JP2001062669A - Machining method and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To positively prevent the increase in machined chips in a machining solution by machining a workpiece while collecting machined chips formed by machining the workpiece, in a circulating path by an electrophoretic phenomenon, and eliminating the machined chips from the machining solution. SOLUTION: A collecting tank 31 is provided therein with a collecting means 61 for collecting ground chips formed by grinding a workpiece 23, from a grinding solution K by an electrophoretic phenomenon. The collecting means 61 has a pair of electrodes 63, 65 arranged in the collecting tank 31, and a DC power unit 67 for applying voltage between a pair of electrodes 63, 65. In the case of the workpiece 23 being formed of glass material mainly composed of silicon oxide, for instance, fine grains of silicon oxide which are ground chips are charged negative on the surface in the water-based grinding solution K and stuck to the positive electrode 63. Grinding can thereby be performed while positively preventing the increase in ground chips in the grinding solution K.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing method such as grinding and an apparatus therefor, and more particularly to a processing method and an apparatus therefor capable of effectively removing processing waste in a working fluid such as a grinding fluid.

[0002]

2. Description of the Related Art Generally, a so-called inorganic hard brittle material such as a ceramic material or a glass material is used as a material for an optical element such as a lens, a prism or a mirror, or a material for a high-precision substrate. Conventionally, such a component made of an inorganic hard brittle material is manufactured by performing a grinding process and then a polishing process.

FIG. 4 shows a conventional grinding device used for grinding a component made of an inorganic hard brittle material. In this grinding device, a workpiece 2 fixed on a rotary platen 1 is shown.
Is ground by the diamond grindstone 3. The grinding process is performed by constantly supplying a grinding liquid K to a contact portion between the diamond grindstone 3 and the workpiece 2 for the purpose of cooling, lubricating, and discharging grinding chips.

Usually, a predetermined amount of the grinding fluid K is stored in a grinding fluid tank 4 and supplied to a contact portion between the diamond grinding stone 3 and the workpiece 2 via a circulation path 5. That is, the circulation path 5 includes a collection piping system 6 for collecting the grinding fluid K supplied to the workpiece 2 and a supply piping system 7 for supplying the grinding fluid K in the grinding fluid tank 4 to the workpiece 2. Have.

[0005] The recovery piping system 6 is opened to the first tank 8 of the grinding fluid tank 4, and a filter 9 for removing relatively large grinding dust is disposed in the recovery piping system 6. Supply piping system 7
Is opened through a suction pipe 11 to a second tank 10 of the grinding fluid tank 4, and a grinding fluid supply pump 12 and a flow control valve 13 are arranged in the supply piping system 7.

[0006]

However, in the conventional grinding apparatus, it is difficult to remove minute grinding debris generated by the grinding process from the grinding fluid K, and as the processing time increases, the grinding fluid is reduced. Grinding debris in K increases, and grinding fluid K
There is a problem that the performance of the device deteriorates.

That is, there is a problem that cooling, lubrication and discharge of grinding chips, which are the main objects of supplying the grinding liquid K, are not efficiently performed, and the processing quality is gradually deteriorated. Grinding debris in the grinding fluid K is a diamond grindstone 3
There is a problem that the performance of the grindstone is deteriorated due to clogging of the grindstone or the grindstone is worn. So, conventionally,
While the total amount of the grinding fluid K in the grinding fluid tank 4 is exchanged while monitoring the grinding resistance, the quality of the workpiece 2, and the like, the replacement of the grinding fluid K is relatively difficult in such a method. It has to be performed frequently and there is a problem that the processing efficiency is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and provides a processing method and apparatus capable of performing processing while reliably preventing an increase in processing chips in a processing liquid. With the goal.

[0009]

According to a first aspect of the present invention, there is provided a processing method comprising:
In a processing method of processing a workpiece with a processing tool while supplying a processing fluid circulated through a circulation path to the workpiece, processing chips generated by processing the workpiece are removed in the circulation path. , Wherein the processing is carried out while collecting by electrophoresis and removing from the processing liquid.

A processing apparatus according to a second aspect of the present invention is a processing apparatus for processing a workpiece with a processing tool while supplying a processing fluid circulated through the circulation path to the workpiece, And a collecting means for collecting processing waste generated by processing the workpiece from the processing liquid by an electrophoretic phenomenon. The processing apparatus according to claim 3 is the processing apparatus according to claim 2, wherein the collecting unit is configured to collect a tank disposed in the circulation path, a pair of electrodes disposed in the collection tank, and the pair of electrodes. And a DC power supply for applying a voltage between them.

According to a fourth aspect of the present invention, in the processing apparatus according to the third aspect, an inflow tank into which the working fluid flows is formed on one side of the collection tank so as to communicate with the collection tank. An outflow tank through which the working fluid flows out is formed on the other side of the collection tank in communication with the collection tank.

(Operation) According to the processing method of the first aspect, the processing waste generated by processing the workpiece is generated in the circulation path.
It is collected by the electrophoresis phenomenon, and processing is performed while removing processing waste from the processing liquid.

The electrophoresis phenomenon will be described later in detail. According to the second aspect of the present invention, the collecting means is disposed in the circulation path, and the collecting means collects the processing waste generated by processing the workpiece from the working fluid by an electrophoretic phenomenon. In the processing device according to the third aspect, the collection tank is arranged in the circulation path, and the pair of electrodes is arranged in the collection tank.

[0014] When a voltage is applied between the pair of electrodes by the DC power supply device, machining chips in the machining fluid adhere to one of the electrodes due to an electrophoresis phenomenon. In the processing apparatus according to the fourth aspect, the inflow tank into which the processing liquid flows is formed on one side of the collection tank, and the outflow tank from which the processing liquid flows out is formed on the other side of the collection tank. Is in a state close to laminar flow, and the electrophoresis phenomenon is efficiently performed.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 shows a first embodiment of a processing apparatus according to the present invention. In this embodiment, the present invention is applied to a rotary type surface grinding type grinding apparatus. In this grinding device, a workpiece 23 having a planar shape is fixed on a rotary platen 21.

The turn table 21 is rotated by a drive mechanism (not shown). The workpiece 23 is made of an optical element such as a lens, a prism, a mirror, or the like, or a high-precision substrate, and is formed of an inorganic hard brittle material such as a glass material or ceramics. Above the workpiece 23, a diamond grindstone 27 attached to a cup type grinding wheel 25 is arranged.

The cup-type grinding wheel 25 is rotated at a high speed by a drive mechanism (not shown). In this embodiment,
A grinding liquid tank 29 is disposed below the rotary platen 21, and a predetermined amount of the grinding liquid K is stored in the grinding liquid tank 29. The grinding liquid tank 29 is configured such that an inflow tank 33 is formed on one side of the collection tank 31 and an outflow tank 35 is formed on the other side.

In the inflow tank 33, a recovery piping system 3 for the grinding fluid K is provided.
7 is opened, and a supply piping system 39 for the grinding liquid K is opened in the outflow tank 35. Thus, a circulation path 41 of the grinding liquid K is formed. At the upper end of the recovery pipe system 37, the lower part of the rotary platen 21 is covered to collect the grinding fluid K.
3 are formed.

The lower end of the recovery piping system 37 is inserted into the inflow tank 33 through a through hole 33 a formed in the upper surface of the inflow tank 33. Further, a filter 45 for removing relatively large grinding dust is disposed in the collection piping system 37. At an upper end of the supply piping system 39, a supply unit 47 for supplying the grinding liquid K to a contact portion between the diamond grindstone 27 and the workpiece 23 is formed.

The lower end of the supply piping system 39 is connected to a grinding fluid supply pump 51 via a flow control valve 49.
The grinding liquid supply pump 51 is fixed to the upper surface of the outflow tank 35, and the suction pipe 53 of the grinding liquid supply pump 51 is inserted into the outflow tank 35 from a through hole 35 a formed in the outflow tank 35. .

In this embodiment, the collection tank 31 and the inflow tank 3
3 is divided by a partition plate 55, and the partition plate 55
Many small holes 55a are formed. In addition, collection tank 31
And the outflow tank 35 are partitioned by a partition plate 57, and the partition plate 57 has a large number of small holes 57a. In the outflow tank 35, a liquid temperature controller 59 composed of a heater and a cooler pipe for controlling the liquid temperature of the grinding liquid K is arranged.

In this embodiment, in the collecting tank 31, grinding chips generated by grinding the workpiece 23 are stored.
Collection means 6 for collecting from the grinding fluid K by the electrophoresis phenomenon
1 is provided. This collecting means 61 is provided in the collecting tank 31.
It has a pair of electrodes 63 and 65 disposed therein, and a DC power supply 67 for applying a voltage between the pair of electrodes 63 and 65.

FIG. 2 is an explanatory diagram for explaining the electrophoresis phenomenon. That is, it has been known that when fine particles are dispersed in a solvent such as water, an electric double layer is formed near the surface of the fine particles in the solvent, and a surface potential difference occurs. This is a property that occurs universally regardless of the material of the fine particles and the solvent, and even in the grinding fluid K in which grinding chips separated from the workpiece 23 and discharged during grinding are dispersed. Naturally expressed.

When an electric field is externally applied to a solution containing fine particles having an electric double layer formed near the surface, for example, when the surface of the fine particles is positively charged, the fine particles move to the negative electrode side. And electrophoretic movement, which is
This is a physical phenomenon called an electrophoresis phenomenon. A general material widely used as a network oxide constituting a glass material is silicon oxide (silica SiO ₂ ).
The silicon oxide fine particles 69 are negatively charged in water as shown in FIG.

At present, typical ceramic materials widely used as industrial or structural materials include aluminum oxide (alumina Al ₂ O ₃ ) and zirconium oxide (zirconia ZrO ₂ ). It is known that aluminum is positively charged in water and zirconium oxide is negatively charged. In FIG. 2, the negatively charged silicon oxide fine particles 69 are formed.
Moves to the positive electrode 63 side of the pair of electrodes 63 and 65 by electrophoresis, and is attached to the positive electrode 63.

Therefore, the workpiece 23 shown in FIG.
In the case of a glass material containing silicon oxide as a main component, the fine particles 69 of silicon oxide, which are grinding dust, have a negatively charged surface in a water-based grinding liquid K and adhere to the positive electrode 63. You. In addition, with the increase in processing time,
Since the attachment of grinding dust increases on the positive electrode 63,
It is desirable that the positive electrode 63 be removed from the collection tank 31 at predetermined time intervals to remove grinding debris.

In the above-described grinding method, grinding chips generated by grinding the workpiece 23 are collected by the electrophoresis phenomenon in the circulation path 41, and the grinding process is performed while removing the grinding chips from the grinding fluid K. Grinding can be performed while reliably preventing an increase in grinding dust in the grinding liquid K.
Further, in the above-described grinding apparatus, since the collecting means 61 for collecting grinding dust generated by grinding the workpiece 23 from the grinding liquid K by the electrophoretic phenomenon is disposed in the circulation path 41, Grinding can be performed while reliably preventing an increase in grinding waste.

Further, in the above-described grinding apparatus, the collecting means 61 is provided with the collecting tank 31 disposed in the circulation path 41, the pair of electrodes 63 and 65 disposed in the collecting tank 31, and the pair of electrodes 63 and 65. DC power supply 67 for applying voltage during
The grinding dust in the grinding fluid K can be reliably removed by the electrophoresis phenomenon.

In the above-described grinding apparatus, the collection tank 31
On one side, an inflow tank 33 into which the grinding fluid K flows is formed,
An outflow tank 35 from which the grinding liquid K flows out to the other side of the collection tank 31.
Is formed, the grinding liquid K in the collection tank 31 becomes close to a laminar flow, and the electrophoresis phenomenon can be performed efficiently. FIG. 3 shows a second embodiment of the present invention. In this embodiment, the workpiece 23A has an aspherical shape, and is fixed to the upper surface of the rotary platen 21 via a support member 71. ing.

A diamond grindstone 27A mounted on a straight grinding wheel 73 is disposed above the workpiece 23A. Since the configuration is substantially the same as that of the first embodiment except for the above-described portions, the same portions will be denoted by the same reference numerals and detailed description thereof will be omitted. In the second embodiment, the same effects as in the first embodiment can be obtained.

In the embodiment described above, an example in which the present invention is applied to grinding is described. However, the present invention is not limited to such an embodiment. Can be applied.

[0032]

As described above, according to the processing method of the first aspect, the processing chips generated by processing the workpiece are collected by electrophoresis in the circulation path and removed from the processing liquid while processing. Since the processing is performed, the processing can be performed while reliably preventing an increase in the processing waste in the processing liquid.

In the processing apparatus according to the second aspect, in the circulation path,
Since the collecting means for collecting the processing chips generated by processing the workpiece from the processing liquid by the electrophoresis phenomenon is arranged, the processing can be performed while reliably preventing the processing chips from increasing in the processing liquid. In the processing apparatus according to claim 3, the collecting means includes:
Since it is composed of a collection tank arranged in the circulation path, a pair of electrodes arranged in the collection tank, and a DC power supply device for applying a voltage between the pair of electrodes, the processing chips in the machining fluid are electrophoresed. It can be reliably removed by the phenomenon.

In the processing apparatus according to the fourth aspect, the inflow tank into which the processing liquid flows is formed on one side of the collection tank, and the outflow tank from which the processing liquid flows out is formed on the other side of the collection tank. The working fluid in the collection tank is close to a laminar flow, and the electrophoresis phenomenon can be performed efficiently.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a first embodiment of a processing apparatus of the present invention.

FIG. 2 is an explanatory diagram for explaining an electrophoresis phenomenon.

FIG. 3 is an explanatory view showing a second embodiment of the processing apparatus of the present invention.

FIG. 4 is an explanatory view showing a conventional processing apparatus.

[Explanation of symbols]

 23 Workpiece 27 Diamond grinding stone 29 Grinding liquid tank 31 Collection tank 33 Inflow tank 35 Outflow tank 41 Circulation path 61 Collection means 63, 65 Electrode 67 DC power supply K Grinding liquid

Claims (4)

[Claims] 1. A working fluid circulated through a circulation path,
In a processing method of processing the workpiece by a processing tool while supplying the workpiece to a workpiece, processing chips generated by processing the workpiece are collected by electrophoresis in the circulation path and are collected in the processing fluid. A processing method characterized in that processing is performed while removing from the surface. 2. A processing fluid circulated through a circulation path,
A processing apparatus for processing the workpiece with a processing tool while supplying the workpiece to a workpiece, wherein, in the circulation path, processing chips generated by processing the workpiece are collected from the machining fluid by an electrophoretic phenomenon. A processing apparatus characterized by comprising a collecting means for performing processing. 3. The processing apparatus according to claim 2, wherein the collection unit includes: a collection tank arranged in the circulation path; a pair of electrodes arranged in the collection tank; A processing apparatus, comprising: a DC power supply for applying a voltage. 4. The processing apparatus according to claim 3, wherein an inflow tank into which the processing liquid flows is formed in communication with the collection tank on one side of the collection tank, and on another side of the collection tank. A processing apparatus, wherein an outflow tank from which the processing liquid flows out is formed in communication with the collection tank.