic epoxy resins obtained by oxidation with peracetic acid, and alicyclic epoxy resins. In particular, in the present invention, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, naphthalenediol type epoxy resin, aminoglycidyl ether type epoxy resin It is desirable to use at least one selected from the above, and these may be used alone or in combination of two or more.
Further, a solid epoxy resin may be used in combination as long as the object of the invention is not impaired. Furthermore, you may mix the reactive diluent which has an epoxy group for viscosity adjustment. Examples of the reactive diluent having an epoxy group include n-butyl glycidyl ether, versatic acid glycidyl ether, styrene oxide, ethylhexyl glycidyl ether, phenyl glycidyl ether, butylphenyl glycidyl ether, 1,6-hexanediol diglycidyl ether, neodymium There are pentyl glycol diglycidyl ether, diethylene glycol diglycidyl ether, and trimethylolpropane triglycidyl ether, and one or more of them may be used in combination.
These epoxy resins are sufficiently purified and preferably have little ionic impurities. For example, free Na ions and free Cl ions are preferably 500 ppm or less.

The (B) curing agent used in the present invention is not particularly limited as long as it is an aromatic amine. If the composition is liquid, the curing agent may be a solid aromatic amine, or a liquid and solid aroma. A group amine may be used in combination.
As an aromatic amine, for example, EpiCure W, EpiCure Z (all trade names manufactured by Japan Epoxy Resin Co., Ltd.), Kayahard A-A, Kayahard AB, Kayahard AS (all manufactured by Nippon Kayaku Co., Ltd.) Name), Totoamine HM-205 (trade name, manufactured by Toto Kasei Co., Ltd.), Adeka Hardener EH-101, Adeka Hardner EH-M32 (all trade names manufactured by Asahi Denka Kogyo Co., Ltd.), Epomic Q-640, Epomic Q- 643 (both trade names manufactured by Mitsui Chemicals, Inc.), DETDA80 (trade names manufactured by Lonza) and the like may be used, and these may be used alone or in combination of two or more.
The equivalent ratio of (A) epoxy resin and (B) curing agent is not particularly limited, but in order to reduce each unreacted component, the curing agent is in the range of 0.6 to 1.6 equivalents relative to the epoxy resin. Is preferably set to 0.7 to 1.4 equivalents, and more preferably 0.8 to 1.2 equivalents. 0.6. When deviating from the range of ˜1.6 equivalents, there is a tendency that unreacted components increase and reliability decreases.
Here, the equivalent of an aromatic amine is calculated on the assumption that one active hydrogen of an amino group reacts with one epoxy group.

The (C) curing accelerator used in the present invention is 1,8-diazabicyclo (5,4,0) undecene-7 (hereinafter referred to as DBU) and / or 1,5-diazabicyclo (4,3,0) nonene. -5 (hereinafter referred to as DBN) and / or DBU salt and / or DBN salt are not particularly limited and may be used singly or in combination of two or more. In particular, in the present invention, it is preferable to use DBU and / or a salt thereof from the viewpoint of reliability of the semiconductor device.
Examples of DBU and salts thereof include, for example, DBU, U-CAT SA1 (DBU-phenol salt), U-CAT SA102 (DBU-octylate), U-CAT SA506 (DBU-p-toluenesulfonate), U -CAT SA603 (DBU-formate), U-CAT SA810 (DBU-orthophthalic salt), U-CAT SA841 (DBU-phenol novolac resin salt) (all are trade names manufactured by San Apro Co., Ltd.), TOYOCAT AC-710 (DBU) -Trimellitic acid salt), TOYOCAT AC-722 (DBU-terephthalic acid salt), TOYOCAT AC-740 (DBU-cyanuric acid salt) (all are trade names manufactured by Tosoh Corporation).
The weight ratio of the sum of DBU and DBN in (C) cure accelerator to the total amount of (A) epoxy resin and (C) cure accelerator must be in the range of 0.02 to 0.10, preferably 0.04 It is in the range of ~ 0.08. If the weight ratio is lower than the lower limit, curability and solder oxide film removability deteriorate, and conversely if the upper limit is exceeded, the viscosity at room temperature of the composition increases, so voids and bondability deteriorate, and Tg Decreases and various reliability deteriorates, which is not preferable. Here, when (C) the curing accelerator includes a DBU salt and / or a DBN salt, the weight of the salt is directly used for calculating the “total amount”, and “(C) DBU in the curing accelerator and For “sum of DBN”, a value obtained by converting the weight of the salt into the weight of DBU and / or DBN is used.

In the present invention, an inorganic filler, a coupling agent, a flexing agent, a colorant and the like can be used as necessary. Inorganic fillers are blended for the purpose of lowering the thermal expansion, imparting rigidity and thermal conductivity of the epoxy resin composition, and are usually fused silica, crystalline silica, alumina, silicon nitride, boron nitride, silicon carbide. In particular, in the present invention, substantially spherical fused silica produced by heating and baking silica powder to a temperature equal to or higher than its melting point is preferred in the present invention. Spherical fused silica with a maximum particle size of 5 μm or less is preferable to prevent poor bonding due to the biting of the underfill material in the gap between the chip bump and the circuit board, and the compounding amount is reduced in the thermal expansion coefficient of the underfill material For this purpose, it is preferable to blend 40 wt% or more of the resin.
The coupling agent has the effect of improving the adhesion between the inorganic filler and the resin and the adherend. Specifically, γ- (2-aminoethyl) aminopropyltrimethoxysilane, γ- (2-aminoethyl) ) Aminopropyldimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-anilinopropyltrimethoxysilane, γ-ureidotrimethoxysilane, γ-dibutylaminopropyltrimethoxysilane, imidazole Silane or the like can be used. Silicone, acrylic and polyolefin elastomers or powders can be used as the flexibilizing agent, and carbon black, organic dyes, organic pigments, titanium oxide, red lead, bengara, etc. can be used as the colorant.

  Although the manufacturing method of the liquid epoxy resin composition of this invention is not specifically limited, What is necessary is just the method which can disperse-mix the said various components uniformly. As a general method, dispersion kneading with a three-roll, a raking machine, a planetary mixer or the like can be mentioned. Resin sealing of a semiconductor element with the liquid epoxy resin composition of the present invention is usually performed by a dispensing method.

In FIG. 1, an example of the electronic component apparatus of this invention manufactured with the liquid epoxy resin composition of this invention is shown with a longitudinal cross-sectional view. As shown in FIG. 1, a structure in which a semiconductor element 3 is mounted on one side of a wired circuit board 1, that is, a circuit forming surface via a plurality of connection electrode portions (bumps) 2 is employed. A sealing resin layer 4 that is a cured product of the liquid epoxy resin composition of the present invention is formed between the printed circuit board 1 and the semiconductor element 3.
The plurality of connection electrode portions 2 that electrically connect the circuit of the wired circuit board 1 and the electrodes of the semiconductor element 3 may be disposed on the surface of the wired circuit board 1 in advance. It may be disposed on the surface. Furthermore, it may be previously arranged on both the printed circuit board 1 surface and the semiconductor element 3 surface.
The material of the printed circuit board 1 may be either organic or inorganic, and is not particularly limited, but is roughly divided into a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate and a bismaleimide triazine. Examples include a substrate and a polyimide substrate. The liquid epoxy resin composition of the present invention is particularly suitable even when the bonding temperature cannot be set to a high temperature due to heat resistance problems, such as a combination of a plastic substrate and a connecting electrode portion using low melting point solder. It is used suitably, without being limited.
The material of the plurality of connection electrode portions 2 is not particularly limited, and examples thereof include a low melting point by solder and a high melting point bump, a tin bump, a silver-tin bump, a silver-tin-copper bump, and the like. Further, for the electrode part on the circuit wiring board made of the above-mentioned material, the connection electrode part 2 in the figure may be a gold bump, a copper bump or the like.
The semiconductor element 3 is not specifically limited, What is normally used can be used. For example, various semiconductors such as elemental semiconductors such as silicon and germanium, and compound semiconductors such as gallium arsenide and indium phosphide are used.

The manufacturing method of an electronic component device using the liquid epoxy resin composition of the present invention will be described in order with reference to the drawings, taking an example using solder bumps as connection electrode portions. 2 and 3 are schematic cross-sectional views showing an example of the manufacturing process of the electronic component device.
(1) First, as shown in FIG. 2, the liquid epoxy resin composition 7 of the present invention is applied on the printed circuit board 1 by a dispensing method.
(2) Next, as shown in FIG. 3, a plurality of solder bump connection electrode portions for electrical bonding to the circuit of the substrate at a predetermined position on the liquid epoxy resin composition 7 of the substrate of (1). A semiconductor element 3 provided with (joint ball) 2 is mounted.
The liquid epoxy resin composition 7 is melted on the heating stage to be in a molten state, and the connection electrode portion 2 of the semiconductor element 3 pushes away the molten liquid epoxy resin composition 7, so that the circuit board 1 for wiring and the connection electrode The parts 2 are temporarily mounted by contact, and the gap between the semiconductor element 3 and the printed circuit board 1 is filled with the molten liquid epoxy resin composition 7.
(3) Thereafter, metal bonding by solder reflow is performed, and at the same time, the liquid epoxy resin composition 7 is cured, thereby sealing the gap and forming the sealing resin layer 4 (see FIG. 1). At this time, the solder reflow method in which the solder is melted and the solder bumped element is electrically bonded onto the substrate is mounted on the chip by a device having a heater and a pressing portion, even in a bonding method using a reflow furnace. At the same time, a joining method may be employed in which the heater portion is heated to the melting point of the solder or higher to melt the solder. Moreover, the method of hardening | curing the said epoxy resin composition by the heat processing after metal joining other than the method of hardening | curing the epoxy resin composition 7 simultaneously with the said metal joining is mentioned. In this way, the electronic component device shown in FIG. 1 is manufactured.

In the above-described method for manufacturing an electronic component device, the case where the semiconductor element 3 provided with the plurality of connection electrode portions 2 is used has been described. However, the present invention is not limited to this. Those having the connecting electrode portion 2 may be used.
Examples of the method for applying the liquid epoxy resin composition 7 on the printed circuit board 1 include a printing method and a transfer method in addition to the dispensing method.
Further, the thickness and weight of the liquid epoxy resin composition 7 are the same as described above in the size of the semiconductor element 3 to be mounted and the size of the spherical connection electrode provided on the semiconductor element, that is, the semiconductor element 3 and the wiring circuit. It is set appropriately depending on the volume occupied by the sealing resin layer 4 formed by filling the gap with the substrate 1 and sealing.
In the method for manufacturing an electronic component device, the liquid epoxy resin composition 7 does not necessarily have to be heated and melted during the temporary mounting of (2). Furthermore, as the heating temperature when the liquid epoxy resin composition 7 is heated to a molten state, the heat resistance of the semiconductor element 3 and the printed circuit board 1, the melting point of the connection electrode portion 2, and the liquid epoxy resin composition 7 are used. In view of the softening point, heat resistance, etc., the thickness is appropriately set.

The liquid epoxy resin composition obtained by the present invention includes LSIs, transistors, diodes, thyristors, and other active elements resin-sealed with ceramics, glass / epoxy, polyimide and other substrates, capacitors, resistors, passive elements such as coils, etc. At the same time, it is preferably used as a sealing material for filling a gap between the bare chip and the substrate such as a COB (Chip on Board), a module, or a card for flip-chip mounting a bare semiconductor chip. Also, the gap between the bare chip and the substrate such as FC-BGA (Flip chip Ball Grid Array), EBGA (Enhanced BGA), ABGA (Advanced BGA), Stacked-BGA, and SIP (System in Package) that perform flip chip mounting at the package level It is preferable to use it as a sealing material for filling. In particular, the chip size has recently been increased and the gap has been narrowed. The liquid epoxy resin composition of the present invention exhibits excellent effects when the chip size is 15 × 15 mm or more and the gap is 80 μm or less.
The latest packages such as BGA, CSP (Chip Size / Scale Package), and WL-CSP (Wafer Level CSP) have an area array structure, and the mounting form on the substrate is the same as flip chip mounting. is there. Particularly in mobile electronic devices such as mobile phones, the impact resistance of joints is strictly required, and the gap between the package and the substrate is sealed with a reinforcing resin composition to ensure connection reliability. There is. The liquid epoxy resin composition of the present invention can also be used for such applications. In addition, bare chips are wire-bonded to TCP (Tape Carrier Package), ceramics, glass / epoxy, polyimide substrates, etc., which have been conventionally sealed with liquid epoxy resin compositions and bonded to semiconductor tape via bumps. It can also be used for resin sealing of COB, module, card, BGA, CSP and the like mounted by the bonding method.
In particular, the flip chip mounting type in which the circuit forming surface of the element and the circuit forming surface of the inorganic or organic substrate are opposed to each other, and the electrode of the element and the circuit of the substrate are electrically connected via bumps, It is particularly preferred that the liquid epoxy resin composition is filled in the gap between the element and the substrate.
The liquid epoxy resin composition of the present invention can also be used effectively for printed circuit boards.

  EXAMPLES Next, although an Example demonstrates this invention, the scope of the present invention is not limited to these Examples. In addition, the various characteristics of a liquid epoxy resin composition, observation of a void, and evaluation of various reliability were performed with the following method and conditions. The specifications of the semiconductor device used for the reliability evaluation are as follows: chip size 10.04 × 10.04 × 0.73 tmm (circuit is aluminum zigzag wiring, passivation: polyimide film), bump: solder ball (Sn / Pb: Melting point 310 ° C., φ80 μm, 1936 pin), bump pitch: 200 μm, substrate: FR-5 (53 × 30 × 0.7 tmm, Sn / Ag / Cu: melting point 217 ° C. receiving solder), chip / substrate gap: 45 μm It is.

(1) Viscosity and thixotropic index Using an E-type viscometer (manufactured by Tokyo Keiki Co., Ltd.), the viscosity (Pa · s) at 25 ° C. of the liquid epoxy resin composition was measured at a rotor rotation speed of 10 rpm. The thixotropic index was expressed as the ratio of the viscosity measured at 2.5 rpm of the rotor and the viscosity measured at 10 rpm.

(2) Void observation The inside of the semiconductor device sealed with the liquid epoxy resin composition was observed with an ultrasonic flaw detector AT-5500 (manufactured by Hitachi Construction Machinery Co., Ltd.) to examine the presence or absence of voids.

(3) Solder Joinability A continuity test indicated that all the 1936 bumps of the semiconductor device were conductive, and the others were indicated by x.
Further, cross-sectional observation of the bump and the receiving solder was performed, and the case where the interface between the bump and the receiving solder was uniformly wet-joined was indicated by ○, and the others were indicated by ×.

(4) Reliability evaluation (1) Reflow resistance After the semiconductor device was heated and dried at 120 ° C for 12 hours, the semiconductor device was absorbed for 168 hours under 85 ° C and 60% RH, and the far-infrared heating type reflow oven (260 ° C heating time) 10 seconds), the inside was observed with an ultrasonic flaw detector, and the liquid epoxy resin composition was separated from the chip and the substrate, and the presence or absence of cracks in the epoxy resin composition was examined.
(2) Thermal cycle resistance The semiconductor device is processed for 1000 cycles with a heat cycle of -50 ° C to 150 ° C for 30 minutes each, a continuity test is conducted to check for disconnection defects in the aluminum wiring, and evaluation is based on the number of defective packages / number of evaluation packages. did.
(3) Moisture resistance reliability After the semiconductor device was treated for 240 h under PCT conditions of 121 ° C., 2 atm, 100% RH, the presence or absence of disconnection of the aluminum wiring and the pad was confirmed by a continuity test and evaluated by the number of defective packages / number of evaluation packages.

[Examples 1 to 8]
Each raw material weighed at the blending ratio shown in Table 1 was put in a vacuum crusher and kneaded for about 20 minutes while reducing the pressure to 5 torr to obtain 8 types of target liquid epoxy resin compositions. Next, these liquid epoxy resin compositions were apply | coated on the circuit board using dispenser. Next, after aligning the chip and the circuit board using a flip chip bonder manufactured by Misuzu FA Co., Ltd., both were pressed at 260 ° C. for 10 seconds. Next, the resin was cured by heating in a high temperature bath at 165 ° C. for 2 hours to obtain the intended resin-encapsulated semiconductor device. The properties, moldability, and reliability evaluation results of the obtained liquid epoxy resin composition are summarized in Table 1.

＊1：エポキシ当量160
＊2：エポキシ当量95
＊3：活性水素当量45
＊4：1,8−ジアザビシクロ（5,4,0）ウンデセン−7
＊5：1,5−ジアザビシクロ（4,3,0）ノネン−5
＊6：DBU−フェノール塩、DBU濃度62wt%
＊7：DBU−蟻酸塩、DBU濃度75wt%
＊8：DBU−フェノールノボラック樹脂塩、DBU濃度30wt%
＊9：DBU−シアヌル酸塩、DBU濃度54wt%

* 1: Epoxy equivalent 160
* 2: Epoxy equivalent 95
* 3: Active hydrogen equivalent 45
* 4: 1,8-diazabicyclo (5,4,0) undecene-7
* 5: 1,5-diazabicyclo (4,3,0) nonene-5
* 6: DBU-phenol salt, DBU concentration 62wt%
* 7: DBU-formate, DBU concentration 75wt%
* 8: DBU-phenol novolac resin salt, DBU concentration 30 wt%
* 9: DBU-cyanurate, DBU concentration 54 wt%

[Comparative Examples 1-5]
Five types of liquid epoxy resin compositions were prepared in the same manner as above using each material weighed at the blending ratio shown in Table 2, and the moldability and various reliability of the semiconductor device were evaluated. The results are summarized in Table 2.

＊1：エポキシ当量160
＊2：エポキシ当量95
＊3：活性水素当量45
＊4：1,8−ジアザビシクロ（5,4,0）ウンデセン−7
＊10：2−エチル−4−メチルイミダゾール
＊11：ベンジルジメチルアミン
＊12：トリスジメチルアミノメチルフェノール

* 1: Epoxy equivalent 160
* 2: Epoxy equivalent 95
* 3: Active hydrogen equivalent 45
* 4: 1,8-diazabicyclo (5,4,0) undecene-7
* 10: 2-Ethyl-4-methylimidazole * 11: Benzyldimethylamine * 12: Trisdimethylaminomethylphenol

  As is clear from Tables 1 and 2, the liquid epoxy resin composition of the present invention has no defects such as voids, is excellent in solder jointability, and has excellent reliability such as reflow resistance, temperature cycle resistance, and moisture resistance. It is.

FIG. 1 is a schematic cross-sectional view illustrating an example of an electronic component device. FIG. 2 is a schematic cross-sectional view showing an example of the manufacturing process of the electronic component device. FIG. 3 is a schematic cross-sectional view showing an example of the manufacturing process of the electronic component device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring circuit board 2 Electrode part for connection 3 Semiconductor element 4 Sealing resin layer 7 Liquid epoxy resin composition

Claims (4)

  (A) Epoxy resin, (B) curing agent, (C) DBU, DBU salt, DBN and DBN salt, a solvent-free liquid epoxy resin composition containing a curing accelerator composed of at least one kind. (B) the curing agent is an aromatic amine, and the weight ratio of the sum of DBU and DBN in the total amount of (A) epoxy resin and (C) curing accelerator is in the range of 0.02 to 0.10. A liquid epoxy resin composition.   (A) Epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin, bisphenol S type epoxy resin, hydrogenated bisphenol A type epoxy resin, naphthalenediol type epoxy resin, aminoglycidyl ether type epoxy The liquid epoxy resin composition according to claim 1, comprising at least one liquid epoxy resin selected from resins.   3. The liquid epoxy resin composition according to claim 1 or 2 is applied to a position on the circuit forming surface of an inorganic or organic substrate, and then the epoxy of the device is bonded to the circuit of the substrate through a bump at the same time. A method for producing an electronic component device, comprising curing a resin composition or curing the epoxy resin composition by a subsequent heat treatment. An electronic component device comprising an element sealed with a liquid epoxy resin composition according to claim 1 on a circuit of an inorganic or organic substrate.

Images