JP2001353973A - Printing intaglio and offset printing method using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To print a printing pattern, which has a favorable uniform shape accuracy over a whole surface. SOLUTION: This printing method has solid patterns 112 consisting of recessed parts filled with a printing ink 107. The recessed parts consisting of dummy patterns 120 are formed at the outer peripheral parts of the solid patterns 112. The depth of the recessed part of the formed dummy pattern 120 has the same one of the recessed part of the solid pattern 112. In addition, the dummy patterns are arranged at the positions of wiring line patterns.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an intaglio printing plate for printing fine patterns such as electrodes and circuit wiring on electronic components, and an offset printing method using the intaglio plate.

[0002]

2. Description of the Related Art Conventionally, various methods have been considered for producing an electron source substrate in which elements such as a circuit board, a liquid crystal display element, and an image forming apparatus and wirings are arranged on the substrate. There is a method in which wiring and the like are all formed by photolithography.

For example, when forming a fine pattern wiring, in the photolithography method, first, a conductive layer is formed, a resist layer is formed thereon, the resist layer is exposed and developed, and a portion without the resist layer is formed. Is etched, and the remaining resist layer is further stripped off.

Here, the printing method is suitable for forming a large-area pattern. By forming the device electrodes of the surface conduction electron-emitting device by the printing method, a large number of surface conduction electron-emitting devices can be formed. It can be formed on a substrate. This is also advantageous in terms of cost. In forming the element electrodes by this printing method, an offset printing technique suitable for forming a thin film is used. An example of applying this offset printing technology to a circuit board is disclosed in
There is one disclosed in Japanese Patent Publication No. 290295. The substrate disclosed in this publication has a plurality of bonding electrodes connected to circuit components at different angles in order to eliminate bonding defects due to variations in electrode pitch dimensions due to pattern expansion and contraction during printing. . And Japanese Patent Laid-Open No. 4-290295
Japanese Patent Application Laid-Open Publication No. H11-157, discloses that an electrode pattern is formed by offset printing.

Hereinafter, a general offset printing apparatus and method for forming an electrode pattern, a color filter, and the like will be described. FIG. 5 is a plan view showing an offset printing apparatus, and FIGS. 6A to 6D are schematic views showing a conventional offset printing process. In these figures, the blanket cylinder 110 on the body frame 108
Has gears 111 on both sides and a blanket 113 mounted around the periphery. Reference numeral 102 denotes a printing stage.
25 or a work 106 which is a printing medium (FIG. 6D)
Is fixed by vacuum suction.

The printing stage 102 can be moved in one axis direction by a servomotor. Two rack gears 109 are provided on both sides of the printing stage 102, and when the printing stage 102 moves to the blanket cylinder 110, the gear 111 of the blanket cylinder 110 and the rack gear 109 of the printing stage 102 are accurately engaged with each other for stable operation. Has become possible. Reference numeral 101 denotes a dispenser device that supplies the ink 107, and supplies the ink 107 linearly to the intaglio 125 by moving one axis. 117 is a doctor blade.

[0007] In FIG.
The intaglio 125 is vacuum-absorbed on the upper surface, and the ink 107 is supplied in a line onto the intaglio 125 by the dispenser device 101. Then, as the printing stage 102 moves, the ink 107 is filled into the pattern concave portions of the intaglio 125 by the doctor blade 117.

Further, as shown in FIG. 6B, when the printing stage 102 moves, the printing stage 102 shown in FIG.
5 of rack gear 109 and blanket cylinder 110 shown in FIG.
And the gear 107 is accurately engaged with the gear 111 to receive the ink 107 filled in the concave portion of the intaglio 125 on the blanket 113 in a stable operation.

Next, the intaglio 12 on the printing stage 102
6 and the printing stage 102 is returned to the printing start position, and the blanket cylinder 110 is also returned to the rotation initial position, as shown in FIG. Then, a work 106, which is a printing object, is fixed on the printing stage 102 by vacuum suction.

Next, as shown in FIG. 6D, when the printing stage 102 moves, the rack gear 109 of the printing stage 102 and the gear 111 of the blanket cylinder 110 are engaged with each other with high precision, and the work 10 is stably operated.
The ink 107 is transferred to the pattern 6 in the pattern of the intaglio 125.

Thus, the printing process is completed. The printing ink 107 can be appropriately selected depending on the function of the pattern to be manufactured. That is, the electrode pattern of the recording thermal head or the like mainly uses an ink containing an organic Au metal called Au resinate paste, and if it is a color filter used for a liquid crystal display device or the like, red R, green G,
An ink in which a pigment of each color of blue B is dispersed, an ink containing an organic dye, and the like are used.

[0012]

However, in the above-described conventional intaglio offset printing method, the pattern shape of large-area printing is such that the ink solvent atmosphere in the printing process is different between the central part and the peripheral part. The drying of the ink in the part was promoted, so that the amount of the ink 107 that could be transferred from the intaglio 125 to the blanket 113 was reduced, resulting in a distribution of the print pattern shape in which the shape of the outer peripheral portion was thinned.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and suppresses and controls the drying of the ink in the intaglio from the time when the ink is filled into the intaglio until the ink is transferred to the blanket by means of a solvent atmosphere. It is an object of the present invention to provide an intaglio printing plate capable of printing a print pattern with good shape accuracy uniformly over the entire surface and an offset printing method using the same.

[0014]

In order to achieve this object, an intaglio printing plate according to the present invention has an actual pattern consisting of a recess filled with printing ink, and a dummy pattern is provided on the outer periphery of the actual pattern. It is characterized in that a concave portion of the pattern is formed. Preferably, the formed dummy pattern is basically the same depth and the same shape as the actual pattern portion,
The formed dummy pattern is formed at a wiring line pattern position formed in a later step, and the dummy pattern is eventually covered. Therefore, there is no influence on the removing operation or the subsequent process.

Further, the offset printing method according to the present invention uses the intaglio printing for printing according to the present invention, fills the actual pattern concave portions and the peripheral dummy pattern concave portions of the printing intaglio with ink, and then completely fills the blanket. After the pattern is once transferred, all the patterns are printed on the work.

[0016]

In the printing intaglio plate according to the present invention, the dummy pattern recesses are formed on the outer periphery of the actual pattern recesses so that the shape of the entire real pattern can be made uniform. This is because during the time before the transfer to the blanket after filling the ink, the ink drying at the outer edge of the intaglio pattern is inevitably accelerated compared to the center, and the outer peripheral pattern shape becomes thinner. By forming a dummy pattern as an ink reservoir on the outer peripheral portion of the substrate, the solvent atmosphere in the peripheral portion becomes rich, and drying is suppressed.

At this time, the dummy pattern to be added may have the same depth as the actual pattern and can be formed by a single etching process, so that it is effective in preventing drying without increasing the intaglio manufacturing cost.

Further, in the printing method according to the present invention, the intaglio for printing according to the present invention is used, ink is filled in the recesses of the intaglio, and then all the patterns are once transferred to a blanket, and then are completely transferred onto the work. Print-transfer the pattern. At this time, a dummy pattern is finally printed on the work because the concave pattern can hold the ink required for controlling the solvent atmosphere, but this dummy pattern portion is disposed at a printing position such as a wiring line in a later process. By doing so, it is covered in a later step, there is no influence, and a removing step or the like that causes an increase in cost is unnecessary.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The intaglio printing plate according to the first aspect of the present invention is characterized in that a dummy pattern concave portion having an approximate shape having the same depth as the actual pattern concave portion is formed on the outer periphery of the actual pattern. In addition, due to the volatilization of the ink held in the dummy pattern concave portions, the actual pattern on the outer peripheral portion is also suppressed from drying, and has an effect that a uniform print pattern shape can be obtained over the entire surface.

The intaglio printing for printing according to claim 2 of the present invention comprises:
The dummy pattern according to the first aspect has the same depth as the actual pattern, and has an effect that a process for producing an intaglio is not complicated and cost is suppressed.

The intaglio printing for printing according to claim 3 of the present invention comprises:
The formation position of the dummy pattern according to claim 1 is arranged at a printing position of a wiring line or the like in a later process, and the printed dummy pattern is covered in a later process. There is no effect on the process, and there is no need for a removal process or the like that causes an increase in cost, which has the effect of reducing costs.

According to a fourth aspect of the present invention, there is provided an offset printing method for printing up to a dummy pattern formed on the outer periphery using the intaglio printing for printing according to any one of the first to third aspects. As a result, the outer peripheral portion of the actual pattern portion is also suppressed from drying due to volatilization of the ink of the dummy pattern, so that a highly accurate pattern shape can be obtained over the entire printing surface.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A shows an embodiment of a printing intaglio according to the present invention, wherein FIG. 1A is a plan view and FIG. 1B is a sectional view. Here, the intaglio 105 is a glass substrate (blue plate)
Alternatively, it is a metal base material (brass with Ni-Cr coating) and has a width of 350 x a length of 300 x a thickness of 2.8 mm.
The actual pattern 112 is 210 mm long.
× In the range of short side 160mm, width 100μm, length 3
A large number of rectangular pad patterns of 00 μm and 8 μm in depth are arranged.

Further, the outer periphery of the actual pattern portion is
A rectangular dummy pattern 120 having a size of × 150 and a depth of 8 μm, which is the same as the actual pattern, is arranged and arranged in 5 rows, 5 columns and 5 columns. The pattern interval on the left and right in the printing direction is 30μ.
m is a design value (illustrated at equal intervals in the schematic diagram). Here, the dummy pattern formed on the outer peripheral portion is arranged at a position where a 150 μm linear wiring is formed in a later step. The intaglio 105 is used for the printing stage 102.
It is vacuum-absorbed (not shown) and moves during the printing process.

Here, the offset printing method using the intaglio printing according to the present embodiment will be further described with reference to FIG. As shown in FIG. 1B, first, the ink 107 is supplied from the dispenser device 101 onto the intaglio 105, and then the doctor blade (MDC regular) 117 is set at a predetermined angle (here, the angle with the intaglio surface is 60 degrees). Then, it moves while being in contact with the intaglio 105 with the indentation amount of 1.5 mm, and the ink filling step is performed. In addition, the ink 107
Is a Pt resinate paste composed of an organic metal (N.
E-Chemcat Co., Ltd., MO Paste E-3100) is diluted with a BCA solvent and used. Next, as shown in FIG. 1C, the intaglio 10 is placed on a blanket 113 attached to the blanket cylinder 110.
5, the print pattern 114 is received.

Further, the blanket 1 shown in FIG.
From 13, the print pattern 114 is transferred and printed on the work 106. FIG. 1E shows a print pattern 11 on the work 106.
FIG. 4 is a plan view showing a substrate on which offset printing is performed.

FIG. 1F shows the printed circuit board after the line wirings 115 and 116 are formed on the work 106. The peripheral dummy pattern is covered with the line wirings 115 and 116 in a necessary range. .

FIG. 2A shows an intaglio 1 after ink filling.
FIG. 5 is a schematic diagram of a volatile atmosphere of the upper ink, and a solvent atmosphere 1
21 is formed, the ink 1 in the concave portion of the intaglio 105 is formed.
07 is suppressed. Further, FIG.
06 is a schematic diagram of the shape of the print pattern 114 transferred and printed, and the printing interval of the central actual pattern (1) is a design value 3
Drying is suppressed to 0 μm to 31 μm, and the printing interval of the outer peripheral actual pattern (2) is also suppressed to 33 μm by drying.
m, printing was performed with good shape accuracy over the entire printed actual pattern. The outermost peripheral dummy pattern (3) dries, and the printing interval is 40 μm, and the pattern shape becomes thin. However, this pattern portion is unnecessary in function,
As shown in FIG. 1 (f), the wiring is covered with the line wiring, so that no problem occurs in the subsequent steps. In addition, the concave shape of the dummy pattern disposed around the intaglio 105 needs to have the same level of ink holding ability as the concave portion of the actual pattern, but may be an approximate rectangular or circular pattern. It is not limited to the example arrangement. Further, the shape depth of the dummy pattern is the same as that of the actual pattern, so that only one etching step for forming the intaglio 105 is required, and an increase in intaglio manufacturing cost can be suppressed. Next, for comparison, a conventional offset printing method using the intaglio 125 will be described with reference to FIG.

First, the actual pattern 11 is placed on the intaglio 125.
2 are formed in an aligned arrangement (FIG. 3A),
After filling the ink 107 into the intaglio 125 (FIG. 3)
(B)), the print pattern is transferred and printed on the work 106 after receiving the blanket (not shown).

FIG. 3C is a plan view showing a substrate on which the print pattern 114 is offset-printed on the work 106, and FIG. 3D is a plan view showing the printed substrate after line wirings 115 and 116 are formed. is there. Here, FIG. 4A shows the intaglio 125 after the ink 107 is filled in the conventional intaglio 125.
FIG. 4 is a schematic diagram showing an ink volatilization atmosphere above, and the solvent atmosphere 121 is formed, whereby drying of the ink 107 in the intaglio 125 is suppressed. However, the solvent atmosphere 121 is less in the peripheral pattern than in the center. , Drying proceeds.

FIG. 4B is a schematic view showing the shape of the print pattern 114 transferred and printed on the work 106. The print interval of the central real pattern (1) is set at a design value of 30 μm.
Although the drying was suppressed to 31 μm with respect to m, the printing interval of the outer peripheral actual pattern (2) progressed, and the printing interval became 38 μm, the pattern shape became narrower, and the printed material had large shape variation. Was.

[0032]

As described above, in the offset printing method using the intaglio printing for printing according to the present invention, the drying of the ink around the intaglio can be suppressed, so that the printing pattern shape with high precision can be formed over the entire surface at low cost. can get.

[Brief description of the drawings]

1A shows an intaglio printing for printing according to an embodiment of the present invention, wherein FIG. 1A is a plan view, FIG.
(B) to (d) are cross-sectional views showing operation steps of the offset printing method according to the embodiment of the present invention, (e) is a plan view showing the offset printing substrate obtained in the embodiment of the present invention, and (f). FIG. 3 is a plan view showing a printed circuit board after line wiring formation obtained in an example of the present invention.

FIG. 2A is a schematic view of an intaglio ink volatilizing atmosphere according to an embodiment of the present invention, and FIG. 2B is a side view (partially enlarged) showing an outline of a print pattern shape obtained in the embodiment of the present invention. It is a top view (including (1)-(3)).

FIG. 3A is a plan view of a conventional printing intaglio, FIG. 3B is a cross-sectional view showing an ink filling step of a conventional offset printing method, and FIG. 3C is a plan view showing a conventionally obtained offset printing substrate; (D) is a plan view showing a printed board after line wiring formation conventionally obtained.

FIG. 4 (a) is a schematic view of a conventionally obtained intaglio ink volatile atmosphere, and FIG. 4 (b) is a side view schematically showing a conventionally obtained print pattern shape, in which (1) and (1) 2) is a partially enlarged plan view thereof.

FIG. 5 is a plan view showing an offset printing apparatus.

FIGS. 6A to 6D are schematic diagrams showing a conventional offset printing process.

[Explanation of symbols]

101: dispenser device, 102: printing stage, 1
05: intaglio, 106: work, 107: ink, 10
8: body frame, 109: rack gear, 110: blanket cylinder, 111: gear, 112: actual pattern, 11
3: blanket, 114: print pattern, 115, 1
16: wiring pattern, 117: doctor blade, 12
0: dummy pattern, 121: solvent atmosphere, 125: intaglio.

Continued on the front page (72) Inventor Riko Midorikawa 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 2H113 AA01 AA02 BA03 CA17 2H114 AA03 AA08 DA01 DA04 EA04 5E343 AA02 BB23 DD02 FF02 GG08

Claims (4)

[Claims] 1. An intaglio printing plate having a real pattern comprising a concave portion filled with a printing ink, wherein a concave portion of a dummy pattern is formed on an outer peripheral portion of the real pattern. 2. The printing intaglio according to claim 1, wherein the recesses of the formed dummy pattern have the same depth as the recesses of the actual pattern. 3. The intaglio printing plate according to claim 1, wherein the recesses of the formed dummy pattern are arranged at wiring line pattern positions formed in a later step. 4. The method according to claim 1, wherein the ink is filled in a concave portion of the intaglio printing plate according to any one of claims 1 to 3, and then all the patterns are temporarily transferred to a blanket, and then all the patterns are printed and transferred onto a work. Offset printing method.