JP2002353296A - Equipment for peeling wafer protective tape and wafer mounting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide equipment for peeling a wafer protective tape and wafer mounting equipment that cause no wreck or damage because of floating or wrap at the time of peeling process or mounting process, in addition, it is possible to apply without changing sucking tables according to the sizes of wafers such as eight inch and twelve inch wafers, while the devices have simple structure and is compact, and excellent in versatility. SOLUTION: When the smallest size of the wafer transcription F is under peeling process, a supporting ring table 20 goes down and performs peeling process by mounting and sucking the wafer part W of the smallest size of the wafer transcription F on a center suction table 20. When the wafer transcription F larger than the smallest size thereof is under peeling process, the supporting ring table 50 goes up and performs peeling process by mounting and sucking the wafer part W of the wafer transcription F, and also it is formed to support an outer round of the wafer W of the wafer transcription F with the supporting ring table 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for manufacturing a small electronic component such as a semiconductor chip, the method comprising: transferring a wafer to which a protective tape has been applied onto a ring frame and a dicing tape; Wafer protective tape peeling device, for peeling protective tape,
Further, the present invention relates to a wafer mounting apparatus for performing a wafer mounting process of attaching a wafer to a ring frame via a dicing tape and integrating the wafer.

[0002]

2. Description of the Related Art In recent years, semiconductor wafers such as silicon have been increased in size from conventional 6 inches to 8 inches and 12 inches, and semiconductor chips such as IC cards have become increasingly thinner. 300μm
There is an increasing demand for thin semiconductor chips from about 400 μm to about 200 μm to 50 μm.

[0003] Therefore, in order to prevent chips from being damaged or damaged during wafer processing, Japanese Patent Application Laid-Open No. 5-33541 has been proposed.
As disclosed in, for example, Japanese Unexamined Patent Application Publication No. 1-2005, a method called “first dicing” has been proposed. In this method, dicing is performed to a predetermined depth in the thickness direction of the wafer from the surface on which the circuit of the wafer is formed, a groove having a bottom is formed in a dice shape, a protective tape is attached to the wafer surface, and then the back surface of the wafer is formed. Grind to the bottomed groove and divide it into many chips. Then, after the wafer on which the protective tape is adhered is attached to the ring frame, the protective tape is peeled off, and then the next steps such as washing, drying, and die bonding are performed.

[0004]

However, when the protective tape is peeled off as described above, the wafer may be damaged if the peeling device is mechanically peeled off with a peeling device such as a claw member, or the wafer may float when peeling. And adjacent chips may come into contact with each other and break. For this reason,
In Japanese Patent No. 2877997, the adhesive tape attached to the lower surface of the ring-shaped frame is placed on a suction table having a wide area extending to the whole, and mounted on the ring-shaped frame via the adhesive tape. In a state where the separated semiconductor wafer is held by suction on a suction table, a release tape is attached to a protective adhesive tape attached to the surface of the semiconductor wafer, and the protective adhesive tape is peeled off via the release tape.

However, recently, semiconductor wafers made of silicon or the like have been reduced from the conventional 6 inches to 8 inches and 1 inch.
The size has been increased to 2 inches, and the thickness of semiconductor chips such as IC cards has become increasingly thinner. The demand for thinner semiconductor chips from the conventional 300 μm to 400 μm to 200 μm to 50 μm has been increasing. Is the current situation. However, in the case of using a suction table having such a wide area as to extend over the entire adhesive tape, such different sizes, for example, 6 inches,
It is impossible to apply to wafers of 8 inches and 12 inches or all of these sizes, and it is necessary to replace the suction table itself with one according to the size of the wafer to be handled. Is complicated, time-consuming, and costly. In addition, since there is a device for feeding the peeling tape and attaching the tape to the protective tape on the suction table, the replacement of the suction table is more and more complicated.

[0006] Further, in the suction table having such a wide range extending to the whole of the adhesive tape, the suction table becomes large, so that a complicated structure is required and a lot of materials must be used. In addition, the size of the apparatus is increased. Further, conventionally, in a wafer mounting apparatus for performing a wafer mounting process for attaching a wafer to a ring frame via a dicing tape to integrate the wafer, such a suction table is used. It cannot be applied to a wafer, requires replacement work, and has a similar problem such as an increase in the size of the apparatus.

In view of the above situation, the present invention does not damage or damage the wafer due to the lifting or curling of the wafer at the time of peeling, and has a different size, for example, 8 inches. An object of the present invention is to provide a compact and versatile protective tape peeling device for a 12-inch wafer, which can be applied to a 12-inch wafer without replacing the suction table as in the related art. And

In addition, the present invention does not damage or damage the wafer when the wafer is mounted on the wafer by floating or rolling, and has a different size, for example, 8 mm.
It is intended to provide a simple and compact versatile wafer mounting apparatus that can be applied to inch and 12 inch wafers without replacing the suction table as in the conventional case. And

[0009]

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned problems and objects in the prior art. A protective tape is peeled off from a wafer transfer body in which a wafer to which a tape is adhered is attached to a ring frame via a dicing tape, and the wafer transfer body is integrated using wafers of different sizes. A protective tape peeling device for a wafer for performing a peeling process, wherein the minimum size of the wafer transfer body of the minimum size among the wafer transfer bodies integrated using wafers having different sizes is used. A central suction table on which the wafer portion of the wafer transfer body is placed and sucked, and a wafer transfer body having a size larger than the minimum size wafer transfer body. At least one ring-shaped vertically movable support ring table concentrically arranged on the outer periphery of the central suction table for separation processing, the wafer having a size larger than the minimum size wafer transfer body. A support ring table that supports a wafer portion of the transfer body, and when the minimum size wafer transfer body is subjected to the peeling process, the support ring table descends, and the minimum size wafer transfer body When the wafer portion is placed and sucked to perform the peeling process, and when the wafer transfer body having a size larger than the minimum size wafer transfer body is to be peeled, the support ring table is raised,
It is characterized in that the wafer portion of the larger size wafer transfer body is placed and sucked on the central suction table, and the outer periphery of the wafer portion of the wafer transfer body is supported by the support ring table.

With this configuration, when a wafer transfer member having a minimum size, for example, an 8-inch wafer transfer member is peeled off, the support ring table is lowered, and the wafer having the minimum size is placed on the central suction table. The peeling process can be performed by mounting and adsorbing the wafer portion of the transfer body. When a wafer transfer body having a size larger than the smallest wafer transfer body, for example, a 12-inch wafer transfer body, is peeled off, the support ring table is raised and the wafer transfer body is moved by the central suction table. In addition to mounting and adsorbing the wafer portion, the peeling process can be performed by supporting the outer periphery of the wafer portion of the wafer transfer body by the support ring table.

Therefore, the wafer can be suction-supported by selecting the center suction table and the support ring table for the wafer transfer bodies of different sizes as described above, so that the wafer can be lifted or turned during peeling. As a result, there is no possibility of breakage or damage due to contact of the wafer. Moreover, different sizes, such as 6 inches, 8 inches and 1
It can be applied to a wafer of 2 inches or all of these sizes without replacing the suction table as in the conventional case, and has a simple structure, compactness and excellent versatility.

Further, the wafer mounting apparatus of the present invention comprises:
A wafer mounting apparatus for performing a wafer mounting process of attaching a wafer to a ring frame via a dicing tape and performing a wafer mounting process. A central suction table on which a wafer portion of a size wafer and a ring frame are placed and sucked, and a wafer of a size larger than the minimum size wafer are concentrically formed on an outer periphery of the center suction table for wafer mounting processing. At least one annularly movable support ring table arranged, the support ring table comprising a wafer portion of a wafer having a size larger than the minimum size wafer and a support ring table for supporting a ring frame, When mounting a wafer of size, the support ring The table is lowered, the wafer portion of the minimum size wafer and the ring frame are placed on the central suction table, and the wafer is mounted by suction and the wafer mounting process is performed on a wafer larger in size than the minimum size wafer. In this case, the support ring table is lifted, the wafer portion of the larger size wafer and the ring frame are placed and sucked on the central suction table, and the outer periphery of the wafer portion of the wafer and the ring frame are held by the support ring table. Is configured to be supported.

With this configuration, when mounting a wafer of the minimum size, for example, an 8-inch wafer, the support ring table is lowered and the wafer portion of the minimum size wafer is placed on the central suction table. The mounting process can be performed by placing and adsorbing the ring frame. When a wafer having a size larger than the smallest wafer, for example, a 12-inch wafer is peeled off, the support ring table is raised, and the wafer portion of the wafer and the ring frame are mounted by the central suction table. At the same time, the mounting process can be performed while supporting the outer periphery of the wafer portion of the wafer with the support ring table.

Therefore, by selecting the central suction table and the support ring table for the wafers having different sizes, the wafer can be suction-supported.
The wafer is not broken or damaged by floating or rolling during mounting. Moreover, it can be applied to wafers of different sizes, for example, 6 inches, 8 inches and 12 inches, or all of these sizes, without changing the suction table as in the prior art, and is simple. The structure is compact and excellent in versatility.

Further, in the present invention, a positioning receiving pin for positioning the ring frames of different sizes is provided, and the positioning receiving pins are arranged so that the positioning receiving pins can abut against the ring frames of different sizes. It is configured to be movable in the direction. With such a configuration, when mounting processing is performed on wafers of different sizes, the positioning receiving pins are provided with notches for positioning in the notches for positioning of the ring frame having a size corresponding to the wafers of different sizes. Since it moves in the direction and makes contact, the positioning of the ring frame with respect to wafers of different sizes can be performed accurately.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment (embodiment) of a wafer protective tape peeling apparatus and a wafer mounting apparatus according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a front view of the entire apparatus of the first embodiment of the wafer protective tape peeling apparatus of the present invention, FIG. 2 is a front sectional view of a protective tape peeling table section of the wafer protective tape peeling apparatus of FIG. FIG. 3 is a top plan view of FIG. 2, and FIG. 4 is a cross-sectional view showing a state where a protective tape of a wafer transfer body used in the present invention is peeled off.

In FIG. 1, reference numeral 10 denotes a protective tape peeling device for a wafer (hereinafter, simply referred to as a "protective tape peeling device"). The protective tape peeling device 10 is shown in FIG.
As shown in FIG. 7, the protective tape P is adhered to the surface of the wafer W divided into a number of chips by the pre-dicing method, and the ring frame R is adhered to the outer periphery of the wafer W via the dicing tape T. This is used to peel off the protective tape P from the integrated wafer transfer body F.

Such a wafer transfer body F is positioned on the table section 12 for peeling off the protective tape of the protective tape peeling apparatus 10, and the dicing tape T side is located on the table section 12 for peeling off the protective tape. It is arranged so that the P side is located upward. As shown in FIG. 1, the protective tape peeling device 10 includes a table section 12, a tape feeding section 14, a peeling head section 16 as moving means, and a heater cutter section 18 as bonding / cutting means. I have.

Table 1 for peeling off protective tape
2 has a central suction table 20 movable in the front-rear direction as indicated by an arrow 4 in FIG. In the tape feeding section 14, as shown in FIGS. 5A to 5C, the peeling tape S is fed and sandwiched between the pinch roller 22 and the guide roller 24, and then the direction is changed by the guide roller 24. The tape is transferred to the tape receiving plate 26 and is pressed on the tape receiving plate 26 by a tape pressing plate 28 which can move up and down. In addition, the tape feeding unit 14 is configured to be movable in the vertical direction.

The release tape S may be a heat-resistant film such as a polyethylene terephthalate (PET) film provided with a heat-sensitive adhesive layer, or a release tape itself having a heat-sensitive release tape. it can. As shown in FIG. 5A, the peeling head 16
A holding portion 30 is provided, and is movable in the left-right direction.
Further, the holding section 30 includes a chuck 36 including an upper jaw 32 and a lower jaw 34, and can move up and down to open and close the chuck 36.

As shown in FIG. 5B, the heater cutter section 18 includes a heater member 38 having a vertically movable heater.
Is provided. A tape holding guide 40 is provided on the front and rear sides of the heater cutter unit 18, and a tape holding guide 4 is provided on the rear side of the heater cutter unit 18.
2 and a cutter blade 46 that moves laterally along the groove 44 of the tape retainer 42 is provided.

The protective tape peeling device 10 constructed as described above operates as shown in FIGS. The central suction table 20 is moved below the tape feeding section 14. Then, the peeling head unit 16 is moved in a direction approaching the tape feeding unit 14. At this time, the chuck 36 is open.

After the peeling head 16 presses the tape receiving plate 26 and the leading end of the peeling tape S is detected, the chuck 36 is closed. Hold the release tape S.
As shown in FIG. 5A, the peeling head S is pulled out by moving the peeling head 16 in a direction away from the tape feeding unit 14. Thereafter, as shown in FIG. 5B, the heater cutter unit 18 is lowered to hold the peeling tape S by the tape holder 42 and the tape holder guide 40, and the wafer W is heated by the heater via the heater member 38. The protective tape P on the surface is bonded by heat fusion.
Then, the cutter blade 46 is moved in the width direction of the tape along the groove 44 of the tape holder 42 to cut the peeling tape S into a predetermined length. The bonding point is preferably located near the edge of the wafer W, for example, within a distance of 3 mm from the edge of the wafer W.

Then, as shown in FIG. 5C, after the tape feeding section 14 and the heater cutter section 18 are raised, the peeling head section 16 and the central suction table 20 are moved in a direction away from each other. Thus, the protective tape P on the surface of the wafer W can be peeled off from the surface of the wafer W by the peeling tape S. Although the peeling tape S and the protective tape P thus peeled are not shown, the chuck 36 of the peeling head portion 16 is opened, and the air is blown from above so that the peeling tape S and the protective tape P are dropped and stored in a waste box (not shown). It has become.

By the way, recently, as the semiconductor wafer, a wafer W having an outer diameter of 6 inches to 8 inches has become mainstream, but recently, a larger 12 inch large diameter semiconductor wafer W has become available on the market. It is starting to appear. In order to be applicable to wafers W having different sizes, for example, 8 inches and 12 inches, the protective tape peeling device 10 of the present invention uses the table 12 for peeling the protective tape. Is a wafer transfer member F of the smallest size, for example, as shown in FIG.
The wafer transfer body F1 of inch is provided with a substantially disk-shaped central suction table 20 on which the wafer W is placed and sucked from the dicing tape T side.

The central suction table 20 is a suction member made of, for example, a porous ceramic or a steel plate, and is connected to a vacuum source such as a vacuum pump (not shown) to reduce the pressure, thereby dicing the wafer transfer body F. The tape T side is suction-held and fixed. Thereby, when peeling the protective tape P from the wafer transfer body F via the peeling tape S, the wafer transfer body F floats from the table portion 12 and warps at the time of peeling, so that the chips of the wafer W It is configured so as not to be damaged or damaged.

On the outer periphery of the central suction table 20, there is provided an annular support ring table 50 which is concentrically arranged at a predetermined interval. This support ring table 50 is, as shown in FIGS.
2, it can move up and down. In the protective tape peeling apparatus 10 configured as described above, when the wafer transfer body F of the smallest size, for example, the wafer transfer body F1 of 8 inches is peeled off, as shown in FIG.
The support ring table 50 is lowered, the wafer W of the wafer transfer body F1 having the minimum size is placed on the central suction table 20, and is suctioned to perform the peeling process.

On the other hand, when a wafer transfer member F having a size larger than the minimum size wafer transfer member F1, for example, a 12-inch wafer transfer member F2, is subjected to a peeling process, as shown in FIG. 50 rises, and the wafer W of the wafer transfer body F2 is moved by the central suction table 20.
Is placed and sucked, and the outer peripheral portion of the wafer W of the wafer transfer body F2 having a size larger than the minimum size wafer transfer body F1 is supported.

This allows different sizes, for example 8
The present invention can be applied to an inch or 12 inch wafer W without replacing the suction table as in the related art. As described above, after the protective tape P is peeled off by the protective tape peeling device 10 of the present invention, the wafer transfer body F is subjected to the following steps of washing, drying, die bonding and the like as appropriate. I have.

In this embodiment, only one support ring table 50 is provided on the outer periphery of the central suction table 20, but the size of the wafer W, for example, 6 inches, 8 inches, 12 inches, etc. To respond,
For example, as shown in FIG. 8, three support ring tables 50, 50, 50 may be provided concentrically, and the number thereof may be adjusted as appropriate.

In this embodiment, the support ring table 50 is configured to support the outer peripheral portion of the wafer W of the wafer transfer body F. However, in order to support the outer peripheral portion by suction, the support ring table 50 is also required. , Central suction table 2
Similarly to the case of 0, for example, a suction member made of a porous ceramic or a rigid plate may be used, and this may be connected to a vacuum source such as a vacuum pump (not shown) to make a negative pressure to perform suction.

As a result, when the protective tape P is peeled off from the wafer transfer body F via the peeling tape S, the wafer transfer body F floats from the table section 12 for peeling off the protective tape and warps at the time of peeling. Or the chips of the wafer W are not damaged.
Furthermore, in this embodiment, these central suction tables 2
0, the dicing tape T side of the wafer transfer body F is fixed by suction by the support ring table 50, but the range and size of the suction can be changed as appropriate.

FIG. 9 is a top view showing an embodiment of the wafer mounting apparatus of the present invention, and FIG. 10 is a front view of the wafer mounting apparatus of FIG. A wafer mounting apparatus (hereinafter, simply referred to as a “mounting apparatus”) 100 according to this embodiment includes:
As shown in FIG. 14, the wafer W is
For performing a wafer mounting process of attaching to and integrating with the ring frame R via the.

The mounting apparatus 100 for the wafer W includes a mount table 112 having the same configuration as the table 12 of the first embodiment. After the wafer W and the ring frame R are held by suction on the upper surface of the mount table 112, a dicing tape T pre-cut in the shape of the ring frame R on these upper surfaces is attached to the tape mounter 80 (FIG. 15). ).

As shown in FIG. 15, the tape mounter section 80 is formed such that a dicing tape T which has been precut by a peeling material D in advance and adhered on the peeling material D at a constant interval has an acute angle at the tip of the peel plate 82. The dicing tape T is peeled off from the peeling material D by being rapidly folded back. As described above, the dicing tape T peeled off from the release material D is
With this, it can be attached to the ring frame R and the wafer W.

In this case, the mount table section 112
In order to be applicable to wafers W of different sizes, for example, 8 inches and 12 inches, as shown in FIGS. 9 and 10, the smallest size wafer W, for example, 8 Inch wafer F1 is placed on the wafer W and ring frame R1 from the dicing tape T side.
A central suction table 120 having a substantially disk shape at the center for mounting and sucking is provided.

When the protective tape P is adhered to the circuit surface W1 of the wafer W, the center suction table 120 is made of, for example, a porous ceramic or rigid plate as shown in FIG. A suction member is provided, which is connected to a vacuum source such as a vacuum pump (not shown) to generate a negative pressure so that the wafer W is suction-held and fixed to the circuit surface W1 of the wafer W via the protective tape P. ing.

When the protective tape P is not adhered to the circuit surface W1 of the wafer W, the central suction table 120 is used to protect the circuit surface W1 as shown in FIG. A portion W of the outer peripheral portion of W1 where no circuit is formed
2 are formed so as to form a ring-shaped suction protrusion receiving portion 122, and a gap 124 is formed between the circuit surface W <b> 1 and the central suction table 120. In this case, the circuit surface W is applied to the suction projecting receiving portion 122 by the action of the negative pressure.
A suction opening 126 connected to a vacuum source such as a vacuum pump (not shown) is formed in order to suction a portion W2 of the outer peripheral portion of the circuit 1 where no circuit is formed.

Accordingly, when performing a mounting process for integrating the wafer W with the ring frame R via the dicing tape T, the wafer W floats from the mount table 112 and warps when peeled off. The W chip is configured not to be damaged or damaged. Further, on the outer periphery of the central suction table 120, there is provided a ring-shaped support ring table 150 which is arranged concentrically at predetermined intervals. This support ring table 150
Is, as shown in FIG.
It is configured to be able to move up and down.

As shown in FIGS. 9 and 10,
Positioning pins 130, 130 for positioning the ring frames R1, R2 of different sizes are provided, and the positioning pins 130, 130 are connected to the ring frames R of different sizes, as shown in FIGS.
1, R2 is configured to be movable in the radial direction so as to be able to abut the position notches V1, V2.

With this configuration, when mounting processing is performed on wafers W of different sizes, the notches V1, R2 of the ring frames R1 and R2 corresponding to the wafers W of different sizes are used. Since the positioning pins 130, 130 move in the radial direction and come into contact with V2, the ring frames R1, R2 can be accurately positioned with respect to wafers W of different sizes.

The mounting apparatus 100 thus configured
Then, when mounting a wafer W of the smallest size, for example, an 8-inch wafer W, the support ring table 150 is lowered and the minimum size is placed on the central suction table 120 as shown in FIG. The wafer W and the ring frame R1 are placed and sucked to perform a mounting process. At this time, as shown by the solid line in FIG.
The positioning pins 130 move inward in the radial direction and come into contact with the positioning notches V1 of the ring frame R1, and the wafer W
The positioning of the ring frame R1 with respect to.

On the other hand, when mounting a wafer W of a size larger than the minimum size of the wafer W, for example, a 12-inch wafer W, as shown in FIG. Central suction table 12
The wafer W placed at 0 is sucked and the lower portion of the ring frame R2 having a size larger than the minimum size of the ring frame R1 is supported. At this time, as shown by the solid line in FIG.
The reference numerals 0 and 130 move radially outward and come into contact with the positioning notch V2 of the ring frame R2 of the wafer W to position the ring frame R2 with respect to the wafer W.

Thus, different sizes, for example, 8
The present invention can be applied to an inch or 12 inch wafer W without replacing the suction table as in the related art. In this embodiment, only one support ring table 150 is provided on the outer periphery of the central suction table 120. However, in order to accommodate different sizes of the wafer W, for example, 6 inches, 8 inches, and 12 inches. 8, for example, three support ring tables 150, 150, 150 may be provided concentrically, and the number thereof may be adjusted as appropriate.

In this embodiment, the support ring table 150 is provided between the outer peripheral portion of the wafer W and the ring frame R2.
However, in order to suction-support the outer peripheral portion and the ring frame R2, the support ring table 150 is also similar to the center suction table 120, for example.
A suction member made of porous ceramics or a steel plate may be connected to a vacuum source, such as a vacuum pump (not shown), and may be suctioned by applying a negative pressure.

Further, in this embodiment, the wafer W and the ring frame R are held and fixed by the central suction table 120 and the support ring table 150. However, the range and size of the suction are appropriately determined. Can be changed. The present invention is not limited to the above-described embodiment. In this embodiment, the protection tape P is peeled off via the release tape S. Various changes can be made without departing from the purpose of the present invention, such as being applicable in the case of peeling without being performed.

[0047]

According to the present invention, when the protective tape peeling apparatus peels off a wafer transfer body of a minimum size, for example, an 8-inch wafer transfer body, the support ring table is lowered and the central suction table is removed. Then, the wafer portion of the wafer transfer body having the smallest size can be placed and sucked to perform the peeling process.

When a wafer transfer body having a size larger than the minimum size wafer transfer body, for example, a 12-inch wafer transfer body, is peeled off, the support ring table is raised and the wafer is moved by the central suction table. The wafer portion of the transfer body can be placed and sucked, and the supporting ring table can support the outer peripheral portion of the wafer portion of the wafer transfer body to perform the peeling process.

Therefore, the wafer can be suction-supported by selecting the center suction table and the support ring table for the wafer transfer bodies of different sizes as described above, so that the wafer can be lifted or turned during peeling. As a result, the wafer is not damaged. Moreover, it can be applied to wafers of different sizes, for example, 6 inches, 8 inches and 12 inches, or all of these sizes, without changing the suction table as in the prior art, and is simple. The structure is compact and excellent in versatility.

Further, according to the wafer mounting apparatus of the present invention, when mounting a minimum size wafer, for example, an 8 inch wafer, the support ring table is lowered and the minimum size wafer is placed on the central suction table. The mounting process can be performed by mounting the wafer portion and the ring frame and adsorbing them. Further, when a wafer having a size larger than the minimum size wafer, for example, a 12-inch wafer is peeled off, the support ring table is raised, and the wafer and the ring frame are placed by the central suction table. In addition to the suction, the mounting process can be performed while supporting the outer periphery including the ring frame by the support ring table.

Therefore, the wafer can be suction-supported by selecting the center suction table and the support ring table for wafers of different sizes as described above.
The wafer is not broken or damaged by floating or rolling during mounting. Moreover, it can be applied to wafers of different sizes, for example, 6 inches, 8 inches and 12 inches, or all of these sizes, without changing the suction table as in the prior art, and is simple. The structure is compact and excellent in versatility.

According to the wafer mounting apparatus of the present invention, when mounting processing is performed on wafers of different sizes, the notch for determining the position of the ring frame of a size corresponding to the wafers of different sizes. In addition, since the positioning pins move in the radial direction and come into contact with the positioning pins, the invention is an extremely excellent invention which has many unique and remarkable effects such as accurate positioning of the ring frame with respect to wafers of different sizes.

[Brief description of the drawings]

FIG. 1 is a front view of an entire apparatus of a first embodiment of a wafer protective tape peeling apparatus of the present invention.

FIG. 2 is a front sectional view of a table portion for peeling a protective tape of the wafer protective tape peeling device of FIG. 1;

FIG. 3 is a top plan view of FIG. 2;

FIG. 4 is a schematic sectional view showing a state in which a protective tape of a wafer transfer member used in the present invention is peeled off.

FIGS. 5A to 5C are schematic views showing a state in which the protective tape of the wafer transfer body is peeled off by the wafer protective tape peeling device of the present invention.

FIG. 6 is a schematic diagram showing a state in which a protective tape of a small-sized wafer transfer body is peeled off by the wafer protective tape peeling device of the present invention.

FIG. 7 is a schematic view showing a state in which a protective tape of a large-sized wafer transfer body is peeled off by the wafer protective tape peeling device of the present invention.

FIG. 8 is a plan view of another embodiment of the protective tape peeling table portion of the wafer protective tape peeling device of the present invention.

FIG. 9 is a top view showing an embodiment of the wafer mounting apparatus of the present invention.

FIG. 10 is a schematic front view of the wafer mounting device of FIG. 9;

FIG. 11 is a schematic sectional view of a central suction table of the wafer mounting device.

FIG. 12 is a schematic sectional view of another central suction table of the wafer mounting device.

FIG. 13 is a schematic sectional view of a central suction table of the wafer mounting apparatus.

FIG. 14 is a cross-sectional view of a wafer showing a state where a ring frame is stuck by the mounting device of the present invention.

FIGS. 15A to 15C are schematic diagrams illustrating an operation in a mount processing state by the mount device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Protective tape peeling apparatus 12 Table part 14 Tape feeding part 16 Peeling head part 18 Heater cutter part 20 Central suction table 22 Pinch roller 24 Guide roller 26 Tape receiving plate 28 Tape pressing plate 30 Nipping part 36 Chuck 38 Heater member 40 Guide 44 groove 46 Cutter blade 50 Support ring table 52 Cylinder 80 Tape manter part 82 Peel plate 84 Press roller 100 Mounting device 112 Mount table part 120 Central suction table 122 Suction protrusion receiving part 124 Air gap 126 Suction opening part 130 Positioning pin 150 Support ring Table 152 Cylinder D Release material P Protective tape R Ring frame R1 Ring frame R2 Ring frame S Release tape T Dicing tape F, F1, F2 Part E wafer transfer body W wafer W1 circuit surface W2 circuit surface is not formed

Claims (3)

[Claims] 1. A wafer transfer body in which a wafer having a surface to which a protective tape is adhered is attached to a ring frame via a dicing tape and integrated, wherein the wafer transfer body is integrated using wafers of different sizes. A wafer protective tape peeling device for performing a peeling process of peeling the protective tape from the wafer, wherein a wafer transfer body of a minimum size among wafer transfer bodies integrated using wafers of different sizes is used. In order to perform the peeling process, a central suction table on which the wafer portion of the minimum size wafer transfer body is placed and sucked, and in order to peel the wafer transfer body having a size larger than the minimum size wafer transfer body, At least one ring-shaped vertically movable support ring table concentrically arranged on the outer periphery of the central suction table. And a support ring table for supporting the wafer portion of the wafer transfer body that is larger than the wafer transfer member's, upon the release handle wafer transfer member of the minimum size,
The support ring table is lowered, the wafer portion of the smallest size wafer transfer body is placed on the central suction table, and the wafer transfer body is sucked to perform the peeling process. The wafer transfer body having a size larger than the smallest size wafer transfer body When performing the peeling process, the support ring table is raised, the wafer portion of the large-sized wafer transfer body is placed and sucked by the central suction table, and the wafer transfer body of the wafer transfer body is held by the support ring table. A protective tape peeling device for a wafer, wherein the device is configured to support an outer periphery of a wafer portion. 2. A wafer mounting apparatus for performing a wafer mounting process of attaching a wafer to a ring frame via a dicing tape and integrating the wafer, wherein a wafer having a minimum size among wafers having different sizes is mounted. In order to mount a wafer portion and a ring frame of a minimum-sized wafer on a central suction table, and to perform a wafer mounting process on a wafer of a size larger than the minimum-sized wafer, At least one annular support ring table arranged concentrically on the outer periphery and configured to be vertically movable,
A supporting ring table for supporting a wafer portion and a ring frame of a wafer having a size larger than the minimum size wafer, and when performing the wafer mounting process on the wafer having the minimum size, the supporting ring table is lowered to the center. The wafer portion of the minimum size wafer and the ring frame are placed on the suction table and suction is performed to perform the wafer mounting process. When the wafer mounting process is performed on a wafer having a size larger than the minimum size wafer, the support ring is used. The table is lifted, the wafer portion of the larger size wafer and the ring frame are placed and suctioned on the central suction table, and the outer periphery of the wafer portion of the wafer and the ring frame are supported by the support ring table. A wafer mounting device characterized by the above-mentioned. 3. A positioning receiving pin for positioning the ring frames of different sizes is provided, and the positioning receiving pins are movable in a radial direction so as to be able to abut against the ring frames of different sizes. 3. The wafer mounting device according to claim 2, wherein: