JP2006134086A - Ic card with fingerprint sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card with a fingerprint sensor, which is thin and has high durability, a good feeling of operation and fine appearance. <P>SOLUTION: In the IC card constituted by integrating a fingerprint sensor 10 provided with a sensor part 11 for detecting ruggedness of a fingerprint and an integrated circuit 17 for driving or detecting the sensor part 11 into an IC card casing 29, the sensor part 11 comprises a base body part 11a with top face as a sensor surface 10a and a flange flat part 11b formed around the bottom part of the body part 11a, the sensor surface 10a is formed so as to be exposed to the surface of the IC card casing 29 and the integrated circuit 17 is mounted on a mounting surface 17e formed on the flat part 11b. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC card on which a thin fingerprint sensor is mounted.

Among biometric risks, fingerprint sensors that can be reduced in size and thickness are mounted on mobile phones and IC cards in the near future, and are expected as a means for identity verification. In particular, in the IC card, a thickness of 0.76 mm is defined by the ISO standard and the like, and in order to correspond to a generally popular IC card reader, 0.76 mm when mounted on a fingerprint sensor. It is desirable to keep the thickness.
As a conventional example in which a fingerprint sensor is mounted in an IC card, for example, WO99 / 50794 (Patent Document 1) can be cited. Although there is no detailed description of the structure of the fingerprint sensor in this patent document, it is necessary to separately mount driving and detection ICs in order to operate this type of fingerprint sensor.

As a specific example, a pressure-sensitive fingerprint sensor in which a plurality of drive lines and detection lines are formed on a film and opposed to each other, and a capacitive fingerprint sensor in which a wiring and an insulating film are laminated can be considered. Since any of the fingerprint sensors is passive detection, it is not necessary to use a hard substrate such as a Si substrate, and a thin and flexible fingerprint sensor can be realized by devising the substrate material. When a fingerprint sensor is mounted on an IC card, it is required that the function of the IC card is not particularly impaired. Therefore, a passive fingerprint sensor that is thin and flexible is desired.
International Publication No. 99/50794 Pamphlet

However, since the conventional general fingerprint sensor has a planar structure, when a detection IC or the like is mounted on the electrode drawn out from the sensor, these portions become restrictions on the card thickness.
Since the IC mounting portion is higher than the sensor surface, it is necessary to make the portion thicker in consideration of the protection function of the IC. For this reason, as shown in the above-mentioned patent document, whether the IC mounting part for detection is protruded (so that it protrudes from the sensor surface) or is partially thickened, or the entire card is thickened and planarized. It was necessary to take measures such as.

For example, FIG. 12 shows a schematic diagram of a conventional capacitive fingerprint sensor 80 in which driving and detection ICs 86 and 87 are mounted on the capacitive sensor 81, and FIG. 13 shows the fingerprint sensor 80 of FIG. The schematic sectional drawing mounted in the card | curd 89 is shown. FIG. 14 is a schematic diagram of a conventional pressure-sensitive fingerprint sensor 90 in which driving and detection ICs 96 and 97 are mounted on the pressure-sensitive sensor unit 91, and FIG. 15 shows that the fingerprint sensor 90 of FIG. 14 is mounted on the IC card 99. An example is shown.
When trying to match the thickness of the entire IC card to the card standard of 0.76 mm, the IC card housing part that holds the sensor part as shown in FIG. The part where the sensor part is located is insufficient in strength, and sufficient durability cannot be secured. Further, since the sensor surface a comes to a position lower than the card surface b, the step becomes large. In addition, when the sensor surface a is recessed with respect to the IC card, the operational feeling is not good, and the finger 100 does not easily hit the sensor surface near the step (peripheral region of the sensor surface), and the substantial detection area becomes narrow. End up.
On the other hand, when the IC part is thickened, the IC mounting part protrudes as shown in FIG. 13B or FIG. 15B, and the portability and the card appearance are adversely affected. There was a problem that it was larger than the thickness of the card standard.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an IC card with a fingerprint sensor that is thin, has good durability, and has a good operational feeling and appearance.

In order to achieve the above object, the present invention employs the following configuration.
An IC card with a fingerprint sensor according to the present invention is an IC card in which a fingerprint sensor provided with a sensor unit for detecting unevenness of a fingerprint and an integrated circuit for driving or detecting the sensor unit is incorporated in an IC card casing. And
The sensor unit has a trapezoidal main body part whose top surface is a sensor surface and a bowl-shaped flat part provided around the bottom side, and the sensor surface is exposed on the surface of the IC card casing. The integrated circuit is mounted on a mounting surface formed on the flat portion.
According to the IC card with a fingerprint sensor having such a configuration, even if the sensor surface is configured to be substantially flush with the surface of the IC card housing, the integrated circuit does not protrude from the IC card surface, and can be thinned. Since the main body having the sensor surface can be thickened to the same level as the thickness of the IC card, the strength of the sensor can be ensured and the durability can be improved.
Since the difference in level between the sensor unit and the surface of the IC card housing can be eliminated, it is possible to improve the poor operational feeling and the substantial detection area due to the sensor surface being recessed from the surface of the IC card housing. This makes it easier for the finger to hit the sensor surface. Further, it is possible to improve the appearance defect and the adverse effect on portability caused by the mounting portion of the integrated circuit projecting from the sensor surface, and it is also possible to make the thickness within the ISO standard of the IC card.

  In the IC card with a fingerprint sensor of the present invention having the above-described configuration, the main body of the sensor unit has a substantially trapezoidal pedestal in a longitudinal section, a row wiring disposed on the pedestal, and a direction intersecting the row wiring. A sensor element having a column wiring extending is provided, a first wiring is formed on an inclined surface of one side surface of the pedestal, and the row wiring and an electrode for mounting the integrated circuit formed on the mounting surface are The second wiring is formed on the inclined surface of the other side surface of the pedestal connected via the first wiring, and the column wiring and the electrode for mounting the integrated circuit formed on the mounting surface are It may be connected via the second wiring.

In the IC card with a fingerprint sensor of the present invention having the above-described configuration, a collar is provided around the bottom of the pedestal, and a flexible film body is laminated on the pedestal and the collar, and the film body is the sensor. It is preferable that an element and the first and second wirings are provided.
According to the IC card with a fingerprint sensor having such a configuration, after forming the sensor element and the first and second wirings on a flexible film body in a flat state, the flexible film body When mounted on the pedestal and the collar and mounted in the IC card, it can be held by the IC card housing and deformed along the surface shape of the pedestal and the collar, so that the sensor element and the first As a method for forming the second wiring, a method of forming a fine pattern using a general film forming apparatus or exposure apparatus can be employed, and the manufacturing method is easy.

In the IC card with a fingerprint sensor of the present invention having any one of the above configurations, the pedestal has a substantially trapezoidal shape in a longitudinal sectional view, and the pedestal has a curved surface at the boundary between the top surface and the inclined surface on the side surface. The pedestal has a curved surface at a boundary portion between the inclined surface and the collar portion.
According to the IC card with a fingerprint sensor of the present invention having such a configuration, the wiring is formed on the boundary between the top surface of the pedestal and the inclined surface of the side surface or on the boundary between the inclined surface of the pedestal and the flange portion. Since it becomes easy, the connection failure resulting from the film-forming defect can be prevented.

Moreover, in the IC card with a fingerprint sensor of the present invention having any one of the above structures, a concave portion is formed on the top surface of the pedestal, and a curved surface is formed in the concave portion.
Since the pedestal provided in the main body of the sensor unit can be thick, a concave portion having a curved surface can be formed on the top surface of the pedestal. If such a concave portion is formed on the top surface of the pedestal, the sensor surface disposed on the pedestal also has a concave portion, and can also have a curved surface in the concave portion. For example, even in a dark place Since the user can easily understand the sensor surface, the user can easily touch the sensor surface, and the peripheral area of the sensor surface can also be easily touched by the finger, so that the substantial detection area can be prevented from being narrowed.

Further, the IC card with a fingerprint sensor of the present invention is an IC card in which a fingerprint sensor including a sensor unit for detecting unevenness of a fingerprint and an integrated circuit for driving or detecting the sensor unit is incorporated in an IC card casing. Because
The sensor portion has a main body portion on which a sensor surface and a mounting surface for mounting the integrated circuit are formed, and the sensor surface and the mounting surface are arranged so as to be opposite to each other. The sensor surface is provided so as to be exposed on the surface of the IC card casing.
According to the IC card with a fingerprint sensor having such a configuration, the integrated circuit mounting portion can be provided on the opposite side of the sensor surface even when the sensor surface is exposed on the surface of the IC card casing. The mounting portion of the IC card housing does not protrude from the surface of the IC card housing, and the mounting portion of the sensor portion and the integrated circuit is held by the IC card housing having a sufficient thickness from the back side. Strength can be secured, mechanical and electrical damage of the integrated circuit can be reduced, and durability can be improved.

  In the IC card with a fingerprint sensor of the present invention configured as described above, the main body has a substrate, a sensor element having a row wiring and a column wiring extending in a direction intersecting the row wiring on one surface of the substrate, and the row Connecting the first wiring for connecting the wiring and the electrode for mounting the integrated circuit formed on the mounting surface, and the column wiring and the electrode for mounting the integrated circuit formed on the mounting surface The second wiring may be disposed, and a surface of the substrate opposite to the sensor element may be the sensor surface.

In the IC card with a fingerprint sensor of the present invention configured as described above, the sensor element substrate is formed of a single flexible film substrate, and the row wiring and the column wiring are formed on the flexible film substrate, The row wiring and the column wiring may intersect with each other by bending the flexible film substrate.
According to the IC card with a fingerprint sensor having such a configuration, after the row wiring and the column wiring are formed on the flexible film substrate, the flexible film substrate is bent, and the row wiring and the column are formed. Since the sensor element can be manufactured by crossing the wiring, a method of forming a fine pattern using a general film forming apparatus or exposure apparatus can be adopted as a method of forming the column wiring or row wiring. The manufacturing method is easy.

Moreover, in the IC card with a fingerprint sensor of the present invention having any one of the above configurations, a convex portion protruding from the surface of the IC card casing may be formed around the sensor surface.
When such a convex portion is formed around the sensor surface, for example, even in a dark place, the user can easily understand the sensor surface and easily touch the sensor surface with a finger.

Moreover, in the IC card with a fingerprint sensor of the present invention having any one of the above configurations, the thickness of the IC card with the fingerprint sensor is preferably 0.68 mm or more and 0.80 mm or less.
The thickness of the IC card is preferably 1 mm or less. In particular, the thickness is preferably set to 0.68 mm to 0.80 mm. With this configuration, an IC card corresponding to the JIS standard can be realized.
Moreover, the thickness of the IC card with a fingerprint sensor of the present invention may be 0.76 mm or less which is a standard value of JIS standard.

In addition, a fingerprint sensor according to the present invention is a fingerprint sensor provided with a sensor unit for detecting unevenness of a fingerprint and an integrated circuit for driving or detecting the sensor unit,
The sensor unit has a trapezoidal main body with a top surface serving as a sensor surface, and a bowl-shaped flat part provided around the bottom of the sensor part, and the integrated circuit is mounted on a mounting surface formed on the flat part. It is characterized by being implemented.
In addition, a fingerprint sensor according to the present invention is a fingerprint sensor provided with a sensor unit for detecting unevenness of a fingerprint and an integrated circuit for driving or detecting the sensor unit,
The sensor part has a main body part on which a sensor surface and a mounting surface for mounting the integrated circuit are formed, and the sensor surface and the mounting surface are arranged so as to be opposite to each other. And
The fingerprint sensor according to the present invention having any one of the above-described configurations can be mounted on a device having a space factor or a design restriction other than an IC card, such as a portable electronic device.

  The IC card with a fingerprint sensor of the present invention is thin, has good durability, and has a good operational feeling and appearance.

Next, embodiments of the present invention will be described in detail with reference to the drawings.
The present invention is of course not limited to the embodiments described below, and in the following drawings, the constituent parts are shown so that the scale of each constituent part can be easily shown in the drawings. The scale is changed every time.
(First embodiment)
In the first embodiment, an example in which the present invention is applied to an IC card with a capacitive fingerprint sensor will be described.
FIG. 1 is a cross-sectional view showing a schematic configuration of an IC card with a capacitive fingerprint sensor according to the present embodiment, and FIG. 2 is a capacitive fingerprint sensor provided in the IC card with a fingerprint sensor of FIG. It is a perspective view which shows schematic structure of these. 3 is a conceptual diagram showing a configuration of an equivalent circuit of the capacitive fingerprint sensor of FIG. 2, and FIG. 4 is an enlarged plan view of a main part of the capacitive fingerprint sensor of FIG. 5 is a cross-sectional view taken along line VV in FIG.

The IC card with a fingerprint sensor of this embodiment is one in which a capacitive fingerprint sensor 10 is incorporated in an IC card housing 29.
The electrostatic capacitance type fingerprint sensor 10 includes a sensor unit 11 that detects the unevenness of the fingerprint, a driving IC (integrated circuit) 16 that drives the sensor unit 11, and a capacitance detection IC (integrated circuit) 17 that detects the capacitance. Is the main constituent.
The sensor unit 11 has a trapezoidal main body part 11 a whose top surface is a sensor surface 10 a and a bowl-shaped flat part 11 b provided around the bottom side thereof, and the sensor surface 10 a is the surface of the IC card housing 29. It is provided so as to be exposed. The sensor surface 10 a is substantially flush with the surface of the IC card housing 29.
Mounting surfaces 16e and 17e for mounting ICs (integrated circuits) 16 and 17 are formed on the flat portion 11b. An electrode 16i is formed on one mounting surface 16e, and a driving IC 16 is mounted on the electrode 16i. The electrode 17i is formed on the other mounting surface 17e, and the capacitance detection IC 17 is mounted on the electrode 17i.

A main body 11 a of the sensor unit 11 includes a pedestal 12 having a substantially trapezoidal shape in a longitudinal section and a plurality of sensor elements 15 provided on the pedestal 12.
On the top surface of the pedestal 12, a plurality of row wires 17a, a detection electrode 23 extending from the row wire 17a, and a pair of drive electrodes 22 of the detection electrode 23 are formed. The plurality of row wirings 17a are arranged substantially parallel to each other.
A floating electrode 25 and a plurality of column wirings 16a extending in a direction intersecting with the row wirings 17a are formed on the plurality of row wirings 17a, the detection electrodes 23, and the drive electrodes 22 via an interlayer insulating film 24. Yes. The plurality of column wirings 16a are arranged substantially parallel to each other.

In the configuration of the detection electrode 23 and the drive electrode 22 and the floating electrode 25, the drive electrode 22 and the detection electrode 23 are overlapped so that the floating electrode 25 is completely covered in plan view. A capacitor Ca is formed between the drive electrode 22 and the floating electrode 25, and a capacitor Cb is formed between the detection electrode 23 and the floating electrode 25.
Each drive electrode 22 is electrically connected to the column wiring 16a via a contact 34 at one end. That is, the drive electrode 22 has a shape extending from the column wiring 16a.
A portion where the row wiring 17a and the column wiring 16a intersect (in other words, the portion of the floating electrode 25) serves as a fingerprint (detected object) detection portion, that is, a sensor element 15.
The passivation film 18 is provided on the floating electrode 25 and the column wiring 16a in order to protect these electrodes and wiring. In the present embodiment, the passivation film 18 on the top of the base 12 is exposed on the surface of the IC card housing 29. In FIG. 1, the row wiring 17a, the interlayer insulating film 24, and the floating electrode 25 are not shown. In FIG. 2, the description of the passivation film 18 is omitted.

A flat collar 13 is formed around the bottom of the pedestal 12, and an electrode 16i for mounting the driving IC 16 and an electrode 17i for mounting the capacitance detection IC 17 are formed on the collar.
A plurality of first wirings 17 b are formed on the inclined surface 12 a on one side surface of the pedestal 12. One end of the first wiring 17b is connected to the corresponding row wiring 17a, and the other end is connected to the capacitance detection IC 17 via the electrode 17i.
A plurality of second wirings 16 b are formed on the inclined surface 12 b on the other side surface of the pedestal 12. One end of the second wiring 16b is connected to the corresponding column wiring 16, and the other end is connected to the driving IC 16 via the electrode 16i.

The thickness d of the base 12, the order of magnitude of the sensor surface 10a touches the fingertip, for example, the area of the sensor surface 10a is the case of 80 mm ² to 200 mm ^2, is about 0.3 mm to 0.5 mm.
The inclination angle θ of the inclined surface of the pedestal 12 is about 30 to 60 degrees in that the first wiring 17b and the second wiring 16b can be easily formed on the inclined surface, and film formation defects can be prevented. preferable.
As a method of forming the above wiring on the top surface or the inclined surface of the pedestal 12, a method of forming a three-dimensional wiring on a three-dimensional structure can be adopted. For example, a wiring made of a conductive film by photolithography with a deep focus depth Can be formed.

The thickness _{D 1} of the fingerprint sensor with the IC card of the present embodiment is preferably less 0.68mm or 0.80mm JIS standard.
The thickness _{D 1} of the fingerprint sensor with the IC card of the present embodiment may be 0.76mm or less thick which is the standard value of the JIS standard.

The capacitance type fingerprint sensor 10 obtains a change in capacitance at a detection portion corresponding to an intersection where a row wiring and a column wiring intersect with each other as a change in displacement current, and an I / V conversion circuit (illustrated). (Abbreviated) can be detected.
The IC card of this embodiment provided with such a capacitive fingerprint sensor 10 has a large number that occurs when the fingertip 77 is pressed against the surface of the sensor surface 10a (exposed surface of the passivation film 18). By detecting the change in capacitance of the detection portion, the shape of the fingerprint (fine uneven surface) of the fingertip 77 can be output as signal data.

The IC card with a fingerprint sensor according to the present embodiment has a capacitive fingerprint sensor 10 in which a mounting surface on which an electrode for mounting an IC is formed on the sensor surface 10a is lowered, and only the sensor surface 10a has an IC card housing. Since it is embedded in the IC card housing 29 so as to be exposed on the surface of 29, it is thin, has good durability, and has a good operational feeling and appearance.
Note that the base 12 and the collar 13 provided in the IC card with the fingerprint sensor of this embodiment form a continuous curved surface 12c at the boundary between the top surface of the base 12 and the inclined surface of the side as shown in FIG. The continuous curved surface 12d is preferably formed at the boundary between the inclined surface of the pedestal 12 and the flange 13 for the reason described above.

Further, as shown in FIG. 7, a recess 12e is formed on the top surface of the pedestal 12, a continuous curved surface is formed in the recess 12e, and a recess 10e is formed on the sensor surface 10a on the top of the pedestal 12, It is preferable for the reason described above that a continuous curved surface is formed in the recess 10e.
Further, as shown by the dotted line in FIG. 1, it is preferable that the convex portion 76 protruding from the surface of the IC card housing 29 is formed around the sensor surface 10a for the reason described above. The thickness of the IC card including the portion provided with the portion 76 is preferably set to a thickness of 0.76 mm or less of JIS standard.

(Second Embodiment)
FIG. 8 is a cross-sectional view showing a schematic configuration of an IC card with a capacitive fingerprint sensor according to the second embodiment.
The IC card with fingerprint sensor of the second embodiment is different from the IC card with fingerprint sensor of the first embodiment in that a flexible film body 40 is laminated on the pedestal 12 and the collar 13, A plurality of sensor elements, detection electrodes, drive electrodes, interlayer insulating films, and floating electrodes similar to those of the first embodiment are formed on the film body 40 on the top of 12, and the film body on the inclined surface on one side surface of the base 12. 40, a plurality of first wirings are formed, a plurality of second wirings 16b are formed on the inclined surface 12b of the other side surface, and a plurality of mounting surfaces are formed on the film body 40 on the flange portion 13, The electrode 16i is formed on one mounting surface, the driving IC 16 is mounted on the electrode 16i, the electrode 17i is formed on the other mounting surface 17e, and the capacitance detection IC 17 is mounted on the electrode 17i. In that the passivation film 18 is formed on Ingu electrodes and the column wiring 16a.

Examples of the material of the flexible film body 40 include polyimide and polyamide.
The thickness of the flexible film body 40 is about 50 μm to 200 μm.

  According to the IC card with a fingerprint sensor of the present embodiment, after the sensor element and the first and second wirings are formed on the flat film body 40, the film body 40 is placed on the base 12 and the collar 13. When mounted on the IC card, it is pressed by the IC card housing 29 and can be deformed along the surface shapes of the pedestal 12 and the flange 13 so that the sensor element and the first and second sensor elements can be deformed. As a method for forming the wiring, a method of forming a fine pattern using a general film forming apparatus or exposure apparatus can be adopted, and the manufacturing method is easy.

(Third embodiment)
In the third embodiment, an example in which the present invention is applied to an IC card with a pressure-sensitive fingerprint sensor will be described.
FIG. 9 is a cross-sectional view showing a schematic configuration of the pressure-sensitive fingerprint sensor IC card of this embodiment, and FIG. 10 shows a schematic configuration of the pressure-sensitive fingerprint sensor provided in the IC card with the fingerprint sensor of FIG. It is sectional drawing shown. 11A is a conceptual diagram showing a configuration of an equivalent circuit of the pressure-sensitive fingerprint sensor of FIG. 10, and FIG. 11B is an arrangement relationship between the column wiring and the row wiring of the pressure-sensitive fingerprint sensor of FIG. FIG.

The IC card with a fingerprint sensor of the present embodiment is one in which a pressure-sensitive fingerprint sensor 50 is incorporated in an IC card housing 29.
The pressure-sensitive fingerprint sensor 50 is mainly composed of a sensor unit 51 that detects unevenness of a fingerprint, a detection IC (integrated circuit) 57 that detects capacitance, and a driving IC (integrated circuit) 56. Yes. In FIG. 9, the driving IC (integrated circuit) 56 is not shown.
The sensor unit 51 includes a main body 51a on which a sensor surface 50a, a mounting surface 57e for mounting a detection IC (integrated circuit) 57, and a mounting surface for mounting a driving IC (integrated circuit) 56 are formed. The sensor surface 50 a and the mounting surface are arranged so as to be opposite to each other, and the sensor surface 50 a is provided so as to be exposed on the surface of the IC card housing 29.

As shown in FIGS. 10 and 11, the main body 51 a has a single flexible film substrate 72 that is bent, and a row wiring 67 a and a row wiring 67 a between the opposing surfaces of the flexible film substrate 72. A plurality of sensor elements 65 having column wirings 66a extending in the intersecting direction are provided. In the present embodiment, a plurality of row wirings 67a are arranged substantially in parallel on the upper surface 72a of the opposed surfaces of the bent single flexible film substrate 72, and are returned to the lower surface 72b. The wiring 66a is arranged substantially in parallel.
The flexible film substrate 72 is bent so that the upper end portion protrudes from the lower end portion, and a protruding portion 72c is provided.

A plurality of first wirings 67b are formed on the upper surface 72a, and a mounting surface 57e is formed on the inner surface side (upper surface 72) of the protruding portion 72c. One end of the first wiring 67b is connected to the corresponding row wiring 67a, and the other end is connected to the detection IC 57 via an electrode (not shown) formed on the mounting surface 57e.
A plurality of second wirings (not shown) are formed on the lower surface 72b. One end of these second wirings is connected to the corresponding column wiring 66a, and the other end is connected to the driving IC 56 via an electrode (not shown) formed on the mounting surface. The second wiring is formed via a bent portion of the flexible film substrate 72, and electrically connects the column wiring 66a and the driving IC 56.

A method of forming the plurality of sensor elements 65 between the opposed surfaces of the bent flexible film substrate 72 includes a plurality of column wirings 66a on one surface of the flexible film substrate 72 in a flat state, and orthogonal to these column wirings. A plurality of row wirings 67a extending in the extending direction are formed adjacent to each other, and an insulating film 68 is formed so as to cover the column wirings 66a and the row wirings 67a. When the flexible film substrate 72 forms a plurality of column wirings 66a and a plurality of row wirings 67a, a plurality of first wirings 67b, electrodes for mounting an IC, and a plurality of second wirings are also formed.
Then, the flexible film substrate 72 is bent along a folding line near the boundary between the column wiring 66a and the row wiring 67a so that the column wiring 66a and the row wiring 67a face each other through the insulating film 68. It ’s fine.
In the present embodiment, the outer surface of the flexible film substrate 72 on the side where the row wiring 67a is formed is exposed on the surface of the IC card housing 29, and this exposed surface serves as the sensor surface 50a. The sensor surface 50a is a surface opposite to the surface on which the sensor element of the bent flexible film substrate 72 is provided.

As shown in FIG. 10, after the flexible film substrate 72 is bent, a spacer 69 is formed to maintain a certain distance between the column wiring 66a and the row wiring 67a facing each other through the insulating film 68. Is preferred. Further, as indicated by a dotted line in FIG. 10, the reinforcing plate 71 may be bonded to the column wiring 66 a side of the flexible film substrate 72. Further, a frame-shaped reinforcing plate 73 may be formed around the periphery of the flexible film 72 on the row wiring 67a side as indicated by a dotted line in FIG.
The thickness D _{2 of the} IC card with fingerprint sensor of the present embodiment is preferably 0.68 mm or more and 0.80 mm or less of JIS standard.
In addition, the thickness D _{2 of the} IC card with a fingerprint sensor of the present embodiment may be 0.76 mm or less which is a standard value of JIS standard.

  With the above-described configuration, the pressure-sensitive sensor 50 is provided with a change in capacitance according to the change in the separation distance of the intersection 65a where the row wiring 67a and the column wiring 66a intersect in the detection IC 57. It can be detected by a capacitance detection circuit. In this way, the fingerprint (fine uneven surface) of the fingertip 77 is detected by detecting a change in the capacitance of the multiple intersections 65a that occurs when the fingertip 77 is pressed against the sensor surface 50a of the flexible film substrate 72. Can be output as signal data.

According to the IC card with a fingerprint sensor of the present embodiment, the IC mounting portion can be provided on the opposite side of the sensor surface 50a even if the sensor surface 50a is exposed on the surface of the IC card housing 29. Since the IC mounting part does not protrude from the surface of the IC card casing and can be thinned, and the sensor part 51 and the IC mounting part are held by the IC card casing having a sufficient thickness from the back side, the sensor The strength of the portion 51 can be secured, the mechanical and electrical damage of the IC can be reduced, and the durability can be improved.
In addition, although it is preferable for the reason mentioned above that the convex part which protrudes from the surface of the IC card housing | casing 29 is formed in the circumference | surroundings of the sensor surface 50a, in that case, IC card thickness including the part which provided the convex part Is preferably set to a thickness of 0.68 mm or more and 0.80 mm or less of JIS standard.

In the first to third embodiments, the sensor unit and the pedestal may be made of a hard material that does not deform, but may be a flexible material that can be bent. In order to cope with the bending described in the card standard, it is preferable to use a flexible material.
The sensor unit, pedestal, film body, and flexible film substrate may be opaque colored according to design requirements, but may be made of a transparent material. When a transparent material is used, the fingerprint sensor of the first to third embodiments is not limited to an IC card, and is a transparent fingerprint that can be placed on a display device in a device such as a cellular phone that has restrictions on the location of the sensor. It can also be used as a sensor.

1 is a cross-sectional view showing a schematic configuration of an IC card with a capacitive fingerprint sensor according to a first embodiment of the present invention. The perspective view which shows schematic structure of the electrostatic capacitance type fingerprint sensor with which the IC card with a fingerprint sensor of FIG. 1 was equipped. The conceptual diagram which shows the structure of the equivalent circuit of the electrostatic capacitance type fingerprint sensor of FIG. FIG. 3 is an enlarged plan view of a main part of the capacitive fingerprint sensor in FIG. 2. FIG. 5 is a cross-sectional view taken along line VV in FIG. 4. Sectional drawing which showed the other example of the IC card with the electrostatic capacitance type fingerprint sensor of this invention. Sectional drawing which showed the other example of the IC card with the electrostatic capacitance type fingerprint sensor of this invention. Sectional drawing which shows schematic structure of the IC card with the electrostatic capacitance type fingerprint sensor of 2nd Embodiment. Sectional drawing which shows schematic structure of the IC card with a pressure-sensitive fingerprint sensor of 3rd Embodiment. Sectional drawing which shows schematic structure of the pressure-sensitive fingerprint sensor with which the IC card with a fingerprint sensor of FIG. 9 was equipped. 11A is a conceptual diagram showing the configuration of an equivalent circuit of the pressure-sensitive fingerprint sensor of FIG. 10, and FIG. 11B is a plan view showing the arrangement relationship between the column wiring and the row wiring of the pressure-sensitive fingerprint sensor of FIG. . The perspective view which shows the conventional electrostatic capacitance type fingerprint sensor typically. FIG. 13 is a schematic cross-sectional view showing an example in which the fingerprint sensor of FIG. 12 is mounted on an IC card. The perspective view which shows the conventional pressure-sensitive fingerprint sensor typically. The schematic sectional drawing which shows the example which mounted the fingerprint sensor of FIG. 14 in the IC card.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Capacitive fingerprint sensor, 10a, 50a ... Sensor surface, 11, 51 ... Sensor part, 11a ... Main part, 11b ... Flat part, 16 ... For drive IC, 17 ... IC for capacity detection, 12 ... pedestal, 12a, 12b ... inclined surface, 12c, 12d ... curved surface, 12e ... recess, 13 ... collar, 15, 65 ... Sensor elements, 16a, 66a ... Column wiring, 16e, 17e ... Mounting surface, 16i, 17i ... Electrodes, 17a, 67a ... Row wiring, 16b ... Second wiring, 17b, 67b ... first wiring, 18 ... passivation film, 22 ... drive electrode, 23 ... detection electrode, 24 ... interlayer insulating film, 25 ... floating electrode, 29 ... IC card housing, 34 ... contact, 40 ... film body 50 ... Pressure-sensitive fingerprint sensor, 51a ... Main body, 57 ... Detection IC, 57e ... Mounting surface, 65a ... Intersection, 68 ... Insulating film, 69 ... spacers 71, 73 ... reinforcing plate 76 ... projecting portion, 77 ... _fingertip, D _{1, D} 2 ... thickness, d ... thickness

Claims (10)

An IC card in which a fingerprint sensor provided with a sensor unit for detecting unevenness of a fingerprint and an integrated circuit for driving or detecting the sensor unit is incorporated in an IC card housing,
The sensor unit has a trapezoidal main body part whose top surface is a sensor surface and a bowl-shaped flat part provided around the bottom side, and the sensor surface is exposed on the surface of the IC card casing. An IC card with a fingerprint sensor, wherein the integrated circuit is mounted on a mounting surface formed on the flat portion.   The main body of the sensor unit includes a pedestal having a substantially trapezoidal shape in a longitudinal section, a sensor element having a row wiring disposed on the pedestal and a column wiring extending in a direction intersecting the row wiring, and the pedestal A first wiring is formed on an inclined surface of one side surface, and the row wiring and an electrode for mounting the integrated circuit formed on the mounting surface are connected via the first wiring, The second wiring is formed on the inclined surface of the other side surface, and the column wiring and the electrode for mounting the integrated circuit formed on the mounting surface are connected via the second wiring. The IC card with a fingerprint sensor according to claim 1.   A flange is provided around the bottom of the pedestal, and a flexible film body is laminated on the pedestal and the ridge. The film body includes the sensor element and the first and second wirings. The IC card with a fingerprint sensor according to claim 2, wherein the IC card has a fingerprint sensor.   The pedestal has a substantially trapezoidal shape in a longitudinal sectional view, and the pedestal has a curved surface at the boundary between the top surface and the inclined surface of the side surface, and has a curved surface at the boundary between the inclined surface of the pedestal and the flange. The IC card with a fingerprint sensor according to claim 2 or 3.   The IC card with a fingerprint sensor according to any one of claims 2 to 4, wherein a concave portion is formed on a top surface of the pedestal, and the concave portion has a curved surface. An IC card in which a fingerprint sensor provided with a sensor unit for detecting unevenness of a fingerprint and an integrated circuit for driving or detecting the sensor unit is incorporated in an IC card housing,
The sensor portion has a main body portion on which a sensor surface and a mounting surface for mounting the integrated circuit are formed, and the sensor surface and the mounting surface are arranged so as to be opposite to each other. An IC card with a fingerprint sensor, wherein a sensor surface is provided so as to be exposed on a surface of the IC card casing.   The main body includes a substrate, and a sensor element having a row wiring and a column wiring extending in a direction intersecting the row wiring is mounted on one surface of the substrate, and the integrated circuit formed on the row wiring and the mounting surface is mounted. The first wiring for connecting to the electrode for performing the operation and the second wiring for connecting the column wiring to the electrode for mounting the integrated circuit formed on the mounting surface are disposed. The IC card with a fingerprint sensor according to claim 6, wherein a surface of the substrate opposite to the sensor element is the sensor surface.   The sensor element substrate is formed of a single flexible film substrate, the row wiring and the column wiring are formed on the flexible film substrate, and the flexible film substrate is bent to form the row. The IC card with a fingerprint sensor according to claim 7, wherein the wiring and the column wiring intersect each other.   The IC card with a fingerprint sensor according to any one of claims 1 to 8, wherein a convex portion protruding from a surface of the IC card casing is formed around the sensor surface.   The IC card with a fingerprint sensor according to any one of claims 1 to 9, wherein a thickness of the IC card with the fingerprint sensor is 0.68 mm or more and 0.80 mm or less.

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