JP2004296245A - Led lamp - Google Patents

Led lamp Download PDF

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Publication number
JP2004296245A
JP2004296245A JP2003086485A JP2003086485A JP2004296245A JP 2004296245 A JP2004296245 A JP 2004296245A JP 2003086485 A JP2003086485 A JP 2003086485A JP 2003086485 A JP2003086485 A JP 2003086485A JP 2004296245 A JP2004296245 A JP 2004296245A
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JP
Japan
Prior art keywords
support member
heat
led
led lamp
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003086485A
Other languages
Japanese (ja)
Inventor
Ryoji Yokoya
良二 横谷
Masao Yamaguchi
昌男 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2003086485A priority Critical patent/JP2004296245A/en
Publication of JP2004296245A publication Critical patent/JP2004296245A/en
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/777—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lamp that can suppress temperature increase of an LED element. <P>SOLUTION: The LED lamp 100 is constructed of an LED element 1, a support member 2 for supporting a mounting board 7 to mount the LED element 1, and a bulb 8 for housing the mounting board 7. The support member 2 is formed in nearly cylindrical shape by a material of, for example, aluminum, and its base part 2a is connected to a base 3. The base 3 is one used for general electric bulb and a screw groove is formed using a material of iron or the like. A plurality of heat radiating holes 2c for discharging the air entered from the top end part 2b of the support member 2 is provided in the vicinity of the power supply part 4 of the support member 2. The bulb 8 housing the mounting board 7 is made of resin material and formed in nearly spherical shape, and has a pair of holes 8a facing each other at the bulb wall, and the support member 2 penetrates through the pair of holes 8a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、ＬＥＤランプに関するものである。
【０００２】
【従来の技術】
この種の従来例として、特開２００１−２４３８０９号公報に示されるものがある。このものは、一端に口金が設けられ、他端の開口部に向けてラッパ状に拡がるラッパ状金属放熱部と、このラッパ状金属放熱部の開口部に取り付けられた透光性カバーと、前記ラッパ状金属放熱部と前記透光性カバーにより形成された略球体の内部に設けられた金属基板と、この金属基板の前記透光性カバーに対向する外面に実装されたＬＥＤ素子とを備えたものである。この構成により、ＬＥＤ素子に発生した熱は、略球体内での対流などにより放熱されるほか、金属基板から高熱伝導部材を介してラッパ状金属放熱部に流れ、ラッパ状金属放熱部から外部の空気に放熱される。
【０００３】
【特許文献１】
特開２００１−２４３８０９号公報
【０００４】
【発明が解決しようとする課題】
前記従来例によれば、簡単な冷却構造により、ＬＥＤ素子の発熱を抑制して発光効率を高くすることができる。
【０００５】
しかしながら、ＬＥＤ素子を高密度実装する場合などにおいては、ＬＥＤ素子の寿命の確保及び発光効率の向上の点から、さらに放熱効果を高めＬＥＤ素子の温度を抑制することが望ましい。
【０００６】
本発明は、かかる事由に鑑みてなしたものであり、その目的とするところは、ＬＥＤ素子の温度上昇を抑制することのできるＬＥＤランプを提供することである。
【０００７】
【課題を解決するための手段】
請求項１に係る発明は、ＬＥＤ素子と、ＬＥＤ素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるＬＥＤランプにおいて、バルブ壁に対向する一対の孔を設け、一対の孔にＬＥＤ素子の熱を放熱させる放熱機能を有する支持部材を貫通させて設けたことを特徴とする。
【０００８】
請求項２に係る発明は、請求項１記載の発明において、前記ＬＥＤ素子は、支持部材の軸周りに複数実装されるものであることを特徴とする。
【０００９】
請求項３に係る発明は、請求項１又は請求項２記載の発明において、前記支持部材を筒形状にし、支持部材内に空気の流れを発生させることにより、ＬＥＤ素子の熱を放熱させるようにしたことを特徴とする。
【００１０】
請求項４に係る発明は、請求項１又は請求項２記載の発明において、前記支持部材はヒートパイプからなり、ヒートパイプで伝熱させることにより、ＬＥＤ素子の熱を放熱させるようにしたことを特徴とする。
【００１１】
請求項５に係る発明は、請求項３又は請求項４記載の発明において、前記支持部材は、バルブから突出した部分に放熱フィンを有するものであることを特徴とする。
【００１２】
請求項６に係る発明は、請求項１乃至請求項５記載の発明において、周囲に照明用の反射板を備え、前記支持部材と反射板を熱的に接続したことを特徴とする。
【００１３】
請求項７に係る発明は、複数のＬＥＤ素子と、複数のＬＥＤ素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるＬＥＤランプにおいて、ヒートパイプを実装基板に沿わすとともに、ヒートパイプをバルブから突出させることにより、ＬＥＤ素子が発生する熱をヒートパイプを介して伝熱させ、外部に放熱させるようにしたことを特徴とする
【００１４】
【発明の実施の形態】
（第１の実施形態）
第１の実施形態を図１に基づいて説明する。図１（ａ）は、本実施形態のＬＥＤランプ１００の斜視図である。図１（ｂ）は、本実施形態のＬＥＤランプ１００の断面図である。
【００１５】
本実施形態のＬＥＤランプ１００は、ＬＥＤ素子１と、ＬＥＤ素子１が実装される実装基板７を支持する支持部材２と、実装基板７を収納するバルブ８とを有して構成されている。
【００１６】
ＬＥＤ素子１は、チップ型のもので、例えば青色ＬＥＤと蛍光体用いた白色ＬＥＤである。支持部材２は、たとえばアルミ等の材料で略円筒形状に形成されてなるもので、その基端部２ａが、口金３に接続されている。口金３は、一般の電球の口金に用いられるもので、鉄等の材料により、ネジ溝が形成されてなるものである。そして、支持部材２の口金３近傍には、電源部４が設けられている。電源部４は、口金３に印加される商用電源からの交流電圧を、直流電圧に変換してＬＥＤ素子１に印加するもので、支持部材２の外側に向かって広がる傾斜面を有する電源基板ボックス４ａ内に、支持部材２の軸に対して直交するように設置される電源基板４ｂを収納している。
【００１７】
支持部材２の電源部４近傍には、支持部材２の先端部２ｂから流入した空気が流出する複数の放熱孔２ｃが設けられている。そして、放熱孔２ｃの口金３側近傍には、先端部２ｂから支持部材２内に流入した空気が、放熱孔２ｃから、スムーズに流出するように、先端部２ｂに向かって突出した凸部を有するガイド２ｄが設けられている。
【００１８】
支持部材２の放熱孔２ｃと先端部２ｂ間には、熱伝導絶縁シート（図示はしない）及びホルダー６を介してＬＥＤ素子１が複数実装された実装基板７が配設されている。熱伝導絶縁シートは、例えばシリコン系のゴムに、鉄又はセラミック等の高熱伝導率のフィラーを混ぜたものである。なお、熱伝導絶縁シートに変えて、高熱伝導率のグリース又は接着剤を用いてもよい。ホルダー６は、ＬＥＤ素子１が複数実装された実装基板７を保持するもので、高熱伝導率の材料により、支持部材２が貫通する孔を有して、略六角柱形状に形成されるものである。そして、ホルダー６の支持部材２の軸に平行に位置する６つの各長方形面には、略長方形の実装基板７が配設されている。実装基板７は、略長方形であり、複数のＬＥＤ素子１が各実装基板７につき５個、支持部材２の軸に沿って実装されている。また、電源部４から各ＬＥＤ素子１に電力を供給するため、実装基板７と口金３を接続する配線（図示はしない）が、支持部材２内に設けられている。
【００１９】
バルブ８は、実装基板７を収納するもので、透光性の樹脂材料によりで略球形に形成され、バルブ壁に対向する一対の孔８ａを有し、一対の孔８ａには、支持部材２が貫通している。また、支持部材２の先端部２ｂには、支持部材２内への埃等の浸入を防止するため、フィルタ５を設けている。
【００２０】
次に本実施形態のＬＥＤランプ１００の放熱作用について説明する。ＬＥＤランプ１００が、支持部材２の先端部２ｂを垂下させて照明器具のソケット（図示はしない）に装着されることにより、商用電源に電気的に接続されると、電源部４は、商用電源から受けた交流電圧を直流電圧に変換して、各ＬＥＤ素子１に電力を供給し、これにより、各ＬＥＤ素子１は発光する。ここで、ＬＥＤ素子１において光に変換されなかった電力は、熱損失となる。そして、この熱は、実装基板７及びホルダー６を介して支持部材２に流れる。ここで、支持部材２内に存在する空気は、支持部材２に流れた熱により、暖められることにより浮力が生じ、口金３方向に向かう空気の流れが発生する。そしてこの空気の流れは、ガイド２ｄに突き当たり、ガイド２ｄの凸部によって、支持部材２の軸方向に直交するように流れの方向を変える。そして、空気の流れは、放熱孔２ｃを通って、ＬＥＤランプ１００の外部に放出される。また、支持部材２の先端部２ｂには、外部から新たな空気が流入する。この空気の流れにより、支持部材２内部の熱は、放熱孔２ｃから放出される。これにより、ＬＥＤ素子１が発生する熱は、ＬＥＤランプ１００の外部に放出されることになり、ＬＥＤ素子１がバルブ８に覆われていても、ＬＥＤ素子１の温度上昇を抑制することができる。
【００２１】
なお、本実施形態においては、バルブ８に樹脂材料を用いたがガラス等の透光性の材料であればよい。
（第２の実施形態）
第２の実施形態を図２に基づいて説明する。図２（ａ）は、本実施形態のＬＥＤランプ１００の斜視図である。図２（ｂ）は、本実施形態のＬＥＤランプ１００の断面図である。
【００２２】
本実施形態は、支持部材２の表面に放熱フィン１０を設けた点が第１の実施形態と異なり、他は同じである。すなわち、支持部材２に設けた放熱孔２ｃとＬＥＤ素子１が実装されたのホルダー６の間に、アルミ等の金属からなり、支持部材２の表面から放射状に広がる複数枚の羽を有する放熱フィン１０を設けているのである。この羽の形状は略四辺形であり、その面は支持部材２の軸に平行に位置するように配設されている。
【００２３】
この放熱フィン１０を設けることにより、第１の実施形態で述べた熱の流れに加え、ＬＥＤ素子１が発生した熱は、実装基板７及びホルダー６を介して支持部材２に流れ、さらに放熱フィン１０にまで熱が流れる。そして、放熱フィン１０の表面からＬＥＤランプ１００の外部に熱が放熱されるのである。
【００２４】
これにより、第１の実施形態で述べた放熱孔２ｃからの空気の放出による放熱のみの場合よりも、さらに放熱量を増加させることができることにより、ＬＥＤ素子１の温度上昇を抑制することが可能となる。
【００２５】
なお、本実施形態においては、放熱孔２ｃとホルダー６の間に、放熱フィン１０を設けたが、放熱孔２ｃと電源部４との間に放熱フィン１０を設けるようにしてもよい。
（第３の実施形態）
第３の実施形態を図３に基づいて説明する。図３は、本実施形態のＬＥＤランプ１００の断面図である。
【００２６】
本実施形態は、支持部材としてヒートパイプ３０を用いた点が第２の実施形態と異なり、他は同じである。ヒートパイプ３０は、両端を封じたパイプに、冷却液が封入されてなるものである。ここで、ＬＥＤランプ１００は、口金３を下方向を向けて設置されている。
【００２７】
第１の実施形態と同様に、ＬＥＤ素子１が発生した熱は、ホルダー６を介してヒートパイプ３０に流れる。ホルダー６近傍に存在する冷却液は、ＬＥＤ素子１が発生する熱を受けて蒸発し、その蒸気はヒートパイプ３０の先端部３０ｂに移動する。先端部３０ｂは、外部の空気により冷却された状態にあるため、先端部３０ｂに移動した蒸気は、その熱を奪われて凝縮され冷却液に戻り、ホルダー６近傍に移動する。このサイクルを繰り返すことにより、ＬＥＤ素子１が発生する熱は、外部に放熱され、これによりＬＥＤ素子１の温度上昇は抑制される。
（第４の実施形態）
第４の実施形態を図４に基づいて説明する。図４は、本実施形態のＬＥＤランプ１００及びその周囲の断面図である。
【００２８】
本実施形態は、ＬＥＤランプ１００の周囲に照明用の反射板４０を備え、支持部材２と反射板４０をばね状部材４１により熱的に接続したものである。
【００２９】
反射板４０は、アルミ等の材料を用いて、略回転楕円形に形成されるもので、その内表面は、ＬＥＤ素子１から放射される光が反射するように、鏡面加工が施されている。また、反射板４０の中心軸上には、ＬＥＤランプ１００が装着されるソケット９が設けられている。
【００３０】
ばね状部材４１は、支持部材２と反射板４０の間で、口金３方向に湾曲して支持部材２と反射板４０を熱的に接続するものである。また、反射板４０の開口部４０ａ近傍には、熱伝導絶縁シートからなるガイド４２が設けられている。
【００３１】
この構成において、ＬＥＤ素子１が発生した熱は、実装基板７及びホルダー６を介して支持部材２に流れる。支持部材２に流れた熱は、ばね状部材４１及びガイド４２を介して反射板４０に流れ、反射板４０の表面から外部に放熱される。
【００３２】
以上のようにばね状部材４１を介して、ＬＥＤ素子１からの熱が反射板４０に伝導して、反射板４０で放出されるため、ＬＥＤ素子１の温度上昇を抑制することができるのである。
（第５の実施形態）
第５の実施形態を図５に基づいて説明する。図５（ａ）は、本実施形態の全体斜視図、図５（ｂ）は、本実施形態の断面図である。
【００３３】
本実施形態のＬＥＤランプ１００は、複数のＬＥＤ素子１と、複数のＬＥＤ素子１が実装される実装基板７と、実装基板７を収納するバルブ８と、を有し、ＬＥＤランプ１００を支持するガイド５１及びベース５２を備えるものである。
【００３４】
具体的には、略長方形の実装基板７に複数のＬＥＤ素子１が実装され、実装基板７と略同一サイズのホルダー６に密着して設置されている。ホルダー６は、熱伝導率の大きい金属、例えばアルミ、銅等の金属からなるものである。また、ホルダー６を実装基板７とで挟むように、ヒートパイプ３０が設けられている。更に、ＬＥＤ素子１の前面には、レンズ５３が装着されており、ＬＥＤ素子１及びホルダー６の周囲には、レンズ５３を一部に含んだバルブ８により、密閉構造を形成している。また、ヒートパイプ３０は、バルブ８から突出しており、ヒートパイプ３０のバルブ８から突出した部分の表面には、放熱フィン１０が設けられている。さらに放熱フィン１０の周囲には放熱孔５６が複数設けられている。放熱フィン１０の端部は、ＬＥＤランプ１００を支持する樹脂からなる中空のガイド５１に結合され、ＬＥＤランプ１００及びガイド５１を保持するベース５２が、ガイド５１に接続されている。
【００３５】
以上の構成において、ＬＥＤ素子１が発生した熱は、ホルダー６を介してヒートパイプ３０に流れる。ホルダー６近傍に存在する冷却液は、ＬＥＤ素子１が発生する熱を受けて蒸発し、その蒸気はヒートパイプ３０の先端部３０ｂに移動する。先端部３０ｂは、外部の空気により冷却された状態にあるため、先端部３０ｂに移動した蒸気は、その熱を奪われて凝縮され冷却液に戻り、ホルダー６近傍に移動する。このサイクルを繰り返すことにより、ＬＥＤ素子１が発生する熱は、外部に放熱されるのである。
（第６の実施形態）
第６の実施形態を図６に基づいて説明する。図６（ａ）は、本実施形態のＬＥＤランプの斜視図、図６（ｂ）は、本実施形態の断面図である。
【００３６】
本実施形態は、ＬＥＤランプ１００とガイド５１とを接続するコネクタ５４を設け、放熱フィン１０を、ガイド５１の内部に設けたものである。さらに、コネクタ５４の端部には、ＬＥＤランプ１００を回転させる回転機構５５が設けられている。
【００３７】
なお、放熱作用については、第５の実施形態と同じであるが、ガイド５１内部に放熱フィン１０を内在させたことにより、ＬＥＤランプ１００がコンパクトになるという効果がある。
【００３８】
なお、本実施形態においては、放熱フィン１０を、ガイド５１の内部に設けたが、図７に示すように、ガイド５１内部に放熱フィン１０を設け、さらにガイド５１の両端部に放熱孔５６を設けてもよい。この場合には、放熱フィン１０が発生する熱により、放熱フィン１０近傍の空気に浮力が生じ、この空気が放熱孔５６から外部に流出することにより、放熱効果を高めることが可能となる。
【００３９】
【発明の効果】
請求項１に係る発明は、ＬＥＤ素子と、ＬＥＤ素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるＬＥＤランプにおいて、バルブ壁に対向する一対の孔を設け、一対の孔にＬＥＤ素子の熱を放熱させる放熱機能を有する支持部材を貫通させて設けるようにしたので、熱が支持部材を介して流れて放熱されることにより、ＬＥＤ素子の温度を抑制することができる。
【００４０】
請求項２に係る発明は、請求項１記載の発明において、前記ＬＥＤ素子は、支持部材の軸周りに複数実装されるものであることを特徴とする。
【００４１】
請求項３に係る発明は、請求項１又は請求項２記載の発明において、前記支持部材を筒形状にし、支持部材内に空気の流れを発生させることにより、ＬＥＤ素子の熱を放熱させるようにしたので、ＬＥＤ素子が、発生する熱により空気の流れが発生し、支持部材の一端部から空気が流入し、他端部から空気が流出することにより、ＬＥＤ素子の温度を抑制することができる。
【００４２】
請求項４に係る発明は、請求項１又は請求項２記載の発明において、前記支持部材はヒートパイプからなり、ヒートパイプで伝熱させることにより、ＬＥＤ素子の熱を放熱させるようにしたので、ヒートパイプ内の冷却液が、ヒートパイプ端部で冷却されることにより、ＬＥＤ素子の温度を抑制することができる。
【００４３】
請求項５に係る発明は、請求項３又は請求項４記載の発明において、前記支持部材は、バルブから突出した部分に放熱フィンを有するものであるようにしたので、放熱フィンからの放熱量が増加するため、請求項１に比して、更に冷却効果を高めることができる。
【００４４】
請求項６に係る発明は、請求項１乃至請求項５記載の発明において、周囲に照明用の反射板を備え、前記支持部材と反射板を熱的に接続したので、接続部材を介して、ＬＥＤ素子からの熱が反射板に伝導して、反射板で放出されるため、一層冷却効果を高めることができる。
【００４５】
請求項７に係る発明は、複数のＬＥＤ素子と、複数のＬＥＤ素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるＬＥＤランプにおいて、ヒートパイプを実装基板に沿わすとともに、ヒートパイプをバルブから突出させることにより、ＬＥＤ素子が発生する熱をヒートパイプを介して伝熱させ、外部に放熱させるようにしたので、ＬＥＤランプをコンパクトにすることができる。
【図面の簡単な説明】
【図１】（ａ）は、第１の実施形態のＬＥＤランプ１００の斜視図、（ｂ）は、同ＬＥＤランプ１００の断面図である。
【図２】（ａ）は、第２の実施形態のＬＥＤランプ１００の斜視図、（ｂ）は、同ＬＥＤランプ１００の断面図である。
【図３】第３の実施形態のＬＥＤランプ１００の断面図である。
【図４】第４の実施形態のＬＥＤランプ１００及びその周囲の断面図である。
【図５】（ａ）は、第５の実施形態の斜視図、（ｂ）は、同断面図である。
【図６】（ａ）は、第６の実施形態の斜視図、（ｂ）は、同断面図である。
【図７】（ａ）は、第６の実施形態の別例の斜視図、（ｂ）は、同別例の断面図である。
【符号の説明】
１ ＬＥＤ素子
２ 支持部材
２ａ 基端部
２ｂ 先端部
２ｃ 放熱孔
２ｄ ガイド
３ 口金
４ 電源部
６ ホルダー
７ 実装基板
８ バルブ
８ａ 孔[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an LED lamp.
[0002]
[Prior art]
A conventional example of this type is disclosed in Japanese Patent Application Laid-Open No. 2001-243809. This is provided with a base at one end, a trumpet-shaped metal heat radiating portion extending in a trumpet shape toward an opening at the other end, a light-transmitting cover attached to the opening of the trumpet-shaped metal heat radiating portion, A metal substrate provided inside a substantially spherical body formed by the trumpet-shaped metal heat radiating portion and the translucent cover; and an LED element mounted on an outer surface of the metal substrate facing the translucent cover. Things. With this configuration, the heat generated in the LED element is radiated by convection or the like in the substantially spherical body, flows from the metal substrate to the flared metal radiating portion via the high thermal conductive member, and is externally radiated from the flared metal radiating portion. Dissipated by air.
[0003]
[Patent Document 1]
JP 2001-243809 A
[Problems to be solved by the invention]
According to the above conventional example, with a simple cooling structure, it is possible to suppress the heat generation of the LED element and increase the luminous efficiency.
[0005]
However, when the LED elements are mounted at a high density, it is desirable to further increase the heat radiation effect and suppress the temperature of the LED elements from the viewpoint of securing the life of the LED elements and improving the luminous efficiency.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an LED lamp that can suppress a temperature rise of an LED element.
[0007]
[Means for Solving the Problems]
The invention according to claim 1 is an LED lamp including an LED element, a support member that supports a mounting board on which the LED element is mounted, and a bulb that houses the mounting board, wherein a pair of holes facing the bulb wall is formed. And a support member having a heat radiating function for radiating heat of the LED element penetrates the pair of holes.
[0008]
According to a second aspect of the present invention, in the first aspect, a plurality of the LED elements are mounted around an axis of a support member.
[0009]
According to a third aspect of the present invention, in the first or the second aspect of the present invention, the support member is formed in a cylindrical shape, and a flow of air is generated in the support member so that heat of the LED element is radiated. It is characterized by having done.
[0010]
According to a fourth aspect of the present invention, in the first or second aspect of the invention, the support member is formed of a heat pipe, and the heat of the LED element is radiated by conducting heat through the heat pipe. Features.
[0011]
The invention according to claim 5 is the invention according to claim 3 or 4, wherein the support member has a radiation fin in a portion protruding from the valve.
[0012]
According to a sixth aspect of the present invention, in the first to fifth aspects of the present invention, a reflector for illumination is provided around the periphery, and the support member and the reflector are thermally connected.
[0013]
The invention according to claim 7 is an LED lamp including a plurality of LED elements, a support member that supports a mounting board on which the plurality of LED elements are mounted, and a bulb that stores the mounting board, wherein the heat pipe is mounted on the mounting board. The heat generated by the LED element is transmitted through the heat pipe and radiated to the outside by projecting the heat pipe from the bulb.
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
A first embodiment will be described with reference to FIG. FIG. 1A is a perspective view of the LED lamp 100 of the present embodiment. FIG. 1B is a cross-sectional view of the LED lamp 100 of the present embodiment.
[0015]
The LED lamp 100 according to the present embodiment includes an LED element 1, a support member 2 that supports a mounting substrate 7 on which the LED element 1 is mounted, and a bulb 8 that houses the mounting substrate 7.
[0016]
The LED element 1 is of a chip type, for example, a white LED using a blue LED and a phosphor. The support member 2 is made of a material such as aluminum and has a substantially cylindrical shape, and has a base end 2 a connected to the base 3. The base 3 is used for a base of a general electric bulb, and has a thread groove formed of a material such as iron. A power supply unit 4 is provided near the base 3 of the support member 2. The power supply unit 4 converts an AC voltage from a commercial power supply applied to the base 3 into a DC voltage and applies the DC voltage to the LED element 1. The power supply board box has an inclined surface extending outward from the support member 2. A power supply board 4b installed to be orthogonal to the axis of the support member 2 is housed in 4a.
[0017]
In the vicinity of the power supply unit 4 of the support member 2, a plurality of heat radiation holes 2c through which the air flowing in from the tip 2b of the support member 2 flows out are provided. A protrusion protruding toward the distal end portion 2b is provided near the base 3 of the heat radiation hole 2c so that the air flowing into the support member 2 from the distal end portion 2b flows out smoothly from the heat radiation hole 2c. Guide 2d is provided.
[0018]
A mounting board 7 on which a plurality of LED elements 1 are mounted is disposed between the heat radiation hole 2 c and the tip 2 b of the support member 2 via a heat conductive insulating sheet (not shown) and a holder 6. The heat conductive insulating sheet is, for example, a mixture of a silicon-based rubber and a filler having a high thermal conductivity such as iron or ceramic. Note that grease or an adhesive having a high thermal conductivity may be used instead of the heat conductive insulating sheet. The holder 6 holds a mounting substrate 7 on which a plurality of LED elements 1 are mounted, and is formed of a material having high thermal conductivity, having a hole through which the support member 2 penetrates, and formed in a substantially hexagonal prism shape. is there. A substantially rectangular mounting board 7 is disposed on each of the six rectangular surfaces located parallel to the axis of the support member 2 of the holder 6. The mounting substrate 7 has a substantially rectangular shape, and a plurality of LED elements 1 are mounted on the mounting member 7 along the axis of the supporting member 2 for each mounting substrate 7. In order to supply power from the power supply unit 4 to each LED element 1, a wiring (not shown) for connecting the mounting board 7 and the base 3 is provided in the support member 2.
[0019]
The bulb 8 accommodates the mounting substrate 7 and is formed in a substantially spherical shape by a translucent resin material, has a pair of holes 8a facing the valve wall, and has a pair of holes 8a in the pair of holes 8a. Is penetrating. Further, a filter 5 is provided at the tip 2 b of the support member 2 in order to prevent intrusion of dust and the like into the support member 2.
[0020]
Next, the heat radiation effect of the LED lamp 100 of the present embodiment will be described. When the LED lamp 100 is attached to a socket (not shown) of the lighting fixture with the tip 2b of the support member 2 hanging down, and is electrically connected to a commercial power supply, the power supply unit 4 Is converted into a DC voltage to supply power to each LED element 1, whereby each LED element 1 emits light. Here, the power not converted into light in the LED element 1 becomes a heat loss. Then, this heat flows to the support member 2 via the mounting board 7 and the holder 6. Here, the air present in the support member 2 is heated by the heat flowing through the support member 2 to generate buoyancy by being heated, thereby generating a flow of air toward the base 3. Then, the flow of the air hits the guide 2d, and the direction of the flow is changed by the convex portion of the guide 2d so as to be orthogonal to the axial direction of the support member 2. Then, the flow of air is emitted to the outside of the LED lamp 100 through the heat radiation holes 2c. Further, new air flows into the distal end portion 2b of the support member 2 from outside. Due to this flow of air, the heat inside the support member 2 is released from the heat radiation holes 2c. As a result, the heat generated by the LED element 1 is released to the outside of the LED lamp 100, and even if the LED element 1 is covered by the bulb 8, the temperature rise of the LED element 1 can be suppressed. .
[0021]
In the present embodiment, a resin material is used for the bulb 8, but a light-transmitting material such as glass may be used.
(Second embodiment)
A second embodiment will be described with reference to FIG. FIG. 2A is a perspective view of the LED lamp 100 of the present embodiment. FIG. 2B is a cross-sectional view of the LED lamp 100 of the present embodiment.
[0022]
The present embodiment is different from the first embodiment in that a radiation fin 10 is provided on the surface of the support member 2, and the other is the same. That is, a radiating fin made of metal such as aluminum and having a plurality of wings radiating from the surface of the supporting member 2 between the radiating hole 2c provided in the supporting member 2 and the holder 6 on which the LED element 1 is mounted. 10 is provided. The shape of the wing is substantially a quadrilateral, and its surface is disposed so as to be positioned parallel to the axis of the support member 2.
[0023]
By providing the heat radiation fins 10, in addition to the heat flow described in the first embodiment, the heat generated by the LED element 1 flows to the support member 2 via the mounting board 7 and the holder 6, and furthermore, the heat radiation fins Heat flows up to 10. Then, heat is radiated from the surface of the radiation fin 10 to the outside of the LED lamp 100.
[0024]
This makes it possible to further increase the amount of heat radiation compared to the case of only heat radiation due to the release of air from the heat radiation holes 2c described in the first embodiment, thereby suppressing a temperature rise of the LED element 1. It becomes.
[0025]
In the present embodiment, the heat radiation fins 10 are provided between the heat radiation holes 2c and the holder 6, but the heat radiation fins 10 may be provided between the heat radiation holes 2c and the power supply unit 4.
(Third embodiment)
A third embodiment will be described with reference to FIG. FIG. 3 is a sectional view of the LED lamp 100 of the present embodiment.
[0026]
This embodiment is different from the second embodiment in that a heat pipe 30 is used as a support member, and the other is the same. The heat pipe 30 is formed by sealing a cooling liquid in a pipe whose both ends are sealed. Here, the LED lamp 100 is installed with the base 3 facing downward.
[0027]
As in the first embodiment, the heat generated by the LED element 1 flows to the heat pipe 30 via the holder 6. The cooling liquid present in the vicinity of the holder 6 receives the heat generated by the LED element 1 and evaporates, and the vapor moves to the tip 30 b of the heat pipe 30. Since the distal end portion 30b is in a state of being cooled by external air, the steam that has moved to the distal end portion 30b is deprived of its heat, condensed, returned to the coolant, and moves to the vicinity of the holder 6. By repeating this cycle, the heat generated by the LED element 1 is radiated to the outside, whereby the temperature rise of the LED element 1 is suppressed.
(Fourth embodiment)
A fourth embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view of the LED lamp 100 of the present embodiment and the periphery thereof.
[0028]
In this embodiment, a reflector 40 for illumination is provided around the LED lamp 100, and the support member 2 and the reflector 40 are thermally connected by a spring-like member 41.
[0029]
The reflection plate 40 is formed in a substantially spheroidal shape using a material such as aluminum, and its inner surface is mirror-finished so that light emitted from the LED element 1 is reflected. . The socket 9 on which the LED lamp 100 is mounted is provided on the central axis of the reflection plate 40.
[0030]
The spring-like member 41 curves between the support member 2 and the reflector 40 in the direction of the base 3 to thermally connect the support member 2 and the reflector 40. Further, a guide 42 made of a heat conductive insulating sheet is provided near the opening 40 a of the reflection plate 40.
[0031]
In this configuration, the heat generated by the LED element 1 flows to the support member 2 via the mounting board 7 and the holder 6. The heat flowing to the support member 2 flows to the reflector 40 via the spring-like member 41 and the guide 42, and is radiated to the outside from the surface of the reflector 40.
[0032]
As described above, the heat from the LED element 1 is transmitted to the reflection plate 40 via the spring-like member 41 and is released from the reflection plate 40, so that the temperature rise of the LED element 1 can be suppressed. .
(Fifth embodiment)
A fifth embodiment will be described with reference to FIG. FIG. 5A is an overall perspective view of the present embodiment, and FIG. 5B is a cross-sectional view of the present embodiment.
[0033]
The LED lamp 100 of the present embodiment includes a plurality of LED elements 1, a mounting board 7 on which the plurality of LED elements 1 are mounted, and a bulb 8 that stores the mounting board 7, and supports the LED lamp 100. A guide 51 and a base 52 are provided.
[0034]
Specifically, a plurality of LED elements 1 are mounted on a substantially rectangular mounting substrate 7, and are mounted in close contact with a holder 6 having substantially the same size as the mounting substrate 7. The holder 6 is made of a metal having a high thermal conductivity, for example, a metal such as aluminum and copper. A heat pipe 30 is provided so as to sandwich the holder 6 with the mounting board 7. Further, a lens 53 is mounted on the front surface of the LED element 1, and a hermetically sealed structure is formed around the LED element 1 and the holder 6 by a bulb 8 partially including the lens 53. Further, the heat pipe 30 protrudes from the valve 8, and a radiation fin 10 is provided on a surface of a portion of the heat pipe 30 protruding from the valve 8. Further, a plurality of heat radiation holes 56 are provided around the heat radiation fins 10. An end of the radiation fin 10 is coupled to a hollow guide 51 made of a resin that supports the LED lamp 100, and a base 52 that holds the LED lamp 100 and the guide 51 is connected to the guide 51.
[0035]
In the above configuration, the heat generated by the LED element 1 flows to the heat pipe 30 via the holder 6. The cooling liquid present in the vicinity of the holder 6 receives the heat generated by the LED element 1 and evaporates, and the vapor moves to the tip 30 b of the heat pipe 30. Since the distal end portion 30b is in a state of being cooled by external air, the steam that has moved to the distal end portion 30b is deprived of its heat, condensed, returned to the coolant, and moves to the vicinity of the holder 6. By repeating this cycle, the heat generated by the LED element 1 is radiated to the outside.
(Sixth embodiment)
A sixth embodiment will be described with reference to FIG. FIG. 6A is a perspective view of the LED lamp of the present embodiment, and FIG. 6B is a cross-sectional view of the present embodiment.
[0036]
In this embodiment, a connector 54 for connecting the LED lamp 100 and the guide 51 is provided, and the radiation fins 10 are provided inside the guide 51. Further, a rotating mechanism 55 for rotating the LED lamp 100 is provided at an end of the connector 54.
[0037]
Note that the heat radiation action is the same as that of the fifth embodiment, but the effect that the LED lamp 100 is made compact by disposing the heat radiation fins 10 inside the guide 51 is provided.
[0038]
In the present embodiment, the heat radiation fins 10 are provided inside the guide 51. However, as shown in FIG. 7, the heat radiation fins 10 are provided inside the guide 51, and the heat radiation holes 56 are provided at both ends of the guide 51. It may be provided. In this case, the heat generated by the radiation fins 10 generates buoyancy in the air near the radiation fins 10, and the air flows out of the radiation holes 56 to the outside, so that the heat radiation effect can be enhanced.
[0039]
【The invention's effect】
The invention according to claim 1 is an LED lamp including an LED element, a support member that supports a mounting board on which the LED element is mounted, and a bulb that houses the mounting board, wherein a pair of holes facing the bulb wall is formed. Since the support member having a heat dissipation function for dissipating heat of the LED element is provided so as to penetrate through the pair of holes, the heat flows through the support member and is dissipated, thereby suppressing the temperature of the LED element. can do.
[0040]
According to a second aspect of the present invention, in the first aspect, a plurality of the LED elements are mounted around an axis of a support member.
[0041]
According to a third aspect of the present invention, in the first or the second aspect of the present invention, the support member is formed in a cylindrical shape, and a flow of air is generated in the support member so that heat of the LED element is radiated. As a result, the LED elements generate air flow due to the generated heat, air flows in from one end of the support member, and air flows out from the other end, whereby the temperature of the LED elements can be suppressed. .
[0042]
According to a fourth aspect of the present invention, in the first or second aspect of the present invention, the support member is formed of a heat pipe, and the heat of the LED element is radiated by conducting heat through the heat pipe. By cooling the cooling liquid in the heat pipe at the end of the heat pipe, the temperature of the LED element can be suppressed.
[0043]
According to a fifth aspect of the present invention, in the third or fourth aspect, the support member has a radiating fin at a portion protruding from the valve. As a result, the cooling effect can be further enhanced as compared with the first aspect.
[0044]
According to a sixth aspect of the present invention, in the first to fifth aspects of the present invention, an illumination reflector is provided around the periphery, and the support member and the reflector are thermally connected. Since the heat from the LED element is transmitted to the reflection plate and emitted from the reflection plate, the cooling effect can be further enhanced.
[0045]
The invention according to claim 7 is an LED lamp including a plurality of LED elements, a support member that supports a mounting board on which the plurality of LED elements are mounted, and a bulb that stores the mounting board, wherein the heat pipe is mounted on the mounting board. In addition, the heat generated by the LED element is transmitted through the heat pipe by projecting the heat pipe from the bulb, and is radiated to the outside, so that the LED lamp can be made compact.
[Brief description of the drawings]
FIG. 1A is a perspective view of an LED lamp 100 according to a first embodiment, and FIG. 1B is a cross-sectional view of the LED lamp 100.
FIG. 2A is a perspective view of an LED lamp 100 according to a second embodiment, and FIG. 2B is a cross-sectional view of the LED lamp 100.
FIG. 3 is a sectional view of an LED lamp 100 according to a third embodiment.
FIG. 4 is a sectional view of an LED lamp 100 according to a fourth embodiment and the periphery thereof.
FIG. 5A is a perspective view of a fifth embodiment, and FIG. 5B is a sectional view of the same.
FIG. 6A is a perspective view of a sixth embodiment, and FIG. 6B is a sectional view of the same.
FIG. 7A is a perspective view of another example of the sixth embodiment, and FIG. 7B is a cross-sectional view of the other example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 LED element 2 Support member 2a Base end 2b Tip 2c Heat radiating hole 2d Guide 3 Base 4 Power supply unit 6 Holder 7 Mounting board 8 Valve 8a Hole

Claims (7)

ＬＥＤ素子と、ＬＥＤ素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるＬＥＤランプにおいて、バルブ壁に対向する一対の孔を設け、一対の孔にＬＥＤ素子の熱を放熱させる放熱機能を有する支持部材を貫通させて設けたことを特徴とするＬＥＤランプ。In an LED lamp including an LED element, a support member that supports a mounting substrate on which the LED element is mounted, and a bulb that houses the mounting substrate, a pair of holes facing the bulb wall is provided, and the pair of holes has an LED element. An LED lamp characterized in that a supporting member having a heat radiation function for dissipating the heat is penetrated and provided. 前記ＬＥＤ素子は、支持部材の軸周りに複数実装されるものであることを特徴とする請求項１記載のＬＥＤランプ。The LED lamp according to claim 1, wherein a plurality of the LED elements are mounted around an axis of a support member. 前記支持部材を筒形状にし、支持部材内に空気の流れを発生させることにより、ＬＥＤ素子の熱を放熱させるようにしたことを特徴とする請求項１又は請求項２記載のＬＥＤランプ。3. The LED lamp according to claim 1, wherein the support member has a cylindrical shape, and the heat of the LED element is radiated by generating a flow of air in the support member. 前記支持部材はヒートパイプからなり、ヒートパイプで伝熱させることにより、ＬＥＤ素子の熱を放熱させるようにしたことを特徴とする請求項１又は請求項２記載のＬＥＤランプ。The LED lamp according to claim 1, wherein the support member is formed of a heat pipe, and the heat of the LED element is radiated by transferring the heat through the heat pipe. 前記支持部材は、バルブから突出した部分に放熱フィンを有するものであることを特徴とする請求項３又は請求項４記載のＬＥＤランプ。5. The LED lamp according to claim 3, wherein the support member has a radiation fin at a portion protruding from the bulb. 周囲に照明用の反射板を備え、前記支持部材と反射板を熱的に接続したことを特徴とする請求項１乃至請求項５記載のＬＥＤランプ。6. The LED lamp according to claim 1, further comprising a reflector for illumination around the periphery, wherein the support member and the reflector are thermally connected. 複数のＬＥＤ素子と、複数のＬＥＤ素子が実装される実装基板を支持する支持部材と、実装基板を収納するバルブと、を備えるＬＥＤランプにおいて、ヒートパイプを実装基板に沿わすとともに、ヒートパイプをバルブから突出させることにより、ＬＥＤ素子が発生する熱をヒートパイプを介して伝熱させ、外部に放熱させるようにしたことを特徴とするＬＥＤランプ。In an LED lamp including a plurality of LED elements, a support member that supports a mounting board on which the plurality of LED elements are mounted, and a bulb that stores the mounting board, a heat pipe is provided along the mounting board, An LED lamp characterized in that by projecting from a bulb, heat generated by an LED element is transmitted through a heat pipe and radiated to the outside.
JP2003086485A 2003-03-26 2003-03-26 Led lamp Pending JP2004296245A (en)

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